2N6661DCSM
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DOC 8874, ISSUE 1
FEATURES
• Faster switching
• Low Ciss
• Integral Source-Drain Diode
• High Input Impedance and High Gain
DESCRIPTION
These Dual enhancement-mode (normally-off) vertical DMOS
FETs are ideally suited to a wide range of switching and
amplifying applications where high breakdown voltage, high
input impedance, low input capacitance, and fast switching
speeds are desired.
High Reliability Screening options are available.
ENHANCEMENT MODE
MOSFET
VDSS 90V
ID 0.9A
RDS(on) 4.0Ω
CERAMIC LCC2 PACKAGE
(Underside View)
PAD 1 – DRAIN 1 PAD 4 – DRAIN 2
PAD 2 – GATE 1 PAD 5 – SOURCE 2
PAD 3 – GATE 2 PAD 6 – SOURCE 1
1
2
6
3
4
5
2.54 ± 0.13
(0.10 ± 0.005)
0.64 ± 0.06
(0.025 ± 0.003)
0.23
(0.009)
1.40 ± 0.15
(0.055 ± 0.006)
1.65 ± 0.13
(0.065 ± 0.005)
2.29 ± 0.20
(0.09 ± 0.008)
rad.
A
1.27 ± 0.13
(0.05 ± 0.005)
A =
6.22 ± 0.13
(0.245 ± 0.005)
4.32 ± 0.13
(0.170 ± 0.005)
MECHANICAL DATA
Dimensions in mm (inches)
ABSOLUTE MAXIMUM RATINGS
Each Side -
T
CASE
= 25°C unless otherwise stated
V
DS
Drain - Source Voltage 90V
I
D
Drain Current - Continuous (T
C
= 25°C) 0.9A
- Continuous (T
C
= 100°C) 0.7A
I
DM
Drain Current - Pulsed
(Note 1)
3A
V
GS
Gate - Source Voltage ±20V
P
tot(1)
Total Power Dissipation at T
mb
≤ 25°C 6.25W
De-rate Linearly above 25°C 0.050W/°C
P
tot(2)
Total Power Dissipation at T
amb
≤ 25°C 0.5W
T
j
,T
stg
Operating and Storage Junction Temperature Range -55 to +150°C
THERMAL DATA
R
thj-mb
Thermal Resistance Junction – Mounting base Max 20 °C/W
R
thj-amb
Thermal Resistance Junction - Ambient Max 250 °C/W
NOTES: 1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting T
J
= 25°C, L = 1.46mH, I
AS
= 48A, V
DD
= 50V, R
G
= 25Ω,
3) Pulse Test: Pulse Width ≤ 380µS, Duty Cycle , δ 2%