ZiLOG, Inc. 2H - Year 2002 Quality And Reliability Report ZAC03-0004 ZiLOG 2002Quality and Reliability Report Chapter Title and Subsection TABLE OF CONTENTS Chapter Title and Subsection Chapter 1 - ZiLOG's Quality Culture Reliability And Quality Assurance Policy Statement..................................... 1 - 1 ZiLOG Quality Policy Mission Statement................................................. 1-2 ZiLOG's Quality And Reliability Program................................................ 1-3 ZiLOG's Environmental, Health and Safety Policy...................................... 1-8 ISO Certification............................................................................... 1 - 9 Quality and Reliability Trend Charts....................................................... 1 - 10 ZiLOG's Quality Organization Chart...................................................... 1 - 11 Chapter 2 - Customer Quality Support System Customer Failure Analysis/Correlation Procedure ....................................... 2-1 Summary of QC Test Equipment ........................................................... 2-4 List of Outside FA Labs ..................................................................... 2-9 Customer Notification System............................................................... 2 - 10 Customer Change Notification Letter Z80S183 Die Revision........................... Chapter 3 2 - 11 - Qualification Requirements Product/Process Qualification Requirements.............................................. 3-1 ZiLOG Product Qualification Summary................................................... 3-2 Package Qualification Requirements........................................................ 3-3 ZiLOG Package Qualification Summary................................................... 3-4 ZAC03-0004 II ZiLOG 2002Quality and Reliability Report Chapter Title and Subsection Chapter 4 - Quality Monitor Systems Failure Rate Prediction Calculations........................................................ 4-1 ESD Testing Methodology................................................................... 4-4 Latchup Testing Methodology............................................................... 4-4 ZiLOG's Reliability Summary............................................................... 4-5 Early Life....................................................................................... 4-5 Long Term Life................................................................................ 4-5 Pressure Pot.................................................................................... 4-5 Temperature Cycle............................................................................ 4-5 Highly Accelerated Stress Test.............................................................. 4-6 Package Integrity Test........................................................................ 4-6 Reliability Monitor Testing Requirements Table 1......................................... 4-7 Reliability Monitor Early Life Test Conditions 168 Hrs, 125C Burn-In (CMOS Plastic) Table 2........................................................................ 4-8 Reliability Monitor Early Life Test Conditions 168 Hrs, 125C Burn-In (NMOS Plastic) Table 3........................................................................ 4-9 Reliability Monitor Long-Term Life Test Conditions: 150C, 5V, 184 Hrs Burn-In (CMOS) Table 4................................................................................ 4 - 12 Reliability Monitor Long-Term Life Test Conditions: 125C, 1000 Hrs Burn-In (CMOS) Table 5................................................................................. 4 - 15 Reliability Test Summary Early Life Test Summary Table 6. ............................. 4 - 16 Reliability Test Summary Long-Term Life Test Summary Table7...................... 4 - 16 Reliability Monitor Pressure Pot Test Conditions (CMOS-Plastic) Table 8............ 4 - 17 Reliability Monitor Pressure Pot Test Conditions (NMOS-Plastic) Table 9............ 4 - 19 Reliability Monitor Temperature Cycling Test Conditions (CMOS) Table 10......... 4 - 20 Reliability Monitor Temperature Cycling Test Conditions (NMOS) Table 11......... 4 - 23 Reliability Monitor Highly Accelerated Stress Test (HAST)-(CMOS) Table 12 ...... 4 - 24 Reliability Monitor ZiLOG Packaging Integrity Test Results (CMOS) Table 13...... 4 - 25 Reliability Monitor ZiLOG Packaging Integrity Test Results (NMOS) Table 14...... 4 - 28 C-Mode Scanning Acoustic Microscope Monitor 2002 (CMOS) Table 15............ 4 - 29 C-Mode Scanning Acoustic Microscope Monitor 2002 (NMOS) Table 16............ 4 - 37 ZAC03-0004 III ZiLOG 2002Quality and Reliability Report Chapter Title and Subsection Chapter 5 - Assembly and Test Package Types................................................................................. 5-1 Technology Data.............................................................................. 5-1 Pre/Post Packaging Device Test Procedures.............................................. 5-2 Plastics Process Flow......................................................................... 5-3 Plastic-Standard Assembly/Test Process................................................... 5-4 General Material Specification.............................................................. 5-5 Chapter 6 The Handling and Storage of Surface Mount Devices ............ Handling........................................................................................ 6- 1 Lead Protection ................................................................................ 6-2 ESD Protection ................................................................................ 6-2 Storage/Unpacking Cautions ................................................................ 6-3 Soldering ....................................................................................... 6-3 Desoldering .................................................................................... 6-3 Chapter 7 - Quality Systems Quality Systems................................................................................ 7- 1 Subcontracting ................................................................................ 7-1 Lot Traceability .............................................................................. 7-1 Availability of Documentation on Monitoring ........................................... 7-1 Quality Data ................................................................................... 7-1 Testing ......................................................................................... 7-2 Test Tape Support ............................................................................ 7-2 When Manufacturing is Performed Offshore, What Are The Controls? .............. 7-3 Availability of Programming Facilities ................................................... 7-3 Documentation Control ...................................................................... 7-3 QA Audit ....................................................................................... 7-3 Material Control .............................................................................. 7-3 Vendor of the Year Award .................................................................. 7-4 ZAC03-0004 IV ZiLOG 2002Quality and Reliability Report Chapter Title and Subsection Chapter 8 - Statistical Process Control Scope ............................................................................................ 8-1 Control Charts ................................................................................. 8-1 Design of Experiments ....................................................................... 8-1 Chapter 9 - Document Control Document Control System................................................................... 9-1 ZiLOG Policies, Procedures or Specifications ........................................... 9-2 Flow Chart .................................................................................... 9-3 SPC Fabrication Typical Process .......................................................... 9-4 Chapter 10 - Thermal Properties Thermal Characteristics...................................................................... 10 - 1 Device JA, JC Table 1 Summary Of Thermal Characteristics For ZiLOG Plastic Packages........................................................................................ 10 - 2 Device JA, JC Table 2 Summary Of Thermal Resistance For Hermetic Packages......................................................................................... 10 - 3 Device JA, JC Table 3 Summary Of Thermal Resistance For Networking Technology Devices........................................................................... 10 - 4 Device JA, JC Table 4 Summary Of Thermal Resistance For Connecting Technology & Home Entertainment....................................................... 10 - 10 Chapter 11 - Glossary ZiLOG Glossary............................................................................... ZAC03-0004 V 11 - 1 ZiLOG 2002Quality and Reliability Report CHAPTER 1 ZiLOG's Quality Culture RELIABILITY AND QUALITY ASSURANCE POLICY STATEMENT ZiLOG's philosophy towards quality has been consistently aimed at continuous product improvement and optimization of processes associated with the design, manufacture, test and delivery of products that conform to all established requirements for total customer satisfaction. It has been a ZiLOG tradition that the customer is the main driving force in a company-wide goal to achieve the highest quality possible. Through excellent management of its personnel, equipment, materials, and environmental resources, ZiLOG is well positioned for success. ZAC03-0004 1-1 ZiLOG 2002Quality and Reliability Report ZiLOG QUALITY POLICY MISSION STATEMENT "ZiLOG designs, builds, tests, and delivers quality through constant product and process improvements for total customer satisfaction." * ZiLOG designs quality solutions by matching our designs to established process parameters. Hence, product design will always be guardbanded relative to process capabilities. * ZiLOG builds quality so that the different contributing factors work harmoniously to achieve and maintain the required level of product quality and reliability. * ZiLOG rigorously tests our products and processes so customers receive the highest quality and reliability. * ZiLOG delivers quality so customers receive solutions that meet their expectations and contract requirements. At ZiLOG, we subscribe to the philosophy that quality is everyone's responsibility. The employees of ZiLOG believe that there can be no compromise in the Reliability and Quality of its products. The information provided in this report reflects their determination to provide the finest possible products. ZiLOG is proud of its Reliability and Quality programs and is pleased to share this data with its customers. For further information, contact ZiLOG's Director of Reliability and Quality Assurance. Mike Burgdorf Director Reliability and Quality Assurance ZAC03-0004 1-2 ZiLOG 2002Quality and Reliability Report ZiLOG'S QUALITY AND RELIABILITY PROGRAM ZiLOG, Inc. has an excellent reputation for the quality and reliability of its products. ZiLOG's Quality and Reliability Program is based on careful study of the principles laid down by such pioneers as W. E. Deming and J. M. Juran. Even more importantly, we have benefited from the observation and practical implementation of those principles as practiced in Japanese, European and American manufacturing facilities. The ZiLOG program begins with employee involvement. Whether the judgment of our performance is based on perfection with incoming inspection, trouble free service in the field, or timely and accurate customer service, we recognize that our employees ultimately control these factors. Hence, our quality program is broadly shared throughout the organization. Harmony Between Design and Process High product quality and reliability in VLSI products is possible only if there is structural harmony between product design and manufacturing. Great care is taken to ensure that the statistical process control limits observed within the manufacturing plants properly guardband the design technology used to configure the circuit and layout in ZiLOG's automated design methodology. Through use of a technique which we call Process Templating, the technology file in the automated design system is periodically updated to ensure that product design parameters fall within the statistical control limits with which the process is actually operated. In simple terms, the Process Template is the profile displayed by the process evaluation parameters which are automatically recorded from the test patterns on wafers as they proceed through the production line. These parameters are translated into the design technology file attributes so every product design bears a lock and key relationship to the process. Training The integrity of our product design and manufacturing process depends on the skills of our employees. ZiLOG training emphasizes the fundamentals involved in product design and processing for quality and reliability. Customer Service, an important aspect of ZiLOG's quality performance as a vendor, also depends upon our people clearly understanding their jobs and our obligations to our customers. This aspect of training is also a part of the overall curriculum administered by ZiLOG. ZAC03-0004 1-3 ZiLOG 2002Quality and Reliability Report Order Acknowledgment Policy One definition of vendor quality performance is that the vendor "does what he promises or acknowledges." Acceptable reliability and quality is achieved only if ZiLOG and the customer are in agreement on product and delivery specifications. Test Guardbanding No physical attribute is absolute. Customers' test methods may differ from ZiLOG's due to variations in test equipment, temperature or specification interpretation. To ensure that every ZiLOG product performs to full customer expectations, ZiLOG uses a "waterfall" methodology in its testing. The first electrical tests made on the circuit for both AC and DC parameters, at the wafer probe operation, are guardbanded to the final test specifications. The final test specifications for both AC and DC parameters, in turn, are guardbanded to the quality control outgoing sample. The quality control outgoing sample is guardbanded to data sheet specifications. This technique of "waterfall" guardbanding eliminates circuits which may be marginal to the customer's expectations long before they get to the shipping container. Probe at Temperature Semiconductor devices tend to exhibit their most limited performance at the highest operating temperature. Therefore, it is ZiLOG's policy that all chips are tested at high temperature the very first time they are electrically screened at the wafer probe station. The circuits are tested again at their upper operating temperature limit in the 100% final test operation. Process Characterization Before release to production, every process is thoroughly characterized by an exhaustive series of pilot production runs and tests which identify the statistical, electrical, and mechanical limits of that particular process. This documentation is maintained as the historical record or "footprint" for that particular regime. Process recharacterization is done any time there is a major process or manufacturing site change, and the resulting documentation is then added to the characterization history. Once the process is fully characterized, test site evaluation and process template data is gathered frequently to make sure that the process remains in specification. ZAC03-0004 1-4 ZiLOG 2002Quality and Reliability Report Product Characterization Every ZiLOG product design is evaluated over extremes of operating temperature, supply voltage, and clock frequency prior to production release. This information permits the proper guardbanding of the test program waterfall and identification of any marginal "corners" in design tolerances. A product characterization summary, which details the more important tolerances identified in the process of this exhaustive product design evaluation, is available to ZiLOG's customers. Process Qualification ZiLOG also qualifies every process prior to production by an exhaustive stress sequence performed on test chips and on representative products. Once a process regime is qualified, a process re-qualification is performed any time there is a major process change, or whenever the process template statistical quality limits are significantly exceeded or adjusted. Product Qualification In addition to characterization, every new ZiLOG product design is fully qualified by a comprehensive series of life, electrical, and environmental tests before release to production. Whenever possible, both industry standard environmental and life tests are employed. Again, a qualification summary is available to our customers which details certain key life and environmental data taken in the course of these evaluations. Please see Chapter Four (Qualification Requirements) for an example of the ZiLOG Package Qualification Summary and Device Qualification Summary. PPM Measurement, Direct and Indirect It is frequently said that if you want to improve something, you need to put a measure on it. Therefore, ZiLOG measures its outgoing quality "parts per million" by the maintenance of careful records on the statistical sampling of production lots prepared for shipment. This information is then translated by our statisticians to a statement of our parts per million outgoing quality performance. Of course, it is one thing for ZiLOG to think it is doing a good job in outgoing product quality and it is another for a customer to agree. Therefore, we ask certain key customers to provide us with their incoming inspection data that helps us calibrate our outgoing performance in terms of the actual results in the field. The fact that ZiLOG has been awarded "ship to stock" status by many customers testifies to our success in this area. ZAC03-0004 1-5 ZiLOG 2002Quality and Reliability Report FIT Measurement Direct and Indirect Just as ZiLOG records its outgoing quality in terms of parts per million, it also measures its outgoing product reliability in terms of "FITS" or Failures per billion device hours. This calculation is done by using the results of weekly operating life test measurements on the circuits performed in accordance with standard specifications. Field Quality Engineers ZiLOG maintains a force of skilled Field Application Engineers, who are also trained as Field Quality Engineers. These engineers are available on immediate call to consult our customers on any problems they may be experiencing with ZiLOG product performance. Product Analysis Product Analysis facilities, staffed by experienced professionals, exist at each ZiLOG site to provide rapid evaluation of in-process and in-field rejects. ZiLOG is pleased to share product analysis reports on specific products with the customer upon request. Oxide Charge to Breakdown (Qbd) Gate oxide quality for ZiLOG's major fabrication processes is monitored weekly through extraction of wafer level Qbd data from the parametric test database. ZiLOG's Qbd test is based on the J-ramp test specified in JEDEC Standard JESD35- "Procedure for the Wafer-Level Testing of Thin Dielectrics." Statistical Process Control ZiLOG employs Statistical Process Control at all critical process steps. Deviations from norms must be evaluated by a Q/R review board. Total Quality Program ZiLOG employees actively participate in meetings where methods are proposed, reviewed, and adopted. These meetings enable a department to do its job in a more precise and accurate manner. ZiLOG Vendor of the Year Award ZiLOG is proud of the many quality and performance awards it has received from its customers. In turn, ZiLOG makes an annual award to the vendor who has done the best overall job for ZiLOG. ZAC03-0004 1-6 ZiLOG 2002Quality and Reliability Report Environmental Protection Recycling ZiLOG is committed to an environmental protection-recycling project that is becoming an international requirement. ZiLOG prefers that materials used to package its finished products be recyclable and/or manufactured from recycled material. The "Recyclable" symbol can already be found on shipping boxes, tubes and reels, and on shipping trays for QFP/VQFP products. ZAC03-0004 1-7 ZiLOG 2002Quality and Reliability Report ZiLOG ENVIRONMENTAL, HEALTH AND SAFETY POLICY ZiLOG's mission is to create superior value for our stakeholders. The health and safety of our employees, and the proper care of our environment, are of paramount importance. ZiLOG's concern for them is not only good corporate citizenship, it's also good business. ZiLOG is committed to a continuously improving Environmental, Health and Safety Management System. Strict compliance with applicable EHS regulations is considered a minimum standard - neither production goals nor financial objectives shall excuse noncompliance. The core values of ZiLOG's EHS Management System are to: * * * * * * * * * * * * * Create, maintain and promote a safe and healthful workplace for all employees. Comply with the intent as well as the letter of all relevant EHS regulations at the Federal, State and Local levels. Set EHS goals and objectives and measure progress toward them. Promote a respect for the environment among employees. Conserve resources and minimize waste by reducing, reusing, and recycling. Integrate EHS considerations into business planning, decision making, and daily activities. Provide the resources and training to carry out this policy. Prevent accidents and minimize environmental impacts. Communicate our EHS performance. Respond to the concerns of the communities in which we do business. Support EHS public policy development. Encourage our contractors and suppliers to adopt EHS standards similar to our own. Exchange EHS knowledge and technology. These core values build on our tradition of quality, innovation, and continuous improvement. Each employee is personally responsible for making these value a part of everyday worklife at ZiLOG. Jim Thorburn Chief Executive Officer ZiLOG, Inc. ZAC03-0004 1-8 ZiLOG 2002Quality and Reliability Report ISO CERTIFICATION ZiLOG is extremely proud to have received the following ISO 9000 certification awards, which reflect the stringent quality standards to which all ZiLOG products are manufactured. FACILITY/LOCATION CERTIFICATION RECEIVED ZiLOG Electronics Philippines, Inc. (ZEPI) Manila, The Philippines - Final Test and Shipment of Semiconductors ISO 9002 - Re-certified 7/98 By SGS Yarsley International Certification Services Camberley, Surrey, UK ISO 14001 - Certified 11/99 by SGS International Certification Services Zurich, Switzerland ZiLOG Nampa Nampa, Idaho - Wafer Fabrication ISO 9001 Re-certified 9/98 by the National Standards Authority of Ireland. ISO 14001 - Certified 3/99 by the National Standards Authority of Ireland. (*ISO - International Standards Organization) ISO 9000 CERTIFICATION FOUNDRIES/SUBCONTRACTORS FACILITY LOCATION PROGRAM Wafer Foundries: UMC TSMC Taiwan Taiwan Assembly Subcontractors: Taiwan AIT Amkor ASE Carsem ZAC03-0004 Batam, Indoneasia Manila, PI Manila, PI and Taiwan Ipoh, Malaysia ISO 9002 ISO 9002 ISO 9002 ISO 9002 ISO 9002 ISO 9002 1-9 ZiLOG 2002Quality and Reliability Report QUALITY AND RELIABILITY TREND CHARTS PPM Electrical 50 32 25 20 10 18 16 14 12 00 20 99 19 19 98 97 19 96 19 19 95 94 19 92 93 19 19 19 91 0 10 9 3 02 20 20 35 01 43 30 20 40 Figure 2-1.- FIT Rate (FIT = Failure in Time: Failures per Billion Hours) 200 150 100 50 150 90 80 70 60 50 40 35 30 25 23 19 90 19 91 19 92 19 93 19 94 19 95 19 96 19 97 19 98 19 99 20 00 20 01 20 02 0 200 Figure 2-2. PPM Electrical ZAC03-0004 1 - 10 22 ZiLOG 2002Quality and Reliability Report Figure 2-3. R/QA Organizational Chart Director Reliability and Quality Assurance Mike Burgdorf Principal Engineer Reliability and Quality Assurance Joseph Brajkovich ZAC03-0004 Director Quality Assurance Nampa Mike Burgdorf Manager Quality Assurance Asia Malie Fonte 1 - 11 ZiLOG 2002 Quality and Reliability Report CHAPTER 2 Customer Quality Support CUSTOMER FAILURE ANALYSIS/CORRELATION PROCEDURE ZiLOG has a complete Customer Failure Analysis (CFA) system. Using this system, a customer may return units for failure analysis or test correlation. The sequence of events for the CFA procedure is as follows: 1. Customer suspects a failure. 2. The Customer and ZiLOG's Field Applications Engineer (FAE) generate a CFA request. See Figure 3-1. 3. A CFA request is assigned a number for tracking. 4. ZiLOG's FAE sends the unit(s) to the factory. 5. Product/Test Engineering performs a go/no-go electrical test. 6. The unit(s) and test results are given to the Failure Analysis Engineer. 7. If the unit(s) fail the test, the Failure Analysis Engineer performs electrical and physical analysis, and generates a CFA report. See Figure 3-2. 8. If the unit(s) pass the test, the Failure Analysis Engineer generates a CFA report and returns the unit(s) to the customer. 9. Our goal is to provide a complete CFA report within 10 working days from the time the unit(s) are received. ZiLOG and the customer will work together to reduce all types of failures to zero. The CFA procedure is one of several communication tools that can be used to achieve this goal, proving its overall effectiveness since its inception in 1985. ZAC03-0004 2-1 ZiLOG 2002 Quality and Reliability Report Figure 3-1. ZiLOG Guideline Information Needed By The Factory With CFA's Purpose: To eliminate time spent researching a failed component/part history in order to concentrate on finding the root cause of failure or complaint by the customer OP184 FAILURE ANALYSIS QUESTIONNAIRE GENERAL INFORMATION: Initiated By: Date: B.U.: Customer Name: Customer Address: Phone No: Customer priority level: PART INDENTITY: Device: Date/bb Code: Total # devices in lot: Qty. devices tested/inspected: Qty. being returned: Qty. of failed devices: Customer Application: FAILURE DESCRIPTION: Incoming: Low Noise Option? Assembly: Yes No Final Test: Field Return: How long in service before failure occurred? Was part removed with any other parts? Yes No Did failure follow part? Yes No Additional processing temperatures which part had seen before failure occurred: Is this a new application for this device? Yes No Is this a new failure mode? Yes No Is there a Customer board or test program available for use at ZiLOG? Yes No Are there failing and passing samples available for correlation work? Yes No Process steps part had seen up to time of failure: ADDITIONAL DETAILS: ZAC03-0004 2-2 ZiLOG 2002 Quality and Reliability Report Figure 3-2. ZiLOG Failure Analysis Report PSI: Quantity: Customer: Analyst: CUSTOMER FAILURE ANALYSIS REPORT ZiLOG Confidential Date: Approved: Page 1 of 1 Date: CFA#: Date: Problem as reported by customer: Device Date Code(s): Analysis: External Visual: Bench Test: Electrical Test, Final Test at 100C, QA test at 25C, Sentry Tester: Conclusion: Recommended Action: ZAC03-0004 2-3 ZiLOG 2002 Quality and Reliability Report Table 3-1. Summary of QC Test Equipment Equipment At ZEPI Brand Usage Wetting Balance Tester Multicore Must II Solderability Test ISOMET Low Speed Saw Buehler Cross-Section Analysis Curve Tracer Tektronix 577 Bench Check ESD Tester IMCS 700 VZAP Testing ESD Tester Oryx 11000 VZAP Testing HAST Express Test Reliability Test Polimet Polisher Buehler Cross-Section Analysis High Power Scope Olympus External/Internal Visual Inspection Low Power Scope Bausch & Lomb External/Internal Visual Inspection Jet Etch Novus Technologies Decapping of Plastic Devices Hot Plates 3D Ready-Heat Solderability-Steam Aging Pressure Cooker Electric Steroclave Reliability Test Plasmod Plasma Etcher March Inst Inc Topside Etch SEM & EDX Leica S420 Visual & Elemental Analysis Digital Multimeter Fluke Latchup Test Power Supply HP Latchup Test Timer Gralab Timed Operations Acoustic Microscope Sonoscan C-SAM 3100 Delamination Inspection Profile Projector Mitutoyo Dimensional Inspection Temperature/Humidity Test Chamber ESPEC Temperature/Humidity Test Temperature/Humidity Test Chamber Sexton ESPEC Moisture Resistance Test Salt Atmospheric Chamber Associated Salt Atmosphere Test Mechanical Shock Tester Lansmont Mechanical Shock Test ZAC03-0004 2-4 ZiLOG 2002 Quality and Reliability Report Table 3-1. Summary of QC Test Equipment Equipment At ZEPI Brand Usage VVF Test Unholtz-Dickie VVF Test Thermal Shock Tabai Thermal Shock Test Temperature Cycle Ransco Temp Cycle Test Toolmaker Scope Unitron Dimensional Check Hardness Tester Ames Precision Leadframe IQC Plating Thickness Measuring Equipment Fischerscope For Plating Thickness Wirepull Tester Unitek In-Process Wirepull Testing Wirepull Tester Westbond In-Process Wirepull Testing Beam Balance None Weight Measurement Shear Tester B&G Die Shear Test Particle Counter Atcor Airborne Particle Measurement Flow Thru Cooler Neslab Viscosity Check Digital Linear Gauge --- Wafer Thickness Check Incubator Millipore Bacteria Monitor Ball Shear Tester KTC Wirebond Check High Power Scope Olympus Inspection 1 Set PH Meter VWR VWR PH Check 3 PCS Chatillion Gauge Chatillon Die Push Test Coplanarity Tester RVSI Coplanarity Check MP-4 Land Camera With Stage And Floodlights Polaroid Photo Duplicating, Macrophotography 8X10 High Power Microscope w/Video Camera Leitz, RCA Wafer Level Inspection ZAC03-0004 2-5 ZiLOG 2002 Quality and Reliability Report Table 3-1. Summary of QC Test Equipment Equipment At Nampa Zoom Stereoscope 5-50X High Power Microscope w/Camera, 50-1000X Long-Working Distance Objectives X-Ray System Gold Coater Low-Speed Diamond Saw Bench Top Furnace High Temperature Ovens: 175C 150C 125C Exhaust Hood Wet Sink w/Exhaust 3-Wheel Polisher Hot Plate PC100 Hot Plate PC100 Hot Plate Hot Plate Hot Plate Ultrasonic Cleaner (2) Ultrasonic Cleaner Plasma Etcher Jet Etch & Jet Rinse Cerdip Opener Timmers (2) Dial-O-Gram (2) UV Light UV Light EA Curve Tracer 576 Curve Tracer 577 CRT Camera Temperature Forcing Unit Microprobe Station Laser Cutter Microprobe Device Socket Cards: ZAC03-0004 Brand Nikon Nikon Usage X-Section Mounting, Low-Power Inspection Package Die Visual Microphotography Faxitron Denton Vacuum Buehler Lindberg Film Radiography SEM Sample Prep (Backup) Package Cross High Temp Analysis to 1100C Blue M Blue M Blue M Kewaunee JST Plastics Buehler Corning Corning Lindberg Corning Arthur H. Thomas Type 2000 Bransonic Branson 3510 Tegal B&G Enterprises B&G Enterprises Gralab Ohaus Blak-Ray Loglcal Devices, Inc. Tektronix Tektronix Tektronix Temptronic Wentworth Bake Recovering Bake Recovering SEM Sample Storage Chemical Use Safety Chemical Use Safety Cross-Section and Lap Wafer Reliability Analysis Hot Chemical Etch Wafer Pressure Pot Test Chip Unzip Chemical Heating New Wave EZ LAZE Sample Cleaning Sample Cleaning Topside Etch and Descum Part Decapsulation Part Decapsulation Timed Operations Chemical Measurement Dye Penetrant Test EPROM Erasing Bench Check Bench Check Waveform Photo Bench Temperature Testing Microprobing (Not Complete - no mcroscope) Trace Cutting 2-6 ZiLOG 2002 Quality and Reliability Report Table 3-1. Summary of QC Test Equipment Equipment At Nampa 44 LCC/PLCC 48 Lead DIP 64 Lead Narrow Pitch DIP High Power Microscope 50x - 400x High Power Microscope 50x - 1000x S440 SEM FIB With SIMS (SIMS not working) Reactive ION Etcher (REI), 8-Inch Polycon, BF, DF, DIC, Confocal, Fluorescence, W/8x8" Stage W/Micron Stage Readout W/Sony Color VP Video Oscilloscopes 4145A (2) w/LCR Meter Visionary 2000 W/MP2000 8" Probe Package Device Thermal Socket Cards: 20 Lead PLCC 44 Lead PLCC 68 Lead PLCC 84 Lead PLCC 44 Lead PQFP 100 Lead QFP 100 Lead VQFP 124 Lead PGA 64 Lead DIP 28 Lead DIP (300 Mil) Blazer 125 Tester W/8" Probe Station 4156B Precision Semiconductor Parameter Analyzer 35665A Dynamic Signal Analyzer 4275A Multi-Frequency LCR Meter ZAC03-0004 Brand ZiLOG Designed Micromanipulator ZiLOG Designed Nikon Nikon Leica FEI Trion Leica-Reichert Semprex Optronics Sony HP, Tektronics 7704 HP HP Hypervision Carl Suss Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics Temptronics IMS Wentworth HP HP HP Usage Bench Microprobe Work Die Visual Microscope Die Visual Chip Unzip Inspection High Power Imaging Micro Cross Sectioning, Device Modification and Elemental Analysis and Imaging Device Deprocessing Product Visual Examination Feature Size Measurement Video Camera 3x4 Inch Color Video Print Signal and Waveform Monitor Parametric Tester Capacitance and CV Measure Emission Microscope, Device Microprobe, CV Emission Microscope, Microprobe and Liquid Crystal (Room and Hot) Bitmapping, Device Test Microprobe Parametric Tester Tester Tester (Inductance, capacitance, resistance instrument) 2-7 ZiLOG 2002 Quality and Reliability Report Table 3-1. Summary of QC Test Equipment Equipment At Nampa 4274A Multi-Frequency LCR Meter Microminipulator Test Station (2) 4155B Semiconductor Parameter Analyzer 208 PQFP 44 QFP 48 DIP 64 DIP 17x17 PGA 84 PLCC 24 DIP 48 DIP 28 DIP 24 DIP 44 PLCC 124 PGA HP Display 1340A Philips XL30 SFEG SEM Multiprep Techprep 50x - 4500x High Power Optical Microscope High Temperature Oven 20 C - 550 C Photographic Printer Printer (color) MP4 Camera Chip Unzip ZAC03-0004 Brand HP Micromanipulator Agilent Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger Schlumberger HP Philips Allied High Tech Nikon Eclipse L200 Grieve Codonics Tektronics Polaroid Hypevision Usage Tester (Inductance, capacitance, resistance instrument) Probe Test Parameter Tester Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Socket Adapters Signal Display Ultra High Resolution SEI, BSE (Solid State) Parallel Polishing Bright field, Dark field, Numarsky, Confocal inspection, Digital Camera1280 x 1944 Hammer Testing, Ink Dot Curing High Quality Photographic Printer Photographic Printer Polaroid Photographs Backside Analysis 2-8 ZiLOG 2002 Quality and Reliability Report Table 3-1. Summary of QC Test Equipment Equipment At Campbell Brand Usage Spectrum Analyzer HP-8591A Near Field EMI Testing Pre-Amplifier HP8447D Near Field EMI Testing Plotter HP-7550A Near Field EMI Testing Biconical Antenna #CEAB-100 Near Field EMI Testing Log Periodic Antenna #CEAL-100 Near Field EMI Testing USE OF OUTSIDE FMA LABS RIGA Analytical Lab, Inc. 3375 Scott Blvd., Suite 132 Santa Clara, CA 95051 Charles Evans & Assoc. 301 Chesapeake Drive Redwood City, CA 94063 BridgePoint Tech. Mfg. 4007 Commercial Drive Austin, TX 78744 ZAC03-0004 2-9 ZiLOG 2002 Quality and Reliability Report CUSTOMER NOTIFICATION SYSTEM Corporate R/QA notifies the customer with a formal change notification letter on major process and design changes if the customer requests notification of such. The following is a list of criteria for which certain customers need to be notified: 1. Process: die size, passivation, metallization, mask changes. 2. Materials and finishes: either internally or externally, including symbolization. 3. Internal Connection Methods: including lead bonding and die attach. 4. Packaging: sealing and encapsulation techniques, including lead bonding and die attach. 5. Test Parameters: which may affect correlation. 6. Anti-Static Handling: procedures or packaging. Shown on the following pages is an example of a change notification letter that gives the customer a schedule of the conversion, stating that: * The customer will be given 30 days to respond to ZiLOG requesting samples for qualification by the customer. * New product will be shipped within 60 days from the date of the letter, unless ZiLOG receives written notice from the customer to continue shipping their current qualified product. ZAC03-0004 2 - 10 ZiLOG 2002 Quality and Reliability Report June 30, 2000 Subject: Customer Change Notification Z80S183 / Z80L183 Die Revision Change From "B" to "C" Dear Customer: Please be advised that ZiLOG is in the process of changing the current Z80S183/Z80L183 die revision "B" for the Mixed Signal 180. The new Z80S183/Z80L183 die revision "C" is fully compatible with the existing Z80S183/Z80L183 with the exception of the following improvements. 1. Improved Sleep Mode current of less than 1.7 mA @ 5V less than 700A @ 3V. 2. All modes of the Watch Dog Timer are functional. 3. The CPU ID Register at location 3Dh is changed from 00h to 02h to reflect the new die. All Z80S183/Z80L183 have a date code in the lower left corner of the package and follow the yyww convention, where yy is the year and ww is the week. The improved die will be stamped date code later than 0025. If you wish to receive qualification samples of the new product, contact the ZiLOG field sales office serving your area. Sincerely, Mike Burgdorf Director Reliability and Quality Assurance ZAC00-0045 ZAC03-0004 2 - 11 ZiLOG 2002 Quality and Reliability Report CHAPTER 3 Qualification Requirements PRODUCT/PROCESS QUALIFICATION REQUIREMENTS Per Procedures SOP0940, SOP0903 and SOP0909, ZiLOG performs initial qualification on new processes, products and packages. Re-qualification is required when material changes occur. Table 4-1. Product/Process Qualification Requirements Test Sample Size Acceptance Criteria MIL-STD 883C/Procedure Test Conditions ESD 10 HBM 3015.7 2 KV Min. CMOS Latchup 6 200 mA Min QR - QCC-1425 EIA/JESD78 3 PTIC, 3 NTIC Operating Life 77 1/77 1005 150C, 5V 184 Hour/Full Qual Temp Cycle 45 0/45 1010, Condition C -65C to 150C 500 Cycles/Qual 1000 Cycles/Test Pressure Pot 45 0/45 QCC-1403 336 Hours 121C at 2 ATM HAST 45 0/45 PM 25-13 96 Hours 140 C, 85% RH, 2 ATM Package Integrity 10 0/10 240C, 10 Sec Note: Process Qual requires three (3) lots, Product Qual requires one (1) lot. ZAC03-0004 3- 1 ZiLOG 2002 Quality and Reliability Report ZiLOG Product Qualification Summary PRODUCT QUALIFICATION SUMMARY ZiLOG Authorized Distribution Document Control Nbr.: QR-9392 Rev.: 02 Page 1 of 1 DATE: 12-4-01 PRODUCT: Z86L88 PROCESS: UMC 0.35 um WRITTEN BY: Joseph Brajkovich APPROVED: M. Burgdorf * INTRODUCTION This report summarizes the qualification results of the Z86L88 16K IR Microcontroller. * INFORMATION SUMMARY All qualification tests were performed to MIL-STD-883 and/or internal ZiLOG procedures. PRODUCT QUALIFICATION Test Description ESD Latch-up Burn-in Temperature cycle Pressure pot HAST Package integrity QUALIFICATION Process Device ZAC03-0004 Test Method MIL-STD-883/3015 QCC1425 MIL-STD-883/1005 MIL-STD-883/1010 120 C, 15 PSI 140 C, 85% RH 240 C, 10 seconds TYPE UMC 0.35 um Z86L88/G Condition Condition D Per Test Condition B, 150 C Condition C Per Test Per Test Per Test Test Result PASS PASS 0/77 184 hours 0/50 1000 cycles 0/50 336 hours 0/50 96 hours 0/15 DOC. NO. QR-0656 QR-1098 3- 2 ZiLOG 2002 Quality and Reliability Report Package Qualification Requirements Sample Size Acceptance Criteria Solderability 4 0/15 2003 LTPD 15/Leads Physical Dimensions 15 0/15 2016 Per Mil-STD Lead Fatigue 15 0/15 2004 Per Mil-STD External Visual 4 0/4 1004 Per Mil-STD Internal Visual 4 0/4 1004 Per Mil-STD Die Shear 3 0/3 QCC-0105 8 Lbs Min Bond Strength 4 0/15 2011, Condition D 4 gms Min. Bond Shear 3 0/3 QCC-0184 Operating Life 77 1/77 1005 Temp Cycle 45 0/45 1010, Condition C -65C to 150C 500 Cycles/Qual 1000 Cycles/Test Pressure Pot 45 0/45 QCC-1403 HAST 45 0/45 PM 25-13 336 Hours 121C at 2 ATM 96 Hours 140C, 85% RH, 2 ATM Package Integrity 5 0/15 X-Ray 32 0/32 Solder Dunk 5 0/5 Test ZAC03-0004 MIL-STD 883C/Procedure Test Conditions 150C, 5V 184 Hour/Full Qual 240C, 10 Sec 2012 Per Mil-STD Per Test Method 3- 3 ZiLOG 2002 Quality and Reliability Report ZiLOG Package Qualification Summary PACKAGE QUALIFICATION SUMMARY Document Control Nbr.: QR-3002 Rev.: 01 Page 1 of 1 OP25 PACKAGE TYPE: 44L QFP DATE: 1-27-99 WRITTEN BY: Joseph Brajkovich APPROVED: Alice Baluni * INTRODUCTION This report summarizes the qualification results of the 44L QFP package. * INFORMATION SUMMARY All qualification tests were performed to MIL-STD-883 B, C and/or internal ZiLOG procedures. PACKAGE QUALIFICATION Test Description Bond Strength Test Method MIL-STD-883/2011 Condition Condition D Ball Shear Die Shear Physical Dimensions Resistance to Solvents Lead Fatigue Solderability Pressure Pot Temperature Cycle Burn-In Package Integrity Solder Dunk QCM-0184 QCM-0105 MIL-STD-883/2016 MIL-STD-883/2015 MIL-STD-883/2004 MIL-STD-883/2003 QCC1403 MIL-STD-883/1010 MIL-STD-883/1005 240C, 10 seconds 3X 240C, 10 seconds 3X Per Spec Per Spec Per Test Method Per Test Method Per Test Method Per Test Method Per Spec Condition C 125C Per Test Method After 1000 Temp Cycle QUALIFICATION Package ZAC03-0004 TYPE 44L QFP Test Result 6.8/8.2/7.5 min/max/ave 0/3 0/3 0/15 0/15 0/1 0/6 0/45 336 hrs 0/45 1000 cycles 0/77 1000 hrs 0/15 0/5 DOC. NO. QR-0308 3- 4 ZiLOG 2002 Quality and Reliability Report CHAPTER 4 Quality Monitor Systems FAILURE RATE PREDICTION CALCULATIONS ZiLOG estimates the operating life of our products through statistical methods. It is not possible to guarantee the lifetime of an individual part because the tests to determine this are destructive. Therefore, we can only use statistics to predict the typical behavior of groups of parts. These predictions, and the methods they are based on, are documented in FIT reports. The FIT report is based on process specific data and is derated to reflect individual device characteristics. FIT reports are available for all of ZiLOG's products. Other factors that affect device lifetime include actual operating hours, ambient temperature, stability of the power supply, board assembly and other handling practices. All of these factors are outside of the control of ZiLOG and may dramatically shorten the lifetime of a device. The failure rate for each product and process is a function of time, temperature and applied power. The primary temperature is, of course, the product junction temperature. This is externally influenced by the ambient temperature and internally influenced by the power dissipated in the die. The power dissipation, in turn, is a function of the duty cycle and applied VCC. In the case of CMOS, product power dissipation is also a function of the operating frequency. ZiLOG product failure rates were derived from accelerated life test results accumulated on an ongoing basis as part of the ZiLOG reliability monitor. The accelerated life test reliability data includes both infant mortality (early life results 0-160 hours) and long term life results (168-1000 hours). Various interim time points and sample sizes are used. Lifetest may be performed at either 125C for 1000 hours or the Mil-Std-883 equivalent or 150C for 184 hours. ZAC03-0004 4-1 ZiLOG 2002 Quality and Reliability Report The acceleration obtained when using high temperature life stressing, may be calculated for various stress and application temperatures using the widely accepted Arrhenius equation as follows: A = exp(-Ea(T1 - T2)/k(T1)(T2)) Where ZAC03-0004 A: Acceleration factor Ea: Activation energy (eV) T1: Application junction temperature (K) T2: Stress junction temperature (K) k: Boltzmann Constant 8.62 x 10-5 (eV/K) 4-2 ZiLOG 2002 Quality and Reliability Report Z85230VSC FIT Rate Calculation The acceleration obtained when using high temperature life stressing may be calculated for various stress and application temperatures using the widely accepted Arrhenius equation as follows: A = exp (-Ea (T1 - T2) / (k (T1) (T2))) Where A: Ea: T1: T2: k: Acceleration factor Activation energy (eV) Application junction temperature (K) Stress junction temperature (K) Boltzmann Constant 8.62 x 10-5 (eV / K) 5 Assume Ea = .7, Ta application = 55C, Ta stress = 125C and k = 8.62 x 10 . Consider now a typical CMOS product Z85230 operating with a 100% duty cycle at 16 MHz in a 44 pin PLCC package. Then with a VCC of 5V and an Icc of 7 ma this would give T1 = 330K and T2 = 400K. 5 A = exp (-.7(330 - 400) / 8.62 x 10 (330) (400) ) = 75 So 1000 hours of life stress at 125C is equivalent to 75,000 hours of system application operation at 55C. FIT and Failure Rate Estimation: Given High Temperature Operating Life stress results: Z85230 Rel Monitor 1994 Rel Monitor 1995 Rel Monitor 1996 Rel Monitor 1997 Rel Monitor 1998 Rel Monitor 1999 Rel Monitor 2000 Rel Monitor 2001 Rel Monitor 1H-2002 168 Hours 500 Hours 1000 Hours 0/76 0/837 0/10,759 1/6,152 0/7,520 0/22,470 0/38,258 0/61,646 0/12,992 0/8,394 0/76 0/760 0/76 0/606 077 0/231 0/200 0/77 0/231 0/200 2 Failure Rate Estimations are made assuming a Poisson distribution using the Chi density function to assign confidence values as an estimate for the general population as follows: 60% Confidence 2 # Fails = 1 then Chi = 4.05 2 Given 1 reject from 29,527,680 device hours at 125C. Then using Chi this gives a median failure rate of 6 4.05/2 rejects per 29,527,680 device hours or 0.0686 rejects per 10 device hours. 6 Failure rate = 0.0686 rej / 10 dev. hrs. 9 = 68.6 rej / 10 dev. hrs. = 68.6 FIT at 125 C Failure Rate MTBF = 68.6/75 = 1 FIT at 55C (A = 75 as above) 9 = 10 /1 = 124,471 years ZAC03-0004 4-3 ZiLOG 2002 Quality and Reliability Report ESD TESTING METHODOLOGY ZiLOG has an unqualified commitment to quality and reliability and, as part of this commitment, ZiLOG strives to provide the best possible ESD protection for each of our products. Since 1983, ZiLOG has had an ongoing electrostatic discharge development program to monitor and improve its ESD protection circuitry. During an ESD event, the ESD protection circuitry must absorb the power of the ESD pulse while allowing little or no damage to occur to the internal circuitry of the chip. A 3000 volt ESD pulse can induce transient currents approaching one amp, and it is the management of these transient currents that is the key to good ESD protection. At ZiLOG, ESD protection circuits have been developed to optimize the handling of ESD pulse currents, by paying close attention to current flow patterns, and minimizing current density and crowding problems that cause damage to the circuitry. This circuitry has resulted in typical ESD failure voltages above 2000 volts for NMOS products and above 4000 volts for CMOS products, with concomitant improvement in product quality and reliability. All of ZiLOG's products are tested for their ESD immunity as part of routine internal qualification procedures. The ESD test hardware is in compliance with MIL-STD-883 and Method 3015.7. LATCHUP TESTING METHODOLOGY ZiLOG has an unqualified commitment to quality and reliability and, as part of this commitment, also strives to provide each of its products with the best possible latchup protection. ZiLOG has an ongoing program to monitor and improve its latchup protection circuitry. Latchup may occur as a result of either current injection (positive or negative) or supply pin overvoltage. The latchup action is that of a parasitic SCR, converting from a high-impedance state, to a low impedance, regenerative, state. The resulting current flow may exceed the design capabilities of the device. Damage may occur to interconnections (bond wires and die metallization) as a result of thermal heating effects and excessive current flow. During conditions, which may lead to latchup, the device must be able to shunt the triggering event (the positive or negative injection current) without damage to the device. ZiLOG has targeted a 200 mA minimum latchup requirement for all new designs to minimize the risk of latchup. In addition, ZiLOG recommends that the customer do a careful analysis of system transients to ensure that our maximum undershoot and overshoot applied potentials are not violated. Absolute maximum ratings are: voltage on Vcc with respect to VSS - 0.3V to +7.0V and voltages on all inputs with respect to VSS - 0.3 to VCC + 0.3V. All of ZiLOG's products are tested for their latchup immunity as part of routine internal qualification procedures. The latchup test hardware is in compliance with EIA JEDEC Standard 78, and the detailed test procedure is per ZiLOG specification QCC1425, which is available upon request. ZAC03-0004 4-4 ZiLOG 2002 Quality and Reliability Report ZiLOG'S RELIABILITY SUMMARY ZiLOG's reliability program is unique, in that the reliability testing takes place on standard production material at the point of assembly. Reliability testing has been integrated into the manufacturing process. This flow creates a "Quick Reaction" reliability monitor, and allows ZiLOG to ensure the integrity of material prior to shipment, gather trend analysis data for internal corrective actions, and maintain a meaningful database for customer review. The tests currently employed under ZiLOG's quick reaction reliability monitor, include early life (burn-in), steam pressure pot, and temperature cycle. Testing conditions are included with the attached test results. In addition to early life testing, a long-term life test is performed on selected lots to gather FIT data. Test conditions and FIT calculations are included with the attached data. Following are brief descriptions of various reliability tests included in this program: EARLY LIFE Early Life testing, also called burn-in, is typically performed at 125C for 168 hours. A dynamic or static bias is employed, depending on the device that is being tested. Early Life test results expose process or assembly defects. These results are a valuable measure of a given fabrication or assembly process. LONG TERM LIFE Long Term Life testing is generally performed at 150C for 184 hours. Either dynamic or static bias is used to stress the device appropriately. These test results are used to estimate field operation lifetime for a device. This data can be applied to all products manufactured using the same fabrication process. PRESSURE POT Pressure pot testing is performed at 121C, 15 PSIG, and 100% relative humidity. This test evaluates the ability of a plastic device to withstand the long-term effects of a humid environment. TEMPERATURE CYCLE Temperature Cycle testing is performed at a -65C to 150C temperature. This test uses an air-toair environment. The 215C cold to hot temperature difference determines if proper thermal expansion matching exists between all materials used in device manufacture. The temperature cycle simulates the thermal stresses a device undergoes during power-up and power-down events. ZAC03-0004 4-5 ZiLOG 2002 Quality and Reliability Report HIGHLY ACCELERATED STRESS TEST The Highly Accelerated Stress Test (HAST) is performed at a 141C temperature and 85% Relative Humidity (RH) at 2 ATM of pressure with alternate pin bias. This test replaces the traditional 85/85 test and greatly reduces the time taken to evaluate the ability of a plastic encapsulated device to withstand the long-term effects of a biased humid environment. PACKAGE INTEGRITY TEST Package Integrity testing ensures the integrity of surface mount devices in terms of package cracking, bonding craters, and marked deterioration as a result of heat application during the soldering operation. This includes testing of 5 units on each 3 legs as follows: CONTROL - 10-SECOND SOLDER DUNK AT 240C TEST 1 - 10-HOUR *PPT 10-SECOND SOLDER DUNK AT 240C TEST 2 - 10-HOUR *PPT 3-HOUR OVEN BAKE AT 150C 10-SECOND SOLDER DUNK AT 240C (*PPT = Pressure Pot Testing at 121C, 100% RH, 2 ATM) End-points are room temperature electrical test, visual inspection, mark permanency and crater test. ZAC03-0004 4-6 ZiLOG 2002 Quality and Reliability Report Table 5-1. ZiLOG's Reliability Monitor Testing Requirements Test Conditions Product to be Tested Frequency SS Allowable Rejects Temp cycle Each pkg type Monthly 45 0 Pressure Pot Package/Fab Process Monthly 45 0 Burn-in Per assembly and process flow Per assembly and process flow PLCC or QFP package Weekly 77 0 -65 to 150C 100, 500, 1000 cycles 96, 168, and 336 hrs 121C, 100% RH, 2 ATM 168 hrs, 125C Every 2 Months Weekly 77 1 184 hrs cum, 150C 15 0 N/A 10 N/A Latch-up CMOS Each new die revision or device Each new die revision or device 10-hr Pressure Pot, 10 second solder dunk Mil Std 883 N/A N/A Per ZiLOG spec HAST 1 pkg/fab process Monthly 10 or as needed 45 Solderability Each package type Any package type with solder Monthly 3 0 NMOS - 48 hours CMOS - 96 hours at 140C, 85% RH 2 ATM Mil Std 883 Weekly 3 0 MAB 1042 Each package type Weekly 1 0 Per ZiLOG spec Life test Package Integrity ESD Solder thickness monitor Lead fatigue test ZAC03-0004 0 Test 4-7 ZiLOG 2002 Quality and Reliability Report Table 5-2. ZiLOG Reliability Monitor Early Life Test Conditions: 168 HRS, 125C Burnin CMOS Plastic Package 2002 Lot No. Rej S/S Z8018008FSC Y132AB0Q 0 77 Z88C0020VED1700TR EYH42CC0PBB 0 1134 Z84C9008VED1380TR EY130NR0PBG 0 206 Z84C9008VED1380TR EY130NR0OBG 0 397 Z86E0208PSC1925 AYI43HH0BP 0 77 Z84C9008VED1380TR EY130NR0PAB 0 110 Z84C9008VED1380TR E123AJ0C 0 139 Z8018233FSC AY144LY0P 0 77 Z84C9008VED1380TR E125BN0QAA 0 528 Z84C9008VED1380TR E125BN0QABA 0 795 Z84C9008VED1380TR E125BN0QABB 0 462 Z84C9008VED1380TR E125BN0QBA 0 795 Z8018008VSC BX145AS0 0 77 Z84C9008VED1380TR E125BN0QBBA 0 795 Z8622812PSC E143GX0T 0 77 Z88C0020VED1700TR BY151BH0A 0 1801 Z86C3316PSCR4124 AYH1120AR 0 77 Z9023406PSCR51X3 EYH1314BG 0 77 Z86C4312PSCR5122 BYH0988D 0 100 Z86C9012PSC EYH1373B 0 100 Z86L8708PSCR51R3 EYHBJ28.01 0 77 Z86L8708PSCR51R3 EHBJ27.0F 0 77 Z86C0208PSCR517J EZ209HU0E 0 77 Device Type Fail Notes 1H - 2002 ZAC03-0004 4-8 ZiLOG 2002 Quality and Reliability Report Table 5-2. ZiLOG Reliability Monitor Early Life Test Conditions: 168 HRS, 125C Burnin CMOS Plastic Package 2002 Device Type Lot No. Rej S/S Z86C0412PECR4537 EZ208DS0B 0 77 Z86L8808PSCR51JW NXHCE27.0CT 0 77 Z85C3008VSC B038GN0QB 0 77 Z85C3008VSC B038GN0QA 0 77 Z84C0008PEC1983 A036FY0X1P 0 77 Z84C0008PEC1983 A038GG0PQ 0 77 Z86C0712PSCR2568 B135PT0RBB 0 100 Z84C9010VSC EY20SLU0Q 0 77 Z84C0008FEC BY206BJ0B 0 77 Z8S18033VSC EY145BN8A 0 77 Z8S18033VSC BY204FH0AR 0 77 Z86C3312PECR50RX BX208DL0P 0 77 Z9023406PSCR522X BYHCE29 0 77 Z86C9533ASC2041 A125CF8B 0 77 Z86L8808PSCR51JW NXHCE27.0CT 0 77 Z9023406PSCR522X BYHCE29 0 77 Z9025506PSCR523H BYN22H6895.00P 0 77 Z9025506PSCR51AP BYH1601B 0 77 Z85C3008VSC S042AE0R 0 77 Z85C3008PSC K041HJ0S 0 77 Z86C0208PSCR4502 K207PY0AR 0 77 Z903561212PSCR50LM BH1666AC 0 77 Z8L18020FSC A214GL0AAP 0 77 Z8S18020VSC K207XX0AR 0 77 Z85C3008PSC K041HJ0S 0 77 ZAC03-0004 Fail Notes 4-9 ZiLOG 2002 Quality and Reliability Report Table 5-2. ZiLOG Reliability Monitor Early Life Test Conditions: 168 HRS, 125C Burnin CMOS Plastic Package 2002 Device Type Lot No. Rej S/S Z84C9010VSC K207HR0AP 0 77 Z8S18020VSC K207XX0AR 0 77 Z9023406PSCR5140 BYH1786D 0 77 Z84C9010VSC EY205LU0Q 0 77 Z9025506PSCR51AP BYH1490FD 0 100 Z8702414SSCR51XK BHBT78.04B 0 72 Z8702414SSCR51XK CHBT77 0 75 Z8S18033VSC BY204FH0AR 0 77 Z8S18020VSC A222FN0AQ 0 77 Z86L4308FSCR50AF BZ222HS0B 0 77 Z86E3312SSC AZ222JK0AAQ 0 77 Z86E0208PSC1925 AZ221TU0PA 0 77 Z84C0006PEC KZ219KN0P 0 100 Z9023406PSCR51J1 BHCWF8.020A 0 100 Z8S18010VSC A222FN0AQ 0 100 Z86K1505PSCR4530 AZ233FP0PB 0 100 Z9023406PSCR50M5 BYH1509RB 0 100 Z84C0010PEC AZ219KP0QR 0 100 Z86L4308FSCR50AF BZ222HS0B 0 100 Z86E0208PSC1925 AZ222JJ0AAB 0 100 Z86E0208PSC1925 AZ223FZ0PA 0 100 Z86E0812SSC1866 NZ224KR0PB 0 100 Z86E3312SSC AZ222JK0AAQ 0 100 Z86E0412PSC1866 AZ223HW0APB 0 100 Fail Notes 2H - 2002 ZAC03-0004 4 - 10 ZiLOG 2002 Quality and Reliability Report Table 5-2. ZiLOG Reliability Monitor Early Life Test Conditions: 168 HRS, 125C Burnin CMOS Plastic Package 2002 Device Type Lot No. Rej S/S Z86E0208PSC1925 AZ221TU0PA 0 100 Z86E0208PSC1925 AZ221TU0PC 0 100 Z84C2006VEC B219SV0S 0 100 Z86E2112PSC A048LW0X 0 100 Z86E3312PSC B225HN0APB 0 100 Z86E3312PSC BZ25HN0APB 0 77 Z86C0812PSCR2422 AZ227CG0AP 0 77 Z86C3312PSCR2130 B220CDDAAA 0 77 Z8F6403FZ030SC AR60986.1P 0 77 Z864170813SCR3212 BYH16655B 0 77 Z8674312FSC BZ228AL0AQ 0 77 Z84C0008FEC AZ221JN0PQA 0 100 Z86C6116PSCR3360 AZ227LN0AQ 0 100 Z85C3008VSC BZ228SY0 0 100 Z8S18020VSC1960 B001LN0P 0 100 Z8702414SSCR52CH AZHF11.132A 0 77 EZ80F92AZ020SC KR61001.AZ 0 76 Z86C0812PSCR50PX AZ234HJ0PA 0 100 Z86E0212PSC1866 AZ233AY0PPA 0 100 Z86L8808PSCR51JW BZHF03S.00E 0 100 Z84C00010PEC AZ231JP0RR 0 100 Z9023306PSCR51J9 BHF1W2.03C 0 100 Z8018008VSC BZ233BF0 0 100 Z9025106PSCR52NN B230EJ0A 0 77 Z86C3312PECR517F NY214GN0P 0 77 Z8019520FSC K232CN0A 0 77 Z86C6516PSCR3332 NZ235DG0B 0 77 Z86C6116PSCR2224 AZ230PU0KQA 0 77 Z84C00008PEC A222KS0ATQ 0 77 Z86K1505PSCR4230 AZ239KY0BPA 0 77 Z8F6403FZ030SC AR61105.A1 0 83 ZAC03-0004 Fail Notes 4 - 11 ZiLOG 2002 Quality and Reliability Report Table 5-3. ZiLOG Reliability Monitor Early Life Test Conditions: 168 HRS, 125C Burn-in NMOS Plastic Package 2002 Device Type S/S Lot No. Rej Z0843004DSA0563 B0315W0RRA 0 381 Z0843004DEA0539 B031SW0RQ 0 178 Z0843004DSA0563 B031SW0RRBA 0 1146 Z0843004DSA0563 B031SW0RRBB 0 501 Z0844004DSA0541 B607BDOACAB 0 1669 Z0840004DEA0540 B709GJ0AAPB 0 275 Z0843004DSA0563 B031SW0RRBC 0 60 Z0840004DEA0540 B709GJ0AAPC 0 284 Z0853606DEA B031RZ0BA 0 188 Z0840004DEA0540 B709GJ0AAPE 0 285 Z0803008DEA B840KZ0AQA 0 198 Z0853606DEA B031RZ0BB 0 106 Z0840004DEA0540 B709GJ0AAPG 0 285 Z0840004DEA0540 B709GJ0AAPH 0 285 Z0840004DEA0540 B709GJ0AAPI 0 285 Z0840004DEA0540 B709GJ0AAPJ 0 253 Z0840004DEA0560 B709GJ0AAPG 0 285 Z0847004PSC E1451Z0P 0 100 Z0803606PSC E144NT0P 0 180 Z084004DSA0560 B709GJ0AARA 0 285 Z084004DSA0560 B709GJ0AARB 0 285 Z084004DSA0560 B709GJ0AARC 0 285 Z084004DSA0560 B709GJ0AARD 0 285 Z084004DSA0560 B709GJ0AARE 0 285 Z084004DSA0560 B709GJ0AAQH 0 200 Z084004DSA0560 B709GJAAQF 0 73 Z0803606PSC E204FF0AP 0 77 Z0840004PSC EY205AN0AP 0 77 Z0847006PSC EY149EX0AR 0 77 Fail Notes 1H - 2002 ZAC03-0004 4 - 12 ZiLOG 2002 Quality and Reliability Report Table 5-3. ZiLOG Reliability Monitor Early Life Test Conditions: 168 HRS, 125C Burn-in NMOS Plastic Package 2002 Device Type S/S Lot No. Rej Z0847006PSC A212LN0AZP 0 100 Z0853006PSC A221CG0QP 0 100 Z0853006VSC A217JR0RR 0 77 Z0844006PSC B145WZ0 0 77 Z0853606VSC BZ203AE0AP 0 100 Z0853006PSC A237LZ0AAPA 0 77 Z0853006PSC A237LZ0AAQP 0 77 Fail Notes 2H - 2002 ZAC03-0004 4 - 13 ZiLOG 2002 Quality and Reliability Report Table 5-4. ZiLOG Reliability Monitor Long-Term Life Test Conditions: 150C, 5V,184 HRS Burn-in CMOS 2002 Device Type Lot No. Rej S/S Fail Notes 1H - 2002 Z86L990PZ008SCR51ML BYHBHAE 0 77 Z86L990PZ008SCR51J5 BH0517A 0 77 Z86C0612PSCR51RX E146EW8R 0 77 Z8932320FSCR51M7 AYH2TX8R 0 77 Z86C3316PSCR51F7 AY148BS8 0 77 Z9023406PSCR51X3 EYH1B032 0 77 EZ80L92AZ020SC MB54G 0 76 Z9023406PSCR503W EYH134BG 0 76 Z9023406PSCR51X3 EYHBQ33 0 77 Z86L8708PSCR51R3 EYHBS28.01 0 77 Z86L8708PSCR51R3 EHBJ27.0F 0 77 Z0221524VSCRJ0A5 KY209KT0A 0 77 Z9023406PSCR522X BYHCE29 0 77 Z8702414SCR51XK BHBT78.04B 0 72 Z8702414SCR51XK CHBT77 0 75 Z86L990PZ008SCR51ML EYHCF08 0 77 Z0221524VSCR50A5 BY203BJ84 0 77 Z1GS02BA EY204EE8HSC 0 77 Z1GS03BA EY215BX8 0 77 Z9023406PSCR51J1 BCWF8.02DA 0 77 Z8702414SSCR52CH KR61001.A2 0 77 EZ80F92AZ020SC2047 AZHF11.132A 0 77 Z86L34PZ008SCR525N N2AHF565.01 0 77 Z0221524VSCR51JA KA227EU8AB 0 77 2H - 2002 ZAC03-0004 4 - 14 ZiLOG 2002 Quality and Reliability Report Table 5-5. ZiLOG Reliability Monitor Long-Term Life Test Conditions: 125C 1000 HRS Burn-in CMOS 2002 Device Type Lot No. Rej S/S Fail Notes 1H - 2002 Z85C3008PSC K041HJ0S 0 77 Z8S18020VSC K207XX0AR 0 77 Z86C3312PSCR2130 B220CD0AAA 0 77 Z84C0006PEC KZ219KN0P 0 77 2H - 2002 ZAC03-0004 4 - 15 ZiLOG 2002 Quality and Reliability Report Table 5-6. Reliability Test Summary Early Life Test Summary 2002 Technology Package Type Samples Tested Rejects FITS (55C,60%,0.7eV) 1H - 2002 NMOS Plastic 8,873 0 8 CMOS Plastic 10,172 0 7 19,045 0 4 TOTAL 1H - 2002: 2H - 2002 NMOS Plastic 608 0 121 CMOS Plastic 4,245 0 17 4,853 0 15 23,898 0 3 TOTAL 2H - 2002: TOTAL - 2002 Table 5-7. Reliability Test Summary Long-Term Life Test Summary 2002 Device Hrs @ 125C Rejects FITS (55C,60%,0.7eV) 1,454,000 0 9 NMOS 154,000 0 80 CMOS 539,000 0 23 TOTAL 2H - 2002 693,000 0 18 2,147,000 0 6 Technology 1H - 2002 CMOS 2H - 2002 TOTAL - 2002 ZAC03-0004 4 - 16 ZiLOG 2002 Quality and Reliability Report Table 5-8. ZiLOG Reliability Monitor Pressure Pot Test Conditions: 121C, 2 ATM. CMOS Plastic Packages 2002 Device Type Lot No. 96 Hrs Rej S/S 168 Hrs Rej S/S 336 Hrs Rej S/S Fail Notes 1H - 2002 Z86L87088PSCR51R3 EYHBJ270F - - 0 45 0 45 Z86L990PZ008SCR51ML BYHBHAE - - 0 45 0 45 Z86L990PZ008SCR51J5 BH0517A - - 0 45 0 45 Z8018008VSC BX145ASO - - - - 0 45 Z9023406PSCR51X3 EYHB032 - - 0 45 0 45 Z84C0008PEC1983 A036FY0X1P - - - - 0 45 Z8018008FSC Y132AB0Q - - - - 0 45 Z8937320ASC B810WW8Q2 - - - - 0 45 Z86L87SZ008SCRXXX G1473AFB - - - - 0 45 Z86C3316PSCR4124 AYH1120AR - - 0 45 0 45 Z86C0408PECR2981 A204EK0RPPA - - - - 0 45 Z86L8808SSCR51PX BXH1505APB - - 0 45 0 45 Z84C0008FEC BY206BJ0B - - - - 0 45 Z9023406PSCR5140 BYH1786D - - - - 0 45 Z8673312PSC 0EY204JW0B - - - - 0 32 Z84C9010VSC EY205LU0Q - - - - 0 45 Z86L8808SSCR51XF EYHBHTH.0CP - - - - 0 45 Z86E136SZ016SC NYH1736AAT - - - - 0 45 Z86E136SZ016SC NYH1736AATA - - - - 0 45 Z85C3008VSC B038NG0QA - - 0 45 0 45 Z85C3008VSC B038GN0QB - - 0 45 0 45 Z0843006PSC K037JX0T 0 45 - - 0 45 Z8937320ASC K813TY8 0 45 - - 0 45 Z16C0110PSC B9S0JY0 - - - - 0 45 ZAC03-0004 4 - 17 ZiLOG 2002 Quality and Reliability Report Table 5-8. ZiLOG Reliability Monitor Pressure Pot Test Conditions: 121C, 2 ATM. CMOS Plastic Packages 2002 Device Type Lot No. 96 Hrs Rej S/S 168 Hrs Rej S/S 336 Hrs Rej S/S Z8702414SSCR51XK BHBT78.04B - - 0 45 0 45 Z8702414SSCR51XK CHBT77 - - 0 45 0 45 Z8623316VSCR4591 KE2080Q - - - - 0 45 Z84C9010VSC K207HR0AP - - - - 0 45 Z85C3008PSC K041HJ0S - - - - 0 45 Z16C0110PSC K930FX0 - - - - 0 45 Z86C0208PSCR4502 K207PY0AR - - 0 45 0 45 Z8F6403FZ020SC AR60986 - - - - 0 45 Z86E136SZ016SC AG0797EX - - 0 45 0 45 Z80180008VSC00TR BZ221XX0B - - - - 0 45 Z8S18020VSC K207XX0AR - - 0 45 0 45 Z8612912SSC A224DL0AP - - 0 45 0 45 Z9023406PSCR51J1 BHCWF8.02DA - - 0 45 0 45 Z8PE003HZ010SC B219FP0 - - 0 45 0 45 Z86C6516PSCR3332 NY211NS0B - - 0 45 0 45 Z84C0006PEC KZ219KN0P - - 0 45 0 45 EZ80F92AZ020SC2047 KR61001.02 - - 0 45 0 45 Z86D991SZ008SC2046 SY206HH0BAP - - 1 45 0 44 Z8S18010VSC A222FN0AQ - - 0 45 0 45 Z8F6403FT020SC R61105.A1 - - 0 45 0 45 Z8702414SSCR52CH AZH11.132A - - 0 45 0 45 Z86C3312PSCR3130 B220CD0AAA - - 0 45 0 32 Z8641708BSCR3212 BYH1665B - - - - 0 45 Z86L98HZ008SCR526R SHCNQ5.02RA - - 0 45 0 45 Z8018233ASC1932 AH0657SB - - - - 0 45 Z8019520FSC K232CN0A - - - - 0 45 Z86C3312PECR5177 NY214GN0P - - - - 0 45 Fail Notes 2H - 2002 ZAC03-0004 B8F -EOS 4 - 18 ZiLOG 2002 Quality and Reliability Report Table 5-9. ZiLOG Reliability Monitor Pressure Pot Test Conditions: 121C, 2 ATM. NMOS Plastic Packages 2002 Device Type Lot No. 96 Hrs Rej S/S 168 Hrs Rej S/S 336 Hrs Rej S/S Fail Notes 1H - 2002 No Samples Available 2H - 2002 Z0853606VSC ZAC03-0004 B205APOA - - 0 45 0 45 4 - 19 ZiLOG 2002 Quality and Reliability Report Table 5-10. ZiLOG Reliability Monitor For Temperature Cycling Test Conditions: Condition C, -65C To 150C CMOS 2002 Device Type Lot No. 100X Rej S/S 500X Rej S/S 1000X Rej S/S Fail Notes 1H - 2002 Z86L8708PSCR51N7 EYHBHMA - - 0 45 0 45 Z86L88708PSCR51R3 EYHBJ270F - - 0 45 0 45 Z86L990H2008SCR50XC H0757 - - 0 45 0 45 Z8623312PSCR4409 EY149EP0RA 0 45 - - - - Z8623312PSCR4409 EY149EP0RB 0 45 - - - - Z856L8808PSCR51JW EY10004AJ 0 45 - - - - Z86E136PZ016SC EYH0765AA 0 45 - - - - Z84C3008PEC EY144SW0V 0 45 - - - - Z84C3008PEC EY145DE0Q 0 45 - - - - Z84C3008PEC EY145DE0R 0 45 - - - - Z8937320ASC B810WW8Q2 - - 0 45 0 45 Z9023406PSCR51X3 EYHBQ33 - - 0 45 0 45 Z86C0208PSCR517J EZ209HU0E 0 45 - - - - Z86C0412PECR4537 EZ208DS0B 0 45 - - - - Z8673312PSC OEY204JW0B - - 0 45 0 45 Z86L8808SCCR51XF EYHBHTH.0CP - - - - 0 45 Z84C9010VSC EY205LU0Q - - - - 0 45 Z8523008VSC AY142YY0BBP 0 45 0 45 Z8611608SSCR3407 AY142RY0RX1 - - 0 45 0 45 Z8611608SSCR3407 AY142RY0RX2 - - 0 45 0 45 Z86C3316PSCR4124 AYH1120AR - - 0 45 0 45 Z84C0008PEC1983 A036FY0X1P - - 0 45 0 45 EZ80L92AZ020SC AMB54GC 0 45 0 45 0 45 Z9035612PSCR3720 BYH1722A - - 0 45 0 45 ZAC03-0004 4 - 20 ZiLOG 2002 Quality and Reliability Report Table 5-10. ZiLOG Reliability Monitor For Temperature Cycling Test Conditions: Condition C, -65C To 150C CMOS 2002 100X Rej S/S 500X Rej S/S 1000X Rej S/S Device Type Lot No. Z8018008VSC BX145AS0 - - 0 45 0 45 Z86L8808SSCR51XP BXH1505APB - - 0 45 0 45 Z8937320ASC B810WW8Q2 - - 0 45 0 45 Z84C008FEC BY206BJ0B - - - - 0 45 Z9023406PSCR5140 BYH1786D - - - - 0 45 Z86C0408PECR2981 A204EK0RPPA - - - - 0 45 Z853008VSC B038GN0QA - - 0 45 0 45 Z853008VSC B038GN0QB - - 0 45 0 45 Z8018008VSC BX145AS0 - - 0 45 0 45 Z8018008FSC Y132AB0Q - - 0 45 - - Z86L827SZ008SCRXXX G1473AFB - - 0 45 0 45 Z86E136SZ016SC AYH1736AASP - - 0 45 0 45 Z86E0208PSC1925 AYB9BN0BBP - - 0 45 0 45 Z86E0208PSC1925 AY143HH0BP - - 0 45 0 45 Z86E126PZ016EC AG0797EX - - 0 45 0 45 Z8702414SCR51XK CHBT77 - - 0 45 0 45 Z8702414SCR51XK BHBT78.04B - - 0 45 0 45 Z16C0110PSC B9S0JY0 - - 0 45 0 45 Z8018008FSC Y132AB0Q - - 0 45 0 45 Z8523008VSC S042AE0R - - 0 45 0 45 Z86E136SZ016SC NYH1736AAT - - 0 45 0 45 Z86E136SZ016SC NYH1736AATA - - 0 45 0 45 Z84C9010VSC K207HR0AP - - 0 45 0 45 Z85C3008PSC K041HJ0S - - 0 45 0 45 Z16C0110PSC K930FX0 - - 0 45 0 45 ZAC03-0004 Fail Notes 4 - 21 ZiLOG 2002 Quality and Reliability Report Table 5-10. ZiLOG Reliability Monitor For Temperature Cycling Test Conditions: Condition C, -65C To 150C CMOS 2002 100X Rej S/S 500X Rej S/S 1000X Rej S/S Device Type Lot No. Z86C0208PSCR4502 K207PY0AR - - 0 45 0 45 EZ80L92AZ020SC AMB54GC 0 45 0 45 0 45 Z8018008VSC00TR BZ221X0B - - 0 45 0 45 Z8623316VSC4591 KE2080Q - - 0 45 0 45 Z8S18020VSC K207XX0AR - - 0 45 0 45 Z8937320ASC K813TX8 - - 0 45 0 45 Z8623312PSCR51XW K151UY0RA 0 45 0 45 - - Z86L8808PSCR51JW KZHCP26.0MJ - - 0 45 - - Z86L8808PSCR521A KZHCNYS.0KA - - 0 45 - - Z86L8808PSCR2607 KZH1772BE - - 0 45 - - Z86L8808PSCR51JW KZHCNL2.0B - - 0 45 - - Z86L8808PSCR51JW KZHCNSY.0G - - 0 45 - - Z86L8808PSCR51JW KZHCNSY.00E - - 0 45 - - Z8PE003HZ010SC B219FP0 - - 0 45 0 45 Z9023406PSCR522F KHCRIT.0CRC 0 45 0 45 0 45 Z86L8808PSCR51JW OEY204JW0B 0 45 0 45 0 45 Z9023406PSCR522F KHCYGG.00PI 0 45 0 45 0 45 Z86L8808PSCR4455 NZHCPJN.0QS 0 45 0 45 0 45 Z8612912SSC A224DL0AP 0 45 0 45 Z86E2112PSC A048LW0X 1 45 0 44 0 44 Z86L8808PSCR4455 BZHCW79.02E - - 0 45 0 45 Z9023406PSCR51J1 AYH1120AR - - 0 45 0 45 Z86L8808PSCR51J1 KZHCNL0.00C 0 45 0 45 0 45 Z86E136PZ016SC KH1577AD 0 45 0 45 0 45 Z86E136PZ016SC KH1577AG 0 45 0 45 0 45 Z86C6516PSCR3322 NY211NS0B - - 0 45 0 45 Z84C0006PEC KZ219KN0P - - 0 45 0 45 EZ80F92AZ020SC2047 KR61001.A2 - - 0 45 0 45 Fail Notes 2H - 2002 ZAC03-0004 B3F Leakage 4 - 22 ZiLOG 2002 Quality and Reliability Report Table 5-10. ZiLOG Reliability Monitor For Temperature Cycling Test Conditions: Condition C, -65C To 150C CMOS 2002 100X Rej S/S 500X Rej S/S 1000X Rej S/S Device Type Lot No. Z86D991SZ008SC2046 SY206HH0BAP - - 0 45 0 45 Z8018233ASC1932 AH0657SB - - 0 45 0 45 Z8F6403FT020SC R61105.A1 - - 0 45 0 45 Z8018233ASC1932 AH0657SB - - 0 45 0 45 Z86C3312PSCR2130 B220CD0AAA - - 0 45 0 45 Z8641708BSCR3212 BYH1665B - - - - 0 45 Z8019520FSC Y132AB0Q - - 0 45 0 45 Z86C3312PECR517F NY214GN0P - - 0 45 0 45 Z86L98HZ008SCR526R SHCNQ5.01RA - - 0 45 0 45 Fail Notes Table 5-11. ZiLOG Reliability Monitor For Temperature Cycling Test Conditions: Condition C, -65C To 150C NMOS 2002 Device Type Lot No. 100X Rej S/S 500X Rej S/S 1000X Rej S/S Fail Notes 1H - 2002 Z0844004DSA0541 B607BD0ACAA - - 0 45 0 45 Z0843006PSC K037JX0T - - 0 45 0 45 Z0853606VSC B205AP0A - - 0 45 0 45 2H - 2002 ZAC03-0004 4 - 23 ZiLOG 2002 Quality and Reliability Report Table 5-14. ZiLOG Reliability Monitor Highly Accelerated Stress Test (HAST) Test Conditions: 140C @ 85% Humidity At 2 ATM Of Pressure CMOS Plastic 2002 48 Hrs Device Type Lot No. Rej S/S Rej 96 Hrs S/S Fail Notes 1H - 2002 Z9023406PSCR51X3 EYHB032 0 45 Z86L990PZ008SCR51ML BYHBHAE 0 45 Z86L990PZ00R51J5 BH0517A 0 45 EZ80L92AZ020SC MB546 0 45 Z86L990PZ008SCR51ML BYHBHAE 0 45 Z86L990PZ008SCR51J5 BH0517A 0 45 Z8702414SCR51XK BHBT78.04B 0 45 Z8702414SSCR52CH AZHF11.132A 0 45 EZ80F92AZ020SC2047 KR61001.A2 0 45 Z8S18020VEC B222FR0AP 0 40 Z0221524VSCR51JA KA227EU8AB 0 30 2H - 2002 ZAC03-0004 4 - 24 ZiLOG 2002 Quality and Reliability Report Table 5-13. ZiLOG Reliability Monitor ZiLOG Package Integrity Test Results CMOS 2002 Device Type Lot No. Rej S/S 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 Fail Notes 1H - 2002 Z86E0208PSC1925 Z86E3108SSCR50W0 Z8018233FSC Z9035612PSCR3720 Z8018008VSC Z86L8808SSCR51PX Z8624312FECR51R4 Z8673312VEC Z86L8708PSCR51R3 Z8018008FSC Z86L827SZ008SCRXXX Z84C0008PEC1983 Z8019520FSC Z86E3116PSC Z8673312VSCR3845 Z86C8316SSCR4564 Z86E0208HSC1925 Z86E0412PSC1866 Z8673312VSCR3845 Z80L183AZ030SCR4567 Z86E0812SSC1866 Z86C3316PSCR4124 Z86E0208SECR516F Z86L430-8FSCR50AF Z15M1720ASC1868 Z8624312PECR40945 Z86733VSCR3845 Z8623312SECR4472TR Z8617216FSCR5053 Z86E0208HSC1925 Z8623312PSCR4409 Z8S18033VSC Z86L8808SSCR51XF Z86L0808SSCR5009 Z86C0408PECR2981 Z8673312VSCR3845 Z8S18010FSC ZAC03-0004 AY139BN0BBP AY147RS0BPP AY144LY0P BYH1722A BX145AS0 BXH1505APB BY147KK0R EY147KP0RB EYHBJ70F Y132AB0Q G1473AFB A036FY0X1P AY147NP0RAP BY150HR0AAD BY149GU0AAB BY141JS0R BY135K0B EZ150NP0P EKY149GUOB KG1164 NZ150NP0A AYH1120AR AZ203BP0APP AX201CW0RPX A048TY0X10 BY202HS0RAD BY201EZ0AAQ B202HR0RA BY1506Y0RP BY135KZ0B EX201DL0R EY145BN8A EYHBHTH.0CP NZ203SU0R A204EK0RPPA AY209AG0P AY204FN0AP 4 - 25 ZiLOG Device Type Z86E136SZ016SC Z9023406PSCR5140 Z8932320VECR519W Z86L8808SSCR4590TR Z84C0008FEC Z8673312PSC Z84C9010VSC Z86E136SZ016SC Z86L8808PSCR51JW Z86C8316PSCR264 Z8S18033VSC Z2209SZ000XC Z8673312PSC Z8S18033VSC Z8702414SCR51XK Z9023306FSCR51J8 Z86E0812SSC1866 Z8673312VSCR3845 Z8PE002PZ010SCR523K Z86C0208PSCR4502 Z8937320ASC Z8S18020VSC Z86E126PZ016EC Z8612912SSC Z8F6403FZ020SC Z16C0110PSC Z8702414SCR51XK Z853008PSC Z86L9533ASC Z8623316VSCR4591 Z0221520ASCR50A5 2002 Quality and Reliability Report Rej S/S AYH1736AASP BYH1786D BY206BR0RBA BXHCA91.0QC BY206BJ0B OEY204JW0B EY205LU0Q NYH1736AAT NXHCE27.0CT AZ212CZ0PX 1206FJ8ARP ABS8859.1XA BY210GN0AAP B207XX0AS BHBT78.04B BYH1303Q EZ209LY0C E203BT0ABBA EZ209AR0AB K207PY0AR K813TY8 K207XX0AR AG0797EX A217JX0PNP AR60986 B9S0JY0 BHBT78.04B K041HJ0S KH006A KE2080Q BY150JP0A 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 AT221RU0AAC A222FP0AQ AY143GZ0AU AH1575AABAP BHCT27.00C BY206BS0A B224SY0AA BX208DK0B B20BL0S 0 0 0 0 0 0 0 0 0 15 15 15 15 15 15 15 15 15 Lot No. Fail Notes 2H - 2002 Z86K1505PSCR4530 Z8S18033VSC00TR Z8018110FEC Z86E132SZ016SC Z9023406PSCR503W Z8932320VECR50XPTR Z86D8608SSCR524 Z86L4308FSCR50AF Z8E0010HEC ZAC03-0004 4 - 26 ZiLOG Device Type Z86E13016PEC Z86E0812SSC1866 Z86L8808PSCR51JW Z8L18220ASC Z86E0412PSC2004 Z8S18010VSC Z8L18020FSC Z8612912SSC Z9023406PSCR51J1 Z86C4316VSCR4065 Z86D8608SSCR52L1 Z86L4308FSCR50AF Z8PE003HZ010SC Z86C6516PSCR3332 Z86C0208SSCR3358 Z84C0006PEC Z8937320ASC Z86L8808SCR50HWTR Z86E0812PSC1866 Z86C8316SECR52JATR Z8018233ASC1932 Z86L8808PSCR4455 Z86L4308FSCR50AF Z8641708BSCR3212 Z8PE003HZ010SC Z86E0208SSC1925 Z8937320ASC Z86D991SZ008SC2046 Z86E0812PSC1866 Z86E3412SSC Z8018233ASC1932 Z8702414SSCR52CH Z8673312PSC Z8932320VECR50XP Z8674312FSC Z8641708BSCR3212 Z86D990HZ0082046 Z86C3312PECR517F Z86C0812SSCR2433 EZ80F92AZ020SC2047 Z8019520FSC Z86E0412PSC1866 Z8623312SECR4472TR Z8F6403FT020SC Z84C3008PEC Z86E3412VSC Z86L4308FSCR50AF Z86C6516PSCR3752 ZAC03-0004 2002 Quality and Reliability Report Lot No. NZ221SU0 NZ224KR0PAA KZHCP26.0N KY219GU0P AZ224C00APB A222FN0AQ A227PX0APPA A224DL0AP BHCWF8.020A B226GT0P B224SY0AA BZ220HS0B B219FP0 NY211NS0B NZ224UZ0PB KZ219KN0P K816FN0 SZHCPSN.5QB AZ227CW0RA BY1506Y0RP AH0657SB BZHWY3.1PC BZ220HS0B BYH1665B BZ220BP0AA NZ224UZ0PB K816FN0 SY206HH0BAP AZ229EW0BPA AZ231PS0APA AH0657SB AZHF11.132A BZ230AJ0 B226DT0BA BZ230AN0 BYH1665B C0142BT0ABA NY214GN0P NZ233WZ0BB KR61001.A2 K232CN0A AZ237PT0PB AZ235CY0PA AR6110.5A B228AB0AQ BZ228FW0A BZ237FG0AB NE0903D Rej S/S 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 15 Fail Notes 4 - 27 ZiLOG Device Type Z86E0812SSCR5017TR Z16M1720ASC1868 Z86K1505PSCR5016 Z86C36SSCR5189TR Z86L4308FSCR50AF Z09036512PSCR51MR Z86E7216FSC Z86C3316PSCR2913 Z86C0812SECR5129TR 2002 Quality and Reliability Report Lot No. NZ235FN0P KA049B00X1 AH1656APB AZ24CJP0PA AZ243CU0PB BH1670AQB B242PR0A NZ243EH0BP NZ241EH0AA Rej S/S 0 0 0 0 0 0 0 0 0 15 15 15 15 15 15 15 15 15 Fail Notes Table 5-14. ZiLOG Reliability Monitor ZiLOG Package Integrity Test Results NMOS 2002 Device Type Lot No. Rej S/S Z0843006PSC K037JX0T 0 15 Z0853008VSC00TR A217JR0SP 0 15 Z0853008VSC B217JR0 0 15 Fail Notes 1H - 2002 2H - 2002 Z0853606VSC B224CY0AAP 0 15 Z0853606VSC B205AP0A 0 15 ZAC03-0004 4 - 28 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type 1H - 2002 Z9035612PSC Z8673312PSC Z8673312PSC Z9035612PSCR3720 Z8673312PSC Z85C3008VSC00TR Z9037116PSC Z8673312PSC Z86C8316SSCR4564 Z86L990PZ008SCR51J5 Z86L990PZ008SCR51ML Z9035612PSCR3720 Z8018008VSC Z8611608SSCR3407 Z8611608SSCR3407 Z86C0812SECR50AHTR Z86C8316SSCR4564 Z86E0812SSC1866 Z86E0208SSCR2433 Z86C0812SSCR2433 Z8702114SSCR4216TR Z8611608SSCR3407 Z86E0208PSC1925 Z86E0208PSC1925 Z86L8708PSCR51N7 Z86L0808SSCR5009 Z86L8708PSCR51R3 Z86L827SZ008SCRXXX Z8018008FSC Z86C0208SSCR50JH Z86E0412SSC1866 Z86C0812SECR5129TR Z86C0812SECR5129TR Z86E0412SSC1866 Z86CE0812SEC Z86E0208SECR516PTR Z86L8808SSCR51PX Z8937320ASC Z9037116PSC Z9037116PSC Z8702114SSCR4216TR Z8702114SSCR4216TR Z86E0812SSC1866 Z86C0812SSCR2433 Z86L0808SSCR5009 Z86C3316PSCR4124 Z84C0008PEC1983 ZAC03-0004 Lot No. BE2468 BY146GP0AB BY143ET0B BYH1722 BY145CP0 B036DJ0FB BY146GP0AA BY145CP0B BY145JS0R BH0517A BYHBHAE BY1722A BX145AS0 AY142RY0R1GB AYK12RY0RIHA AZ150JZ0RAA AY141JS0R1X AX144LT0QA AZ147PZ0RP AZ146ET0RPA AZ15V0RAP AY129FH0R AY143HH0BP AY139BN0BBY EYHBHMA E151W0RQ EYHBJ270F G1473AFB Y132AB0Q N140CT0RAA NZ150NP0AP NZ150LY0RA NZ146EX0RB NZ145BH0AP N145BH0AQ N149FR0AA BXH1505APB B810WW8Q2 BYH101PS MB546 AZ201DG0RAC AZ151PU0RBP NZ150NP0A AZ151RS0RPB A151AR0RAPC AYH1120AR A036FY0X1P Sample Selection 500X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 1000X TC 1000XTC 500X 500X 500X 500X FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 1000X TC 500X 500X 1000X TC FRESH SAMPLES 1000X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC FRESH SAMPLES FRESH SAMPLES 500X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC 500X TC Results 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 4 - 29 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Z8018008FSC Z86E0812SSC1866 Z9037116PSC Z9037116PSC Z9037116PSC Z8937320ASC Z16C3010ASC Z8937320ASC Z9037116PSC Z9037116PSC Z86L990PZ008SCR51ML Z9023406PSCR5140 Z8937320ASC Z86C3316PSCR4124 Z86C0408PEC Z86E136SZ016SC Z84C9010VSC Z86L8808SSCR51XF Z867331PSC Z86L8808PSCR5101 Z86L8108PSCR5101 Z86E136SZ016SC Z86E136SZ016SC Z8937320ASC Z8937320ASC Z8937320ASC Z8E00110HSCR508F Z85C3008VSC Z85C3008VSC Z84C0008FEC Z85C3008VSC Z85C3008VSC Z9037116PSC Z9023406PSCR5140 Z86C0408PECR2981 Z86E136SZ016SC Z84C0008PEC1983 Z86C3316PSCR4124 Z84C9010VSC Z86L8808SSCR51XF Z86E136SZ016SC Z86E136SZ016SC Z8937320ASC Z8937320ASC Z9037116PSC Z9037116PSC Z16C0110PSC Z85C3008VSC ZAC03-0004 Lot No. Y132AB0Q NZ150NP0A BYH1101PWE BYH1101B BYH149BPB B810WW8Q2 B124AT0P B810WW8Q2 BYH1498QA BYH1498QB BYHBHP1A BYH1786D B810WW8Q2 AYH1120AR A204EK0RRPPA AYH1736AASP EY205LU0Q EYHBHTH.0CP EY204JW0 EH0092A EH0092B NYH1736AATA NYH1736AAT K810WW8QA K810WW8Q1 K810WW8Q1 B1091S0S B038GN0QA B038GN0QB BY206BJ0B B038GN0QA B038GN0QB BYH1498SA BYH1786D A204EK0RRPPA AYH1736AASP A036FY0Y1P AYH1120AR EY205LU0Q EYHBHTH.0CP NYH1736AAT NYH1736AATA KY916JZ0A KY916JZ0C BYH1498TG BYH1498UA B9S0JY0 B0386N00Q Sample Selection 500X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 1000X TC 500X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC 500X TC FRESH SAMPLES FRESH SAMPLES 1000X TC 500X TC 500X TC 1000X TC 1000X TC 1000X TC 500X TC 500X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES Results 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 4 - 30 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Z9023406PSCR5140 Z84C0008FEC Z9037116PSC Z9037116PSC Z9035612PSCR3720 Z85C3008VSC Z85C3008VSC Z16C3010VSC00TR Z16C3010VSC00TR Z86L8808PSCR521A Z9023406PSCR51X3 Z9023406PSCR51X3 Z8673312PSC Z8937320ASC Z16C0110PSC Z84C9010VSC Z8937320ASC Z8S18020VSC Z85C3008PSC Z9037116PSC Z9037116PSC Z9037116PSC Z16C0110PSC Z8702414SSCR51XK Z8702414SSCR51XK Z16C3010VSC00TR Z16C3010VSC00TR Z86L8808PSCR2607 Z86L8808PSCR5121 Z86E126PZ016EC Z16C0110PSC Z85C3008PSC Z84C9010VSC Z86C0208PSCR4502 EZ80L92AZ020SC Z86C3316VSCR4591 Z84C3006PEC Z86L8808PSCR521A Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z86C9533ASC Z86L8808PSCR521A Z86E136PZ016SC Z84C3010PEC Z86L1608PSCR2565 Z86E0612PSC ZAC03-0004 Lot No. BYH1786 BY206BJ0B BYH1498S0 BYH1498SN BYH1722A B0386N0QA B0386N0QB B217S0A B219TU0 BZHCNSW.00U EYHB032 EYHB032 0EY204JW03 KY916JZ0C K930FX0 K207HR0AP K813TY8 K207XX0A K041HJ0S BYH1498AH BYH1498PD BYH1498AC B9S0JY0 BHBT78.04B CHBT77 B219TU0 B217S0A BYHB625.EHA BZHCNTA.04T AG0797EX K930FX0 K041HJ0S K207HR0AP K207HR0AP KYMB54GC KE2080Q K210GW0CA KZHCNYS.00G KZHCNTM.0ZE KZHCP26.0ML KZHCP26.0ME KZHCP26.00P KYH1769AB KZHCNYS.0KB KH1747AABPAC K213AY0AP K136BB0A K117DJ0S Sample Selection 1000X TC 1000X TC FRESH SAMPLES FRESH SAMPLES 1000X TC 1000X TC 1000X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC 1000X TC 1000X TC 3X REFLOW FRESH SAMPLES FRESH SAMPLES 500X TC 400X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC 1000X TC 1000X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 500X TC 500X TC 500X TC 1000X TC 300X TC FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES Results 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 4 - 31 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Lot No. Sample Selection Results Z86L8808PSCR521A Z86L8808PSCR521A Z8937320ASC Z86C3312PECR2035 Z86E136PZ016SC Z86L8808PSCR2607 Z86L8808PSCR2607 Z86E3016PSC Z86C6516PSCR50CH Z86L8808PSCR51JW Z86L0808SSCR5009 Z86L0808SSCR5009 Z86L0808SSCR5009 Z86L8808PSCR51JW Z85C3008VSC Z86L8808PSCR521A KZHCNYS.00T KZHCNYS.00B K816FP0 K210BX0 KH1736AATA KZH1772BC KZH1772BA KZ210GS0AAB NG0060A NZHCNST.0PB NZ215ABAAA NZ215ABBAAB NZ215AB0AB NZHCNST S042AE0R KZHCNSY.00X FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES FRESH SAMPLES 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 0/5 2/15 DIE/MOLD INT 2H - 2002 Z16C0110PSC Z8018008VSC00TR Z8E0010HSCR508F Z86K1505PSC4530 Z86K1505PSC4530 Z9010204PSCR3855 Z86C6516PSCR3918 Z86E126PZ016EC Z86E3016VSC Z8523016VSC00TR Z86E126PZ016EC Z86L8808PSCR51JW Z86C3312PECR529J Z86C3312PECR529J Z86C0208PSCR4448 Z98622812PSC Z98622812PSC Z84C3006PEC Z84C3006PEC Z86C0412PSCR51M6 Z86L0208PSCR4241 Z86C0408PECR2981 Z86C0408PECR2981 Z8623312PEC2035 Z86E136PZ016SC EZ80L92AZ020SC Z8623312PECR52F5 Z8623312PECR52F5 B9S0TY0 BZ221XX0B B019LS0S A220EZ0PAA A220EZ0PC A219GG0PB A2170G0PA AG0797EX AZ219JP0AP AZ215EK0AQ AG079EX KXHCP2K.02A K219JU0A K219JU0B KZ218PR0PAA K220GT0AAB K220GT0AAA K219SZ0PB K219SZ0PA KZ219HP0A K219KY0D KZ219HL0D KZ219HL0C K220CF0A KH1721AAR KYMB54GC KZ220AY0AA3 KZ220AY0AAA 1000X TC 300X TC 1000X TC FRESH FRESH FRESH FRESH 500X TC FRESH FRESH 1000X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 100X TC FRESH FRESH 0/5 0/5 0/5 0/15 0/15 0/15 0/15 0/5 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/5 0/15 0/15 ZAC03-0004 4 - 32 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Z86K1505PSCR4243 Z8623312PECR52F5 Z86C3312PECR2035 Z86C3312PECR2035 Z86C3312PSCR2130 Z86C3312PSCR2035 Z86C3316VSCR4591 Z86C3012PECR3495 Z16C0110PSC Z84C9010VSC EZ80L92AZ020SC Z8623312VSCR4591 Z86E3116PSC Z86C6516PSCR507F Z86C6516PSCR3918 Z86C6516PSCR3918 Z86L8808PSCR51JW Z86C6516PSCR3918 Z86C6516PSCR3918 Z86L8808PSCR51JW Z86L8808PSCR4455 Z86L8808PSCR4455 Z86L8808PSCR4455 Z86L8808PSCR4455 Z86L8808PSCR4455 Z86L8808PSCR4455 Z16C3010VSC Z16C3010VEC00TR Z8018008VSC00TR Z16C3010VSC00TR Z9023106PSC Z9023106PSC Z9023106PSC Z9023106PSC Z9023106PSC Z9023406PSCR51J1 Z9023406PSCR522F Z86L8808PSCR4455 Z86L8808PSCR4455 Z86L8808PSCR4455 Z86L8808PSCR4455 Z16C3010VEC00TR Z84C1510AEC Z8F6403FZ020SC Z16C3010VSC ZAC03-0004 Lot No. Sample Selection KZ28FF0A KZ220AY0AB K220CF0AB K220CF0AC K220C00AP K220CF0AA KE2080Q KZ214BZ0BB K930FX0 K207HP0AP KYMB54GC KE2080Q KZ210GT0AAQ N219EU0AA N212CT0 NY211LP0A NZHCPK0.00P N214DH0 N211LR0A NZHCPK0.00A NZHCPJS.00E NZHCPJS.00Q NZHCPJS.00L NZHCPJS.00N NZHCPJS.00G NZHCPJS.00R B223BB0P B136CU0P BZ221XX0B B223BB0 B213AW0Q B213AT0B B213AX0C B213106PSC B213AT0A BHF0F3.05D BHF0F3.00PB BZHCW79.2BC BZHCW79.28B BZHCW79.02C BZHCW79.2BA A224CX0Q AZ220FT0P AR60986 A224CZ0PX FRESH FRESH FRESH FRESH FRESH FRESH 500X TC FRESH 1000X TC 1000X TC 500X TC 1000X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH S 1000X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 100X TC FRESH Results 0/15 0/15 0/15 0/15 0/15 0/15 0/5 0/15 0/5 0/5 0/5 0/5 0/15 0/15 0/15 0/15 0/5 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/5 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/5 0/5 0/15 4 - 33 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Z16C3010VSC Z8523016VSC00TR EZ80L92AZ020SC Z8623312PECR503X Z8623312PECR503X Z88C0020PSC Z86E136PZ016SC Z86C3312PECR2035 Z86E136PZ016SC Z84C3006PEC Z86E136PZ016SC Z84C3006FEC Z84C3006FEC Z86C3108PECR3519 Z86E136PZ016SC Z86E3016PSC Z84C0006PEC1527 Z86L8808PSCR51JW Z86C6516PSCR50CH Z86L98HZ008SCR526R Z86L98HZ008SCR526R Z86L8808SSCR50HWTR Z86L8808PSCR51JW Z86L8808PSCR521A Z9023306PSCR5159 Z9023406PSCR51J1 Z9023406PSCR522F Z86L8808PSCR4455 Z86L8808PSCR4455 Z8621912SSC Z86L8808SSCR4590 Z8702414SSCR52CH Z16C3010VSC Z16C3010VSC Z8523016VSC00TR Z8018233ASC1932 Z8621912SSC EZ80F92AZ020SC Z86C6516PSCR50CH Z86L98HZ008SCR526R Z86D991SZ008SC2046 Z9023406PSCR51KC Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW ZAC03-0004 Lot No. Sample Selection A224CY0X A219TT0PAP KYMB54GC KZ222ET0 KZ222EP0 K220EH0A KH1577AE K224NZ0A KH1577AB K223EK0 KH1577AF K208EF0BA K22ACT0AP KZ224WY0AP KH1577AC KZ221CZ0B KZ222TT0U KZHCNL0.0AA NG0060A SHCNQ5.01RA SHCNQ5.01RA SZHCQ47.00B BZHCWY7.02E BZHCW7C.1PD BHF0F3.063 BHF0F3.05D BHF0F3.00PB BZHCW79.2BC BZHCW79.28B A224DL0AP AR60986.1 AZHF11.132A A224CZ0PX A224CY0X A219TT0PAP AH0657SB A224DL0AP KR61001.A2 NG0060A SHCNQ5.01RA SY206HH0BAP BHF2P0.00AA BZHF03W.05B BZHF03W.05A BHCY0Q.00AA FRESH FRESH 1000X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 500X TC FRESH PKG INT FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 500X TC FRESH 100X TC FRESH FRESH FRESH FRESH 1000X TC 500X TC 500X TC 500X TC 500X TC FRESH FRESH FRESH FRESH Results 0/15 0/15 0/5 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/5 0/5 0/15 0/15 0/15 0/15 0/15 0/5 0/15 0/15 0/15 0/15 0/15 0/15 0/15 4 - 34 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Z86L8808PSCR51JW Z86L8808PSCR51JW Z8641708BSCR3212 Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z9025106PSC Z16C3010VSC00TR Z16C3010VSC00TR Z16C3010VSC00TR Z16C3010VSC00TR Z16C3010VSC00TR Z9023406PSC Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z9023406PSCR51KC Z86L8808PSCR51JW Z8PE003HZ010SC Z86L8808SSCR4590 Z8F6403FZ020SC Z86L8808SSCR52M8 Z86L8808SSCR4590 Z86L8808SSCRR5086TR Z8018233ASC1932 Z86L8808SSCR52C7 Z8621912SSC Z86L8808SSCR50HWTR Z8702414SSCR52CH Z96L8808SSCR52FN Z8621912SSC Z90255066PSCR51K9 Z90255066PSCR51K9 Z90255066PSCR51K9 Z90255066PSCR51K9 Z90255066PSCR51K9 Z90255066PSCR51K9 Z9023406PSCR51J1 Z90255066PSCR51K9 Z9023406PSCR522F Z9023406PSCR522F ZAC03-0004 Lot No. Sample Selection BZHF03W.05E BZHF035.0PA BYH1665B BZHF035.0PF BZHF035.0QE BZHF035.0PB B230EK0A BZ233FT0 BZ233FS0A BZ233FS0AP BZ233HK0 BZ234AJ0AP BHF343.00F BZHF035.00D BZHF035.00C BZHF035.00F BZHF035.0PL BZHF035.0QJ BZHF035.0PJ BZHF035.00E BHF343.00B BZHF03R.00B B219FP0 AZHCY3W.00B AR60986.1 AZHCY3Y.7PB AZHCY3W.00D AZHF03W.2PB AH0657SB AZHCY2Y.9PA A224DL0AP AZHCY0N.0PI AZHF11.132A AZHF096.008 A224DL0AP BHF42J00PA BH42J00PG BHW55.00B BH42J.00PB BH42J.00PI BH42J.00PD BHCWF8.02DA BHF42J.00PC BHFM15.00E BHFM15.00E FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 1000X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH 500X TC FRESH 500X TC FRESH 1000X TC FRESH FRESH FRESH FRESH FRESH FRESH 1000X TC FRESH FRESH FRESH Results 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 4 - 35 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Z86L8808PSCR51JW Z86L8808PSCR51JW Z9025506PSCR5288 Z9025506PSCR5288 Z8641708BSCR3212 Z86C3312PSCR2130 Z86L8808PSCR51JW Z86L8808PSCR51JW Z86L8808PSCR51JW Z9025506PSCR52LX Z9023406PSCR51KC Z9023406PSCR51KC Z9023406PSCR51KC Z9023406PSCR51KC Z86L8808PSCR51JW Z8621912SSC Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR52MC Z8018233ASC1932 Z8S18010VSC Z8018233ASC1932 Z8S18010VSC Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR50HWTR Z86L8808SSCR519P Z86L8808SSCR50HWTR Z86C3312PECR517F Z86L8808SSCR50HWTR Z86L8808SSCR4470TR Z86L8808SSCR4470TR Z86L8808SSCR4590 Z86L8808SSCR4590 Z86L8808SSCR52FN Z86D991SZ008SC2046 Z86L8808SSCR4590 ZAC03-0004 Lot No. Sample Selection BZHF29N.01E BZHF29N.01D BH0Q3Q.02AB BHCQ3Q.02A BYH1665B B220CD0AAA BZHF26W.0P1 BZHF26W.0QG BZHF26W.0PH BHF3G2.00DB BHF3QP.02PA BHF3QP.02PC BHF343.00AC BHF3G2.00DC BZHF26.0PA A224DL0AP AZHCY0N.0PH AZHCY0N.00C AZHCY0N.PEB AZHCY0N.00B AZHCY0N.00D AZHF29S.01A AH0G57SB A222FN0AQ AH0G57SB A222FN0AQ NZHF03T.0BC NZHF2CF.0AC NZHF2CF.0AK NZHF2CF.08K NZHF2CF.0AL NZHF2CF.0BI NZHF2CF.0AM NZHF2CF.0BH NZHF295.4PA NZHF03T.0BE NY214GN0P NZHF29S.06P NZHF29S.06P NZHF29Q.02 NZHF29Q.1PE NZHF29Q.1PG NZHF29S.05 SY206HH0BAP SZHF29N.02P FRESH FRESH FRESH FRESH 500X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 100X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 500X TC 500X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH FRESH 500X TC FRESH FRESH FRESH FRESH FRESH FRESH 1000X TC FRESH Results 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 4 - 36 ZiLOG 2002 Quality and Reliability Report Table 5-15. C-Mode Scanning Acoustic Microscope Monitor 2002 CMOS Device Type Z86L8808PSCR51JW Z84C0006PEC EZ80F92AZ020SC2047 Z8019520FSC Z86L8808PSCR51JW Z9023306PSCR51J9 Z8S18020VEC Z8S18020VEC Z86L8808PSCR51JW Z86L8808PSCR521A Z86L8108SSCR52HTR Z8641708BSCR3212 Z86L8108PSCR5101 Z8018233ASC1932 Z86L8808SSCR52FN Z86L8108SSCR528HTR Z86L8108PSCR5101 Z86L8808SSCR50HWTR Z84C0006PEC Z8019520FSC Z86L8808PSCR521A Z86L8808PSCR521A Z0221524VSCR51JA Z8019520FSC Lot No. Sample Selection KZHCNL0.00C KZ219KN0P KR61001.A2 K232CN0A KZHF29N.01P BH343.06PC B222RR0AP B222FR0BA BZHFR26W.00D BZHF2CH.1PB BZHCN3A.05B BYH1665B BZHCN0D.1PB AH06575B AZHF29R.0PF AZHCN3A.05A AZHCN00.01P NZHF2CG.01D KZ219KN0P K232CN0A KZHF2CH.01C KZHF2CH.01B KA227EU8AB K232CN0A 1000X TC 500X TC 1000X TC 500X TC FRESH FRESH FRESH FRESH FRESH FRESH FRESH 1000X TC FRESH 1000X TC FRESH FRESH FRESH FRESH 1000X TC 500X TC FRESH FRESH 500X TC 1000X TC Results 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 0/15 Table 5-16. C-Mode Scanning Acoustic Microscope Monitor 2002 NMOS Device Type Lot No. Sample Selection Results 1H - 2002 Z0843006PSC Z0220112VSCR4078TR Z0843004PSC K037JX0T K139AX0R K037JX0T FRESH SAMPLES 1000X TC 500X TC 0/5 0/5 0/5 2H - 2002 Z0853606VSC Z0853606VSC Z084C3006PSC B205AP0A B205AP0A K037JX0T 1000X TC 500X TC 1000X TC 0/15 0/15 0/5 ZAC03-0004 4 - 37 ZiLOG 2002 Quality and Reliability Report CHAPTER 5 Assembly and Test Package types: 8 / 18 / 20 / 22 / 28 / 40 / 48 42 / 52 / 64 28 / 44 / 68 / 84 44 / 80 / 100 / 132/ 144 / 208 44 / 64 / 100 / 144 / 160 64 18 / 20 / 28 20 / 28 / 48 Plastic Dual In-line Package (PDIP) Shrink Dual In-line Package (SDIP) Plastic-Leaded Chip Carrier (PLCC) Quad Flat Pack (QFP) Very Small Quad Flat Pack (VQFP) Thin Quad Flat Pack (TQFP) Small Outline Integrated Circuit (SOIC) Shrink Small Outline Package (SSOP) Technology Data: Die attach (method/composition) Wirebond (type/material) Bonding wires (material/diameter) Package seal Lead and lead finish Leadframe material/plating Leadframe plating thickness Moisture Sensitivity Level for Surface Mount Devices ZAC03-0004 Oven cure/silver filled epoxy Ball bond, thermosonic/gold to aluminum Crescent bond, thermosonic/gold to silver plated frame Gold 1.0 / 1.3 mil Transfer epoxy molding Solder plate Copper (A151) / Ag spot plate for PLCC Copper (A194)/Ag spot plate for PDIP, SDIP, SOIC and SSOP Copper (A7025)/Ag spot plate for QFP and VQFP Ag spot is 150-400 microinches PLCC, QFP, LQFP & TQFP: MSL = 3, Floor Life = 168 hrs. @ 30C/60% RH 5- 1 ZiLOG 2002 Quality and Reliability Report Pre/Post Packaging Device Test Procedures: Wafer probe at 70C; final test at 70C; Wafer probe tests guardband final test Number/Type of Testers Sentry 15/20/21, Megatest, ITS9000, SZ Provision for Testing at Speed Yes Provision of high temp testing Environmental handlers Provisions for tape and reel shipment of SMT devices Yes Provisions for tray shipment of QFP devices Yes ZAC03-0004 5- 2 ZiLOG 2002 Quality and Reliability Report ATTACHMENT 1 Legend: - Material - Bank - Transport - QC acceptance - Process - Inspection/Test ___________________________________________________________________________________________ PLASTICS PROCESS FLOW Flow Process/Item Document Wafer Die Bank SOM-040 Pack/transport to Subcon SOM-005 Subcon Assembly REJECT ZAC03-0004 Pack/transport ZEPI SOM-005 Incoming Inspection of Subcontract ZilOG Products QCM-235 Electrical Test TSM-021 <For Stress Test D Flow only> Burn-In (48hrs or as specified on PSI)/ 100% Electrical Test at Room TSM-012/ TSM-021 Electrical Test Gate QCM-108 QC Outgoing & Shipping Gate (see note 1) QCM-126 Final Visual Inspection (For visual reject) MAM-235 Finished Goods SOM-171 Bake Out (for VQFP/QFP/TQFP) MAM-212 Tape & Reel (as required per PSI) MAM-236 Pack MAM-067 Shipping Audit QCM-301 Ship QCM-301 5- 3 ZiLOG 2002 Quality and Reliability Report ATTACHMENT 2 PLASTIC-STANDARD ASSEMBLY/TEST PROCESS PLASTIC - STANDARD (C FLOW) PLASTIC - STRESSED (D FLOW) * DIE BANK * DIE BANK * WAFER SAW * WAFER SAW * EPOXY DIE ATTACH * EPOXY DIE ATTACH * WIREBOND * WIREBOND * MOLD * MOLD * STRIPMARK * STRIPMARK * SOLDER PLATE * SOLDER PLATE * BAKEOUT (FOR PLCC) * BAKEOUT (FOR PLCC) * TRIM/FORM * TRIM/FORM * 100% ELECTRICAL TEST - HOT AND QC SAMPLE ELECTRICAL AT 25C * 100% ELECTRICAL TEST - HOT * QC PRESHIP INSPECTION * BURN-IN 48 HOURS AT 125C * BAKEOUT FOR QFP/VQFP INT RAY TAPE AND REEL (OPTIONAL FOR SOIC, QFP AND PLCC) * 100% ELECTRICAL TEST AT ROOM * QC PRESHIP INSPECTION * BAKEOUT FOR QFP/VQFP IN TRAY TAPE AND REEL (OPTIONAL FOR PLCC, QFP, SOIC) * * PACK * * ZAC03-0004 PACK 5- 4 ZiLOG 2002 Quality and Reliability Report ATTACHMENT 3 GENERAL MATERIAL SPECIFICATION MATERIAL PDIP DIE ATTACH WIRE SIZE EPOXY Silver Filled Epoxy 1.0 - 1.3 mil Au EN4065D 84-1 LMIS 84-1 LMISR4 CRM 1033B 8390A SDIP - MOLD MARKING COMPOUND EME6300H / HJ / Laser / Padmark RQ EME6600CS EME6600 CEL4630 SXT / SX CEL 4600P8/P8T PLATING 85/15 Tin Lead Silver Filled Epoxy 1.0 - 1.3 mil Au EME6300H /HJ /RQ Laser / Padmark 85/15 Tin Lead EN4065D 84-1 LMIS 84-1 LMISR4 CRM1033B CEL4660 SXT CEL4630 SXT / SX EME6600CS CEL4600P8/P8T SDIP - MCM Silver Filled Epoxy 1.2 mil Au 8390A DONG JIN 200NF Laser / Padmark 85/15 Tin Lead PLCC Silver Filled Epoxy 1.0 - 1.3 mil Au EN4065D 84-1 LMISR4 CRM 1033B EME6300H Laser / Padmark EME6600 EME6600CS CEL 4630SX / SXT 85/15 Tin Lead SOIC Silver Filled Epoxy 1.0 - 1.3 mil Au 84-1 LMISR4 CRM1033D CRM1033B MP AN 8000 AN EME6300H EME6600CS EME6600 CEL4630SX / SXT Laser / Padmark 85/15 Tin Lead SSOP Silver Filled Epoxy 1.0 - 1.2 mil Au 84-1 LMISR4 MP AN 8000 AN Laser/ Padmark 85/15 Tin Lead EPTSSOP Silver Filled Epoxy 1.2 mil Au 8290 7050B Laser / Padmark 85/15 Tin Lead QFP Silver Filled Epoxy 1.0 - 1.3 mil Au 84-1 LMISR4 EN4065D CRM 1033B EME6300H / HJ EME6600CS EME6600H EME7320CR CEL4630SXT Laser / Padmark 85/15 Tin Lead TQFP/VQFP Silver Filled Epoxy 1.0 - 1.3 mil Au 84-1 LMISR4 8360 CRM 1033B EME7320CR Laser / Padmark 85/15 Tin Lead REGULAR ZAC03-0004 5- 5 ZiLOG 2002 Quality and Reliability Report CHAPTER 6 The Handling and Storage of Surface Mount Devices 1. Handling Components should be handled with vacuum pick to ensure that coplanarity of leads is maintained. ZAC03-0004 6-1 ZiLOG 2002 Quality and Reliability Report 2. Lead Protection Avoid sliding of units with leads in contact. The solder coating is prone to contamination/scraping. If sliding cannot be avoided, the contact surface should be clean and smooth. 3. ESD Protection Observe ESD protection at all times. These are static sensitive devices. ZAC03-0004 6-2 ZiLOG 2002 Quality and Reliability Report 4. Storage/Unpacking Caution The plastic body of a surface mount product may be subjected to high temperatures during the printed circuit board assembly operation. Any moisture that may be present in the plastic may expand and damage the unit. Therefore, it is very important that the surface mount IC be dry before the printed circuit board operation begins. ZiLOG assures that the unit is thoroughly dry before final packing for shipment. The units are shipped in a "dry pack" envelope designed to keep moisture away from the IC's. The user should carefully observe the following practices to assure that the units remain moisture free at the time of the printed circuit board soldering operation: * Do not open the dry pack until you are ready to solder. Product may be exposed to ambient conditions of 30C/60%RH (or less) for no more than 168 hours. This corresponds to a moisture sensitivity level of 3. * Unopened dry packs may be stored at <40oC/90% RH. * When the dry pack must be opened for a short period of time (such as for incoming inspection) it should be resealed as soon as possible, ensuring that the desiccant remains inside the dry pack. Resealing should be done with heat seal for best closure of the bag. * If the units have been exposed to more than 168 hours at ambient conditions of 30C/60%RH(or less) or if the humidity indicator card in the bag shows humidity above 20%, devices should be baked for 8 hours at 125oC, before board soldering. 5. Soldering Recommended surface mount profile is as follows: Maximum 3oC/sec. ramp up. Maximum 220oC peak temp. Minimum 1 min. cool down from peak temp. to 50oC. 6. Desoldering Parts removed due to board assembly problems or suspected failure. If boxed-in type desoldering fixture is used, the following are recommended operating parameters: Package Temp: 220oC max. Dwell Time: 1 min. max. It is important that the above precautions are followed to ensure integrity of the packages. ZAC03-0004 6-3 ZiLOG 2002Quality and Reliability Report CHAPTER 7 Quality Systems QUALITY SYSTEMS * Organization: Quality control departments are located at all plants * Equipment: Nampa and Manila can conduct failed material analysis including decapsulation, SEM, microprobe, Emission microscope, X-Ray, EDX, cross-section and Sonoscan acoustic microscope. See Table 3-1 for a complete list of QC test equipment. SUBCONTRACTING: 100% of assembly is subcontracted. LOT TRACEABILITY: There is complete lot traceability by product date code back through the assembly process and wafer manufacturing process to the starting material. AVAILABILITY OF DOCUMENTATION ON MONITORING: Documents are available in either hard copy or electronic form (SOP0937). QUALITY DATA: * Data availability: Outgoing quality is measured by the quality control acceptance/rejection data and on each production lot which is reported on a PPM basis. In addition, ZiLOG cooperates with certain customers who provide their incoming inspection data on a PPM basis for correlation, per Procedures SOP0903 and SOP0927. * Mechanism of transfer: Hard copy/electronic * Details/attributes provided: PPM * Method of calculation: See Procedure SOP0927 ZAC03-0004 7-1 ZiLOG 2002Quality and Reliability Report * Current levels (by family/technology/package) per attribute: 30 PPM on mature products (mature products defined as those which have transited the initial startup experience curve). PPM detail is provided to the customer in ZiLOG's semi-annual quality and reliability report. * Goals for next three to five years: ZiLOG desires to have all mature products at better than 20 PPM during this period. TESTING (QA/Operating) * Test program release procedure: ZiLOG has a formal test program review/release procedure, per Procedures SOP1239. * Does QA sample test? Yes. Lots are sampled by QA using a statistically valid sampling plan. If the QA sample fails, the entire lot is re-tested and a second QA sample is drawn. * Is datasheet tested or guaranteed? ZiLOG provides its product specifications to the customer in a document called a data sheet (SOP0302). The product specification describes the attributes that ZiLOG warrants. * Is the product tested at full temperature range? Yes * Is the product 100% electrically tested prior to QA? Yes * Does QA pull samples for both AC and DC Testing? Yes * How is propagation delay tested (e.g., simultaneous switching effect): Simultaneous * Fault coverage (Operating vs. QA): As close to 100% as practical * Coplanarity requirement on SMD: 4 mils maximum; reference the seating plane * Define failure: Does not meet specifications TEST TAPE SUPPORT: Test tapes, load boards and documentation are available WHAT HAPPENS WHEN FAILURES OCCUR? * Is sample truncated? No * Corrective action plan: Plant sample failure analysis overviewed by HQ R/QA * How is product segregated (i.e., is there protection from mixing)? Automatic binning during electrical test is used to segregate product. Product traceability to the customer order is maintained by a unique part numbering system (SOP0937 and SOP0902). ZAC03-0004 7-2 ZiLOG 2002Quality and Reliability Report WHEN MANUFACTURING IS PERFORMED OFFSHORE, WHAT ARE THE CONTROLS?: Same as onshore; the Manila plant is monitored through the Inventory Activity Yield (IAY) data collection system by the Director of Quality Assurance and Reliability on a contemporaneous basis, as is the Nampa plant. Reporting is continuous. Periodic audits are performed on all offshore facilities by ZiLOG personnel. AVAILABILITY OF PROGRAMMING FACILITIES: ZiLOG develops its own test programs with facilities located in Manila, Campbell and Nampa. DOCUMENTATION CONTROL: (Include procedure for changes and updates.) See Procedures SOP0922, SOP0901, and SOP0937. R/QA operates Document Control. QA AUDIT: * Availability of audit reports: Serialized run sheets and audit checklists are maintained by the Quality Control organization. MATERIALS CONTROL: See Procedures SOP0811,SPOL025. ZAC03-0004 7-3 ZiLOG 2002 Quality and Reliability Report VENDOR OF THE YEAR AWARD: ZiLOG has an aggressive commitment to the continuous improvement of the quality and reliability of our products. This concern affects not only material produced, but all materials and/or services procured by ZiLOG. Toward this end, ZiLOG has embarked on a program of ongoing vendor reviews at each site. These reviews culminate in a Vendor of the Year Award(s) from each site. VENDOR OF THE YEAR Year 2002 Year 2001 Year 2000 ZAC03-0004 Winner Nampa, Idaho Site Category 1 Silicon - LG Siltron Category 1 Raw Materials - Arch Chemicals Category 2 Raw Materials - Honeywell Freight Carriers - Air Van North American Contracted Services - Tri-State Electric Winner Nampa, Idaho Site Category 1 Silicon - LG Siltron Category 1 Raw Materials - Tosoh SMD Category 2 Raw Materials - Microsil Freight Carriers - Air Van North American Contracted Services - Tri-State Electric Winner Nampa, Idaho Site Category 1 Silicon - LG Siltron Category 2 Raw Materials - Microsil Logistics - Air Van North American 7-1 ZiLOG 2002 Quality and Reliability Report VENDOR OF THE YEAR (Continued) Year Winner Nampa, Idaho Site 1998/1999 1997 1996 1995 1994 1993 1992 1991 1990 1989 ZAC03-0004 L.G. Electronics Photronic Labs, Inc. Astra Microtronics (AMT) Mitsubishi Silicon America Thesys GmbH Kawasaki Steel Corporation Schlumberger Technologies ATE Division OCG/Olin Hunt Sumitomo Photronic Labs, Inc. 7-2 ZiLOG 2002 Quality and Reliability Report CHAPTER 8 Statistical Process Control STATISTICAL PROCESS CONTROL SCOPE: All major manufacturing processes are under SPC control Process stability and capability analyses are reported monthly. A corporate-wide specification defines the scope of the program and provides detailed instructions for implementing SPC at an operation. It also defines the frequency of evaluation of control limits, training requirements, and responsibilities (SOP0918) CONTROL CHARTS: ZiLOG (Nampa) uses the 8-Point Zone Control Chart. The Zone Control Chart is easily adapted to nonstandard distributions. All Technicians are certified on the use of the Zone Control Chart. Control limits and out-of-control action plans are written into the process specifications. Control limits are changed as process improvements are implemented. DESIGN OF EXPERIMENTS: New processes require rigorous qualification through one or more Statistical Design of Experiments (SDE). Research is ongoing to improve the traditional SDE methodology. ZAC03-0004 8 1 ZiLOG 2002 Quality and Reliability Report CHAPTER 9 Document Control DOCUMENT CONTROL SYSTEM ZiLOG's Document Control Department promotes reliability and quality through efficient, global document management and revision control systems. The Document Control Department maintains an electronic document management system that is accessible by ZiLOG employees worldwide 24 hours a day. Manufacturing documents are available electronically for all wafer foundry and assembly subcontractors. The system automatically manages revision control; ensuring users have the most up-to-date version every time. Corporate Document Control in Campbell, California, oversees the worldwide document management processes for revision controlled documents. They are also responsible for managing design, engineering and marketing documents and records as well as company-wide policies and procedures. Document Control departments in Nampa, Idaho, and Manila, Philippines, manage the manufacturing, assembly and test procedures and specifications. Additional details regarding any of the sections contained in this document may be found in ZiLOG policies, procedures or specifications. General categories are listed below. Please contact the ZiLOG Director of Quality and Reliability with specific questions. * Corporate-Wide Policies * Standard Operating Procedures for Business Units, Corporate Communications, Finance, Human Resources, Information Technology, Legal, Operations, Reliability and QA, Sales, Strategy, Technology, Design & Test * Core Process Documents for all Phases of the Product Life Cycle * Product and Process Specific Manufacturing, Assembly and Test Procedures and Specifications ZAC03-0004 9- 1 ZiLOG 2002 Quality and Reliability Report Document # POL025 Document Title Procurement Organization Roles And Responsibilities POL003 Zilog Testing Policy POL013 Tooling Revision Customer Qualification Policy POL031 Manufacturing Management Fundamentals QCC1425 CMOS D.C. Latch-Up Test Procedure QCC1478 Electrostatic Discharge Procedure (Mil-Std) SOP0302 Procedure For Administering A Technical Specification (CPS and/or DS) SOP0811 Procedure For The Return of Purchased Material SOP0817 Die and Wafer Procedure SOP0901 Procedure For Submitting A Change Notice Form SOP0902 Product Number Identity System SOP0903 Quality And Reliability Program SOP0906 EMC Testing Standards Procedure SOP0908 Ship-To-Stock Procedure SOP0913 Customer Notification Procedure SOP0916 Fits Program Procedure SOP0918 Statistical Process Control Procedure SOP0922 Procedure For Creating Or Revising Policies Or Cross-Functional Procedures SOP0923 Hast Testing Procedure SOP0925 Military Group C And D Qualifications SOP0927 PPM Measurement Program SOP0932 Customer Order Reschedule And Cancellation Procedure SOP0936 Product/Process Characterization Testing SOP0937 Master Specification System Procedure SOP1233 Procedure For Naming And Controlling Product Mask Step And Layer Revisions ZAC03-0004 9- 2 ZiLOG 2002 Quality and Reliability Report ATTACHMENT 6 Input Product Demand Wafer Fab ZiLOG, Nampa, ID Wafer Fab Foundry Wafer Probe ZiLOG, Manila, PI Wafer Probe Subcontractor Assembly Subcontractor Final Test ZEPI Final Test Subcontractor Ship to Customer ZAC03-0004 9- 3 ZiLOG 2002 Quality and Reliability Report ATTACHMENT 7 SPC Fabrication Typical Process Thickness/ Critical Thickness Particulate Uniformity Dimension Concentration Etch Rate Barrier Oxidation X - - - - - Silicon Nitride Deposition X - - - - - N-Well Mask - X X - - - SDG Mask - X X X - - P Field Implant X X X - - - Poly Mask - X X X - - S/D Implant Mask - X X - - - Source Drain Reoxidation X - X - X - Contact Mask - X X - - X Metal-I Mask - X X X - - Spin on Glass - - - - - X Final Inspect X - - - - - Via Mask - X X X - X Metal II Mask - X X X - - Pad Mask - - X - - - Pad Mask Pix - - X - - - ZAC03-0004 9- 4 ZiLOG 2002 Quality and Reliability Report CHAPTER 10 Thermal Properties THERMAL CHARACTERISTICS Calculation of Device Junction Temperature Failure rates and Failures in Time (FITS) obtained from life test data are based on ambient temperatures (TA), and are not corrected to junction temperature (TJ). However, when a significant difference between TA and TJ exists, TJ can be incorporated into the Arrhenius Equation for accelerated failure rates by using the following equations: Junction Temp. (TJ): TJ = (JA) (PD) + TA where: JA is the thermal resistance of junction with respect to ambient (C/W). PD is the maximum power dissipation at TA in watts and: TA is the ambient temperature C. Case Temperature (TC): where: Illustration: TC = TJ - (JC) (PD) JC is the thermal resistance of junction with respect to case. In order to calculate junction temperature (TJ) and case temperature (TC) for static airflow for the Z86C04 in an 18L PDIP, we do the following: 1. At 25C, maximum power dissipation for this device is 0.08 watts. 2. For our example, ambient temperature is denoted by TA and is assumed to be 25C. For the Z86C04 in plastic (copper); JA and JC are 75 and 18C/watt respectively. Therefore, TJ = 75 x (0.08) + 25 = 31.2C, and TC = 31.2 - (18 x 0.08) = 29.8C ZAC03-0004 10- 1 ZiLOG 2002 Quality and Reliability Report Table 11-1. Device JA, JC Table Summary Of Thermal Characteristics For ZiLOG Plastic Packages Package Type PDIP 18L 20L 28L 40L 42L 48L 52L 64L PLCC 44L 68L 84L QFP 44L 80L 100L VQFP 64L 100L SOIC 8L 18L 20L 28L SSOP 20L 28L 48L EPT SSOP 28 LCC 44L 52L 68L ZAC03-0004 Package Code P JA JC Lead Frame 75 75 60 43 42 40 38 42 18 18 12 12 11 8 8 14 Cu Cu Cu Cu Cu Cu Cu Cu 46 43 42 13 14 12 Cu Cu Cu 45 43 38 10 16 17 Cu Cu Cu 70 100 19 25 Cu Cu 110 70 75 60 N/A N/A N/A N/A Cu Cu Cu 75 60 45 18 12 12 Cu Cu Cu 36 10 Cu 53 48 40 7 10 6 V F A S HZ HT L 10- 2 ZiLOG 2002 Quality and Reliability Report Table 11-2. Device JA, JC Table Summary Of Thermal Resistance For Hermetic Packages PBGA 256L 256L CERDIP 28 40 48 Ceramic Side Braze 18 28 40 48 Ceramic Window 44L Pin Grid Array 68L Notes: B 25 21 N/A N/A 52 41 32 14 11 5 81 21 49 48 36 11 11 4 32 3 36 6 2 Layer 4 Layer D C K G P=Plastic DIP C=Ceramic DIP D=Cerdip L=LCC-Ceramic Leadless Chip Carrier V=PLCC-Plastic Leaded Chip Carrier F=QFP-Plastic Quad Flat Pack A=VQFP-Very Small Quad Flat Pack G=Ceramic Pin Grid Array S=SOIC-Small Outline Integrated Circuit B=PBGA-Plastic Ball Grid Array HZ=SSOP-Shrink Small Outline Package HT=EPT SSOP-Exposed Pad Thin SSOP ZAC03-0004 10- 3 ZiLOG 2002 Quality and Reliability Report CHAPTER 11 Glossary TERM DEFINITION : Symbol for Angstrom, which equals 10-10 meters (one ten-billionth of a meter). Accelerated Life Test: A life test, in which the applied stress level exceeds that needed in actual use in order to shorten the time required to observe failure. A good accelerated test should not alter the basic modes and/or mechanisms of failure. Acceleration Factor: The ratio of the times needed to obtain the same failure rates under two different sets of stress conditions involving the same failure modes or mechanisms. Activation Energy (Ae): The energy level needed to activate a specific failure mechanism. AES: Auger Electron Spectroscopy typically used for interlayer dielectrics and passivation films. Align: The operation of exposing a resist covered wafer in a projection printer. APCVD: Atmospheric Pressure Chemical Vapor Deposition. One method for deposition of glass used for interlayer or passivation dielectric. ASSP: Application Specific Standard Product. AQL: Acceptable Quality Level. Generally, 95 percent confidence that material of the stated AQL will pass sample inspection. Bonding: The act of connecting package leads to specified locations on the chip via fine wire. Bond Pads: Exposed aluminum pads on a chip to which wires from the package lead frame are bonded during assembly. Burn-In: The operation of a device prior to its application, at elevated temperature and/or voltage for a specific period of time. The purpose is to stabilize the device characteristics, identify early failures, and eliminate devices subject to infant mortality or excessive parametric drift. ZAC03-0004 11- 1 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION BPSG: Boron doped Phosphosilicate Glass. CD: Critical Dimension. CFA: Customer Failure Analysis/Correlation Request. C of C: Certificate of Conformance. CMOS: Complementary MOS technology combining n and p transistors in the same product. Advantages include low power dissipation. Confidence: A specialized statistical term which refers to the probability of a statement being true. Check: A visual check done at the conclusion of a (dry or wet) masking step. Chip: One square on a wafer containing a single integrated circuit. The substrate on which all active and passive components of a circuit are fabricated; also called a die. Clean Room: The room in a chip fabrication plant in which wafers are processed. This area features a controlled environment with filtered air that eliminates essentially all dust and dirt. Contact: A connection between two conductive layers, e.g., metal-to-silicon contact. Control limit: A statistically defined limit which determines whether or not a process has changed significantly as compared to past history. A measure of statistical process control. C-SAM: C-Mode Scanning Acoustic Microscope which examines packaged units and produces high resolution, ultrasonic images. CVD: Chemical Vapor Deposition of thin films. Gaseous reactants are brought together over the silicon wafer, depositing required layers typically used for interlayer dielectrics and passivation films. DC: Document Control. DESC: Defense Electronic Supply Center. DI: Deionized water. DIP: Dual-in-Line Package. DRC: Design Rule Check. DUT: Device Under Test. Depletion transistor: A MOSFET with a permanently "on" channel; requires a negative applied gate voltage to turn off (see "enhancement transistor"). ZAC03-0004 11- 2 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION Develop: A chemical process that solidifies photoresist where it has been exposed and removes it elsewhere (for negative resist) or vice versa (for positive resist). Develop inspect: A visual check following dry masking to verify proper resist patterning before etch, e.g., alignment and thickness are checked. Die: A single integrated circuit separated from the wafer on which it was made; also called a chip. Diffusion: The process of doping silicon by diffusing impurities from the surface into the wafer at high temperature. Any region in the silicon substrate doped by diffusion or by ion implant (e.g., source and drain diffusions). Dopant: Any impurity intentionally introduced into silicon to control its electronic behavior (e.g., Boron, Arsenic, and Phosphorus). Dose: In ion implant, a measure of the amount of dopant implanted; usually expressed in ions per square centimeter. Drain: A highly doped region adjacent to a transistor currently carrying channel. It carries electrons out of the transistor to the next circuit element or conductor. Dry Masking: A process segment where a photoresist is spun onto the wafer, soft baked, exposed, and developed to obtain a desired pattern ready for etch or implant (see "wet masking"). EDX: Energy Dispersive X-ray analysis. Normally uses electron beam excitation in the scanning electron microscope. EOS: Electrical overstress, common application failure mechanism. ESD: Electrostatic discharge, common handling failure mechanism. Enhancement transistor: A MOSFET with a normally "off" channel; requires a positive applied gate voltage to turn on (see "depletion transistor"). Etch rate: The rate at which a given layer is etched off in a given standard acid solution, expressed in A/sec. Evaporation: Deposition technique for Aluminum, Gold, and Chromium thin films. Expose: Expose a photoresist-coated wafer to light through a mask. FAE: Field Application Engineer. Final Test: Measurement of assembled device performance. Products are categorized by speed/power/performance criteria. ZAC03-0004 11- 3 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION FIT: "Failure units" or "Failure in Time," a measure of failure rate defined as one failure in 109, or one billion device hours. FPO: Finish Process Order. A lot traveler, which accompanies each lot through the finish (Mark and Pack and FQA) areas. FQE: Field Quality Engineer. Gate: The gate of a transistor. Gate oxide: Dielectric oxide between the gate and the channel region of a transistor. Generic: Devices similar in process or function. ZiLOG uses a generic approach in its Reliability Program. Devices built in the same wafer fab process and having similar complexity or function are grouped into a "generic" product family. Data on any device within a family is considered indicative of the performance of all other devices in that group and process line. Gettering: Trapping of contamination atoms (especially alkali ions) to prevent their drift into device regions where they may affect electrical performance. Glass: The amorphous form of SiO2, used in various insulating layers on the wafer. Hard Bake: A step following dry masking, where the resist is heated to prepare it for wet etch. HAST: Highly Accelerated Stress Test. HTOL: High Temperature Operating Life. IC: Integrated Circuit. Infant Mortality: Initial failure rate in life studies. It is followed by early failure period and then final wear out portion of failure "bathtub" curve. IQC: Incoming Quality Control. K: Kilo, thousand, 103. Layout: A magnified, physical representation of an electronic circuit at the transistor level. LCC: Leadless Chip Carrier. Lead: The external connection to a packaged integrated circuit. Life Test: A test for the purpose of estimating some characteristic(s) of a device's useful lifetime. LSI: Large Scale Integration ZAC03-0004 11- 4 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION LPCVD: Low Pressure Chemical Vapor Deposition. Typical method for deposition of glass used for interlayer or passivation dielectric. LTO glass: Low Temperature Oxide glass used for interlayer or passivation dielectric. Typically deposited at the same temperature as APCVD deposited glasses used for passivation, but at low pressure. LTPD: Lot Tolerance Percent Defective. A sample plan that will reject 90 percent of the lots equal to or worse than the stated LTPD value. Mask: A pattern usually "printed" on glass, used to define areas of the chip on the wafer for production purposes. Masking: The lithography portion of the process or physical area where lithography occurs. MeV: Million electron Volts. meV: Milli electron Volts. MFG: Manufacturing. Mil: 0.001 inch. MIL: Military. Mod: Nampa Fabrication Module. MOS: Metal Oxide Semiconductor integrated circuit technology. MRB: Material Review Board. MTBF: Mean Time Between Failures. MTTF: Mean Time to Fail. Time to 50 percent Cumulative Fail. Nano: 10-9. Negative photoresist: A resist material in which unexposed areas are developed away. NIST: National Institute of Standards and Technology. Nitride: Silicon Nitride, Si3N4. NMOS: N channel MOS technology. Nm: Nanometer (1nm = 10A = 10-9 meters). Ns: Nanoseconds (10-9 seconds). OEM: Original Equipment Manufacturer. OTP: One Time Programmable Product sold in plastic packaging. No window is provided for UV erasure. "Oxi": A process whereby thick oxide islands are grown between active device regions for better isolation and performance. ZAC03-0004 11- 5 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION Oxynitride: A plasma deposited passivation or interlayer dielectric film consisting of silicon, oxygen, and nitrogen. P: Phosphorous. PDIP: Plastic Dual In-Line Package. PE: Product Engineer. PECVD: Plasma Enhanced Chemical Vapor Deposition. PGA: Pin Grid Array (package). PLCC: Plastic Leaded Chip Carriers. PM: Procedural Manual that contains ZiLOG's policies and procedures. POA: Point of Acceptance. PPM: PPM Quality Data, Parts per Million defective; 1000 PPM = 0.1 percent defective. PPOT: Pressure Pot. PROM: Programmable Read Only Memory. PSG: Phosphosilicate Glass. A glass containing phosphorus (in the form of P205). LTO, Pyrox and Pyroglass are all types of PSG. Package: The container used to hold an active semiconductor device. Photolithography: The portion of the process involving the use of light sensitive photoresist material for layer definition. Photomask: (1) A patterned chrome on glass photographic plate used to transfer a pattern to photo-resist in dry masking. (2) A process segment involving the patterning of a given layer by use of a photomask. Photoresist: A light sensitive polymer material which is used as a mask for etching and ion implant steps. See also Negative and Positive Photoresist. Plasma ash: A process using a gas transformed by an RF field into a reactive plasma. Plasma deposition: Deposition of thin films using gaseous reactants in the presence of a plasma for lower temperatures. Plasma etch: An etching process using a gas transformed by an RF field into a reactive plasma. Poly: Polycrystalline silicon made up of many tiny crystals (as opposed to single crystal silicon. ZAC03-0004 11- 6 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION Poly Re-ox: Oxidation of the poly after it has been defined. The re-ox provides the interpoly di-electric in a double (two layer) poly process. Positive photoresist: A photosensitive organic polymer material in which exposed areas are developed away. Prebake: First step of dry masking, in which the wafers are dried in an oven prior to resist application. Probe: The first electrical test of processed wafers. Process Templating: The profile displayed by the process evaluation parameters, which are automatically recorded from the test patterns on wafers as they proceed through the production line. Projection Aligner: A machine which projects the photomask onto the resist-coated wafer. The mask is the same size as the wafer and imaged 1:1 on the wafer. Pyrox: A type of phosphosilicate glass containing approximately 4.5 wt Phosphorous. QA: Quality Assurance. QE: Quality Engineer. QR-XXXX: Product or Process Qualification Report (XXXX = report number). RBS: Rutherford Back Scattering. A method for non-destructive depth profile analysis of thin films by back scattering of high-energy helium ions. RE: Reliability Engineer. RGA: Residual Gas Analysis. QFP: Quad Flat Package. QIP: Quality Improvement Process. Q&R: Quality and Reliability. RH: Relative Humidity. RIE: Reactive Ion Etch. RMA: Return Material Authorization. ROM: Read Only Memory. Refractive Index: A basic physical property which determines the extent of light bending (refraction) upon entering the surface. Used in thin film process control as an indirect measure of chemistry. Resist: See Photoresist. ZAC03-0004 11- 7 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION SDE: Statistical Design of Experiments. SEM: Scanning Electron Microscope. A microscope which makes use of a scanning beam of electrons to image detail less than 100A in size (surface only). SIMS: Secondary Ion Mass Spectroscopy. SL-Lot: Special Lot. ZiLOG identification used to identify products designed to unique customer requirements. SPC: Statistical Process Control. STS: Ship-to-Stock. Eliminates need for customer IQC. Silicon: Metallic element which forms the substrate in most semiconductor devices. Soft bake: A step preparing freshly spun photoresist for exposure by baking it in an oven (to remove excess solvent). SOIC: Small Outline Integrated Circuit package. Source: Equivalent to the drain of a transistor with the exception that electrons leave the source into the channel of the active device. Spec. Limit: Absolute acceptable limit for a process parameter. Spin: A process step which coats a spinning wafer with liquid photoresist by dispensing the liquid onto its center. Sputtering: Deposition of a metal layer by bombarding a metal target with heavy ions from a gaseous (e.g., argon) plasma. Metal atoms are removed from the target and deposited onto the wafer during this process. TD: Technology Development. TDDB: Time Dependent Dielectric Breakdown. TEM: Transmission Electron Microscope. A microscope used to obtain high-resolution images with a transmitted electron beam by electron lens imaging rather than scanning. THB: Temperature Humidity Bias (85C/85% RH). TSOP: Thin small outline package. Test patterns: Special electrical test structures included on production device wafers for monitoring critical parameters. Thermal oxide: A high quality SiO2 layer grown by oxidizing the silicon in a furnace (as opposed to externally deposited glass). UL: Underwriters Laboratory. ZAC03-0004 11- 8 ZiLOG 2002 Quality and Reliability Report TERM DEFINITION UV: Ultra Violet. V/I: A monitor measuring voltage and current between probes applied to a semiconductor layer. Measures layer resistivity. Visual: A check of process quality by examination of wafers under a light microscope. VLSI: Very Large Scale Integration. VQFP: Very small Quad Flat Pack package. Vt: Transistor threshold voltage. Voltage at which the transistor turns on. Wafer: A thin piece of silicon sliced from a cylinder shaped crystal. It is polished so that the surface is like a mirror. It is most commonly found in 4, 5, and 6-inch diameters. The wafer is the base material for most of the world's integrated circuits. Wafer flat: A flat area ground onto the original silicon ingot from which the wafers are sliced. Gives crystallographic orientation. Waterfall Guardbanding: The technique of testing a circuit at different levels of the manufacturing process, to insure above marginal product performance and compliance. Wet masking: Process segment following "dry masking" in which the wafer, covered with the resist pattern, is etched to transfer the resist pattern to the wafer. The resist is then removed (includes wet and/or plasma etching). Wet etch: Etching in a liquid acid or solution. Wire bonding: The process of connecting thin wires from the chip's bond pads to the package lead. (This is done at assembly.) ZD: Zero Defects. ZEPI: ZiLOG Electronics Philippines, Inc. ZUS: ZiLOG Corporate Headquarters, San Jose, California. ZAC03-0004 11- 9