DATA SH EET
Product specification
Supersedes data of 2001 May 07 2001 May 11
DISCRETE SEMICONDUCTORS
BAP65-02
Silicon PIN diode
M3D319
2001 May 11 2
Philips Semiconductors Product specification
Silicon PIN diode BAP65-02
FEATURES
High voltage, current controlled
RF resistor for RF switches
Low diode capacitance
Low diode forward resistance (low loss)
Very low series inductance.
APPLICATIONS
RF attenuators and switches
Bandswitch for TV tuners
Series diode for mobile communication transmit/receive
switch.
DESCRIPTION
Planar PIN diode in a SOD523 ultra small SMD plastic
package.
PINNING
PIN DESCRIPTION
1 cathode
2 anode
handbook, halfpage
12
Top view
MAM405
Marking code: K6.
Fig.1 Simplified outline (SOD523) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRcontinuous reverse voltage 30 V
IFcontinuous forward current 100 mA
Ptot total power dissipation Ts90 °C715 mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature 65 +150 °C
2001 May 11 3
Philips Semiconductors Product specification
Silicon PIN diode BAP65-02
ELECTRICAL CHARACTERISTICS
Tj= 25°C unless otherwise specified.
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS TYP. MAX. UNIT
VFforward voltage IF= 50 mA 0.9 1.1 V
IRreverse leakage current VR=20V 20 nA
Cddiode capacitance VR= 0 V; f = 1 MHz 0.65 pF
VR= 1 V; f = 1 MHz 0.55 0.9 pF
VR= 3 V; f = 1 MHz 0.5 0.8 pF
VR= 20 V; f = 1 MHz 0.375 pF
rDdiode forward resistance IF= 1 mA; f = 100 MHz 1 −Ω
I
F
= 5 mA; f = 100 MHz; note 1 0.65 0.95
IF= 10 mA; f = 100 MHz; note 1 0.56 0.9
IF= 100 mA; f = 100 MHz 0.35 −Ω
|s
21|2isolation VR= 0; f = 900 MHz 10 dB
VR= 0; f = 1800 MHz 5.8 dB
VR= 0; f = 2450 MHz 4.4 dB
|s21|2insertion loss IF= 1 mA; f = 900 MHz 0.11 dB
IF= 1 mA; f = 1800 MHz 0.13 dB
IF= 1 mA; f = 2450 MHz 0.16 dB
|s21|2insertion loss IF= 5 mA; f = 900 MHz 0.08 dB
IF= 5 mA; f = 1800 MHz 0.11 dB
IF= 5 mA; f = 2450 MHz 0.13 dB
|s21|2insertion loss IF= 10 mA; f = 900 MHz 0.07 dB
IF= 10 mA; f = 1800 MHz 0.1 dB
IF= 10 mA; f = 2450 MHz 0.13 dB
|s21|2insertion loss IF= 100 mA; f = 900 MHz 0.07 dB
IF= 100 mA; f = 1800 MHz 0.1 dB
IF= 100 mA; f = 2450 MHz 0.128 dB
τLcharge carrier life time whenswitched from IF=10mAto
I
R= 6 mA; RL= 100 ;
measured at IR=3mA
0.17 −µs
L
Sseries inductance IF= 100 mA; f = 100 MHz 0.6 nH
SYMBOL PARAMETER VALUE UNIT
Rth j-s thermal resistance from junction to soldering point 85 K/W
2001 May 11 4
Philips Semiconductors Product specification
Silicon PIN diode BAP65-02
GRAPHICAL DATA
handbook, halfpage
10
1
101
MLD499
1011IF (mA)
rD
()
10 102
Fig.2 Forward resistance as a function of forward
current; typical values.
f = 100 MHz; Tj=25°C.
handbook, halfpage
020
1000
0
200
400
600
800
4
Cd
(fF)
VR (V)
81216
MLD500
Fig.3 Diode capacitance as a function of reverse
voltage; typical values.
f = 1 MHz; Tj=25°C.
handbook, halfpage
0 1000
(1) (2) (3) (4)
(5)
2000 f (MHz) 3000
0
0.5
0.1
0.2
0.3
0.4
MLD501
s21 2
(dB)
Fig.4 Insertion loss (|s21|2) of the diode as a
function of frequency; typical values.
Diodeinsertedinserieswitha50 striplinecircuitandbiased
via the analyzer Tee network. Tamb =25°C.
(1) IF= 0.5 mA.
(2) IF= 1 mA.
(3) IF= 5 mA.
(4) IF=10mA.
(5) IF= 100 mA.
handbook, halfpage
0 1000 2000 f (MHz) 3000
0
10
30
40
20
MLD502
s21 2
(dB)
Fig.5 Isolation (|s21|2) of the diode as a function of
frequency; typical values.
Diode zero biased and inserted in series with a 50 stripline circuit.
Tamb =25°C.
2001 May 11 5
Philips Semiconductors Product specification
Silicon PIN diode BAP65-02
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
SOD523 SC-79 98-11-25
Plastic surface mounted package; 2 leads SOD523
0 0.5 1 mm
scale
D
12
H
E
E
b
p
A
c
vM
A
A
UNIT bpcDEv
mm 0.35
0.25 0.2
0.1 0.15
0.9
0.7
1.3
1.1
A
0.7
0.5
HE
1.7
1.5
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode.
(1)
2001 May 11 6
Philips Semiconductors Product specification
Silicon PIN diode BAP65-02
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DATA SHEET STATUS(1) PRODUCT
STATUS(2) DEFINITIONS
Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseoratanyother conditionsabovethose given inthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationor warrantythat suchapplicationswillbe
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusing orsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofany ofthese products,conveysno licenceor title
under any patent, copyright, or mask work right to these
products,and makes no representationsorwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 May 11 7
Philips Semiconductors Product specification
Silicon PIN diode BAP65-02
NOTES
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2001 72
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Printed in The Netherlands 613512/03/pp8 Date of release: 2001 May 11 Document order number: 9397 750 08364