Connector Technical Information
Technical Info. Narrow-pitch connectorsFPC connectors
139
ds_x65_en_connector_technical_information: 010611J
GENERAL NOTES ON USING ADVANCED SERIES NARROW-PITCH CONNECTORS
" Connector mounting
In case the connector is picked up by
chucking during mounting, an excessive
mounter chucking force may deform the
molded or metal part of the connector.
Consult us in advance if chucking is to
be applied.
" Soldering
1. Manual soldering
• Due to the low profile, if an excessive
amount of solder is applied to this
product during manual soldering, the
solder may creep up to near the con-
tact points, or interference by solder
may cause imperfect contact.
• Make sure that the soldering iron tip is
heated within the temperature and
time limits indicated in the specifica-
tions.
• Flux from the solder wire may adhere
to the contact surfaces during solder-
ing operations. After soldering, care-
fully check the contact surfaces and
clean off any flux before use.
• Be aware that a load applied to the
connector terminals while soldering
may displace the contact.
• Thoroughly clean the iron tip.
2. Reflow soldering
• Screen-printing is recommended for
printing paste solder.
• To determine the relationship
between the screen opening area and
the PC-board foot pattern area, refer
to the diagrams in the recommended
patterns for PC boards and metal
masks. Make sure to use the terminal
tip as a reference position when set-
ting.
Avoid an excessive amount of solder
from being applied, otherwise,
interference by the solder will cause an
imperfect contact.
• Consult us when using a screen-print-
ing thickness other than that recom-
mended.
• Depending on the size of the connec-
tor being used, self alignment may
not be possible. Accordingly, carefully
position the terminal with the PC
board pattern.
• The recommended reflow tempera-
ture profile is given in the figure below
Recommended reflow temperature profile
• The temperature is measured on the
surface of the PC board near the con-
nector terminal.
• Some solder and flux types may
cause serious solder creeping. Take
the solder and flux characteristics into
consideration when setting the reflow
soldering conditions.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive (Double reflow soldering on
the same side is possible)
3. Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge,
use a soldering iron with a flat tip. Do
not add flux, otherwise, the flux may
creep to the contact parts.
• Use a soldering iron whose tip tem-
perature is within the temperature
range specified in the specifications.
" Do not drop the product or handle
it carelessly. Otherwise, the
terminals may become deformed
due to excessive force or the
solderability during reflow
soldering may degrade.
" Do not insert or remove the
connector when it is not soldered.
Also, forcibly applied external
pressure on the terminals can
weaken the adherence of the
terminals to the molded part or
cause the terminals to lose their
evenness.
" When cutting or bending the PC
board after mounting the
connector, be careful that the
soldered sections are subjected to
excessive forces.
" Notes when using a FPC
•When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause
the soldering to come off. It is recom-
mended to use a reinforcement board
on the backside of the FPC board to
which the connector is being con-
nected. Make sure that the reinforcing
plate is larger than the outline of the
recommended PC board pattern
(Outline + approx. 1 mm). The rein-
forcing plate is made of SUS, glass
epoxy or polyimide that is 0.2 to 0.3
mm thick.
• This connector employs a simple
locking structure. However, the con-
nector may come off depending on
the size and weight of the FPC, layout
and reaction force of FPC, or by drop
impact. Make sure to fully check the
equipment’s condition. To prevent
any problem with loose connectors,
adopt measures to prevent the con-
nector from coming off inside the
equipment.
" Other Notes
When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be
used for switching.
For other details, please refer to the
latest product specifications.
Terminal Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Time
Temperature Peak temperature
200°C
220°C
Upper limit (Soldering heat resistance)
260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limit (Solder wettability)
Do not the soldered areas to be subjected to forces