1
FEATURES APPLICATIONS
DB OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
SUPPORTS DEFENSE, AEROSPACE,
DESCRIPTION
MAX3232-EP
www.ti.com
......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVERWITH ± 15-kV ESD PROTECTION
•Battery-Powered Systems, PDAs, Notebooks,•RS-232 Bus-Pin ESD Protection Exceeds
Laptops, Palmtop PCs, and Hand-Held± 15 kV Using Human-Body Model (HBM)
Equipment•Meets or Exceeds the Requirements ofTIA/EIA-232-F and ITU v.28 Standards•Operates With 3-V to 5.5-V V
CC
Supply•Operates Up To 250 kbit/s•Two Drivers and Two Receivers•Low Supply Current . . . 300 µA Typical•External Capacitors . . . 4 × 0.1 µF•Accepts 5-V Logic Input With 3.3-V Supply•Alternative High-Speed Pin-Compatible Device(1 Mbit/s)
– SNx5C3232
AND MEDICAL APPLICATIONS•Controlled Baseline•One Assembly/Test Site•One Fabrication Site•Available in Military ( – 55 ° C/125 ° C)Temperature Range
(1)
•Extended Product Life Cycle•Extended Product-Change Notification•Product Traceability(1) Additional temperature ranges are available - contact factoryORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
SSOP (DB) Reel of 2000 MAX3232MDBREP– 55 ° C to 125 ° C MB3232MTSSOP(PW) Reel of 2000 MAX3232MPWREP
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .
The MAX3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ± 15-kVESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements ofTIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and theserial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/ µs driveroutput slew rate.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006 – 2009, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
LOGIC DIAGRAM (POSITIVE LOGIC)
DIN1 DOUT1
RIN1ROUT1
DIN2 DOUT2
RIN2ROUT2
11
10
12
9
14
7
13
8
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS (see
(1)
and Figure 4 )
MAX3232-EP
SGLS337A – APRIL 2006 – REVISED MARCH 2009 .........................................................................................................................................................
www.ti.com
FUNCTION TABLE
EACH DRIVER EACH RECEIVER
INPUT DIN OUTPUT DOUT INPUT RIN OUTPUT ROUT
L H L HH L H LOpen HH = high level, L = low level, Open = input disconnected or connected driver off
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
CC
Supply voltage range
(1)
– 0.3 to 6 VV+ Positive output supply voltage range
(1)
– 0.3 to 7 VV – Negative output supply voltage range
(1)
0.3 to – 7 VV+ – V – Supply voltage difference
(1)
13 VInput voltage range Drivers – 0.3 to 6 VV
I
Receivers – 25 to 25 VOutput voltage range Drivers – 13.2 to 13.2 VV
O
Receivers – 0.3 to V
CC
+ 0.3 Vθ
JA
Package thermal impedance
(2)
DB package 82 ° C/WPW package 108 ° C/WT
J
Operating virtual junction temperature 150 ° CT
stg
Storage temperature range – 65 to 150 ° C
(1) All voltages are with respect to network GND.(2) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 ° C can affect reliability.
MIN NOM MAX UNIT
V
CC
= 3.3 V 3 3.3 3.6Supply voltage VV
CC
= 5 V 4.5 5 5.5V
CC
= 3.3 V 2V
IH
Driver high-level input voltage DIN VV
CC
= 5 V 2.4V
IL
Driver low-level input voltage DIN 0.8 V
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.
2Submit Documentation Feedback Copyright © 2006 – 2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3232-EP
ELECTRICAL CHARACTERISTICS
MAX3232-EP
www.ti.com
......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009
RECOMMENDED OPERATING CONDITIONS (see and Figure 4 ) (continued)
MIN NOM MAX UNIT
Driver input voltage DIN 0 5.5V
I
VReceiver input voltage – 25 25T
A
Operating free-air temperature MAX3232M -55 125 ° C
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see
(1)
andFigure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
I
CC
Supply current No load, V
CC
= 3.3 V or 5 V 0.3 2 mA
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.
Copyright © 2006 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): MAX3232-EP
DRIVER SECTION
ELECTRICAL CHARACTERISTICS
SWITCHING CHARACTERISTICS
MAX3232-EP
SGLS337A – APRIL 2006 – REVISED MARCH 2009 .........................................................................................................................................................
www.ti.com
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see
(1)
andFigure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High -level output voltage DOUT at R
L
= 3 k Ωto GND, DIN = GND 5 5.4 VV
OL
Low -level output voltage DOUT at R
L
= 3 k Ωto GND, DIN = V
CC
– 5 – 5.4 VI
IH
High -level input current V
I
= V
CC
± 0.01 ± 1 µAI
IL
Low -level input current V
I
at GND ± 0.01 ± 1 µAV
CC
= 3.6 V, V
O
= 0 VI
OS
(3)
Short -circuit output current ± 35 ± 60 mAV
CC
= 5.5 V, V
O
= 0 Vr
o
Output resistance V
CC
, V+, and V – = 0 V, V
O
= ± 2 V 300 10M Ω
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than oneoutput should be shorted at a time.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see
(1)
andFigure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
C
L
= 1000 pF, R
L
= 3 k Ω,Maximum data rate 150 250 kbit/sOne DOUT switching, See Figure 1R
L
= 3 k Ωto 7 k Ω,t
sk(p)
Pulse skew
(1)
CL = 150 pF to 2500 pF 300 nsSee Figure 2C
L
= 150 pF to 1000 pF 6 30Slew rate, transition region (see RL = 3 k Ωto 7 k Ω,SR(tr) V/ µsFigure 1 ) V
CC
= 3.3 V
C
L
= 150 pF to 2500 pF 4 30
(1) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than oneoutput should be shorted at a time.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25 ° C.
4Submit Documentation Feedback Copyright © 2006 – 2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3232-EP
RECEIVER SECTION
ELECTRICAL CHARACTERISTICS
SWITCHING CHARACTERISTICS
PARMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6 V
tTHL or tTLH
1.5 V 1.5 V
3 V
−3 V
3 V
−3 V
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
tPHL
50% 50%
1.5 V 1.5 V
50 Ω
Generator
(see Note B) RL
RS-232
Output
CL
(see Note A)
MAX3232-EP
www.ti.com
......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted (see
(1)
and Figure 4 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
V
OH
High -level output voltage I
OH
= -1 mA V
CC
– 0.6 V
CC
– 0.1 VV
OL
Low -level output voltage I
OL
= 1.6 mA 0.4 VV
CC
= 3.3 V 1.5 2.4V
IT+
Positive -going input threshold voltage VV
CC
= 5 V 1.8 2.4V
CC
= 3.3 V 0.6 1.2V
IT –
Negative -going input threshold voltage VV
CC
= 5 V 0.8 1.5V
hys
Input hysteresis (V
IT+
– V
IT –
) 0.3 Vr
i
Input resistance V
I
= ± 3 V to ± 25 V 3 5 8 k Ω
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V and T
A
= 25 ° C.
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted (see
(1)
and Figure 3 )
PARAMETER TEST CONDITIONS MIN TYP
(2)
MAX UNIT
t
PLH
Propagation delay time, low - to high -level output 300 nsC
L
= 150 pFt
PHL
Propagation delay time, high - to low -level output 300 nst
sk(p)
Pulse skew
(3)
300 ns
(1) Test conditions are C1 – C4 = 0.1 µF at V
CC
= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2 – C4 = 0.33 µF at V
CC
= 5 V ± 0.5 V.(2) All typical values are at V
CC
= 3.3 V or V
CC
= 5 V and T
A
= 25 ° C.(3) Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
Figure 1. Driver Slew Rate
A. C
L
includes probe and jig capacitance.B. The pulse generator has the following characteristics: Z
O
= 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤10 ns.
Figure 2. Driver Pulse Skew
Copyright © 2006 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): MAX3232-EP
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
50%
50%
−3 V
3 V
1.5 V
1.5 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
CL
(see Note A)
MAX3232-EP
SGLS337A – APRIL 2006 – REVISED MARCH 2009 .........................................................................................................................................................
www.ti.com
PARMETER MEASUREMENT INFORMATION (continued)
A. C
L
includes probe and jig capacitance.B. The pulse generator has the following characteristics: Z
O
= 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤10 ns.
Figure 3. Receiver Propagation Delay Times
6Submit Documentation Feedback Copyright © 2006 – 2009, Texas Instruments Incorporated
Product Folder Link(s): MAX3232-EP
APPLICATION INFORMATION
11
10
8
1
2
3
4
7
ROUT2
DIN2
9
RIN1
16
13
12
15
14
DIN1
5
6
+
−
C3
VCC
C2+
C1
C2
C1+
GND
C1−
ROUT1
C2−
+
−
CBYPASS
= 0.1µF
V+
+
−
+
−
RIN2
C4+
−
VCC C1 C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
VCC vs CAPACITOR V ALUES
DOUT1
DOUT2
V−
5 kΩ
5 kΩ
A
MAX3232-EP
www.ti.com
......................................................................................................................................................... SGLS337A – APRIL 2006 – REVISED MARCH 2009
A. C3 can be connected to V
CC
or GND.B. Resistor values shown are nominal.C. Nonpolarized ceramic capacitros are acceptable. If polarized tantalum or electrolytic capacitors are used, they shouldbe connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
Copyright © 2006 – 2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): MAX3232-EP
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3232MDBREP ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3232MPWREP ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
V62/06623-01XE ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
V62/06623-01YE ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3232-EP :
•Catalog: MAX3232
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 16-Mar-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3232MDBREP SSOP DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
MAX3232MPWREP TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3232MDBREP SSOP DB 16 2000 367.0 367.0 38.0
MAX3232MPWREP TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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