VSMY3850-GS18 - Vishay [Semiconductors]

VSMY3850

www.vishay.com Vishay Semiconductors

Rev. 1.2, 09-Sep-11 1Document Number: 83399

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

High Speed Infrared Emitting Diode, 850 nm,

Surface Emitter Technology

DESCRIPTION

VSMY3850 is an infrared, 850 nm emitting diode based on

surface emitter technology with high radiant intensity, high

optical power and high speed, molded in a PLCC-2 package

for surface mounting (SMD).

FEATURES

• Package type: surface mount

• Package form: PLCC-2

• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75

• Peak wavelength: p = 850 nm

• High reliability

• High radiant power

• High radiant intensity

• Angle of half intensity:  = ± 60°

• Suitable for high pulse current operation

• Floor life: 168 h, MSL 3, acc. J-STD-020

• Lead (Pb)-free reflow soldering

• Compliant to RoHS Directive 2002/95/EC and in

accordance to WEEE 2002/96/EC

Note

** Please see document “Vishay Material Category Policy”:

www.vishay.com/doc?99902

RELEASED FOR APPLICATIONS

Infrared radiation source for operation with CMOS cameras

(illumination)

• High speed IR data transmission

• IR touch panels

•3D TV

• Light curtain

Note

• Test conditions see table “Basic Characteristics”

Note

• MOQ: minimum order quantity

94 8553

PRODUCT SUMMARY

COMPONENT Ie (mW/sr)  (deg) P (nm) tr (ns)

VSMY3850 17 ± 60 850 10

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM

VSMY3850-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2

VSMY3850-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2

ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)

PARAMETER TEST CONDITION SYMBOL VALUE UNIT

Reverse voltage VR5V

Forward current IF100 mA

Pulse peak forward current tp/T = 0.5, tp  100 μs IFM 200 mA

Surge forward current tp = 100 μs IFSM 1A

Power dissipation PV200 mW

Junction temperature Tj100 °C

Operating temperature range Tamb - 40 to + 85 °C

Storage temperature range Tstg - 40 to + 100 °C

Soldering temperature acc. figure 7, J-STD-020 Tsd 260 °C

Thermal resistance junction/ambient J-STD-051, soldered on PCB RthJA 250 K/W

VSMY3850

www.vishay.com Vishay Semiconductors

Rev. 1.2, 09-Sep-11 2Document Number: 83399

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature

22541

amb

- Ambient Temperature (°C)

PV - Power Dissipation (mW)

100

150

200

250

0 20406080100

thJA

= 250 K/W

22542 Tamb - Ambient Temperature (°C)

IF - Forward Current (mA)

100

120

0 20406080100

RthJA

= 250 K/W

BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT

Forward voltage IF = 100 mA, tp = 20 ms VF1.6 2.0 V

IF = 1 A, tp = 100 μs VF2.9 V

Temperature coefficient of VF

IF = 1 mA TKVF - 1.45 mV/K

IF = 10 mA TKVF - 1.2 mV/K

Reverse current IRnot designed for reverse operation μA

Junction capacitance VR = 0 V, f = 1 MHz, E = 0 Cj125 pF

Radiant intensity IF = 100 mA, tp = 20 ms Ie12 17 25 mW/sr

IF = 1 A, tp = 100 μs Ie150 mW/sr

Radiant power IF = 100 mA, tp = 20 ms e55 mW

Temperature coefficient of eIF = 100 mA TKe- 0.35 %/K

Angle of half intensity ± 60 deg

Peak wavelength IF = 100 mA p840 850 870 nm

Spectral bandwidth IF = 30 mA  30 nm

Temperature coefficient of pIF = 100 mA TKp0.25 nm/K

Rise time IF = 100 mA tr10 ns

Fall time IF = 100 mA tf10 ns

Virtual source diameter d 0.44 mm

VSMY3850

www.vishay.com Vishay Semiconductors

Rev. 1.2, 09-Sep-11 3Document Number: 83399

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)

Fig. 3 - Forward Current vs. Forward Voltage

Fig. 4 - Radiant Intensity vs. Forward Current

Fig. 5 - Relative Radiant Power vs. Wavelength

Fig. 6 - Relative Radiant Intensity vs. Angular Displacement

21892

IF - Forward Current (A)

VF - Forward Voltage (V)

0.001

0.01

0.1

0 0.5 1 1.5 2 2.5 3

tp = 100 µs

21893 IF - Forward Pulse Current (A)

Ie - Radiant Intensity (mW/sr)

0.1

100

1000

0.001 0.01 0.1 1

tp = 100 µs

λ - Wavelength (nm)

21776-1

Φe, rel - Relative Radiant Power

0.25

0.5

0.75

650 750 850 950

= 30 mA

0.4 0.2 0

e, rel

- Relative Radiant Intensity

94 8013

0.6

0.9

0.8

0°

30°

10° 20°

40°

50°

60°

70°

80°

0.7

1.0

ϕ - Angular Displacement

VSMY3850

www.vishay.com Vishay Semiconductors

Rev. 1.2, 09-Sep-11 4Document Number: 83399

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

PACKAGE DIMENSIONS in millimeters

SOLDER PROFILE

Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 168 h

Conditions: Tamb < 30 °C, RH < 60 %

Moisture sensitivity level 3, acc. to J-STD-020.

DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

TAPE AND REEL

PLCC-2 components are packed in antistatic blister tape

(DIN IEC (CO) 564) for automatic component insertion.

Cavities of blister tape are covered with adhesive tape.

Mounting Pad Layout

1.2

2.6 (2.8)

1.6 (1.9)

area covered with

solder resist

Drawing-No.: 6.541-5067.02-4

Issue: 4; 19.07.10

20767

technical drawings

according to DIN

specifications

Pin identification

2.8 ± 0.15 1.75 ± 0.1

2.2 0.9

3.5 ± 0.2

3 + 0.15

Ø 2.4

100

150

200

250

300

0 50 100 150 200 250 300

Time (s)

Temperature (°C)

240 °C 245 °C

max. 260 °C

max. 120 s max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s max. ramp down 6 °C/s

19841

255 °C

VSMY3850

www.vishay.com Vishay Semiconductors

Rev. 1.2, 09-Sep-11 5Document Number: 83399

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

Fig. 8 - Blister Tape

Fig. 9 - Tape Dimensions in mm for PLCC-2

MISSING DEVICES

A maximum of 0.5 % of the total number of components per

reel may be missing, exclusively missing components at the

beginning and at the end of the reel. A maximum of three

consecutive components may be missing, provided this gap

is followed by six consecutive components.

Fig. 10 - Beginning and End of Reel

The tape leader is at least 160 mm and is followed by a

carrier tape leader with at least 40 empty compartments.

The tape leader may include the carrier tape as long as the

cover tape is not connected to the carrier tape. The least

component is followed by a carrier tape trailer with a least

75 empty compartments and sealed with cover tape.

Fig. 11 - Dimensions of Reel-GS08

Fig. 12 - Dimensions of Reel-GS18

COVER TAPE REMOVAL FORCE

The removal force lies between 0.1 N and 1.0 N at a removal

speed of 5 mm/s. In order to prevent components from

popping out of the blisters, the cover tape must be pulled off

at an angle of 180° with regard to the feed direction.

Adhesive tape

Component cavity

Blister tape

94 8670

1.85

1.65

4.0

3.6

3.4

2.05

1.95

1.6

1.4

4.1

3.9

4.1

3.9

5.75

5.25

8.3

7.7

3.5

3.1

2.2

2.0

0.25

94 8668

De-reeling direction

Tape leader

min. 75 empty

compartments

> 160 mm

40 empty

compartments

Carrier leader Carrier trailer

94 8158

180

178

4.5

3.5

2.5

1.5

13.00

12.75

63.5

60.5

14.4 max.

10.0

9.0

120°

94 8665

Identification

Label:

Vishay

type

group

tape code

production

code

quantity

321

329

Identification

4.5

3.5

2.5

1.5

13.00

12.75

62.5

60.0

14.4 max.

10.4

8.4

120°

18857

Label:

Vishay

type

group

tape code

production

code

quantity

Legal Disclaimer Notice

www.vishay.com Vishay

Revision: 12-Mar-12 1Document Number: 91000

Disclaimer

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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,

“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

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consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular

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requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements

about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular

product with the properties described in the product specification is suitable for use in a particular application. Parameters

provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All

operating parameters, including typical parameters, must be validated for each customer application by the customer’s

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including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

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Material Category Policy

Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the

definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council

of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment

(EEE) - recast, unless otherwise specified as non-compliant.

Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that

all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.