MECHANICAL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
MARKING SPECIFICATIONS
ENVIRONMENTAL/MECHANICAL SPECIFICATIONS
PARAMETER
Fine Leak Test
Gross Leak Test
Mechanical Shock
High Temperature Storage
Low Temperature Storage
Moisture Resistance
Solder Thermal Stability
Thermal Shock
Vibration
MANUFACTURER CATEGORY SERIES PACKAGE CLASS REV.DATE
ECLIPTEK CORP. CRYSTAL ECCM8 CERAMIC CR46 10/06
SUGGESTED SOLDER PAD LAYOUT
ALL DIMENSIONS IN MILLIMETERS
Tolerance = +0.2
TAPE AND REEL DIMENSIONS
ALL DIMENSIONS IN MILLIMETERS
M N O P Q
1.5 MIN 50 MIN 20.2 MIN 13±.5 40 MIN
R S T U V
QTY/REEL
2.5 MIN 10 MIN 18.4 MAX 180 MAX 12.4+2-0 1,000
REEL
A B C D E
12±.3 5.5±.1 4.75±.1 4 ±.1 2±.1
F G H J K L
4±.1 2.9±.1 1.5±.1 4.4±.1 .3 ±.05 1 ±.1
TAPE
*Compliant to EIA-481A
PACKAGING OPTIONS
Blank=Bulk, TR=Tape and Reel
FREQUENCY
PART NUMBERING GUIDE
ECCM8 A A - 16 - 32.000M TR
LOAD CAPACITANCE
10=10pF
12=12pF
16=16PF
MODE OF OPERATION
A=Fundamental
FREQUENCY TOLERANCE/STABILITY
A=±50ppm at 25°C, ±100ppm over 0°C to 70°C
B=±50ppm at 25°C, ±100ppm over -20°C to 70°C
C=±50ppm at 25°C, ±100ppm over -40°C to 85°C
D=±30ppm at 25°C, ±50ppm over 0°C to 70°C
E=±30ppm at 25°C, ±50ppm over -20°C to 70°C
F=±30ppm at 25°C, ±50ppm over -40°C to 85°C
G=±15ppm at 25°C, ±30ppm over 0°C to 70°C
H=±15ppm at 25°C, ±30ppm over -20°C to 70°C
J=±15ppm at 25°C, ±30ppm over -40°C to 85°C
K=±15ppm at 25°C, ±20ppm over 0°C to 70°C
L=±15ppm at 25°C, ±20ppm over -20°C to 70°C
M=±15ppm at 25°C, ±20ppm over -40°C to 85°C
N=±10ppm at 25°C, ±15ppm over 0°C to 70°C
P=±10ppm at 25°C, ±15ppm over -20°C to 70°C
Line 1: E XX.X
Frequency in MHz
(3 Digits Maximum + Decimal)
Line 2: XX Y ZZ
Week of Year
Last Digit of Year
Ecliptek Manufacturing Identifier
800-ECLIPTEK www.ecliptek.com for latest revision Specifications subject to change without notice.
Pad 1: Input/Output
Pad 2: Cover/Ground
Pad 3: Input/Output
Pad 4: Cover/Ground
SPECIFICATION
JIS C 6701 10.6 Leak Rate: 2.1x 10-9 Pa-m3/6 Maximum.
JIS C 6701 10.6 Leak Rate: 1.27 x 10-5 Pa-m3/8 Maximum.
Random drop on rigid hard wood surface 3 times at height of
75cm.
JIS C 7021 B-10: at 85°C for 1000 hours.
JIS C 7021 B-12: at -40°C for 1000 hours.
JIS C 7021 B-11: at 85°C and 90% humidity for 1000 hours.
Recommended Solder Reflow profile 1 time.
100 cycles over -40°C to +85°C for 30 minutes.
JIS C 6701 10.26: at 10Hz to 55Hz, 1.5mm amplitude for
1 minute. Test Time: X, Y, Z each direction for 2 hours.