6/21/2017 ON Semiconductor: RoHS (Material Composition) | | Feedback Products Company Investor Relations Contact Us Quality Quality System Corporate Social Responsibility Applications Tools Sustainability Manufacturing Scrap Reclaim Center Environmental Health & Safety MyON Enter Part#/Keyword/Crossreference Rate this webpage Search XREF Need Support? Material Composition Technical Support Locate Pbfree (RoHS) and Halogenfree Material content details. AP1302CSSL00SMGA0DR Environmental Programs Product Stewardship Programs About Home > About > Quality > Environmental Programs > RoHS (Material Composition) Search Download: Excel Sort by entry order Use~for the exact search match (i.e. ~NTS2101PT1). 2 Nonhybrid devices found Nonhybrid devices 1 2 of 2 Page size: [ 1] Mold Compound Green Partner Certificates Epoxy Phenolic + Carbon Fused AlHydroxide Resin Phenol black silica [%] [%] Resin [%] [%] [%] Takeback and Recycle Policy Careers Base part Part AP1302CSSL00SMGA0DR Status HF Active AP1302CSSL00SMGA0DR1 Active 1 2 of 2 Y Y Excel IPC175X XML Silica Weight crystalline [mg] [%] Acrylic Polyimide Weight resins [%] [mg] [%] n/a 60676 860 n/a Al [%] n/a 7440 7429 213 905 Fiber glass [%] n/a 65997 173 Organic Resin (Bismaleimide Cu + Triazine + [%] Epoxy resin) [%] 13676545 1156510 29690822 25068386 Ni [%] Au [%] 7440 7440 7440 508 020 575 Cured Resin of Weight Solder [mg] Mask [%] Ag [%] Sn [%] Cu [%] 7440 7440 7440 224 315 508 Wire Bond Weight [mg] Cu [%] Weight [mg] Conflict Minerals 50 TOTAL Au Sn Weight [1=Yes] [1=Yes] [mg] n/a n/a n/a 7440 508 n/a 7440 575 7440 315 0.30 75.90 10.30 33.8000 7.50 54.50 10.50 27.50 0.8000 0.38 99.63 0.99 8.0200 21.19 13.08 49.36 1.90 0.25 14.22 12.3100 3.00 96.50 0.50 12.5600 100.00 0.6100 1.0000 1.00 68.1000 3.00 4.50 6.00 0.30 75.90 10.30 33.8000 7.50 54.50 10.50 27.50 0.8000 0.38 99.63 0.99 8.0200 21.19 13.08 49.36 1.90 0.25 14.22 12.3100 3.00 96.50 0.50 12.5600 100.00 0.6100 1.0000 1.00 68.1000 n/a n/a Weight [mg] Solder Ball 6.00 n/a n/a Misc. Si [%] [%] Organic Substrate and Solder Mask 4.50 n/a 14808 607 Epoxy Fused resins silica [%] [%] Die 3.00 21645512 1333 60676 864 860 Die Attach n/a Page size: [ 1] 50 Materials Disclosure Disclaimer Note: Even though all possible efforts have been made to provide you with the most accurate information, we can not guarantee to its completeness and accuracy due to the fact that the data has been compiled based on the ranges provided and some information that may not have been provided by the subcontractors and raw material suppliers to protect their business proprietary information. Based on the above considerations, this information is provided only as estimates of the average weight of these parts and the anticipated significant toxic metals components. These estimates do not include trace levels of dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of Mercury, Hexavalent Chromium, Cadmium, PBBE or PBDE (5 of the 6 RoHS banned substances) in this or any of our other products. For further explanation on material composition calculations, please view our Product Chemical Content Brochure. Privacy Policy | Terms of Use | Site Map | Careers | Contact Us | Terms and Conditions | Mobile Portal | Mobile App Copyright (c) 19992017 ON Semiconductor http://www.onsemi.com/PowerSolutions/MaterialComposition.do Follow Us 1/1