The LP239 is obsolete
a
nd is no longer supplied.
SLCS004B − O C TOBER 1987 − REVISED SEPTEMBER 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DWide Supply-Voltage Range ...3 V to 30 V
DUltralow Power Supply Current
Drain ...60 µA Typ
DLow Input Biasing Current ...3 nA
DLow Input Offset Current . . . ±0.5 nA
DLow Input Offset Voltage . . . ±2 mV
DCommon-Mode Input Voltage Includes
Ground
DOutput Voltage Compatible With MOS and
CMOS Logic
DHigh Output Sink-Current Capability
(30 mA at VO = 2V)
DPower Supply Input Reverse-Voltage
Protected
DSingle-Power-Supply Operation
DPin-for-Pin Compatible With LM239, LM339,
LM2901
description/ordering information
The LP239, LP339, LP2901 are low-power quadruple differential comparators. Each device consists of four
independent voltage comparators designed specifically to operate from a single power supply and typically to
draw 60-µA drain current over a wide range of voltages. Operation from split power supplies also is possible
and the ultra-low power-supply drain current is independent of the power-supply voltage.
Applications include limit comparators, simple analog-to-digital converters, pulse generators, squarewave
generators, time-delay generators, voltage-controlled oscillators, multivibrators, and high-voltage logic gates.
The LP239, LP339, LP2901 were designed specifically to interface with the CMOS logic family. The ultra-low
power-supply current makes these products desirable in battery-powered applications.
The LP239 is characterized for operation from −25°C to 85°C. The LP339 is characterized for operation from
0°C to 70°C. The LP2901 is characterized for operation from −40°C to 85°C.
ORDERING INFORMATION
TAVIOMAX
AT 25°CPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP (N) Tube of 25 LP339N LP339N
0°C to 70°C±5 mV
SOIC (D)
Tube of 50 LP339D
LP339
0C to 70 C
±5 mV
SOIC (D) Reel of 2500 LP339DR LP339
PDIP (N) Tube of 25 LP2901N LP2901N
−40°C to 85°C±5 mV
SOIC (D)
Tube of 50 LP2901D
LP2901
−40 C to 85 C
5 mV
SOIC (D)
Reel of 2500 LP2901DR
LP2901
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
2OUT
VCC
2IN −
2IN +
1IN −
1IN +
3OUT
4OUT
GND
4IN +
4IN −
3IN +
3IN −
D OR N PACKAGE
(TOP VIEW)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
The LP239 is obsolete
a
nd is no longer supplied.
SLCS004B − O C TOBER 1987 − REVISED SEPTEMBER 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
schematic diagram (each comparator)
5 µA
IN+
IN−
GND
OUT
6 µA
0.2 µA
VCC
0.2 µA
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage, VID (see Note 2) ±36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (either input) −0.3 V to 36 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current, VI ≤ −0.3 V (see Note 3) −50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground (see Note 4) Unlimited. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total dissipation (see Note 5) See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, TA: LP239 −25°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LP339 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LP2901 −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 6 and 7): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature range 1,6 mm (1/16 inch) from case for 60 seconds: J package 300°C. . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated in the recommended operating conditions is not implied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to the network ground.
2. Differential voltages are at IN+ with respect to IN −.
3. This input current only exists when the voltage at any of the inputs is driven negative. The current flows through the collector-base
junction of the input clamping device. In addition to the clamping device action, there is lateral n-p-n parasitic transistor action. This
action is not destructive, and normal output states are reestablished when the input voltage returns to a value more positive than
− 0.3 V at TA = 25°C.
4. Short circuits between outputs to VCC can cause excessive heating and eventual destruction.
5. If the output transistors are allowed to saturate, the low-bias dissipation and the on-off characteristics of the outputs keep the
dissipation very small (usually less than 100 mW).
6. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability.
7. The package thermal impedance is calculated in accordance with JESD 51-7.
DISSIPATION RATING TABLE
PACKAGE TA ≤ 25°C
POWER RATING DERATING F ACTOR
ABOVE TA = 25°CTA = 70°C
POWER RATING TA = 85°C
POWER RATING
J1025 mW 8.2 mW/°C656 mW 533 mW
The LP239 is obsolete
a
nd is no longer supplied.
SLCS004B − O C TOBER 1987 − REVISED SEPTEMBER 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
LP239 LP339 LP2901
UNIT
MIN MAX MIN MAX MIN MAX
UNIT
VCC Supply voltage 3 30 3 30 3 30 V
VIC
Common-mode input voltage
VCC = 5 V 0 3 0 3 0 3 V
VIC Common-mode input voltage VCC = 30 V 0 28 0 28 0 28 V
VI
Input voltage
VCC = 5 V 0 3 0 3 0 3 V
VIInput voltage VCC = 30 V 0 28 0 28 0 28 V
TAOperating free-air temperature −25 85 0 70 −40 85 °C
electrical characteristics, VCC = 5 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS TA†MIN TYP MAX UNIT
VIO
Input offset voltage
VCC = 5 V to 30 V,
VO = 2 V,
25°C±2±5
mV
VIO Input offset voltage
VCC = 5 V to 30 V,
RS = 0,
VO = 2 V,
See Note 6 Full range ±9mV
IIO
Input offset current
25°C±0.5 ±5
nA
IIO Input offset current Full range ±1±15 nA
IIB
Input bias current
See Note 7
25°C −2.5 −25
nA
IIB Input bias current See Note 7 Full range −4 −40 nA
VICR
Common-mode input voltage
Single supply
25°C0 to
VCC − 1.5
V
VICR
Common-mode input voltage
range Single supply Full range 0 to
VCC − 2
V
AVD Large-signal differential voltage
amplification VCC = 15 V, RL = 15 kΩ500 V/mV
VI− = 1 V,
VO = 2 V,
25°C 20 30
Output sink current VI− = 1 V,
VI+ = 0
VO = 2 V,
See Note 8 Full range 15 mA
Output sink current
VI+ = 0
VO = 0.4 V 25°C 0.2 0.7
mA
Output leakage current
VI+ = 1 V,
VO = 5 V 25°C 0.1 nA
Output leakage current
VI+ = 1 V,
VI− = 0 VO = 30 V Full range 1µA
VID Differential input voltage VI ≤ 0 (or VCC − on split supplies) 36 V
ICC Supply current RL = ∞ all comparators 60 100 µA
†Full range is −25°C to 85°C for the LP239, 0°C to 70°C for the LP339, and −40°C to 85°C for the LP2901.
NOTES: 8. VIO is measured over the full common-mode input voltage range.
9. Because of the p-n-p input stage, the direction of the current is out of the device. This current essentially is constant (i.e., independe nt
of the output state). No loading change exists on the reference or input lines as long as the common-mode input voltage range is
not exceeded.
10. The output sink current is a function of the output voltage. These devices have a bimodal output section that allows them to sink
(via a Darlington connection) large currents at output voltages greater than 1.5 V, and smaller currents at output voltages
less than 1.5 V.
switching characteristics, VCC = 5 V, TA = 25°C, RL connected to 5 V through 5.1 kΩ
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Large-signal response time
TTL logic swing, Vref = 1.4 V
1.3
µs
Response time
TTL logic swing, V
ref
= 1.4 V
8µ
s
The LP239 is obsolete
a
nd is no longer supplied.
SLCS004B − O C TOBER 1987 − REVISED SEPTEMBER 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
Figure 1 shows the basic configuration for using the LP239, LP339, or LP2901 comparator. Figure 2 shows the
diagram for using one of these comparators as a CMOS driver.
Figure 1. Basic Comparator
IN +
IN − OUT
30 kΩ
+
−
VCC
1/4 LP239, LP339,
or LP2901
Figure 2. CMOS Driver
IN +
IN −
100 kΩ
1/4 LP239, LP339,
or LP2901 1/4 SN54/74LS00 or
1/4 SN54/74ALS1000A
V
CC
+
−12
3OUT
All pins of any unused comparators should be grounded. The bias network of the LP239, LP339, and LP2901
establishes a drain current that is independent of the magnitude of the power-supply voltage over the range of
2 V to 30 V. It usually is necessary to use a bypass capacitor across the power supply line.
The differential input voltage may be larger than VCC without damaging the device. Protection should be
provided to prevent the input voltages from going negative by more than −0.3 V. The output section has two
distinct modes of operation: a Darlington mode and ground-emitter mode. This unique drive circuit permits the
device to sink 30 mA at VO = 2 V in the Darlington mode and 700 µA at VO = 0.4 V in the ground-emitter mode.
Figure 3 i s a simplified schematic diagram of the output section. The output section is configured in a Darlington
connection (ignoring Q3). If the output voltage is held high enough (above 1 V), Q1 is not saturated and the
output current is limited only by the product of the hFE of Q1, the hFE of Q2, and I1 and the 60-Ω saturation
resistance of Q2. The devices are capable of driving LEDs, relays, etc. in this mode while maintaining an
ultra-low power-supply current of 60 µA, typically.
VCC
VO
Q2
Q1
Q3
I1 = 6 µA
Figure 3. Output-Section Schematic Diagram
The LP239 is obsolete
a
nd is no longer supplied.
SLCS004B − O C TOBER 1987 − REVISED SEPTEMBER 2004
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
Without transistor Q3, if the output voltage were allowed to drop below 0.8 V, transistor Q1 would saturate, and
the output current would drop to zero. The circuit would be unable to pull low current loads down to ground or
the negative supply, if used. Transistor Q3 has been included to bypass transistor Q1 under these conditions
and apply the current I1 directly to the base of Q2. The output sink current now is approximately I1 times the
hFE of Q2 (700 µA at VO = 0.4 V). The output of the devices exhibits a bimodal characteristic, with a smooth
transition between modes.
In both cases, the output is an uncommitted collector. Several outputs can be tied together to provide a dot logic
function. An output pullup resistor can be connected to any available power-supply voltage within the permitted
power-supply range, and there is no restriction on this voltage, based on the magnitude of the voltage that is
supplied to VCC of the package.
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
LP239D OBSOLETE SOIC D 14 TBD Call TI Call TI
LP239N OBSOLETE PDIP N 14 TBD Call TI Call TI
LP2901D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2901DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2901DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2901DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2901DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2901DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP2901N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LP2901NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LP339D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP339DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP339DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP339DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP339DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP339DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
LP339N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
LP339NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LP2901 :
•Automotive: LP2901-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP2901DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LP2901DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LP339DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
LP339DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP2901DR SOIC D 14 2500 367.0 367.0 38.0
LP2901DR SOIC D 14 2500 333.2 345.9 28.6
LP339DR SOIC D 14 2500 367.0 367.0 38.0
LP339DR SOIC D 14 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
