HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 1/3
H1N5817, H1N5818, H1N5819 HSMC Product Specification
H1N5817 thru H1N5819
1.0 AMP. SCHOTTKY BARRIER RECTIFIERS
Features
• Low Forward Voltage Drop
• High Current Capability
• High Reliability
• High Surge Current Capability
Maximum Ratings
Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz,
resistive or inductive load. For capacitive load, derate current by 20%.
Type Number H1N5817 H1N5818 H1N5819 Units
Maximum Recurrent Peak Reverse Voltage 20 30 40 V
Maximum RMS Voltage 14 21 28 V
Maximum DC Blocking Voltage 20 30 40 V
Maximum Average Forward Rectified Current
0.375"(9.5mm) Lead Length @ TL=90°C1A
Peak Forward Surge Current, 8.3ms Single Half
Sine-wave Superimposed on Rated Load (JEDEC
method) 25 A
Maximum Instantaneous Forward Voltage @ 1A 0.45 0.550 0.600 V
Maximum Instantaneous Forward Voltage @ 3A 0.750 0.875 0.900 V
Maximum DC Reverse Current At Rated DC
Blocking Voltage 1 (@ Ta=25°C)
10 (@ Ta=100°C) mA
mA
Typical Thermal Resistance (Note 1) RθJA 50 °C /W
Typical Junction Capacitance (Note 2) 110 pF
Operating Temperature Range Tj -65 to +125 °C
Storage Temperature Range TSTG -65 to +125 °C
Note 1: Thermal resi stance from junction to ambient vertical PC Board Mounting, 0.375”(9.5mm) lead length.
Note 2: Measured at 1Mhz and applied reverse voltage of 4V D.C.
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 2/3
H1N5817, H1N5818, H1N5819 HSMC Product Specification
Characteristics Curve
Fig. 1 - M axim um Forwar d Cu r r ent Deratin g Cu r ve
0.00
0.25
0.50
0.75
1.00
0 25 50 75 100 125 150 175
Lead Tem perat ure (
o
C)
Aver age For war d Cur r ent (A
)
Fig. 2 - Ty pical Jun ct ion Capactitan ce
10
100
1000
0.1 1 10 100
Reverse Volt age ( V)
Capacit ance ( p F)
Fig.3 - Typical Forward Ch aracterist ics
0.1
1
10
100
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1
Forw ar d Solt age ( V)
I nstantan eous Fo r war d Current ( A)
.
H1N5817
H1N5818,H1N5819
Tj=25
o
C
Pulse Width=300us
1% Duty Cycle
Fig.4 - Maximum N on-R epetitiv e Forward Surge Curren t
0
5
10
15
20
25
30
1 10 100
Nu mber Of Cycles At 60Hz
Peak Forward Surge Current ( A
)
8.3ms Single H alf Sine
Wa ve JIDIC Meth od
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HL200101
Issued Date : 2000.01.15
Revised Date : 2001.12.06
Page No. : 3/3
H1N5817, H1N5818, H1N5819 HSMC Product Specification
DO-41 Dimension
*: Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.0280 0.0340 0.71 0.86 D 1.0000 - 25.40 -
B 1.0000 - 25.40 - E 0.0800 0.1070 2.00 2.70
C 0.1600 0.2050 4.10 5.20
Notes: 1.Dimension and tolerance based on our Spec. dated May 28,1998.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Of fice And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
E
BC
A
D
DO-41 Molded Plastic Package
HSMC Package Code: L
