BC856A – BC858C
Document Number: DS112072 Rev. 22 - 2
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BC856A-BC858C
PNP SURFACE MOUNT SMALL SIGNAL TRANSISTOR IN SOT23
Features
Ideally Suited for Automatic Insertion
Complementary NPN Types Available (BC846 – BC848)
For switching and AF Amplifier Applications
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. "Green" Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP capable (Note 4)
Mechanical Data
Case: SOT23
Case material: molded plastic, “Green” molding compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.008 grams (Approximate)
Ordering Information (Notes 4 & 5)
Product Compliance Marking
Reel size
(inches)
Quantity per
reel
BC856A-7-F AEC-Q101 K3A 7 3,000
BC856B-7-F AEC-Q101 K3B 7 3,000
BC856BQ-7-F Automotive K3B 7 3,000
BC856B-13-F AEC-Q101 K3B 13 10,000
BC856BQ-13-F Automotive K3B 13 10,000
BC857A-7-F AEC-Q101 K3A 7 3,000
BC857B-7-F AEC-Q101 K3B 7 3,000
BC857BQ-7-F Automotive K3B 7 3,000
BC857B-13-F AEC-Q101 K3B 13 10,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green"
and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl)
and <1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_compliance_definitions/.
5. Tape width is 8mm. For packaging details, go to our website at http”//www.diodes.com/products/packages.html
Marking Information
Date Code Key
Year 2010 2011 2012 2013 2014 2015 2016 2017
Code X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Product Compliance Marking Reel size
(inches)
Quantity per
reel
BC857C-7-F AEC-Q101 K3G 7 3,000
BC857C-13-F AEC-Q101 K3G 13 10,000
BC858A-7-F AEC-Q101 K3A 7 3,000
BC858B-7-F AEC-Q101 K3B 7 3,000
BC858C-7-F AEC-Q101 K3G 7 3,000
C
E
B
Top View
SOT23
Device Symbol Top View
Pin-Out
xxx = Product Type Marking Code
(Please see Ordering Information)
YM = Date Code Marking
Y = Year ex: X = 2010
M = Month ex: 9 = September
xxx
YM
BC856A – BC858C
Document Number: DS112072 Rev. 22 - 2
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BC856A-BC858C
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Collector-Base Voltage
BC856
VCBO
-80
V
BC857 -50
BC858 -30
Collector-Emitter Voltage
BC856
VCEO
-65
V
BC857 -45
BC858 -30
Emitter-Base Voltage VEBO -5.0 V
Continuous Collector Current IC -100 mA
Peak Collector Current ICM -200 mA
Peak Emitter Current IEM -200 mA
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit
Power Dissipation (Note 6) PD
310 mW
(Note 7) 350
Thermal Resistance, Junction to Ambient (Note 6) RθJA 403 C/W
(Note 7) 357
Thermal Resistance, Junction to Leads (Note 8) RθJL 350 C/W
Operating and Storage Temperature Range TJ,TSTG -65 to +150 C
ESD Ratings (Note 9)
Characteristic Symbol Value Unit JEDEC Class
Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B
Electrostatic Discharge - Machine Model ESD MM 400 V C
Notes: 6. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
7. For the device mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
8. Thermal resistance from junction to solder-point (at the end of the leads).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
BC856A – BC858C
Document Number: DS112072 Rev. 22 - 2
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BC856A-BC858C
Thermal Characteristics and Derating Information
0 25 50 75 100 125 150
0.0
0.1
0.2
0.3
0.4
Derating Curve
Temperature (°C)
Max Power Dissipation (W)
100µ 1m 10m 100m 1 10 100 1k
0
50
100
150
200
250
300
350
400
Transient Thermal Impedance
D=0.5
D=0.2
D=0.1
Single Pulse
D=0.05
Thermal Resistance (°C/W)
Pulse Width (s)
10m 100m 1 10 100 1k
0.1
1
10
Single Pulse. Tamb=25°C
Pulse Power Dissipation
Pulse Width (s)
Max Power Dissipation (W)
BC856A – BC858C
Document Number: DS112072 Rev. 22 - 2
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BC856A-BC858C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage
BC856
BVCBO
-80
V IC = -10µA
BC857 -50
BC858 -30
Collector-Emitter Breakdown Voltage
(Note 10)
BC856
BVCEO
-65
V IC = -10mA
BC857 -45
BC858 -30
Emitter-Base Breakdown Voltage BVEBO -5 — V IE = -1µA
Collector Cutoff Current ICBO — —
-15 µA VCB = -30V
-4 VCB = -30V, TA = +150°C
Collector Emitter Cutoff Current
BC856
ICES — —
-15
nA
VCE = -80V
BC857 -15
VCE = -50V
BC858 -15
VCE = -30V
Small Signal Current Gain
(Note 10)
BC856A / BC857A / BC858A
hfe
200
— —
IC = -2.0mA, VCE = -5V
f = 1.0kHz
BC856B / BC857B / BC858B 330
BC857C / BC858C 600
Input Impedance (Note 10)
BC856A / BC857A / BC858A
hie
2.7
— k
BC856B / BC857B / BC858B 4.5
BC857C / BC858C 8.7
Output Admittance
(Note 10)
BC856A / BC857A / BC858A
hoe
18
— µS
BC856B / BC857B / BC858B 30
BC857C / BC858C 60
Reverse Voltage Transfer
Ratio (Note 10)
BC856A / BC857A / BC858A
hre
1.5x10-
4
— — BC856B / BC857B / BC858B 2x10-
4
BC857C / BC858C 3x10-
4
DC Current Gain (Note 10)
BC856A / BC857A / BC858A
hFE
125 180 250
IC = -2.0mA, VCE = -5V
BC856B / BC857B / BC858B 220 290 475
BC857C / BC858C 420 520 800
Collector-Emitter Saturation Voltage (Note 10) VCE(sat) -75 -300 mV IC = - 10mA, IB = -0.5mA
-250 -650 IC = - 100mA, IB = -5.0mA
Base-Emitter Turn-On Voltage (Note 10) VBE(on) -600 -650 -750 mV IC = -2mA, VCE = -5V
— — -820 IC = -10mA, VCE = -5V
Base-Emitter Saturation Voltage (Note 10) VBE(sat) -700 — mV
IC = -10mA, IB = -0.5mA
-850 IC = -100mA, IB = -5mA
Output Capacitance Cobo — 3 — pF
VCB = -10V, f = 1.0MHz
Transition Frequency fT 100 200 MHz
VCE = -5V, IC = -10mA,
f = 100MHz
Noise Figure NF — 2 10 dB
VCE = -5V, IC = -200µA
RS = 2k, f = 1kHz
f = 200Hz
Notes: 10. Measured under pulsed conditions. Pulse width 300µs. Duty cycle 2%
BC856A – BC858C
Document Number: DS112072 Rev. 22 - 2
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Feb. 2013
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BC856A-BC858C
Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
1
10
100
1,000
110 100 1,000
V = 5V
CE
h, D
C
C
U
R
R
EN
T
G
AIN
FE
I , COLLECTOR CURRENT (mA)
Figure 1 Typical DC Current Gain vs. Collector Current
C
T = 25°C
A
T = -50°C
A
T = 150°C
A
1
0.1 10 100 1,000
V,
C
O
LLE
C
T
O
R
-EMI
T
T
E
R
SATURATION VOLTAGE (V)
CE(SAT)
I , COLLECTOR CURRENT (mA)
Figure 2 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
C
T = 25°C
A
T = -50°C
A
T = 150°C
A
0
0.1
0.2
0.3
0.4
0.5
I
I
C
B
= 10
10
100
1,000
110 100
f,
G
AIN-BANDWID
T
H
P
R
O
D
U
C
T
(M
H
z)
t
I , COLLECTOR CURRENT (mA)
Figure 3 Gain-Bandwidth Product vs Collector Current
C
V = 5V
CE
BC856A – BC858C
Document Number: DS112072 Rev. 22 - 2
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Feb. 2013
© Diodes Incorporated
BC856A-BC858C
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
 0° 8° -
All Dimensions in mm
Dimensions Value (in mm)
Z 2.9
X 0.8
Y 0.9
C 2.0
E 1.35
A
M
JL
D
F
BC
H
K
G
K1
XE
Y
C
Z
BC856A – BC858C
Document Number: DS112072 Rev. 22 - 2
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© Diodes Incorporated
BC856A-BC858C
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
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failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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