Block Diagram
Packages
Product Summary
VOFFSET 600Vmax
IQBS 1mA
Vin +/-260mVmax
Gain temp.drift 20ppm/oC (typ.)
fo40kHz (typ.)
Overcurrent trip 1.5usec (typ)
signal delay (IR2172)
Overcurrent trip level +/-260mV (typ.)
LINEAR CURRENT SENSING IC
8-Lead PDIP
8-Lead SOIC
Features
• Floating channel up to +600V
• Monolithic integration
• Linear current feedback through shunt resistor
• Direct digital PWM output for easy interface
• Low IQBS allows the boot strap power supply
• Independent fast overcurrent trip signal
• High common mode noise immunity
• Input overvoltage protection for IGBT short circuit
condition
• Open Drain outputs
Description
IR2171/IR2172 are monolithic current sensing IC
designed for motor drive applications. It senses the
motor phase current through an external shunt resistor,
converts from analog to digital signal, and transfers the
signal to the low side. IR’s proprietary high voltage iso-
lation technology is implemented to enable the high
bandwidth signal processing. The output format is dis-
crete PWM to eliminate need for the A/D input interface
for the IR2172. The dedicated overcurrent trip (OC) sig-
nal facilitates IGBT short circuit protection. The open-
drain outputs make easy for any interface from 3.3V to
15V.
Data Sheet No. PD60192 revG
IR2171/IR2172 (S)
(Refer to Lead Assignments for correct pin
configuration). This/These diagram(s)
show electrical connections only. Please
refer to our Application Notes and
DesignTips for proper circuit board layout.
VB
V+
V-
VS
VCC
PO
COM
IR2171/
IR2172
GND
15V
To Motor Phase
PWM Output
Up to 600V
NC (OC 2172)Overcurrent
IMPORTANT NOTICE:
For new designs we recommend IR’s new products
IR2175, IR2177, IR21771, IR2277 or IR22771.
2
IR2171/IR2172
www.irf.com
Symbol Definition Min. Max. Units
VSHigh side offset voltage -0.3 600
VBS High side floating supply voltage -0.3 25
VCC Low side and logic fixed supply voltage -0.3 25
VIN Maximum input voltage between VIN+ and VIN- -5 5
VPO Digital PWM output voltage COM -0.3 VCC +0.3
VOC Overcurrent output voltage (IR2172) COM -0.3 VCC +0.3
VIN- VIN- input voltage (note 1) VS -5 VB+ 0.3
dV/dt Allowable offset voltage slew rate — 50 V/ns
PDPackage power dissipation @ TA ≤ +25°C 8 lead SOIC — .625
8 lead PDIP — 1.0
RthJA Thermal resistance, junction to ambient 8 lead SOIC — 200
8 lead PDIP — 125
TJJunction temperature — 150
TSStorage temperature -55 150
TLLead temperature (soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
V
°C/W
W
Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The
external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins.
°C
Recommended Operating Conditions
The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom-
mended conditions.
Symbol Definition Min. Max. Units
VBHigh side floating supply voltage VS +13.0 VS +20
VSHigh side floating supply offset voltage 0.3 600
VPO Digital PWM output voltage COM VCC
VOC Overcurrent output voltage COM VCC
VCC Low side and logic fixed supply voltage 9.5 20
VIN Input voltage between VIN+ and VIN- -260 +260 mV
TAAmbient temperature -40 125 °C
V
3
IR2171/IR2172
www.irf.com
VIN Nominal input voltage range before saturation -260 — 260
|VIN+ _ VIN-|
VOC+ Overcurrent trip positive input voltage — 260 —
VOC- Overcurrent trip negative input voltage — -260 —
VOS Input offset voltage -10 0 10 VIN = 0V (Note 1)
∆VOS/∆TA Input offset voltage temperature drift — 25 — µV/oC
G Gain (duty cycle % per VIN) 157 162 167 %/V max gain error=5%
(Note 2)
∆G/∆TA Gain temperature drift — 20 — ppm/oC
ILK Offset supply leakage current — — 50 µA VB = VS = 600V
IQBS Quiescent VBS supply current — 1 2 VS = 0V
IQCC Quiescent VCC supply current — — 0.5
LIN Linearity (duty cycle deviation from ideal linearity — 0.5 1 %
curve)
∆VLIN/∆TA Linearity temperature drift — .005 — %/oC
IOPO Digital PWM output sink current 20 — —
2——
IOCC OC output sink current (IR2172) 10 — —
1——
DC Electrical Characteristics
VCC = VBS = 15V, and TA = 25oC unless otherwise specified.
Symbol Definition Min. Typ. Max. Units Test Conditions
Note 1: ±10mV offset represents ±1.5% duty cycle fluctuation
Note 2: Gain = (full range of duty cycle in %) / (full input voltage range).
mA
mV
mA
VO = 1V
VO = 0.1V
VO = 1V
VO = 0.1V
VCC = VBS = 15V, and TA = 25oC unless otherwise specified.
Symbol Definition Min. Typ. Max. Units Test Conditions
Propagation delay characteristics
fo Carrier frequency output 35 41 47 kHz
∆f/∆TATemperature drift of carrier frequency — 500 — ppm/oC
Dmin Minimum duty — 7 — %
Dmax Maximum duty — 93 — % VIN+=+260mV,VIN-=0V
BW fo bandwidth 15 kHz
PHS Phase shift at 1kHz -10 o
tdoc Propagation delay time of OC (IR2172) 1 1.5 —
twoc Low true pulse width of OC (IR2172) — 1 —
AC Electrical Characteristics
figure 1
VIN = 0 & 5V
VIN+=-260mV,VIN-=0V
VIN+ = 100mVpk -pk
sine wave, gain=-3dB
VIN+ =100mVpk-pk
sine wave
µsec
4
IR2171/IR2172
www.irf.com
Application Hint:
Temperature drift of the output carrier frequency can be cancelled by measuring both a PWM period and the on-time
of PWM (Duty) at the same time. Since both periods vary in the same direction, computing the ratio between these
values at each PWM period gives consistent measurement of the current feedback over the temperature drift.
Vin+= -260mV
Vin- = 0V
Vin+= +260mV
Vin- = 0V
Duty=93%
Duty=7%
Carrier Frequency =
40kHz
PO
PO
Timing Waveforms
Figure 1 Output waveform
Figure 2. OC Waveform (2172 only)
+260mV
-260mV
Vin
OC
twoc
tdoc
5
IR2171/IR2172
www.irf.com
Lead Assignment
Lead Definitions
Symbol Description
VCC Low side and logic supply voltage
COM Low side logic ground
VIN+ Positive sense input
VIN- Negative sense input
VBHigh side supply
VSHigh side return
PO Digital PWM output
OC Overcurrent output (negative logic) (IR2172 only)
N.C. No connection
IR2172S
8
7
6
4
3
2
1VCC
OC
PO
COM
VS
VIN-
VIN+
VB
5
8 lead SOIC
IR2172
8
7
6
4
3
2
1VCC
OC
PO
COM
VS
VIN-
VIN+
VB
5
8 lead PDIP
IR2171
8
7
6
4
3
2
1VCC
NC
PO
COM
VS
VIN-
VIN+
VB
5
8 lead PDIP
IR2171S
8
7
6
4
3
2
1VCC
NC
PO
COM
VS
VIN-
VIN+
VB
5
8 lead SOIC
6
IR2171/IR2172
www.irf.com
01-6014
01-3003 01 (MS-001AB)
8 Lead PDIP
Case outlines
01-6027
01-0021 11 (MS-012AA)
8 Lead SOIC
87
5
65
D B
E
A
e
6X
H
0.25 [.010] A
6
4312
4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA.
NOTES:
1. DIME NSIONING & TOLERANCING PER ASME Y14.5M-1994.
2. CONTROLLING DIMENSION: MILLIMETER
3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
7
K x 45°
8X L 8X c
y
FOOTPRINT
8X 0.72 [.028]
6.46 [.255]
3X 1.27 [.050] 8X 1.78 [.070]
5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].
7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO
A SUB STRATE.
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].
0.25 [.010] CAB
e1
A
A1
8X b
C
0.10 [.004]
e1
D
E
y
b
A
A1
H
K
L
.189
.1497
0°
.013
.050 BASIC
.0532
.0040
.2284
.0099
.016
.1968
.1574
8°
.020
.0688
.0098
.2440
.0196
.050
4.80
3.80
0.33
1.35
0.10
5.80
0.25
0.40
0°
1.27 BASIC
5.00
4.00
0.51
1.75
0.25
6.20
0.50
1.27
MIN MAX
MILLIMETERSIN C H E S
MIN MAX
DIM
8°
e
c .0075 .0098 0.19 0.25
.025 BASIC 0.635 BASIC
3/6/2006
