HUQUUAUAUAUUUUAHI SUBSCRETE DEVICES POWER SERIES e Triacs SCRs Rectifiers PACKAGE CONFIGURATION VOLTAGE GRADE 0 = Step Lead A = 100 D = 400 1 = Isolated Step Lead B = 200 E = 500 2 = Sandwich C = 300 M = 600 EXAMPLE: 6 amp, 400 volt, Step Lead, Tsm SubscreteM Triac is a MPA1060D. PEAK ONE dv/dt FULL CYCLE lpbRM Vim (STATIC) SURGE PEAK PEAK CRITICAL (NON-REP) | OFF-STATE | ON-STATE | RATE-OF-RISE ro ON-STATE | CURRENT VOLTAGE | OF OFF-STATE | | | CURRENT mA VOLTS VOLTAGE GE TYPE | @ 60 Hz T, = 100C AMPERES VOLTS/p SEC CURRENT RATINGS (RMS) | | | (Maximum) | (MAXIMUM) | (MAXIMUM) MPA106; | | 0.1 25 1 | / 1 | . MPA110, | . : - 0.1 50 I | pt Z || oo fz MPA115| | : 0.1 100 = : | t bee : : . | | MPA125; | |. | 0.2 25 | |p _ roid. a mPAi40; || 300 | 0.2 25 | lf 1 | Itsm | | | PEAK ONE dv/dt FULL CYCLE | 'oRM/IRAaM Vom (STATIC) 1 | SURGE PEAK PEAK CRITICAL |_| (NON-REP) | OFF-STATE | ON-STATE | RATE-OF-RISE 1 | ON-STATE |OR REVERSE | yoLTAGE | OF OFF-STATE i | CURRENT CURRENT VOLTS VOLTAGE GE TYPE; | @ 60 Hz mA T, = 100C CURRENT RATINGS (RMS) to AMPERES VOLTS/p SEC (MAXIMUM)_| (MAXIMUM) (TYPICAL) || po mpazio! | | a0 0.1 50 Go [tp o MPA225! | | , 0.2 50 3 | | : oe ed | | a. MPA235; | | 300 0.2 50 (| fipgmPEAKONECYCLE] 122,, Vem MAXIMUM 1 | SURGE (NON-REP) PEAK REVERSE | PEAK FORWARD TT] FORWARD CURRENT | CURRENT mA | VOLTAGE, VOLTS CURRENT RATINGS (RMS) | GE TYPE | | (MAXIMUM) (MAXIMUM) 166 dv/dt i (COMMUTATING) GT CRITICAL RATE-| DC GATE OF-RISE OF OFF-| JRIGGER STATE VOLTAGE |. CURRENT T, = 100C, GOHz | MT2+ GATE+ 4 MT2 GATE @ RATED RMS MT2+ GATE CURRENT aon VOLTS/y SEC (MINIMUM) (MAXIMUM) Vet DC GATE TRIGGER VOLTAGE Vde (MAXIMUM) IL ROJc IH CURRENT APPARENT JUNCTION CURRENT HOLDING | mT2+ GATE+ THERMAL CURRENT MT2 GATE IMPEDANCE mAde MT2+ GATE @ 60 Hz mAde C/WATT (MAX.) NON- (MAXIMUM) | (MAXIMUM) ISOL. | ISOL. tg CIRCUIT Igt COMMUTATED | DC GATE TURN-OFF TIME| TRIGGER Ty = 100C CURRENT MSEC mAdc (TYPICAL) (MAXIMUM) Vet DC GATE TRIGGER VOLTAGE Vde (MAXIMUM) R@jc STEADY-STATE | T, JUNCTION 1 THERMAL RESISTANCE] OPERATING 2 C/WATT (MAXIMUM) TEMP. NON-ISOL.| ISOL. RANGE C 1.7 2.5 w NOTES: RQuc STEADY- ty I STATE Ty HOLDING LATCHING THERMAL | JUNCTION CURRENT CURRENT OPERATING RESISTANCE mAdc mAdc C/WATT TEMP. (MAXIMUM) RANGE NON- MAXIMUM) (MAXIMUM) ISOL. | _ISOL. All characteristics given for Ty = 25C unless otherwise stated. R@Jc Definition: @ For Non-lsolated Configurations: Thermal resistance from junction to geometric center of bottom plate. For Isolated Configurations: Thermal resistance from junction tobottom of substrate under geometric center of chip. Most maximum allowable ratings depend almost entirely on the quality and thermal characteristics of the bond when mounting the SubscreteM Device. For this reason, normal ratings such as average current, surge current and operating temperature range, are obtainable when the solder thickness is limited to <3 mils and good wetting is achieved. 167