Document Number: MC33907-MC33908D2
Rev. 5.0, 10/2016
NXP Semiconductors
Data Sheet: Advance Information
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© 2016 NXP B.V.
Power system basis chip with high
speed CAN and LIN transceivers
The 33907/33908 SMARTMOS devices area multi-output, power supply,
integrated circuit, including HSCAN and/or LIN transceivers, dedicated to the
automotive market.
Multiple switching and linear voltage regulators, including low-power mode
(32 μA) are available with various wake-up capabilities. An advanced power
management scheme is implemented to maintain high efficiency over wide input
voltages (down to 2.7 V) and wide output current ranges (up to 1.5 A).
The 33907/33908 include enhanced safety features, with multiple fail-safe
outputs, becoming a full part of a safety oriented system partitioning, to reach a
high integrity safety level (up to ASIL D).
The built-in enhanced high-speed CAN interface fulfills the ISO11898-2 and -5
standards. The LIN interface fulfills LIN protocol specifications 1.3, 2.0, 2.1, 2.2,
and SAEJ2602-2
Features
• Battery voltage sensing & MUX output pin
• Highly flexible SMPS pre-regulator, allowing two topologies: non-inverting
buck-boost and standard buck
• Switching mode power supply (SMPS) dedicated to MCU core supply, from
1.2 V to 3.3 V delivering up to 1.5 A
• Multiple wake-up sources in low-power mode: CAN, LIN, and/or IOs
• Six configurable I/Os
• Linear voltage regulator dedicated to auxiliary functions, or to a sensor supply
(VCCA tracker or independent), 5.0 V or 3.3 V
• Linear voltage regulator dedicated to MCU A/D reference voltage or I/Os
supply (VCCA), 5.0 V or 3.3 V
Figure 1. 33907/33908 simplified application diagram - buck boost configuration
POWER SYSTEM BASIS CHIP
33907
33908
AE SUFFIX (PB-FREE)
98ASA00173D
48-PIN LQFP-EP
Applications
• Electrical power steering
• Engine management
• Battery management
• Active suspension
• Gear box
• Transmission
• Electrical vehicle (EV), hybrid electrical vehicle
(HEV), and inverter
• Advanced driver assistance systems
VAUX_E
VAUX_B
VAUX
CAN-5V
MOSI
MISO
SCLK
NCS
RXD
TXD
CANH
CANL
SELECT
INTB
RSTB
FS0B
DEBUG
IO_0
IO_1
IO_2
IO_3
IO_4
IO_5
GND_COM
VDDIO
CAN BUS
VDDIO
VPRE
DEBUG
mode
GNDA DGND
VCORE or
VCCA
VSUP1
SW_PRE2
VPRE
SW_CORE
FB_CORE
VCCA_E
VCCA_B
VCCA
VSENSE COMP_CORE
VSUP2
BOOTS_PRE
BOOTS_CORE
GATE_LS
SW_PRE1
VCORE_SNS
VSUP3
+Battery
(KL30)
VDDIO
MUX_OUT
VAUX
VCCA
MCU
SPI
VDD
ADC Input
AD ref.
voltage
NMI
Reset
FCCU
CAN
Ignition Key
(KL15)
VDD
VSUP3
LIN BUS
LIN RXDL
TXDL LIN
33907/33908
2NXP Semiconductors
33907/33908
Figure 2. Simplified application diagram - buck configuration, VAUX not used, VCCA = 100 mA
VAUX_E
VAUX_B
VAUX
CAN-5V
MOSI
MISO
SCLK
NCS
RXD
TXD
CANH
CANL
SELECT
INTB
RSTB
FS0B
DEBUG
IO_0
IO_1
IO_2
IO_3
IO_4
IO_5
GND_COM
VDDIO
CAN BUS
VDDIO
VPRE
DEBUG
mode
GNDA DGND
VCORE or
VCCA
VSUP1
SW_PRE2
VPRE
SW_CORE
FB_CORE
VCCA_E
VCCA_B
VCCA
VSENSE COMP_CORE
VSUP2
BOOTS_RPE
BOOTS_CORE
GSTE_LS
Sw_PRE1
VCORE_SNS
VSUP3
+Battery
(KL30)
VDDIO
MUX_OUT
VCCA
MCU
SPI
VDD
ADC Input
AD ref.
voltage
NMI
Reset
FCCU
CAN
Ignition Key
(KL15)
VDD
VSUP3
LIN BUS
LIN RXDL
TXDL LIN
VPRE
VPRE
33907/33908
NXP Semiconductors 3
33907/33908
1 Orderable parts
Table 1. Orderable part variations
Part number Temperature (TA)Package CAN LIN VCORE Notes
MC33907NAE
-40 to 125 °C 48-pin LQFP exposed pad 1
0 0.8 A
(1)
MC33908NAE 0 1.5 A
MC33907LAE 1 0.8 A
MC33908LAE 1 1.5 A
Notes
1. To order parts in Tape & Reel, add the R2 suffix to the part number.
NXP Semiconductors 4
33907/33908
2 Internal Block Diagram
Figure 3. 33907L/33908L with CAN and LIN simplified internal block diagram
VSUP1
SW_PRE2
VPRE
SW_CORE
FB_CORE
VCCA_E
VCCA_B
VCCA
VAUX_B
VAUX_E
VAUX
CAN-5V
COMP_CORE
MOSI
MISO
SCLK
NCS
RXD
TXD
CANH
CANL
VDDIO
SELECT
MUX_OUT
INTB
RSTB
FS0B
DEBUG
GNDA
DGND
IO_0
IO_1
IO_2
IO_3
IO_4
IO_5
VPRE SMPS VCORE SMPS
VCCA Linear RegulatorVAUX Linear Regulator
Voltage Regulator
SUPERVISOR
(Over & undervoltage)
VCAN
Internal Linear
Regulator
HSCAN Interface
I/Os
Interface
MUX
Interface
FAIL SAFE Machine
Analog Reference #2
FS
Power Management
State Machine
V2p5
Logic
Main
V2p5Logic
FS
6
OSC
Main
OSC
FS
CAN-5V
VPRE
VAUX VCCA FB_CORE
IO_0
VSENSE
TSDTSD
TSD
TSD
VSUP1&2 CAN diag
BOOTS_PRE
BOOTS_CORE
Charge Pump
GATE_LS
SW_PRE1
VSUP2
VCORE_SNS
VREF
(2.5 V)
Die
Temp
Analog
Reference #1
GND_COM
SPI
Main
SPI
FS
VSUP3
TSD
IO_1
5
VSUP3
VPRE
VSENSE VSENSE
VPRE
VPRE
VDDIO
CAN-5V
VSUP3
VSENSE
Select
Select Debug
VDDIO
Debug
MISO FS
Fail Safe Logic & supply
RXDL
TXDL
LIN LIN Interface
VPRE VPRE
VPRE
VPRE
NXP Semiconductors 5
33907/33908
Figure 4. 33907N/33908N with CAN only simplified internal block diagram
VSUP1
SW_PRE2
VPRE
SW_CORE
FB_CORE
VCCA_E
VCCA_B
VCCA
VAUX_B
VAUX_E
VAUX
CAN-5V
COMP_CORE
MOSI
MISO
SCLK
NCS
RXD
TXD
CANH
CANL
VDDIO
SELECT
MUX_OUT
INTB
RSTB
FS0B
DEBUG
GNDA
DGND
IO_0
IO_1
IO_2
IO_3
IO_4
IO_5
VPRE SMPS VCORE SMPS
VCCA Linear RegulatorVAUX Linear Regulator
Voltage Regulator
SUPERVISOR
(Over & undervoltage)
VCAN
Internal Linear
Regulator
HSCAN Interface
I/Os
Interface
MUX
Interface
FAIL SAFE Machine
Analog Reference #2
FS
Power Management
State Machine
V2p5
Logic
Main
V2p5Logic
FS
6
OSC
Main
OSC
FS
CAN-5V VAUX VCCA FB_CORE
IO_0
VSENSE
TSDTSD
TSD
TSD
VSUP1&2 CAN diag
BOOTS_PRE
BOOTS_CORE
Charge Pump
GATE_LS
SW_PRE1
VSUP2
VCORE_SNS
VREF
(2.5 V)
Die
Temp
Analog
Reference #1
GND_COM
SPI
Main
SPI
FS
VSUP3
TSD
IO_1
5
VSUP3
VPRE
VSENSE VSENSE
VPRE
VDDIO
CAN-5V
VSUP3
VSENSE
Select
Select Debug
VDDIO
Debug
MISO FS
Fail Safe Logic & supply
VPRE
VPRE
VPRE
VPRE VPRE
VPRE
6NXP Semiconductors
33907/33908
3 Pin connections
3.1 Pinout diagram for 33907/33908
Figure 5. 33907L/33908L pinout with CAN and LIN
Figure 6. 33907N/33908N pinout with CAN only
VSUP1
VSUP2
VSENSE
VSUP3
LIN
GND_COM
CAN_5V
CANH
CANL
IO_4
IO_5
IO_0
IO_1
FS0B
DEBUG
AGND
MUX_OUT
IO_2
IO_3
TXD
RXD
TXDL
RXDL
RSTB
MISO
MOSI
SCLK
NCS
INTB
VDDIO
SELECT
FB_CORE
VCORE_SNS
VPRE
VAUX
VAUX_B
VAUX_E
VCCA_E
VCCA_B
VCCA
GATE_LS
DGND
BOOT_PRE
COMP_CORE
SW_CORE
BOOT_CORE
SW_PRE1
SW_PRE2
Transparent top view
VSUP1
VSUP2
VSENSE
VSUP3
NC
GND_COM
CAN_5V
CANH
CANL
IO_4
IO_5
IO_0
IO_1
FS0B
DEBUG
AGND
MUX_OUT
IO_2
IO_3
TXD
RXD
NC
NC
RSTB
MISO
MOSI
SCLK
NCS
INTB
VDDIO
SELECT
FB_CORE
VCORE_SNS
VPRE
VAUX
VAUX_B
VAUX_E
VCCA_E
VCCA_B
VCCA
GATE_LS
DGND
BOOT_PRE
COMP_CORE
SW_CORE
BOOT_CORE
SW_PRE1
SW_PRE2
Transparent top view
NXP Semiconductors 7
33907/33908
3.2 Pin definitions
A functional description of each pin can be found in the functional pin description section beginning on page 26.
Table 2. 33907/33908 pin definition
33907L/
33908L
pin number
33907N/
33908N
pin number
Pin name Type Definition
11VSUP1A_IN
Power supply of the device. An external reverse battery protection diode in series is
mandatory
22VSUP2A_IN
Second power supply. Protected by the external reverse battery protection diode used for
VSUP1. VSUP1 and VSUP2 must be connected together externally.
3 3 VSENSE A_IN Sensing of the battery voltage. Must be connected prior to the reverse battery protection
diode.
44VSUP3A_IN
Third power supply dedicated to the device supply. Protected by the external reverse battery
protection diode used for VSUP1. Must be connected between the reverse protection diode
and the input PI filter.
5 NC LIN A_IN/OUT LIN single-wire bus transmitter and receiver. NC: pin must be left open for 33907N/33908N
version
6 6 GND_COM GND Dedicated ground for CAN
7 7 CAN_5V A_OUT Output voltage for the embedded CAN interface
8 8 CANH A_IN/OUT HSCAN output High
9 9 CANL A_IN/OUT HSCAN output Low
10
11
10
11 IO_4:5 D_IN
A_OUT
Can be used as digital input (load dump proof) with wake-up capability or as an output gate
driver
Digital input: Pin status can be read through the SPI. Can be used to monitor error signals
from another IC for safety purposes.
Wake-up capability: Can be selectable to wake-up on a rising or falling edge, or on a
transition
Output gate driver: Can drive a logic level low-side NMOS transistor. Controlled by the SPI.
12
13
12
13 IO_0:1 A_IN
D_IN
Can be used as analog or digital input (load dump proof) with wake-up capability (selectable)
Analog input: Pin status can be read through the MUX output pin
Digital input: Pin status can be read through the SPI. Can be used to monitor error signals
from another IC for safety purposes
Wake-up capability: Can be selectable to wake-up on a rising or falling edge, or on a
transition
Rk: For safety purposes, IO_1 can also be used to monitor the middle point of a redundant
resistor bridge connected on Vcore (in parallel to the one used to set the Vcore voltage).
14 14 FS0B D_OUT Output of the safety block (active low). The pin is asserted low at start-up and when a fault
condition is detected. Open drain structure.
15 15 DEBUG D_IN Debug mode entry input
16 16 AGND GROUND Analog ground connection
17 17 MUX_OUT A_OUT Multiplexed output to be connected to an MCU ADC input. Selection of the analog parameter
is available at MUX-OUT through the SPI.
18
19
18
19 IO_2:3 D_IN
Digital input pin with wake-up capability (logic level compatible)
Digital INPUT: Pin status can be read through the SPI. Can be used to monitor error signals
from MCU for safety purposes.
Wake-up capability: Can be selectable to wake-up on a rising or falling edge, or on a
transition.
20 20 TXD D_IN Transceiver input from the MCU which controls the state of the HSCAN bus. Internal pull-up
to VDDIO. Internal pull-up to VDDIO.
21 21 RXD D_OUT Receiver output which reports the state of the HSCAN bus to the MCU
22 NC TXDL D_IN Transceiver input from the MCU which controls the state of the LIN bus. Internal pull-up to
VDDIO. NC: pin must be left open for 33907N/33908N version
8NXP Semiconductors
33907/33908
23 NC RXDL D_OUT Receiver output which reports the state of the LIN bus to the MCU. NC: pin must be left open
for 33907N/33908N version
24 24 RSTB D_OUT
This output is asserted low when the safety block reports a failure. The main function is to
reset the MCU. Reset input voltage is also monitored in order to detect external reset and
fault condition. Open drain structure.
25 25 MISO D_OUT SPI bus. Master Input Slave Output
26 26 MOSI D_IN SPI bus. Master Output Slave Input
27 27 SCLK D_IN SPI Bus. Serial clock
28 28 NCS D_IN No Chip Select (Active low)
29 29 INTB D_OUT This output pin generates a low pulse when an Interrupt condition occurs. Pulse duration is
configurable. Internal pull-up to VDDIO.
30 30 VDDIO A_IN Input voltage for MISO output buffer. Allows voltage compatibility with MCU I/Os.
31 31 SELECT D_IN Hardware selection pin for VAUX and VCCA output voltages
32 32 FB_CORE A_IN VCORE voltage feedback. Input of the error amplifier.
33 33 COMP_CORE A_IN Compensation network. Output of the error amplifier.
34 34 VCORE_SNS A_IN VCORE output voltage sense
35 35 SW_CORE A_IN VCORE switching point
36 36 BOOT_CORE A_IN/OUT Bootstrap capacitor for VCORE internal NMOS gate drive
37 37 VPRE A_OUT VPRE output voltage
38 38 VAUX A_OUT VAUX output voltage. External PNP ballast transistor. Collector connection
39 39 VAUX_B A_OUT VAUX voltage regulator. External PNP ballast transistor. Base connection
40 40 VAUX_E A_OUT VAUX voltage regulator. External PNP ballast transistor. Emitter connection
41 41 VCCA_E A_OUT VCCA voltage regulator. External PNP ballast transistor. Emitter connection
42 42 VCCA_B A_OUT VCCA voltage regulator. External PNP ballast transistor. Base connection
43 43 VCCA A_OUT VCCA output voltage. External PNP ballast transistor. Collector connection
44 44 GATE_LS A_OUT Low-side MOSFET gate drive for “Non-inverting Buck-boost” configuration
45 45 DGND GROUND Digital ground connection
46 46 BOOT_PRE A_IN/OUT Bootstrap capacitor for the VPRE internal NMOS gate drive
47 47 SW_PRE2 A_IN Second pre-regulator switching point
48 48 SW_PRE1 A_IN First pre-regulator switching point
Table 2. 33907/33908 pin definition (continued)
33907L/
33908L
pin number
33907N/
33908N
pin number
Pin name Type Definition
NXP Semiconductors 9
33907/33908
4 General product characteristics
4.1 Maximum ratings
Table 3. Maximum ratings
All voltages are with respect to ground, unless otherwise specified. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol Ratings Value Unit Notes
Electrical ratings
VSUP1/2/3 DC Voltage at Power Supply Pins -1.0 to 40 V (2)
VSENSE DC Voltage at Battery Sense Pin -14 to 40 V
VSW1,2 DC Voltage at SW_PRE1 and SW_PRE2 Pins -1.0 to 40 V
VPRE DC Voltage at VPRE Pin -0.3 to 8 V
VGATE_LS DC Voltage at Gate_LS pin -0.3 to 8 V
VBOOT_PRE DC Voltage at BOOT_PRE pin -1.0 to 50 V
VSW_CORE DC Voltage at SW_CORE pin -1.0 to 8.0 V
VCORE_SNS DC Voltage at VCORE_SNS pin 0.0 to 8.0 V
VBOOT_CORE DC Voltage at BOOT_CORE pin 0.0 to 15 V
VFB_CORE DC Voltage at FB_CORE pin -0.3 to 2.5 V
VCOMP_CORE DC Voltage at COMP_CORE pin -0.3 to 2.5 V
VAUX_E,B DC Voltage at VAUX_E, VAUX_B pin -0.3 to 40 V
VAUX DC Voltage at VAUX pin -2.0 to 40 V
VCCA_B,E DC Voltage at VCCA_B, VCCA_E pin -0.3 to 8.0 V
VCCA DC Voltage at VCCA pin -0.3 to 8.0 V
VDDIO DC Voltage at VDDIO -0.3 to 8.0 V
VFS0 DC Voltage at FS0B (with ext R mandatory) -0.3 to 40 V
VDEBUG DC Voltage at DEBUG -0.3 to 40 V
VIO_0,1,4,5 DC Voltage at IO_0:1; 4:5 (with ext R = 5.1 kΩ in series mandatory) -0.3 to 40 V
VDIG DC Voltage at INTB, RSTB, MISO, MOSI, NCS, SCLK, MUX_OUT, RXD, TXD,
RXDL, TXDL, IO_2, IO_3 -0.3 to VDDIO+0.3 V
VSELECT DC Voltage at SELECT -0.3 to 8.0 V
VBUS_CAN DC Voltage on CANL, CANH -27 to 40 V
VBUS_LIN DC Voltage on LIN -18 to 40V V
VCAN_5V DC Voltage on CAN_5 V -0.3 to 8.0 V
I_IO0, 1, 4, 5 IOs Maximum Current Capability(IO_0, IO_1, IO_4, IO_5) -5.0 to 5.0 mA
Notes
2. All Vsups (VSUP1/2/3) shall be connected to the same supply (Figure 58)
10 NXP Semiconductors
33907/33908
VESD-HBM1
VESD-HBM2
VESD-HBM3
VESD-HBM4
VESD-CDM1
VESD-CDM2
VESD-GUN1
VESD-GUN2
VESD-GUN3
VESD-GUN4
VESD-GUN5
VESD-GUN6
VESD-GUN7
VESD-GUN8
VESD-GUN9
VESD-GUN10
VESD-GUN11
VESD-GUN12
ESD Voltage
Human Body Model (JESD22/A114) - 100 pF, 1.5 kΩ
•All pins
• VSUP1,VSUP2, VSUP3, VSENSE, VAUX, IO_0:1, IO_4:5,FS0B, DEBUG
• CANH, CANL
•LIN
Charge Device Model (JESD22/C101):
•All Pins
• Corner Pins
System level ESD (Gun Test)
• VSUP1, VSUP2, VSUP3, VSENSE, VAUX, IO_0:1, IO_4:5, FS0B
330 Ω / 150 pF Unpowered According to IEC61000-4-2:
330 Ω / 150 pF Unpowered According to OEM LIN, CAN, FLexray Conformance
2.0 kΩ / 150 pF Unpowered According to ISO10605.2008
2.0 kΩ / 330 pF Powered According to ISO10605.2008
• CANH, CANL
330 Ω / 150 pF Unpowered According to IEC61000-4-2:
330 Ω / 150 pF Unpowered According to OEM LIN, CAN, FLexray Conformance
2.0 kΩ / 150 pF Unpowered According to ISO10605.2008
2.0 kΩ / 330 pF Powered According to ISO10605.2008
•LIN
330 Ω / 150 pF Unpowered According to IEC61000-4-2:
330 Ω / 150 pF Unpowered According to OEM LIN, CAN, FLexray Conformance
2.0 kΩ / 150 pF Unpowered According to ISO10605.2008
2.0 kΩ / 330 pF Powered According to ISO10605.2008
±2.0
±4.0
±6.0
±8.0
±500
±750
±8.0
±8.0
±8.0
±8.0
±15.0
±12.0
±15.0
±15.0
±15.0
±15.0
±12.0
±15.0
kV
kV
kV
kV
V
V
kV
kV
kV
kV
kV
kV
kV
kV
kV
kV
kV
kV
(3)
Thermal ratings
TAAmbient Temperature -40 to 125 °C
TJJunction Temperature -40 to 150 °C
TSTG Storage Temperature -55 to 150 °C
Thermal resistance
RθJA Thermal Resistance Junction to Ambient 30 °C/W (4)
RθJCTOP Thermal Resistance Junction to Case Top 24.2 °C/W (5)
RθJCBOTTOM Thermal Resistance Junction to Case Bottom 0.9 °C/W (6)
Notes
3. Compared to AGND.
4. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC - 883 Method 1012.1).
6. Thermal resistance between the die and the solder par on the bottom of the packaged based on simulation without any interface resistance.
Table 3. Maximum ratings (continued)
All voltages are with respect to ground, unless otherwise specified. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol Ratings Value Unit Notes
NXP Semiconductors 11
33907/33908
4.2 Static electrical characteristics
Table 4. Operating range
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
Power supply
ISUP123 Power Supply Current in Normal Mode (VSUP > VSUP_UV_7) 2.0 – 13.0 mA
ISUP3 Power Supply Current for VSUP3 in Normal Mode (VSUP > VSUP_UV_7)– 3.5 5.0 mA
ISUP_LPOFF1 Power Supply Current in LPOFF (VSUP = 14 V at TA = 25 °C) – 32 – µA
ISUP_LPOFF2 Power Supply Current in LPOFF (VSUP = 18 V at TA = 80 °C) – 42 60 µA
VSNS_UV Power Supply Undervoltage Warning – 8.5 – V
VSNS_UV_HYST Power Supply Undervoltage Warning Hysteresis 0.1 – – V
VSUP_UV_7 Power Supply Undervoltage Lockout (power-up) 7.0 – 8.0 V
VSUP_UV_5 Power Supply Undervoltage Lockout (power-up) – – 5.6 V
VSUP_UV_L Power Supply Undervoltage Lockout (falling - Boost config.) – – 2.7 V
VSUP_UV_L_B Power Supply Undervoltage Lockout (falling - Buck config.) – – 4.6 V (7)
VSUP_UV_HYST Power Supply Undervoltage Lockout Hysteresis – 0.1 – V (8)
VPRE voltage pre-regulator
VPRE
VPRE Output Voltage
• Buck mode (VSUP > VSUP_UV_7)
• Buck mode (VSUP_UV_7 ≥ VSUP ≥ 4.6 V)
• Boost mode (VSUP ≥ 2.7 V)
6.25
VPRE_UV_4
P3
6.0
–
VSUP -
RDSON_PR
E * IPRE
–
6.75
–
7.0
V
IPRE
VPRE Maximum Output Current Capability
• Buck or Boost with VSUP > VSUP_UV_7
• Buck with VSUP_UV_7 ≥ VSUP ≥ 4.6 V
• Boost with VSUP_UV_7 ≥ VSUP ≥ 6.0 V
• Boost with 6.0 V ≥ VSUP ≥ 4.0 V
• Boost with 4.0 V ≥ VSUP ≥ 2.7 V
2.0
0.5
2.0
1.0
0.3
–
2.0
–
–
–
–
–
–
–
–
A(8)
IPRE_LPOFF
VPRE Maximum Output Current Capability in LPOFF at low VSUP
voltage
• Buck with VSUP_UV_7 ≥ VSUP ≥ 4.6 V
• Boost with VSUP_UV_7 ≥ VSUP ≥ 6.0 V
• Boost with 6.0 V ≥ VSUP ≥ 4.0 V
• Boost with 4.0 V ≥ VSUP ≥ 2.7 V
0.05
2.0
1.0
0.3
–
–
–
–
–
–
–
–
A(8)
IPRE_LIM VPRE Output Current Limitation with VSUP ≤ 28 V 3.5 – – A
IPRE_OC
VPRE Overcurrent Detection Threshold (in buck mode only) with VSUP
≤ 28 V 5.0 – – A
VPRE_UV VPRE Undervoltage Detection Threshold (Falling) 5.5 – 6.0 V
Notes
7. VSUP_UV_L_B = VPRE_UV_4P3 + RDSON_PRE * IPRE
8. Guaranteed by design
12 NXP Semiconductors
33907/33908
VPRE voltage pre-regulator (continued)
VPRE_UV_HYST VPRE Undervoltage Hysteresis 0.05 – 0.15 V (9)
VPRE_UV_4P3 VPRE Shut-off Threshold (Falling - buck and buck/boost) 4.2 – 4.5 V
VPRE_UV_4P3_
HYST
VPRE Shut-off Hysteresis 0.05 – 0.15 V (9)
RDSON_PRE VPRE Pass Transistor On Resistance with VSUP ≤ 28 V – – 200 mΩ
LIR_VPRE VPRE Line Regulation – 20 – mV (9)
LORVPRE_BUCK
VPRE Load Regulation for COUT = 57 µF
•I
PRE from 50 mA to 2.0 A - Buck mode – 100 – mV (9)
LORVPRE_BOOST
VPRE Load Regulation for COUT = 57 µF
•I
PRE from 50 mA to 2.0 A - Boost mode – 500 – mV (9)
VPRE_LL_H
VPRE_LL_L
VPRE Pulse Skipping Thresholds –
–
200
180
–
–mV
TWARN_PRE VPRE Thermal Warning Threshold – 125 – °C
TSD_PRE VPRE Thermal Shutdown Threshold 160 – – °C
TSD_PRE_HYST VPRE Thermal Shutdown Hysteresis – 10 – °C (9)
VSUP_IPFF IPFF Input Voltage Detection 18 – 24 V
VSUP_IPFF_HYST IPFF Input Voltage Hysteresis 0.2 – – V
IPRE_IPFF_PK IPFF High-side Peak Current Detection with VSUP ≤ 28 V 1.7 – – A
VG_LS_OH LS Gate Driver High Output Voltage (IOUT = 50 mA) VPRE-1 – VPRE V
VG_LS_OL LS Gate driver Low Level (IOUT = 50 mA) – – 0.5 V
Vcore voltage regulator
VCORE_FB VCORE Feedback Input Voltage 0.784 0.8 0.816 V
ICORE
VCORE Output Current Capability in Normal Mode
• 33907N
• 33908N
• 33907L
• 33908L
–
–
–
–
–
–
–
–
0.8
1.5
0.8
1.5
A
ICORE_LIM
VCORE Output Current Limitation
• 33907N
• 33908N
• 33907L
• 33908L
1
1.8
1
1.8
–
–
–
–
2
3.5
2
3.5
A
RDSON_CORE VCORE Pass Transistor On Resistance – – 200 mΩ
Notes
9. Guaranteed by design
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
NXP Semiconductors 13
33907/33908
Vcore voltage regulator (continued)
LORVCORE_1.2 VCORE Transient Load regulation - 1.2 V range -60 – 60 mV (10), (11)
LORVCORE_3.3 VCORE Transient Load regulation - 3.3 V range -100 – 100 mV (10), (11)
VCORE_LL_H
VCORE_LL_L
VCORE Pulse Skipping Thresholds –
–
180
160
–
–mV
TWARN_CORE VCORE Thermal Warning Threshold – 125 – °C
TSD_CORE VCORE Thermal Shutdown Threshold 160 – – °C
TSD_CORE_HYST VCORE Thermal Shutdown Hysteresis – 10 – °C (10)
VCCA voltage regulator
VCCA
VCCA Output Voltage
•5.0 V config. with Internal ballast at 100 mA
•5.0 V config with external ballast at 200 mA
•5.0 V config with external ballast at 300 mA
•3.3 V config with Internal ballast at 100 mA
•3.3 V config with external ballast at 200 mA
•3.3 V config with external ballast at 300 mA
4.95
4.9
4.85
3.2505
3.234
3.201
5.0
5.0
5.0
3.3
3.3
3.3
5.05
5.1
5.15
3.3495
3.366
3.399
V(12)
ICCA_IN VCCA Output Current (int. MOSFET) – – 100 mA
ICCA_OUT VCCA Output Current (external PNP) – – 300 mA
ICCA_LIM_INT VCCA Output Current Limitation (int. MOSFET) 100 – 675 mA
ICCA_LIM_OUT VCCA Output Current Limitation (external PNP) 300 – 675 mA
ICCA_LIM_FB VCCA Output Current Limitation Foldback 80 – 200 mA
VCCA_LIM_FB VCCA Output Voltage Foldback Threshold 0.5 – 1.1 V
VCCA_LIM_HYST VCCA Output Voltage Foldback Hysteresis 0.03 – 0.3 V
ICCA_BASE_SC
ICCA_BASE_SK
VCCA Base Current Capability –
20
–
–
30
–mA
TWARN_CCA VCCA Thermal Warning Threshold (int. MOSFET only) – 125 – °C
TSDCCA VCCA Thermal Shutdown Threshold (int. MOSFET only) 160 – – °C
TSDCCA_HYST VCCA Thermal Shutdown Hysteresis – 10 – °C (13)
LORTVCCA
VCCA Transient Load Regulation
•I
CCA = 10 mA to 100 mA (internal MOSFET)
•I
CCA = 10 mA to 300 mA (external ballast)
––1.0%
(13)
Notes
10. Guaranteed by design.
11. COUT = 40 µF, ICORE = 10 mA to 1.5 A, dICORE/dt ≤ 2.0 A/µs
12. External PNP gain within 150 to 450
13. Guaranteed by design.
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
14 NXP Semiconductors
33907/33908
Vaux voltage regulator
VAUX_5 VAUX Output Voltage (5.0 V configuration) 4.85 5.0 5.15 V
VAUX_33 VAUX Output Voltage (3.3 V configuration) 3.2 3.3 3.4 V
VAUX_TRK VAUX Tracking Error (VAUX_5 and VAUX_33) -15 – +15 mV
IAUX_OUT VAUX Output Current – – 300 mA
IAUX_LIM VAUX Output Current Limitation 300 – 700 mA
IAUX_LIM_FB VAUX Output Current Limitation Foldback 100 – 530 mA
VAUX_LIM_FB VAUX Output Voltage Foldback Threshold 0.5 – 1.1 V
VAUX_LIM_HYST VAUX Output Voltage Foldback Hysteresis 0.03 – 0.3 V
IAUX_BASE_SC
IAUX_BASE_SK
VAUX Base Current Capability –
7.0
–
–
-7.0
–mA
TSDAUX VAUX Thermal Shutdown Threshold 160 – – °C
TSDAUX_HYST VAUX Thermal Shutdown Hysteresis – 10 – °C (14)
LORVAUX VAUX Static Load Regulation (IAUX_OUT = 10 mA to 300 mA) – 15 – mV (14)
LORTVAUX
VAUX Transient Load Regulation
•I
AUX_OUT = 10 mA to 300 mA ––1.0%
(14)
CAN_5V voltage regulator
VCAN
VCAN Output Voltage
VSUP > 6.0 V in Buck mode
VSUP > VSUP_UV_L in Boost mode
4.8 5.0 5.2 V
ICAN_OUT VCAN Output Current – – 100 mA
ICAN_LIM VCAN Output Current Limitation 100 – 250 mA
TSDCAN VCAN Thermal Shutdown Threshold 160 – – °C
TSDCAN_HYST VCAN Thermal Shutdown Hysteresis – 10 – °C (14)
VCAN_UV VCAN Undervoltage Detection Threshold 4.25 – 4.8 V
VCAN_UV_HYST VCAN Undervoltage Hysteresis 0.07 – 0.22 V
VCAN_OV VCAN Overvoltage Detection Threshold 5.2 – 5.55 V
VCAN_OV_HYST VCAN Overvoltage Hysteresis 0.07 – 0.22 V
LORVCAN VCAN Load Regulation (from 0 to 50 mA) – 100 – mV (14)
Notes
14. Guaranteed by design.
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
NXP Semiconductors 15
33907/33908
Fail-safe machine voltage supervisor
VPRE_OV VPRE Overvoltage Detection Threshold 7.2 – 8.0 V
VPRE_OV_HYST VPRE Overvoltage Hysteresis – 0.1 – V (15)
VCORE_FB_UV VCORE FB Undervoltage Detection Threshold 0.67 – 0.773 V
VCORE_FB_UV_D VCORE FB Undervoltage Detection Threshold - Degraded mode 0.45 – 0.58 V
VCORE_FB_UV_
HYST
VCORE FB Undervoltage Hysteresis 10 – 27 mV (15)
VCORE_FB_OV VCORE FB Overvoltage Detection Threshold 0.84 – 0.905 V
VCORE_FB_OV_HYS
T
VCORE FB Overvoltage Hysteresis 10 – 30 mV (15)
VCORE_FB_DRIFT VCORE_FB Drift versus IO_1 50 100 150 mV
IPD_CORE VCORE Internal Pull-down Current (active when VCOR E is enabled) 5.0 12 25 mA
VCCA_UV_5 VCCA Undervoltage Detection Threshold (5.0 V config) 4.5 – 4.75 V
VCCA_UV_5D VCCA Undervoltage Detection Threshold (Degraded 5.0 V) 3.0 – 3.2 V
VCCA_UV_33 VCCA Undervoltage Detection Threshold (3.3 V config) 3.0 – 3.2 V
VCCA_UV_HYST VCCA Undervoltage Hysteresis – 0.07 – V (15)
VCCA_OV_5 VCCA Overvoltage Detection Threshold (5.0 V config) 5.25 – 5.5 V
VCCA_OV_33 VCCA Overvoltage Detection Threshold (3.3 V config) 3.4 – 3.6 V
VCCA_OV_HYST VCCA Overvoltage Hysteresis – 0.15 – V (15)
RPD_CCA VCCA Internal Pull-down Resistor (active when VCCA is disabled) 50 – 160 Ω
VAUX_UV_5 VAUX Undervoltage Detection Threshold (5.0 V config) 4.5 – 4.75 V
VAUX_UV_5D VAUX Undervoltage Detection Threshold (Degraded 5.0 V) 3.0 – 3.2 V
VAUX_UV_33 VAUX Undervoltage Detection Threshold (3.3 V config) 3.0 – 3.2 V
VAUX_UV_HYST VAUX Undervoltage Hysteresis – 0.07 – V (15)
VAUX_OV_5 VAUX Overvoltage Detection Threshold (5.0 V config) 5.25 – 5.5 V
VAUX_OV_33 VAUX Overvoltage Detection Threshold (3.3 V config) 3.4 – 3.6 V
VAUX_OV_HYST VAUX Overvoltage Hysteresis – 0.07 – V (15)
RPD_AUX VAUX Internal Pull-down Resistor (active when VAUX is disabled) 50 – 170 Ω
Notes
15. Guaranteed by design.
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
16 NXP Semiconductors
33907/33908
Fail-safe outputs
VRSTB_OL Reset Low Output Level (I_RSTB = 2.0 mA and 2.0 V < VSUP < 40 V) – – 0.5 V (16)
IRSTB_LIM Reset Output Current Limitation 12 – 25 mA
VRSTB_IL External Reset Detection Threshold (falling) 1.0 – – V
VRSTB_IH External Reset Detection Threshold (rising) – – 2.0 V
VRSTB_IN_HYST External Reset Input Hysteresis 0.2 – – V
VFS0B_OL FS0B Low Output Level (I_FS0b = 2.0 mA) – – 0.5 V
IFS0B_LK FS0B Input Current Leakage (VFS0B = 28 V) – – 1.0 µA
IFS0B_LIM FS0B Output Current Limitation 6.0 – 12 mA
Analog input - multi-purpose IOs
VIO_ANA_WD Measurable Input Voltage (wide range) 3.0 – 19 V
VIO_ANA_TG Measurable Input Voltage (tight range) 3.0 – 9.0 V
IIO_IN_ANA Input Current – – 100 µA
Digital input
VIO_IH
Digital High Input voltage level (IO_0:1, IO_4:5)
• Min Limit = 2.7 V at VSUP = 40 V 2.6 – – V
VIO23_IH Digital High Input voltage level (IO_2, IO_3) 2.0 – – V
VIO_IL Digital Low Input voltage Level (IO_0:1; IO_4:5) – – 2.1 V
VIO_HYST Input Voltage Hysteresis (IO_0:1, IO_4:5) 50 120 500 mV (17)
VIO23_IL Digital Low Input voltage Level (IO_2, IO_3) – – 0.9 V
VIO23_HYST Input Voltage Hysteresis (IO_2, IO_3) 200 450 700 mV (17)
IIO_IN_0:1 Input Current for IO_0:1 -5.0 – 100 µA
IIO_IN_1 Input Current for IO_1 when used for FB_Core monitoring -1.0 – 1.0 µA
IIO_IN_2:5 Input Current for IO_2:5 -5.0 – 5.0 µA
IIO_IN_LPOFF Input Current for IO_0:5 in LPOFF -1.0 – 1.0 µA
Output gate driver
VIO_OH High Output Level at IIO_OUT = -2.5 mA VPRE - 1.5 – VPRE V
VIO_OL Low Output Level at IIO_OUT = +2.5 mA 0.0 – 1.0 V
VIO_OUT_SK
VIO_OUT_SC
Output Current Capability 2.5
–
–
–
–
-2.5 mA
Notes
16. For VSUP < 2.0 V, all supplies are already off and external pull-up on RSTB (e.g VCORE or VCCA) pulls the line down.
17. Guaranteed by design.
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
NXP Semiconductors 17
33907/33908
Analog multiplexer
VAMUX_ACC Voltage Sense Accuracy (VSNS, IO_0, IO_1) using 5.1 kΩ resistor -5.0 – 5.0 % (18)
VAMUX_WD_5 Divider Ratio (wide input voltage range) at VDDIO = 5.0 V – 5.0 –
VAMUX_WD_3P3 Divider Ratio (wide input voltage range) at VDDIO = 3.3 V – 7.0 –
VAMUX_TG_5 Divider Ratio (tight input voltage range) at VDDIO = 5.0 V – 2.0 –
VAMUX_TG_3P3 Divider Ratio (tight input voltage range) at VDDIO = 3.3 V – 3.0 –
VAMUX_REF1 Internal Voltage Reference with 6.0 V < VSUP < 19 V 2.475 2.5 2.525 V
VAMUX_REF2 Internal Voltage Reference with VSUP ≤ 6.0 V or VSUP ≥ 19 V 2.468 2.5 2.532 V
VAMUX_TP_CO Internal Temperature sensor coefficient – 9.9 – mV/°C (19)
VAMUX_TP Temperature Sensor MUX_OUT output voltage (at TJ=165°C) 2.08 2.15 2.22 V
Interrupt
VINTB_OL Low Output Level (IINT = 2.5 mA) – – 0.5 V
RPU_INT Internal Pull-up Resistor (connected to VDDIO) – 10 – KΩ
IINT_LK Input Leakage Current – – 1 µA
CAN transceiver
CAN logic input pin (TXD)
VTXD_IH TXD High Input Threshold 0.7 x VDDIO – –V
VTXD_IL TXD Low Input Threshold – – 0.3 x VDDIO V
TXDPULL-UP TXD Main Device Pull-up 20 33 50 KΩ
TXDLK TXD Input Leakage Current, VTXD = VDDIO -1.0 – 1.0 µA
CAN logic output pin (RXD)
VRXD_OL1 Low Level Output Voltage (IRXD = 250 µA) – – 0.4 V
VRXD_OL2 Low Level Output Voltage (IRXD = 1.5 mA) – – 0.9 V
VOUTHIGH High Level Output Voltage (IRXD = -250 µA, VDDIO = 3.0 V to 5.5 V) VDDIO -
0.4V ––V
Notes
18. If a higher resistor value than recommended is used, the accuracy degrades.
19. Guaranteed by design
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
18 NXP Semiconductors
33907/33908
CAN output pins (CANH, CANL)
VDIFF_COM_MODE Differential Input Comparator Common Mode Range -12 – 12 V
VIN_DIFF_SLEEP Differential Input Voltage Threshold in Sleep Mode 0.5 – 0.9 V
VIN_HYST Differential Input Hysteresis (in TX, RX mode) 50 – – mV
RIN_CHCL CANH, CANL Input Resistance 5.0 – 50 kΩ
RIN_DIFF CAN Differential Input Resistance 10 – 100 kΩ
RIN_MATCH Input Resistance Matching -3.0 – 3.0 %
VCANH
CANH Output Voltage (45 Ω < RBUS < 65 Ω)
• TX dominant state
• TX recessive state
2.75
2.0
–
2.5
4.5
3.0
V
VCANL
CANL Output Voltage (45 Ω < RBUS < 65 Ω)
• TX dominant state
• TX recessive state
0.5
2.0
–
2.5
2.25
3.0
V
VCAN_SYM CAN dominant voltage symmetry (VCANL + VCANH) 4.5 5 5.5 V
VOH-VOL
Differential Output Voltage
• TX dominant state (45 Ω < RBUS < 65 Ω)
• TX recessive state
1.5
-50
2.0
0.0
3.0
50
V
mV
ICANL-SK
CANL Sink Current Under Short-circuit Condition (VCANL ≤ 12 V, CANL
driver ON, TXD low) 40 – 100 mA
ICANH-SC
CANH Source Current Under Short-circuit Condition (VCANH = -2.0 V,
CANH driver ON, TXD low) -100 – -40 mA
RINSLEEP
CANH, CANL Input Resistance Device Supplied and in CAN Sleep
Mode 5.0 – 50 kΩ
VCANLP CANL, CANH Output Voltage in Sleep Modes. No termination load. -0.1 0.0 0.1 V
ICAN
CANH, CANL Input Current, Device Unsupplied, (VCANH, VCANL =5.0V)
•V
SUP and VCAN connected to GND
•V
SUP and VCAN connected to GND via 47k resistor
-10
-10
–
–
10
10
µA
µA
(20)
TOT Overtemperature Detection 160 – – °C
THYST Overtemperature Hysteresis – – 20 °C
Digital interface
MISOHHigh Output Level on MISO (IMISO = 1.5 mA) VDDIO - 0.4 – – V
MISOLLow Output Level on MISO (IMISO = 2.0 mA) – – 0.4 V
IMISO Tri-state Leakage Current (VDDIO = 5.0 V) -5.0 – 5.0 µA
VDDIO Supply Voltage for MISO Output Buffer 3.0 – 5.5 V
IVDDIO Current consumption on VDDIO – 1.0 3.0 mA
SPILK SCLK, NCS, MOSI Input Current -1.0 – 1.0 µA
VSPI_IH SCLK, NCS, MOSI High Input Threshold 2.0 – – V
RSPI NCS, MOSI Internal Pull-up (pull-up to VDDIO) 200 400 800 KΩ
VSPI_IL SCLK, NCS, MOSI Low Input Threshold – – 0.8 V
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
NXP Semiconductors 19
33907/33908
Debug
VDEBUG_IL Low Input Voltage Threshold 2.1 2.35 2.6 V
VDEBUG_IH High Input Voltage Threshold 4.35 4.6 4.97 V
IDEBUG_LK Input Leakage Current -10 – 10 µA
LIN transceiver (when 7.0 V < Vsup1,2,3 < 18 V, unless otherwise specified) (33907L/33908L)
LIN logic input pin (TXDL)
VTXDL_IH TXDL High Input Threshold 2.0 – – V
VTXDL_IL TXDL Low Input Threshold – – 0.8 V
TXDLPULL-UP TXDL Internal Pull-up (to VDDIO) 20 33 50 kΩ
TXDLLK TXD Input Leakage Current, VTXDL = VDDIO -1.0 – 1.0 µA
LIN logic input pin (RXDL)
VRXDL_OL1 Low Level Output Voltage (IRXDL = 250 µA) – – 0.4 V
VRXDL_OL2 Low Level Output Voltage (IRXDL = 1.5 mA) – – 0.9 V
VRXDL_OUT_HIGH High Level Output Voltage (IRXDL = -250 µA, VDDIO = 3.0 V to 5.5 V) VDDIO-0.4V – – V
LIN output pin
IBUS_PAS_DOM
Input Leakage Current at the Receiver. Dominant State (Driver OFF,
VBAT = 12 V, VBUS = 0 V) -1.0 – – mA (21)
IBUS_PAS_REC
Input Leakage Current at the Receiver. Recessive State (Driver OFF,
8.0 V < VBAT < 18 V, 8.0 V < VBUS < 18 V, VBUS ≥ VBAT)––20µA
VDRIVER_DOM Driver Dominant Voltage – – 0.251 VSUP V
VBUS_DOM Receiver Dominant State – – 0.4 VSUP V
VBUS_REC Receiver Recessive State 0.6 VSUP ––V
VBUS_WU LIN Wake-up Detection Threshold (7.0 V< VSUP < 18 V) 0.4 VSUP – 0.6 VSUP V
VLIN_UV VSUP Undervoltage Threshold – – 7.0 V
VSER_DIODE
Series Diode Voltage Drop (DSER_MASTER and DSER_INT in pull-up
path) 0.4 0.7 1.0 V
IBUS_LIM Current Limitation for Driver Dominant State (VBUS = 18 V) 40 – 200 mA (22)
RSLAVE LIN Pull-up Resistor 20 – 60 kΩ
VSHIFT_GND Ground Shift (VSHIFT_GND = VGND_ECU - VGND_BATTERY) 0.0 – 11.5%VBAT V
VSHIFT_BAT Battery Voltage Shift (VSHIFT_BAT = VBATTERY - VSHIFT_GND- VBAT) 0.0 – 11.5%VBAT V(23)
Notes
20. Guaranteed by design and characterization.
21. VBAT is the voltage at the input of the control unit.
22. Current flowing inside the pin. A transceiver must be capable to sink at least 40 mA.
23. VBAT: voltage across the battery connectors of the vehicle. VGND_ECU: voltage on the local ECU ground connector with respect to battery ground
of the vehicle (VGND_BATTERY).
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
20 NXP Semiconductors
33907/33908
LIN output pin (continued)
VSHIFT_DIF
Difference Between Battery Shift and Ground Shift
(VSHIFT_DIF = VSHIFT_BAT - VSHIFT_GND)0.0 – 8.0% VBAT V(24)
VBUS_CNT VBUS_CNT = (VTH_REC + VTH_DOM)/2 0.475 VSUP – 0.525 VSUP V(25)
VHYST VHYST = VTH_REC - VTH_DOM – – 0.175 VSUP V
IBUS_NO_GND
Ground Disconnection. GND = VSUP, 0 V < VBUS < 18 V, VBAT = 12 V.
Loss of Local GND does not affect communication in the remaining
network
-1.0 – 1.0 mA (26)
IBUS_NO_BAT
VBAT disconnection. VSUP = GND, 0 V < VBUS < 18 V. Node sustains
the current that can flow under this condition. BUS remains operational. – – 100 µA
LINTSD LIN Thermal Shutdown – 180 – °C (27)
LINTSD_HYST LIN Thermal Shutdown Hysteresis 20 °C
CLIN LIN internal capacitor – – 10 pF (27)
Notes
24. This constraint refers to duty cycle D1 and D2 only.
25. VTH_DOM: receiver threshold of the recessive to dominant LIN bus edge. VTH_REC receiver threshold of the dominant to recessive LIN bus edge.
26. VSUP is the voltage at the input of the device (different from Vbat when a reverse current protection diode is implemented.
27. Guaranteed by design.
Table 4. Operating range (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
NXP Semiconductors 21
33907/33908
4.3 Dynamic electrical characteristics
Table 5. Dynamic electrical characteristics
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
Digital interface timing
fSPI SPI Operation Frequency (50% DC) 0.5 – 8.0 MHz
tMISO_TRANS
MISO Transition Speed, 20 - 80%
•V
DDIO = 5.0 V, CLOAD = 50 pF
•V
DDIO = 5.0 V, CLOAD = 150 pF
5.0
5.0
–
–
30
50
ns
tCLH Minimum Time SCLK = HIGH 62 – – ns
tCLL Minimum Time SCLK = LOW 62 – – ns
tPCLD Propagation Delay (SCLK to data at 10% of MISO rising edge) – – 30 ns
tCSDV NCS = LOW to Data at MISO Active – – 75 ns
tSCLCH SCLK Low Before NCS Low (setup time SCLK to NCS change H/L) 75 – – ns
tHCLCL SCLK Change L/H after NCS = low 75 – – ns
tSCLD SDI Input Setup Time (SCLK change H/L after MOSI data valid) 40 – – ns
tHCLD SDI Input Hold Time (MOSI data hold after SCLK change H/L) 40 – – ns
tSCLCL SCLK Low Before NCS High 100 – – ns
tHCLCH SCLK High After NCS High 100 – – ns
tPCHD NCS L/H to MISO at High-impedance – – 75 ns
tONNCS NCS Min. High Time 500 – – ns
tNCS_MIN NCS Filter Time 10 – 40 ns
Figure 7. SPI timing diagram
Figure 8. Register access restriction
tSCLCH
NCS
SCLK
MISO
MOSI MSB
LSB
MSB
LSB
tHCLCL tCLH tCLL
tPCLD
tSCLD tHCLD
tSCLCL
tONNCS
tPCHD
z
tCSDV
Not used
tHCLCH
Tri-state
Any Fail-safe
register access
Any main
register access
Any Fail-safe
register access
22 NXP Semiconductors
33907/33908
CAN dynamic characteristics
tDOUT TXD Dominant State Timeout 0.8 – 5.0 ms
tDOM Bus Dominant Clamping Detection 0.8 – 5.0 ms
tLOOP
Propagation Loop Delay TXD to RXD
•R
LOAD = 120 Ω, C between CANH and CANL = 100 pF,
C at RxD < 15 pF
– – 255 ns
t1PWU Single Pulse Wake-up Time 0.5 – 5.0 µs
t3PWU Multiple Pulse Wake-up Time 0.5 – 1.0 µs
t3PTO1 Multiple Pulse Wake-up Timeout (120 µs bit selection) 110 120 – µs
t3PTO2 Multiple Pulse Wake-up Timeout (360 µs bit selection) 350 360 – µs
tCAN_READY
Delay to Enable CAN by SPI Command (NCS rising edge) to CAN to
Transmit (device in normal mode and CAN interface in TX/RX mode) – – 100 µs (28)
Fail-safe state machine
OSCFSSM Oscillator 405 – 495 kHz
CLKFS_MIN Fail-safe Oscillator Monitoring 150 – – kHz
tIC_ERR IO_0:5 Filter Time 4.0 – 20 µs
tACK_FS Acknowledgement Counter (used for IC error handling IO_1 and IO_5) 7.0 – 9.7 ms
t_DFS_RECOVERY IO_0 Filter Time to Recover from Deep Reset and Fail State 0.8 – 1.3 ms
tIO1_DRIFT_MON IO_1 filter time 1.0 – 2.0 ms
Fail-safe output
tRSTB_FB RSTB Feedback Filter Time 8.0 – 15 µs
tFSOB_FB FS0B Feedback Filter Time 8.0 – 15 µs
tRSTB_BLK RSTB Feedback Blanking Time 180 – 320 µs
tFSOB_BLK FS0B Feedback Blanking Time 180 – 320 µs
tRSTB_POR Reset Delay Time (after a Power On Reset or from LPOFF) 12 15.9 23.6 ms (29)
tRSTB_LG Reset Duration (long pulse) 8.0 – 10 ms
tRSTB_ST Reset duration (short pulse) 1.0 – 1.3 ms
tRSTB_IN External Reset Delay time 8.0 – 15 µs
tDIAG_SC Fail-safe Output Diagnostic Counter (FS0B) 550 – 800 µs
VSUP voltage supply
CSUP Minimum capacitor on Vsup 44 – – µF
Notes
28. For proper CAN operation, TXD must be set to high level before CAN enable by SPI, and must remain high for at least TCAN_READY.
29. This timing is not guaranteed in case of fault during startup phase (after Power On Reset of from LPOFF)
Table 5. Dynamic electrical characteristics (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
NXP Semiconductors 23
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VPRE voltage pre-regulator
fSW_PRE VPRE Switching Frequency 418 440 462 kHz
tSW_PRE VSW_PRE On and Off Switching Time – – 30 ns (30)
tPRE_SOFT VPRE Soft Start Duration (COUT ≤ 100 µF) 500 – 700 µs
tPRE_BLK_LIM VPRE Current Limitation Blanking Time 200 – 600 ns
tIPRE_OC VPRE Overcurrent Filtering Time 30 – 120 ns (30)
tPRE_UV VPRE Undervoltage Filtering Time 20 – 40 µs
tPRE_UV_4p3 Vpre Shut-off Filtering Time 3.0 – 6.0 µs
dIPRE/DT VPRE Load Regulation Variation – – 25 A/ms (30)
tPRE_WARN VPRE Thermal Warning Filtering Time 30 – 40 µs
tPRE_TSD VPRE Thermal Detection Filtering Time 1.3 – – µs
tVSUP_IPFF IPFF Input Voltage Filtering Time 1.0 – 5.0 µs
tIPRE_IPFF IPFF High-side Peak Current Filter Time 100 – 300 ns
tLS_RISE/FALL LS Gate Voltage Switching Time (IOUT = 300 mA) – – 50 ns
VSENSE voltage regulator
tVSNS_UV VSNS Undervoltage Filtering Time 1.0 – 3.0 µs
VCORE voltage regulator
tCORE_BLK_LIM VCORE Current Limitation Blanking Time 20 – 40 ns
fSW_CORE VCORE Switching Frequency 2.28 2.4 2.52 MHz
tSW_CORE VSW_CORE On and Off Switching Time 6.0 – 12 ns
VCORE_SOFT VCORE Soft Start (COUT = 100 µF max) – – 10 V/ms
tCORE_WARN VCORE Thermal Warning Filtering Time 30 – 40 µs
tCORE_TSD VCORE Thermal Detection Filtering Time 0.5 – – µs
VCCA voltage regulator
tCCA_LIM VCCA Output Current Limitation Filter Time 1.0 – 3.0 µs
tCCA_LIM_OFF1
tCCA_LIM_OFF2
VCCA Output Current Limitation Duration 10
50
–
–
–
–ms
tCCA_WARN VCCA Thermal Warning Filtering Time 30 – 40 µs
tCCA_TSD VCCA Thermal Detection Filter Time (int. MOSFET) 1.5 – – µs
dILOAD/dt VCCA Load Transient – 2.0 – A/ms (30)
VCCA_SOFT VCCA Soft Start (5.0 V and 3.3 V) – – 50 V/ms
Notes
30. Guaranteed by characterization.
Table 5. Dynamic electrical characteristics (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
24 NXP Semiconductors
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VAUX voltage regulator
tAUX_LIM VAUX Output Current Limitation Filter Time 1.0 – 3.0 µs
tAUX_LIM_OFF1
tAUX_LIM_OFF2
VAUX Output Current Limitation Duration 10
50
–
–
–
–ms
tAUX_TSD VAUX Thermal Detection Filter Time 1.5 – – µs
dIAUX/dt VAUX Load Transient – 2.0 – A/ms (31)
VAUX_SOFT VAUX Soft Start (5.0 V and 3.3 V) – – 50 V/ms
CAN_5V voltage regulator
tCAN_LIM Output Current Limitation Filter Time 2.0 – 4.0 µs
tCAN_TSD VCAN Thermal Detection Filter Time 1.0 – – µs
tCAN_UV VCAN Undervoltage Filtering Time 4.0 – 7.0 µs
tCAN_OV VCAN Overvoltage Filtering Time 100 – 200 µs
dICAN/dt VCAN Load Transient – 100 – A/ms (31)
Fail-safe machine voltage supervisor
tPRE_OV VPRE Overvoltage Filtering Time 128 – 234 µs
tCORE_UV VCORE FB Undervoltage Filtering Time 4.0 – 10 µs
tCORE_OV VCORE FB Overvoltage Filtering Time 128 – 234 µs
tCCA_UV VCCA Undervoltage Filtering Time 4.0 – 10 µs
tCCA_OV VCCA Overvoltage Filtering Time 128 – 234 µs
tAUX_UV VAUX Undervoltage Filtering Time 4.0 – 10 µs
tAUX_OV VAUX Overvoltage Filtering Time 128 – 234 µs
Digital input - multi-purpose ios
FIO_IN Digital Input Frequency Range 0.0 – 100 kHz
Analog multiplexer
tMUX_READY
SPI Selection to Data Ready to be Sampled on Mux_out
•V
DDIO = 5.0 V, CMUX_OUT = 1.0 nF ––10
µs
Interrupt
tINTB_LG INTB Pulse Duration (long) 90 100 – µs
tINTB_ST INTB Pulse Duration (short) 20 25 – µs
Functional sate machine
tWU_GEN General Wake-up Signal Deglitch Time (for any wu signal on IOs) 60 70 80 µs
Notes
31. Guaranteed by characterization.
Table 5. Dynamic electrical characteristics (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
NXP Semiconductors 25
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LIN dynamic characteristics (when 7.0 V < Vsup1, 2, 3 < 18 V, unless otherwise specified) (33907L/33908L)
tRX_PD Receiver Propagation Delay (TRX_PD = MAX (tREC_PDR, tREC_PDF)) – – 6.0 µs
tRX_SYM
Symmetry of Receiver Propagation Delay (TRX_SYM = tREC_PDF -
tREC_PDR)-2.0 – 2.0 µs
tBUS_WU BUS Wake-up Filter Time – – 250 µs
tXD_DOM TXD_L Permanent Dominant State Delay – 5.0 – ms
tLIN_SHORT_GND LIN Short-circuit to GND Deglitcher – 15 – ms
BDFAST Fast Baud Rate – – 100 KB/s
D1
Duty Cycle D1
THREC(max) = 0.744 x VSUP, THDOM(max) = 0.581 x VSUP
VSUP 7.0 V to 18 V, tBIT = 50 µs
D1 = tBUS-rec(min)/(2tBIT)
0.396 – – % (32)
D2
Duty Cycle D2
THREC(min) = 0.422 x VSUP, THDOM(min) = 0.284 x VSUP
VSUP 7.6 V to 18 V, tBIT = 50 µs
D2 = tBUS-rec(max)/(2tBIT)
– – 0.581 % (32)
D3
Duty Cycle D3
THREC(max) = 0.778 x VSUP, THDOM(max) = 0.616 x VSUP
VSUP 7.0 V to 18 V, tBIT = 96 µs
D3 = tBUS-rec(min)/(2tBIT)
0.417 – – % (32)
D4
Duty Cycle D4
THREC(min) = 0.389 x VSUP, THDOM(min) = 0.251 x VSUP
VSUP 7.6 V to 18 V, tBIT = 96 µs
D4 = tBUS-rec(max)/(2tBIT)
– – 0.59 % (32)
Notes
32. LIN Driver, Bus load conditions (CBUS,RBUS): 1.0 nF;1.0 kΩ / 6.8 nF;660 Ω / 10 nF;500 Ω
Table 5. Dynamic electrical characteristics (continued)
TCASE = -40 °C to 125 °C, unless otherwise specified. VSUP = VSUP_UV_L to 40 V, unless otherwise specified. All voltages referenced to
ground. When 28 V < VSUP < 40 V, thermal dissipation must be considered (Figure 25).
Symbol Parameter Min. Typ. Max. Unit Notes
26 NXP Semiconductors
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5 Functional pin description
5.1 Introduction
The 33907/33908 is the third generation of the System Basis Chip, combining:
• High efficiency switching voltage regulator for MCU, and linear voltage regulators for integrated CAN interface, external ICs such as
sensors, and accurate reference voltage for A to D converters.
• Built-in enhanced high-speed CAN interface (ISO11898-2 and -5), and LIN interface (LIN up to Rev. 2.2/ SAEJ2602-2), with local and
bus failure diagnostic, protection, and Fail-safe operation mode.
• Low-power mode, with ultra low-current consumption.
• Various wake-up capabilities.
• Enhanced safety features with multiple fail-safe outputs and scheme to support ASIL D applications.
5.2 Power supplies (VSUP1, VSUP2, VSUP3)
VSUP1 and VSUP2 are the inputs pins for internal supply dedicated to SMPS regulators. VSUP3 is the input pin for internal voltage
reference. VSUP1, 2, and 3 are robust against ISO7637 pulses.
VSUP1,2, and 3 shall be connected to the same supply (Figure 58).
5.3 Vsense input (VSENSE)
This pin must be connected to the battery line (before the reverse battery protection diode), via a serial resistor. It incorporates a threshold
detector to sense the battery voltage, and provide a battery early warning. It also includes a resistor divider to measure the VSENSE
voltage via the MUX-OUT pin. VSENSE pin is robust against ISO7637 pulses.
5.4 Pre-regulator (VPRE)
A highly flexible SMPS pre-regulator is implemented in the 33907/33908. It can be configured as a “non-inverting buck-boost converter”
(Figure 27) or “standard buck converter” (Figure 26), depending on the external configuration (connection of pin GATE_LS). The
configuration is detected automatically during start-up sequence.
The SMPS pre-regulator is working in current mode control and the compensation network is fully integrated in the device. The high-side
switching MOSFET is also integrated to make the current control easier. The pre-regulator delivers a typical output voltage of 6.5 V, which
is used internally. Current limitation, overcurrent, overvoltage, and undervoltage detectors are provided. VPRE is enabled by default.
5.5 VCORE Output (from 1.2 V to 3.3 V range)
The VCORE block is an SMPS regulator. The voltage regulator is a step down DC-DC converter operating in voltage control mode. The
output voltage is configurable from 1.2 V to 3.3 V range thanks to an external resistor divider connected between VCORE and the
feedback pin (FB_CORE) (as example in Figure 1, Figure 2, and Figure 58).
The stability of the converter is done externally, by using the COMP_CORE pin. Current limitation, overvoltage, and undervoltage
detectors are provided. VCORE can be turned ON or OFF via a SPI command, however it is not recommended to turn OFF VCORE by
SPI when VCORE is configured safety critical (both overvoltage and undervoltage have an impact on RSTB and FS0B). VCORE
overvoltage information disables VCORE. Diagnostics are reported in the dedicated register and generate an Interrupt. VCORE is enabled
by default.
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5.6 VCCA output, 5.0 V or 3.3 V selectable
The VCCA voltage regulator is used to provide an accurate voltage output (5.0 V, 3.3 V) selectable through an external resistor connected
to the SELECT pin.
The VCCA output voltage regulator can be configured using an internal transistor delivering very good accuracy (±1.0% for 5.0 V
configuration and ±1.5% for 3.3 V configuration), with a limited current capability (100 mA) for an analog to digital converter, or with an
external PNP transistor, giving higher current capability (up to 300 mA) with lower output voltage accuracy (±3.0% for 300 mA) when using
a local ECU supply.
Current limitation, overvoltage, and undervoltage detectors are provided. VCCA can be turned ON or OFF via a SPI command, however
it is not recommended to turn OFF VCCA by SPI when VCCA is configured safety critical (both overvoltage and undervoltage have an
impact on RSTB and FS0B). VCCA overcurrent (with the use of external PNP only) and overvoltage information disables VCCA.
Diagnostics are reported in the dedicated register and generate an Interrupt. VCCA is enabled by default.
5.7 VAUX output, 5.0 V or 3.3 V selectable
The VAUX pin provides an auxiliary output voltage (5.0 V, 3.3 V) selectable through an external resistor connected to SELECT pin. It uses
an external PNP ballast transistor for flexibility and power dissipation constraints. The VAUX output voltage regulator can be used as
“auxiliary supply” (local ECU supply) or “sensor supply” (external ECU supply) with the possibility to be configured as a tracking regulator
following VCCA.
Current limitation, overvoltage, and undervoltage detectors are provided. VAUX can be turned ON or OFF via a SPI command, however
it is not recommended to turn OFF VAUX by SPI when VAUX is configured safety critical (both overvoltage and undervoltage have an
impact on RSTB and FS0B). VAUX overcurrent and overvoltage information disables VAUX, reported in the dedicated register, and
generates an Interrupt. VAUX is enabled by default.
5.8 SELECT Input (VCCA, VAUX voltage configuration)
VCCA and VAUX output voltage configurations are set by connecting an external resistor between SELECT pin and Ground. According
to the value of this resistor, the voltage of VCCA and VAUX are configured after each Power On Reset, and after a wake-up event when
device is in LPOFF. Information latches until the next hardware configuration read. Regulator voltage values can be read on the dedicated
register via the SPI.
When VAUX is not used, the output VCCA voltage configuration is set using an external resistor connected between the SELECT and the
VPRE pin.
Table 6. VCCA/VAUX Voltage Selection (Figure 59)
VCCA(V) VAUX(V) R Select Recommended value
3.3 3.3 <7.0 KΩ5.1 KΩ ±5.0%
5.0 5.0 10.8 << 13.2 KΩ12 KΩ ±5.0%
3.3 5.0 21.6 << 26.2 KΩ24 KΩ ±5.0%
5.0 3.3 45.9 << 56.1 KΩ51 KΩ ±5.0%
Table 7. VCCA Voltage Selection (VAUX not used, Figure 60, Figure 61)
VCCA(V) R Select Recommended Value
3.3
<7.0 KΩ5.1 KΩ ±5.0%
21.6 << 26.2 KΩ24 KΩ ±5.0%
5.0
10.8 << 13.2 KΩ12 KΩ ±5.0%
45.9 << 56.1 KΩ51 KΩ ±5.0%
28 NXP Semiconductors
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5.9 CAN_5V voltage regulator
The CAN_5V voltage regulator is a linear regulator dedicated to the internal HSCAN interface. An external capacitor is required. Current
limitation, overvoltage, and undervoltage detectors are provided. If the internal CAN transceiver is not used, the CAN_5V regulator can
supply an external load (CAN_5V voltage regulator). CAN_5V is enabled by default.
5.10 INTERRUPT (INTB)
The INTB output pin generates a low pulse when an Interrupt condition occurs. The INTB behavior as well as the pulse duration are set
through the SPI during INIT phase. INTB has an internal pull-up resistor connected to VDDIO.
5.11 CANH, CANL, TXD, RXD
These are the pins of the high speed CAN physical interface. The CAN transceivers provides the physical interface between the CAN
protocol controller of an MCU and the physical dual wires CAN bus. The CAN interface is connected to the MCU via the RXD and TXD
pins.
5.11.1 TXD
TXD is the device input pin to control the CAN bus level. TXD is a digital input with an internal pull-up resistor connected to VDDIO. In the
application, this pin is connected to the microcontroller transmit pin.
In Normal mode, when TXD is high or floating, the CANH and CANL drivers are OFF, setting the bus in a recessive state. When TXD is
low, the CANH and CANL drivers are activated and the bus is set to a dominant state. TXD has a built-in timing protection that disables
the bus when TXD is dominant for more than TDOUT. In LPOFF mode, VDDIO is OFF, pulling down this pin to GND.
5.11.2 RXD
RXD is the bus output level report pin. In the application, this pin is connected to the microcontroller receive pin. In Normal mode, RXD is
a push-pull structure. When the bus is in a recessive state, RXD is high. When the bus is dominant, RXD is low. In LPOFF mode, this pin
is in high-impedance state.
5.11.3 CANH and CANL
These are the CAN bus pins. CANL is a low side driver to GND, and CANH is a high side driver to CAN_5V. In Normal mode and TXD
high, the CANH and CANL drivers are OFF, and the voltage at CANH and CANL is approximately 2.5 V, provided by the internal bus
biasing circuitry. When TXD is low, CANL is pulled to GND and CANH to CAN_5V, creating a differential voltage on the CAN bus.
In LPOFF mode, the CANH and CANL drivers are OFF, and these pins are pulled down to GND via the device RIN_CHCL resistors. CANH
and CANL have integrated ESD protection and extremely high robustness versus external disturbance, such as EMC and electrical
transients. These pins have current limitation and thermal protection.
5.12 LIN, TXDL, RXDL
These pins apply to 33907L and 33908L versions.
These are the pins of the LIN physical interface. The LIN transceivers provides the physical interface between the MCU and the physical
single wire LIN bus. The LIN interface is connected to the MCU via the RXDL and TXDL pins.
NXP Semiconductors 29
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5.12.1 TXDL
The TXDL input pin is the MCU interface to control the state of the LIN output. TXDL is a digital input with an internal pull-up resistor
connected to VDDIO. In the application, this pin is connected to the microcontroller transmit pin.
In Normal mode, when TXDL is high or floating, the LIN output transistor is OFF, setting the bus in recessive state. When TXDL is low,
the LIN output transistor is ON and the bus is set to a dominant state. TXDL has a built-in timing protection that disables the bus when
TXDL is dominant for more than TXD_DOM. In LPOFF mode, VDDIO is OFF, pulling down this pin to GND.
5.12.2 RXDL
RXDL is the bus output level report pin. In the application, this pin is connected to the microcontroller receive pin. In Normal mode, RXD
is a push-pull structure. When the bus is in a recessive state, RXD is high. When the bus is dominant, RXD is low. In LPOFF mode, this
pin is in high-impedance state.
5.12.3 LIN
This is the LIN bus pin. The LIN driver is a low-side MOSFET with internal overcurrent thermal shutdown. An internal pull-up resistor with
a serial diode structure is integrated so no external pull-up components are required for the application in a slave node. An additional pull-
up resistor of 1.0 kΩ must be added when the device is used in the master node. In Normal mode and TXDL high, the LIN transistor is
OFF, and the voltage at LIN is approximately VSUP3, provided by the pull up resistor with a serial diode structure. When TXD is low, LIN
is pulled to GND
The device has two selectable baud rates: 20 kBits/s for Normal Baud rate and 10 kBits/s for slow baud rate. An additional fast baud rate
(100 kBits/s) is implemented. It can be used to flash the MCU or in the garage for diagnostic. The LIN Consortium specification does not
specify electrical parameters for this baud rate. The communication only must be guaranteed. In LPOFF mode, the LIN transistor is OFF,
and this pin is pulled up to VSUP3. LIN has integrated ESD protection and extremely high robustness versus external disturbance, such
as EMC and electrical transients.
5.13 Multiplexer output MUX_OUT
The MUX_OUT pin (Figure 9) delivers analog voltage to the MCU ADC input. The voltage to be delivered to MUX_OUT is selected via
the SPI, from one of the following parameters:
• VSENSE
• VIO_0
• VIO_1
• Internal 2.5 V reference
• Die temperature sensor T(°C) = (VAMUX - VAMUX_TP) / VAMUX_TP_CO + 165
Voltage range at MUX_OUT is from GND to VDDIO (3.3 V or 5.0 V)
30 NXP Semiconductors
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Figure 9. Simplified analog multiplexer block diagram
5.14 I/O pins (I/O_0:I/O_5)
The 33907/33908 includes six multi-purpose I/Os (I/O_0 to I/O_5). I/O_0, I/O_1, I/O_4, and I/O_5 are load dump proof and robust against
ISO7637 pulses. An external serial resistor must be connected to those pins to limit the current during ISO pulses. I/O_2 and I/O_3 are
not load dump proof.
• IO_0:1 are selectable as follows:
Analog input (load dump proof) sent to the MCU through the MUX_OUT pin. Wake-up input on the rising or falling edge or based on
the previous state. Digital input (logic level) sent to the MCU through the SPI. Safety purpose: Digital input (logic level) to perform
an IC error monitoring (both IO_0 AND IO_1 are used if configured as safety inputs, see Figure 11).
• IO_1 is also selectable as follow:
Safety purpose: FB_Core using a second resistor bridge (R3/R4 duplicated) connected to IO_1, to detect external resistor drift and
trigger when FB_Core - IO_1 > ±150 mV max.
• IO_2:3 are selectable as follows:
Digital input (logic level) sent to the MCU through the SPI. Wake-up input (logic level) on the rising or falling edge or based on the
previous state. Safety purpose: Digital input (logic level) to monitor MCU error signals (both IO_2 AND IO_3 are used if configured
as safety inputs). Only bi-stable protocol is available.
Table 8. I/Os configuration
I/0 number Analog input Digital input Wake-up capability Output gate driver
IO_0 XX X
IO_1 XX X
IO_2 XX
IO_3 XX
IO_4 XX X
IO_5 XX X
VSENSE
R
1
R
2
R
3
R
4
R
5
5.0 V
Ratio#1
5.0 V
Ratio#2
3.3 V
Ratio#1
3.3 V
Ratio#2
SPI selection
IO_0
IO_1
Same as above
Same as above
SPI selection
Internal 2.5 V reference
Mux_out
SPI selection
Die temperature sensor
NXP Semiconductors 31
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When IO_2:3 are used as safety inputs to monitor FCCU error outputs from the NXP MCU, the monitoring is active only when the
Fail-safe sate machine is in “normal WD running” state (Figure 14) and all the phases except the “Normal Phase” are considered as
an Error.
Figure 10. IO_2:3 MCU error monitoring: bi-stable protocol
• IO_4:5 are selectable as follows:
Digital input (logic level) sent to the MCU through the SPI. Wake-up input (load dump proof) on rising or falling edge or based on
previous state. Output gate driver (from VPRE) for low-side logic level MOSFET. Safety purpose: Digital input (logic level) to perform
an IC error monitoring (both IO_4 AND IO_5 are used if configured as safety inputs, see Figure 11).
Figure 11. External error signal handling
5.15 SAFE output pins (FS0B, RSTB)
FS0B is asserted low when a fault event occurs (See Faults triggering FS0B activation on page 45). The objective of this pin is to drive
an electrical safe circuitry independent from MCU to deactivate the whole system and set the ECU in a protected and known state.
After each power on reset or after each wake-up event (LPOFF) the FS0B pin is asserted low. Then the MCU can decide to release the
FS0B pin, when the application is ready to start. An external pull-up circuitry is mandatory connected to VDDIO or VSUP3.
• If the pull-up is connected to VDDIO, the value recommended is 5.0kΩ, there will be no current in LPOFF since VDDIO is OFF in
LPOFF mode.
• If the pull-up is connected to VSUP3, the value must be above 10 kΩ, there will be a current in the pull-up resistor to consider at
application level in LPOFF mode.
FCCU_eout[0]
FCCU_eout[1]
Reset Phase Normal Phase Error Phase Config Phase
33907_8 Internal IO_4 signal
latched
Error signal (IO_4 input)
Acknowledgment counter
Acknowledgement signal
from MCU (IO_5 input)
Filter time
Reset
counter
Restart Acknowledgment
counter
FS0B
RSTB
The error is acknowledged by the MCU
then, internal IO_4 signal is released The error is NOT
acknowledged by the MCU
So, FS0B is activated at the
end of the counter
32 NXP Semiconductors
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The RSTB pin must be connected to MCU and is active low. An external pull-up resistor must be connected to VDDIO. In default
configuration, the RST delay time has three possible values depending on the mode and product configuration:
• The longest one is used automatically following a Power On Reset or when resulting from LPOFF mode (Low Power Off).
• The two reset durations are then available in the INIT_FSSM1 register, which are 1.0 ms and 10 ms. The configured duration is
finally used in the normal operation when a fault occurs leading to a reset activation. The INIT_FSSM1 register is available (writing)
in the INIT FS phase.
5.16 DEBUG input (entering in debug mode)
The DEBUG pin allows the product to enter Debug mode. To activate the Debug mode, voltage applied to the DEBUG pin must be within
the VDEBUG_IL and VDEBUG_IH range at start-up. If the voltage applied to DEBUG pin is out of these limits, before VCORE ramp-up, the
device settles into Normal mode. When the Debug mode is activated, the FS0B output is asserted low at start-up. As soon as the FS0B
is released to “high” via SPI (Good WD answer and FS_OUT writing) this pin is never activated whatever the fault is reported.
In Debug mode, any errors from watchdog are ignored (No reset and No fail-safe), even if the whole functionality of the watchdog is kept
ON (Seed, LFSR, Wd_refresh counter, WD error counter). This allows an easy debug of the hardware and software routines (i.e. SPI
commands). When the Debug mode is activated, the CAN transceiver is set to Normal operation mode. This allows communication with
the MCU, in case SPI communication is not available (case of MCU not programmed). To exit Debug mode, the pin must be tied to Ground
through an external pull-down resistor or to VPRE through an external pull-up resistor and a Power On Reset occurs.
NXP Semiconductors 33
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6 Functional device operation
6.1 Mode and state description of main state machine
The device has several operation modes. The transition and conditions to enter or leave each mode are illustrated in the functional state
diagram (Figure 13). Two state machines are working in parallel. The Main state machine is in charge of the power management (VPRE,
VCORE, VCCA, VAUX,...) and the fail-safe state machine is in charge of all the safety aspect (WD, RSTB, FS0B,...).
6.1.1 Buck or buck boost configuration
An external low side logic level MOSFET (N-type) is required to operate in non-inverting buck-boost converter. The connection of the
external MOSFET is detected automatically during the start-up phase (after a Power On Reset or From LPOFF).
• If the external low-side MOSFET is NOT connected (GATE_LS pin connected to PGND), the product is configured as a standard
buck converter.
• If the external low-side MOSFET is connected (GATE_LS pin connected to external MOSFET gate), the product is configured as a
non-inverting buck-boost converter.
The automatic detection is done by pushing 300 μA current on Gate_LS pin and monitoring the corresponding voltage generated. If a
voltage >120 mV is detected before the 120 μs timeout, the non-inverting buck-boost configuration is locked. Otherwise, the standard
buck configuration is locked. The boost driver has a current capability of ±300 mA.
6.1.2 VPRE on
Pre-regulator is an SMPS regulator. In this phase, the pre-regulator is switched ON and a softstart with a specified duration tPRE_SOFT is
started to control the VPRE output capacitor charge.
6.1.3 Select pin configuration
This phase is detecting the required voltage level on VAUX and VCCA, according to resistor value connected between the SELECT pin
and ground. If the SELECT pin is connected to VPRE via the resistor, it disables the VAUX regulator at start-up.
6.1.4 VCORE/VAUX/VCCA on
In this stage, the three regulators VCORE, VAUX, VCCA are switched ON at the same time with a specified soft start duration. The
CAN_5V is also started at that time.
6.1.5 INIT main
This mode is automatically entered after the device is “Powered ON”. When RSTB is released, initialization phase starts where the device
can be configured via the SPI. During INIT phase, some registers can only be configured in this mode (refer to Table 15 and Table 16).
Other registers can be written in this mode, and also in Normal mode.
Once the INIT registers configurations are complete, a last register called “INIT INT” must be configured to switch to Normal mode. Writing
data in this register (even same default values), automatically locks the INIT registers, and the product switches automatically to Normal
mode in the Main state machine.
6.1.6 Normal
In this mode, all device functions are available. This mode is entered by a SPI command from the INIT phase by writing in the INIT INT
register. While in Normal mode, the device can be set to Low Power mode (LPOFF) using secured SPI command.
34 NXP Semiconductors
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6.1.7 Low power mode off
The Main State Machine has 3 LPOFF modes with different conditions to enter and exit each LPOFF mode as described here after. After
wake up from LPOFF, all the regulators are enabled by default. In LPOFF, all the regulators are switched OFF. The register configuration,
the Vpre behavior and the ISO pulse requirement are valid for the 3 LPOFF modes.
6.1.7.1 LPOFF - sleep
Entering in Low Power mode LPOFF - SLEEP is only available if the product is in Normal mode by sending a secured SPI command. In
this mode, all the regulators are turned OFF and the MCU connected to the VCORE regulator is unsupplied.
Before entering in LPOFF Power mode OFF-sleep, the Reset Error Counter must go back to value “0” (“N” consecutive good watchdog
refresh decreases the reset error counter to 0). “N” = RSTb_err_2:0 x (WD_refresh_2:0 + 1). Once the 33907/33908 is in LPOFF - SLEEP,
the device monitors external events to wake-up and leave the Low Power mode. The wake-up events can occur and depending of the
device configuration from:
•CAN
•LIN
• I/O inputs
When a wake-up event is detected, the device starts the main state machine again by detecting the VPRE configuration (BUCK or BUCK-
BOOST), the wake-up source is reported to the dedicated SPI register, and the Fail-safe state machine is also restarted.
6.1.7.2 LPOFF - VPRE_UV
LPOFF- VPRE_UV is entered when the device is in the INIT or Normal mode, and if the VPRE voltage level is passing the VPRE_UV_L_4P3
threshold (typ 4.3 V). After 1.0 ms the device attempts to recover by switching ON the VPRE again.
6.1.7.3 LPOFF - deep FS
LPOFF - DEEP FS is entered when the device is in Deep Fail-safe and if the Key is OFF (IO_0 is low). To exit this mode, a transition to
high level on IO_0 is required. IO_0 is usually connected to key ON key OFF signal.
6.1.7.4 Register configuration in LPOFF
In LPOFF, the register settings of the Main State Machine are kept because the internal 2.5 V main digital regulator is available for wake-
up operation. However, the register settings of the Fail-safe state machine are erased because the 2.5 V fail safe digital regulator is not
available in LPOFF. As a consequence, after a wake-up event, the configuration of the Fail-safe registers must be done again during
initialization phase (256 ms open window).
6.1.7.5 VPRE behavior in LPOFF
When device is in LPOFF Sleep mode, and if the VSUP < VSUP_UV_7, VPRE is switched on to maintain internal biasing and wake-up
capabilities on IOs, CAN or LIN.
•If V
PRE is configured as a non-inverting buck-boost converter, VPRE is switched ON in SMPS mode with boost functionality.
•If V
PRE is configured as a standard buck converter, VPRE is switched ON in Linear mode following VSUP.
6.1.7.6 ISO pulse in LPOFF
If the application has to sustain ISO pulses on VBAT in LPOFF mode, the connection of a an external zener diode and a serial resistor to
the ground is mandatory (see Figure 12). During repetitive ISO pulses on Vbat, the capacitors connected on VSUP line are more and more
charged and cannot be discharged thanks to the extremely low-current needed to maintain wake-up capabilities on IOs, CAN, and LIN.
As a consequence, if a leakage path is not created artificially with those discrete components the voltage on VSUP line can exceed the
absolute maximum rating supported by this pin.
NXP Semiconductors 35
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Figure 12. Components involved under ISO pulse in LPOFF
6.2 Mode and state description of fail-safe state machine
6.2.1 LBIST
Included in the fail-safe machine, the Logic Built-in Self Test (LBIST) verifies the correct functionality of the FSSM at start-up. The fail-safe
state machine is fully checked and if an issue is reported, the RSTB stays low and after 8 s, the device enters in DEEP Fail-safe. LBIST
is run at start-up and after each wake-up event when the device is in LPOFF mode.
6.2.2 Select pin configuration
This phase detects the required voltage level to apply on VAUX and VCCA, according to the resistor value connected between the
SELECT pin and ground, (VAUX used) or between the SELECT pin and VPRE (VAUX not used). This mode is the equivalent mode seen
in the main state machine. Difference is in the fail-safe machine, this detection is used to internally set the UV/OV threshold on VCCA and
VAUX for the voltage supervision.
6.2.3 ABIST
Included in the fail-safe machine, the Analog Built-in Self Test (ABIST) verifies the correct functionality of the analog part of the device,
like the overvoltage and undervoltage detections of the voltage supervisor and the RTSTB and FS0B fail-safe outputs feedback (Table 9).
The ABIST is run at start-up and after each wake-up event when device is in LPOFF mode.
6.2.4 Release RSTB
In this state, the device releases the RSTB pin.
Table 9. Regulators and fail-safe pins checked during ABIST
Parameters Overvoltage Undervoltage OK/NOK
VPRE X
VCORE X X
VCCA X X
VAUX X X
IO_1 FB_Core Delta X
RSTB X
FS0B X
VSUP1
VSENSE
VSUP2
VSUP3
VBAT
33907_08
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36 NXP Semiconductors
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6.2.5 INIT FS
This mode is automatically entered after the device is “powered on” and only if Built-in Self Tests (Logic and Analog) have been passed
successfully. This INIT FS mode starts as soon as RSTB is released (means no “Activate RST” faults are present and no external reset
is requested). Faults leading to an “Activate RST” are described in Reset error counter.
In this mode, the device can be configured via the SPI within a maximum time of 256 ms, including first watchdog refresh. Some registers
can only be configured in this mode and is locked when leaving INIT FS mode (refer to Table 15 and Table 16). It is recommended, to
configure first the device before sending the first WD refresh. As soon as the first good watchdog refresh is sent by the MCU, the device
leaves this mode and goes into Normal WD mode.
6.2.6 Normal WD is running
In this mode, the device waits for a periodic watchdog refresh coming from the MCU, within a specific configured window timing.
Configuration of the watchdog window period can be set during INIT FS phase or in this mode. This mode is exited if there are consecutive
bad watchdog refreshes if there is an external reset request, or if a fault occurs leading to a RSTB activation.
6.2.7 RST delay
When the reset pin is asserted low by the device, a delay runs, to release the RSTB, if there are no faults present. The reset low duration
time is configurable via the SPI in the INIT_ FSSM1 register, which is accessible for writing only in the INIT FS phase.
6.3 Deep fail safe state
The Fail-safe state machine monitors the RSTB pin of the device and count the number of reset(s) happening in case of fault detection
(see Reset error counter). As soon as either the Reset Error Counter reach its final value or the RESET pin remains asserted low for more
than 8.0 s, the device moves to Deep Fail-safe state, identified by the “Wait Deep Fail-safe” state in the functional state diagram
(Figure 13).
When the device is in Deep Fail-safe state, all the regulators are OFF. To exit this state, a Key OFF / Key ON action is needed. IO_0 is
usually connected to key signal. Key OFF (IO_0 low) will move the device to LPOFF-Deep FS, and Key ON (IO_0 high) will wake-up the
device.
The final value of the Reset Error Counter can be configured to 2 or 6 in the register INIT FSSM 2. During power up phase, the 8.0 s timer
starts when the Fail-safe state machine enters in the “Select pin config detection” state and stop when the RSTB pin is released. During
“INIT FS” state, the 8.0 s timer can be disabled in the register INIT SUPERVISOR 2. During “Normal WD running” state, the 8.0 s timer is
activated at each RSTB pin assertion.
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6.4 Functional state diagram
Figure 13. Simplified state diagram
CAN/IOs event
LPOFF -
VPRE_UV
LPOFF -
DEEP FS
From
Anywhere
VSUP < VSUP_UV_L
Buck or
Buck Boost
configuration
detection
PowerDown
VSUP > VSUP_UV_5
120µs elapsed
VPRE
ON
VPRE>VPRE_UV
SELECT pin
config.
detection
VPRE<VPRE_UV
1ms elapsed
Vcore/Vaux/
Vcca ON
INIT MAIN
INIT done
(init int reg. writing)
NORMAL
MODE
LPOFF -
SLEEP
Wake up
SPI command
From
Anywhere
PowerDown
LBIST
LBIST Done &
VPRE>VPRE_UV
SELECT pin
config.
detection
1ms elapsed &
VCORE > VCORE_UV &
VCCA > VCCA_UV &
VAUX > VAUX_UV
ABIST
VPRE<VPRE_UV
Release
RSTb
INIT FS
NORMAL
WD is
RUNNING
RST Delay
ABIST Pass
No external RST &
No activate RST
WD OK
External
RST
Activate RST or
WD Not OK
Activate RST
Activate
RST
External
RST
External
RST
No activate RST &
RST delay expired
Rise IO_0
- RSTb is asserted low
- RSTb is asserted low
- RSTb is asserted low
- RSTb is released
- Unlock SPI init registers
- Start 256ms open window
- RSTb is released
- Start WD close/open window
- Unlock SPI init registers
- SPI config
- SPI init registers locked
MAIN STATE MACHINE FAIL SAFE STATE MACHINE
Activate RST : any UV, any OV, WD,
IO_23 error, deep fail safe, reset by spi,
IO_1 FB_core delta, FS0b short to VDD,
SPI DED
- VCAN/VCORE OFF
- VAUX/VCCA OFF
- OSC Main ON
- FailSafe ON
- VCAN/VCORE/VAUX/VCCA OFF
- Fail Safe OFF
- RSTb delay running
- RSTb is asserted low
POR Fail Safe
No POR Fail Safe
VPRE_UV_L4P3
VPRE_UV_L4P3
Wait
Fail
SAFE
POR Fail Safe &
Fail Safe Reg. ON
& VSUP > VSUP_UV_5
VSUP <V
SUP_UV_5
VSUP < VSUP_UV_5
POR Fail Safe &
Fail Safe Reg. ON
1ms
Wait
Deep Fail
Safe
RST delay=8s or
RST error counter = 6
No IO_0
Vpre OFF
Vpre ON
38 NXP Semiconductors
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6.5 Fail-safe machine
To fulfill safety critical applications, the 33907/33908 integrates a dedicated fail-safe machine (FSM). The FSM is composed of three main
sub-blocks: the Voltage Supervisor (VS), the Fail-safe state machine (FSSM), and the Fail-safe output driver (FSO).The FSM is electrically
independent from the rest of the circuitry, to avoid common cause failure.
For this reason, the FSM has its own voltage regulators (analog and digital), dedicated bandgap, and its own oscillator. Three power
supply pins (VSUP 1, 2, & 3) are used to overtake a pin lift issue. The internal voltage regulators are directly connected on VSUP (one
bonding wire per pin is used). Additionally, the ground connection is redundant as well to avoid any loss of ground.
All the voltages generated in the device are monitored by the voltage supervisor (under & overvoltage) owing to a dedicated internal
voltage reference (different from the one used for the voltage regulators). The result is reported to the MCU through the SPI and delivered
to the Fail-safe state machine (FSSM) for action, in case of a fault. All the safety relevant signals feed the FSSM, which handles the error
handling and controls the fail-safe outputs.
There are two fail-safe outputs: RSTB (asserted low to reset the MCU), and FS0B (asserted low to control any fail-safe circuitry). The Fail-
safe machine is in charge of bringing and maintaining the application in a Fail-safe state. Four sub Fail-safe states are implemented to
handle the different kinds of failures, and to give a chance for the system to come back to a normal state.
6.5.1 Fail-safe machine state diagram
Figure 14. Detailed fail-safe state diagram
From
Anywhere
PowerDown
LBIST
LBIST Done &
VPRE>VPRE_UV
SELECT pin
config.
detection
1ms elapsed &
VCORE > VCORE_UV &
VCCA > VCCA_UV &
VAUX > VAUX_UV
ABIST
VPRE<VPRE_UV
Release
RSTb
INIT FS
NORMAL
WD is
RUNNING
Assert RSTb
ABIST Pass
No external RST &
No activate RST
WD OK
External
RST
Activate RST or
WD Not OK
Activate RST
Activate
RST
External
RST
External
RST
No activate RST &
RST delay expired
- RSTb is asserted low
- RSTb is asserted low
- RSTb is asserted low
- RSTb is released
- Unlock SPI init registers
- Start 256ms open window
- RSTb is released
- Start WD close/open window
- RSTb delay running
- RSTb is asserted low
POR Fail-safe
No POR Fail-safe
Release
FSOb
RST_err_count = 0
& FS_OUT ok
FS0B Low
2 > RST_error_count < 6 FS0b low & No
activate RST &
RST delay expired
- FS0b is asserted low -FS0b is
released
Deep Fail
Safe
RST delay=8s OR
Rst_error_count=6
IO_0
- VCAN/VCORE OFF
- VAUX/VCCA OFF
- Fail Safe OFF
- FS0b = Low
- RSTb = Low
No FS0b
RST delay=8s Ext. IC error (IO0:1
and/or IO4:5)
Ext. IC error (IO0:1
and/or IO4:5)
RSTb delay = 8s
External RSTb =
8s
NXP Semiconductors 39
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6.5.2 Watchdog operation
A windowed watchdog is implemented in the 33907/33908 and is based on “question/answer” principle (Challenger). The watchdog must
be continuously triggered by the MCU in the open watchdog window, otherwise an error is generated. The error handling and watchdog
operations are managed by the Fail-safe state machine. For debugging purpose, this functionality can be inhibited by setting the right
voltage on the DEBUG pin at start-up.
The watchdog window duration is selectable through the SPI during the INIT FS phase or in Normal mode. The following values are
available: 1.0 ms, 2.0 ms, 3.0 ms, 4.0 ms, 6.0 ms, 8.0 ms, 12 ms, 16.0 ms, 24 ms, 32 ms, 64 ms, 128 ms, 256 ms, 512 ms, and 1024 ms.
The watchdog can also be inhibited through the SPI register to allow “reprogramming” (ie.at vehicle level through CAN).
An 8-bit pseudo-random word is generated, due to a Linear Feedback Shift Register implemented in the 33907/33908. The MCU can send
the seed of the LFSR or use the LFSR generated by the 33907/33908 during the INIT phase and performs a pre-defined calculation. The
result is sent through the SPI during the “open” watchdog window and verified by the 33907/33908. When the result is right, a new LFSR
is generated and the watchdog window is restarted. When the result is wrong, the WD error counter is incremented, the watchdog window
is restarted, an INTB is generated, and the LFSR value is not changed. Any access to the WD register during the “closed” watchdog
window is considered a wrong WD refresh.
6.5.2.1 Normal operation (first watchdog refresh)
At power up, when the RSTB is released as high (after around 16 ms), the INIT phase starts for a maximum duration of 256 ms and this
is considered as a fully open watchdog window. During this initialization phase the MCU sends the seed for the LFSR, or uses the default
LFSR value generated by the 33907/33908 (0xB2), available in the WD_LFSR register (Table 75). Using this LFSR, the MCU performs
a simple calculation based on this formula. As an example, the result of this calculation based on LFSR default value (0xB2) is 0x4D.
Figure 15. Watchdog answer calculation
The MCU sends the results in the WD answer register (Table 77). When the watchdog is properly refreshed during the open window, the
256 ms open window is stopped and the initialization phase is finished. A new LFSR is generated and available in the WD LFSR register,
Table 74. If the watchdog refresh is wrong or if the watchdog is not refreshed during this 256 ms open window (INIT FS phase), the device
asserts the reset low and the RSTB error counter is incremented by “1”.
After a good watchdog refresh, the device enters the Normal WD refresh mode, where open and closed windows are defined either by
the configuration made during initialization phase in the watchdog window register (Table 73), or by the default value already present in
this register (3.0 ms).
6.5.2.2 Normal watchdog refresh
The watchdog must be refreshed during every open window of the window period configured in the register Table 73. Any WD refresh
restarts the window. This ensures the synchronization between MCU and 33907/33908.
The duration of the “window” is selectable through the SPI with no access restriction, means the window duration can be changed in the
INIT phase or Normal mode. Doing the change in normal operation allow the system integrator to configure the watchdog window duration
on the fly:
• The new WD window duration (except after disable) will be taken into account when a write in the WD_answer register occurs (good
or bad WD answer) or when the previous WD window is finished without any writing (WD timeout)
• The new WD window duration after disable will be taken into account when SPI command is validated
The duty cycle of the window is set to 50% and is not modifiable.
Figure 16. Windowed watchdog
LFSR_OUT[7:0] x
4
+
6
-
4
NOT /
4
WD_answer[7:0]
Window Period
CLOSED CLOSEDOPEN OPEN
Refresh
Slot
Refresh
Slot
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6.5.2.3 Watchdog in debug mode
When the device is in debug mode (entered via the DEBUG pin), the watchdog continues to operate, but does not affect the device
operation by asserting a reset or fail-safe pins. For the user, operation appears without the watchdog. If needed and to debug the
watchdog itself, the user can operate as in Normal mode and check LFSR values, the watchdog refresh counter, the watchdog error
counter, and reset counter. This allows the user to debug their software and ensure a good watchdog strategy in the application.
6.5.2.4 Wrong watchdog refresh handling
Error counters and strategy are implemented in the device to manage wrong watchdog refreshes from the MCU. According to consecutive
numbers of wrong watchdog refreshes, the device can decide to assert the RSTB only, or to go in deep Fail-safe mode where only a Power
On Reset or a transition on IO_O helps the system to recover.
6.5.2.5 Watchdog error counter
The watchdog error counter is implemented in the device to filter the incorrect watchdog refresh. Each time a watchdog failure occurs, the
device increments this counter by 2. The WD error counter is decremented by 1 each time the watchdog is properly refreshed. This
principle ensures that a cyclic “OK/NOK” behavior converges to a failure detection. To allow flexibility in the application, the maximum
value of this counter is configurable in the INIT_WD register, but only when device is in INIT FS mode.
Figure 17. Watchdog error counter configuration (INIT_WD register, Bits WD_CNT_error_1:0)
WD refresh OK
WD refresh OK
WD refresh OK
0
2
1
3
4
WD refresh NOK
WD refresh NOK
WD refresh NOK
Watchdog Error Counter
WD_CNT_error = 4
WD refresh OK
WD refresh OK
WD refresh OK
WD refresh OK
WD refresh OK
0
2
1
3
4
5
6
WD refresh NOK
WD refresh NOK
WD refresh NOK
WD refresh NOK
WD refresh NOK
WD refresh NOK
Watchdog Error Counter
WD_CNT_error = 6
WD refresh NOK
0
2
1
WD refresh NOK
Watchdog Error Counter
WD_CNT_error = 2
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6.5.2.6 Watchdog refresh counter
The watchdog refresh counter is used to decrement the RST error counter. Each time the watchdog is properly refreshed, the watchdog
refresh counter is incremented by “1”. Each time the watchdog refresh counter reaches “6” and if next WD refresh is also good, the RST
error counter is decremented by “1” (case with WD_CNT_refresh_1:0 configured at 6).
Whatever the position is in the watchdog refresh counter, each time there is a wrong refresh watchdog, the watchdog refresh counter is
reset to “0”. To allow flexibility in the application, the maximum value of this watchdog refresh counter is configurable in the INIT_WD
register, but only when device is in INIT FS mode.
Figure 18. Watchdog refresh counter configuration (INIT_WD register, WD_CNT_refresh_1:0)
Any access to the watchdog register during the “closed” watchdog window is considered as a wrong watchdog refresh. Watchdog timeout,
meaning no WD refresh during closed or open windows, is considered as a wrong WD refresh.
Table 10. Watchdog error table
Window
CLOSED OPEN
BAD Key WD_NOK WD_NOK
SPI GOOD Key WD_NOK WD_OK
None (time out) No_issue WD_NOK
0
2
1
3
4
WD Refresh OK
Watchdog Refresh Counter
WD_CNT_refresh = 4
WD Refresh OK
WD Refresh OK
WD Refresh OK
WD Refresh NOK
WD Refresh NOK /
WD_OFF
WD Refresh NOK /
WD_OFF
WD Refresh NOK /
WD_OFF
WD Refresh OK /
WD Refresh NOK /
WD_OFF
0
2
1
3
4
5
6
WD Refresh OK
Watchdog Refresh Counter
WD_CNT_refresh = 6
WD Refresh OK
WD Refresh OK
WD Refresh OK
WD Refresh OK
WD Refresh OK
WD Refresh NOK
WD Refresh NOK /
WD_OFF
WD Refresh NOK /
WD_OFF
WD Refresh NOK /
WD_OFF
WD Refresh NOK /
WD_OFF
WD Refresh NOK /
WD_OFF
WD Refresh OK /
WD Refresh NOK /
WD_OFF
0
1
WD Refresh OK
Watchdog Refresh Counter
WD_CNT_refresh = 1
WD Refresh NOK
WD Refresh OK /
WD Refresh NOK /
WD_OFF
0
Watchdog Refresh Counter
WD_CNT_refresh = 2
WD Refresh NOK
2
1WD Refresh NOK /
WD_OFF
WD Refresh OK /
WD Refresh NOK /
WD_OFF
WD Refresh OK
WD Refresh OK
42 NXP Semiconductors
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6.5.3 Reset error counter
The reset error counter manages the reset events and counts the number of resets occurring in the application. This counter is
incremented not only for the reset linked to consecutive wrong refresh watchdogs, but also for other sources of reset (undervoltage,
overvoltage, external reset). The RST error counter is incremented by 1, each time a reset is generated.
The reset error counter has two output values (intermediate and final). The intermediate output value is used to handle the transition from
reset (RSTB is asserted low) to reset and fail where RSTB and FS0B are activated. The final value is used to handle the transition from
reset and fail to deep reset and fail (Deep Fail-safe mode), where regulators are off, RSTB and FS0B are activated, and a power on reset
or a transition on IO_0 is needed to recover. The intermediate value of the reset error counter is configurable to “1” or “3” using the
RSTB_err_FS bit in the INIT FSSM2 register (Table 71).
If RSTB_err_FS is set to “0”, it means the device activates FS0B when the reset error counter reaches level “3”.
If RSTB_err_FS is set to “1”, it means the device activates FS0B when the reset error counter reaches level “1”.
This configuration must be done during INIT FS phase.
The final value of the reset error counter is based on the intermediate configuration.
• RSTB_err_FS = 0 / Intermediate = 3; Final = 6 (Figure 19). When reset error counter reaches 6, the device goes into deep reset and
fails.
• RSTB_err_FS = 1 / Intermediate = 1; Final = 2 (Figure 20). When reset error counter reaches 2, the device goes into deep reset and
fails.
In any condition, if the RSTB is asserted LOW for a duration longer than eight seconds, the device goes into deep reset and fails.
Conditions that leads to an increment of the RSTB error counter, and according to the product configuration are:
• Watchdog error counter = 6
• Watchdog refresh NOK during INIT phase or Watchdog timeout
• IO_23 error detection (FCCU)
• Undervoltage
•Overvoltage
• IO_1 FB_Core Delta
• FS0B shorted to VDD
• SPI DED
• Reset request by the SPI
• External reset
Conditions leading to a transition go to FS, according to the product configuration are:
• IO_01/IO_23/IO_45 error detection
• Undervoltage
•Overvoltage
• IO_1 FB_Core Delta
• Analog BIST fail
• SPI DED
• RSTB shorted to high
NXP Semiconductors 43
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Figure 19. RSTB error counter (RSTB_err_FS = 0)
Figure 20. RSTB error counter(RSTb_err_FS = 1)
Reset Error Counter
(Cfg SPI RSTb_err_FS=0; WD_CNT_refresh=6)
0
2
1
3
4
5
6
gotoFS
7 consecutive WD Refresh OK
INCR
gotoFS INCR
INCR
INCR
INCR
INCR
Active FS0
Turn OFF regulators
Active FS0
Active FS0
Active FS0
RSTb asserted for 8
seconds
7 consecutive WD Refresh OK
7 consecutive WD Refresh OK
7 consecutive WD Refresh OK
7 consecutive WD Refresh OK
7 consecutive WD Refresh OK
POR or from
LPOFF mode
INCR = WD error counter = WD_CNT_error[1:0] |
WD refresh NOK during INIT |
IO23_ERR |UV/OV |
IO_1 FB_Core delta |
FS0b_shorttovdd |
SPI DED |
Reset by SPI |
External reset
gotoFS = IO01/23/45_ERR |
UV/OV|
IO_1 FB_Core delta |
ABIST_fail |
SPI DED |
RSTb_short2hi
(7 = WD_CNT_refresh + 1)
0
2
1
7 consecutive WD Refresh OK
INCR/gotoFS
INCR
Active FS0
Turn OFF regulators
Active FS0
RSTb asserted for 8
seconds
7 consecutive WD Refresh OK
POR or from
LPOFF mode
INCR = WD error counter = WD_CNT_error[1:0] |
WD refresh NOK during INIT |
IO23_ERR |UV/OV |
IO_1 FB_Core delta |
FS0b_shorttovdd |
SPI DED |
Reset by SPI |
External reset
gotoFS = IO01/23/45_ERR |
UV/OV |
IO_1 FB_Core delta |
ABIST_fail |
SPI DED |
RSTb_short2hi
(7 = WD_CNT_refresh + 1)
Reset Error Counter
(Cfg SPI RSTb_err_FS=1; WD_CNT_refresh=6)
44 NXP Semiconductors
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6.5.3.1 RST error counter at start-up or resuming from LPOFF mode
At start-up or when resuming from LPOFF mode the reset error counter starts at level 1 and FS0B is asserted low. To remove activation
of FS0B, the RST error counter must go back to value “0” (seven consecutive good watchdog refresh decreases the reset error counter
down to 0) and a right command is sent to FS_OUT register (Figure 23).
Figure 21. Example of WD operation generating a reset (WD_error_cnt = 6)
Figure 22. Example of WD operation leading a decrement of the reset error counter (WD_resfresh_cnt = 6)
WD window
OK NOK NOK OK
02
WD error
counter 43
NOK
5
OK
46
NOK
Reset error
counter 1
RSTB
010
WD Refresh
counter 00
110
RSTb
delay time
1st WD refresh OK after
INIT phase. Start of the
WD window
New fully OPEN window of
256 ms
6
2
0
OK OK OK OK OK OK OK
0
OK
123456 0
1
1
WD window
WD error
counter
Reset error
counter
RSTb
WD Refresh
counter
RSTb
delay time
1
NOK
New fully OPEN window of
256 ms
4
NXP Semiconductors 45
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Figure 23. Reset error counter and FS0B deactivation sequence (RSTB_err_FS = 0 & WD_CNT_error1:0 = 6)
6.5.4 Fail-safe output (FS0B) deactivation
When the fail-safe output FS0B is asserted low by the device due to a fault, some conditions must be validated before allowing the FS0B
pin to be deactivated by the device. These conditions are:
• Fault is removed
• Reset error counter must be at “0”
• FS_OUT register must be filled with the right value.
6.5.4.1 Faults triggering FS0B activation
The activation of the FS0B is clearly dependent on the product configuration, but the following items can be settled:
• IO_01/IO_23/IO_45 error detection
• Undervoltage
• Overvoltage
• IO_1 FB_Core Delta
• Analog BIST fail (not configurable)
• SPI DED (not configurable)
• RSTB shorted to high (not configurable)
• RSTB error counter level
6.5.5 SPI DED
Some SPI registers affect some safety critical aspects of the fail-safe functions, and thus are required to be protected against SEU (Single
Event Upset). Only fail-safe registers are concerned. During INIT FS mode, access to fail-safe registers for product configuration is open.
Then once the INIT FS phase is over, the Hamming circuitry is activated to protect registers content.
At this stage, if there is 1 single bit flip, the detection is made due to hamming code, and the error is corrected automatically (fully
transparent for the user), and a flag is sent. If there are two errors (DED - Dual Error Detection), the detection is made due to hamming
code but detected errors cannot be corrected. Flag is sent, RSTB and FS0B are activated.
6.5.6 FS_OUT register
When fault is removed and reset error counter changes back to level “0”, a right word must be filled in the FS_OUT register. The value is
dependant on the current WD_LFSR. LSB and MSB must be swapped and negative operation per bit must be applied.
Figure 24. FS_OUT register based on LFSR value
RSTb
Reset error counter
RST_ERR_CNT 1
FS0b
0
# WD refresh counter max value +1
consecutive WD answers OK
FS_OUT
write OK
Output stage ON OFF
1 2
WD error counter
= 6
WD error counter
= 6
WD error counter
= 6
3
ON
Reset delay
2
# WD refresh counter max value +1
consecutive WD answers OK
OFF
FS_OUT
write OK
1 0
WD_LFSR_7:0= b7 b6 b5 b4 b3 b2 b1 b0
FS_OUT_7:0 = b0b1b2b3b4b5b6b7
46 NXP Semiconductors
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6.6 Input voltage range
Due to the flexibility of the pre-regulator, the device can cover a wide battery input voltage range. However, a more standard voltage range
can still be covered using only the Buck configuration.
Figure 25. Input voltage range
•V
SUP > 28 V: Potential VPRE thermal limitation
RDS(on), Current limitation and Overcurrent detection are specified for VSUP < 28 V.
•V
SUP < 19 V: Mux_out limitation
IO_0 and IO_1 maximum analog input voltage range is 19 V. Internal 2.5 V reference voltage accuracy degraded.
• Buck only, VSUP < VSUP_UV_7:
CAN communication is guaranteed for VSUP > 6.0 V. LIN communication according to SAEJ2602-2 specification is stopped
(VSUP < 7.0 V). For VCCA and VAUX 5.0 V configuration, undervoltage triggers at low VSUP (refer to VCCA_UV_5 and VAUX_UV_5).
6.7 Power management operation
A thermal sensor is implemented as close as possible to the pass transistor of each regulator (VPRE, VCORE, VCCA, VCAN) and an
associated individual Thermal Shutdown (TSD) protect these regulators independently. When the TSD threshold of a specific regulator is
reached, this regulator only is switched OFF and the information is reported in the main state machine. The regulator restarts automatically
when the junction temperature of the pass transistor decrease below the TSD threshold.
VSUP
No operation
Extended voltage range
VPRE output current limitation
2.7 V
VSUP_UV_7
19 V
28 V
40 V
Normal voltage range
Extended voltage range
Amux limitation
Extended voltage range
Potential Vpre thermal limitation
No operation
Risk of damage
No operation
Normal voltage range
Extended voltage range
Vpre output current limitation
Extended voltage range
Potential Vpre thermal limitation
Extended voltage range
Amux limitation
No operation
Risk of damage
Buck-Boost Buck only
4.6 V
6.0 V
NXP Semiconductors 47
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6.7.1 VPRE voltage pre-regulator
A highly flexible SMPS pre-regulator is implemented in the 33907/33908. Depending on the input voltage requirement, the device can be
configured as “non-inverting buck-boost converter” (Figure 27) or “standard buck converter” (Figure 26). An external logic level MOSFET
(N-type) is required to operate in “non-inverting buck-boost converter”. The connection of the external MOSFET is detected automatically
during the start-up phase.
The converter operates in Current Control mode in any configuration. The high-side switching MOSFET is integrated to make the current
control easier. The PWM frequency is fixed at 440 kHz typical. The compensation network is fully integrated. VPRE output voltage is
regulated between 6.0 V and 7.0 V.
If the full current capability is not used for VCORE, VCCA, VAUX and CAN_5V, additional external LDO can be connected to VPRE to
fulfill application needs while the current load remains below the maximum current capability in all conditions.
Figure 26. Pre-regulator: buck configuration
Figure 27. Pre-regulator: buck boost configuration
When the converter is set up to work in boost mode at low VSUP, the transition between buck and boost mode is automatically handled
by the device at VSUP_UV_7 threshold. Transition between buck mode and boost mode is based on hysteresis (Figure 28).
• When VSUP > VSUP_UV_7, the converter works in buck mode and VPRE output is regulated at 6.5 V typic.
• When VSUP < VSUP_UV_7, the converter works in boost mode and VPRE output is regulated at 6.3 V typic.
SW_pre2
VPRE
Boots_pre
Gate_LS
SW_pre1
L_VPRE
Cboot_pre
Csnub_Vpre
Rsunb_Vpre
PGND
PGND
PGND
D_Vpre
PGND PGND PGND
ESR cap.
<100 mΩ
ESR cap.
<10 mΩ
PGND
Cout_Vpre1
Cout_Vpre2
Cout_Vpre3
Cout_Vpre4
SW_pre2
VPRE
Boots_pre
Gate_LS
SW_pre1
L_Vpre
Cboot_pre
Csnub_Vpre
Rsunb_Vpre
PGND
PGND
PGND
Optional
D_Vpre
LS_BB
D_BB
PGND PGND PGND
ESR cap.
<100 mΩ
ESR cap.
<10 mΩ
PGND
Cout_Vpre1
Cout_Vpre2
Cout_Vpre3
Cout_Vpre4
48 NXP Semiconductors
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Figure 28. Transition between buck and boost
6.7.1.1 Power up and power down sequence
Figure 29. Buck configuration power-up and power-down
D (%)
VIN (V)
18127.5
33
50
100
D buck D boost
66
24
25
VPRE (V)
6.5
0
hysteresis
Buck_Boost Mask
VSNS_UV
Vsup
VSUP_UV_5
Buck Boost Boost
Buck
Vpre_EN
Vpre
INTB
(Vddio=Vcore)
RSTB
Vcore
0V
Vbattery
RST delay time
VSUP_UV_L_B
VCORE_FB_UV * ((R3+R4)/R4)
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Figure 30. Buck boost configuration power-up and power-down
Vsup
VSUP_UV_7
VSUP_UV_L
Buck Boost Boost
Buck
0V
Vbattery
RST delay time
VSUP_UV_5
Buck_Boost Mask
Vpre_EN
Vpre
RSTB
Vcore VCORE_FB_UV * ((R3+R4)/R4)
INTB
(Vddio=Vcore)
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6.7.1.2 Cranking management
When VPRE is set up to work in buck only mode, the application can work down to VSUP = VSUP_UV_L_B = 4.6V with a minimum of 500 mA
current guaranteed on VPRE..
Figure 31. Behavior during cranking (buck configuration)
When VPRE is set up to work in boost mode, the application can work down to VSUP = VSUP_UV_L = 2.7V with a minimum of 300 mA
current guaranteed on VPRE. The boost mode configuration help to pass LV124 specification requiring a minimum of 3.2 V on VBAT supply
during cold cranking conditions.
Buck_Boost
Mask
VSUP
VSNS_UV
Buck
VPRE_EN
VPRE
INTB
RSTB
VCORE
VCORE_FB_UV * ((R3+R4)/R4)
VSENSE
VSUP_UV_L_B
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Figure 32. Behavior during cranking (buck boost configuration)
6.7.1.3 Light load condition
In order to improve the converter efficiency and avoid any unwanted output voltage increase, VPRE voltage regulator operates in Pulse
Skipping mode during light load condition.
The transition between Normal mode and Pulse Skipping mode is based on the comparison between the error amplifier output (EA_out)
and pre-defined thresholds VPRE_LL_H and VPRE_LL_L. When the Error Amplifier output reaches VPRE_LL_L, VPRE high-side transistor is
switched OFF. When the Error Amplifier output reaches VPRE_LL_H, VPRE high-side transistor is switched ON again for the next switching
period (Figure 33).
Figure 33. Description of light load condition
Buck_Boost
Mask
VSUP
VSUP_UV_7
VSUP_UV_L
Buck
Boost Boost
Buck
VPRE_EN
VPRE
INTB
RSTB
VCORE
VCORE_FB_UV * ((R3+R4)/R4)
E
A
_
out
Vpre
_
L
L
_
H
Vpr
e
_
L
L
_
L
Light Load
flag
HS Ga te
driv
e
Ref
Vp re_L L_L
VPR E VSUP1/2
SW_PRE
Error Amplifier
VPRE HS
Drive r
Li gh t L oa d
Comp arator
(H y s t 2 0 m V )
GND
EA_ out
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6.7.1.4 Input power feed forward condition
In order to improve the converter efficiency during high input power condition, VPRE switching frequency is reduced from 440 kHz to
220 kHz when VSUP > VSUP_IPFF and IPRE > IPRE_IPFF_PK to decrease the switching losses. The transition between the two frequencies
is transparent for the application.
Figure 34. Input power feed forward principle
6.7.1.5 Overcurrent detection and current limitation
6.7.1.5.1 Overcurrent protection:
In order to ensure the integrity of the high-side MOSFET, an overcurrent detection is implemented. The regulator is switched OFF by the
Main State machine when the over-current detection threshold IPRE_OC is reached three consecutive times. The overcurrent detection is
blanked when the pass transistor is switched ON during TPRE_OC to avoid parasitic switch OFF of the high-side gate driver.
The VPRE output voltage decrease causes an undervoltage condition on one of the cascaded regulators (VCORE, VCCA, VAUX) and
bring the device in Fail-safe state. The overcurrent protects the regulator in case of SW_PRE pin shorted to GND. The overcurrent works
in Buck mode only.
6.7.1.5.2 Current limitation:
A current limitation is also implemented to avoid uncontrolled power dissipation inside the device (duty cycle control) and limits the current
below IPRE_LIM. The current limitation is blanked when the pass transistor is switched ON during TPRE_BLK_LIM to allow short-circuit
detection on SW_PRE pin.
When IPRE_LIM threshold is reached during Buck mode, the high-side integrated MOSFET is switched OFF. When IPRE_LIM threshold is
reached during Boost mode, the external low-side MOSFET is switched OFF. In both cases, the MOSFET is not switched ON again before
the next rising edge of the switching clock.
The current limitation will induce a duty cycle reduction and will lead to VPRE output voltage to fall down gradually and may cause an
undervoltage condition on one of the cascaded regulators (VCORE, VCCA, VAUX) and bring the device in Fail-safe state. The current
limitation does not switch OFF the regulator. The current limitation protects the regulator when VPRE pin is shorted to GND.
VSUP
VSUP_IPFF
IPFF
VPRE_FSW
440 kHz 440 kHz
220 KHz
Ipk envelop
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Figure 35. Overcurrent and current limitation scheme
6.7.1.6 VPRE voltage monitoring
The overvoltage detection switches OFF the regulator. The undervoltage detector is disabled when the regulator is switched OFF
reporting an undervoltage. Diagnostic is reported in the dedicated register and generate an Interrupt.
The undervoltage detection does not switches OFF the regulator. However, VPRE decrease may induce an undervoltage on a regulator
attached to VPRE (VCORE, VCCA, VAUX, or CAN_5V), and bring the application in Fail-safe state depending on the supervisor
configuration (registers INIT SUPERVISOR 1,2,3).
6.7.1.7 VPRE efficiency
VPRE efficiency versus current load is given for information based on typical external component criteria described in the table close to
the graph and at three different VSUP voltages (8.0 V, 14 V, and 18 V) covering typical automotive operating range. The efficiency is valid
in buck mode only and above 200 mA load on VPRE in order to be in continuous mode in the 22 µH inductor. The efficiency is calculated
and has to be verified by measurement at application level.
SW_PR E
IPR E_OC
IPRE_LIM
IPRE_SW
TPRE_BLK_ILIM TPRE_OC
VPR E
54 NXP Semiconductors
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Figure 36. VPRE efficiency
6.7.2 VCORE voltage regulator
This voltage regulator is a step-down DC-DC converter operating in Voltage Control mode. The high side switching MOSFET is integrated
in the device and the PWM frequency is fixed at 2.4 MHz typical. The output voltage is configurable from 1.2 V to 3.3 V range and
adjustable around these voltages with an external resistor divider (R3/R4) connected between VCORE and the feedback pin (FB_CORE)
(Figure 37).
VCORE = VCORE_FB x ((R3 + R4) / R4)
The voltage accuracy is ±2.0% (without the external resistor bridge R3/R4 accuracy) and the max output current is 1.5 A. The stability of
the overall converter is done by an external compensation network (R1/C1/R2/C2) connected to the pin COMP_CORE. It is recommended
to use 1% accuracy resistors and set R4 = 8.06 kΩ and adjust R3 to obtain the final VCORE voltage needed for the MCU core supply.
Figure 37. VCORE buck regulator
SW_CORE
FB_CORE
COMP_CORE
BOOT_CORE
VCORE_SNS
L_Vcore
Cboot_Core
R3
R4
C1
R1
Cout1_Vcore
EMI
Cout_Vcore
PGND
PGND
PGND PGND
PGND
GND
ESR cap.
<100mΩ
D_Vcore
Csnub_Vcore
Cout2_Vcore
Rsnub_Vcore
GND
GND
EMI
Vcore_sns
EMI
FB_core
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6.7.2.1 Light load condition
In order to improve the converter efficiency and avoid any unwanted output voltage increase, VCORE voltage regulator operates in Pulse
Skipping mode during light load condition. The principle is the same as the VPRE implementation described in details in Light load
condition.
6.7.2.2 Current limitation
A current limitation is implemented to avoid uncontrolled power dissipation inside the device (duty cycle control) and limits the current
below ICORE_LIM. The current limitation is banked when the pass transistor is switched ON during TCORE_BLK_LIM to avoid parasite
detection. When ICORE_LIM threshold is reached, the high-side integrated MOSFET is switched OFF. The MOSFET is not switched ON
again before the next rising edge of the switching clock.
The current limitation will induce a duty cycle reduction and will lead to VCORE output voltage to fall down gradually and may cause an
undervoltage condition and bring the device in Fail-safe state. The current limitation does not switch OFF the regulator.
6.7.2.3 Voltage monitoring
The overvoltage detection switches OFF the regulator. The regulator remains ON in case of undervoltage detection. Diagnostic is reported
in the dedicated register, generate an Interrupt and may bring the application in Fail-safe state depending on the supervisor configuration
(registers INIT SUPERVISOR 1,2, 3).
6.7.2.4 VCORE efficiency
Vcore efficiency versus current load is given for information based on typical external component criteria described in the table close to
the graph and at two different VCORE voltages (3.3 V, and 1.2 V) covering most of the 32-bit MCU supply range. The efficiency is valid
above 200 mA load on VCORE in order to be in continuous mode in the 2.2 µH inductor. The efficiency is calculated and has to be verified
by measurement at application level. One of the major contributor degrading the efficiency at VCORE = 1.2 V is the external diode during
the recirculation phase. Lower the diode Forward Voltage (VF) is, the better the efficiency.
Figure 38. VCORE efficiency
56 NXP Semiconductors
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6.7.3 Charge pump and bootstrap
Both switching MOSFETs of VPRE and VCORE SMPS are driven by external bootstrap capacitors. Additionally, a charge pump is
implemented to ensure 100% duty cycle for both converters. Each converter uses a 100 nF external capacitor minimum to operate
properly.
6.7.4 VCCA voltage regulator
VCCA is a linear voltage regulator mainly dedicated to supply the MCU I/Os, especially the ADC. The output voltage is selectable at 5.0 V
or 3.3 V. Since this output voltage can be used to supply MCU I/Os, the output voltage selection is done using an external resistor
connected to the SELECT pin and ground if VAUX is used. When VAUX is not used, the resistor is connected between the SELECT pin
and VPRE.
When VCCA is used with the internal MOS transistor, VCCA_E pin must be connected to VPRE. The voltage accuracy is ±1.0% for 5.0 V
configuration and ±1.5% for 3.3 V configuration with an output current capability at 100 mA.
When VCCA is used with an external PNP transistor to boost the current capability up to 300 mA, the connection is detected automatically
during the start-up sequence of the 33907/33908. In such condition, the internal pass transistor is switched OFF and all the current is
driven through the external PNP to reduce the internal power dissipation. The output voltage accuracy with an external PNP is reduced
to ±3.0% at 300 mA current load. The VCCA output voltage is used as a reference for the Auxiliary voltage supply (VAUX) when VAUX
is configured as a tracking regulator.
6.7.4.1 Current limitation
A current limitation is implemented to avoid uncontrolled power dissipation of the internal MOSFET or external PNP transistor. By default,
the current limitation threshold is selected based on the auto detection of the external PNP during start up phase.
• When the internal MOSFET transistor is used, the current is limited to ICCA_LIM_INT and the regulator is kept ON
• When the external PNP transistor is used, the current is limited to ICCA_LIM_OUT and the regulator is switch OFF after a dedicated
duration TCCA_LIM_OFF under current limitation. A SPI command is needed to restart the regulator.
In case of external PNP configuration only, the lowest current limitation threshold can be selected by SPI in the register INIT VREG 2
instead of the highest one. In order to limit the power dissipation in the external PNP transistor in case of short circuit to GND of VCCA
pin, a current limitation foldback scheme is implemented to reduce the current limitation to ICCA_LIM_FB when VCCA is below VCCA_LIM_FB.
6.7.4.2 Voltage monitoring
The overvoltage detection switches OFF the regulator. The regulator remains ON in case of undervoltage detection. Diagnostic is reported
in the dedicated register, generate an Interrupt and may bring the application in Fail-safe state depending on the supervisor configuration
(registers INIT SUPERVISOR 1, 2, 3).
6.7.5 VAUX voltage regulator
VAUX is a highly flexible linear voltage regulator that can be used either as an auxiliary supply dedicated to additional device in the ECU
or as a sensor supply (i.e. outside the ECU). An external PNP transistor must be used (no internal current capability). If VAUX is not used
in the application, VAUX_E and SELECT pins must be connected to VPRE in order to not populate the external PNP as described in
Figure 60.
If VAUX is used as an auxiliary supply, the output voltage is selectable between 5.0 V, 3.3 V. Since this voltage rail can be used to supply
MCU IOs, the selection is done with an external resistor connected between the SELECT pin and ground. In such case, the voltage
accuracy is ±3.0% with a maximum output current capability at 300 mA. If VAUX is used as a sensor supply rail, the output voltage is
selectable between 5.0 V and 3.3 V. VCCA can be used as reference for the sensor supply used as tracker. The selection is done during
the INIT phase and secured (bit VAUX_TRK_EN in the register INIT VREG2). The tracking accuracy is ±15 mV.
NXP Semiconductors 57
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Figure 39. Example of VAUX used in tracker mode
6.7.5.1 Current limitation
A current limitation is implemented to avoid uncontrolled power dissipation of the external PNP transistor. The current is limited to IAUX_LIM
and the regulator is switch OFF after a dedicated duration TAUX_LIM_OFF under current limitation. A SPI command is needed to restart the
regulator. In order to limit the power dissipation in the external PNP transistor in case of short-circuit to GND of VAUX pin, a current
limitation foldback scheme is implemented to reduce the current limitation to IAUX_LIM_FB when VAUX is below VAUX_LIM_FB.
Figure 40. VAUX current limitation scheme with foldback mechanism
SW2
FB1
Vcca_E
Vcca_B
Vcca 5V
Comp1
Vcore_sns
L3 - 2.2 µH
C6
100nF R3
R4
C10
R1
R2 C11
Vcore
C8
4.7 µF
C7
40µF
PGND PGND
GND
GND
Boot_core
Vcore
Buck – 1.5A
VCCA - LDO1
100/300mA
VAUX - LDO2
300mA
Vaux_E
Vaux_B
Vaux 5V
C9
4.7 µF
GND
PNP2
MCU
VDD_LV_1.2V
V_ADC_5V
D4
Ext
Sensor
ADC_IN
GND
Int 3.3/
5V ref
ECU
limit
+/- 15mV
V_Peripherals & I/O
Input ref
33907/33908
Iaux_LIMIaux_LIM_FB
IAUX
VAUX
Vaux
(3.3Vor
5V)
Vaux_LIM_FB
58 NXP Semiconductors
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6.7.5.2 Voltage monitoring
The overvoltage detection switches OFF the regulator. The regulator remains ON in case of undervoltage detection. Diagnostic is reported
in the dedicated register, generate an Interrupt and may bring the application in Fail-safe state depending on the supervisor configuration
(registers INIT SUPERVISOR 1, 2, 3).
6.7.6 CAN_5V voltage regulator
The CAN_5V voltage regulator is a linear regulator fully dedicated to the internal HSCAN interface. By default, the CAN_5V regulator and
the undervoltage detector are enabled, the overvoltage detector is disabled. The overvoltage detector can be enabled by SPI during
INIT_MAIN sate.
If the overvoltage detector is enabled, the CAN_5V regulator switches OFF when an overvoltage is detected. The undervoltage detector
is disabled when the regulator is switched OFF reporting an undervoltage. Diagnostic is reported in the dedicated register and generate
an Interrupt. The CAN_5V regulator is not safety regulator. Consequently, the CAN_5V voltage monitoring (overvoltage, undervoltage)
will never assert RSTB or FS0B Fail-safe pins.
If the 33907/33908 internal CAN transceiver is not used in the application, the CAN_5V regulator can be used to supply an external
standalone CAN or FLEX-RAY transceiver, providing that the current load remains below the maximum current capability in all conditions.
In that case, the internal CAN transceiver must be put in Sleep mode without wake-up capability.
6.7.7 Power dissipation
The 33907/33908 provides high performance SMPS and Linear regulators to supply high end MCU in automotive applications. Each
regulator can deliver:
•V
PRE (6. 5V) up to 2.0 A
•V
CORE (from 1.2 V to 3.3 V range) up to 0.8 A (33907) or up to 1.5 A (33908)
•V
CCA (3.3 V or 5.0 V) up to 100 mA (with internal MOS) or up to 300 mA (with external PNP)
•V
AUX (3.3 V or 5.0 V) up to 300 mA (with external PNP)
•V
CAN (5.0 V) up to 100 mA
A thermal dissipation analysis has to be performed based on application use case to ensure the maximum silicon junction temperature
does not exceed 150 °C.
Two use cases covering the two main VCORE voltage configurations are provided in Figure 41.
• use case 1: VCORE = 3.3 V, ICORE = 0.7 A, VCCA with int. MOS
• use case 2: VCORE = 1.2 V, ICORE = 1.4 A, VCCA with ext. PNP
Both use cases have a total internal power dissipation below 0.9 W. A junction to ambient thermal resistivity of 30 °C/W allows the
application to work up to 125 °C ambient temperature. A good soldering of the package expose pad is highly recommended to achieve
such thermal performance.
NXP Semiconductors 59
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Figure 41. Power dissipation use case
The main contributors to the device power dissipation are VPRE, VCORE, and VCCA (when used with internal PMOS) regulators. In
comparison, the power dissipation from the Internal IC, VAUX and CAN transceiver are negligible. VPRE power dissipation is mainly
induced by the loading of the regulators it is supplying, mainly VCORE, VCCA and VAUX which are application dependant. The total
device power dissipation, depending on the variation of these three regulators, is detailed in Figure 42 with the environmental conditions
in the associated table.
Vpre
25%
Vcore
33%
Vcca
21%
Vaux
5%
CAN transceiver
8%
Internal IC
8%
Main contributors to the IC's Power dissipation
Vpre
28%
Vcore
51%
Vcca
2%
Vaux
5%
CAN transceiver
7%
Internal IC
7%
Main contributors to the IC's Power dissipation
Vsup = 14V and 25% of CAN traffic
use case 1: Vcore=3.3V, Icore=0.7A, Vcca with int. MOS use case 2: Vcore=1.2V, Icore=1.4A, Vcca with ext. PNP
0.765 W
TOTAL PDIS =
0.829 W
TOTAL PDIS =
1) CAN transceiver dissipation includes CAN_5V regulator dissipation.
2) 25% CAN traffic means the CAN bus is dominant for 25% of time and recessive for the remaining 75%.
60 NXP Semiconductors
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Figure 42. Power dissipation versus ICORE, ICCA, or IPRE
Pdis VS Icore Pdis VS Icca Pdis VS Ipre
Vpre 6.5V 6.5V 6.5V
Ipre Icore + Icca
+ Iaux + Ican
Icore + Icca
+ Iaux + Ican From 0.5 to 2A
Vcore 3.3V and 1.2V 3.3V 3.3V
Icore from 0.25 to 1.5A 0.7A 0.3A
Vcca 3.3V 3.3V and 5V 3.3V
Icca 50mA 20 to 100mA 50mA
Vaux 3.3V 3.3V 3.3V
Iaux 200mA 200mA 200mA
CAN_5V 5V 5V 5V
Ican 33mA 33mA 33mA
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6.7.8 Start-up sequence
In order to provide a safe and well known start-up sequence, the 33907/33908 includes an undervoltage lock-out. This undervoltage lock-
out is only applicable when the device is under a Power-On-Reset condition, which means the initial condition is VSUP < VSUP_UV_L (i.e.
below 2.7 V max). In all the other conditions (i.e. LPOFF), the device is able to operate (and therefore to restart) down to VSUP_UV_L. The
other different voltage rails automatically start, as described in Figure 43.
Figure 43. Start-up scheme
The final value of VAUX and VCCA depends on the hardware configuration (resistor values on the SELECT pin). The typical start up
sequence takes around 16 ms to release RSTB. RSTB can be pulled low after those 16 ms by the MCU, if it is not ready to run after power
up.
If an internal or external fault happen during this start up phase (ABIST fault due to regulator shorted for example), the 8.0 s timer
monitoring the RSTB pin low, will finally send the device in Deep Fail-safe mode after 8.0 s.
~16ms
Vsup
Vint_2.5
Vpre
Softstart Vpre
Softstart Vregs
Vsup_uv_5
INIT
UV Lock-out
Vpre_uv
Vpre_EN
Vcca/Vaux
Vcore
LS detect
RSTB
INTB
(Vddio=Vcore)
Main Select pin config
Select pin
ABIST
1ms
FS Select pin config
LBIST
120us
1ms
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6.8 CAN transceiver
The high speed CAN (Controller Area Network) transceiver provides the physical interface between the CAN protocol controller of an MCU
and the physical dual wires CAN bus. It offers excellent EMC and ESD performance and meets the ISO 11898-2 and ISO11898-5
standards.
Figure 44. CAN simplified block diagram
6.8.1 Operating modes
6.8.1.1 Normal mode
When CAN mode bits configuration is “11” (CAN in normal operation), the device is able to transmit information from TXD to the bus and
report the bus level to the RXD pin. When TXD is high, CANH and CANL drivers are off and the bus is in the recessive state (unless it is
in an application where another device drives the bus to the dominant state). When TXD is low, CANH and CANL drivers are ON and the
bus is in the dominant state. When CAN mode bits configuration is “01” (CAN in listen only), the device is only able to report the bus level
to the RXD pin. TXD driver is OFF and the device is NOT able to transmit information from TXD to the bus. TXD is maintained high by
internal pull up resistor TXDPULL-UP connected to VDDIO.
CAN_5V
Rin
Rin
2.5V
Mode
Control
Differential
Receiver
Wake-up
Receiver
Pre
Driver
TXD CAN H
CAN L
VDDIO
RXD
Over
Dominant
Temperature
Bus Biasing
and
CAN_5V Monitor
CAN_5V
VDDIO
Pre
Driver
Buffer
Input
VDDIO
time out
VSUP3
Main
WU report
to main loicto main loic
Logic
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Figure 45. CAN timing diagram
6.8.1.2 Sleep mode
When the device is in LPOFF mode, the CAN transceiver is automatically set in Sleep mode with or without wake-up capability depending
on CAN mode bits configuration. In that case, the CANH and CANL pins are pulled down to GND via the internal RIN resistor, the TXD
and RXD pins are pulled down to GND, both driver and receiver are OFF.
The CAN mode is automatically changed to Sleep with wake-up capability if not configured to Sleep without wake-up capability when the
device enters is LPOFF. After LPOFF, the initial CAN mode prior to enter LPOFF is restored (Figure 46).
Figure 46. CAN transition when device goes to LPOFF
6.8.2 Fault detection
6.8.2.1 TXD permanent dominant (timeout)
If TXD is set low for a time longer than TDOUT parameter, the CAN drivers are disabled, and the CAN bus will return to recessive state.
The CAN receiver continues to operate. This prevent the bus to be set in dominant state permanently in case a failure set the TXD input
to low level permanently.
The CAN_mode MSB bit is set to 0 and the flag TXD_dominant is reported in the Diag CAN1 register. The device recovers from this error
detection after setting the CAN_mode to Normal Operation and when a high level is detected on TXD. The TXD failure detection is
operating when the CAN transceiver is in Normal mode and Listen only mode.
0.3V
DDIO
TXD
CANH
RXD
CANL
Vdiff
dominant
recessive
0.9V
0.5V
0.7V
DDIO
high
low
high
low
Tloop (R-D) Tloop (D-R)
(CANH - CANL)
CAN_mode CAN_mode CAN_mode
[1:0] [1:0] [1:0]
0 Sleep, no wake-up capability 0 Sleep, no wake-up capability 0 Sleep, no wake-up capability
1 Listen Only 1 Listen Only
10 Sleep, wake-up capability 10 Sleep, wake-up capability
11 Normal 11 Normal
10 Sleep, wake-up capability
CAN state before entering LPOFF CAN state in LPOFF CAN state after LPOFF
CAN state CAN state CAN state
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Figure 47. TXD Dominant Timeout Detection
6.8.2.2 RXD permanent recessive
If RXD is detected high for seven consecutive receive/dominant cycles, the CAN drivers and receiver are disabled, and the CAN bus will
return to recessive state. This prevent a CAN protocol controller to start CAN message on TXD pin, while RXD is shorted to a recessive
level, and seen from a CAN controller as a bus idle state.
The CAN_mode MSB bit is set to 0 and the flag RXD_recessive is reported in the Diag CAN1 register. The device recovers from this error
detection after setting the CAN_mode to Normal Operation. The RXD failure detection is operating when the CAN transceiver is in Normal
mode and Listen only mode.
6.8.2.3 CAN bus short-circuits
CANL short to GND and CANL short to Battery are detected and reported to the device main logic. The CAN driver and receiver are not
be disabled. CANH short to GND and CANH short to Battery are detected and reported to the device main logic. The CAN driver and
receiver are not be disabled. The CANH and CANL failure detection is operating when the CAN transceiver is in Normal mode.
If the CAN bus is dominant for a time longer than TDOM, due for instance to an external short-circuit from another CAN node, the flag
CAN_dominant is reported in the Diag CAN1 register. This failure does not disable the bus driver. The CAN bus dominant failure detection
is operating when the CAN transceiver is in Normal mode and Listen Only mode.
6.8.2.4 CAN current limitation
The current flowing in and out of the CANH and CANL driver is limited to 100 mA, in case of short-circuit (parameters ICANL-SK and
ICANH-SC).
6.8.2.5 CAN overtemperature
If the driver temperature exceeds the TSD (TOT), the CAN drivers are disabled, and the CAN bus will return to recessive state. The CAN
receiver continues to operate. The CAN_mode MSB bit is set to 0 and the flag CAN_OT is reported in the Diag CAN_LIN register.
An hysteresis is implemented in this protection feature. The device overtemperature and recovery conditions are shown in Figure 48. The
CAN drivers remain disabled until the temperature has fallen below the OT threshold minus hysteresis. The device will recover from this
error detection after setting the CAN_mode to Normal Operation and when a high level is detected on TXD.
TXD high
dominant recessive
BUS
TDOUT
dominant dominant
low
RXD high
low
TXD dom time out expired
recovery condition: TXD high
TDOUT TDOUT
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Figure 48. Overtemperature behavior
6.8.2.6 Distinguish CAN diagnostics and CAN errors
The CAN errors can generate an interruption while the CAN diagnostics are reported in the digital for information only. The interruption
generated by the CAN errors can be inhibited setting INT_inh_CAN bit at “1” in the “INIT INT” register.
The list of CAN Diagnostic and CAN Error bits is provided in Table 11.
6.8.3 Wake-up mechanism
The device include bus monitoring circuitry to detect and report bus wake-ups when the device is in LPOFF and CAN mode configuration
is different than Sleep/NO wake-up capability. Two wake-up detection are implemented: single dominant pulse and multiple dominants
pulses. The wake-up mechanism is selected by SPI in the main logic and wake-up events are reported. The event must occur within the
T3PTOX timeout. T3PTOX = T3PTO1 or T3PTO2 depending on the SPI selection.
Table 11. CAN diagnostic and CAN error bits
Register Bit Flag type Effect
DIAG CAN1
CANH_batt Diagnostic No impact on CAN transceiver
CANH_gnd Diagnostic No impact on CAN transceiver
CANL_batt Diagnostic No impact on CAN transceiver
CANL_gnd Diagnostic No impact on CAN transceiver
CAN_dominant Error Turn OFF CAN transceiver
RXD_recessive Error Turn OFF CAN transceiver
TXD_dominant Error Turn OFF CAN transceiver
DIAG CAN_LIN CAN_OT Error Turn OFF CAN transceiver
CAN_OC Diagnostic No impact on CAN transceiver
TXD
high
low
dominant
recessive
Event 1
BUS
Temperature
Hysteresis
Event 1: over temperature detection. CAN driver disable.
Event 2: temperature falls below “overtemp. threshold minus hysteresis” => CAN driver remains disable.
Event 2
dominant
Event 1
Hysteresis
Event 2
dominant
Event 3
Event 3: temperature below “overtemp. threshold minus hysteresis” and TxD high to low transition => CAN driver enable.
Event 4
Event 4: temperature above “overtemp. threshold minus hysteresis” and TxD high to low transition => CAN driver remains disable.
Event 3
Overtemperature Threshold
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6.8.3.1 Single pulse detection
In order to activate wake-up report, 1 event must occur on the CAN bus:
- event 1: a dominant level for a time longer that T1PWU
Figure 49. Single pulse wake-up pattern illustration
6.8.3.2 Multiple pulse detection
In order to activate wake-up report, three events must occur on the CAN bus:
- event 1: a dominant level for a time longer that t1PWU followed by
- event 2: a recessive level (event 2) longer than t3PWU followed by
- event 3: a dominant level (event 3) longer than t3PWU.
The three events and the timeout function avoid that a permanent dominant state on the bus generates permanent wake-up situation
which would prevent system to enter in low-power mode.
Figure 50. Multiple pulse wake-up pattern illustration
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6.9 LIN transceiver
This chapter applies to 33907L and 33908L versions.
The Local Interconnect Network (LIN) is a serial communication protocol, designed to support automotive networks in conjunction with a
Controller Area Network (CAN). The LIN transceiver is operational from a VSUP of 7.0 V to 18 V DC and compatible with LIN Protocol
Specification 1.3, 2.0, 2.1, 2.2 and SAEJ2602-2.
6.9.1 Simplified block diagram
Figure 51. LIN simplified block diagram
6.9.2 Operating modes
6.9.2.1 Normal mode
When LIN mode bits configuration is “11” (LIN in normal operation), the device is able to transmit information from TXDL to the bus and
report the bus level to the RXDL pin. When TXDL is high, LIN driver is OFF and the bus is in the recessive state (unless it is in an
application where another device drives the bus to the dominant state). When TXDL is low, LIN driver is ON and the bus is in the dominant
state.
When LIN mode bits configuration is “01” (LIN in listen only), the device is only able to report the bus level to the RXDL pin. TXDL driver
is OFF and the device is NOT able to transmit information from TXDL to the bus. TXDL is maintained high by internal pull-up resistor
TXDLPULL-UP connected to VDDIO.
6.9.2.2 Sleep mode
When the device is in LPOFF mode, the LIN transceiver is automatically set in Sleep mode with or without wake-up capability depending
on LIN mode bits configuration. In that case, the LIN pin is pulled up to VSUP via the internal resistor and diode structure, the TXDL and
RXDL pins are pulled down to GND.
TXD
RXD
35µA
LIN Interface
LIN
VSUP3
Sleep_mode
Receiver
Ω725 k30 k Ω
VSUP Undervoltage
LIN overtemperature
TXD Dominant
LIN Wake up
LIN Driver X 1
LIN transmitter
in Recessive State
SR_control
LIN transmitter
and receiver Enabled
Normal Baud Rate (20kbps)
Slow Baud Rate (10kbps)
Fast Baud Rate (100kbps)
LIN transmitter in
Recessive State
LIN transmitter in
Recessive State
GND
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6.9.3 Baud rate selection
The device has two selectable baud rates: 20 kB/s for Normal Baud rate and 10 kB/s for slow baud rate. An additional fast baud rate
(100 kB/s) can be used to flash the MCU or in the garage for diagnostic. The LIN Consortium specification does not specified electrical
parameters for this baud rate. The communication only is guaranteed. The baud rate selection is done by SPI setting during the INIT phase
of the main logic. Depending of the baud rate setting, the corresponding LIN slope control is automatically selected.
Figure 52. LIN timings for normal baud rate (20 kB/s)
Figure 53. LIN timings for slow baud rate (10 kB/s)
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Figure 54. LIN receiver timings
6.9.4 Fault detection
6.9.4.1 VSUP undervoltage
A VSUP undervoltage (VLIN_UV) detection is implemented to be compliant with SAEJ2602-2 standard. At low VSUP voltage
(VSUP<VLIN_UV), the LIN bus goes in recessive state to avoid wrong communication.
6.9.4.2 TXDL permanent dominant (timeout)
If TXDL is set low for a time longer than tXD_DOM parameter, the LIN driver is disabled and the LIN bus will return to recessive state. This
prevents the bus to be set in dominant state permanently, in case a failure sets the TXDL input permanently to a low level.
The LIN receiver continues to operate. The LIN_mode MSB bit is set to 0 and the flag TXDL_dominant is reported in the Diag CAN_LIN
register. The device recovers from this error detection after setting the LIN_mode to normal operation and when a high level is detected
on TXDL. The TXDL failure detection is operating when the LIN transceiver is in Normal mode and Listen Only mode.
6.9.4.3 RXDL permanent recessive
If RXDL is detected high for seven consecutive receive/dominant cycles, the LIN driver and receiver are disabled and the LIN bus returns
to recessive state. The LIN_mode MSB bit is set to 0 and the flag RXDL_recessive is reported in the Diag CAN_LIN register. The device
recovers from this error detection after setting the LIN_mode to normal operation, and when a high level is detected on TXDL. The RXDL
failure detection is operating when the LIN transceiver is in Normal mode and Listen Only mode.
6.9.4.4 LIN bus short-circuit
If the LIN bus is dominant for a time longer than tLIN_SHORT_GND, due for instance to an external short-circuit to GND, the detection is
reported to the device main logic. The BUS bus failure detection is operating when the LIN transceiver is in Normal mode and Listen Only
mode.
6.9.4.5 LIN current limitation
In case of LIN short-circuit to Battery, the current flowing out of the LIN driver is limited to 200 mA (parameter IBUS_LIM), and the LIN driver
is not shut down. The LIN bus goes in recessive state when the current limitation occurs and returns in the same functional mode as before
failure when the current falls below the current limitation value.
6.9.4.6 LIN overtemperature
If the driver temperature exceeds the TSD (tLIN_SD), the LIN driver is disabled and the LIN bus will return to recessive state. The LIN
receiver continues to operate. The LIN_mode MSB bit is set to 0 and the flag LIN_OT is reported in the Diag CAN_LIN register.
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A hysteresis is implemented in this protection feature. The LIN driver remain disabled until the temperature has fallen below the OT
threshold minus hysteresis. The device recovers from this error detection after setting the LIN_mode to normal operation, and when a
high level is detected on TXDL.
6.9.4.7 LIN errors
The interruption generated by the LIN errors can be inhibited setting INT_inh_LIN bit at “1” in the “INIT INT” register. The list of LIN error
bits is provided in Table 12.
6.9.5 Wake-up mechanism
The device can wake-up by a LIN dominant pulse longer than tBUS_WU. Dominant pulse means: a recessive to dominant transition, wait
for t > tBUS_WU, then a dominant to recessive transition.
Figure 55. LIN wake-up pattern illustration
Table 12. LIN error bits
Register Bit Flag type Effect
DIAG CAN_LIN
LIN_dominant Error Turn OFF LIN transceiver
RXDL_recessive Error Turn OFF LIN transceiver
TXDL_dominant Error Turn OFF LIN transceiver
LIN_OT Error Turn OFF LIN transceiver
V
LIN_REC
V
LIN_REC
V
LIN_DOM
V
BUS_WU
T
BUS_WU
LIN Wake up
validation
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7 Serial peripheral interface
7.1 High level overview
7.1.1 SPI
The device is using a 16 bits SPI, with the following arrangement:
MOSI, Master Out Slave In bits:
• Bit 15 read/write
• Bit 14 Main or fail-safe register target
• bit 13 to 9 (A4 to A0) to select the register address. Bit 8 is a parity bit in write mode, Next bit (=0) in read mode.
• bit7 to 0 (D7 to D0): control bits
MISO, Master IN Slave Out bits:
• bits 15 to 8 (S15 to S8) are device status bits
• bits 7 to 0(Do7 to Do0) are either extended device status bits, device internal control register content or device flags.
Figure 56 is an overview of the SPI implementation.
7.1.2 Parity bit 8 calculation
The parity is used for write to register command (bit 15,14 = 01). It is calculated based on the number of logic ones contained in bits
15-9, 7-0 sequence (this is the whole 16-bits of the write command except bit 8).
Bit 8 must be set to 0 if the number of 1 is odd.
Bit 8 must be set to 1 if the number of 1 is even.
7.1.3 Device status on MISO
When a write operation is performed to store data or control bit into the device, MISO pin reports a 16-bit fixed device status composed
of two bytes: Device Fixed Status (bits 15 to 8) + extended Device Status (bits 7 to 0). In a read operation, MISO reports the fixed device
status (bits 15 to 8), and the next eight bits are content of the selected register. A standard serial peripheral interface (SPI) is integrated
to allow bi-directional communication between the 33907/33908 and the MCU. The SPI is used for configuration and diagnostic purposes.
Figure 56. SPI overview
Bit 15 Bit 13 Bit 11Bit 12 Bit 10Bit 14 Bit 9 Bit 8
R/W A4 A2M/FS
Bit 7 Bit 5 Bit 3Bit 4 Bit 2Bit 6 Bit 1 Bit 0
D7 D5 D3D4 D2D6 D1 D0
A3
register address
Parity
A0
A1 P
data
MOSI
S15 S13 S11S14 Do7 Do5 Do3Do4 Do2Do6 Do1 Do0
S12 S9
S10 S8
MISO
Device Status Extended Device Status, Register Control bits or Device Flags
CSb
SCLK
MOSI
MISO Tri state Tri state
SPI wave form, and signals polarity
S15 S14 Do0
C1 C0 D0
SCLK signal is low outside of CSB active
CSb active low. Must be raised at end of 16 clocks,
MOSI and MISO data changed at SCLK rising edge
and sampled at falling edge. Msb first.
MISO tri state outside of CSB active
Don’t careDon’t care
for write commands, MOSI bits [15] = [1].
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The device contains several registers. Their address is coded on 7 bits (bits 15 to 9). Each register controls or reports part of the device
function. Data can be written to the register, to control the device operation or set default value or behavior. Every register can also be
read back in order to ensure that its content (default setting or value previously written) is correct.
7.1.4 Register description
Although the minimum time between two NCS low sequences is defined by tONNCS (Figure 57), two consecutive accesses to the fail-safe
registers must be done with a 3.5 µs minimum NCS high time in between. Although the minimum time between two fail-safe registers
accesses is 3.5 µs, some SPI accesses to the main registers can be done in between (Figure 57).
7.2 Detail operation
Figure 57. MOSI / MISO SPI command organization
Table 13. MOSI bits description
R / W
Description Set if it is a READ or WRITE Command
0 READ
1WRITE
M / FS
Description Split the addresses between Fail-safe State machine and main Logic
0Main
1Fail-safe
A4:0
Description Set the address to Read or Write
0See Register Mapping
1
P
Description Parity bit (only use in Write mode). Set to 0 in Read mode
0 Number of “1” (bit15:9 and bit 7:0) is odd
1 Number of “1” (bit15:9) and bit 7:0) is even
D7:0
Description Data in Write mode. Shall be set to 00h in Read mode
0See Register Details
1
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SPI_G = SPI_err or SPI_clk or SPI_Req or SPI_Parity or SPI_FS_err or SPI_FS_clk or SPI_FS_Req or SPI_FS_Parity
WU_G = IO_5_WU or IO_4_WU or IO_3_WU or IO_2_WU or IO_1_WU or IO_0_WU or PHY_WU
CAN_G = CANH_BATT or CANH_GND or CANL_BATT or CANL_GND or CAN_dominant or RXD_recessive or TXD_dominant or
CAN_OT or CAN_OC
LIN_G = LIN_OT or RXDL_recessive or TXDL_dominant or LIN_dominant
IO_G = IO_5 or IO_4 or IO_3 or IO_2 or IO_1 or IO_0
Vpre_G = VSNS_UV or VSUP_UV_7 or IPFF or ILIM_PRE or TWARN_PRE or BOB or VPRE_STATE_flag or VPRE_OV or VPRE_UV
Vcore_G = ILIM_CORE or TWARN_CORE or VCORE_STATE_flag or VCORE_OV or VCORE_UV
Vothers_G = ILIM_CCA or TWARN_CCA or TSD_CCA or ILIM_CCA_OFF or VCCA_UV or VCCA_OV or ILIM_AUX or VAUX_TSD or
ILIM_AUX_OFF or VAUX_OV or VAUX_UV or ILIM_CAN or VCAN_UV or VCAN_OV or TSD_CAN
Table 14. MISO bits description
SPI_G
Description Report an error in the SPI communication
0No Failure
1Failure
Reset Condition Power On Reset / When initial event cleared on read
WU
Description Report a wake-up event. Logical OR of all wake-up sources
0 No WU event
1 WU event
Reset Condition Power On Reset / When initial event cleared on read
CAN_G
Description Report a CAN event (Diagnostic)
0 No event
1 CAN event
Reset Condition Power On Reset / When initial event cleared on read
LIN_G
Description Report a LIN event (diagnostic)
0 No event
1 LIN event
Reset Condition Power On Reset / When initial event cleared on read
IO_G
Description Report a change in IOs state
0 No IO transition
1 IO transition
Reset Condition Power On Reset / when initial event cleared on read
VPRE_G
Description Report an event from VPRE-REGULATOR and battery monitoring (status change or failure)
0 No event
1 Event occurred
Reset Condition Power On Reset / when initial event cleared on read
VCORE_G
Description Report an event from VCORE regulator (status change or failure)
0 No event
1 Event occurred
Reset Condition Power On Reset / when initial event cleared on read
VOTHERS_G
Description Report an event from VCCA, VAUX, or VCAN regulators (status change or failure)
0 No event
1 Event occurred
Reset Condition Power On Reset / when initial event cleared on read
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7.2.1 Register address table
Table 15 is a list of device registers and addresses coded in bits 13 to 9 in MOSI for main logic.
Table 16 is a list of device registers and addresses coded in bits 13 to 9 in MOSI for fail-safe logic
Table 15. Register mapping of main logic
Register
Address
Write description Table ref
FS/M A4 A3 A2 A1 A0 Hex
NOT USED 0 00000 #0(00h) N/A N/A
INIT Vreg 1 0 00001 #1(01h) Write during INIT phase then read only Table 18
INIT Vreg2 0 00010 #2(02h) Write during INIT phase then read only Table 20
INIT CAN_LIN 0 00011 #3(03h) Write during INIT phase then read only Table 22
INIT IO_WU1 0 00100 #4(04h) Write during INIT phase then read only Table 24
INIT IO_WU2 0 00101 #5(05h) Write during INIT phase then read only Table 26
INIT INT 0 00110 #6(06h) Write during INIT phase then read only Table 28
NOT USED 0 00111 #7(07h) N/A N/A
HW Config 0 01000 #8(08h) Read only Table 30
WU Source 0 01001 #9(09h) Read only Table 32
NOT USED 0 01010 #10(0Ah) N/A N/A
IO_input 0 01011 #11(0Bh) Read only Table 34
Status Vreg#1 0 01100 #12(0Ch) Read only Table 36
Status Vreg#2 0 01101 #13(0Dh) Read only Table 38
Diag Vreg#1 0 01110 #14(0Eh) Read only Table 40
Diag Vreg#2 0 01111 #15(0Fh) Read only Table 42
Diag Vreg#3 0 10000 #16(10h) Read only Table 44
Diag CAN1 0 10001 #17(11h) Read only Table 46
Diag CAN_LIN 0 10010 #18(12h) Read only Table 48
Diag SPI 0 10011 #19(13h) Read only Table 50
NOT USED 0 10100 #20(14h) N/A N/A
MODE 0 10101 #21(15h) Write during Normal and Read Table 52
Vreg Mode 0 10110 #22(16h) Write during Normal and Read Table 54
IO_OUT/AMUX 0 10111 #23(17h) Write during Normal and Read Table 56
CAN_LIN Mode 0 11000 #24(18h) Write during Normal and Read Table 58
CAN Mode 2 0 11001 #25(19h) Write during Normal and Read Table 60
Table 16. Register mapping of fail-safe logic
Register
Address
Write description Table ref
FS/M A4 A3 A2 A1 A0 Hex
INIT Supervisor#1 1 00001 #33(21h) Write during INIT phase then Read only Table 62
INIT Supervisor#2 1 00010 #34(22h) Write during INIT phase then Read only Table 64
INIT Supervisor#3 1 00011 #35(23h) Write during INIT phase then Read only Table 66
INIT FSSM#1 1 00100 #36(24h) Write during INIT phase then Read only Table 68
INIT FSSM#2 1 00101 #37(25h) Write during INIT phase then Read only Table 70
WD_Window 1 00110 #38(26h) Write (No restriction) and Read Table 72
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7.2.2 Secured SPI command
Some SPI commands must be secured to avoid unwanted change of the critical bits. In the fail-safe machine and in the main state
machine, the secured bits are calculated from the data bits sent as follows:
• Secure 3 = NOT(Bit5)
• Secure 2 = NOT(Bit4)
• Secure 1 = Bit7
• Secure 0 = Bit6
WD_LFSR 1 00111 #39(27h) Write (No restriction) and Read Table 74
WD_answer 1 01000 #40(28h) Write (No restriction) and Read Table 76
FS_OUT 1 01001 #41(29h) Write (No restriction) Table 78
RSTb request 1 01010 #42(2Ah) Write (No restriction) Table 80
INIT WD 1 01011 #43(2Bh) Write during INIT phase then Read only Table 82
Diag FS1 1 01100 #44(2Ch) Read only Table 84
WD_Counter 1 01101 #45(2Dh) Read only Table 86
Diag_FS2 1 01110 #46(2Eh) Read only Table 88
Table 17. Secured SPI
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
Data 3 Data 2 Data 1 Data 0 Secure 3 Secure2 Secure 1 Secure 0
Table 16. Register mapping of fail-safe logic (continued)
Register
Address
Write description Table ref
FS/M A4 A3 A2 A1 A0 Hex
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7.3 Detail of register mapping
7.3.1 Init VREG 1
7.3.2 Init Vreg 2
Table 18. INIT VREG1 register configuration
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 1 0 0 0 0 0 1 P 0 0 Ipff_DIS 0 0 0 0 Vcore_
FB
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0Reserve
dIpff_DIS Reserve
d0 0 Reserve
d
Vcore_F
B
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0Reserve
dIpff_DIS Reserve
d0 0 Reserve
d
Vcore_F
B
Table 19. Description and configuration of the bits (Default value in bold)
IPFF_DIS
Description DISABLE the input Power Feed Forward (IPFF) function of VPRE
0 ENABLED
1 DISABLED
Reset condition Power On Reset
Vcore_FB
Description Configure the monitoring of the second VCORE resistor string
0 No Monitoring (IO_1 is used as analog & digital input)
1 Monitoring enabled (IO_1 can NOT be used for analog/digital input neither for WU from LPOFF)
Reset condition Power On Reset
Table 20. INIT VREG2 register configuration
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 1 0 0 0 0 1 0 P 0 Tcca_li
m_off Icca_lim 0 0 Taux_li
m_off
Vaux_tr
k_EN 0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0Tcca_li
m_off Icca_lim 0 0 Taux_li
m_off
Vaux_tr
k_EN reserved
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7.3.3 Init CAN_LIN
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 000 0 010000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0Tcca_li
m_off Icca_lim 0 0 Taux_li
m_off
Vaux_tr
k_EN reserved
Table 21. INIT VREG2. description and configuration of the bits (default value in bold)
TCCA_LIM_OFF
Description Configure the current limitation duration before regulator is switched off. Only used for external PNP
0 10 ms
1 50 ms
Reset condition Power On Reset
ICCA_LIM
Description Configure the current limitation threshold. Only available for external PNP
0I
CCA_LIM_OUT
1I
CCA_LIM_INT
Reset condition Power On Reset
TAUX_LIM_OFF
Description Configure the current limitation duration before regulator is switched off. Only used for external PNP
0 10 ms
1 50 ms
Reset condition Power On Reset
VAUX_TRK_EN
Description Configure VAUX regulator as a tracker
0 No tracking. HW configuration is used
1 Tracking enabled
Reset condition Power On Reset
Table 22. INIT CAN_LIN register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 1000011P0CAN_w
u_conf 0 0 CAN_w
u_TO 0LIN_SR
_1
LIN_SR
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0CAN_w
u_conf
Reserve
d
Reserve
d
CAN_w
u_TO
Reserve
d
LIN_SR
_1
LIN_SR
_0
Table 20. INIT VREG2 register configuration (continued)
78 NXP Semiconductors
33907/33908
7.3.4 INIT IO_WU1
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 0000011000000 0 0 0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0CAN_w
u_conf
Reserve
d
Reserve
d
CAN_w
u_TO
Reserve
d
LIN_SR
_1
LIN_SR
_0
Table 23. INIT CAN_LIN. description and configuration of the bits (default value in bold)
CAN_wu_conf
Description Define the CAN wake-up mechanism
0 3 dominant pulses
1 Single dominant pulse
Reset condition Power On Reset
CAN_wu_to
Description Define the CAN wake-up timeout (in case of CAN_wu_conf = 0)
0 120 µs
1 360 µs
Reset condition Power On Reset
LIN_SR_1:0
Description Configure the LIN slew rate
00 20 kbits/s
01 10 kbits/s
1X Fast baud rate (Max: 100 kbits/s)
Reset condition Power On Reset
Table 24. INIT IO_WU1 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 1 0 0 0 1 0 0 P WU_0_1 WU_0_0 WU_1_1 WU_1_0 WU_2_1 WU_2_0 INT_inh
_IO_1
INT_inh
_IO_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_G Vothers
_G WU_0_1 WU_0_0 WU_1_1 WU_1_0 WU-2-1 WU_2_0 INT_inh
_IO_1
INT_inh
_IO_0
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_G Vothers
_G WU_0_1 WU_0_0 WU_1_1 WU_1_0 WU-2-1 WU_2_0 INT_inh
_IO_1
INT_inh
_IO_0
Table 22. INIT CAN_LIN register description (continued)
NXP Semiconductors 79
33907/33908
7.3.5 INIT IO_WU2
Table 25. INIT IO_WU1. description and configuration of the bits (default value in bold)
WU_0_1:0
Description Wake-up configuration for IO_0
00 NO wake-up capability
01 Wake-up on rising edge only
10 Wake-up on falling edge only
11 Wake-up on any edge
Reset condition Power On Reset
WU_1_1:0
Description Wake-up configuration for IO_1
00 NO wake-up capability
01 Wake-up on rising edge only
10 Wake-up on falling edge only
11 Wake-up on any edge
Reset condition Power On Reset
WU_2_1:0
Description Wake-up configuration for IO_2
00 NO wake-up capability
01 Wake-up on rising edge only
10 Wake-up on falling edge only
11 Wake-up on any edge
Reset condition Power On Reset
INT_inh_IO_1
Description Inhibit the INT pulse for IO_1. IO_1 masked in IO_G. Avoid INT when used in FS
0 INT NOT masked
1INT masked
Reset condition Power On Reset
INT_inh_IO_0
Description Inhibit the INT pulse for IO_0. IO_0 masked in IO_G. Avoid INT when used in FS
0 INT NOT masked
1INT masked
Reset condition Power On Reset
Table 26. INIT IO_WU2 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 1 0 0 0 1 0 1 P WU_3_1 WU_3_0 WU_4_1 WU_4_0 WU_5_1 WU_5_0 INT_inh
_IO_23
INT_inh
_IO_45
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G WU_3_1 WU_3_0 WU_4_1 WU_4_0 WU_5_1 WU_5_0 INT_inh
_IO_23
INT_inh
_IO_45
80 NXP Semiconductors
33907/33908
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 0 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G WU_3_1 WU_3_0 WU_4_1 WU_4_0 WU_5_1 WU_5_0 INT_inh
_IO_23
INT_inh
_IO_45
Table 27. INIT IO_WU2. description and configuration of the bits (default value in bold)
WU_3_1:0
Description Wake-up configuration for IO_3
00 NO wake-up capability
01 Wake-up on rising edge only
10 Wake-up on falling edge only
11 Wake-up on any edge
Reset condition Power On Reset
WU_4_1:0
Description Wake-up configuration for IO_4
00 NO wake-up capability
01 Wake-up on rising edge only
10 Wake-up on falling edge only
11 Wake-up on any edge
Reset condition Power On Reset
WU_5_1:0
Description Wake-up configuration for IO_5
00 NO wake-up capability
01 Wake-up on rising edge only
10 Wake-up on falling edge only
11 Wake-up on any edge
Reset condition Power On Reset
INT_inh_IO_45
Description Inhibit the INT pulse for IO_4 & IO_5. IO_4 & IO_5 masked in IO_G. Avoid INT when used in FS
0 INT NOT masked
1INT masked
Reset condition Power On Reset
INT_inh_IO_23
Description Inhibit the INT pulse for IO_2 & IO_3. IO_2 & IO_3 masked in IO_G. Avoid INT when used in FS
0 INT NOT masked
1 INT masked
Reset condition Power On Reset
Table 26. INIT IO_WU2 register description (continued)
NXP Semiconductors 81
33907/33908
7.3.6 INIT INT
Table 28. INIT INT register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 1 0 0 0 1 1 0 P INT_dur
ation
INT_inh
_LIN
INT_inh
_all
INT_inh
_Vsns
INT_inh
_Vpre
INT_inh
_Vcore
INT_inh
_Vother
s
INT_inh
_CAN
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
INT_dur
ation
INT_inh
_LIN
INT_inh
_all
INT_inh
_Vsns
INT_inh
_Vpre
INT_inh
_Vcore
INT_inh
_Vother
s
INT_inh
_CAN
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
INT_dur
ation
INT_inh
_LIN
INT_inh
_all
INT_inh
_Vsns
INT_inh
_Vpre
INT_inh
_Vcore
INT_inh
_Vother
s
INT_inh
_CAN
Table 29. INIT INT. description and configuration of the bits (default value in bold)
INT_duration
Description Define the duration of the INTerrupt pulse
0 100 µs
1 25 µs
Reset condition Power On Reset
INT_inh_LIN
Description Inhibit the INT for LIN error bits
0 All INT sources
1 LIN error bits changed INHIBITED
Reset condition Power On Reset
INT_inh_all
Description Inhibit ALL the INT
0 All INT sources
1 All INT INHIBITED
Reset condition Power On Reset
INT_inh_Vsns
Description Inhibit the INT for VSNS_UV
0 All INT sources
1V
SNS_UV INT INHIBITED
Reset condition Power On Reset
INT_inh_Vpre
Description Inhibit the INT for VPRE status event (cf. register status Vreg1)
0 All INT sources
1V
PRE status changed INHIBITED
Reset condition Power On Reset
82 NXP Semiconductors
33907/33908
7.3.7 HW config
INT_inh_Vcore
Description Inhibit the INT for VCORE status event (cf. register status Vreg2)
0 All INT sources
1V
CORE status changed INHIBITED
Reset condition Power On Reset
INT_inh_Vothers
Description Inhibit the INT for VCCA / VAUX and VCAN status event (cf. register status Vreg2)
0 All INT sources
1V
CCA / VAUX / VCAN status changed INHIBITED
Reset condition Power On Reset
INT_inh_CAN
Description Inhibit the INT for CAN error bits
0 All INT sources
1 CAN error bits changed INHIBITED
Reset condition Power On Reset
Table 30. HW config register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI000 1 000000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
LS_det
ect
Vaux
not
used
Vcca_
PNP_d
etect
Vcca_
HW
Vaux_
HW 10DBG
Table 31. HW config. description and configuration of the bits (default value in bold)
LS_detect
Description Report the hardware configuration of VPRE (Buck only or Buck-Boost)
0 Buck-Boost
1 Buck only
Reset condition Power On Reset / Refresh after LPOFF
VAUX not used
Description Report if VAUX is used
0V
AUX is used (external PNP is assumed to be connected, VAUX can be switched OFF/ON through SPI)
1V
AUX is not used
Reset condition Power On Reset / Refresh after LPOFF
VCCA_PNP_DETECT
Description Report the connection of an external PNP on VCCA
0 External PNP connected
1 Internal MOSFET
Reset condition Power On Reset / Refresh after LPOFF
VCCA_HW
Description Report the hardware configuration for VCCA
0 3.3 V
1 5.0 V
Reset condition Power On Reset / Refresh after LPOFF
Table 29. INIT INT. description and configuration of the bits (default value in bold) (continued)
NXP Semiconductors 83
33907/33908
7.3.8 WU source
VAUX_HW
Description Report the hardware configuration for VAUX
0 5.0 V
1 3.3 V
Reset condition Power On Reset / Refresh after LPOFF
DBG
Description Report the configuration of the DEBUG mode
0 Normal operation
1 DEBUG mode selected
Reset condition Power On Reset / Refresh after LPOFF
Table 32. WU source register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI000 1 001000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
IO_5_
WU
IO_4_
WU
IO_3_
WU
IO_2_
WU
IO_1_
WU
IO_0_
WU 0Phy_W
U
Table 33. WU source. description and configuration of the bits (default value in bold)
IO_5_WU
Description Report a wake-up event from IO_5
0 No Wake-up
1 WU event detected
Reset condition Power On Reset / Read
IO_4_WU
Description Report a wake-up event from IO_4
0 No Wake-up
1 WU event detected
Reset condition Power On Reset / Read
IO_3_WU
Description Report a wake-up event from IO_3
0 No Wake-up
1 WU event detected
Reset condition Power On Reset / Read
IO_2_WU
Description Report a wake-up event from IO_2
0 No Wake-up
1 WU event detected
Reset condition Power On Reset / Read
IO_1_WU
Description Report a wake-up event from IO_1
0 No Wake-up
1 WU event detected
Reset condition Power On Reset / Read
Table 31. HW config. description and configuration of the bits (default value in bold) (continued)
84 NXP Semiconductors
33907/33908
7.3.9 IO input
IO_0_WU
Description Report a wake-up event from IO_0
0 No Wake-up
1 WU event detected
Reset condition Power On Reset / Read
Phy_WU
Description Report a wake-up event from CAN or LIN
0 No Wake-up
1 WU event detected
Reset condition Power On Reset / Read CAN_wu or/and LIN_wu
Table 34. IO input register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI000 1 011000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G IO_5 IO_4 0 IO_3 IO_2 0 IO_1 IO_0
Table 35. IO input. description and configuration of the bits
IO_5
Description Report IO_5 digital state in Normal mode. No update in LPOFF mode since wake-up features available
0 Low
1High
Reset condition Power On Reset
IO_4
Description Report IO_4 digital state in Normal mode. No update in LPOFF mode since wake-up features available
0 Low
1High
Reset condition Power On Reset
IO_3
Description Report IO_3 digital state in Normal mode. No update in LPOFF mode since wake-up features available
0 Low
1High
Reset condition Power On Reset
IO_2
Description Report IO_2 digital state in Normal mode. No update in LPOFF mode since wake-up features available
0 Low
1High
Reset condition Power On Reset
IO_1
Description Report IO_1 digital state in Normal mode. No update in LPOFF mode since wake-up features available
0 Low
1High
Reset condition Power On Reset
Table 33. WU source. description and configuration of the bits (default value in bold)(continued)
NXP Semiconductors 85
33907/33908
7.3.10 Status Vreg1
7.3.11 Status VREG2
IO_0
Description Report IO_0 digital state in Normal mode. No update in LPOFF mode since wake-up features available
0 Low
1High
Reset condition Power On Reset
Table 36. STATUS VREG1 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 00011 0 0 0 0 0 0 0 0 0 0 0
MISO SPI_
GWU CAN_
G
LIN_
GIO_G Vpre_
G
Vcore_
G
Vothers_
GIpFF Ilim_pre Twarn_pr
eBoB Vpre_stat
e00 0
Table 37. Status Vreg1. description and configuration of the bits (default value in bold)
IPFF
Description Input Power Feed Forward
0 Normal Operation
1 Ipff mode activated
Reset condition Power On Reset / Read
ILIM_PRE
Description Report a current limitation condition on VPRE
0 No current limitation (IPRE_PK < IPRE_LIM)
1 Current limitation (IPRE_PK > IPRE_LIM)
Reset condition Power On Reset / Read
TWARN_PRE
Description Report a thermal warning from VPRE
0 No thermal warning (TJ < TWARN_PRE)
1 Thermal warning (TJ > TWARN_PRE)
Reset condition Power On Reset / Read
BoB
Description Report a running mode of VPRE
0Buck
1Boost
Reset condition Power On Reset
VPRE_STATE
Description Report the activation state of VPRE SMPS
0SMPS OFF
1SMPS ON
Reset condition Power On Reset
Table 38. STATUS VREG2 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI000 1 101000000000
Table 35. IO input. description and configuration of the bits(continued)
86 NXP Semiconductors
33907/33908
7.3.12 Diag Vreg1
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
Ilim_co
re
Twarn_
core
Vcore_
state
Twarn_
cca
Ilim_cc
a
Ilim_au
x
Ilim_ca
n0
Table 39. Status Vreg2. description and configuration of the bits (default value in bold)
ILIM_CORE
Description Report a current limitation condition on VCORE
0 No current limitation (ICORE_PK < ICORE_LIM)
1 Current limitation (ICORE_PK > ICORE_LIM)
Reset condition Power On Reset / Read
TWARN_CORE
Description Report a thermal warning from VCORE
0 No thermal warning (TJ < TWARN_CORE)
1 Thermal warning (TJ > TWARN_CORE)
Reset condition Power On Reset / Read
VCORE_STATE
Description Report the activation state of VCORE SMPS
0 SMPS OFF
1 SMPS ON
Reset condition Power On Reset
TWARN_CCA
Description Report a thermal warning from VCCA. Available only for internal pass MOSFET
0 No thermal warning (TJ < TWARN_CCA)
1 Thermal warning (TJ > TWARN_CCA)
Reset condition Power On Reset
ILIM_CCA
Description Report a current limitation condition on VCCA
0 No current limitation (ICCA < ICCA_LIM)
1 Current limitation (ICCA > ICCA_LIM)
Reset condition Power On Reset / Read
ILIM_AUX
Description Report a current limitation condition on VAUX
0 No current limitation (IAUX < IAUX_LIM)
1 Current limitation (IAUX > IAUX_LIM)
Reset condition Power On Reset / Read
ILIM_CAN
Description Report a current limitation condition on VCAN
0 No current limitation (ICAN < ICAN_LIM)
1 Current limitation (ICAN > ICAN _LIM)
Reset condition Power On Reset / Read
Table 40. DIAG VREG1 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI000 1 110000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
Vsns_u
v
Vsup_u
v_7
Tsd_pr
e
Vpre_
OV
Vpre_u
v
Tsd_co
re
Vcore_
FB_OV
Vcore_
FB_uv
Table 38. STATUS VREG2 register description
NXP Semiconductors 87
33907/33908
7.3.13 Diag Vreg2
Table 41. Diag Vreg1. description and configuration of the bits (default value in bold)
VSNS_UV
Description Detection of VBATTERY below VSNS_UV
0V
BAT > VSNS_UV
1V
BAT < VSNS_UV
Reset condition Power On Reset / Read
VSUP_UV_7
Description Detection of VSUP below VSUP_UV_7
0V
SUP > VSUP_UV_7
1V
SUP < VSUP_UV_7
Reset condition Power On Reset / Read
TSD_PRE
Description Thermal shutdown of VPRE
0No TSD (T
J < TSD_PRE)
1 TSD occurred (TJ > TSD_PRE)
Reset condition Power On Reset / Read
VPRE_OV
Description VPRE overvoltage detection
0 No overvoltage (VPRE < VPRE_OV)
1 Overvoltage detected (VPRE > VPRE_OV)
Reset condition Power On Reset
VPRE_UV
Description VPRE undervoltage detection
0 No undervoltage (VPRE > VPRE_UV)
1 Undervoltage detected (VPRE < VPRE_UV)
Reset condition Power On Reset / Read
TSD_CORE
Description Thermal shutdown of VCORE
0No TSD (T
J < TSD_CORE)
1 TSD occurred (TJ > TSD_CORE)
Reset condition Power On Reset / Read
VCORE_FB_OV
Description VCORE overvoltage detection
0 No overvoltage (VCORE_FB < VCORE_FB_OV)
1 Overvoltage detected (VCORE_FB > VCORE_FB_OV)
Reset condition Power On Reset / Read
VCORE_FB_UV
Description VCORE undervoltage detection
0 No undervoltage (VCORE_FB > VCORE_FB_UV)
1 Undervoltage (VCORE_FB < VCORE_FB_UV)
Reset condition Power On Reset / Read
Table 42. DIAG VREG2 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI000 1 111000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
Tsd_C
an
Vcan_
OV
Vcan_u
v0Tsd_au
x
Ilim_au
x_off
Vaux_
OV
Vaux_u
v
88 NXP Semiconductors
33907/33908
7.3.14 Diag Vreg3
Table 43. Diag Vreg2. description and configuration of the bits (default value in bold)
TSD_CAN
Description Thermal shutdown of VCAN
0NO TSD (T
J < TSD_CAN)
1 TSD occurred (TJ > TSD_CAN)
Reset condition Power On Reset / Read
VCAN_OV
Description VCAN Overvoltage detection
0 No Overvoltage (VCAN < VCAN_OV)
1 Overvoltage detected (VCAN > VCAN_OV)
Reset condition Power On Reset / Read
VCAN_UV
Description VCAN undervoltage detection
0 No undervoltage (VCAN > VCAN_UV)
1 Undervoltage detected (VCAN < VCAN_UV)
Reset condition Power On Reset / Read
TSD_AUX
Description Thermal shutdown of VAUX
0 No TSD (TJ < TSD_AUX)
1 TSD occurred (TJ > TSD_AUX)
Reset condition Power On Reset
ILIM_AUX_OFF
Description Maximum current limitation duration
0T
_LIMITATION < TAUX_LIM_OFF
1T
_LIMITATION >TAUX_LIM_OFF
Reset condition Power On Reset / Read
VAUX_OV
Description VAUX overvoltage detection
0 No overvoltage (VAUX < VAUX_OV)
1 Overvoltage detected (VAUX > VAUX_OV)
Reset condition Power On Reset / Read
VAUX_UV
Description VAUX undervoltage detection
0 No undervoltage (VAUX > VAUX_UV)
1 Undervoltage detected (VAUX < VAUX_UV)
Reset condition Power On Reset / Read
Table 44. DIAG VREG3 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI001 0 000000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
Tsd_cc
a0Ilim-
cca_off 0Vcca_
OV 0Vcca_
UV 0
NXP Semiconductors 89
33907/33908
Table 45. Diag Vreg3. description and configuration of the bits (default value in bold)
TSD_CCA
Description Thermal shutdown of VCCA
0NO TSD (T
J < TSD_CCA)
1 TSD occurred (TJ > TSD_CCA)
Reset condition Power On Reset / Read
ILIM_CCA_OFF
Description Maximum current limitation duration. Available only when an external PNP is connected
0T
_LIMITATION < TCCA_LIM_OFF
1T
_LIMITATION >TCCA_LIM_OFF
Reset condition Power On Reset / Read
VCCA_OV
Description VCCA overvoltage detection
0 No overvoltage (VCCA < VCCA_OV)
1 Overvoltage detected (VCCA > VCCA_OV)
Reset condition Power On Reset / Read
VCCA_UV
Description VCCA undervoltage detection
0 No undervoltage (VCCA > VCCA_UV)
1 Undervoltage detected (VCCA < VCCA_UV)
Reset condition Power On Reset
90 NXP Semiconductors
33907/33908
7.3.15 Diag CAN1
Table 46. DIAG CAN1 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI001 0 001000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
CANH_
batt
CANH_
gnd
CANL_
batt
CANL_
gnd
CAN_d
ominan
t
0
RXD_r
ecessiv
e
TXD_d
ominan
t
Table 47. Diag CAN1. description and configuration of the bits (default value in bold)
CANH_batt
Description CANH short-circuit to battery detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
CANH_gnd
Description CANH short-circuit to GND detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
CANL_batt
Description CANL short-circuit to battery detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
CANL_gnd
Description CANL short-circuit to GND detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
CAN_dominant
Description CAN Bus dominant clamping detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
RXD_recessive
Description RXD recessive clamping detection (short-circuit to 5.0 V)
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
TXD_dominant
Description TXD dominant clamping detection (short-circuit to GND)
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
NXP Semiconductors 91
33907/33908
7.3.16 Diag CAN_LIN
Table 48. DIAG CAN_LIN register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0010010000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
LIN_do
minant
TXDL_
domina
nt
0
RXDL_
recessi
ve
LIN_O
T0CAN_O
T
CAN_O
C
Table 49. Diag CAN_LIN. description and configuration of the bits (default value in bold)
LIN_dominant
Description LIN bus dominant clamping detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
TXDL_dominant
Description LIN TXD dominant clamping detection (short-circuit to GND)
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
RXDL_recessive
Description LIN RXD recessive clamping detection (short-circuit to 5.0 V)
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
LIN_OT
Description LIN overtemperature detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
CAN_OT
Description CAN overtemperature detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
CAN_OC
Description CAN overcurrent detection
0 No failure
1 Failure detected
Reset condition Power On Reset / Read
92 NXP Semiconductors
33907/33908
7.3.17 Diag SPI
Table 50. DIAG SPI register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0010011000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G SPI_err 0 SPI_clk 0 SPI_re
q0SPI_pa
rity 0
Table 51. Diag SPI. description and configuration of the bits (default value in bold)
SPI_err
Description Secured SPI communication check
0No error
1 Error detected in the secured bits
Reset condition Power On Reset / Read
SPI_CLK
Description SCLK error detection
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or > 16)
Reset condition Power On Reset / Read
SPI_req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in normal mode, wrong address)
0No error
1 SPI violation
Reset condition Power On Reset / Read
SPI_parity
Description SPI parity bit error detection
0 Parity bit OK
1 Parity bit error
Reset condition Power On Reset / Read
NXP Semiconductors 93
33907/33908
7.3.18 Mode
7.3.19 Vreg mode
Table 52. Mode register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1010101P00
Goto_L
POFF
INT_re
quest
Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
Reserv
ed
Reserv
ed
Reserv
ed
Reserv
ed INIT Normal Reserv
ed
Reserv
ed
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0010101000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
Reserv
ed
Reserv
ed
Reserv
ed
Reserv
ed
INIT Normal Reserv
ed
Reserv
ed
Table 53. Mode. description and configuration of the bits (default value in bold)
Goto_LPOFF
Description Configure the device in Low Power mode VREG OFF (LPOFF)
0 No action
1 LPOFF mode
Reset condition Power On Reset
INIT
Description Report if INIT mode of the main logic state machine is entered
0 Not in INIT mode
1 INIT MODE
Reset condition Power On Reset
Normal
Description Report if Normal mode of the main logic state machine is entered
0 Not in Normal mode
1 Normal mode
Reset condition Power On Reset
INT_request
Description Request for an INT pulse
0 No Request
1 Request for an INT pulse
Reset condition Power On Reset
Secure 3:0
Description Secured bits based on write bits
secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
Table 54. VREG mode register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
94 NXP Semiconductors
33907/33908
7.3.20 IO_OUT-AMUX
MOSI101 0 110P
Vcore_
EN
Vcca_
EN
Vaux_
EN
Vcan_
EN
Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
Reserv
ed
Reserv
ed
Reserv
ed
Reserv
ed
Vcore_
EN
Vcca_
EN
Vaux_
EN
Vcan_
EN
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI001 0 110000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
Reserv
ed
Reserv
ed
Reserv
ed
Reserv
ed
Vcore_
EN
Vcca_
EN
Vaux_
EN
Vcan_
EN
Table 55. VREG mode. description and configuration of the bits (default value in bold)
VCORE_EN
Description VCORE control (Switch OFF NOT recommended if VCORE is SAFETY critical)
0 DISABLED
1 ENABLED
Reset condition Power On Reset
VCCA_EN
Description VCCA control (Switch OFF NOT recommended if VCCA is SAFETY critical)
0 DISABLED
1 ENABLED
Reset condition Power On Reset
VAUX_EN
Description VAUX control (Switch OFF NOT recommended if VAUX is SAFETY critical)
0 DISABLED
1 ENABLED
Reset condition Power On Reset
VCAN_EN
Description VCAN control
0 DISABLED
1 ENABLED
Reset condition Power On Reset
Secure 3:0
Description Secured bits based on write bits
secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
Table 56. IO_OUT-AMUX register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1010111P
IO_out
_4_EN
IO_out
_4
IO_out
_5_EN
IO_out
_5 0Amux_
2
Amux_
1
Amux_
0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
IO_out
_4_EN
IO_oou
t_4
IO_out
_5_EN
IO_out
_5
Reserv
ed
Amux_
2
Amux_
1
Amux_
0
Table 54. VREG mode register description
NXP Semiconductors 95
33907/33908
7.3.21 CAN_LIN mode
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0010111000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
IO_out
_4_EN
IO_out
_4
IO_out
_5_EN
IO_out
_5
Reserv
ed
Amux_
2
Amux_
1
Amux_
0
Table 57. IO_OUT-AMUX. description and configuration of the bits (default value in bold)
IO_out_4_EN
Description Enable the output gate driver capability for IO_4
0 High-impedance (IO_4 configured as input)
1 ENABLED (IO_4 configured as output gate driver)
Reset condition Power On Reset
IO_out_4
Description Configure IO_4 output gate driver state
0LOW
1HIGH
Reset condition Power On Reset
IO_out_5_EN
Description Enable the output gate driver capability for IO_5
0 High-impedance (IO_5 configured as input)
1 ENABLED (IO_5 configured as output gate driver)
Reset condition Power On Reset
IO_out_5
Description Configure IO_5 output gate driver state
0LOW
1HIGH
Reset condition Power On Reset
AMUX_2:0
Description Select AMUX output
000 Vref
001 Vsns wide range
010 IO_0 wide range
011 IO_1 wide range
100 Vsns tight range
101 IO_0 tight range
110 IO_1 tight range
111 Die Temperature Sensor
Reset condition Power On Reset
Table 58. CAN_LIN mode register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI101 1 000P
CAN_
mode_
1
CAN_
mode_
0
CAN_a
uto_dis
LIN_m
ode_1
LIN_m
ode_0
LIN_au
to_dis
00
Table 56. IO_OUT-AMUX register description
96 NXP Semiconductors
33907/33908
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
CAN_
mode_
1
CAN_
mode_
0
CAN_a
uto_dis
LIN_m
ode_1
LIN_m
ode_0
LIN_au
to_dis
CAN_w
u
LIN_wu
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI001 1 000000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
CAN_
mode_
1
CAN_
mode_
0
CAN_a
uto_dis
LIN_m
ode_1
LIN_m
ode_0
LIN_au
to_dis
CAN_w
u
LIN_wu
Table 59. CAN_LIN mode. description and configuration of the bits (default value in bold)
CAN_mode_1:0
Description Configure the CAN mode
00 Sleep / NO wake-up capability
01 LISTEN ONLY
10 Sleep / Wake-up capability
11 Normal operation mode
Reset condition Power On Reset
CAN_auto_dis
Description Automatic CAN Tx disable
0 NO auto disable
1 Reset CAN_mode from “11” to “01” on CAN over temp or TXD dominant or RXD recessive event
Reset condition Power On Reset
LIN_mode_1:0
Description Configure the LIN mode
00 Sleep / NO wake-up capability
01 LISTEN ONLY
10 Sleep / Wake-up capability
11 Normal operation mode
Reset condition Power On Reset
LIN_auto_dis
Description Automatic LIN Tx Disable
0 No Auto disable
1 Reset LIN_mode from “11” to “01” on LIN over temp or TXDL dominant or RXDL recessive event
Reset condition
CAN_wu
Description Report a wake-up event from the CAN
0 No wake-up
1 Wake-up detected
Reset condition Power On Reset / Read
LIN_WU
Description Report a wake-up event from the LIN
0 No wake-up
1 Wake-up detected
Reset condition Power On Reset / Read
Notes
33. CAN mode is automatically configured to “sleep + wake-up capability[10]” if CAN mode was different than “sleep + no wake-up capability [00]”
before the device enters in LPOFF. After LPOFF, the initial CAN mode prior to enter LPOFF is restored.
Table 58. CAN_LIN mode register description
NXP Semiconductors 97
33907/33908
7.3.22 Can_Mode_2
7.3.23 INIT SUPERVISOR1
Table 60. CAN_MODE_2 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1011001P000
Vcan_
OV_Mo
n
secure
_3
secure
_2
secure
_1
secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0000
Vcan_
OV_Mo
n
Reserv
ed
Reserv
ed
Reserv
ed
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0011001000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 0000
Vcan_
OV_Mo
n
Reserv
ed
Reserv
ed
Reserv
ed
Table 61. CAN_MODE_2. description and configuration of the bits (default value in bold)
Vcan_OV_Mon
Description VCAN OV Monitoring
0OFF. V
CAN OV is not monitored. Flag is ignored
1ON. V
CAN OV flag is under monitoring. In case of OV the VCAN regulator is switched OFF.
Reset condition Power On Reset
Secure 3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
Table 62. INIT SUPERVISOR1 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1100001P
Vcore_
FS1
Vcore_
FS_0
Vcca_F
S_1
Vcca_F
S_0
secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_Req
SPI_FS
_Parity
Vcore_
FS1
Vcore_
FS_0
Vcca_F
S_1
Vcca_F
S_0
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0100001000000000
98 NXP Semiconductors
33907/33908
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_Req
SPI_FS
_Parity
Vcore_
FS1
Vcore_
FS_0
Vcca_F
S_1
Vcca_F
S_0
Table 63. INIT SUPERVISOR1. description and configuration of the bits (default value in bold)
Vcore_FS1:0
Description VCORE safety input.
00 No effect of VCORE_FB_OV and VCORE_FB_UV on RSTb and FSxx
01 VCORE_FB_OV DOES HAVE an impact on RSTb and FSxx. VCORE_FB_UV DOES HAVE an impact on RSTb
only
10 VCORE_FB_OV DOES HAVE an impact on RSTb and FSxx. No effect of VCORE_FB_UV on RSTb and FSxx
11 Both VCORE_FB_OV and VCORE_FB_UV DO HAVE an impact on RSTb and FSxx
Reset condition Power On Reset
Vcca_FS1:0
Description VCCA safety input.
00 No effect of VCCA_OV and VCCA_UV on RSTb and FSxx
01 VCCA_OV DOES HAVE an impact on RSTb and FSxx. VCCA_UV DOES HAVE an impact on RSTb only
10 VCCA_OV DOES HAVE an impact on RSTb and FSxx. No effect of VCCA_UV on RSTb and FSxx
11 Both VCCA_OV and VCCA_UV DO HAVE an impact on RSTb and FSxx
Reset condition Power On Reset
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
SPI_FS_err
Description Secured SPI communication check, concerns Fail-safe logic only
0No error
1 Error detected in the secured bits
Reset condition Power On Reset
SPI_FS_CLK
Description SCLK error detection, concerns internal error in fail-safe logic only and external errors (at pin level) for both
main and fail-safe logics. Other errors flagged by the SPI_CLK_ bit
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or >16)
Reset condition Power On Reset
SPI_FS_Req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in Normal mode, wrong address), concerns
fail-safe logic only.
0No error
1 SPI violation
Reset condition Power On Reset
SPI_FS_Parity
Description SPI parity bit error detection, concerns fail-safe logic only
0 Parity bit OK
1Parity bit ERROR
Reset condition Power On Reset
Table 62. INIT SUPERVISOR1 register description
NXP Semiconductors 99
33907/33908
7.3.24 INIT SUPERVISOR2
Table 64. INIT SUPERVISOR2 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1100010P
Vaux_F
S1
Vaux_F
S_0 0 DIS_8s Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity 0 DIS_8s Vaux_F
S1
Vaux_F
S_0
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0100010000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity 0 DIS_8s Vaux_F
S1
Vaux_F
S_0
Table 65. INIT SUPERVISOR2. description and configuration of the bits (default value in bold)
Vaux_FS1:0
Description VAUX safety input.
00 No effect of VAUX_OV and VAUX_UV on RSTb and FSxx
01 VAUX_OV DOES HAVE an impact on RSTb and FSxx. VAUX_UV DOES HAVE an impact on RSTb only
10 VAUX_OV DOES HAVE an impact on RSTb and FSxx. No effect of VAUX_UV on RSTb and FSxx
11 Both VAUX_OV and VAUX_UV DO HAVE an impact on RSTb and FSxx
Reset condition Power On Reset
DIS_8s
Description Disable the 8.0 s timer used to enter Deep Fail-safe mode
0 ENABLED
1 DISABLED
Reset condition Power On Reset
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
SPI_FS_err
Description Secured SPI communication check, concerns fail-safe logic only.
0 No error
1 Error detected in the secured bits
Reset condition Power On Reset
SPI_FS_CLK
Description SCLK error detection, concerns internal error in fail-safe logic only and external errors (at pin level) for both
main and fail-safe logics. Other errors flagged by SPI_CLK_ bit
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or >16)
Reset condition Power On Reset
100 NXP Semiconductors
33907/33908
SPI_FS_Req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in normal mode, wrong address), concerns
fail-safe Logic only
0No error
1 SPI violation
Reset condition Power On Reset
SPI_FS_Parity
Description SPI parity bit error detection, concerns fail-safe logic only
0 Parity bit OK
1Parity bit ERROR
Reset condition Power On Reset
Table 65. INIT SUPERVISOR2. description and configuration of the bits (default value in bold) (continued)
NXP Semiconductors 101
33907/33908
7.3.25 INIT SUPERVISOR3
Table 66. INIT SUPERVISOR3 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1100011P0
Vcca_5
D
Vaux_5
D0Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity 0Reserv
ed
Vcca_5
D
Vaux_5
D
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0100011000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity 0Reserv
ed
Vcca_5
D
Vaux_5
D
Table 67. INIT SUPERVISOR3. description and configuration of the bits (default value in bold)
VCCA_5D
Description Configure the VCCA undervoltage in degraded mode. Only valid for 5.0 V
0 Normal 5.0 V undervoltage detection threshold (VCCA_UV_5)
1 Degraded mode, i.e lower undervoltage detection threshold applied (VCCA_UV_D)
Reset condition Power On Reset
VAUX_5D
Description Configure the VAUX undervoltage in degraded mode. Only valid for 5.0 V
0 Normal 5.0 V undervoltage detection threshold (VAUX_UV_5)
1 Degraded mode, i.e lower undervoltage detection threshold applied (VAUX_UV_5D)
Reset condition Power On Reset
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2= NOT(bit4)
Secured_1=bit7
Secured_0=bit6
SPI_FS_err
Description Secured SPI communication check, concerns fail-safe logic only
0 No error
1 Error detected in the secured bits
Reset condition Power On Reset
SPI_FS_CLK
Description SCLK error detection, concerns internal error in fail-safe logic only and external errors (at pin level) for both
main and fail-safe logics. Other errors flagged by the SPI_CLK_ bit
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or >16)
Reset condition Power On Reset
SPI_FS_Req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in normal mode, wrong address), concerns
fail-safe logic only
0 No error
1SPI violation
Reset condition Power On Reset
102 NXP Semiconductors
33907/33908
7.3.26 Init FSSM1
SPI_FS_Parity
Description SPI parity bit error detection, concerns fail-safe logic only
0 Parity bit OK
1 Parity bit ERROR
Reset condition Power On Reset
Table 68. INIT FSSM1 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI110 0 100P
IO_01_
FS
IO_1_F
S
IO_45_
FS
RSTb_l
ow
Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
SPI_F
S_err
SPI_F
S_CLK
SPI_F
S_req
SPI_F
S_Parit
y
IO_01_
FS
IO_1_F
S
IO_45_
FS
RSTb_l
ow
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI010 0 100000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
SPI_F
S_err
SPI_F
S_CLK
SPI_F
S_req
SPI_F
S_Parit
y
IO_01_
FS
IO_1_F
S
IO_45_
FS
RSTb_l
ow
Table 69. INIT FSSM1. description and configuration of the bits (default value in bold)
IO_01_FS
Description Configure the couple of IO_1:0 as safety inputs
0NOT SAFETY
1 SAFETY CRITICAL
Reset condition Power On Reset
IO_1_FS
Description Configure IO_1 as safety inputs
0NOT SAFETY
1 SAFETY CRITICAL (External resistor bridge monitoring active)
Reset condition Power On Reset
IO_45_FS
Description Configure the couple of IO_5:4 as safety inputs
0NOT SAFETY
1 SAFETY CRITICAL
Reset condition Power On Reset
RSTb_low
Description Configure the Rstb LOW duration time
0 10 ms
1 1.0 ms
Reset condition Power On Reset
Table 67. INIT SUPERVISOR3. description and configuration of the bits (default value in bold) (continued)
NXP Semiconductors 103
33907/33908
7.3.27 Init FSSM2
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
SPI_FS_err
Description Secured SPI communication check, concerns fail-safe logic only
0 No error
1 Error detected in the secured bits
Reset condition Power On Reset
SPI_FS_CLK
Description SCLK error detection, concerns internal error in fail-safe logic only and external errors (at pin level) for both
main and fail-safe logics. Other errors flagged by the SPI_CLK_ bit
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or >16)
Reset condition Power On Reset
SPI_FS_Req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in normal mode, wrong address), concerns
fail-safe logic only
0 No error
1 SPI violation
Reset condition Power On Reset
SPI_FS_Parity
Description SPI parity bit error detection, concerns fail-safe logic only
0 Parity bit OK
1 Parity bit ERROR
Reset condition Power On Reset
Table 70. INIT FSSM2 register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1100101P
RSTb_
err_FS
IO_23_
FS PS 0 Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity
RSTb_
err_FS
IO_23_
FS PS 0
Table 69. INIT FSSM1. description and configuration of the bits (default value in bold) (continued)
104 NXP Semiconductors
33907/33908
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0100101000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity
RSTb_
err_FS
IO_23_
FS PS 0
Table 71. INIT FSSM2. description and configuration of the bits (default value in bold)
IO_23_FS
Description Configure the couple of IO_3:2 as safety inputs for FCCU monitoring
0 NOT SAFETY
1 SAFETY CRITICAL
Reset condition Power On Reset
RSTb_err_FS
Description Configure the values of the RSTb error counter
0 intermediate = 3; final = 6
1 intermediate = 1; final = 2
Reset condition Power On Reset
PS
Description Configure the FCCU polarity
0 Fccu_eaout_1:0 active HIGH
1 Fccu_eaout_1:0 active LOW
Reset condition Power On Reset
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
SPI_FS_err
Description Secured SPI communication check, concerns fail-safe logic only
0No error
1 Error detected in the secured bits
Reset condition Power On Reset
SPI_FS_CLK
Description SCLK error detection, concerns internal error in fail-safe logic only and external errors (at pin level) for both
main and fail-safe logics. Other errors flagged by SPI_CLK_ bit
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or >16)
Reset condition Power On Reset
SPI_FS_Req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in normal mode, wrong address), concerns
fail-safe Logic only
0No error
1 SPI violation
Reset condition Power On Reset
SPI_FS_Parity
Description SPI parity bit error detection, concerns fail-safe logic only
0 Parity bit OK
1 Parity bit ERROR
Reset condition Power On Reset
Table 70. INIT FSSM2 register description (continued)
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7.3.28 WD window
Table 72. WD window register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1100110P
WD_wi
ndow3
WD_wi
ndow2
WD_wi
ndow1
WD_wi
ndow0
Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity
WD_wi
ndow3
WD_wi
ndow2
WD_wi
ndow1
WD_wi
ndow0
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0100110000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
SPI_FS
_err
SPI_FS
_CLK
SPI_FS
_req
SPI_FS
_Parity
WD_wi
ndow3
WD_wi
ndow2
WD_wi
ndow1
WD_wi
ndow0
Any WRITE command to the WD_window in the Normal mode must be followed by a READ command to verify the correct change of the WD window
duration
Table 73. WD window. description and configuration of the bits (default value in bold)
WD_Window_3:0
Description Configure the watchdog window duration. Duty cycle if set to 50%
0000 DISABLE
0001 1.0 ms
0010 2.0 ms
0011 3.0 ms
0100 4.0 ms
0101 6.0 ms
0110 8.0 ms
0111 12 ms
1000 16 ms
1001 24 ms
1010 32 ms
1011 64 ms
1100 128 ms
1101 256 ms
1110 512 ms
1111 1024 ms
Reset condition Power On Reset
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
106 NXP Semiconductors
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7.3.29 WD_LFSR
SPI_FS_err
Description Secured SPI communication check, concerns fail-safe logic only
0No error
1 Error detected in the secured bits
Reset condition Power On Reset
SPI_FS_CLK
Description SCLK error detection, concerns internal error in fail-safe logic only and external errors (at pin level) for both
main and fail-safe logics. Other errors flagged by the SPI_CLK bit.
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or >16)
Reset condition Power On Reset
SPI_FS_Req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in normal mode, wrong address), concerns
fail-safe logic only
0No error
1 SPI violation
Reset condition Power On Reset
SPI_FS_Parity
Description SPI parity bit error detection, concerns fail-safe logic only
0 Parity bit OK
1 Parity bit ERROR
Reset condition Power On Reset
Table 74. WD LFSR register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI110 0 111P
WD_LF
SR_7
WD_LF
SR_6
WD_LF
SR_5
WD_LF
SR_4
WD_LF
SR_3
WD_LF
SR_2
WD_LF
SR_1
WD_LF
SR_0
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
WD_LF
SR_7
WD_LF
SR_6
WD_LF
SR_5
WD_LF
SR_4
WD_LF
SR_3
WD_LF
SR_2
WD_LF
SR_1
WD_LF
SR_0
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI010 0 111000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
WD_LF
SR_7
WD_LF
SR_6
WD_LF
SR_5
WD_LF
SR_4
WD_LF
SR_3
WD_LF
SR_2
WD_LF
SR_1
WD_LF
SR_0
Table 75. WD LFSR. description and configuration of the bits
WD_LFSR_7:0
Description WD 8 bits LFSR value. Used to write the seed at any time
0... bit7:bit0: 10110010 default value at start-up or after a Power on reset: 0xB2 (34), (35)
1...
Reset condition Power On Reset
Notes
34. Value Bit7:Bit0: 1111 1111 is prohibited.
35. During a write command, MISO reports the previous register content.
Table 73. WD window. description and configuration of the bits (default value in bold) (continued)
NXP Semiconductors 107
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7.3.30 WD answer
Table 76. WD answer register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1101000P
WD_an
swer_7
WD_an
swer_6
WD_an
swer_5
WD_an
swer_4
WD_an
swer_3
WD_an
swer_2
WD_an
swer_1
WD_an
swer_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G RSTb FS0 WD FS0_G IO_FS_
G0FS_EC
C
FS_reg
_Ecc
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0101000000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G RSTb FS0 WD FS0_G IO_FS_
G0FS_EC
C
FS_reg
_Ecc
Table 77. WD answer. description and configuration of the bits (default value in bold)
WD_answer_7:0
Description WD answer from the MCU
0... Answer = (NOT(((LFSR x 4)+6)-4))/4
1...
Reset condition Power On Reset / RSTb LOW
RSTb
Description Report a reset event
0 No Reset
1 Reset occurred
Reset condition Power On Reset / Read
FS0b
Description Report a fail-safe event
0 No fail-safe
1 Fail safe event occurred / Also default state at power-up after LPOFF as FS0b is asserted low
Reset condition Power On Reset / Read
WD
Description Report a watchdog refresh ERROR
0 WD refresh OK
1 WRONG WD refresh
Reset condition Power On Reset / Read
FS0_G
Description Report a fail-safe output failure
0 No failure
1Failure
Reset condition Power On Reset / Read
IO_FS_G
Description Report an IO monitoring error
0 No error
1 Error detected
Reset condition Power On Reset
108 NXP Semiconductors
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FS0_G = RSTB_short_high or FS0B_short_high or FS0B_short_low
IO_FS_G = IO_01_fail or IO_1_fail or IO_23_fail or IO_45_fail
Values of the three registers WD_answer, WD_counter, and DIAG_FS2 are updated at the end of any SPI access to one of these
registers. To always get up to date values, it is recommended to make two consecutive SPI accesses to these registers. Example: read
WD_answer, read again WD_answer, read WD_counter, read DIAG_FS2. The first read updates the three registers and the second read
report the latest information.
7.3.31 Fail-safe out (FS_out)
FS_ECC
Description Report an error code correction on fail-safe state machine
0No ECC
1 ECC done
Reset condition Power On Reset / Read
FS_req_ECC
Description Report an error code correction on fail-safe registers
0No ECC
1 ECC done
Reset condition Power On Reset / Read
Table 78. Fail-safe out register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1101001P
FS_out
_7
FS_out
_6
FS_out
_5
FS_out
_4
FS_out
_3
FS_out
_2
FS_out
_1
FS_out
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 00000000
Table 79. Fail-safe out. description and configuration of the bits
FS_out_7:0
Description Secured 8 bits word to release the FS0b
0... Depend on LFSR_out value and calculation
1...
Reset condition Power On Reset -> Default = 00h
Table 77. WD answer. description and configuration of the bits (default value in bold) (continued)
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7.3.32 RSTB request
7.3.33 INIT_WD
Table 80. RSTB request register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI1101010P00
RSTb_r
equest 0Secure
_3
Secure
_2
Secure
_1
Secure
_0
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G 00000000
Table 81. RSTB request. description and configuration of the bits (default value in bold)
RSTb_request
Description Request a RSTb low pulse
0 No request
1 Request a RSTb low pulse
Reset condition Power On Reset / When RSTb done
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
Table 82. INIT WD register description
Write
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI110 1 011P
WD_C
NT_err
or_1
WD_C
NT_err
or_0
WD_C
NT_refr
esh_1
WD_C
NT_refr
esh_0
secure
3
secure
2
secure
1
secure
0
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
SPI_F
S_err
SPI_F
S_CLK
SPI_F
S_Req
SPI_F
S_Parit
y
WD_C
NT_err
or_1
WD_C
NT_err
or_0
WD_C
NT_refr
esh_1
WD_C
NT_refr
esh_0
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI010 1 011000000000
MISO SPI_G WU CAN_
GLIN_G IO_G Vpre_
G
Vcore_
G
Vother
s_G
SPI_F
S_err
SPI_F
S_CLK
SPI_F
S_Req
SPI_F
S_Parit
y
WD_C
NT_err
or_1
WD_C
NT_err
or_0
WD_C
NT_refr
esh_1
WD_C
NT_refr
esh_0
110 NXP Semiconductors
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Table 83. INIT WD. description and configuration of the bits (default value in bold)
WD_CNT_error_1:0
Description Configure the maximum value of the WD error counter
00 6
01 6
10 4
11 2
Reset Condition Power On Reset
WD_CNT_refresh_
1:0
Description Configure the maximum value of the WD refresh counter
00 6
01 4
10 2
11 1
Reset Condition Power On Reset
Secure3:0
Description Secured bits based on write bits
Secured_3 = NOT(bit5)
Secured_2 = NOT(bit4)
Secured_1 = bit7
Secured_0 = bit6
SPI_FS_err
Description Secured SPI communication check, concerns fail-safe logic only
0No error
1 Error detected in the secured bits
Reset condition Power On Reset
SPI_FS_CLK
Description SCLK error detection, concerns internal error in fail-safe logic only and external errors (at pin level) for both
main and fail-safe logics. Other errors flagged by the SPI_CLK bit.
0 16 clock cycles during NCS low
1 Wrong number of clock cycles (<16 or >16)
Reset condition Power On Reset
SPI_FS_Req
Description Invalid SPI access (Wrong Write or Read, Write to INIT registers in normal mode, wrong address), concerns
fail-safe logic only
0No error
1 SPI violation
Reset condition Power On Reset
SPI_FS_Parity
Description SPI parity bit error detection, concerns fail-safe logic only
0 Parity bit OK
1Parity bit ERROR
Reset condition Power On Reset
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7.3.34 Diag FS1
7.3.35 WD counter
Table 84. DIAG FS1 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0101100000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
RSTb_
ext
RSTb_
diag 0FS0b_
diag_1
FS0b_
diag_0 000
Table 85. Diag FS1. description and configuration of the bits (default value in bold)
RSTb_diag
Description Report a RSTb short-circuit to HIGH
0 No Failure
1 Short-circuit HIGH
Reset condition Power On Reset / Read
RSTb_ext
Description Report an external RSTb
0 No external RSTb
1 External RSTb
Reset condition Power On Reset / Read
FS0b_diag_1:0
Description Report a failure on FS0b
00 No Failure
01 Short-circuit LOW / open load
1X Short-circuit HIGH
Reset condition Power On Reset / Read
Table 86. WD counter register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI 01011 0 1 0 0 0 0 0 0 0 0 0
MISO SPI_
GWU CAN_
G
LIN_
GIO_G Vpre_
G
Vcore_
G
Vothers_
G
WD_err
_2
WD_err
_1
WD_err
_0 0WD_ref
resh_2
WD_refr
esh_1
WD_refr
esh_0 0
112 NXP Semiconductors
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7.3.36 Diag FS2
Table 87. WD counter. description and configuration of the bits (default value in bold)
WD_err_2:0
Description Report the value of the watchdog error counter
000 From 0 to 5 (6 generates a Reset and this counter is reset to 0)
to 110
Reset condition Power On Reset
WD_refresh_2:0
Description Report the value of the watchdog refresh counter
000 From 0 to 6 (7 generate a decrease of the RST_err_cnt and this counter is reset to 0)
to 111
Reset condition Power On Reset
Table 88. DIAG FS2 register description
Read
bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
MOSI0101110000000000
MISO SPI_G WU CAN_G LIN_G IO_G Vpre_G Vcore_
G
Vothers
_G
RSTb_
err_2
RSTb_
err_1
RSTb_
err_0 0IO_45_
fail
IO_23_
fail
IO_1_F
ail
IO_01_
fail
Table 89. Diag FS2. description and configuration of the bits (default value in bold)
RSTb_err_2:0
Description Report the value of the RSTb error counter
000
001
…
110
Error counter is set to 1 by default
Reset condition Power On Reset
IO_45_fail
Description Report an error in the IO_45 protocol
0No error
1 Error detected
Reset condition Power On Reset / Read
IO_23_fail
Description Report an error in the FCCU protocol
0No error
1 Error detected
Reset condition Power On Reset / Read
IO_1_fail
Description Report an error in the IO_1 monitoring (external resistor string monitoring)
0No error
1 Error detected
Reset condition Power On Reset
IO_01_fail
Description Report an error in the IO_01 protocol
0No error
1 Error detected
Reset condition Power On Reset / Read
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8 List of interruptions and description
The INTB output pin generates a low pulse when an Interrupt condition occurs. The INTB behavior as well as the pulse duration are set
through the SPI during INIT phase. It is possible to mask some Interruption source (see Detail of register mapping).
Table 90. Interruptions list
Event Description
VSNS_UV Detection of VBATTERY below 8.5 V
VSUP_UV_7 Detection of VSUP below 7.0 V (after reverse current protection diode)
IPFF Input power feed forward. Based on VSUP and IPRE_PEAK
ILIM_PRE Pre-regulator Current Limitation
TWARN_PRE Temperature warning on the pass transistor
BoB Return the running state of VPRE converter (Buck or Boost mode)
VPRE_STATE (VPRE_SMPS_EN) Return the activation state of VPRE DC/DC converter
VPRE OV Report a VPRE overvoltage detection
VPRE UV Report a VPRE undervoltage detection
ILIM_CORE VCORE Current limitation
TWARN_CORE Temperature warning on the pass transistor
VCORE_STATE (VCORE_SMPS_EN) Return the activation state of VCORE DC/DC converter
VCORE OV Report a VCORE overvoltage detection
VCORE UV Report a VCORE undervoltage detection
ILIM_CCA VCCA Current limitation
TWARN_CCA Temperature warning on the pass transistor (Internal Pass transistor only)
TSDVCCA Temperature shutdown of the VCCA
ILIM_CCA_OFF Current limitation maximum duration expiration. Only used when external PNP connected.
VCCA OV Report a VCCA overvoltage detection
VCCA UV Report a VCCA undervoltage detection
ILIM_AUX VAUX Current limitation
ILIM_AUX_OFF Current limitation maximum duration expiration. Only used when external PNP connected.
VAUX OV Report a VAUX overvoltage detection
VAUX UV Report a VAUX undervoltage detection
TSDVAUX Temperature shutdown of the VAUX
ILIM_CAN VCAN Current limitation
VCAN OV Report a VCAN overvoltage detection
VCAN UV Report a VCAN undervoltage detection
TSDCAN Temperature shutdown on the pass transistor. Auto restart when TJ < (TSDCAN - TSDCAN_HYST).
IO_0 Report IO_0 digital state change
IO_1 Report IO_1 digital state change
IO_2 Report IO_2 digital state change
IO_3 Report IO_3 digital state change
IO_4 Report IO_4 digital state change
IO_5 Report IO_5 digital state change
IO_0_WU Report IO_0 WU event
IO_1_WU Report IO_1 WU event
IO_2_WU Report IO_2 WU event
114 NXP Semiconductors
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IO_3_WU Report IO_3 WU event
IO_4_WU Report IO_4 WU event
IO_5_WU Report IO_5 WU event
CAN_WU Report a CAN wake-up event
CAN_OT CAN overtemperature detection
RXD_recessive CAN RXD recessive clamping detection (short-circuit to 5.0 V)
TXD_dominant CAN TXD dominant clamping detection (short circuit to GND)
CAN_dominant CAN bus dominant clamping detection
LIN_WU Report a LIN wake-up event
LIN_OT LN over-temperature detection
RXDL_recessive LIN RXDL recessive clamping detection (short to high)
TXDL dominant LIN TXDL dominant clamping detection (short to GND)
LIN dominant LIN bus dominant clamping detection
INT_Request MCU request for an Interrupt pulse
SPI_err Secured SPI communication check
SPI_CLK Report a wrong number of CLK pulse different than 16 during the NCS low pulse in Main state machine
SPI_Req Invalid SPI access (Wrong write or read, write to INIT registers in normal mode, wrong address)
SPI_Parity Report a Parity error in Main state machine
Table 90. Interruptions list (continued)
NXP Semiconductors 115
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9 Typical applications
Figure 58. 33907/33908 simplified application schematic with non-inverting buck-boost configuration
Figure 59. VAUX/VCCA connection
VSUP1
SW_PRE2
VPRE
SW_CORE
FB_CORE
VCCA_E
VCCA_B
VCCA
VAUX_E
VAUX_B
VAUX
CAN-5V
VSENSE
COMP_CORE
VSUP2
MOSI
MISO
SCLK
NCS
RXD
TXD
CANH
CANL
VDDIO
SELECT
MUX_OUT
INTB
RSTB
FS0B
DEBUG
IO_0
IO_1
IO_2
IO_3
IO_4
IO_5
BOOT_PRE
GATE_LS
SW_PRE1
VCORE_SNS
GND_COM
VSUP3
Vbat 1 µH
4.7 µF
22 µF
5.1 kΩ
1µF
22 µH
10 µF
10 µF
1µF
2.2 µH
100nF
R3
R4
C1
R1
R2 C2
4
MCU SPI
VDDIO
MCU RESET
MCU CAN
10 nF
5.1KΩ
1 nF
MCU Int.
To Fail Safe
circuitry
CAN BUS
120Ω
4.7µF
RSelect
SELECT pin Configuration for VCCA & VAUX
(R select connected to GND)
Vcca Vaux Rselect (KΩ) Recommended Value
3.3V 3.3V < 7 5.1KΩ +/-5%
5V 5V 10.8 <<13.2 12KΩ +/-5%
3.3V 5V 21.6 <<26.4 24KΩ +/-5%
5V 3.3V 45.9 <<56.1 51KΩ +/-5%
Components selection for Vcore voltage (current range 10mA -> 800mA, DI/DT = 2A/µs)
Vcore voltage R3(+/-1%) R4(+/-1%) R1(+/-5%) C1 R2(+/-5%) C2 Cout
1.23V 4.32KΩ 8.06KΩ 200Ω 220pF 39KΩ 1nF2*10µF
3.3V 24.9KΩ 8.06KΩ 510Ω 680pF 18KΩ 150pF 2*10µF MCU inputs
Vcore Voltage
1 nF
10 nF
4.7 µF
Vcca (5V or 3.3V), available configurations
Whithout Ext. PNP : 100mA capability +/-1% accuracy for 5V
configuration, +/-1.5% accuracy for 3.3V configuration,
With Ext. PNP : < 200mA +/-2% accuracy
With Ext. PNP : 300mA capability +/-3% accuracy
Vaux (5V or 3.3V)
300mA capability +/-3% accuracy
MUX_OUT (output selected by SPI)
Vsense or
VIO_0 or
VIO_1 or
Internal 2.5V reference voltage (2.5V +/-1%)
Connected to Vcca or Vcore
(If connected to Vcore, must be
connected closed to coutx 10µF x 2)
VDDIO
or VSUP3
5.1KΩif connected to VDDIO
>10KΩif connected to Vsup3
5.1KΩ
4.7 µF
100nF
10 µF
10 µF
10 µF
100nF
2.2nF
8Ω
PGND
PGND PGND PGND
PGND
GND
GND
GND
PGND
PGND
PGND PGND PGND
PGND
GND
GND
GND
GND
GND
GND
GND
PGND
GND
GND
Ground Connections
PGND ground plane connected to DGND pin
GND ground plane connected to AGND and GND_COM pins
PGND (DGND) and GND (AGND & GND_COM) connected together far from
PGND ground plane.
GND
10 nF
Vpre
DEBUG
mode
GND
GND
GNDA
GND
DGND
ESR cap.
<100mΩ
ESR cap.
<10mΩ
ESR cap.
<10mΩ
ESR cap.
<100mΩ
ESR cap.
<100mΩ
Vaux_PNP
Vcca_PNP
11KΩ
5.1 kΩ
FCCU monitoring
from Freescale
MCU
Optional
Optional
Optional
10 µF
PGND
22 µF
EMI sup. Capacitor must be connected
closed to load (220nF) and connected to
GND
EMI sup. Capacitor must be connected
closed to load (100nF + 100pF) and
connected to GND
100 nF
GND
GND
1KΩ
2.2nF7.5 Ω
PGND
0R
Vbat
Optional
Recommended
connection for IOs not
used in the application
Example of IO
connection and usage
5.1 kΩ
5.1 kΩ
Capacitor must be
close to Vaux pin
Capacitor closed to
Vcca pin
Resistor must be
close to Select pin
Capacitors must be close to Vpre pin
GND
GND
10KΩ
22 pF
330pF
GND
Key on
BOOTS_CORE
Snubber values must be fine tuned as
linked also to board layout performance
Snubber values must be fine tuned as
linked also to board layout performance
VSUP3
LIN BUS
LIN
RXDL
TXDL
MCU LIN
R3
R4
To IO_1
Optional
GND
Optional From 2nd Vcore
resistor bridge
VCCA_E
VCCA_B
VCCA
Cout_Vcca
GND
ESR cap.
<100 mΩ
Vcca_PNP
Optional
33907L_08L
VAUX_E
VAUX_B
VAUX
Cout_Vaux
ESR cap.
<100 mΩ
Vaux_PNP
SELECT
RSelect
GND
GND
33907/33908
116 NXP Semiconductors
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Figure 60. VCCA connection, VAUX not used
Figure 61. VAUX not used, VCCA configuration up to 100 mA
VCCA_E
VCCA_B
VCCA
33907L_08L
VAUX_E
VAUX_B
VAUX
SELECT
RSelect
VPRE
NC
NC
Cout_Vcca
GND
ESR cap.
<100 mΩ
Vcca_PNP
Optional
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VCCA_E
VCCA_B
VCCA
Cout_Vcca
GND
ESR cap.
<100 mΩ
33907L_8L
VAUX_E
VAUX_B
VAUX
SELECT
RSelect
VPRE
NC
NC
NC
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10 Packaging
10.1 Package mechanical dimensions
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.nxp.com and
perform a keyword search for the drawing’s document number.
Table 91. Package mechanical dimensions
Package Suffix Package outline drawing number
7.0 x 7.0, 48-Pin LQFP Exposed Pad, with 0.5 mm
pitch, and a 4.5 x 4.5 exposed pad AE 98ASA00173D
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11 References
The following are URLs where you can obtain information on related NXP products and application solutions
NXP.com support
pages Description URL
AN4766
MC33907_08 System Basis Chip:
Recommendations for PCB layout and external
components
https://www.nxp.com/webapp/Download?colCode=AN4766
AN4661 Designing the VCORE Compensation Network
For The MC33907/MC33908 System Basis Chips http://www.nxp.com/files/analog/doc/app_note/AN4661.pdf
AN4442 Integrating the MPC5643L and MC33907/08 for
Safety Applications http://www.nxp.com/files/analog/doc/app_note/AN4442.pdf
AN4388 Quad Flat Package (QFP) http://www.nxp.com/files/analog/doc/app_note/AN4388.pdf
Power Dissipation Tool (Excel file) http://www.nxp.com/webapp/sps/site/
prod_summary.jsp?code=MC33908&fpsp=1&tab=Design_Tools_Tab
MC33907_8SMUG MC33907_8 Safety Manual - User Guide https://www.nxp.com/webapp/Download?colCode=MC33907_8SMUG
FMEDA MC33907_8 FMEDA Upon demand
KIT33907LAEEVB Evaluation Board http://www.nxp.com/webapp/sps/site/
prod_summary.jsp?code=KIT33907LAEEVB
KIT33908LAEEVB Evaluation Board http://www.nxp.com/webapp/sps/site/
prod_summary.jsp?code=KIT33908LAEEVB
KITMPC5643DBEVM Evaluation Daughter Board (Qorivva MPC5643L) http://www.nxp.com/webapp/sps/site/
prod_summary.jsp?code=KITMPC5643DBEVM
MC33907 Product Summary Page http://www.nxp.com/webapp/sps/site/prod_summary.jsp?code=MC33907
MC33908 Product Summary Page http://www.nxp.com/webapp/sps/site/prod_summary.jsp?code=MC33908
Analog Home Page http://www.nxp.com/analog
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12 Revision history
Revision Date Description of changes
1.0 11/2014 • Product Preview release
12/2014 • Initial release. No change to content.
2.0 1/2015
• Corrected WD_LFSR register access in read mode
• Added (35)
• Added clarifications after Table 77
• Correct minor typographic errors
• Changed document status to Advance Information
• Changed the document order number to MC33907-MC33908D2
3.0 1/2015 • Corrected Revision History
• Corrected typo for ICORE_LIM
4.0 2/2015
• Updated VSUP_UV_7 max. value from 8.2 to 8.0 V in Table 4
• Updated Thermal Resistance values in Table 3
• Changed Thermal Resistance Junction to Case Top value from 14.4 to 24.2 in Table 3 on page 10
• Corrected a typo on page 46 (changed “For VSUP and VAUX 5.0 V” to “For VCCA and VAUX 5.0 V”)
• Corrected typo for VBUS_CNT in Table 4 on page 20
• Corrected typo for D2 and D3 in Table 5 on page 25
8/2016 • Updated to NXP document form and style
5.0 10/2016 • Corrected format (default values in bold) of the default SPI register values to match Data sheet Rev. 4.0, 2/2015
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based on the information in this document. NXP reserves the right to make changes without further notice to any
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Document Number: MC33907-MC33908D2
Rev. 5.0
10/2016