Panasonic Corporation 2013©
Panasonic Corporation Automation Controls Buisiness Division
industrial.panasonic.com/ac/e/
LED lighting terminal L2 series
–5– ACCTB59E 201310-T
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
NOTES ON USING CONNECTOR FOR LED LIGHTING L2
• Tape packed status
Receptacle
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(16.0 )
(7.5)
(1.75)
(2.0)
(4.0)
(4.0)
+0.3
−0.1
1.5 dia.
+0.1
0
Leading direction after packaging
(17.4±1)
Top cover tape
Taping reel
Label
380 dia.
Embossed mounting-hole
Embossed carrier tape
Type
Direction
of tape progress
L2
■ Safety precautions
Observe the following safety precautions to prevent accidents
and injuries.
1) The use of the product outside of the specified rated current
and breakdown voltage ranges may cause abnormal heating,
smoke, and fire. Never use the product beyond the specified
ranges.
2) In order to avoid accidents, make sure you have thoroughly
reviewed the specifications before use. Consult us if you plan to
use the product in a way not covered by the specifications.
3) We are consistently striving to improve quality and reliability.
However, the fact remains that electrical components and
devices generally fail at a given statistical probability.
Furthermore, their durability varies depending on where and
how they are used.
Please be sure to verify electrical components and devices
under actual conditions before use. Continuously using them in
a state of degraded performance may cause deterioration in
insulation performance, thus resulting in abnormal heat
generation, smoke generation, or fire. To avoid that, we ask you
to implement safe designs that include redundancy, fire
prevention, and malfunction prevention. Also, please conduct
periodic maintenance so that no accidents resulting in injury or
death, fire, or harm to society will be caused as a result of
product failure or service life.
■ Mounting of receptacle
1) PC board design
• Design the recommended foot pattern in order to secure the
mechanical strength in the soldered areas.
2) Receptacle mounting
• When mounting, if there is too much suction nozzle pressure,
the receptacle might deform and break. Please check
beforehand.
• To mount the receptacle, place the adsorption nozzle within the
adsorption range shown in the specification diagram and pay
careful attention not to cause the receptacle to deform.
• In case of dry condition, please care the occurrence of static
electricity.
The product may be adhered to the embossed carrier tape or
the cover tape in dry condition.
Recommended humidity is between 40 to 60% and please
remove static electricity by ionizer in manufacturing scene.
3) Soldering
(1) Manual soldering
This product is not designed to be mounted by manual
soldering.
(2) Reflow soldering
• Screen-printing is recommended for printing paste solder.
• To determine the relationship between the screen opening area
and the PC board foot pattern area, refer to the diagrams in the
recommended patterns for PC boards and metal masks. Make
sure to use the terminal tip as a reference position when setting.
• Too much solder may cause solder creeping near the
contacting part or contact failure.
• Consult us when using a screen-printing thickness other than
that recommended.
• Depending on the size of the receptacle being used, self
alignment may not be possible. Accordingly, carefully position
the receptacle with the PC board pattern.
• The recommended reflow temperature profile is given in the
figure below.
• The temperature is measured on the surface of the PC board
near the receptacle.
• Certain solder and flux types may cause serious solder
creeping. Solder and flux characteristics should be taken into
consideration when setting the reflow soldering conditions.
• When coating the PC board after soldering the receptacle to
prevent the deterioration of insulation, perform the coating in
such a way so that the coating does not get on the receptacle.
60 to 120 sec.
Preheating
Time
Te mperature Peak temperature
200°C
220°C
Upper limit (Solder heat resistance)
260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limit (Solder wettability)