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Rev:
Product Family Data Sheet
SAMSUNG ELECTRONICS
95, Samsung2-Ro, Giheung-Gu,
Yongin-City, Gyeonggi-Do 446-711, KOREA
006
LM561B -5630 Middle Power LED
Introduction
Features
Beam Angle: 120˚
Precondition :JEDEC Level 2a
Dimension : 5.6 x 3.0 x 0.8 mm
ESD withstand Voltage :up to ± 5KV [HBM]
Applications
INDOOR LIGHTING :Ambient Light, LED tube, Down light, LED bulb and Ceiling Light
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Contents
1. Product Code Information ----------------------- 3
2. Characteristics ----------------------- 10
3. Typical CharacteristicsGraph ----------------------- 11
4. Outline Drawing &Dimension ----------------------- 17
5. Reliability Test Items &Conditions ----------------------- 18
6. Solder Conditions ----------------------- 19
7. Tape &Reel ----------------------- 20
8. Label Structure ----------------------- 22
9. Packing Structure ----------------------- 23
10. Precaution For Use ----------------------- 26
11. Hazard Substance Analysis Report ----------------------- 29
Revision History ----------------------- 49
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1. Product Code Information
1) Luminous Flux Bins (Ts= 25℃)
Nominal
CCT Product Code Flux Rank
Sorting Condition lm @65mA
Flux Range (Φv,lm)
2700K
SPMWH◆541MD5WAW☆S1 S1 24.0 ~ 26.0
SPMWH◆541MD5WAW☆S2 S2 26.0 ~ 28.0
SPMWH◆541MD5WAW☆S3 S3 28.0 ~ 30.0
3000K
SPMWH◆541MD5WAV☆S1 S1 24.5 ~ 26.5
SPMWH◆541MD5WAV☆S2 S2 26.5 ~ 28.5
SPMWH◆541MD5WAV☆S3 S3 28.5 ~ 30.5
3500K
SPMWH◆541MD5WAU☆S1 S1 25.0 ~ 27.0
SPMWH◆541MD5WAU☆S2 S2 27.0 ~ 29.0
SPMWH◆541MD5WAU☆S3 S3 29.0 ~ 31.0
4000K
SPMWH◆541MD5WAT☆S1 S1 26.0 ~ 28.0
SPMWH◆541MD5WAT☆S2 S2 28.0 ~ 30.0
SPMWH◆541MD5WAT☆S3 S3 30.0 ~ 32.0
5000K
SPMWH◆541MD5WAR☆S1 S1 27.0 ~ 29.0
SPMWH◆541MD5WAR☆S2 S2 29.0 ~ 31.0
SPMWH◆541MD5WAR☆S3 S3 31.0 ~ 33.0
5700K
SPMWH◆541MD5WAQ☆S1 S1 26.5 ~ 28.5
SPMWH◆541MD5WAQ☆S2 S2 28.5 ~ 30.5
SPMWH◆541MD5WAQ☆S3 S3 30.5 ~ 32.5
6500K
SPMWH◆541MD5WAP☆S1 S1 26.0 ~ 28.0
SPMWH◆541MD5WAP☆S2 S2 28.0 ~ 30.0
SPMWH◆541MD5WAP☆S3 S3 30.0 ~ 32.0
Notes:
1)SAMSUNG ELECTRONICS maintains atolerance of ±5% on Luminous Flux measurements.
2)"◆" (the quantity of PKG on the Reel) can be "T"(2,500pcs) or "1"(10,000pcs).
3)Warm white : "☆"can be "0"(Whole Bin), "H"(Half Bin) or "M"(Quarter Bin) of the color binning.
Cool white : "☆"can be "0"(Whole Bin) or "M"(Quarter Bin) of the color binning.
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2) Color Bins (Ts= 25℃)
1) Color Binning
Nominal
CCT Product Code Color Rank Chromaticity Bins
2700K
SPMWH◆541MD5WAW0S1
SPMWH◆541MD5WAW0S2
SPMWH◆541MD5WAW0S3
W0(Whole bin) W1, W2, W3, W4, W5, W6, W7, W8,
W9, WA, WB, WC, WD, WE, WF, WG
SPMWH◆541MD5WAWHS1
SPMWH◆541MD5WAWHS2
SPMWH◆541MD5WAWHS3
WH(Half bin) W5, W6, W7, W8, W9, WA, WB, WC
SPMWH◆541MD5WAWMS1
SPMWH◆541MD5WAWMS2
SPMWH◆541MD5WAWMS3
WM(Quarter bin) W6, W7, WA, WB
3000K
SPMWH◆541MD5WAV0S1
SPMWH◆541MD5WAV0S2
SPMWH◆541MD5WAV0S3
V0(Whole bin) V1, V2, V3, V4, V5, V6, V7, V8,
V9, VA, VB, VC, VD, VE, VF, VG
SPMWH◆541MD5WAVHS1
SPMWH◆541MD5WAVHS2
SPMWH◆541MD5WAVHS3
VH(Half bin) V5, V6, V7, V8, V9, VA, VB, VC
SPMWH◆541MD5WAVMS1
SPMWH◆541MD5WAVMS2
SPMWH◆541MD5WAVMS3
VM(Quarter bin) V6, V7, VA, VB
3500K
SPMWH◆541MD5WAU0S1
SPMWH◆541MD5WAU0S2
SPMWH◆541MD5WAU0S3
U0(Whole bin) U1, U2, U3, U4, U5, U6, U7, U8,
U9, UA, UB, UC, UD, UE, UF, UG
SPMWH◆541MD5WAUHS1
SPMWH◆541MD5WAUHS2
SPMWH◆541MD5WAUHS3
UH(Half bin) U5, U6, U7, U8, U9, UA, UB, UC
SPMWH◆541MD5WAUMS1
SPMWH◆541MD5WAUMS2
SPMWH◆541MD5WAUMS3
UM(Quarter bin) U6, U7, UA, UB
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1) Color Binning (Continued)
Nominal
CCT Product Code Color Rank Chromaticity Bins
4000K
SPMWH◆541MD5WAT0S1
SPMWH◆541MD5WAT0S2
SPMWH◆541MD5WAT0S3
T0(Whole bin) T1, T2, T3, T4, T5, T6, T7, T8,
T9, TA, TB, TC, TD, TE, TF, TG
SPMWH◆541MD5WATHS1
SPMWH◆541MD5WATHS2
SPMWH◆541MD5WATHS3
TH(Half bin) T5, T6, T7, T8, T9, TA, TB, TC
SPMWH◆541MD5WATMS1
SPMWH◆541MD5WATMS2
SPMWH◆541MD5WATMS3
TM(Quarter bin) T6, T7, TA, TB
5000K
SPMWH◆541MD5WAR0S1
SPMWH◆541MD5WAR0S2
SPMWH◆541MD5WAR0S3
R0(Whole bin) R1, R2, R3, R4, R5
R6, R7, R8, R9 ,RA
SPMWH◆541MD5WARMS1
SPMWH◆541MD5WARMS2
SPMWH◆541MD5WARMS3
RM(Quarter bin) R1, R2, R3, R4, R5, R6
5700K
SPMWH◆541MD5WAQ0S1
SPMWH◆541MD5WAQ0S2
SPMWH◆541MD5WAQ0S3
Q0(Whole bin) Q1, Q2, Q3, Q4, Q5
Q6, Q7, Q8, Q9, QA
SPMWH◆541MD5WAQMS1
SPMWH◆541MD5WAQMS2
SPMWH◆541MD5WAQMS3
QM(Quarter bin) Q1, Q2, Q3, Q4, Q5, Q6
6500K
SPMWH◆541MD5WAP0S1
SPMWH◆541MD5WAP0S2
SPMWH◆541MD5WAP0S3
P0(Whole bin) P1, P2, P3, P4, P5
P6, P7, P8, P9, PA
SPMWH◆541MD5WAPMS1
SPMWH◆541MD5WAPMS2
SPMWH◆541MD5WAPMS3
PM(Quarter bin) P1, P2, P3, P4, P5, P6
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2) Chromaticity Region &Coordinates
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2) Chromaticity Region &Coordinates (Continued)
Region CIE XCIE YRegion CIE XCIE Y
Vrank (3000K)
V1
0.4147 0.3814
V9
0.4221 0.3984
0.4183 0.3898 0.4259 0.4073
0.4242 0.3919 0.4322 0.4096
0.4203 0.3833 0.4281 0.4006
V2
0.4203 0.3833
VA
0.4281 0.4006
0.4242 0.3919 0.4322 0.4096
0.4300 0.3939 0.4385 0.4119
0.4259 0.3853 0.4342 0.4028
V3
0.4259 0.3853
VB
0.4342 0.4028
0.4300 0.3939 0.4385 0.4119
0.4359 0.3960 0.4449 0.4141
0.4316 0.3873 0.4403 0.4049
V4
0.4316 0.3873
VC
0.4403 0.4049
0.4359 0.3960 0.4449 0.4141
0.4418 0.3981 0.4513 0.4164
0.4373 0.3893 0.4465 0.4071
V5
0.4183 0.3898
VD
0.4259 0.4073
0.4221 0.3984 0.4299 0.4165
0.4281 0.4006 0.4364 0.4188
0.4242 0.3919 0.4322 0.4096
V6
0.4242 0.3919
VE
0.4322 0.4096
0.4281 0.4006 0.4364 0.4188
0.4342 0.4028 0.4430 0.4212
0.4300 0.3939 0.4385 0.4119
V7
0.4300 0.3939
VF
0.4385 0.4119
0.4342 0.4028 0.4430 0.4212
0.4403 0.4049 0.4496 0.4236
0.4359 0.3960 0.4449 0.4141
V8
0.4359 0.3960
VG
0.4449 0.4141
0.4403 0.4049 0.4496 0.4236
0.4465 0.4071 0.4562 0.4260
0.4418 0.3981 0.4513 0.4164
Region CIE XCIE YRegion CIE XCIE Y
Wrank (2700K)
W1
0.4373 0.3893
W9
0.4465 0.4071
0.4418 0.3981 0.4513 0.4164
0.4475 0.3994 0.4573 0.4178
0.4428 0.3906 0.4523 0.4085
W2
0.4428 0.3906
WA
0.4523 0.4085
0.4475 0.3994 0.4573 0.4178
0.4532 0.4008 0.4634 0.4193
0.4483 0.3919 0.4582 0.4099
W3
0.4483 0.3919
WB
0.4582 0.4099
0.4532 0.4008 0.4634 0.4193
0.4589 0.4021 0.4695 0.4207
0.4538 0.3931 0.4641 0.4112
W4
0.4538 0.3931
WC
0.4641 0.4112
0.4589 0.4021 0.4695 0.4207
0.4646 0.4034 0.4756 0.4221
0.4593 0.3944 0.4700 0.4126
W5
0.4418 0.3981
WD
0.4513 0.4164
0.4465 0.4071 0.4562 0.4260
0.4523 0.4085 0.4624 0.4274
0.4475 0.3994 0.4573 0.4178
W6
0.4475 0.3994
WE
0.4573 0.4178
0.4523 0.4085 0.4624 0.4274
0.4582 0.4099 0.4687 0.4289
0.4532 0.4008 0.4634 0.4193
W7
0.4532 0.4008
WF
0.4634 0.4193
0.4582 0.4099 0.4687 0.4289
0.4641 0.4112 0.4750 0.4304
0.4589 0.4021 0.4695 0.4207
W8
0.4589 0.4021
WG
0.4695 0.4207
0.4641 0.4112 0.4750 0.4304
0.4700 0.4126 0.4813 0.4319
0.4646 0.4034 0.4756 0.4221
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2) Chromaticity Region &Coordinates (Continued)
Region CIE XCIE YRegion CIE XCIE Y
Trank (4000K)
T1
0.367 0.3578
T9
0.3702 0.3722
0.3726 0.3612 0.3763 0.376
0.3744 0.3685 0.3782 0.3837
0.3686 0.3649 0.3719 0.3797
T2
0.3726 0.3612
TA
0.3763 0.3760
0.3783 0.3646 0.3825 0.3798
0.3804 0.3721 0.3847 0.3877
0.3744 0.3685 0.3782 0.3837
T3
0.3783 0.3646
TB
0.3825 0.3798
0.3840 0.3681 0.3887 0.3836
0.3863 0.3758 0.3912 0.3917
0.3804 0.3721 0.3847 0.3877
T4
0.384 0.3681
TC
0.3887 0.3837
0.3898 0.3716 0.395 0.3875
0.3924 0.3794 0.3978 0.3958
0.3863 0.3758 0.3912 0.3917
T5
0.3686 0.3649
TD
0.3719 0.3797
0.3744 0.3685 0.3782 0.3837
0.3763 0.376 0.3802 0.3916
0.3702 0.3722 0.3736 0.3874
T6
0.3744 0.3685
TE
0.3782 0.3837
0.3804 0.3721 0.3847 0.3877
0.3825 0.3798 0.3869 0.3958
0.3763 0.376 0.3802 0.3916
T7
0.3804 0.3721
TF
0.3847 0.3877
0.3863 0.3758 0.3912 0.3917
0.3887 0.3836 0.3937 0.4001
0.3825 0.3798 0.3869 0.3958
T8
0.3863 0.3758
TG
0.3912 0.3917
0.3924 0.3794 0.3978 0.3958
0.395 0.3875 0.4006 0.4044
0.3887 0.3836 0.3937 0.4001
Region CIE XCIE YRegion CIE XCIE Y
Urank (3500K)
U1
0.3889 0.3690
U9
0.3941 0.3848
0.3915 0.3768 0.3968 0.3930
0.3981 0.3800 0.4040 0.3966
0.3953 0.3720 0.4010 0.3882
U2
0.3953 0.3720
UA
0.4010 0.3882
0.3981 0.3800 0.4040 0.3966
0.4048 0.3832 0.4113 0.4001
0.4017 0.3751 0.4080 0.3916
U3
0.4017 0.3751
UB
0.4080 0.3916
0.4048 0.3832 0.4113 0.4001
0.4116 0.3865 0.4186 0.4037
0.4082 0.3782 0.4150 0.3950
U4
0.4082 0.3782
UC
0.4150 0.3950
0.4116 0.3865 0.4186 0.4037
0.4183 0.3898 0.4259 0.4073
0.4147 0.3814 0.4221 0.3984
U5
0.3915 0.3768
UD
0.3968 0.3930
0.3941 0.3848 0.3996 0.4015
0.4010 0.3882 0.4071 0.4052
0.3981 0.3800 0.4040 0.3966
U6
0.3981 0.3800
UE
0.4040 0.3966
0.4010 0.3882 0.4071 0.4052
0.4080 0.3916 0.4146 0.4089
0.4048 0.3832 0.4113 0.4001
U7
0.4048 0.3832
UF
0.4113 0.4001
0.4080 0.3916 0.4146 0.4089
0.4150 0.3950 0.4222 0.4127
0.4116 0.3865 0.4186 0.4037
U8
0.4116 0.3865
UG
0.4186 0.4037
0.4150 0.3950 0.4222 0.4127
0.4221 0.3984 0.4299 0.4165
0.4183 0.3898 0.4259 0.4073
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2) Chromaticity Region &Coordinates (Continued)
Notes: SAMSUNG ELECTRONICS maintains ±0.005 tolerance of Cx,Cy
Region CIE XCIE YRegion CIE XCIE Y
Prank (6500K)
P1
0.3068 0.3113
P6
0.3126 0.3324
0.3145 0.3187 0.3210 0.3408
0.3135 0.3256 0.3205 0.3481
0.3055 0.3177 0.3117 0.3393
P2
0.3145 0.3187
P7
0.3081 0.3049
0.3221 0.3261 0.3154 0.3119
0.3216 0.3334 0.3145 0.3187
0.3135 0.3256 0.3068 0.3113
P3
0.3055 0.3177
P8
0.3154 0.3119
0.3135 0.3256 0.3226 0.3188
0.3126 0.3324 0.3221 0.3261
0.3041 0.3240 0.3145 0.3187
P4
0.3135 0.3256
P9
0.3028 0.3304
0.3216 0.3334 0.3117 0.3393
0.3210 0.3408 0.3107 0.3461
0.3126 0.3324 0.3015 0.3368
P5
0.3041 0.3240
PA
0.3117 0.3393
0.3126 0.3324 0.3205 0.3481
0.3117 0.3393 0.3200 0.3554
0.3028 0.3304 0.3107 0.3461
Region CIE XCIE YRegion CIE XCIE Y
Rrank (5000K)
R1
0.3366 0.3369
R6
0.3456 0.3601
0.3441 0.3428 0.3539 0.3669
0.3449 0.3515 0.3551 0.3760
0.3369 0.3451 0.3464 0.3688
R2
0.3441 0.3428
R7
0.3363 0.3287
0.3515 0.3487 0.3433 0.3341
0.3527 0.3578 0.3441 0.3428
0.3449 0.3515 0.3366 0.3369
R3
0.3369 0.3451
R8
0.3433 0.3341
0.3449 0.3515 0.3503 0.3396
0.3456 0.3601 0.3515 0.3487
0.3373 0.3534 0.3441 0.3428
R4
0.3449 0.3515
R9
0.3376 0.3616
0.3527 0.3578 0.3464 0.3688
0.3539 0.3669 0.3471 0.3775
0.3456 0.3601 0.3379 0.3698
R5
0.3373 0.3534
RA
0.3464 0.3688
0.3456 0.3601 0.3551 0.3760
0.3464 0.3688 0.3564 0.3851
0.3376 0.3616 0.3471 0.3775
Qrank (5700K)
Q1
0.3222 0.3243
Q6
0.3292 0.3461
0.3294 0.3306 0.3373 0.3534
0.3293 0.3384 0.3376 0.3616
0.3217 0.3316 0.3292 0.3539
Q2
0.3294 0.3306
Q7
0.3227 0.3170
0.3366 0.3369 0.3295 0.3228
0.3369 0.3451 0.3294 0.3306
0.3293 0.3384 0.3222 0.3243
Q3
0.3217 0.3316
Q8
0.3295 0.3228
0.3293 0.3384 0.3363 0.3287
0.3292 0.3461 0.3366 0.3369
0.3212 0.3389 0.3294 0.3306
Q4
0.3293 0.3384
Q9
0.3207 0.3462
0.3369 0.3451 0.3292 0.3539
0.3373 0.3534 0.3291 0.3617
0.3292 0.3461 0.3202 0.3535
Q5
0.3212 0.3389
QA
0.3292 0.3539
0.3292 0.3461 0.3376 0.3616
0.3292 0.3539 0.3379 0.3698
0.3207 0.3462 0.3291 0.3617
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2. Characteristics
1) Absolute Maximum Rating
Item
Symbol
Rating
Condition
Operating temperature range Top -40℃~ +85℃-
Storage temperature range Tstg -40℃~ +120℃-
LED junction temperature TJ110℃-
Forward Current IF150 mA -
Peak Pulsed Forward Current IFP 300 mA Duty 1/10 pulse width 10ms
Thermal resistance Rth, j-s 16℃/W Junction to solder point
Assembly Process Temperature -260℃, < 10sec -
ESD -5kV HBM
2) Electro-optical Characteristi
Item Unit Nominal
CCT
Product
Code Rank Min Typ Max
Forward Voltage1) (VF)
(@65 mA, Ts = 25℃) V - - WA
AZ
2
.
7
0
2
.
8
0
A1
2
.
8
0
2
.
9
0
A2
2
.
9
0
3
.
0
0
A3
3
.
0
0
3
.
1
0
A4
3
.
1
0
3
.
2
0
Luminous Flux2) (Φv)
(@65 mA, Ts = 25℃) lm
2700K
(W☆)
*
WAW
☆
S1
S1
2
4
.
0
2
6
.
0
*
WAW
☆
S2
S2
2
6
.
0
2
8
.
0
*
WAW
☆
S3
S3
2
8
.
0
3
0
.
0
3000K
(V☆)
*
WAV
☆
S1
S1
2
4
.
5
2
6
.
5
*
WAV
☆
S2
S2
2
6
.
5
2
8
.
5
*
WAV
☆
S3
S3
2
8
.
5
3
0
.
5
3500K
(U☆)
*
WAU
☆
S1
S1
2
5
.
0
2
7
.
0
*
WAU
☆
S2
S2
2
7
.
0
2
9
.
0
*
WAU
☆
S3
S3
2
9
.
0
3
1
.
0
4000K
(T☆)
*
WAT
☆
S1
S1
2
6
.
0
2
8
.
0
*
WAT
☆
S2
S2
2
8
.
0
3
0
.
0
*
WAT
☆
S3
S3
3
0
.
0
3
2
.
0
5000K
(R☆)
*
WAR
☆
S1
S1
2
7
.
0
2
9
.
0
*
WAR
☆
S2
S2
2
9
.
0
3
1
.
0
*
WAR
☆
S3
S3
3
1
.
0
3
3
.
0
5700K
(Q☆)
*
WAQ
☆
S1
S1
2
6
.
5
2
8
.
5
*
WAQ
☆
S2
S2
2
8
.
5
3
0
.
5
*
WAQ
☆
S3
S3
3
0
.
5
3
2
.
5
6500K
(P☆)
*
WAP
☆
S1
S1
2
6
.
0
2
8
.
0
*
WAP
☆
S2
S2
2
8
.
0
3
0
.
0
*
WAP
☆
S3
S3
3
0
.
0
3
2
.
0
Reverse Voltage
(@5 mA, Ts = 25℃) V - - - 0.7 - 1.2
Color
Rendering
Index
3)
R
a
5
8
0
Special
CRI
)
R9
0
Notes:
1)~4) SAMSUNG ELECTRONICS maintains atolerance of VF:±0.1 V, Φv:±5 %, Ra:±3.0, R9 :±6.5 on
measurements
5) " * " is Product Code of "SPMWH◆541MD5"
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3. Typical Characteristics Graph (Ts= 25℃)
1) Spectrum Distribution
[CCT : 2700K & 3000K]
[CCT : 3500K & 4000K]
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[CCT : 5000K & 5700K]
[CCT : 6500K]
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2) Forward Current Characteristics
[Relative Luminous Flux vs. Forward Current] (Ts= 25℃)
[Forward Current vs. Forward Voltage] (Ts= 25℃)
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3) Temperature Characteristics
[Relative Luminous Flux vs. Ts] (IF= 65mA)
[Forward Voltage vs. Ts] (IF= 65mA)
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4) Color shift Characteristics
[Color Δx, Δy vs. Forward Current] (Ts= 25℃)
[Color Δx, Δy vs. Ts] (IF= 65mA)
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5) Derating Curve
6) Beam Angle Characteristics
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4. Outline Drawing &Dimension
Recommended Land Pattern
Notes:
1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s).
2) Ts point &measurement method
①Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts
point.
②Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be
damaged.
3) Precautions
①The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be
taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating.
②Re-soldering should not be done after the LEDs have been soldered. If re-soldering is
unavoidable, LED`s characteristics should be carefully checked before and after such repair.
③Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two
PCB assembled with LED might cause catastrophic failure of the LEDs.
1. Tolerance is ±0.10 mm
2. The maximum compressing force is 15N on the body ⓐ
3. Do not place pressure on the encapsulation resin ⓑ
ⓐⓑ
Bottom View
Top View
Front View
Left Side View
Anode Mark
Cathode
Anode
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5. Reliability Test Items and Conditions
1) Test Items
Test Item Test Conditions Test
Hours/Cycles Sample No
MSL Test 125 ℃24hrs drying →60 ℃, 60 %RH 120hrs
→260 ℃10sec 3cycles 1cycle 11
Room Temperature
life test 25 ℃±3 ℃,DC150 ㎃1,000 hrs 22
High Temperature
life test 85 ℃±3 ℃,DC150 ㎃1,000 hrs 22
High Temperature
humidity life test 85 ℃±3 ℃, 85 %±2 %RH, DC150 ㎃1,000 hrs 22
Low Temperature
life test -40 ℃±3 ℃,DC150 ㎃1,000 hrs 22
Powered Temperature
Cycle test
-45℃/20 min ↔85℃/20 min, Sweep
100min cycle on/off: each 5min, DC 150mA 100 cycle 22
Thermal Shock -45 ℃/15 min ↔125 ℃/15 min
→Hot plate 180 ℃500 cycle 100
High Temperature
Storage Ta=120 ℃±3 ℃1000 hrs 11
Low Temperature
Storage Ta=-40 ℃±3 ℃1000 hrs 11
ESD(HBM)
R1:10 ㏁,
R2:1.5 ㏀,
C:100 ㎊,
V = ±5 kV
5times 5
ESD(MM)
R1:10 ㏁,
R2: 0,
C:200 ㎊,
V = ±0.5 kV
5times 5
Vibration Test 20~2000~20 Hz 200 m/s2,Sweep 4min
X, Y, Z 3 direction, each 1cycle 4cycles 11
Mechanical Shock Test 1500G, 0.5 ms,
3shocks each X-Y-Z axis 5cycles 11
2) Criteria for Judging the Damage
Item Symbol Test Condition Limit
Min Max
Forward Voltage VFIF= 65 ㎃Init. Value*0.9 Init. Value*1.1
Luminous Flux ΦvIF= 65 ㎃Init. Value*0.7 Init. Value*1.2
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6. Solder Conditions
1) Reflow Conditions (Pb Free )
Reflow Frequency : 2 times max.
2) For Manual Soldering
Not more than 5seconds @Max. 300℃,under soldering iron.
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7. Tape &Reel
1) Taping Dimension
Anode Mark (Cutting side)
(unit :mm)
More than 500㎜
Unloaded tape
Mounted with
LED package
Leading part more than
500㎜
More than 100~200㎜
Unloaded tape
End Start
Tapping Diretion
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2-1) Reel Dimension (max 2,500 pcs)
2-2) Reel Dimension (max 10,000 pcs)
(1) Quantity :The quantity/Reel to be 2,500 pcs or 10,000 pcs, .
(2) Cumulative Tolerance :Cumulative tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape :Adhesion strength to be 0.1-0.7N when the
cover tape is turned off from the carrier tape at 10℃angle to be the carrier tape.
(4) Packaging :P/N, Manufacturing data code no. and quantity to be indicated on a
damp proof Package.
Symbol A B C W1 W2
Spec(mm) Ø330±1 80±1 13±0.5 13±0.3 17.5±1
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8. Label Structure
1) Label Structure
N.B) Denoted rank is the only example.
'★'means All kind of Chromaticity Coordinate Rank.
Rank Code
ⓐⓑ :Forward Voltage(VF)Rank (refer to page. 11)
ⓒⓓ :Chromaticity Coordinate Rank (refer to page. 4~10)
ⓔⓕ :Luminous Flux(Φv,lm) Rank (refer to page. 3)
2) LOT Number
The Lot number is composed of the following characters
①②③④⑤⑥⑦⑧⑨ / 1ⓐⓑⓒ / 2,500 or 10,000 PCS
①:Production Site (S:SAMSUNG ELECTRONICS,G:TIAJIN CHINA)
②: L (LED)
③:Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample)
④:Year (V:2011, W:2012, X:2013...)
⑤:Month (1 ~ 9, A, B)
⑥:Day (1 ~ 9, A, B ~ V)
⑦⑧⑨ :SAMSUNG ELECTRONICS LED Product number (1 ~ 999)
ⓐⓑⓒ :Reel Number (1 ~ 999)
SPMWHT541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,500 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
ⓐⓑⓒⓓⓔⓕ
Rank Code
A1★1S1
SPMWHT541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,500 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
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9. Packing Structure
1-1) Packing Process (The quantity of PKG on the Reel to be Max 2,500 pcs)
Reel
Aluminum Vinyl Bag
LEVEL
2a
LEVEL
2a
①SIDE
Material :Paper(SW3B(B))
TYPE SIZE(mm)
L W H
7inch 245±5 220±5 182±5
CHIP LED
①
H
W
L
SPMWHT541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,500 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
SPMWHT541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,500 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
SPMWHT541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 25,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
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1-2) Packing Process (The quantity of PKG on the Reel to be Max 10,000 pcs)
Reel
Aluminum Vinyl Bag
LEVEL
2a
LEVEL
2a
SPMWH1541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAV94001 / 1001 / 10,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
SPMWH1541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAV94001 / 1001 / 10,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
[Box Label]
SPMWH1541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAV94001 / 1001 / 150,000 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
Box SIZE(mm)
L W H
Inner 340±5 370±5 80±5
Outer 345±5 378±5 405±5
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2) Aluminum Packing Bag
Silica gel &Humidity Indicator Card in Aluminum Vinyl Bag
SPMWHT541MD5WA★0S1 A1★1S1 01
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
GLAW94001 / 1001 / 2,500 pcs
IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
A1★1S1
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10. Precaution for use
1) For over-current-proof function, customers are recommended to apply resistors to
prevent sudden change of the current caused by slight shift of the voltage.
과전류 방지를 위해 전압의 미세한 이동에 의해 야기되는 전류의 순간 변화를 방지하기
위해 저항 등의 설치를 권장함.
2) This device should not be used in any type of fluid such as　water, oil, organic
solvent, etc. When washing is required, IPA is recommended to use.
제품은 물,오일,유기물과 같은 액체 타입에서의 사용은 제한되며,
세정이 필요할 시에는 IPA 사용을 권장함.
3) When the LEDs illuminate, operating current should be decided after considering the
ambient maximum temperature.
LED의 발광 시,동작 전류는 주변 최고온도를 고려하여 결정되어야 함.
4) LEDs must be stored in aclean environment.
If the LEDs are to be stored for 3months or more after being shipped from
Samsung Electronics,they should be packed by asealed container with nitrogen gas
injected.(Shelf life of sealed bags: 12 months, temp. ~40℃, ~90%RH)
LED의 보관은 청정한 환경에서 보존되어져야 하며,만약 삼성전자로부터 공급받는 후
3개월 또는 그 이상 보관이 필요하다면 질소 가스를 동봉한 보존용기에 보관되어야 함.
(보존 bag의수명: 12 개월,보존 온도 ~40℃,습도 ~90%RH)
5) After storage bag is open, device subjected to soldering, solder reflow,or other
high temperature processes must be:
보존 Bag이 개봉된 후에,납땜이나 reflow등의 높은 온도에 노출되는 제품은 다음의
사항에 부합되어야 함.
a. Mounted within 672 hours(28 days) at an assembly line with acondition of no
more than 30℃/60%RH,
a. 제품은 30℃/60%RH보다 같거나 낮은 조립조건에서 672시간(28일)이내에 조립해야 함.
b. Stored at <10%RH.
b. 10% 이하의 상대습도에서 보관되어야 함.
6) Repack unused Products with anti-moisture packing, fold to close any opening and
then store in adry place.
사용하지 않은 제품은 방습팩에 넣어 개봉 부위를 닫아서 다시 포장한 후,
건조한 장소에서 보관할 것을 권장함.
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7) Devices require baking before mounting, if humidity card reading is >60% at 23±5℃.
만약 습도표시카드의 수치가 23±5℃에서 60% 이상이라면,제품 실장 전 baking해야 함.
8) Devices must be baked for 1hour at 60±5℃,ifbaking is required.
만약 baking이 필요하다면,제품은 60±5℃에서 1시간 정도 baking 되어야 함.
9) TheLEDs are sensitive to the static electricity and surge. It is recommended to
use awrist band or anti-electrostatic glove when handling the LEDs.
LED는 정전기 및 서지에 민감한 제품이므로,LED 제품을 다룰 시에는 정전기
방지장갑이나 손목밴드를 사용하기를 권장함.
If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause
damage or even destruction to LED devices.
만약 절대 허용치를 초과하는 전압이 LED에 가해지면,LED 소자는 파괴되거나
손상될 수 있음.
Damaged LEDs may show some unusual characteristics such as increase in leak
current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
손상된 제품은 누설전류의 증가,Turn on 전압의 저하,저 전류에서의 점등불량 등의
이상 거동을 보일 수 있음.
10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener
or organic additives used in luminaires (fixtures).
Transparent LED silicone encapsulant is permeable to those chemicals and
they may lead adiscoloration of encapsualnt when they expose to heat or light.
VOCs(휘발성 유기 화합물)는 등기구에 사용되는 접착제,Flux, 경화제,
유기물 첨가제에서 발생하여 LED 실리콘 봉지제를 투과하고,
빛 또는 열에 노출되었을 때 변색이 발생 할 수 있음.
This phenomenon can cause asignificant loss of light emitted(output) from the
luminaires(fixtures).
이러한 현상은 등기구로부터 나오는 빛의 중대한 손실을 줄 수 있음.
In order to prevent these problems, we recommend you to know the physical
properties of the materials used in luminaires, They must be selected carefully.
이러한 문제 발생 방지를 위해서,등기구에 사용되는 자재에 대한 물성을 알고
주의하여 선택 되어야함.
　　 　　
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11) Risk of Sulfurization (or Tarnishing)
The LED from Samsung Electronics uses asilver-plated lead frame and
its surface color may change to black(or dark colored) when it is exposed to sulfur(S),
chlorine (Cl) or other halogen compound.
삼성전자의 LED는 Ag(은)을 도금한 리드프레임을 사용함. 이 리드프레임의 표면이
황(S), 염소(Cl), 또는 다른 할로겐 화합물들에 노출시 Ag(은)은 검정(또는 어두운색)으로
바뀔 수 있음.
Sulfurization of lead frame may cause intensity degradation, change of
chromaticity coordinates and, in extreme cases, open circuit. It requires caution.
리드 프레임의 황화(Sulfurization)는 광량 저하, 색좌표 변화 및
심한 경우 LED 무등(Open) 불량을 일으킬 수도 있으니 주의가 필요함.
Due to possible sulfurization of lead frame, LED should not be used and
stored together with oxidizing substances made of materials in afollowing list,
:Rubber, plain paper, lead solder cream and so on.
리드 프레임 황화(Sulfurization)의 근원이 될 수 있으니 LED는 아래의 목록으로
만들어진 산화성 물질들과 함께 저장, 사용이 불가함 : 고무, 일반 종이, 납땜 크림 등
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11. Hazard Substance Analysis -SGS
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11. Hazard Substance Analysis -SVHC(REACH)
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Date No. Revision History Writer
Drawn Approved
2013.02.08 001 New version. W.H Jung Y.T KIM
2013.03.06 002 Add up Quarter and half of color binning. W.H Jung Y.T KIM
2013.03.25 003
1) Change of tapping Q'ty from
2,000 pcs to 2,500 pcs.
2) Change of CIE tolerance x,y:±0.005
C.H. KWON Y.T KIM
2013.05.14 004 Add up amark of UL certification. W.H Jung Y.T KIM
2013.06.25 005
1) Add up ErP(Energy-related Products)of
the Energy regulation.
2) Change of Graph on Color shift
Characteristics
W.H Jung Y.T KIM
2013.11.09 006 1) Deletes ErP(Energy-related Products)
codes in the product data sheet. W.H Jung Y.B Yun
Revision History