BC846BLP4-7B - DIODES INC - Datasheet.Directory

BC846BLP4

Document number: DS35751 Rev. 3 - 2

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September 2017

BC846BLP4

65V NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

 Low Collector-Emitter Saturation Voltage, VCE(SAT)

 Ultra-Small Leadless Surface Mount Package

 Totally Lead-Free & Fully RoHS Compliant (Note 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

 Case: X2-DFN1006-3

 Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminals: Finish - NiPdAu, Solderable per MIL-STD-202, Method

208

 Weight: 0.0009 grams (Approximate)

Ordering Information (Note 4)

Part Number

Marking

Reel Size (in)

Tape Width (mm)

Quantity per Reel

BC846BLP4-7B

3S

7

8

10,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"

and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.

Marking Information

Bottom View

Top View

Device Schematic

C

E

B

Device Symbol

X2-DFN1006-3

C

E

B

3S = Product Type Marking Code

3S

Top View

Bar Denotes Base

and Emitter Side

e4

BC846BLP4

Document number: DS35751 Rev. 3 - 2

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BC846BLP4

Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

VCBO

80

V

Collector-Emitter Voltage

VCEO

65

V

Emitter-Base Voltage

VEBO

6

V

Collector Current - Continuous

IC

100

mA

Peak Collector Current

ICM

200

mA

Peak Emitter Current

IEM

200

mA

Thermal Characteristics

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 5)

PD

0.46

W

(Note 6)

1

Thermal Resistance, Junction to Ambient

(Note 5)

RJA

272

°C/W

(Note 6)

120

Thermal Resistance, Junction to Leads

(Note 7)

RJL

110

°C/W

Operating and Storage Temperature Range

TJ, TSTG

-55 to +150

°C

ESD Ratings (Note 8)

Characteristic

Symbol

Value

Unit

JEDEC Class

Electrostatic Discharge - Human Body Model

ESD HBM

4000

V

3A

Electrostatic Discharge - Machine Model

ESD MM

200

V

B

Notes: 5. For a device surface mounted on minimum recommended pad layout FR-4 PCB with single sided 1oz copper, in still air conditions; the device is

measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink.

6. Same as Note 5, except device is surface mounted on 25mm X 25mm collector pad heatsink with 1oz copper.

7. Thermal resistance from junction to solder-point (at the end of the collector lead).

8. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

BC846BLP4

Document number: DS35751 Rev. 3 - 2

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BC846BLP4

Thermal Characteristics

0.000001 0.0001 0.01 1 100 10,000

0.001

0.01

0.1

1

r(t), TRANSIENT THERMAL RESISTANCE

t1, PULSE DURATION TIME (sec)

Fig. 1 Transient Thermal Resistance

R (t) = r(t) * R

R = 272

癈

/W

Duty Cycle, D = t1/ t2





JA JA

JA

D = 0.5

D = 0.7

D = 0.9

D = 0.3

D = 0.1

D = 0.05

D = 0.02

D = 0.01

D = 0.005

D = Single Pulse

1,000

1E-06 0.0001 0.01 1 100 10,000

100

10

1

0.1

t1, PULSE DURATION TIME (sec)

Fig. 2 Single Pulse Maximum Power Dissipation

P , PEAK TRANSIENT POIWER (W)

(PK)

Single Pulse

R = 272 C/W

R = r * R

T - T = P * R







JA

JA(t) (t) JA

J A JA(t)



050 100 150 200

0

P , POWER DISSIPATION (W)

D

0.1

0.2

0.3

0.4

0.5

T , AMBIENT TEMPERATURE (

癈

)

Fig. 3 Power Dissipation vs. Ambient Temperature

A

R = 272 C/W

JA 

272°C /W

(°C )

BC846BLP4

Document number: DS35751 Rev. 3 - 2

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BC846BLP4

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Min

Typ

Max

Unit

Test Condition

OFF CHARACTERISTICS

Collector-Base Breakdown Voltage

BVCBO

80



V

IC = 100µA, IE = 0

Collector-Emitter Breakdown Voltage (Note 9)

BVCEO

65



V

IC = 10mA, IB = 0

Emitter-Base Breakdown Voltage

BVEBO

6



V

IE = 100µA, IC = 0

Collector Cutoff Current

ICES



15

nA

VCE = 65V

Collector Cutoff Current

ICBO



15

5.0

nA

µA

VCB = 40V

VCB = 30V, TA = +150°C

ON CHARACTERISTICS (Note 9)

DC Current Gain

hFE

200

270

450



VCE = 5V, IC = 2.0mA

Collector-Emitter Saturation Voltage

VCE(SAT)



90

220

250

600

mV

IC = 10mA, IB = 0.5mA

IC = 100mA, IB = 5.0mA

Base-Emitter Saturation Voltage

VBE(SAT)



720

870

900



mV

IC = 10mA, IB = 0.5mA

IC = 100mA, IB = 5.0mA

Base-Emitter Voltage

VBE(ON)

580



650



700

770

mV

VCE = 5V, IC = 2.0mA

VCE = 5V, IC = 10mA

SMALL SIGNAL CHARACTERISTICS (Note 9)

Input Capacitance

Cibo



6.7



pF

VCB = 5V, f = 1.0MHz

Output Capacitance

Cobo



1.76



pF

VCB = 10V, f = 1.0MHz

Current Gain-Bandwidth Product

fT

100

300



MHz

VCE = 5V, IC = 10mA, f = 100MHz

Noise Figure

NF



2

10

dB

VCE = 5V, IC = 200µA, RS = 2.0kΩ,

f = 1.0kHz, Δf = 200Hz

Delay Time

tD



11.2



ns

VCC = 30V,

IC = 150mA,

IB1 = -IB2 = 15mA

Rise Time

tR



59.7



ns

Storage Time

tS



190.8



ns

Fall Time

tF



108.6



ns

Note: 9. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle  2%.

BC846BLP4

Document number: DS35751 Rev. 3 - 2

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BC846BLP4

Typical Electrical Characteristics

0.01 0.1 1 10 100 1000

0

100

200

300

400

500

0.0 20.0 40.0 60.0

0.0

0.1

0.2

0.3

0.01 0.1 1 10 100

0.01

0.1

0.01 0.1 1 10 100 1000

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0.01 0.1 1 10 100 1000

0.0

0.2

0.4

0.6

0.8

1.0

1.2

-60 -30 0 30 60 90 120 150

0.1

1

10

100

VCE , Collector to emitter voltage (V)

VCE(SAT) (V)

150OC

VCE v IC

125OC

I C Collector Current (mA)

IB=5mA

IB=2mA

IB=3mA

IB=4mA

VBE(ON) v IC

TA = 25OC

IB=1mA

IC Collector Current (A)

150OC125OC85OC

25OC-55OC

hFE, DC Current Gain

hFE v IC

IC/IB=20

-55OC

25OC

85OC

I C Collector Current (mA)

85OC

150OC

25OC

VCE=5V

125OC

-55OC

VBE(ON) (V)

IC Collector Current (mA)

ICBOv IC

IC/IB=20

85OC

150OC

VBE(SAT) v IC

125OC

25OC

-55OC

VBE(SAT) (V)

IC Collector Current (mA)

VCBO=65V

VCE(SAT) v IC

ICBO (nA)

TA, Ambient Temperature

BC846BLP4

Document number: DS35751 Rev. 3 - 2

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BC846BLP4

Typical Electrical Characteristics (Cont.)

0.1 1 10 100

0.1

1

10

100

110 100

10

100

1000

f = 1MHz

VR V CT IC, Collector Current (mA)

Cobo

IC V fT

Cibo

VR,Reverse Voltage (V)

f =100MHz

Vce=5V

CT, Total Capacitance(pF)

fT, Gain Bandwidth Product (MHz)

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

X2-DFN1006-3

Dim

Min

Max

Typ

A



0.40



A1

0.00

0.05

0.03

b

0.10

0.20

0.15

b2

0.45

0.55

0.50

D

0.95

1.05

1.00

E

0.55

0.65

0.60

e

-

0.35

L1

0.20

0.30

0.25

L2

0.20

0.30

0.25

L3

-

0.40

z

0.02

0.08

0.05

All Dimensions in mm

L3 L1L2

e

b

D

E

A

z

b2

A1

Seating Plane

Pin #1 ID

BC846BLP4

Document number: DS35751 Rev. 3 - 2

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BC846BLP4

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

X2-DFN1006-3

Dimensions

Value (in mm)

C

0.70

G1

0.30

G2

0.20

X

0.40

X1

1.10

Y

0.25

Y1

0.70

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the

final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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C

Y1

X1

X

G2

Y

G1