PR3BMF51NSKF Series
1
Sheet No.: D4-A03801EN
Date Sep. 1. 2006
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of con rmation by device speci cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device speci cation sheets before using any SHARP device.
PR3BMF51NSKF
Series
*Zero cross type is also available. (PR3BMF21NSZF Series)
IT(rms)1.2A, Non-Zero Cross type
DIP 8pin
Triac output SSR
Description
PR3BMF51NSKF Series Solid State Relays (SSR)
are an integration of an infrared emitting diode (IRED),
a Phototriac Detector and a main output Triac. These
devices are ideally suited for controlling high voltage AC
loads with solid state reliability while providing 4kV isola-
tion (Viso(rms)) from input to output.
Features
1. Output current, IT(rms)1.2A
2. Non-zero crossing functionary
3. 8 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage (VDRM : 600V)
5. Superior noise immunity (dV/dt : MIN. 100V/μs)
6. Response time, ton : MAX. 100μs
7. High isolation voltage between input and output
(Viso(rms) : 4kV)
8. Lead free and RoHS directive compliant
Agency approvals/Compliance
1. Recognized by UL508 le No. E94758 (as model No.
R3BMF5)
2. Approved by CSA 22.2 No.14, le No. LR63705 (as
model No. R3BMF5)
3. Optionary available VDE approved (DIN EN 60747-5-
2)(), le No. 40008898 (as model No. R3BMF5)
4. Package resin : UL ammability grade (94V-0)
() DIN EN60747-5-2 : successor standard of DIN VDE0884.
Applications
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching motors, fans, heaters, solenoids, and
valves.
3. Phase or power control in applications such as light-
ing and temperature control equipment.
2
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Internal Connection Diagram
Outline Dimensions (Unit : mm)
Product mass : approx. 0.56g
1
68
1 2 3 4
5
2
3
4
Cathode
Anode
Cathode
Cathode
5
6
8
Gate
Output (T1)
Output (T2)
1. Through-Hole [ex. PR3BMF51NSKF]
2.54±0.25
8 6 5
6.5±0.5
1.05±0.20
1.2±0.3
9.66±0.50
3.5
±0.5
0.5±0.1
1 2 3 4
3.25±0.50
0.5TYP.
θ θ
θ : 0 to 13˚
7.62±0.30
0.26±0.10
Epoxy resin
R3BMF5
Anode
mark
Date code (2 digit)
Rank
mark
Factory identification mark
SHARP
mark
"S"
CSA mark
Model No.
Product mass : approx. 0.54g
2.
SMT Gullwing Lead-Form [ex. PR3BMF51NIPF]
Product mass : approx. 0.56g Product mass : approx. 0.54g
3. Through-Hole VDE option
[ex.
PR3BMF51YSKF]
4. SMT Gullwing Lead-Form VDE option
[ex.
PR3BMF51YIPF]
8 6 5
6.5±0.5
2.54±0.25
3.5±0.5
1.0+0.4
0
0.26±0.10
Epoxy resin
10.0+0
0.5
1.0+0.4
0
0.35±0.25
7.62±0.30
9.66±0.50
4
1 2 3
1.05±0.20
1.2±0.3
R3BMF5
Anode
mark
Date code (2 digit)
Rank
mark
Factory identification mark
SHARP
mark
"S"
CSA mark
Model No.
2.54±0.25
8 6 5
6.5±0.5
1.05±0.20
1.2±0.3
9.66±0.50
3.5
±0.5
0.5±0.1
1 2 3 4
3.25±0.50
0.5TYP.
θ θ
θ:0 to 13˚
7.62±0.30
0.26±0.10
Epoxy resin
R3BMF5
Anode
mark
Date code (2 digit)
Rank
mark
Factory identification mark
SHARP
mark
"S"
CSA mark
Model No.
4
VDE identification mark
8
6.5±0.5
2.54±0.25
3.5±0.5
1.0+0.4
0
0.26±0.10
Epoxy resin
10.0+0
0.5
1.0+0.4
0
0.35±0.25
7.62±0.30
9.66±0.50
4
1 2 3
1.05±0.20
1.2±0.3
6 5
R3BMF5
Anode
mark
Date code (2 digit)
Rank
mark
Factory identification mark
SHARP
mark
"S"
CSA mark
Model No.
4
VDE identification mark
Plating material : SnCu (Cu : TYP. 2%)
3
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
repeats in a 20 year cycle
Rank mark
Please refer to the Model Line-up table.
1st digit 2nd digit
Year of production Month of production
A.D. Mark A.D. Mark Month Mark
1990 A 2002 P January 1
1991 B 2003 R February 2
1992 C 2004 S March 3
1993 D 2005 T April 4
1994 E 2006 U May 5
1995 F 2007 V June 6
1996 H 2008 W July 7
1997 J 2009 X August 8
1998 K 2010 A September 9
1999 L 2011 B October O
2000 M 2012 C November N
2001 N : : December D
Date code (2 digit)
Factory identi cation Mark Country of origin
no mark
Japan
* This factory marking is for identi cation purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
Factory identi cation mark
4
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Absolute Maximum Ratings
Electro-optical Characteristics
(Ta=25˚C)
Parameter Symbol Rating Unit
Input Forward current IF503mA
Reverse voltage VR6V
Output
RMS ON-state current
IT(rms) 1.23A
Peak one cycle surge current
Isurge 124A
Repetitive peak OFF-state voltage VDRM 600 V
*1 Isolation voltage Viso(rms) 4 kV
Operating temperature Topr 30 to +105 ˚C
Storage temperature Tstg 40 to +125 ˚C
*2 Soldering temperature Tsol 270 ˚C
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=50Hz sine wave
(Ta=25˚C)
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input Forward voltage VFIF=20mA 1.2 1.4 V
Reverse current IRVR=3V −−
10 μA
Output
Repentitive peak OFF-state current IDRM VD=VDRM −−
100 μA
ON-state voltage VTIT=1.2A −−
2.5 V
Holding current IHVD=6V −−
25 mA
Critical rate of rise of OFF-state voltage
dV/dt VD=1/
2 ·VDRM 100 −−
V/μs
Transfer
charac-
teristics
Minimum trigger current IFT VD=6V, RL=100Ω−
10 mA
Isolation resistance RISO DC500V, 40 to 60%RH 5×1010 1011 −Ω
Turn-on time tON VD=6V, RL=100Ω, IF=20mA −−
100 μs
1mm
Soldering area
5
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Model Line-up
Lead Form Through-Hole SMT Gullwing
VDRM
[V]
Rank
mark
IFT[mA]
(VD=6V,
RL=100Ω)
Shipping
Package
Sleeve Taping
50 pcs/sleeve 1 000 pcs/reel
DIN
EN60747-5-2
Approved
Approved
Model No. PR3BMF51NSKF PR3BMF51YSKF PR3BMF51NIPF PR3BMF51YIPF 600 1 MAX.10
Please contact a local SHARP sales representative to inquire about production status.
6
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Fig.5 ON-state Voltage vs.
Ambient Temperature
Fig.6 Relative Holding Current vs.
Ambient Temperature
Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs.
Ambient Temperature
Fig.1 Forward Current vs.
Ambient Temperature
Fig.2 RMS ON-state Current vs.
Ambient Temperature
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
10
20
40
50
30
60
30 0 50 100
0
0.2
0.4
1.2
0.8
1
0.6
1.4
30 0 50 100
RMS ON-state current IT(rms) (A)
Ambient temperature Ta (˚C)
CONDITION
No heat sink
Paper phenol boad:
100mm×100mm×1.6mm
All pins should be installed in
the print board with soldering
Solder land:140mm2
(the total of all solder land area)
1
100
10
0.50 1 1.5 2 2.5 3
25˚C
50˚C
25˚C0˚C
Forward current IF (mA)
Forward voltage VF (V)
Ta=75˚C
0
2
4
6
10
8
12
40 020 20 40 60 80 100 120
Minimum trigger current IFT (mA)
Ambient temperature Ta (C)
VD=6V
RL=100
0.8
1
0.9
1.2
1.1
1.3
1.4
ON-state voltage VT (V)
Ambient temperature Ta (˚C)
IT(rms)=1.2A
30 0 50 100
10
100
1 000
Relative holding current I
H
(t˚C) / I
H
(25˚C)×100%
Ambient temperature Ta (˚C)
VD=6V
30 0 50 100
7
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Fig.7 ON-state Current vs. ON-state Voltage Fig.8 Turn-on Time vs. Forward Current
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
0
0.3
1.2
0.9
0.6
1.5
1.8
2.1
0 0.5 1 1.5
ON-state current IT (A)
ON-state voltage VT (V)
IF=20mA
Ta=25˚C
100
10
1
100
VD=6V
RL=100Ω
Ta=25˚C
10
Forward current IF (mA)
Turn-on time tON (μs)
8
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Design Considerations
Recommended Operating Conditions
Parameter Symbol Condition MIN. MAX. Unit
Input Input signal current at ON state IF(ON) 20 25 mA
Input signal current at OFF state IF(OFF) 0 0.1 mA
Output
Load supply voltage VOUT(rms) −−
240 V
Load supply current IOUT(rms)
Locate snubber circuit between output terminals
(Cs=0.022μF, Rs=47Ω)IT(rms)×
80%(*) A
Frequency f 50 60 Hz
Operating temperature Topr −−
20 80 ˚C
(*) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
Degradation
In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less
In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width
is a minimum of 1ms.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situa-
tion, please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit values to start with : Cs=0.022μF and Rs=47Ω. The operation of the SSR
and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit
component values accordingly
When making the transition from On to Off state, a snubber circuit should be used ensure that sudden drops
in current are not accompanied by large instantaneous changes in voltage across the Triac.
This fast change in voltage is brought about by the phase difference between current and voltage.
Primarily, this is experienced in driving loads which are inductive such as motors and solenods.
Following the procedure outlined above should provide suf cient results.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main out-
put triac as possible.
All pins shall be used by soldering on the board. (Socket and others shall not be used.)
Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature uctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
9
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Recommended Foot Print (reference)
SMT Gullwing Lead-form
2.542.54
1.7
2.2
8.2
2.54
(Unit : mm)
Standard Circuit
Tr1
R1
D1
V1
+VCC
AC Line
Load
ZS
ZS : Surge absorption circuit (Snubber)
SSR
2
82
36
For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Manufacturing Guidelines
Soldering Method
Re ow Soldering :
Re ow soldering should follow the temperature pro le shown below.
Soldering should not exceed the curve of temperature pro le and time.
Please don't solder more than twice.
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
(package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
Flow Soldering (No Solder bathing)
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works ne, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
11
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work ne in ac-
tual using conditions since some materials may erode the packaging resin.
Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Speci c brominated ame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead(*), Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
(*) High melting temperature type solders (i.e. tin-lead solder alloys containing more than 85% lead)
is exempted from the requirements.
12
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Package speci cation
Sleeve package
Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12
6.7
5.8
10.8
520
±2
(Unit : mm)
13
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
G
B
H
A
C
Dimensions List (Unit : mm)
5˚
MAX.
H
A
16.0±0.3
B
7.5±0.1
C
1.75±0.10
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.40±0.05
J
4.2±0.1
K
10.2±0.1
F
4.0±0.1
G
φ1.5+0.1
0
Reel structure and Dimensions
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
φ330
b
17.5±1.5
c
φ100±1
d
φ13.0±0.5
e
φ23±1
f
2.0±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 1 000pcs/reel]
14
Sheet No.: D4-A03801EN
PR3BMF51NSKF Series
Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
speci cations, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used speci ed in the relevant speci cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Of ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traf c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
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