Pb
RoHS
EC1300-20.000M-CL175
EC13 00 -20.000M - CL175
Series
RoHS Compliant (Pb-free) 3.3V 14 Pin DIP Metal
Thru-Hole LVCMOS/TTL Oscillator
Frequency Tolerance/Stability
±100ppm Maximum
Operating Temperature Range
0°C to +70°C
Duty Cycle
50 ±10(%)
Cut Leads
Cut Leads to 4.445 ±0.251 (0.175" ±0.010")
Value Added Option Prefix
Nominal Frequency
20.000MHz
Pin 1 Connection
No Connect
ELECTRICAL SPECIFICATIONS
Nominal Frequency 20.000MHz
Frequency Tolerance/Stability ±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,
Shock, and Vibration)
Aging at 25°C ±5ppm/year Maximum
Operating Temperature Range 0°C to +70°C
Supply Voltage 3.3Vdc ±0.3Vdc
Input Current 10mA Maximum
Output Voltage Logic High (Voh) 2.4Vdc Minimum with TTL Load, 2.7Vdc Minimum with LVCMOS Load
Output Voltage Logic Low (Vol) 0.4Vdc Maximum with TTL Load, 0.5Vdc Maximum with LVCMOS Load
Rise/Fall Time 10nSec Maximum (0.4Vdc to 2.4Vdc with TTL Load or 10% to 90% of Wavform with LVCMOS Load)
Duty Cycle 50 ±10(%) (Measured at 50% of waveform)
Load Drive Capability 2TTL Load or 15pF LVCMOS Load Maximum
Output Logic Type CMOS
Pin 1 Connection No Connect
Absolute Clock Jitter ±100pSec Maximum
One Sigma Clock Period Jitter ±25pSec Maximum
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Lead Integrity MIL-STD-883, Method 2004
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 1 of 7
EC1300-20.000M-CL175
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
7.620
±0.203
13.2
MAX
20.8 MAX
15.240
±0.203
1 7
8
14
DIA 0.457
±0.100 (X4)
5.08 MIN
5.08 MAX
0.9 MAX
PIN CONNECTION
1 No Connect
7 Ground/Case Ground
8 Output
14 Supply Voltage
LINE MARKING
1ECLIPTEK
2EC13
EC13=Product Series
320.000M
4XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
OUTPUT WAVEFORM
VOH
VOL
90% or 2.4VDC
50% or 1.4VDC
10% or 0.4VDC
Fall
Time Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
CLOCK OUTPUT
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 2 of 7
EC1300-20.000M-CL175
Supply
Voltage
(VDD)
Test Circuit for TTL Output
Output
No Connect
or Tri-State
Ground
+ +
+
+
_
_
__
Power
Supply Voltage
Meter
Current
Meter
0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
RL
(Note 4)
Power
Supply
Oscilloscope Frequency
Counter
Probe
(Note 2)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'.
Note 5: All diodes are MMBD7000, MMBD914, or equivalent.
Table 1: RL Resistance Value and CL Capacitance
Value Vs. Output Load Drive Capability
Output Load
Drive Capability RL Value
(Ohms) CL Value
(pF)
10TTL
5TTL
2TTL
10LSTTL
1TTL
390
780
1100
2000
2200
15
15
6
15
3
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 3 of 7
EC1300-20.000M-CL175
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
No Connect
or Tri-State
Ground
+ +
+_
__
Power
Supply 0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
Value Added Option - Cut Leads
All dimensions are in millimeters
4.445 ±0.251
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 4 of 7
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EC1300-20.000M-CL175
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 5 of 7
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EC1300-20.000M-CL175
Low Temperature Infrared/Convection 185°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)185°C Maximum
Target Peak Temperature (TP Target) 185°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device. Use this method only
for product with the Gull Wing option.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 6 of 7
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EC1300-20.000M-CL175
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 1 Time / 235°C Maximum 2 Times
Time within 5°C of actual peak (tp)5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to back of PCB board and device leads
only. Do not use this method for product with the Gull Wing option.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only.
This method can be utilized with both Gull Wing and Non-Gull Wing devices.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures listed are applied to device leads only. This
method can be utilized with both Gull Wing and Non-Gull Wing devices.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/17/2010 | Page 7 of 7
