CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA - OCTOBER 2003 - REVISED APRIL 2008 D D D D D D D Qualified for Automotive Applications Fully Static Operation Buffered Inputs Common Reset Positive Edge Clocking Typical fMAX = 60 MHz at VCC = 5 V, CL = 15 pF, TA = 25C Fanout (Over Temperature Range) - Standard Outputs . . . 10 LSTTL Loads - Bus Driver Outputs . . . 15 LSTTL Loads D Significant Power Reduction Compared to LSTTL Logic ICs D VCC Voltage = 2 V to 6 V D High Noise Immunity NIL or NIH = 30% of VCC, VCC = 5 V M OR PW PACKAGE (TOP VIEW) 5 1 0 2 6 7 3 GND D Balanced Propagation Delay and Transition Times description/ordering information 1 16 2 15 3 14 4 13 5 12 6 11 7 10 VCC MR CP CE TC 9 4 8 8 9 The CD74HC4017 is a high-speed silicon-gate CMOS 5-stage Johnson counter with ten decoded outputs. Each of the decoded outputs normally is low and sequentially goes high on the low-to-high transition clock period of the ten-clock-period cycle. The carry (TC) output transitions low to high after output 9 goes from high to low, and can be used in conjunction with the clock enable (CE) input to cascade several stages. CE disables counting when in the high state. A master reset (MR) input also is provided that, when taken high, sets all the decoded outputs, except output 0, to low. The device can drive up to ten low-power Schottky equivalent loads. ORDERING INFORMATION{ SOIC - M -40C 40C to 125C ORDERABLE PART NUMBER PACKAGE TA Tape and reel TSSOP - PW Tape and reel TOP-SIDE MARKING CD74HC4017QM96Q1 HC4017Q CD74HC4017QPWRQ1 HC4017Q For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. FUNCTION TABLE INPUTS CP CE MR OUTPUT STATE L X L No change X H L No change X X H 0 = H, 1-9 = L L L Increments counter X L No change X L No change H L Increments counter NOTE: H = high voltage level, L = low voltage level, X = don't care, = transition from low to high level, = transition from high to low level If n < 5, TC = H, otherwise TC = L Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA - OCTOBER 2003 - REVISED APRIL 2008 logic diagram (positive logic) 3 CP 2 14 4 CE 13 7 10 MR 15 1 5 6 9 11 12 0 1 2 3 4 5 Decoded Decimal Out 6 7 8 9 TC absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < -0.5 V or VI > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < -0.5 V or VO > VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Source or sink current per output pin, IO (VO > -0.5 V or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150C Lead temperature (during soldering): At distance 1/16 1/32 inch (1,59 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 300C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages referenced to GND unless otherwise specified. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA - OCTOBER 2003 - REVISED APRIL 2008 recommended operating conditions (see Note 3) VCC Supply voltage VIH High-level High level input voltage VCC = 2 V MIN MAX 2 6 UNIT V 1.5 VCC = 4.5 V 3.15 VCC = 6 V V 4.2 VCC = 2 V 0.5 VCC = 4.5 V 1.35 VIL Low-level Low level input voltage VI Input voltage 0 VCC V VO Output voltage 0 VCC V tt Input transition (rise and fall) time VCC = 6 V TA V 1.8 VCC = 2 V 0 1000 VCC = 4.5 V 0 500 VCC = 6 V 0 400 -40 125 Operating free-air temperature ns C NOTES: 3. All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS CMOS loads VOH VI = VIH or VIL TTL loads CMOS loads VOL VI = VIH or VIL TTL loads II VI = VCC or GND ICC VI = VCC or GND CIN CL = 50 pF VCC -0.02 2V 1.9 1.9 -0.02 4.5 V 4.4 4.4 -0.02 6V 5.9 5.9 3.7 MIN MAX MIN MAX UNIT V -4 4.5 V 3.98 -5.2 6V 5.48 0.02 2V 0.1 0.1 0.02 4.5 V 0.1 0.1 0.02 6V 0.1 0.1 4 4.5 V 0.26 0.4 5.2 6V 0.26 0.4 6V 0.1 1 A 6V 8 160 A 10 10 pF 0 POST OFFICE BOX 655303 TA = 25C IO (mA) * DALLAS, TEXAS 75265 5.2 V 3 CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA - OCTOBER 2003 - REVISED APRIL 2008 timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER fmax VCC Maximum clock frequency CP tw Pulse duration MR CE to CP tsu Setup time MR inactive th 4 Hold time,, CE to CP POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TA = 25C MIN MAX MIN 2V 6 4 4.5 V 30 20 6V 35 23 2V 80 120 4.5 V 16 24 6V 14 20 2V 80 120 4.5 V 16 24 6V 14 20 2V 75 110 4.5 V 15 22 6V 13 19 2V 5 5 4.5 V 5 5 6V 5 5 2V 0 0 4.5 V 0 0 6V 0 0 MAX UNIT MHz ns ns ns CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA - OCTOBER 2003 - REVISED APRIL 2008 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) Decade out VCC 2V 230 345 CL = 50 pF 4.5 V 46 69 6V 39 59 2V 230 345 4.5 V 46 69 39 59 2V 250 375 4.5 V 50 75 6V 43 64 2V 250 375 4.5 V 50 75 43 64 2V 230 345 4.5 V 46 69 6V 39 59 CL = 15 pF CP CL = 50 pF TC Decade out CL = 50 pF CL = 15 pF CE CL = 50 pF TC Decade out MR TC CL = 50 pF TC, Decade out CP MAX 5V 5V 5V MIN MAX 19 21 2V 230 345 CL = 50 pF 4.5 V 46 69 6V 39 59 2V 75 110 4.5 V 15 22 6V 13 19 CL = 50 pF CL = 15 pF 5V ns 21 5V 5V UNIT 19 CL = 15 pF CL = 15 pF fmax TYP 6V CL = 15 pF tt 5V MIN 6V CL = 15 pF tpd TA = 25C LOAD CAPACITANCE 19 19 60 ns MHz operating characteristics, VCC = 5 V, TA = 25C, input tr, tf = 6 ns, CL = 15 pF PARAMETER Cpd TYP Power dissipation capacitance (see Note 4) 39 UNIT pF NOTE 4: Cpd is used to determine the dynamic power consumption per package. PD = (Cpd x VCC2 x fi) + (CL x VCC2 x fO) fI = input frequency fO = output frequency CL = output load capacitance VCC = supply voltage POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA - OCTOBER 2003 - REVISED APRIL 2008 PARAMETER MEASUREMENT INFORMATION From Output Under Test VCC High-Level Pulse Test Point 50% 50% 0V tw CL = 50 pF (see Note A) VCC Low-Level Pulse 50% 50% 0V LOAD CIRCUIT VOLTAGE WAVEFORMS PULSE DURATIONS VCC Input 50% 50% 0V tPLH VCC Reference Input In-Phase Output 50% 0V tsu Data Input 50% 10% 90% tr tPHL VCC 50% 10% 0 V 90% 90% tr th 90% 50% 10% tPHL Out-of-Phase Output 90% VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES tPLH 50% 10% tf tf VOH 50% 10% VOL tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. For clock inputs, fmax is measured when the input duty cycle is 50%. D. The outputs are measured one at a time with one input transition per measurement. E. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 CD74HC4017-Q1 HIGH-SPEED CMOS LOGIC DECADE COUNTER/DIVIDER WITH 10 DECODED OUTPUTS SCLS546SA - OCTOBER 2003 - REVISED APRIL 2008 CL CL P P N N D Q CL CL CL CL P CL C N CL P Q N CL R Figure 2. Flip-Flop Detail CP MR CE 0 1 2 3 4 5 6 0 0 1 1 2 2 3 4 5 6 7 7 8 8 9 9 TC Figure 3. Timing Diagram POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) CD74HC4017QM96G4Q1 ACTIVE Package Type Package Drawing SOIC Pins Package Qty D 16 2500 Green (RoHS & no Sb/Br) 2000 Green (RoHS & no Sb/Br) CD74HC4017QM96Q1 OBSOLETE SOIC D 16 CD74HC4017QPWRG4Q1 ACTIVE TSSOP PW 16 CD74HC4017QPWRQ1 OBSOLETE TSSOP PW 16 Eco Plan (2) TBD TBD Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM Call TI Call TI CU NIPDAU Level-1-260C-UNLIM Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD74HC4017-Q1 : * Catalog: CD74HC4017 Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2012 * Enhanced Product: CD74HC4017-EP * Military: CD54HC4017 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Enhanced Product - Supports Defense, Aerospace and Medical Applications * Military - QML certified for Military and Defense Applications Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated