Table of Contents
1 Introduction........................................................................... 5
2 Feature Descriptions............................................................. 6
2.1 Block Diagram............................................................... 6
2.2 Radio features............................................................... 8
2.3 Microcontroller features................................................. 9
2.4 System features.............................................................10
2.5 Peripheral features........................................................ 12
2.6 Security Features...........................................................17
3 Transceiver Description........................................................ 18
3.1 Transceiver Functions................................................... 18
3.2 Key Specifications......................................................... 19
3.3 Channel Map Frequency Plans .................................... 19
3.3.1 Channel Plan for Bluetooth Low Energy............19
3.3.2 Other Channel Plans ........................................ 21
4 Transceiver Electrical Characteristics................................... 21
4.1 Radio operating conditions............................................ 21
4.2 Receiver Feature Summary...........................................22
4.3 Transmit and PLL Feature Summary.............................26
5 System and Power Management.......................................... 31
5.1 Power Management.......................................................31
5.1.1 DC-DC Converter.............................................. 32
5.2 Modes of Operation....................................................... 32
5.2.1 Power modes.....................................................32
6 KW39/38/37 Electrical Characteristics.................................. 35
6.1 AC electrical characteristics...........................................35
6.2 Nonswitching electrical specifications............................35
6.2.1 Voltage and current operating requirements..... 35
6.2.2 LVD and POR operating requirements..............36
6.2.3 Voltage and current operating behaviors...........37
6.2.4 Power mode transition operating behaviors...... 38
6.2.5 Power consumption operating behaviors.......... 39
6.2.6 Diagram: Typical IDD_RUN operating behavior46
6.2.7 SoC Power Consumption.................................. 48
6.2.8 Designing with radiated emissions in mind........49
6.2.9 Capacitance attributes.......................................49
6.3 Switching electrical specifications..................................49
6.3.1 Device clock specifications................................49
6.3.2 General switching specifications....................... 50
6.4 Thermal specifications...................................................51
6.4.1 Thermal operating requirements....................... 51
6.4.2 Thermal attributes..............................................51
6.5 Peripheral operating requirements and behaviors.........52
6.5.1 Core modules.................................................... 52
6.5.2 System modules................................................ 53
6.5.3 Clock modules................................................... 54
6.5.4 Memories and memory interfaces..................... 57
6.5.5 Security and integrity modules.......................... 61
6.5.6 Analog............................................................... 61
6.5.7 Timers................................................................68
6.5.8 Communication interfaces................................. 68
6.5.9 Human-machine interfaces (HMI)......................73
6.6 DC-DC Converter Operating Requirements.................. 73
6.7 Ratings...........................................................................75
6.7.1 Thermal handling ratings................................... 75
6.7.2 Moisture handling ratings.................................. 75
6.7.3 ESD handling ratings.........................................76
6.7.4 Voltage and current operating ratings............... 76
7 Pin Diagrams and Pin Assignments......................................76
7.1 KW39/37 Signal Multiplexing and Pin Assignments...... 77
7.2 KW38 Signal Multiplexing and Pin Assignments........... 79
7.3 KW39/38/37 Pinouts......................................................82
7.4 Module Signal Description Tables................................. 83
7.4.1 Core Modules.................................................... 83
7.4.2 Radio Modules...................................................84
7.4.3 System Modules................................................ 85
7.4.4 Clock Modules................................................... 85
7.4.5 Analog Modules.................................................86
7.4.6 Timer Modules...................................................87
7.4.7 Communication Interfaces.................................87
7.4.8 Human-Machine Interfaces(HMI)...................... 89
8 Package Information............................................................. 89
8.1 Obtaining package dimensions......................................89
9 Part identification...................................................................90
9.1 Description.....................................................................90
9.2 Format........................................................................... 90
9.3 Fields............................................................................. 90
9.4 Example.........................................................................91
10 Revision History.................................................................... 91
4MKW39/38/37 Data Sheet, Rev. 7, 03/2020
NXP Semiconductors