ECXO-2325-21.2992M RoHS Pb PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters are intentionally excluded from this specification sheet. ECXO-2325 -21.2992M Series Ecliptek Custom Oscillator Nominal Frequency 21.2992MHz ELECTRICAL SPECIFICATIONS Nominal Frequency 21.2992MHz ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014 Condition A Gross Leak Test MIL-STD-883, Method 1014 Condition C Mechanical Shock MIL-STD-202, Method 213 Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007 Condition A MECHANICAL DIMENSIONS (all dimensions in millimeters) 1.65 0.20 5.00 0.15 1.3 0.2 MARKINING ORIENTATION 7.00 0.15 2.54 TYP 5.08 0.15 6 1 5 2 4 3 3.68 0.15 1.4 0.1 PIN CONNECTION 1 Control Voltage 2 No Connect 3 Case/Ground 4 Output 5 Tri-State 6 Supply Voltage LINE MARKING 1 ECXO2325 2 21.299M 3 XXXXX XXXXX=Ecliptek Manufacturing Code www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/17/2010 | Page 1 of 4 ECXO-2325-21.2992M Suggested Solder Pad Layout All Dimensions in Millimeters 1.8 (X6) 2.0 (X6) 0.54 (X4) 1.89 Solder Land (X6) All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/17/2010 | Page 2 of 4 ECXO-2325-21.2992M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/17/2010 | Page 3 of 4 ECXO-2325-21.2992M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/17/2010 | Page 4 of 4