a FEATURES Two 12-Bit MDACs with Output Amplifiers 4-Quadrant Multiplication Space-Saving 0.3", 24-Pin DIP and 24-Terminal SOIC Package Parallel Loading Structure: AD7847 (8 + 4) Loading Structure: AD7837 LC2MOS Complete, Dual 12-Bit MDACs AD7837/AD7847 FUNCTIONAL BLOCK DIAGRAMS APPLICATIONS Automatic Test Equipment Function Generation Waveform Reconstruction Programmable Power Supplies Synchro Applications GENERAL DESCRIPTION The AD7837/AD7847 is a complete, dual, 12-bit multiplying digital-to-analog converter with output amplifiers on a monolithic CMOS chip. No external user trims are required to achieve full specified performance. Both parts are microprocessor compatible, with high speed data latches and interface logic. The AD7847 accepts 12-bit parallel data which is loaded into the respective DAC latch using the WR input and a separate Chip Select input for each DAC. The AD7837 has a double-buffered 8-bit bus interface structure with data loaded to the respective input latch in two write operations. An asynchronous LDAC signal on the AD7837 updates the DAC latches and analog outputs. The output amplifiers are capable of developing 10 V across a 2 k load. They are internally compensated with low input offset voltage due to laser trimming at wafer level. The amplifier feedback resistors are internally connected to VOUT on the AD7847. The AD7837/AD7847 is fabricated in Linear Compatible CMOS (LC2MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. A novel low leakage configuration (U.S. Patent No. 4,590,456) ensures low offset errors over the specified temperature range. PRODUCT HIGHLIGHTS 1. The AD7837/AD7847 is a dual, 12-bit, voltage-out MDAC on a single chip. This single chip design offers considerable space saving and increased reliability over multichip designs. 2. The AD7837 and the AD7847 provide a fast versatile interface to 8-bit or 16-bit data bus structures. REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703 1 (V = +15 V 6 5%, V = -15 V 6 5%, AGNDA = AGNDB = DGND AD7837/AD7847-SPECIFICATIONS = O V. V = V = +10 V, R = 2 kV, C = 100 pF [V connected to R AD7837]. All specifications T to T unless otherwise noted.) DD REFA REFB L Parameter L OUT SS FB MIN MAX A Version B Version S Version Units Test Conditions/Comments 12 1 1 12 1/2 1 12 1 1 Bits LSB max LSB max Guaranteed Monotonic 2 4 2 3 2 5 mV max mV max DAC Latch Loaded with All 0s Temperature Coefficient = 5 V/C typ 5 7 2 4 5 7 LSB max LSB max DAC Latch Loaded with All 1s Temperature Coefficient = 2 ppm of FSR/C typ REFERENCE INPUTS VREF Input Resistance VREFA, VREFB Resistance Matching 8/13 3 8/13 3 8/13 3 k min/max % max Typical Input Resistance = 10 k Typically 0.5% DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current Input Capacitance3 2.4 0.8 1 8 2.4 0.8 1 8 2.4 0.8 1 8 V min V max A max pF max ANALOG OUTPUTS DC Output Impedance Short Circuit Current 0.2 15 0.2 15 0.2 15 typ mA typ 14.25/15.75 -14.25/-15.75 14.25/15.75 14.25/15.75 -14.25/-15.75 -14.25/-15.75 V min/max V min/max 0.1 0.1 10 6 0.1 0.1 10 6 0.1 0.1 10 6 % per % max % per % max mA max mA max VDD = 15 V 5%, VREF = -10 V VSS = -15 V 5%, VREF = +10 V Output Unloaded. Typically 5 mA Output Unloaded. Typically 4 mA 4 4 4 s typ Settling Time to Within 1/2 LSB of Final Value. DAC Latch Alternately Loaded with All 0s and All 1s Slew Rate Digital-to-Analog Glitch Impulse 7 175 7 175 7 175 V/s typ nV secs typ Channel-to-Channel Isolation VREFA to VOUTB -95 -95 -95 dB typ -95 -95 -95 dB typ Multiplying Feedthrough Error -90 -90 -90 dB typ Unity Gain Small Signal BW 600 600 600 kHz typ Full Power BW 110 110 90 kHz typ Total Harmonic Distortion -88 -88 -88 dB typ Digital Crosstalk Output Noise Voltage @ +25C (0.1 Hz to 10 Hz) 10 10 10 nV secs typ 2 2 2 V rms typ STATIC PERFORMANCE Resolution Relative Accuracy2 Differential Nonlinearity2 Zero Code Offset Error2 @ +25C TMIN to TMAX Gain Error2 @ +25C TMIN to TMAX POWER REQUIREMENTS VDD Range VSS Range Power Supply Rejection Gain/VDD Gain/VSS IDD ISS Digital Inputs at 0 V and VDD VOUT Connected to AGND 4 AC CHARACTERISTICS2, 3 Voltage Output Settling Time VREFB to VOUTA DAC Latch Alternately Loaded with 01 . . . 11 and 10 . . . 00 VREFA = 20 V p-p, 10 kHz Sine Wave. DAC Latches Loaded with All 0s VREFB = 20 V p-p, 10 kHz Sine Wave. DAC Latches Loaded with All 0s VREF = 20 V p-p, 10 kHz Sine Wave. DAC Latch Loaded with All 0s V REF = 100 mV p-p Sine Wave. DAC Latch Loaded with All 1s VREF = 20 V p-p Sine Wave. DAC Latch Loaded with All 1s VREF = 6 V rms, 1 kHz. DAC Latch Loaded with All 1s Code Transition from All 0s to All 1s See Typical Performance Graphs Amplifier Noise and Johnson Noise of RFB NOTES 1 Temperature ranges are as follows: A, B Versions, -40C to +85C; S Version, -55C to +125C. 2 See Terminology. 3 Sample tested @ +25C to ensure compliance. 4 The Devices are functional with V DD/VSS = 12 V (See typical performance graphs.) Specifications subject to change without notice. -2- REV. 0 AD7837/AD7847 TIMING CHARACTERISTICS1, 2 (V DD = +15 V 6 5%, VSS = -15 V 6 5%, AGNDA = AGNDB = DGND = O V) Parameter Limit at TMIN, TMAX Limit at TMIN, TMAX (A, B Versions) (S Version) Units Conditions/Comments t1 t2 t3 t4 t5 t6 3 t7 3 t8 3 0 0 80 80 10 15 15 80 ns min ns min ns min ns min ns min ns min ns min ns min CS to WR Setup Time CS to WR Hold Time WR Pulse Width Data Valid to WR Setup Time Data Valid to WR Hold Time Address to WR Setup Time Address to WR Hold Time LDAC Pulse Width 0 0 100 80 10 15 15 100 NOTES 1 Sample tested @ +25C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage level of 1.6 V. 2 See Figures 3 and 5. 3 AD7837 only. ABSOLUTE MAXIMUM RATINGS* ORDERING GUIDE (TA = +25C unless otherwise noted) VDD to DGND, AGNDA, AGNDB . . . . . . . . -0.3 V to +17 V VSS1 to DGND, AGNDA, AGNDB . . . . . . . +0.3 V to -17 V VREFA, VREFB to AGNDA, AGNDB . . . . . . . . . . . . . . . . . . . . . . . . . . VSS - 0.3 V to VDD + 0.3 V AGNDA, AGNDB to DGND . . . . . . . -0.3 V to VDD + 0.3 V VOUTA2, VOUTB2 to AGNDA, AGNDB . . . . . . . . . . . . . . . . . . . . . . . . . . VSS - 0.3 V to VDD + 0.3 V RFBA3, RFBB3 to AGNDA, AGNDB . . . . . . . . . . . . . . . . . . . . . . . . . . VSS - 0.3 V to VDD + 0.3 V Digital Inputs to DGND . . . . . . . . . . . -0.3 V to VDD + 0.3 V Operating Temperature Range Commercial/Industrial (A, B Versions) . . . -40C to +85C Extended (S Version) . . . . . . . . . . . . . . . . -55C to +125C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300C Power Dissipation (Any Package) to +75C . . . . . . . 1000 mW Derates above +75C by . . . . . . . . . . . . . . . . . . . . 10 mW/C NOTES 1 If VSS is open circuited with V DD and either AGND applied, the V SS pin will float positive, exceeding the Absolute Maximum Ratings. If this possibility exists, a Schottky diode connected between V SS and AGND (cathode to AGND) ensures the Maximum Ratings will be observed. 2 The outputs may be shorted to voltages in this range provided the power dissipation of the package is not exceeded. 3 AD7837 only. Model1 Temperature Range Relative Accuracy Package Option2 AD7837AN AD7837BN AD7837AR AD7837BR AD7837AQ AD7837BQ AD7837SQ -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -55C to +125C 1 LSB 1/2 LSB 1 LSB 1/2 LSB 1 LSB 1/2 LSB 1 LSB N-24 N-24 R-24 R-24 Q-24 Q-24 Q-24 AD7847AN AD7847BN AD7847AR AD7847BR AD7847AQ AD7847BQ AD7847SQ -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -55C to +125C 1 LSB 1/2 LSB 1 LSB 1/2 LSB 1 LSB 1/2 LSB 1 LSB N-24 N-24 R-24 R-24 Q-24 Q-24 Q-24 NOTES 1 To order MIL-STD-883, Class B processed parts, add /883B to part number. 2 N = Plastic DIP; Q = Cerdip; R = SOIC. *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one Absolute Maximum Rating may be applied at any one time. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although these devices feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. 0 -3- WARNING! ESD SENSITIVE DEVICE AD7837/AD7847 Channel-to-Channel Isolation TERMINOLOGY Relative Accuracy (Linearity) This is an ac error due to capacitive feedthrough from the VREF input on one DAC to VOUT on the other DAC. It is measured with the DAC latches loaded with all 0s. Relative accuracy, or endpoint linearity, is a measure of the maximum deviation of the DAC transfer function from a straight line passing through the endpoints. It is measured after allowing for zero and full-scale errors and is expressed in LSBs or as a percentage of full-scale reading. Digital Feedthrough Digital feedthrough is the glitch impulse injected from the digital inputs to the analog output when the data inputs change state, but the data in the DAC latches is not changed. Differential Nonlinearity Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of 1 LSB or less over the operating temperature range ensures monotonicity. For the AD7837, it is measured with LDAC held high. For the AD7847, it is measured with CSA and CSB held high. Digital Crosstalk Digital crosstalk is the glitch impulse transferred to the output of one converter due to a change in digital code on the DAC latch of the other converter. It is specified in nV secs. Zero Code Offset Error Zero code offset error is the error in output voltage from VOUTA or VOUTB with all 0s loaded into the DAC latches. It is due to a combination of the DAC leakage current and offset errors in the output amplifier. Digital-to-Analog Glitch Impulse This is the voltage spike that appears at the output of the DAC when the digital code changes, before the output settles to its final value. The energy in the glitch is specified in nV secs and is measured for a 1 LSB change around the major carry transition (0111 1111 1111 to 1000 0000 0000). Gain Error Gain error is a measure of the output error between an ideal DAC and the actual device output with all 1s loaded. It does not include offset error. Unity Gain Small Signal Bandwidth Total Harmonic Distortion This is the ratio of the root-mean-square (rms) sum of the harmonics to the fundamental, expressed in dBs. This is the frequency at which the small signal voltage output from the output amplifier is 3 dB below its dc level. It is measured with the DAC latch loaded with all 1s. Multiplying Feedthrough Error Full Power Bandwidth This is an ac error due to capacitive feedthrough from the VREF input to VOUT of the same DAC when the DAC latch is loaded with all 0s. This is the maximum frequency for which a sinusoidal input signal will produce full output at rated load with a distortion less than 3%. It is measured with the DAC latch loaded with all 1s. AD7837 PIN FUNCTION DESCRIPTION (DIP & SOIC PIN NUMBERS) Pin Mnemonic Description 1 2 3 4 5 6 7 8 9 10 11 12 13 CS RFBA VREFA VOUTA AGNDA VDD VSS AGNDB VOUTB VREFB DGND RFBB WR 14 LDAC 15 16 17-20 21-24 A1 A0 DB7-DB4 DB3-DB0 Chip Select. Active low logic input. The device is selected when this input is active. Amplifier Feedback Resistor for DAC A. Reference Input Voltage for DAC A. This may be an ac or dc signal. Analog Output Voltage from DAC A. Analog Ground for DAC A. Positive Power Supply. Negative Power Supply. Analog Ground for DAC B. Analog Output Voltage from DAC B. Reference Input Voltage for DAC B. This may be an ac or dc signal. Digital Ground. Ground reference for digital circuitry. Amplifier Feedback Resistor for DAC B. Write Input. WR is an active low logic input which is used in conjunction with CS, A0 and A1 to write data to the input latches. DAC Update Logic Input. Data is transferred from the input latches to the DAC latches when LDAC is taken low. Address Input. Most significant address input for input latches (see Table II). Address Input. Least significant address input for input latches (see Table II). Data Bit 7 to Data Bit 4. Data Bit 3 to Data Bit 0 (LSB) or Data Bit 11 (MSB) to Data Bit 8. -4- REV. 0 AD7837/AD7847 AD7847 PIN FUNCTION DESCRIPTION (DIP & SOIC PIN NUMBERS) Pin Mnemonic Description 11 12 13 14 15 16 17 18 19 10 11 12 13 CSA CSB VREFA VOUTA AGNDA VDD VSS AGNDB VOUTB VREFB DGND DB11 WR 14-24 DB10-DB0 Chip Select Input for DAC A. Active low logic input. DAC A is selected when this input is low. Chip Select Input for DAC B. Active low logic input. DAC B is selected when this input is low. Reference Input Voltage for DAC A. This may be an ac or dc signal. Analog Output Voltage from DAC A. Analog Ground for DAC A. Positive Power Supply. Negative Power Supply. Analog Ground for DAC B. Analog Output Voltage from DAC B. Reference Input Voltage for DAC B. This may be an ac or dc signal. Digital Ground. Data Bit 11 (MSB). Write Input. WR is a positive edge triggered input which is used in conjunction with CSA and CSB to write data to the DAC latches. Data Bit 10 to Data Bit 0 (LSB). AD7837 PIN CONFIGURATION AD7847 PIN CONFIGURATION DIP & SOIC DIP & SOIC CS CSA 1 24 DB0 23 DB1 22 DB2 RFBA 2 23 DB1 CSB 2 VREFA 3 22 DB2 VREFA 3 VOUTA 4 21 DB3 VOUTA 4 21 DB3 20 DB4 AGNDA 5 20 DB4 19 DB5 VDD 6 AD7847 19 DB5 18 DB6 VSS 7 TOP VIEW (Not to Scale) 18 DB6 17 DB7 AGNDB 8 17 DB7 16 A0 VOUTB 9 16 DB8 15 A1 VREFB 10 15 DB9 AGNDA 5 VDD 6 VSS 7 AGNDB 8 VOUTB 9 VREFB 10 DGND 11 RFBB 12 REV. 0 24 DB0 1 AD7837 TOP VIEW (Not to Scale) DGND 11 14 LDAC DB11 12 13 WR -5- 14 DB10 13 WR AD7837/AD7847-Typical Performance Graphs 10 20 VOUT - Volts p-p GAIN - dB 0 VDD = +15V VSS = -15V -10 VREF = +20Vp-p DAC CODE = 111...111 10 VDD = +15V VSS = -15V VREF = +20V p-p @ 1kHz -20 DAC CODE = 111...111 -30 10 4 0 10 10 7 10 5 10 6 FREQUENCY - Hz Frequency Response DAC to DAC Linearity Matching -40 0.3 0.2 INL 0.1 DNL 9 11 13 VDD /V SS - Volts 15 17 Linearity vs. Power Supply -50 300 VREF = 0V DAC CODE = 111...111 200 VDD = +15V VSS = -15V -60 VDD = +15V VSS = -15V THD - dB VREF = 7.5V NOISE SPECTRAL DENSITY - nV/ Hz 400 0.4 ERROR - LSB 10000 Output Voltage Swing vs. Resistive Load 0.5 0.0 100 1000 LOAD RESISTANCE - Ohms VREF = 6V rms DAC CODE = 111...111 -70 -80 100 -90 0 .01 .1 1 10 FREQUENCY - kHz 100 -100 0.1 1 10 FREQUENCY - kHz 100 Noise Spectral Density vs. Frequency THD vs. Frequency Large Signal Pulse Response Small Signal Pulse Response -50 FEEDTHROUGH - dB -60 -70 VDD = +15V VSS = -15V VREF = 20V p-p DAC CODE = 000...000 -80 -90 -100 0.1 1 10 100 FREQUENCY - kHz 1000 Multiplying Feedthrough Error vs. Frequency -6- REV. 0 AD7837/AD7847 CIRCUIT INFORMATION D/A SECTION Table I. AD7847 Truth Table A simplified circuit diagram for one of the D/A converters and output amplifier is shown in Figure 1. A segmented scheme is used whereby the 2 MSBs of the 12-bit data word are decoded to drive the three switches A-C. The remaining 10 bits drive the switches (S0-S9) in a standard R-2R ladder configuration. Each of the switches A-C steers 1/4 of the total reference current with the remaining 1/4 passing through the R-2R section. The output amplifier and feedback resistor perform the current to voltage conversion giving CSA CSB WR Function X 1 0 1 0 g 1 g X 1 1 0 0 1 g g 1 X g g g 0 0 0 No Data Transfer No Data Transfer Data Latched to DAC A Data Latched to DAC B Data Latched to Both DACs Data Latched to DAC A Data Latched to DAC B Data Latched to Both DACs X = Don't Care. g = Rising Edge Triggered. VOUT = - D x VREF CSA, CSB where D is the fractional representation of the digital word. (D can be set from 0 to 4095/4096.) t1 The output amplifier can maintain 10 V across a 2 k load. It is internally compensated and settles to 0.01% FSR (1/2 LSB) in less than 5 s. Note that on the AD7837, VOUT must be connected externally to RFB. t2 t3 WR t4 t5 VALID DATA DATA Figure 3. AD7847 Write Cycle Timing Diagram VREF R R R INTERFACE LOGIC INFORMATION--AD7837 2R 2R 2R 2R 2R 2R C B A S9 S8 S0 2R R/2 VOUT AGND SHOWN FOR ALL 1s ON DAC Figure 1. D/A Simplified Circuit Diagram The input loading structure on the AD7837 is configured for interfacing to microprocessors with an 8-bit-wide data bus. The part contains two 12-bit latches per DAC--an input latch and a DAC latch. Each input latch is further subdivided into a leastsignificant 8-bit latch and a most-significant 4-bit latch. Only the data held in the DAC latches determines the outputs from the part. The input control logic for the AD7837 is shown in Figure 4, while the write cycle timing diagram is shown in Figure 5. INTERFACE LOGIC INFORMATION--AD7847 The input control logic for the AD7847 is shown in Figure 2. The part contains a 12-bit latch for each DAC. It can be treated as two independent DACs, each with its own CS input and a common WR input. CSA and WR control the loading of data to the DAC A latch, while CSB and WR control the loading of the DAC B latch. The latches are edge triggered so that input data is latched to the respective latch on the rising edge of WR. If CSA and CSB are both low and WR is taken high, the same data will be latched to both DAC latches. The control logic truth table is shown in Table I, while the write cycle timing diagram for the part is shown in Figure 3. CSA LDAC DAC A LATCH DAC B LATCH 12 12 CS WR 4 A0 A1 DAC A MS INPUT LATCH 4 8 8 DAC A LS INPUT LATCH DAC B MS INPUT LATCH DAC B LS INPUT LATCH DAC A LATCH WR 8 DAC B LATCH CSB DB7 DB0 Figure 4. AD7837 Input Control Logic Figure 2. AD7847 Input Control Logic REV. 0 -7- AD7837/AD7847 UNIPOLAR BINARY OPERATION A0/A1 ADDRESS VALID Figure 6 shows DAC A on the AD7837/AD7847 connected for unipolar binary operation. Similar connections apply for DAC B. When VIN is an ac signal, the circuit performs 2-quadrant multiplication. The code table for this circuit is shown in Table III. Note that on the AD7847 the feedback resistor RFB is internally connected to VOUT. t7 t6 CS t3 t1 t2 VDD WR t4 AD7837 AD7847 t5 VALID DATA DATA VIN VDD RFBA * VOUT VOUTA VREFA DAC A t8 DGND VSS AGNDA *INTERNALLY CONNECTED ON AD7847 LDAC VSS Figure 5. AD7837 Write Cycle Timing Diagram Figure 6. Unipolar Binary Operation CS, WR, A0 and A1 control the loading of data to the input latches. The eight data inputs accept right-justified data. Data can be loaded to the input latches in any sequence. Provided that LDAC is held high, there is no analog output change as a result of loading data to the input latches. Address lines A0 and A1 determine which latch data is loaded to when CS and WR are low. The control logic truth table for the part is shown in Table II. Table III. Unipolar Code Table DAC Latch Contents MSB LSB Table II. AD7837 Truth Table 1111 1111 1111 4095 -VIN x 4096 1000 0000 0000 2048 -V IN x = -1/ 2 VIN 4096 0000 0000 0001 1 -V IN x 4096 0000 0000 0000 0V CS WR A1 A0 LDAC Function 1 X 0 0 0 0 1 X 1 0 0 0 0 1 X X 0 0 1 1 X X X 0 1 0 1 X 1 1 1 1 1 1 0 No Data Transfer No Data Transfer DAC A LS Input Latch Transparent DAC A MS Input Latch Transparent DAC B LS Input Latch Transparent DAC B MS Input Latch Transparent DAC A and DAC B DAC Latches Updated Simultaneously from the Respective Input Latches Analog Output, VOUT Note 1 LSB = V IN . 4096 X = Don't Care. The LDAC input controls the transfer of 12-bit data from the input latches to the DAC latches. When LDAC is taken low, both DAC latches, and hence both analog outputs, are updated at the same time. The data in the DAC latches is held on the rising edge of LDAC. The LDAC input is asynchronous and independent of WR. This is useful in many applications especially in the simultaneous updating of multiple AD7837s. However, care must be taken while exercising LDAC during a write cycle. If an LDAC operation overlaps a CS and WR operation, there is a possibility of invalid data being latched to the output. To avoid this, LDAC must remain low after CS or WR return high for a period equal to or greater than t8, the minimum LDAC pulse width. -8- REV. 0 AD7837/AD7847 BIPOLAR OPERATION (4-QUADRANT MULTIPLICATION) APPLICATIONS Figure 7 shows the AD7837/AD7847 connected for bipolar operation. The coding is offset binary as shown in Table IV. When VIN is an ac signal, the circuit performs 4-quadrant multiplication. To maintain the gain error specifications, resistors R1, R2 and R3 should be ratio matched to 0.01%. Note that on the AD7847 the feedback resistor RFB is internally connected to VOUT. R2 20k R1 20k VOUT VDD AD7837 AD7847 VIN RFBA VDD R3 10k AD711 PROGRAMMABLE GAIN AMPLIFIER (PGA) The dual DAC/amplifier combination along with access to RFB make the AD7837 ideal as a programmable gain amplifier. In this application, the DAC functions as a programmable resistor in the amplifier feedback loop. This type of configuration is shown in Figure 8 and is suitable for ac gain control. The circuit consists of two PGAs in series. Use of a dual configuration provides greater accuracy over a wider dynamic range than a single PGA solution. The overall system gain is the product of the individual gain stages. The effective gains for each stage are controlled by the DAC codes. As the code decreases, the effective DAC resistance increases, and so the gain also increases. VREFA * DAC A DGND AGNDA VIN VSS *INTERNALLY RFBA 4 5 AGNDA Figure 7. Bipolar Offset Binary Operation 10 1000 0000 0001 +V IN 1000 0000 0000 0V 0111 1111 1111 1 -V IN x 2048 -V IN . 12 VOUTB Analog Output, VOUT 1 x 2048 V IN RFBB 9 2047 +V IN x 2048 2048 DAC B VOUT 1111 1111 1111 Note 1 LSB = AD7837 VREFB Table IV. Bipolar Code Table 0000 0000 0000 VOUTA 2 CONNECTED ON AD7847 VSS DAC Latch Contents MSB LSB 3 DAC A VOUTA VREFA 2048 x = -V IN 2048 8 AGNDB Figure 8. Dual PGA Circuit The transfer function is given by VOUT REQA REQB = x V IN RFBA RFBB (1) where REQA, REQB are the effective DAC resistances controlled by the digital input code: REQ = 212 RIN N (2) where RIN is the DAC input resistance and is equal to RFB and N = DAC input code in decimal. The transfer function in (1) thus simplifies to VOUT 212 212 = x V IN N A NB (3) where NA = DAC A input code in decimal and NB = DAC B input code in decimal. NA, NB may be programmed between 1 and (212-1). The zero code is not allowed as it results in an open loop amplifier response. To minimize errors, the digital codes NA and NB should be chosen to be equal to or as close as possible to each other to achieve the required gain. REV. 0 -9- AD7837/AD7847 ANALOG PANNING CIRCUIT 0.6 TOTAL POWER VARIATION - dB In audio applications it is often necessary to digitally "pan" or split a single signal source into a two-channel signal while maintaining the total power delivered to both channels constant. This may be done very simply by feeding the signal into the VREF input of both DACs. The digital codes are chosen such that the code applied to DAC B is the 2s complement of that applied to DAC A. In this way the signal may be panned between both channels as the digital code is changed. The total power variation with this arrangement is 3 dB. For applications which require more precise power control the circuit shown in Figure 9 may be used. This circuit requires the AD7837/AD7847, an AD712 dual op amp and 8 equal value resistors. 0.5 0.4 0.3 0.2 0.1 0.0 1 512 1024 Again both channels are driven with 2s complementary data. The maximum power variation using this circuit is only 0.5 dBs. 1536 2048 2560 3072 3584 4095 DIGITAL INPUT CODE N A Figure 10. Power Variation for Circuit in Figure 9 R R APPLYING THE AD7837/AD7847 General Ground Management AD7847 VREFA 1/2 AD712 VIN R R R R VOUTB VREFB 1/2 AD712 R AC or transient voltages between the analog and digital grounds i.e., between AGNDA/AGNDB and DGND can cause noise injection into the analog output. The best method of ensuring that both AGNDs and DGND are equal is to connect them together at the AD7837/AD7847 on the circuit board. In more complex systems where the AGND and DGND intertie is on the backplane, it is recommended that two diodes be connected in inverse parallel between the AGND and DGND pins (1N914 or equivalent). VOUTA R VOUTA RLA VOUTB RLB Power Supply Decoupling In order to minimize noise it is recommended that the VDD and the VSS lines on the AD7837/AD7847 be decoupled to DGND using a 10 F in parallel with a 0.1 F ceramic capacitor. Figure 9. Analog Panning Circuit The voltage output expressions for the two channels are as follows: VOUTA Operation with Reduced Power Supply Voltages The AD7837/AD7847 is specified for operation with VDD/VSS = 15 V 5%. The part may be operated down to VDD/VSS = 10 V without significant linearity degradation. See typical performance graphs. The output amplifier however requires approximately 3 V of headroom so the VREF input should not approach within 3 V of either power supply voltages in order to maintain accuracy. N = -V IN 12 A 2 + N A N VOUT B = -V IN 12 B 2 + NB where NA = DAC A input code in decimal (1 NA 4095) MICROPROCESSOR INTERFACING-AD7847 and NB = DAC B input code in decimal (1 NB 4095) Figures 11 to 13 show interfaces between the AD7847 and three popular 16-bit microprocessor systems, the 8086, MC68000 and the TMS320C10. In all interfaces, the AD7847 is memorymapped with a separate memory address for each DAC latch. with NB = 2s complement of NA. The 2s complement relationship between NA and NB causes NB to increase as NA decreases and vice versa. AD7847-8086 Interface Hence NA + NB = 4096. With NA = 2048, then NB = 2048 also; this gives the balanced condition where the power is split equally between both channels. The total power variation as the signal is fully panned from Channel B to Channel A is shown in Figure 10. Figure 11 shows an interface between the AD7847 and the 8086 microprocessor. A single MOV instruction loads the 12-bit word into the selected DAC latch and the output responds on the rising edge of WR. -10- REV. 0 AD7837/AD7847 MICROPROCESSOR INTERFACING-AD7837 ADDRESS BUS 8086 CSA ADDR DECODE CSB 16-BIT LATCH ALE AD7847* WR WR DB11 DB0 AD15 ADDRESS/DATA BUS AD0 *ADDITIONAL PINS OMITTED FOR CLARITY Figure 11. AD7847 to 8086 Interface AD7847-MC68000 Interface Figure 12 shows an interface between the AD7847 and the MC68000. Once again a single MOVE instruction loads the 12-bit word into the selected DAC latch. CSA and CSB are ANDgated to provide a DTACK signal when either DAC latch is selected. Figures 14 to 16 show the AD7837 configured for interfacing to microprocessors with 8-bit data bus systems. In all cases, data is right-justified and the AD7837 is memory-mapped with the two lowest address lines of the microprocessor address bus driving the A0 and A1 inputs of the AD7837. Five separate memory addresses are required, one for the each MS latch and one for each LS latch and one for the common LDAC input. Data is written to the respective input latch in two write operations. Either high byte or low byte data can be written first to the input latch. A write to the AD7837 LDAC address transfers the data from the input latches to the respective DAC latches and updates both analog outputs. Alternatively, the LDAC input can be asynchronous and can be common to a several AD7837s for simultaneous updating of a number of voltage channels. AD7837-8051/8088 Interface Figure 14 shows the connection diagram for interfacing the AD7837 to both the 8051 and the 8088. On the 8051, the signal PSEN is used to enable the address decoder while DEN is used on the 8088. A15 ADDRESS BUS A8 A23 8051/8088 ADDRESS BUS A1 MC68000 AS PSEN OR DEN ADDR DECODE EN CSA EN LDAC A0 A1 AD7837* WR WR AD7847* DTACK CS OCTAL LATCH ALE CSB ADDR DECODE DB7 LDS DB0 WR R/W DB11 AD7 DB0 ADDRESS/DATA BUS AD0 *ADDITIONAL PINS OMITTED FOR CLARITY D15 DATA BUS D0 Figure 14. AD7837 to 8051/8088 Interface *ADDITIONAL PINS OMITTED FOR CLARITY AD7837-68008 Interface Figure 12. AD7847 to MC68000 Interface AD7847-TMS320C10 Interface Figure 13 shows an interface between the AD7847 and the TMS320C10 DSP processor. A single OUT instruction loads the 12-bit word into the selected DAC latch. An interface between the AD7837 and the MC68008 is shown in Figure 15. In the diagram shown, the LDAC signal is derived from an asynchronous timer but this can be derived from the address decoder as in the previous interface diagram. TIMER A19 A11 ADDRESS BUS ADDRESS BUS A0 A0 TMS320C10 MEN MC68008 ADDR DECODE CSA EN CSB AS ADDR DECODE EN DS WR WE WR R/W DB7 DB11 DB0 DB0 D7 D15 DATA BUS DATA BUS D0 D0 *ADDITIONAL PINS OMITTED FOR CLARITY *ADDITIONAL PINS OMITTED FOR CLARITY Figure 15. AD7837 to 68008 Interface Figure 13. AD7847 to TMS320C10 Interface REV. 0 A1 AD7837* DTACK AD7847* A0 CS LDAC -11- AD7837/AD7847 AD7837-6502/6809 Interface Figure 16 shows an interface between the AD7837 and the 6502 or 6809 microprocessor. For the 6502 microprocessor, the 2 clock is used to generate the WR, while for the 6809 the E signal is used. C1362-10-3/90 A15 ADDRESS BUS A0 6502/6809 ADDR DECODE R/W A0 CS A1 LDAC EN AD7837* 2 OR E WR DB7 DB0 D7 DATA BUS D0 *ADDITIONAL PINS OMITTED FOR CLARITY Figure 16. AD7837 to 6502/6809 Interface OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 24-Pin Plastic DIP (N-24) 24-Pin Cerdip (Q-24) 13 24 13 12 1 0.260 0.001 (6.61 0.03) 1 0.130 (3.30) 0.128 (3.25) SEATING PLANE SEATING PLANE 0.011 (0.28) 0.009 (0.23) 0.02 (0.5) 0.016 (0.41) 0.11 (2.79) 0.09 (2.28) 0.07 (1.78) 0.05 (1.27) 0.320 (8.13) 0.290 (7.37) 1.290 (32.77) MAX 0.32 (8.128) 0.30 (7.62) 1.228 (31.19) 1.226 (31.14) 12 0.295 (7.493) MAX 15 0 0.180 (4.572) MAX 0.225 (5.715) MAX 0.125 (3.175) MIN 0.021 (0.533) 0.015 (0.381) TYP 0.070 (1.778) 0.020 (0.508) 0.110 (2.794) 0.090 (2.286) TYP 0.065 (1.651) 0.055 (1.397) 15 0 0.012 (0.305) 0.008 (0.203) TYP 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH. 2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. NOTES 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH. 2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN LEAD PLATED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. 24-Lead SOIC (R-24) 24 13 1 12 0.414 (10.52) 0.398 (10.10) 0.299 (7.6) 0.291 (7.39) 0.096 (2.44) 0.089 (2.26) 0.608 (15.45) 0.596 (15.13) 0.03 (0.76) 0.02 (0.51) 0.013 (0.32) 0.009 (0.23) 6 0 0.01 (0.254) 0.006 (0.15) 0.05 (1.27) 0.019 (0.49) 0.014 (0.35) PRINTED IN U.S.A. 24 0.042 (1.067) 0.018 (0.457) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS. -12- REV. 0