WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. FEATURES AND BENEFITS: * No interface material is needed * Copper with matte tin plating for improved solderability and assembly * Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for "Tape & Reel" and "Tube" formats * EIA standards and ESD protection are specified * Can be used with water soluble or no clean SMT solder creams or other pastes Standard P/N Height Above PC Board in. (mm) 217-36CTE6 .360 (9.1) 217-36CTTE6 .360 (9.1) 217-36CTRE6 .360 (9.1) Material: Copper, Matte Tin Plated Package Format Package Quantity .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8) Bulk Tube Tape & Reel 1 20 250 217 HEAT SINK WITH DDPAK DEVICE Thermal Performance at Typical Load Natural Forced Convection Convection) 55C @ 1W 55C @ 1W 55C @ 1W 16.0C/W @ 200 LFM 16.0C/W @ 200 LFM 16.0C/W @ 200 LFM THERMAL PERFORMANCE 6 LAYER BOARD, D' PAK 125C LEAD, 40C AMBIENT Device Tab dT, C MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) 217-36CT6 Device Power Dissipation. W Device only, NC KEY: Device + HS, NC Device + HS, 100 lfm Device + HS, 200 lfm Device + HS, 300 lfm SECTION A-A NOTES 1. Material to be "ESD" 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. TAPE DETAILS 217-36CTR6 REEL DETAILS Dimensions: in. 22 WTS001_p1-25 6/14/07 10:54 AM Page 23 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks MECHANICAL DIMENSIONS D 2PAK, TO-220, SOL-20 BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESD Material with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK) 217-36CT6 Dimensions: in. 218 SERIES Standard P/N Surface Mount Heat Sink SMT Devices Height Above PC Board in. (mm) Maximum Footprint in. (mm) .40 (10.2) .40 (10.2) .90 (22.9) x .315 (8.0) 1.03 (26.2) x .50 (12.7) 218-40CTE3 218-40CTE5 Thermal Performance at Typical Load Natural Convection Forced Convection 62C rise @ 2W 62C rise @ 2W 21C/W @ 200LFM 21C/W @ 200LFM Material: Copper, Matte Tin Plated MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 200 100 400 600 800 1000 25 80 20 60 15 40 10 20 5 0 0 200 0.5 400 1.0 600 1.5 800 2.0 0 1000 2.5 THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 0 HEAT DISSIPATED (WATTS) 218-40CT3 218-40CT5 Solid line = 218-40CT5 Dashed Line = 218-40CT3 23 WTS001_p1-25 6/14/07 10:54 AM Page 24 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 206 SERIES Vertical Mount Heat Sink Standard P/N 206-1PABEH TO-220 Height Above PC Board in. (mm) Maximum Footprint in. (mm) 1.18 (30.0) 1.00 (25.4) x .50 (12.7) Thermal Performance at Typical Load Natural Convection Forced Convection 56C rise @ 4W 7.3C/W @ 200LFM Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 200 400 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 0 200 2 400 4 600 6 800 8 0 1000 10 THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 0 HEAT DISSIPATED (WATTS) Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks 230 & 234 SERIES Standard P/N PATENT PENDING Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuation Solderable Tab Option Mounting Style Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal No Tab 01 05 10 No Tab 01 05 Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 230-75AB .750 (19.1) .570 (14.5) x .500 (12.7) 230-75ABE-01 .750 (19.1) .570 (14.5) x .500 (12.7) 230-75ABE-05 .500 (12.7) .750 (19.1) x .570 (14.5) 230-75ABE-10 .875 (22.2) .570 (14.5) x .500 (12.7) 234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) 234-75ABE-01 .790 (20.0) .570 (14.5) x .500 (12.7) 234-75ABE-05 .500 (12.7) .790 (20.0) x .570 (14.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 230-75AB-01 230-75AB-10 230 AND 234 SERIES 230-75AB-05 TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection) 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 230 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 234 SERIES 234-75AB Dimensions: in. (mm) 24 234-75AB-01 234 SERIES 234-75AB-05 WTS001_p1-25 6/14/07 10:54 AM Page 25 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 241 SERIES Standard P/N Horizontal Mount Heat Sink TO-220 Height Above PC Board in. (mm) Maximum Footprint in. (mm) .39 (9.9) .86 (21.8) x .69 (17.5) 241-69ABE-03 Thermal Performance at Typical Load Natural Convection Forced Convection 77C rise @ 4W 12C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 200 0 1 200 400 600 800 2 400 3 600 4 800 100 80 60 40 20 0 1000 20 18 16 14 12 10 8 6 4 2 0 5 1000 THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) 0 HEAT DISSIPATED (WATTS) 262 SERIES Standard P/N Horizontal and Vertical Mount Heat Sink TO-220 Height Above PC Board in. (mm) Maximum Footprint in. (mm) .53 (13.4) .75 (19.1) .75 (19.1) x .50 (12.78) .53 (13.4) x .50 (12.7) 262-75ABE-05 262-75ABE-01 Thermal Performance at Typical Load Natural Convection Forced Convection 80C rise @ 2W 80C rise @ 2W 10C/W @ 200LFM 10C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 200 400 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 0 1 200 2 400 3 600 4 800 0 5 1000 THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 0 HEAT DISSIPATED (WATTS) 25 WTS001_p26-49 6/14/07 10:55 AM Page 26 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Self-Locking Wavesolderable Heat Sinks 233 & 236 SERIES Standard P/N PATENT PENDING Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 233-60AB .600 (15.2) .570 (14.5) x .500 (12.7) 233-60ABE-01 .600 (15.2) .570 (14.5) x .500 (12.7) 233-60ABE-05 .500 (12.7) .600 (15.2) x .570 (14.5) 233-60ABE-10 .725 (18.4) .570 (14.5) x .500 (12.7) 236-150AB 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150ABE-01 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150ABE-05 .500 (12.7) 1.500 (38.1) x .570 (14.5) 236-150ABE-10 1.625 (41.3) .570 (14.5) x .570 (12.7) Material: Aluminum, Black Anodized TO-220 Mounting Solderable Configuration Tab Options Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal Vetrical No Tab 01 05 10 No Tab 01 05 10 Mounting Style Thermal Performance at Typical Load Natural Forced Convection Convection Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 40C @ 2W 40C @ 2W 40C @ 2W 40C @ 2W 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 233 AND 236 SERIES 233-60AB-01 236-150AB-01 233-60AB-10 236-150AB-10 233-60AB-05 236-150AB-05 236-150AB Dimensions: in. (mm) 233-60AB 275 & 231 SERIES Standard P/N PATENT 5381041 Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) .750 (19.1) .750 (19.1) .875 (12.7) .690 (18.4) .400 (10.1) .690 (17.5) .750 (19.1) .400 (10.1) .750 (19.1) 1.375 (35) .400 (10.2) 1.375 (35) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .835 (21.2) x .400 (12.7) .690 (17.5) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .750 (19.1) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2 x .400 (12.7) 1.375 (34.9) x .835 (12.7) .835 (21.2) x .400 (12.7) 275-75AB 275-75ABE-01 275-75ABE-10 231-69PAB 231-69PABE 231-69PABE-XXX 231-75PAB 231-75PABE 231-75PABE-XXX 231-137PAB 231-137PABE 231-137PABE-XXX Mounting Solderable Configuration Tab Options Vert./Horiz. Vertical Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical No Tab 01 10 No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V Mounting Style TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 44 C @ 2W 44C @ 2W 44C @ 2W 45C @ 2W 45C @ 2W 45C @ 2W 43C @ 2W 43C @ 2W 43C @ 2W 32C @ 2W 32C @ 2W 32C @ 2W 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 8C/W @ 400 LFM 8C/W @ 400 LFM 8C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 5.9C/W @ 400 LFM 5.9C/W @ 400 LFM 5.9C/W @ 400 LFM Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) 275 AND 231 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS TAB 13H All versions No Tab TAB 14V TAB 13V NATURAL AND FORCED CONVECTION CHARACTERISTICS TAB 01 TAB 10 TAB 15V TAB 13H Dimensions: in. (mm) 26 WTS001_p26-49 6/14/07 10:55 AM Page 27 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Standard P/N Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 235-85AB .850 (21.6) 1.000 (25.4) x 235-85ABE-01 .850 (21.6) 1.000 (25.4) x 235-85ABE-05 .500 (12.7) .850 (21.6) x 235-85ABE-10 .975 (24.8) 1.000 (25.4) x Material: Aluminum, Black Anodized PATENT 5381041 235-85AB .500 (12.7) .500 (12.7) 1.000 (25.4) .500 (12.7) TO-220 Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Vertical Horizontal Vertical No Tab 01 05 10 Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole MECHANICAL DIMENSIONS Thermal Performance at Typical Load Natural Forced Convection Convection 40C @ 2W 40C @ 2W 40C @ 2W 40C @ 2W 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 235 SERIES 235-85AB-05 235-85AB-01 235-85AB-10 Dimensions: in. (mm) 243 SERIES Standard P/N Labor-Saving Clip-On Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) 243-3PAB .800 (20.3) .800 (20.3) x .270 (6.9) Material: Aluminum, Pre-anodized Black TO-220 Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Verl./Horiz. No Tab No Tab Clip Clip Thermal Performance at Typical Load Natural Forced Convection Convection 50C@ 2W 78C@ 2W 4.5C/W @ 400 LFM 8.2C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 243 SERIES VIEW B-B SECTION A-A Dimensions: in. (mm) 239 SERIES Standard P/N Snap-Down Self-Locking Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 239-75AB .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75ABE-03 .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75ABE-04 .750 (19.1) 1.120 (28.4) x .435 (11.0) Material: Aluminum, Black Anodized PATENT PENDING MECHANICAL DIMENSIONS 239-75AB TO-220 Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz Vertical Vertical No Tab 03 04 Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 239 SERIES SECTION A-A Thermal Performance at Typical Load Natural Forced Convection Convection 38C @ 2W 38C @ 2W 38C @ 2W 6C/W @ 400 LFM 6C/W @ 400 LFM 6C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 239-75AB-03 239-75AB-04 Dimensions: in. (mm) 27 WTS001_p26-49 6/14/07 10:55 AM Page 28 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 265 SERIES Standard P/N 265-118ABHE-22 Vertical Mount Heat Sink TO-220 Height Above PC Board in. (mm) Maximum Footprint in. (mm) 1.18 (30.0) 1.00 (25.4) x .50 (12.7) Thermal Performance at Typical Load Natural Convection Forced Convection 56C rise @ 4W 7.0C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 200 400 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 0 200 2 400 4 600 6 800 8 0 1000 10 THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 0 HEAT DISSIPATED (WATTS) 286DB SERIES Vertical Mount Heat Sink TO-220 Standard P/N Height Above PC Board in. (mm) Maximum Footprint in. (mm) 286DBE .95 (24.1) 1.00 (25.4) x .50 (12.7) Thermal Performance at Typical Load Natural Convection Forced Convection 65C rise @ 4W 9.0C/W @ 200LFM Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 200 400 600 1000 10 80 8 60 6 40 4 20 2 0 0 2 200 4 400 6 600 HEAT DISSIPATED (WATTS) 28 800 100 8 800 0 10 1000 THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 0 WTS001_p26-49 6/14/07 10:55 AM Page 29 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above PC Board in. (mm) Standard P/N Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Vertical Vertical No Tab 01 02 Mtg Hole Mtg Hole Mtg Hole 49C @ 2W 49C @ 2W 49C @ 2W 273-AB .375 (9.5) .750 (19.1) x .750 (19.1) 273-ABE-01 .375 (9.5) .750 (19.1) x .750 (19.1) 273-ABE-02 .375 (9.5) .750 (19.1) x .750 (19.1) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS TO-218, TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 7.2C/W @ 400 LFM 7.2C/W @ 400 LFM 7.2C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 273 SERIES 273-AB 273-AB-01 273-AB-02 Dimensions: in. (mm) 274 & 281 SERIES Material: Aluminum, Black Anodized Standard P/N 274-1AB 274-1ABE-01 274-1ABE-02 274-2AB 274-2ABE-01 274-2ABE-02 274-3AB 274-3ABE-01 274-3ABE-02 281-1AB 281-2AB Height Above PC Board in. (mm) .375 (9.5) .375 (9.5) .375 (9.5) .500 (12.7) .500 (12.7) .500 (12.7) .250 (6.4) .250 (6.4) .250 (6.4) .375 (9.5) .500 (12.7) Low-Cost, Low-Height Wavesolderable Heat Sinks Footprint Dimensions in. (mm) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) MECHANICAL DIMENSIONS Mounting Configuration Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vertical Vertical Solderable Tab Options No Tab 01 02 No Tab 01 02 No Tab 01 02 No Tab No Tab TO-220 Mounting Style Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole NATURAL AND FORCED CONVECTION CHARACTERISTICS 274 SERIES 274-XAB-02 274-XAB-01 274 SERIES Thermal Performance at Typical Load Natural Forced Convection Convection 56C @ 2W 8.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 281 SERIES Dimensions: in. (mm) 240 SERIES Standard P/N Labor-Saving Twisted Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 240-118ABEH-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) 240-118ABES-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 240 SERIES TO-220 Mounting Configuration Solderable Tab Options Mounting Style Vertical Vertical 22 22 Clip/Mtg Hole Clip/Mtg Slot Thermal Performance at Typical Load Natural Forced Convection Convection 55C @ 4W 55C @ 4W 5.3C/W @ 400 LFM 5.3C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 240-118ABS-22 240-118ABH-22 Dimensions: in. (mm) 29 WTS001_p26-49 6/14/07 10:55 AM Page 30 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Low-Height, Low-Profile Twisted Fin Heat Sinks 242 SERIES Height Above PC Board in. (mm) Standard P/N Footprint Dimensions in. (mm) Mounting Solderable Configuration Tab Options 242-125ABE-22 1.285 (32.6) .875 (22.2) x .250 (6.4) Material: Aluminum, Black Anodized 242-125AB-22 Vertical MECHANICAL DIMENSIONS 22 TO-220 Mounting Style Thermal Performance at Typical Load Natural Forced Convection Convection Mtg Hole 48C @ 2W 242 SERIES 6.2C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 232 & 238 SERIES Material: Aluminum, Black Anodized Staggered Fin Heat Sinks for Vertical Mounting TO-202, TO-220 Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style 232-200AB 232-200ABE-23 238-200AB 238-200ABE-23 2.000 (50.8) 2.000 (50.8) 2.000 (50.8) 2.000 (50.8) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) Vertical Vertical Verlical Verlical 2, Twisted 2, Solderable 2, Twisted 2, Solderable Clip/Mtg Hole Clip/Mtg Hole Mtg Slot Mtg Slot MECHANICAL DIMENSIONS 232-200AB 238-200AB 232-200AB-23 48C @ 4W 48C @ 4W 48C @ 4W 48C @ 4W 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 238-200AB-23 232 AND 238 SERIES 238 SERIES Thermal Performance at Typical Load Natural Forced Convection Convection Dimensions: in. (mm) 251 SERIES Standard P/N Slim-Profile Heat Sinks With Integral Clips Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 251-62AB .620 (15.7) .910 (23.1) x .380 (9.7) 251-80AB .845 (21.5) .910 (23.1) x .380 (9.7) 251-80ABE-19 .875 (22.2) .910 (23.1) x .380 (9.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 251-62AB 15 Lead Multiwatt Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Vert./Horiz. Vertical No Tab No Tab 19 Clip Clip Clip 251-80AB-19 Dimensions: in. (mm) 30 66C @ 3W 64C @ 3W 64C @ 3W 66C/W @ 400 LFM 66C/W @ 400 LFM 66C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 251 SERIES 251-80AB Thermal Performance at Typical Load Natural Forced Convection Convection WTS001_p26-49 6/14/07 10:55 AM Page 31 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATTTM COMPONENTS 244 SERIES Standard P/N Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) 244-145ABE-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Material: Aluminum, Black Anodized Mounting Configuration Solderable Tab Options Vert/Horiz, Vertical No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 44C @ 4W 44C @ 4W 4.4C/W @ 400 LFM 4.4C/W @ 400 LFM Weight lbs. (grams) .0160 (7.25) .0170 (7.20) MECHANICAL DIMENSIONS Dimensions: in. (mm) 245 SERIES Standard P/N Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 245-145AB 1.450 (36.8) 1.750 (44.5) x .380 (9.7) 245-145ABE-50 1.650 (41.9) 1.750 (44.5) x .380 (9.7) Material: Aluminum, Black Anodized Mounting Configuration Solderable Tab Options Ver.t/Horiz. Vertical No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 38C @ 4W 38C @ 4W 3.2C/W @ 400 LFM 3.2C/W @ 400 LFM Weight lbs. (grams) .0160 (7.25) .0170 (7.20) MECHANICAL DIMENSIONS Dimensions: in. (mm) 246 SERIES Standard P/N Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration 246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. 246-197ABE-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Solderable Tab Options No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 35C @ 4W 35C @ 4W 2.8C/W @ 400 LFM 2.8C/W @ 400 LFM Weight lbs. (grams) .0240 (10.90) .0250 (11.40) MECHANICAL DIMENSIONS Dimensions: in. (mm) 31 WTS001_p26-49 6/14/07 10:55 AM Page 32 Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATTTM COMPONENTS Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks 247 SERIES Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration 247-195AB 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vert./Horiz. 247-195ABE-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Solderable Tab Options No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 25C@ 4W 25C@ 4W 2.4C/W @ 400 LFM 2.4C/W @ 400 LFM Weight lbs. (grams) .0330 (15.10) .0340 (15.60) MECHANICAL DIMENSIONS Dimensions: in. (mm) 248 SERIES Standard P/N Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 248-162AB 1.620 (41.1) 2.000 (50.8) x .750 (19.1) 248-162ABE-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Order SpeedClipTM 285SC or 330SC separately. Material: Aluminum, Black Anodized Mounting Configuration Solderable Tab Options Vert/Horiz. Vertical No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 35C @ 4W 35C @ 4W 2.5C/W @ 400 LFM 2.5C/W @ 400 LFM Weight lbs. (grams) .026 (11.60) .027 (12.20) Order SpeedClipsTM separately for use with Series 246, 247, 248 or 249 MECHANICAL DIMENSIONS Dimensions: in. (mm) 249 SERIES Standard P/N Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration 249-113AB 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vert./Horiz, 249-113ABE-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Dimensions: in. (mm) 32 Solderable Tab Options No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 35C@ 4W 35C@ 4W 3.29C/W @ 400 LFM 3.29C/W @ 400 LFM Weight lbs. (grams) .020 (8.90) .021 (9.40) WTS001_p26-49 6/14/07 10:55 AM Page 33 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. (mm) Maximum Footprint in. (mm) 288-1ABE 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) TO-220, TO-202 Thermal Performance at Typical Load Natural Forced Convection Convection Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC board 85C @ 4W 12C/W @ 200 LFM Weight lbs. (grams) 0.0057 (2.59) space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. 288 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 271 SERIES Standard P/N 271-AB Top-Mount Booster Heat Sinks for Use with 270/272/280 Series Height Above Semiconductor Case in. (mm) Horizontal Mounting Footprint Dimensions in. (mm) 0.500 (12.7) 1.750 (44.5) x 0.700 (17.8) TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 62C @ 4W (NOTE A) 31 C @ 4W (NOTE B) 5.1C/W @ 400 LFM 1.8C/W 400 LFM (NOTE B) Weight lbs. (grams) 0.0052 (2.36) Material: Aluminum, Black Anodized This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. MECHANICAL DIMENSIONS NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. 271 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 33 WTS001_p26-49 6/14/07 10:55 AM Page 34 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Standard P/N Small Footprint Low-Cost Heat Sinks Height Above PC Board in. (mm) Horizontal Mounting Maximum Footing in. (mm) 270-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) 272-AB 0.375 (9.4) 1.750 (44.5) x 1.450 (36.8) 280-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) Material: Aluminum, Black Anodized These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation. Solderable Tab Options -- 01,02 -- TO-220, TO-202 Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 70C @ 4W 42C @ 4W 70C @ 4W 0.0052 (2.36) 0.0105 (5.72) 0.0048 (2.18) 6.0C/W @ 400 LFM 3.6C/W @ 400 LFM 6.0C/W @ 400 LFM The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix "O1" or "02" to the standard part number (i.e. 272-AB01 or 272-AB02). NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 270 SERIES 280 SERIES 272AB01 272 SERIES 272AB02 Dimensions: in. (mm) 289 & 290 SERIES Standard P/N Low-Cost Single or Dual Package Heat Sinks Height Above PC Board in. (mm) 289-AB 0.500 (12.7) 289-AP 0.500 (12.7) 290-1AB 0.500 (12.7) 290-2AB 0.500 (12.7) Material: Aluminum, Black Anodized Horizontal Mounting Maximum Footing in. (mm) 1.000 (25.4) x 0.710 (18.1) 1.000 (25.4) x 0.710 (18.1) 1.000 (25.4) x 1.180 (30.0) 1.000 (25.4) x 1.180 (30.0) Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black an289 SERIES MECHANICAL DIMENSIONS Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 50C @ 2W 50C @ 2W 44C @ 2W 44C @ 2W 0.0055 (2.49) 0.0055 (2.49) 0.0082 (3.72) 0.0081 (3.67) 9.0 C/W @ 400 LFM 9.0 C/W @ 400 LFM 7.0 C/W @ 400 LFM 7.0 C/W @ 400 LFM odized finish (289-AB) or with no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style. NATURAL AND FORCED CONVECTION CHARACTERISTICS 290 SERIES Dimensions: in. (mm) 34 TO-218, TO-202, TO-220 WTS001_p26-49 6/14/07 10:55 AM Page 35 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Height Above PC Board in. (mm) Standard P/N Footprint Dimensions in. (mm) 250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122ABE-09 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122ABE-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized 250 SERIES MECHANICAL DIMENSIONS Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Vertical Vertical No Tab 09 25 Clip Clip Clip 250-122AB-09 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 50C @ 4W 50C @ 4W 50C @ 4W 3.7C/W @ 400 LFM 3.7C/W @ 400 LFM 3.7C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 250-122AB-25 250-122AB Dimensions: in. (mm) High-Performance, High-Power Vertical Mount Heat Sinks 237 & 252 SERIES Height Above PC Board in. (mm) Standard P/N Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46C @ 4W 4.5C/W @ 200 LFM 237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46C @ 4W 4.5C/W @ 200 LFM 237-167ABE2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46C @ 4W 4.5C/W @ 200 LFM 252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40C @ 4W 4.5C/W @ 200 LFM 252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40C @ 4W 4.5C/W @ 200 LFM 252-167ABE2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40C @ 4W 4.5C/W @ 200 LFM Order SpeedClipsTM 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 227-167 252-167 237-167AB2 252-167AB2 237-167AB2-24 252-167AB2-24 NATURAL AND FORCED CONVECTION CHARACTERISTICS 237 AND 252 SERIES 237-167AB3 252-167AB3 237 AND 252 SERIES 237-167AB3 252-167AB3 291 SERIES Standard P/N Dimensions: in. (mm) Labor-Saving Clip-on Heat Sinks Height Above PC Board in. (mm) Vertical Mounting Footprint Dimensions in. (mm) TO-220 Mounting Style Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) TO-220 (Clip) 80C @ 2W 24C/W @ 600 LFM 0.0026 (1.18) 291-H36AB 0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) TO-220 (Mtg. Hole) 68C @ 2W 16C/W @ 600 LFM 0.0026 (1.18)) Material: Aluminum, Black Anodized Designed for mounting horizontally or vertically on a circuit board, 291 Series One type is available with a locking clip and one with a 0.140 in. (3.6) diameter heat sinks employ a unique clip for attachment of TO-220 case styles. mounting hole only. 291 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 291-C2 291-H 35 WTS001_p26-49 6/14/07 10:55 AM Page 36 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks TO-220 See also 286DB Series on Page 7. Standard P/N Height Above PC Board in. (mm) Maximum Footprint in. (mm) Material 286-AB 286-CBTE 286-CTE 1.190 (30.2) 1.190 (30.2) 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) Aluminum, Anodized Copper, Black Copper, Tinned Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wavesoldered directly to MECHANICAL DIMENSIONS Thermal Performance at Typical Load Natural Forced Convection Convection 58C @ 4W 58C @ 4W 58C @ 4W Weight lbs. (grams) 7.4CW @ 200 LFM 7.4CW @ 200 LFM 7.4CW @ 200 LFM 0.0085 (3.86) 0.0250 (11.34) 0.0250 (11.34) the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned). NATURAL AND FORCED CONVECTION CHARACTERISTICS 286 SERIES Dimensions: in. (mm) 287 SERIES Wave-Solderable Low-Cost Heat Sinks Standard P/N Mounting Slot Mounting Hole Height Above PC Board in. (mm) 287-1ABE 287-1ABH 1.180 (30.0) 287-2ABE 287-2ABH 1.180 (30.0) Material: Aluminum, Black Anodized Maximum Footprint "A" in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 1.000 (25.4) Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the MECHANICAL DIMENSIONS TO-220 65C @ 4W 55C @ 4W Weight lbs. (grams) 7.8CW @ 200 LFM 6.4CW @ 200 LFM 0.0090 (4.08) 0.0140 (6.35) board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO220 and similar semiconductor packages. 287 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Standard P/N 287-1AB 287-2AB 287-1ABH 287-2ABH Dim. "A" 0.500 (12.7) 1.000 (25.4) 0.500 (12.7) 1.000 (25.4) Dimensions: in. (mm) 285 & 330 SERIES Standard P/N 285 SC 330 SC 285 SC and 330 SC SpeedClipsTM Nominal Installed Loading Force For Use With Series Material Weight lbs. (grams) 10 lbs 4 lbs 232, 237, 240, 252, 667 232, 237, 240, 252, 667 Carbon Steel Stainless Steel 0.00053 (0.24) 0.00074 (0.34) SpeedClipsTM employ a locking safety tab for mounting. Must be ordered separately for these heat sink series. Use these SpeedClipsTM with our 237, 240, and 252 Series heat sinks for the lowest production assembly time and cost. Order MECHANICAL DIMENSIONS Dimensions: in. (mm) 36 Zif Socket 8 And 387 SPGA LIF one SpeedClipTM for each heat sink purchased. Must be purchased with heat sinks. Speed Clip 330 SC Speed Clip 285 SC 4 lb (17.8N) Nominal Force Installed 10 lb (44.5N) Nominal Force Installed WTS001_p26-49 6/14/07 10:55 AM Page 37 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 695 SERIES Standard P/N 695-1B Space-Saving Heat Sinks for Small Stud-Mounted Diodes Maximum Width in. (mm) Height in. (mm) 1.330 (33.8) 0.530 (13.7) Thermal Performance at Typical Load Natural Forced Convection Convection 72C @ 4.0W Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with an 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design 5.2C/W @ 400 LFM Weight lbs. (grams) 0.008 (4.0) provides good heat dissipation for use where height is limited above the printed circuit board or base plate. NATURAL AND FORCED CONVECTION CHARACTERISTICS 695 SERIES MECHANICAL DIMENSIONS STUD-MOUNT Dimensions: in. (mm) 260 SERIES Cup Clips for TO-5 Case Style Semiconductors Characteristics TO-5 Thermal Resistance - Epoxy Insulated Breakdown Voltage - Epoxy Type (VAC), 60 Hz Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating Dusty Conditions: % Hipot Rating Dirty Conditions: % Hipot Rating Temperature Range -- Continuous (C) 14 C/W 500 50 30 10 to 20 -73/+149 TO-5 Model Depth of Tapped Base 260-4T5E 260-4TH5E 0.093 (2.36) 0.125 (3.18) Thread Size: Mounting Style: 4 6 T S P = = = = = #4-40 UNC #6-32 UNC tapped stud plain Base Style: H = hex Semiconductor Case Style: 5 = TO-5 Insulation E = epoxy TO-5 CASE STYLE CUP CLIPS -- ORDERING GUIDE Standard P/N 260-4T5E 260-4TH5E 260-6SH5E Insulation Type Outline Dimension L x W x I.D. in. (mm) Weight lbs. (grams) Case Style Epoxy Insulated Epoxy Insulated Epoxy Insulated 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0024 (1.09) 0.0031 (1.41) 0.0037 (1.68) TO-5 TO-5 TO-5 Materials and Finish: Cups - beryllium copper, black ebonol "C"; Bases - brass, black ebonol "C" Base Mounting Configurations -- TO-5 Plain Type -- Epoxy bonded, or used with #4 pan head screws. Tapped Base -- #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. To determine the correct mounting screw lengths, add dimensions as follows: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness 37 WTS001_p26-49 6/14/07 10:56 AM Page 38 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 260 SERIES Epoxy Insulated For TO-5 260-4T5E 260-4TH5E 258 SERIES Standard P/N 258 260-6SH5E Thermal Links for Fused Glass Diodes DIODES Dimensions in. (mm) Material Finish 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Aluminum DeltaCoateTM 151 on all surfaces except solder pads and base The thermal resistance from diode leads to chassis or heat sink is 12C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10C/watt chassis or Weight lbs. (grams) 0.0018 (0.82) sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150C/watt to 22C/watt. MECHANICAL DIMENSIONS 258 SERIES Dimensions: in. (mm) 292 SERIES Standard P/N 292-AB Heat Sink for Single TO-92 TO-92 Height Above PC Board in. (mm) Overall Fin Width in. (mm) Thermal Performance Natural Convection Finish Weight lbs. (grams) 0.750 (19.1) 0. 600 (15.3) 0.225C/W @ 0.250 W Black Anodized 0.00049 (0.22) Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The MECHANICAL DIMENSIONS Dimensions: in. (mm) 38 292-AB is effective over the typical power range of such devices. Material: Aluminum, Black Anodized 292 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS WTS001_p26-49 6/14/07 10:56 AM Page 39 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABEP 634-10AB 634-15ABEP 634-15AB 634-20ABEP 634-20AB Material: Aluminum, Black Anodized. Height Above PC Board in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave- MECHANICAL DIMENSIONS TO-220 and TO-218 Footprint Dimensions in. (mm) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) Weight lbs. (grams) 0.016 (7.48 0.025 (11.21) 0.033 (14.95) solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. 634 SERIES TYPICAL THERMAL PERFORMANCE FOR 634-15ABP Notes: 1. Thermal compound is assumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. Dimensions: in. (mm) 637 SERIES Standard P/N High-Efficiency Heat Sinks For Vertical Board Mounting Height Above PC Board "A" in. (mm) 637-10ABEP 1.000 (25.4) 637-15ABEP 1.500 (38.1) 637-20ABEP 2.000 (50.8) 637-25ABEP 2.500 (63.5) Material: Aluminum, Black Anodized Maximum Footprint in. (mm) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and MECHANICAL DIMENSIONS 637 SERIES (EXTRUSION PROFILE 5183) TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 76C @ 6W 65C @ 6w 55C @ 6W 48C @ 6W 0.023 (10.43) 0.035 (15.88) 0.050 (22.68) 0.062 (28.12) 5.8C/W @ 200 LFM 5.5C/W @ 200 LFM 4.7C/W @ 200 LFM 4.2C/W @ 200 LFM board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products. NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 39 WTS001_p26-49 6/14/07 10:56 AM Page 40 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 667 SERIES Labor-Saving SpeedClipTM Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Standard P/N Standoff Pin Plain Pin Maximum Footprint in. (mm) TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 667-10ABESP 667-10ABPP 1.000 (25.4) 1.375 (34.9) x 0.500 (12.7) 667-15ABESP 667-15ABPP 1.500 (38.1) 1.375 (34.9) x 0.500 (12.7) 667-20ABESP 667-20ABPP 2.000 (50.8) 1.375 (34.9) x 0.500 (12.7) 667-25ABESP 667-25ABPP 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) Wave-solderable pins. Material: Aluminum, Black Anodized 76C @ 6W 66C @ 6W 58C @ 6W 48C @ 6W Weight lbs (grams) 5.8C/W @ 200 LFM 5.5C/W @ 200 LFM 4.7C/W @ 200 LFM 4.2C/W @ 200 LFM 0.0240 (11.0) 0.0340 (15.6) 0.0460 (21.0) 0.0580 (26.2) Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost. Note: Order 330 SC or 285 SC SpeedClipTM separately. 667 SERIES 0.044 (1.1) (STANDOFF) 0.156 (4.0) Dimensions: in. (mm) 626 & 627 SERIES Dimensions: in. (mm) 40 200 AIR VELOCITY (FPM) 400 600 800 Standard P/N Height Above PC Board "A" in. (mm) 626 AND 627 SERIES 1000 5 80 4 40 AB 0A BP 60 P 66710ABP 667-2 5ABP 25 7- 20 0 3 2 1 0 4 8 12 16 0 20 POWER DISSIPATION (WATTS) High-Efficiency Heat Sinks for Vertical Board Mounting 626-10ABEP 627-10ABP 1.000 (25.4) 626-15ABEP 627-15ABP 1.500 (38.1) 626-20ABEP 627-20ABP 2.000 (50.8) 626-25ABEP 627-25ABP 2.500 (63-5) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 10 lb Nominal Force Installed 0.130 (3.3) 0.125 (3.2) DIA RAISED BOSS x 0.030 (0.8) HIGH Standard P/N Speed Clip 285SC 0 THERMAL RESISTANCE SINK TO AMBIENT (C/WATT) 0.670 (17.0) A 0.062 (1.6) REF 4 lb Nominal Force Installed 0.093 (2.4) DIA 100 66 0.180 DIA (4.6) 1.000 (25.4) 0.730 (18.5) Speed Clip 330SC 7-1 1.375 (34.9) REF PLAIN PINS "PP" STANDOFF PINS "SP" 66 0.500 (12.7) REF NATURAL AND FORCED CONVECTION CHARACTERISTICS (EXTRUSION PROFILE 8073) 0.093 (2.4) DIA (NOMINAL) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT (C) MECHANICAL DIMENSIONS Maximum Footprint in. (mm) TO-218, TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 76C @ 6W 65C @ 6W 55C @ 6W 48C @ 6W NATURAL AND FORCED CONVECTION CHARACTERISTICS 5.8C/W @ 200 LFM 5.5C/W @ 200 LFM 4.7C/W @ 200 LFM 4.2C/M @ 200 LFM WTS001_p26-49 6/14/07 10:56 AM Page 41 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 647 SERIES High-Performance Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Standard P/N 647-1OABEP 1.000 (25.4) 647-15ABEP 1.500 (38.1) 647-175ABEP 1.750 (44.5) 647-20ABEP 2.000 (50.8) 647-25ABEP 2.500 (63.5) Material: Aluminum, Black Anodized Maximum Footprint in. (mm) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 42C @ 6W 37C @ 6W 34C @ 6W 31C @ 6W 25C @ 6W 0.055 (24.95) 0.075 (34.02) 0.090 (40.82) 0.104 (47.17) 0.125 (56.70) 3.8C/W @ 200 LFM 3.5C/W @ 200 LFM 3.3C/W @ 200 LFM 3.1C/W @ 200 LFM 2.8C/W @ 200 LFM Products section for thermal interface materials, 126 Series silicone-free thermal compounds, and other accessories products. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 647 SERIES (EXTRUSION PROFILE 5195) Dimensions: in. (mm) 657 SERIES Standard P/N High-Performance Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 657-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 657 SERIES TO-220, TO-247, TO-218 Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM Weight lbs (grams) 0.0515 (23.36) 0.0760 (34.60) 0.1030 (47.00) 0.1250 (57.00) NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) 41 WTS001_p26-49 6/14/07 10:56 AM Page 42 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 657 SERIES Standard P/N High-Performance Notched Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 657-10ABEPN 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABEPN 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABEPN 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABEPN 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 657 SERIES TO-220, TO-247, TO-218 Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) 657 SERIES Standard P/N High-Performance Heat Sinks with SpeedClipsTM for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 657-10ABEPSC 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABEPSC 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABEPSC 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABEPSC 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 657 SERIES 677 SERIES Standard P/N 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS High-Performance, High-Power Heat Sinks for Vertical Board Mounting Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 677-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 677-15ABEP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 677-20ABEP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 677-25ABEP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 677 SERIES 677 SERIES (EXTRUSION PROFILE 8719) 42 Thermal Performance at Typical Load Natural Forced Convection Convection 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) Dimensions: in. (mm) TO-220, TO-247, TO-218 TO-218, TO-220, TO-247 15-LEAD Multiwatt Thermal Performance at Typical Load Natural Forced Convection Convection 52C @ 6W 46C @ 6W 40C @ 6W 35C @ 6W 3.1C/W @ 200 LFM 2.8C/W @ 200 LFM 2.5C/W @ 200 LFM 2.2C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS WTS001_p26-49 6/14/07 10:56 AM Page 43 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES Standard P/N HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above PC Board in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection Outline Dimensions in. (mm) 690-3B 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized 1.860 (47.2)-sq 1.860 (47.2)-sq 1.860 (47.2)-sq These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power TO-3, TO-66, TO-220 44C @ 7.5W 44C @ 7.5W 44C @ 7.5W 2.0C/W @ 400 LFM 2.0C/W @ 400 LFM 2.0C/W @ 400 LFM Semiconductor Mounting Hole Pattern Weight lbs. (grams) (1) TO-3 (1) TO-66 (2) TO-220 0.0700 (31.75) 0.0700 (31.75) 0.0700 (31.75) semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91C. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES 690 SERIES TO-66 TO-3 *TWO TO-220'S Dimensions: in. (mm) 680 SERIES Standard P/N Maximum Efficiency Omnidirectional Heat Sinks Height Above PC Board "A" in. (mm) 680-5A 0.500 (12.7) 680-75A 0.750 (19.1) 680-10A 1.000 (25.4) 680-125A 1.250 (31.8) 680-5220 0.500 (12.7) 680-75220 0.750 (19.1) 680-10220 1.000 (25.4) 680-125220 1.250 (31.8) Material: Aluminum, Black Anodized Horizontal Mounting Footprint Dimensions in. (mm) MECHANICAL DIMENSIONS Thermal Performance at Typical Load Natural Forced Convection Convection 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in TO-3, TO-220 70C @ 7.5W 58C @ 7.5W 52C @ 7.5W 45C @ 7.5W 7OC @ 7.5W 58C @ 7.5W 52C @ 7.5W 45C @ 7.5W 3.0C/W @ 400 LFM 2.4C/W @ 400 LFM 2.0C/W @ 400 LFM 1.5C/W @ 400 LFM 3.0C/W @ 400 LFM 2.4C/W @ 400 LFM 2.0C/W @ 400 LFM 1.5C/W @ 400 LFM Semiconductor Mounting Hole Pattern Weight lbs. (grams) (1) TO-3 (1) TO-3 (1) TO-3 (1) TO-3 (2) TO-220 (2) TO-220 (2) TO-220 (2) TO-220 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix "K" (Example: 680-5K). 680 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A 220 K Dimensions: in. (mm) TO-3 *TWO TO-220'S 43 WTS001_p26-49 6/14/07 10:56 AM Page 44 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 & 603 SERIES Low-Height Heat Sinks Footprint Dimensions in. (mm) Standard P/N 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, Black Anodized DO-4/DO-5 Diodes Height in. (mm) Mounting Hole Dia. in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) 0.200 (5.1) 0.270 (6.9) None None 52C @ 5.0W 52C @ 5.0W 52C @ 5.0W 41C @ 5.0W Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient heat 4.5C/W @ 175 LFM 4.5C/W @ 175 LFM 4.5C/W @ 175 LFM 4.0C/W @ 175 LFM Weight lbs. (grams) 0.0500 (22.68) 0.0500 (22.68) 0.0500 (22.68) 0.0810 (36.74) dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 603 SERIES (EXTRUSION PROFILE 1284) 601 SERIES (EXTRUSION PROFILE 1284) SEMICONDUCTOR MOUNTING HOLES K E F Dimensions: in. (mm) 641 SERIES Standard P/N 641A 641K Maximum Performance Natural Convection Heat Sink for all Metal-Case Semiconductors Outline Dimensions in. (mm) Height in. (mm) Mounting Hole Pattern 4.125 (104.8) x 3.000 (76.2) 4.125 (104.8) x 3.000 (76.2) 1.000 (25.4) 1.000 (25.4) (1) TO-3 None Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 Series provides maximum performance in natural convection with an optimized heat sink surface area. The 641K type with an open channel area of MECHANICAL DIMENSIONS 44 36C @ 15W 36C @ 15W 0.9C/W @ 250 LFM 0.9C/W @ 250 LFM Weight lbs. (grams) 0.2900 (131.54) 0.2900 (131.54) 1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting requirements for most metal case power semiconductor types. Material: Aluminum Alloy, Black Anodized. 641 SERIES (EXTRUSION PROFILE 1371) NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES A Dimensions: in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection TO-3 K