TORX179P - Toshiba America Electronic Components, Inc.

TORX179P

2001-08-31

FIBER OPTIC RECEIVING MODULE

TORX179P

FIBER OPTIC RECEIVING MODULE

FOR DIGITAL AUDIO INTERFACE

 Conforms to JEITA Standard CP−1201 (For

Digital Audio Interface including Fiber Optic

inter−connections).

 Mini package type.

1. Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Storage Temperature Tstg −40 to 70 °C

Operating Temperature Topr −20 to 70 °C

Supply Voltage VCC −0.5 to 7 V

High Level Output Current IOH −1 mA

Low Level Output Current IOL 5 mA

Soldering Temperature Tsol 260 (Note 1) °C

Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package).

2. Recommended Operating Conditions

Characteristics Symbol Min Typ. Max Unit

Supply Voltage VCC 4.75 5.0 5.25 V

Unit: mm

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2001-08-31

3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V)

Characteristics Symbol Test Condition Min Typ. Max Unit

Data Rate NRZ Code (Note 2) 0.1 ― 12.8 Mb / s

Transmission Distance Using APF (Note 3),

Using TOTX179P 0.2 ― 5 m

Pulse Width Distortion (Note 4) ∆tw

Pulse Width = 78 ns

Pulse Cycle = 156 ns

CL = 10 pF

Using TOTX179P

−25 ― 25 ns

Maximum Receivable

Power (Note 5) PMAX 12.8 Mb / s, Using APF −14.5 ― ― dBm

Minimum Receivable

Power (Note 5) PMIN 12.8 Mb / s, Using APF ― ― −24 dBm

Current Consumption ICC ― 22 40 mA

High Level Output Voltage VOH 3.6 4.0 ― V

Low Level Output Voltage VOL ― 0.2 0.4 V

Note 2: When non−modulated signal (optical all high or all low level signal) is inputted, output signal is not stable.

When modulated optical high level signal is received, output signal is high. When modulated optical low level

signal is received, output signal is low. The duty factor must be maintained between 25 to 75%.

Note 3: All Plastic Fiber (970 / 1000 µm).

Note 4: Between input of transmitting module and output of TORX179P.

Note 5: BER ≤ 10−9, peak value.

4. Mechanical Characteristics (Ta = 25°C)

Characteristics Symbol Test Condition Min Typ. Max Unit

Insertion Force Using TOCP172, Initial value ― ― 39.2 N

Withdrawal Force Using TOCP172, Initial value 5.9 ― 39.2 N

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2001-08-31

5. Application Circuit

6. Required Optical Fiber with Fiber Optic Connectors

TOCP172−□□B

7. Board layout hole pattern (for reference)

Unit: mm

Recommended PCB thickness: 1.6 mm

8. Precautions on Use

(1) Maximum rating

The maximum ratings are the limit values which must not be exceeded during operation of device.

None of these rating value must not be exceeded. If the maximum rating value is exceeded, the

characteristics of devices may never be restored properly. In extreme cases, the device may be

permanently damages.

(2) Soldering

Optical modules are comprised of internal semiconductor devices. However, in principle, optical

modules are optical components. During soldering, ensure that flux does not contact with the emitting

surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.

Some optical modules come with a protective cap. The protective cap is used to avoid malfunction

when the optical module is not in use. Note that it is not dust or waterproof.

As mentioned before, optical modules are optical components. Thus, in principle, soldering where

there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend

that soldering be performed without the optical module mounted on the board. Then, after the board

has been cleaned, the optical module should be soldered on to the board manually.

If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make

sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the

effects of flux. In such a cases, be sure to check the devices' reliability.

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2001-08-31

(3) Noise resistance

It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber

is not affected by noise at all. However, receiving modules which handle signals whose level is

extremely small, are susceptible to noise.

TOSLINK improve noise resistance to use a conductive case. However, the current signal output by

the optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding

the case may not achieve sufficient noise resistance.

First systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to

check its noise resistance.

Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the

power supply used is significant, reinforce the filter.

The optical module is to be used in an area which is susceptible to radiated noise, increase the

shielding by covering the optical module and the power line filter with a metallic cover.

(4) Vibration and shock

This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to

vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or

stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in

the design of equipment which will be subject to high levels of vibration.

(5) Support pins

The TORX179P has support pins in order to fix itself to the PCB temporary. Please make the hole for

these pins in the PCB under the condition described in board layout hole pattern.

(6) Attaching the fiber optic receiving module

Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX179P to the printed

circuit board in order to fix it to the board.

(7) Solvent

When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to

pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off

using cotton tips.

(8) Protective cap

When the TORX179P is not in use, attach the protective cap.

(9) Supply voltage

Use the supply voltage within the recommended operating condition (VCC = 5 ± 0.25 V). Make sure

that supply voltage does not exceed the maximum rating value of 7 V, even for an instant.

(10) Output

If the receiver output is at low and is connected to the power supply, or if the output is high and is

connected to GND, the internal IC may be destroyed.

(11) Soldering condition

Solder at 260°C or less for no more than ten seconds.

(12) Precautions when disposing of devices and packing materials.

When disposing devices and packing materials, follow the procedures stipulated by local regulations

in order to protect the environment against contamination.

(13) Precautions during use

Toshiba is continually working to improve the quality and the reliability of their products.

Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical

sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when

utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the

malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to

property.

When developing equipment, please ensure that Toshiba products are used within the specified

operating ranges set forth in the most recent product specifications. Also, please keep in mind the

precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.

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2001-08-31

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

• The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk.

• Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes

are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the

products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with

domestic garbage.

• The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other

rights of the third parties which may result from its use. No license is granted by implication or otherwise under

any intellectual property or other rights of TOSHIBA CORPORATION or others.

• The information contained herein is subject to change without notice.

000707EAC

RESTRICTIONS O N PRODUCT USE