TMS320TCI6482
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SPRS246K –APRIL 2005–REVISED MARCH 2012
TMS320TCI6482
Communications Infrastructure Digital Signal Processor
Check for Samples: TMS320TCI6482
1 Features
12 (FPGA, CPLD, ASICs, etc.)
• High-Performance Communications
Infrastructure DSP (TCI6482) – 32M-Byte Total Addressable External
Memory Space
– 1.17-, 1-, and 0.83-ns Instruction Cycle Time • Four 1x Serial RapidIO® Links (or One 4x),
– 850-MHz, 1-GHz, and 1.2-GHz Clock Rate v1.2 Compliant
– Eight 32-Bit Instructions/Cycle – 1.25-, 2.5-, 3.125-Gbps Link Rates
– 9600 MIPS/MMACS (16-Bits) – Message Passing, DirectIO Support, Error
– Commercial Temperature [0°C to 90°C] Mgmt Extensions, Congestion Control
– Extended Temperature [-40°C to 105°C] – IEEE 1149.6 Compliant I/Os
• TMS320C64x+™ DSP Core • DDR2 Memory Controller
– Dedicated SPLOOP Instruction – Interfaces to DDR2-533 SDRAM
– Compact Instructions (16-Bit) – 32-Bit/16-Bit, 533-MHz (data rate) Bus
– Instruction Set Enhancements – 512M-Byte Total Addressable External
– Exception Handling Memory Space
• TMS320C64x+ Megamodule L1/L2 Memory • EDMA3 Controller (64 Independent Channels)
Architecture: • 32-/16-Bit Host-Port Interface (HPI)
– 256K-Bit (32K-Byte) L1P Program Cache • 32-Bit 33-/66-MHz, 3.3-V Peripheral Component
[Direct Mapped] Interconnect (PCI) Master/Slave Interface
– 256K-Bit (32K-Byte) L1D Data Cache Conforms to PCI Local Bus Specification (v2.3)
[2-Way Set-Associative] • One Inter-Integrated Circuit (I2C) Bus
– 16M-Bit (2048K-Byte) L2 Unified Mapped • Two McBSPs
RAM/Cache [Flexible Allocation] • 10/100/1000 Mb/s Ethernet MAC (EMAC)
– 256K-Bit (32K-Byte) L2 ROM – IEEE 802.3 Compliant
– Time Stamp Counter – Supports Multiple Media Independent
• 2 RSAs for CDMA Processing Interfaces (MII, GMII, RMII, and RGMII)
– Dedicated RAKE, PATH_SEARCH and – 8 Independent Transmit (TX) and
RACH_SEARCH Instructions 8 Independent Receive (RX) Channels
– Transmit Processing Capability • Two 64-Bit General-Purpose Timers,
• Enhanced Viterbi Decoder Coprocessor (VCP2) Configurable as Four 32-Bit Timers
– Supports Over 694 7.95-Kbps AMR • UTOPIA
– Programmable Code Parameters – UTOPIA Level 2 Slave ATM Controller
• Enhanced Turbo Decoder Coprocessor (TCP2) – 8-Bit Transmit and Receive Operations up to
– Supports up to Eight 2-Mbps 3GPP 50 MHz per Direction
(6 Iterations) – User-Defined Cell Format up to 64 Bytes
– Programmable Turbo Code and Decoding • VLYNQ™ Port
Parameters – Full Duplex Serial Bus
• Endianess: Little Endian, Big Endian – Up to 4-Bit Transmit, 4-Bit Receive
• 64-Bit External Memory Interface (EMIFA) – Up to 125-MHz Operation
– Glueless Interface to Asynchronous • 16 General-Purpose I/O (GPIO) Pins
Memories (SRAM, Flash, and EEPROM) and • System PLL and PLL Controller
Synchronous Memories (SBSRAM, ZBT
SRAM) • Secondary PLL and PLL Controller, Dedicated
to EMAC and DDR2 Memory Controller
– Supports Interface to Standard Sync Devices
and Custom Logic • Advanced Event Triggering (AET) Compatible
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products conform to Copyright © 2005–2012, Texas Instruments Incorporated
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
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TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
www.ti.com
• Trace-Enabled Device (CTZ, GTZ, or ZTZ Suffix), 0.8-mm Ball Pitch
• IEEE-1149.1 (JTAG™) Boundary-Scan- • 0.09-μm/7-Level Cu Metal Process (CMOS)
Compatible • 3.3-/1.8-/1.5-/1.25-/1.2-V I/Os,
• 697-Pin Ball Grid Array (BGA) Package 1.25-/1.2-V Internal
1.1 CTZ/GTZ/ZTZ BGA Package (Bottom View)
Figure 1-1 shows the TMS320TCI6482 device 697-pin ball grid array package (bottom view).
Figure 1-1. CTZ/GTZ/ZTZ BGA Package (Bottom View)
1.2 Description
The TMS320C64x+™ DSPs (including the TMS320TCI6482 device) are the highest-performance fixed-
point DSP generation in the TMS320C6000™ DSP platform. The TCI6482 device is based on the third-
generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture
developed by Texas Instruments (TI), making these DSPs an excellent choice for applications including
video and telecom infrastructure, imaging/medical, and wireless infrastructure (WI). The C64x+™ devices
are upward code-compatible from previous devices that are part of the C6000™ DSP platform.
Based on 90-nm process technology and with performance of up to 9600 million instructions per second
(MIPS) [or 9600 16-bit MMACs per cycle] at a 1.2-GHz clock rate, the TCI6482 device offers cost-effective
solutions to high-performance DSP programming challenges. The TCI6482 DSP possesses the
operational flexibility of high-speed controllers and the numerical capability of array processors.
The C64x+ DSP core employs eight functional units, two register files, and two data paths. Like the earlier
C6000 devices, two of these eight functional units are multipliers or .M units. Each C64x+ .M unit doubles
the multiply throughput versus the C64x core by performing four 16-bit x 16-bit multiply-accumulates
(MACs) every clock cycle. Thus, eight 16-bit x 16-bit MACs can be executed every cycle on the C64x+
core. At a 1.2-GHz clock rate, this means 9600 16-bit MMACs can occur every second. Moreover, each
multiplier on the C64x+ core can compute one 32-bit x 32-bit MAC or four 8-bit x 8-bit MACs every clock
cycle.
The TCI6482 device includes Serial RapidIO®. This high bandwidth peripheral dramatically improves
system performance and reduces system cost for applications that include multiple DSPs on a board,
such as video and telecom infrastructures and medical/imaging.
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The TCI6482 DSP integrates a large amount of on-chip memory organized as a two-level memory system.
The level-1 (L1) program and data memories on the TCI6482 device are 32KB each. This memory can be
configured as mapped RAM, cache, or some combination of the two. When configured as cache, L1
program (L1P) is a direct mapped cache where as L1 data (L1D) is a two-way set associative cache. The
level-2 (L2) memory is shared between program and data space and is 2048KB in size. L2 memory can
also be configured as mapped RAM, cache, or some combination of the two. The C64x+ Megamodule
also has a 32-bit peripheral configuration (CFG) port, an internal DMA (IDMA) controller, a system
component with reset/boot control, interrupt/exception control, a power-down control, and a free-running
32-bit timer for time stamp.
The peripheral set includes: an inter-integrated circuit bus module (I2C); two multichannel buffered serial
ports (McBSPs); an 8-bit Universal Test and Operations PHY Interface for Asynchronous Transfer Mode
(ATM) Slave [UTOPIA Slave] port; two 64-bit general-purpose timers (also configurable as four 32-bit
timers); a user-configurable 16-bit or 32-bit host-port interface (HPI16/HPI32); a peripheral component
interconnect (PCI); a 16-pin general-purpose input/output port (GPIO) with programmable interrupt/event
generation modes; an 10/100/1000 Ethernet media access controller (EMAC), which provides an efficient
interface between the TCI6482 DSP core processor and the network; a management data input/output
(MDIO) module (also part of the EMAC) that continuously polls all 32 MDIO addresses in order to
enumerate all PHY devices in the system; a 4-bit transmit, 4-bit receive VLYNQ interface; a glueless
external memory interface (64-bit EMIFA), which is capable of interfacing to synchronous and
asynchronous peripherals; and a 32-bit DDR2 SDRAM interface.
The I2C ports on the TCI6482 device allows the DSP to easily control peripheral devices and
communicate with a host processor. In addition, the standard multichannel buffered serial port (McBSP)
may be used to communicate with serial peripheral interface (SPI) mode peripheral devices.
The VLYNQ interface provides a standard high-speed serial interface to a variety of TI devices that can
supplement the processing power or external connectivity of the TCI6482 device. This supports host-to-
peripheral or peer-to-peer communication modes.
The TCI6482 DSP has a complete set of development tools which includes: a new C compiler, an
assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for
visibility into source code execution.
The C64x+ CPU has two tightly coupled Rake/Search Accelerators (RSAs) for Code Division Multiple
Access (CDMA) to assist with chip rate processing in Base Transceiver Systems (BTS).
Copyright © 2005–2012, Texas Instruments Incorporated Features 3
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MDIO
EMAC
10/100/1000
Serial
RapidIO
DDR2
Mem Ctlr
64
TCI6482
HI
I/O Devices
VCP2
I2C
16
RMGII(D)
L2
Cache
Memory
2048K
Bytes
TCP2
HPI (32/16)(B)
DDR2 SDRAM 32
LO
Timer1(C)
VLYNQ
PLL2 and
PLL2
Controller(D)
GMII
RMII
MII
Primary
Switched
Central
Resource
L2 Memory Controller
(Memory Protect/
Bandwidth Mgmt)
System
C64x+ DSP Core
Data Path B
B Register File
B31−B16
B15−B0
Instruction Fetch
Data Path A
A Register File
A31−A16
A15−A0
.L1 .S1
.M1
xx
xx
.D1 .D2
.M2
xx
xx
.S2 .L2
Internal DMA
(IDMA)
M
e
g
a
m
o
d
u
l
e
L1P Memory Controller (Memory Protect/Bandwidth Mgmt)
Instruction
Decode
16-/32-bit
Instruction Dispatch
Power Control
L1D Memory Controller (Memory Protect/Bandwidth Mgmt)
Interrupt and Exception Controller
EMIFA
HI
LO
Timer1(C)
EDMA 3.0
Secondary
Switched Central
Resource
PLL1 and
PLL1
Controller
Device
Configuration
Logic
Boot Configuration
L1D SRAM/Cache
2-Way Set-Associative
32K Bytes Total
RSA RSA
L1P SRAM/Cache Direct-Mapped
32K Bytes
L2 ROM
32K
Bytes(E)
Control Registers
SPLOOP Buffer
In-Circuit Emulation
PCI66(B)
UTOPIA(B)
GPIO16(B)
McBSP1(A)
McBSP0(A)
A. McBSPs: Framing Chips - H.100, MVIP, SCSA, T1, E1; AC97 Devices; SPI Devices; Codecs.
B. The PCI peripheral pins are muxed with some of the HPI peripheral pins and the UTOPIA address pins.
For more detailed information, see the section.
C. Each of the TIMER peripherals (TIMER1 and TIMER0) is configurable as a 64-bit general-purpose timer, dual 32-bit general-purpose timers,
or a watchdog timer.
D. The PLL2 controller also generates clocks for the EMAC.
E. When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
Device Configuration
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
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1.3 Functional Block Diagram
Figure 1-2 shows the functional block diagram of the TCI6482 device.
Figure 1-2. Functional Block Diagram
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1 Features ................................................... 16 Rake Search Accelerator (RSA) .................... 99
1.1 CTZ/GTZ/ZTZ BGA Package (Bottom View) ........ 27 Device Operating Conditions ...................... 100
7.1 Absolute Maximum Ratings Over Operating Case
1.2 Description ........................................... 2Temperature Range (Unless Otherwise Noted) .. 100
1.3 Functional Block Diagram ........................... 47.2 Recommended Operating Conditions ............. 100
Revision History .............................................. 67.3 Electrical Characteristics Over Recommended
2 Device Overview ........................................ 7Ranges of Supply Voltage and Operating Case
2.1 Device Characteristics ............................... 7Temperature (Unless Otherwise Noted) .......... 102
2.2 CPU (DSP Core) Description ........................ 88 C64x+ Peripheral Information and Electrical
Specifications ......................................... 105
2.3 Memory Map Summary ............................ 11 8.1 Parameter Information ............................ 105
2.4 Boot Sequence ..................................... 13 8.2 Recommended Clock and Control Signal Transition
2.5 Pin Assignments .................................... 16 Behavior ........................................... 107
2.6 Signal Groups Description ......................... 20 8.3 Power Supplies .................................... 107
2.7 Terminal Functions ................................. 26 8.4 Enhanced Direct Memory Access (EDMA3)
2.8 Development ........................................ 51 Controller .......................................... 109
3 Device Configuration ................................. 55 8.5 Interrupts .......................................... 124
3.1 Device Configuration at Device Reset ............. 55 8.6 Reset Controller ................................... 128
3.2 Peripheral Configuration at Device Reset .......... 57 8.7 PLL1 and PLL1 Controller ......................... 136
3.3 Peripheral Selection After Device Reset ........... 59 8.8 PLL2 and PLL2 Controller ......................... 151
3.4 Device State Control Registers ..................... 61 8.9 DDR2 Memory Controller ......................... 160
3.5 Device Status Register Description ................ 72 8.10 External Memory Interface A (EMIFA) ............ 162
3.6 JTAG ID (JTAGID) Register Description ........... 74 8.11 I2C Peripheral ..................................... 173
3.7 Pullup/Pulldown Resistors .......................... 75 8.12 Host-Port Interface (HPI) Peripheral .............. 178
3.8 Configuration Examples ............................ 75 8.13 Multichannel Buffered Serial Port (McBSP) ....... 189
4 System Interconnect .................................. 78 8.14 Ethernet MAC (EMAC) ............................ 203
4.1 Internal Buses, Bridges, and Switch Fabrics ....... 78 8.15 Timers ............................................. 221
4.2 Data Switch Fabric Connections ................... 79 8.16 Enhanced Viterbi-Decoder Coprocessor (VCP2) .223
4.3 Configuration Switch Fabric ........................ 81 8.17 Enhanced Turbo Decoder Coprocessor (TCP2) .. 224
4.4 Bus Priorities ....................................... 83 8.18 Peripheral Component Interconnect (PCI) ........ 226
5 C64x+ Megamodule ................................... 84 8.19 UTOPIA ........................................... 233
5.1 Memory Architecture ............................... 84 8.20 Serial RapidIO (SRIO) Port ....................... 237
5.2 Memory Protection ................................. 86 8.21 VLYNQ Peripheral ................................. 249
5.3 Bandwidth Management ............................ 87 8.22 General-Purpose Input/Output (GPIO) ............ 252
5.4 Power-Down Control ............................... 88 8.23 Emulation Features and Capability ............... 254
5.5 Megamodule Resets ............................... 88 9 Mechanical Data ...................................... 256
5.6 Megamodule Revision .............................. 89 9.1 Thermal Data ...................................... 256
5.7 C64x+ Megamodule Register Descriptions ........ 90 9.2 Packaging Information ............................ 256
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
This data manual revision history highlights the technical changes made to the document in this revision.
Scope: Applicable updates to the C64x device family, specifically relating to the TMS320TCI6482 device,
have been incorporated.
TCI6482 DSP Revision History
SEE ADDITIONS/MODIFICATIONS/DELETIONS
Section 8.7.1.1 Internal Clocks and Maximum Operating Frequencies:
Modified values for SYSCLK2 and SYSCLK3 in fifth paragraph
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2 Device Overview
2.1 Device Characteristics
Table 2-1, provides an overview of the TCI6482 DSP. The tables show significant features of the TCI6482
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type
with pin count.
Table 2-1. Characteristics of the TCI6482 Processor
HARDWARE FEATURES TCI6482
EMIFA (64-bit bus width) 1
(clock source = AECLKIN or SYSCLK4)
DDR2 Memory Controller (32-bit bus width) [1.8 V I/O] 1
(clock source = CLKIN2)
EDMA3 (64 independent channels) [CPU/3 clock rate] 1
High-speed 1x/4x Serial Rapid IO Port 1
I2C 1
Peripherals HPI (32- or 16-bit user selectable) 1 (HPI16 or HPI32)
Not all peripherals pins PCI (32-bit), [66-MHz or 33-MHz] 1 (PCI66 or PCI33)
are available at the same McBSPs (internal CPU/6 or external clock source up
time (for more detail, see 2
to 100 Mbps)
Section 3,Device
Configuration). UTOPIA (8-bit mode, 50-MHz, slave-only) 1
10/100/1000 Ethernet MAC (EMAC) 1
Management Data Input/Output (MDIO) 1
64-Bit Timers (Configurable) 2 64-bit or 4 32-bit
(internal clock source = CPU/6 clock frequency)
VLYNQ (VCLK or SYSCLK4) 1
General-Purpose Input/Output Port (GPIO) 16
VCP2 (clock source = CPU/3 clock frequency) 1
Decoder Coprocessors TCP2 (clock source = CPU/3 clock frequency) 1
Size (Bytes) 2192K
32K-Byte (32KB) L1 Program Memory Controller
[SRAM/Cache]
On-Chip Memory Organization 32KB Data Memory Controller [SRAM/Cache]
2048KB L2 Unified Memory/Cache
32KB L2 ROM
C64x+ Megamodule Megamodule Revision ID Register (address location: See Section 5.6,Megamodule Revision
Revision ID 0181 2000h) See Section 3.6,JTAG ID (JTAGID) Register
JTAG BSDL_ID JTAGID register (address location: 0x02A80008) Description
Frequency MHz 850, 1000 (1 GHz), and 1200 (1.2 GHz)
1.17 ns (TCI6482-850),
Cycle Time ns 1 ns (TCI6482 A-1000, -1000) [1-GHz CPU](1)
0.83 ns (TCI6482-1200) [1.2-GHz CPU]
1.25 V (A-1000/-1000/-1200)
Core (V) 1.2 V (-850)
Voltage 1.25/1.2 [RapidIO],
I/O (V) 1.5/1.8 [EMAC RGMII], and
1.8 and 3.3 V [I/O Supply Voltage]
PLL1 and PLL1 CLKIN1 frequency multiplier Bypass (x1), x15, x20, x25, x30, x32
Controller Options CLKIN2 frequency multiplier
PLL2 x20
[DDR2 Memory Controller and EMAC support only]
(1) The extended temperature device's (A-1000) electrical characteristics and ac timings are the same as those for the corresponding
commercial temperature devices (-1000).
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Table 2-1. Characteristics of the TCI6482 Processor (continued)
HARDWARE FEATURES TCI6482
697-Pin Flip-Chip Plastic BGA (CTZ)
BGA Package 24 x 24 mm 697-Pin Plastic BGA (GTZ)
697-Pin Flip-Chip Plastic BGA (ZTZ)
Process Technology μm 0.09 μm
Product Preview (PP), Advance Information (AI),
Product Status(2) PD
or Production Data (PD) TMS320TCI6482CTZ7/GTZ7/ZTZ8
(For more details on the C64x+™ DSP part
Device Part Numbers TMS320TCI6482CTZ/GTZ/ZTZ
numbering, see Figure 2-13)TMS320TCI6482CTZ2/GTZ2/ZTZ2
(2) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
2.2 CPU (DSP Core) Description
The C64x+ Central Processing Unit (CPU) consists of eight functional units, two register files, and two
data paths as shown in Figure 2-1. The two general-purpose register files (A and B) each contain 32 32-
bit registers for a total of 64 registers. The general-purpose registers can be used for data or can be data
address pointers. The data types supported include packed 8-bit data, packed 16-bit data, 32-bit data, 40-
bit data, and 64-bit data. Values larger than 32 bits, such as 40-bit-long or 64-bit-long values are stored in
register pairs, with the 32 LSBs of data placed in an even register and the remaining 8 or 32 MSBs in the
next upper register (which is always an odd-numbered register).
The eight functional units (.M1, .L1, .D1, .S1, .M2, .L2, .D2, and .S2) are each capable of executing one
instruction every clock cycle. The .M functional units perform all multiply operations. The .S and .L units
perform a general set of arithmetic, logical, and branch functions. The .D units primarily load data from
memory to the register file and store results from the register file into memory.
The C64x+ CPU extends the performance of the C64x core through enhancements and new features.
Each C64x+ .M unit can perform one of the following each clock cycle: one 32 x 32 bit multiply, two
16 x 16 bit multiplies, two 16 x 32 bit multiplies, four 8 x 8 bit multiplies, four 8 x 8 bit multiplies with add
operations, and four 16 x 16 multiplies with add/subtract capabilities (including a complex multiply). There
is also support for Galois field multiplication for 8-bit and 32-bit data. Many communications algorithms
such as FFTs and modems require complex multiplication. The complex multiply (CMPY) instruction takes
for 16-bit inputs and produces a 32-bit real and a 32-bit imaginary output. There are also complex
multiplies with rounding capability that produces one 32-bit packed output that contain 16-bit real and 16-
bit imaginary values. The 32 x 32 bit multiply instructions provide the extended precision necessary for
audio and other high-precision algorithms on a variety of signed and unsigned 32-bit data types.
The .L or (Arithmetic Logic Unit) now incorporates the ability to do parallel add/subtract operations on a
pair of common inputs. Versions of this instruction exist to work on 32-bit data or on pairs of 16-bit data
performing dual 16-bit add and subtracts in parallel. There are also saturated forms of these instructions.
The C64x+ core enhances the .S unit in several ways. In the C64x core, dual 16-bit MIN2 and MAX2
comparisons were only available on the .L units. On the C64x+ core they are also available on the .S unit
which increases the performance of algorithms that do searching and sorting. Finally, to increase data
packing and unpacking throughput, the .S unit allows sustained high performance for the quad 8-bit/16-bit
and dual 16-bit instructions. Unpack instructions prepare 8-bit data for parallel 16-bit operations. Pack
instructions return parallel results to output precision including saturation support.
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Other new features include:
•SPLOOP - A small instruction buffer in the CPU that aids in creation of software pipelining loops where
multiple iterations of a loop are executed in parallel. The SPLOOP buffer reduces the code size
associated with software pipelining. Furthermore, loops in the SPLOOP buffer are fully interruptible.
•Compact Instructions - The native instruction size for the C6000 devices is 32 bits. Many common
instructions such as MPY, AND, OR, ADD, and SUB can be expressed as 16 bits if the C64x+
compiler can restrict the code to use certain registers in the register file. This compression is
performed by the code generation tools.
•Instruction Set Enhancements - As noted above, there are new instructions such as 32-bit
multiplications, complex multiplications, packing, sorting, bit manipulation, and 32-bit Galois field
multiplication.
•Exception Handling - Intended to aid the programmer in isolating bugs. The C64x+ CPU is able to
detect and respond to exceptions, both from internally detected sources (such as illegal op-codes) and
from system events (such as a watchdog time expiration).
•Privilege - Defines user and supervisor modes of operation, allowing the operating system to give a
basic level of protection to sensitive resources. Local memory is divided into multiple pages, each with
read, write, and execute permissions.
•Time-Stamp Counter - Primarily targeted for Real-Time Operating System (RTOS) robustness, a free-
running time-stamp counter is implemented in the CPU which is not sensitive to system stalls.
For more details on the C64x+ CPU and its enhancements over the C64x architecture, see the following
documents:
•TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732)
•TMS320C64x+ DSP Cache User's Guide (literature number SPRU862)
•TMS320C64x+ Megamodule Reference Guide (literature number SPRU871)
•TMS320C6455 Technical Reference (literature number SPRU965)
•TMS320C64x to TMS320C64x+ CPU Migration Guide (literature number SPRAA84)
Copyright © 2005–2012, Texas Instruments Incorporated Device Overview 9
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src2
src2
Á
Á
Á
Á
Á
Á
Á
.D1
.M1
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
.S1
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
.L1
long src
odd dst
src2
src1
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
Á
src1
src1
src1
even dst
even dst
odd dst
dst1
dst
src2
src2
src2
long src
DA1
ST1b
LD1b
LD1a
ST1a
Data path A
Odd
register
file A
(A1, A3,
A5...A31)
Á
Á
Á
Odd
register
file B
(B1, B3,
B5...B31)
Á
Á
Á
.D2
Á
Á
Á
Á
src1
dst
src2
DA2
LD2a
LD2b
src2
.M2 src1
Á
Á
Á
dst1
Á
Á
Á
.S2 src1
Á
Á
Á
Á
even dst
long src
odd dst
ST2a
ST2b
long src
.L2
Á
Á
Á
Á
even dst
odd dst
Á
Á
Á
src1
Data path B
Control Register
32 MSB
32 LSB
dst2 (A)
32 MSB
32 LSB
2x
1x
32 LSB
32 MSB
32 LSB
32 MSB
dst2
(B)
(B)
(A)
8
8
8
8
32
32
32
32
(C)
(C)
Even
register
file A
(A0, A2,
A4...A30)
Even
register
file B
(B0, B2,
B4...B30)
(D)
(D)
(D)
(D)
A. On .M unit, dst2 is 32 MSB.
B. On .M unit, dst1 is 32 LSB.
C. On C64x CPU .M unit, src2 is 32 bits; on C64x+ CPU .M unit, src2 is 64 bits.
D. On .L and .S units, odd dst connects to odd register files and even dst connects to even register files.
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
www.ti.com
Figure 2-1. TMS320C64x+™ CPU (DSP Core) Data Paths
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2.3 Memory Map Summary
Table 2-2 shows the memory map address ranges of the TCI6482 device. The external memory
configuration register address ranges in the TCI6482 device begin at the hex address location 0x7000
0000 for EMIFA and hex address location 0x7800 0000 for DDR2 Memory Controller.
Table 2-2. TCI6482 Memory Map Summary
MEMORY BLOCK DESCRIPTION BLOCK SIZE (BYTES) HEX ADDRESS RANGE
Reserved 1024K 0000 0000 - 000F FFFF
Internal ROM 32K 0010 0000 - 0010 7FFF
Reserved 7M - 32K 0010 8000 - 007F FFFF
Internal RAM (L2) [L2 SRAM] 2M 0080 0000 - 009F FFFF
Reserved 4M 00A0 0000 - 00DF FFFF
L1P SRAM 32K 00E0 0000 - 00E0 7FFF
Reserved 1M - 32K 00E0 8000 - 00EF FFFF
L1D SRAM 32K 00F0 0000 - 00F0 7FFF
Reserved 1M - 32K 00F0 8000 - 00FF FFFF
Reserved 8M 0100 0000 - 017F FFFF
C64x+ Megamodule Registers 4M 0180 0000 - 01BF FFFF
Reserved 12.5M 01C0 0000 - 0287 FFFF
HPI Control Registers 256K 0288 0000 - 028B FFFF
McBSP 0 Registers 256K 028C 0000 - 028F FFFF
McBSP 1 Registers 256K 0290 0000 - 0293 FFFF
Timer 0 Registers 256K 0294 0000 - 0297 FFFF
Timer 1 Registers 128K 0298 0000 - 0299 FFFF
PLL1 Controller (including Reset Controller) Registers 512 029A 0000 - 029A 01FF
Reserved 256K - 512 029A 0200 - 029B FFFF
PLL2 Controller Registers 512 029C 0000 - 029C 01FF
Reserved 64K 029C 0200 - 029C FFFF
EDMA3 Channel Controller Registers 32K 02A0 0000 - 02A0 7FFF
Reserved 96K 02A0 8000 - 02A1 FFFF
EDMA3 Transfer Controller 0 Registers 32K 02A2 0000 - 02A2 7FFF
EDMA3 Transfer Controller 1 Registers 32K 02A2 8000 - 02A2 FFFF
EDMA3 Transfer Controller 2 Registers 32K 02A3 0000 - 02A3 7FFF
EDMA3 Transfer Controller 3 Registers 32K 02A3 8000 - 02A3 FFFF
Reserved 256K 02A4 0000 - 02A7 FFFF
Chip-Level Registers 256K 02A8 0000 - 02AB FFFF
Device State Control Registers 256K 02AC 0000 - 02AF FFFF
GPIO Registers 16K 02B0 0000 - 02B0 3FFF
I2C Data and Control Registers 256K 02B0 4000 - 02B3 FFFF
UTOPIA Control Registers 512 02B4 0000 - 02B4 01FF
Reserved 256K - 512 02B4 0200 - 02B7 FFFF
VCP2 Control Registers 128K 02B8 0000 - 02B9 FFFF
TCP2 Control Registers 128K 02BA 0000 - 02BB FFFF
Reserved 256K 02BC 0000 - 02BF FFFF
PCI Control Registers 256K 02C0 0000 - 02C3 FFFF
Reserved 256K 02C4 0000 - 02C7 FFFF
EMAC Control 4K 02C8 0000 - 02C8 0FFF
EMAC Control Module Registers 2K 02C8 1000 - 02C8 17FF
MDIO Control Registers 2K 02C8 1800 - 02C8 1FFF
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Table 2-2. TCI6482 Memory Map Summary (continued)
MEMORY BLOCK DESCRIPTION BLOCK SIZE (BYTES) HEX ADDRESS RANGE
EMAC Descriptor Memory 8K 02C8 2000 - 02C8 3FFF
Reserved 496K 02C8 4000 - 02CF FFFF
RapidIO Control Registers 256K 02D0 0000 - 02D3 FFFF
Reserved 768K 02D4 0000 - 02DF FFFF
RapidIO CPPI RAM 16K 02E0 0000 - 02E0 3FFF
Reserved 2M - 16K 02E0 4000 - 02FF FFFF
Reserved 16M 0300 0000 - 03FF FFFF
Reserved 192M 0400 0000 - 0FFF FFFF
Reserved 256M 1000 0000 - 1FFF FFFF
Reserved 256M 2000 0000 - 2FFF FFFF
McBSP 0 Data 256 3000 0000 - 3000 00FF
Reserved 64M - 256 3000 0100 - 33FF FFFF
McBSP 1 Data 256 3400 0000 - 3400 00FF
Reserved 64M - 256 3400 0100 - 37FF FFFF
VLYNQ 64M 3800 0000 - 3BFF FFFF
UTOPIA Receive (Rx) Data Queue 1K 3C00 0000 - 3C00 03FF
UTOPIA Transmit (Tx) Data Queue 1K 3C00 0400 - 3C00 07FF
Reserved 16M - 2K 3C00 0800 - 3CFF FFFF
Reserved 48M 3D00 0000 - 3FFF FFFF
PCI External Memory Space 256M 4000 0000 - 4FFF FFFF
TCP2 Data Registers 128M 5000 0000 - 57FF FFFF
VCP2 Data Registers 128M 5800 0000 - 5FFF FFFF
Reserved 256M 6000 0000 - 6FFF FFFF
EMIFA (EMIF64) Configuration Registers 128M 7000 0000 - 77FF FFFF
DDR2 Memory Controller Configuration Registers 128M 7800 0000 - 7FFF FFFF
Reserved 256M 8000 0000 - 8FFF FFFF
Reserved 256M 9000 0000 - 9FFF FFFF
EMIFA CE2 - SBSRAM/Async(1) 8M A000 0000 - A07F FFFF
Reserved 256M - 8M A080 0000 - AFFF FFFF
EMIFA CE3 - SBSRAM/Async(1) 8M B000 0000 - B07F FFFF
Reserved 256M - 8M B080 0000 - BFFF FFFF
EMIFA CE4 - SBSRAM/Async(1) 8M C000 0000 - C07F FFFF
Reserved 256M - 8M C080 0000 - CFFF FFFF
EMIFA CE5 - SBSRAM/Async(1) 8M D000 0000 - D07F FFFF
Reserved 256M - 8M D080 0000 - DFFF FFFF
DDR2 Memory Controller CE0 - DDR2 SDRAM 512M E000 0000 - FFFF FFFF
(1) The EMIFA CE0 and CE1 are not functionally supported on the TCI6482 device and, therefore, are not pinned out.
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2.4 Boot Sequence
The boot sequence is a process by which the DSP's internal memory is loaded with program and data
sections and the DSP's internal registers are programmed with predetermined values. The boot sequence
is started automatically after each power-on reset, warm reset, max reset, and system reset. For more
details on the initiators of these resets, see Section 8.6,Reset Controller.
There are several methods by which the memory and register initialization can take place. Each of these
methods is referred to as a boot mode. The boot mode to be used is selected at reset through the
BOOTMODE[3:0] pins.
Each boot mode can be classified as a hardware boot mode or as a software boot mode. Software boot
modes require the use of the on-chip bootloader. The bootloader is DSP code that transfers application
code from an external source into internal or external program memory after the DSP is taken out of reset.
The bootloader is permanently stored in the internal ROM of the DSP starting at byte address 0010
0000h. Hardware boot modes are carried out by the boot configuration logic. The boot configuration logic
is actual hardware that does not require the execution of DSP code. Section 2.4.1,Boot Modes
Supported, describes each boot mode in more detail.
When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
Therefore, when using a software boot mode, care must be taken such that the CPU frequency does not
exceed 750 MHz at any point during the boot sequence. After the boot sequence has completed, the CPU
frequency can be programmed to the frequency required by the application.
2.4.1 Boot Modes Supported
The TCI6482 device has six boot modes:
• No boot (BOOTMODE[3:0] = 0000b)
With no boot, the CPU executes directly from the internal L2 SRAM located at address 0x80 0000.
Note: device operations is undefined if invalid code is located at address 0x80 0000. This boot mode is
a hardware boot mode.
• Host boot (BOOTMODE[3:0] = 0001b and BOOTMODE[3:0] = 0111b)
If host boot is selected, after reset, the CPU is internally "stalled" while the remainder of the device is
released. During this period, an external host can initialize the CPU's memory space as necessary
through Host Port Interface (HPI) or the Peripheral Component Interconnect (PCI) interface. Internal
configuration registers, such as those that control the EMIF can also be initialized by the host with two
exceptions: Device State Control registers (Section 3.4), PLL1 and PLL2 Controller registers
(Section 8.7 and Section 8.8) cannot be accessed through any host interface, including HPI and PCI.
Once the host is finished with all necessary initialization, it must generate a DSP interrupt (DSPINT) to
complete the boot process. This transition causes boot configuration logic to bring the CPU out of the
"stalled" state. The CPU then begins execution from the internal L2 SRAM located at 0x80 0000. Note
that the DSP interrupt is registered in bit 0 (channel 0) of the EDMA Event Register (ER). This event
must be cleared by software before triggering transfers on DMA channel 0.
All memory, with the exceptions previously described, may be written to and read by the host. This
allows for the host to verify what it sends to the DSP if required. After the CPU is out of the "stalled"
state, the CPU needs to clear the DSPINT, otherwise, no more DSPINTs can be received.
As previously mentioned, for the TCI6482 device, the Host Port Interface (HPI) and the Peripheral
Component Interconnect (PCI) interface can be used for host boot. To use the HPI for host boot, the
PCI_EN pin (Y29) must be low [default] (enabling the HPI peripheral) and BOOTMODE[3:0] must be
set to 0001b at device reset. Conversely, to use the PCI interface for host boot, the PCI_EN pin (Y29)
must be high (enabling the PCI peripheral) and BOOTMODE[3:0] must be set to 0111b at device reset.
For the HPI host boot, the DSP interrupt can be generated through the use of the DSPINT bit in the
HPI Control (HPIC) register.
For the HPI host boot, the CPU is actually held in reset until a DSP interrupt is generated by the host.
The DSP interrupt can be generated through the use of the DSPINT bit in the HPI Control (HPIC)
register. Since the CPU is held in reset during HPI host boot, it will not respond to emulation software
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such as Code Composer Studio.
For the PCI host boot, the CPU is out of reset, but it executes an IDLE instruction until a DSP interrupt
is generated by the host. The host can generate a DSP interrupt through the PCI peripheral by setting
the DSPINT bit in the Back-End Application Interrupt Enable Set Register (PCIBINTSET) and the
Status Set Register (PCISTATSET).
Note that the HPI host boot is a hardware boot mode while the PCI host boot is a software boot mode.
If PCI boot is selected, the on-chip bootloader configures the PLL1 Controller such that CLKIN1 is
multiplied by 15. More specifically, PLLM is set to 0Eh (x15) and RATIO is set to 0 (÷1) in the PLL1
Multiplier Control Register (PLLM) and PLL1 Pre-Divider Register (PREDIV), respectively. The CLKIN1
frequency must not be greater than 50 MHz so that the maximum speed of the internal ROM, 750
MHz, is not violated. The CFGGP[2:0] pins must be set to 000b during reset for proper operation of the
PCI boot mode.
As mentioned previously, a DSP interrupt must be generated at the end of the host boot process to
begin execution of the loaded application. Since the DSP interrupt generated by the HPI and PCI is
mapped to the EDMA event DSP_EVT (DMA channel 0), it will get recorded in bit 0 of the EDMA
Event Register (ER). This event must be cleared by software before triggering transfers on DMA
channel 0.
• EMIFA 8-bit ROM boot (BOOTMODE[3:0] = 0100b)
After reset, the device will begin executing software out of an Asynchronous 8-bit ROM located in
EMIFA CE3 space using the default settings in the EMIFA registers. This boot mode is a hardware
boot mode.
• Master I2C boot (BOOTMODE[3:0] = 0101b)
After reset, the DSP can act as a master to the I2C bus and copy data from an I2C EEPROM or a
device acting as an I2C slave to the DSP using a predefined boot table format. The destination
address and length are contained within the boot table. This boot mode is a software boot mode.
• Slave I2C boot (BOOTMODE[3:0] = 0110b)
A Slave I2C boot is also implemented, which programs the DSP as an I2C Slave and simply waits for a
Master to send data using a standard boot table format.
Using the Slave I2C boot, a single DSP or a device acting as an I2C Master can simultaneously boot
multiple slave DSPs connected to the same I2C bus. Note that the Master DSP may require booting
via an I2C EEPROM before acting as a Master and booting other DSPs.
The Slave I2C boot is a software boot mode.
• Serial RapidIO boot (BOOTMODE[3:0] = 1000b through 1111b)
After reset, the following sequence of events occur:
– The on-chip bootloader configures device registers, including SerDes, and EDMA3
– The on-chip bootloader resets the peripheral's state machines and registers
– RapidIO ports send idle control symbols to initialize SerDes ports
– The host explores the system with RapidIO maintenance packets
– The host identifies, enumerates, and initializes the RapidIO device
– The host controller configures DSP peripherals through maintenance packets
– The application software is sent from the host controller to DSP memory
– The DSP CPU is awakened by interrupt such as a RapidIO DOORBELL packet
– The application software is executed and normal operation follows
For Serial RapidIO boot, BOOTMODE2 (L26 pin) is used in conjunction with CFGGP[2:0] (T26, U26,
and U25 pins, respectively) to determine the device address within the RapidIO network.
BOOTMODE2 is the MSB of the address, while CFGGP[2:0] are used as the three LSBs—giving the
user the opportunity to have up to 16 unique device IDs.
BOOTMODE[1:0] (L25 and P26, respectively) denote the configuration of the RapidIO peripheral; i.e.,
"00b" refers to RapidIO Configuration 0. For exact device RapidIO configurations, see the
TMS320TCI648x DSP Bootloader User's Guide (literature number SPRUEA7).
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The SRIO boot is a software boot mode.
2.4.2 2nd-Level Bootloaders
Any of the boot modes can be used to download a 2nd-level bootloader. A 2nd-level bootloader allows for
any level of customization to current boot methods as well as definition of a completely customized boot.
TI offers a few 2nd-level bootloaders, such as an EMAC bootloader and a UTOPIA bootloader, which can
be loaded using the Master I2C boot.
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AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
13121110987654321
13121110987654321
CLKR1/
GP[0]
HD15/
AD15
HD2/
AD2
URADDR0/
PGNT/
GP[12]
HD22/
AD22
DVDD33
RSV15
UXADDR1/
PIDSEL
RSV16
HDS1/
PSERR HINT/
PFRAME
DVDD33 HHWIL/
PCLK
VSS HD12/
AD12
HD24/
AD24 RSV03
HD20/
AD20
HD18/
AD18 HD6/
AD6
HD16/
AD16
VSS HD28/
AD28
HD17/
AD17
HD31/
AD31
HD14/
AD14
HCNTL1/
PDEVSEL
HR/W/
PCBE2
HRDY/
PIRDY
URADDR1/
PRST/
GP[13]
HD21/
AD21
DVDD33 VSS
EMU8
RSV36 EMU11
EMU1
EMU10
EMU12
RSV37
EMU15
EMU4
EMU13
DVDD33
DVDD33
VSS
EMU0
VSS
DVDD33
VRXD1/
DX0
VSCRUN/
CLKX0
VTXD1/
DX1/
GP[9] RSV38EMU6
VTXD2/
FSR1/
GP[10]
CLKX1/
GP[3]
VTXD3/
FSX1/
GP[11]
DVDD33
VSS
EMU18
DVDD33
EMU5
VSS
DVDD33
HD9/
AD9
HD23/
AD23
HD3/
AD3
HD10/
AD10
GP[6]
VSS EMU14
GP[7]
RSV02
HD4/
AD4
HD30/
AD30
CVDD
HD27/
AD27 VSS VSS VSS
DVDD33
VSS CVDD
CVDD
VSS
DVDD33
DVDD33 VSS
VSS DVDD33
VSS VSS
HD19/
AD19 HD13/
AD13 HD29/
AD29 DVDD33 DVDD33
HD25/
AD25 DVDD33
HD0/
AD0 VSS
HD11/
AD11 TOUTL0 EMU3 EMU7
VCLK/
CLKR0 TOUTL1
VSS DVDD33 VSS
DVDD33 VSS
HDS2/
PCBE1 HCNTL0/
PSTOP HCS/
PPERR
VSS
HD8/
AD8 VSS
HD26/
AD26 VSS
HD7/
AD7 HD1/
AD1
EMU2 RSV39 VSS
DVDD33
HAS/
PPAR
HD5/
AD5
AH TINPL0
VTXD0/
DR1/
GP[8] EMU17TDONMI EMU16
VRXD2/
FSR0
GP[4]VSS TRST TDI RSV27 EMU9
AJ TINPL1
VRXD0/
DR0 TMSVSS
CLKS RSV40
VRXD3/
FSX0
GP[5]DVDD33 DVDD33 TCK RSV26 SYSCLK4/
GP[1]
14
VSS
DVDD33
RESETSTAT
POR
VSS
CVDD
CVDD
RESET
DVDD33
VSS
15
AVDDA
VSS
DVDD33
RIOCLK
CVDD
VSS
VSS
RIOCLK
VSS
DVDD33
14 15
VSS
CVDD
CVDD
CVDD
VSS
VSS VSS
CVDD
DVDDRM
VSS
VSS
CVDD
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
AH
AJ
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
www.ti.com
2.5 Pin Assignments
2.5.1 Pin Map
Figure 2-2 through Figure 2-5 show the TCI6482 device pin assigments in four quadrants (A, B, C, and D).
Figure 2-2. TCI6482 Pin Map (Bottom View) [Quadrant A]
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AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
17 18 19 20 21 22 23 24 25 26 27 28 29
17 18 19 20 21 22 23 24 25 26 27 28 29
SDA
AED27
VSS
ASADS/
ASRE
AED17
AHOLD
PLLV1
AEA13/
LENDIAN
AEA4/
SYSCLKOUT
_EN
AEA5/
MCBSP1
_EN
AEA6/
PCI66
AECLKOUTACE5 ACE4
ABA0/
DDR2_EN
ABE7
ACE2 RSV41
AAOE/
ASOE
RSV42 RSV44
ABE2
ABE0
AED29
AED31
ACE3
AEA1/
CFGGP1
AEA11 AEA2/
CFGGP2
AEA14/
HPI_
WIDTH
AED21
DVDD33
VSS
VSS
VSS
DVDD33
AVDDT
DVDDR
VSS
VSS
RSV17
VSS
DVDD33
VSS
VSS
AVDDT
RIOTX0
DVDD33
VSS
DVDD33
VSS AED3VSS RIOTX1
AED7
AED1
SCL
AVDDA
VSS
AVDDT
RIOTX2
VSS
DVDD33
VSS
AED25
AED28
AED11
AED4
AED9
AED15RIOTX3
AED16
ABA1/
EMIFA_EN
RSV43
ABE1
DVDD12
AED24DVDD33
VSS
VSS
AED19
DVDD33
CVDD
CVDD
DVDD33
VSS
VSS
DVDD33
DVDD33
VSS
VSS
VSS
DVDD33
VSS
AED26VSS
DVDD33
AED22AED0
AED13AED12
AED10RIOTX0
AVDDT
RIOTX3
AED30DVDD33
AEA12/
UTOPIA_EN
VSS
VSS
VSS
VSS
RSV20
AEA0/
CFGGP0
VSS
DVDD33
AR/W
DVDD33
PCI_ENDVDD33
AED23
AAWE/
ASWE
RIOTX1RIOTX2DVDD33
ABE3
AEA3
AED8
AH
DVDD33 VSS
AVDDT RIORX0 AED14RIORX3 AED2 AED18 VSS
RIORX0VSS
VSS
VSS
RIORX3
AJ
VSS DVDD33
VSS RIORX1 AED5RIORX2 AED6 AED20 DVDD33
AVDDT
RIORX1RIORX2AVDDT
16
VSS
AVDDA
VSS
DVDD33
VSS
DVDD12
CVDD
VSS
DVDD33
VSS
16
VSS
CVDD
CVDD
DVDDRM
VSS
VSS
VSS
DVDDRM VSS
CVDD
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
AH
AJ
TMS320TCI6482
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SPRS246K –APRIL 2005–REVISED MARCH 2012
Figure 2-3. TCI6482 Pin Map (Bottom View) [Quadrant B]
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C
D
E
F
G
H
J
K
L
M
N
P
17 18 19 20 21 22 23 24 25 26 27 28 29
17 18 19 20 21 22 23 24 25 26 27 28 29
RSV09
AED52
DVDD33
VSS
VSS
VSS
AECLKIN
AEA9/
MACSEL0
CLKIN1
DVDD33
AEA15/
AECLKIN
_SEL
AED40AED44 AED42
AED34
ABE6 AED32
ABE4
AEA18/
BOOT
MODE2
AED37
ABUSREQ
AED46
AEA16/
BOOT
MODE0
AEA19/
BOOT
MODE3 AHOLDA
AEA10/
MACSEL1
VSS
VSS
DVDD18
DED19
VSS
CVDD
VSS DSDDQS2 DSDDQ
GATE2
DED23
DVDD18
DVDD33
DSDDQS3
DSDDQS3
VSS
DVDD18
RSV11
RSV12 RSV33DSDDQM2 DED26
VSS
RSV32
RSV23
VSS
VSS
DEA4
DEA1
AVDLL2
DVDD33
DVDD33
AED56
AED50
AED45
AED59
AED61
AED58DEA5
AED60
AED33
AEA17/
BOOT
MODE1
DSDDQ
GATE3
RSV19
AED55VSS
DVDD18
DVDD18
AED39
DVDD33
VSS
VSS
RSV30
DVDD33
VSS
VSS
DVDD18
VSS
DVDD18
DVDD18
AED35AED48AED54DVDD18
VSS
DVDD33
AED47
DVDD33
DVDD33
AED57DED27DSDDQS2
DEA0
AED41DSDDQM3
DVDD33
VSS
CVDD
VSS
CVDD
VSS
AEA8/
PCI_EEAI
RSV31
AED38
VSS
AARDY
VSS
AED36AED63
VSS
DED22DED18DEA6
ABE5
AEA7/
VLYNQ_
EN
AED43
B
DED29 DED31DVDD18 DED25 RSV22
DEA2 AED49 AED51 VSS
DVDD18
DED21DED16DEA7
A
DED28 DED30VSS DED24 DVDD18MON
DEA3 AED62 AED53 DVDD33
VSS
DED20DED17DEODT1
16
DVDD18
CVDD
DEODT0
DEA8
CVDD
VSS
VSS
DEA9
DEA10
DEA11
16
CVDD
VSS
VSS
CVDD
VSS CVDD
C
D
E
F
G
H
J
K
L
M
N
P
B
A
TMS320TCI6482
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Figure 2-4. TCI6482 Pin Map (Bottom View) [Quadrant C]
18 Device Overview Copyright © 2005–2012, Texas Instruments Incorporated
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A
D
E
F
G
H
J
K
L
M
N
P
13121110987654321
13121110987654321
RGRXD2
RGTXD3
DVDD33
UXDATA2/
MTXD2
VSS
UXDATA0/
MTXD0/
RMTXD0
CVDDMON
UXDATA6/
MTXD6
VSS
URADDR3/
PREQ/
GP[15]
URADDR2/
PINTA/
GP[14]
URDATA2/
MRXD2 URDATA3/
MRXD3
URDATA0/
MRXD0/
RMRXD0
VSS UXDATA3/
MTXD3
UXSOC/
MCOL
URDATA5/
MRXD5
UXDATA1/
MTXD1/
RMTXD1
DVDD15
UXDATA4/
MTXD4
URCLAV/
MCRS/
RMCRSDV
UXADDR0/
PTRDY
UXDATA7/
MTXD7
UXCLK/
MTCLK/
RMREFCLK
UXADDR4/
MDCLK
RGRXD3
DVDD18 DED1
DSDDQS0
DSDDQM0 DED2
DSDDQS0
DED6
DED7
DED8
DED9
DED10
DSDDQM1
DSDDQS1
DED15
DED14
VSS
RSV25
RSV35
RSV34
VSS
DVDD15 VSS
VSS
DVDD15
VSS
VSS
DSDWE
DSDRAS
DSDCAS
VSS
DED3
RSV29
DVDD33
RGTXD0
RGTXD1
RGREFCLK
RGTXCTL
DVDD15MON
RGRXD1 RSV18
RSV13
UXCLAV/
GMTCLK
UXDATA5/
MTXD5
DSDDQ
GATE0 DED0
DVDD15 DED12 DVDD18 DED5
RGRXD0
DVDD33 VSS
VSS
VSS
DVDD33MON VSS
RSV21 DED13 DED4 VSS AVDLL1
VSS VREFHSTL RGMDCLK RSV24 DSDDQ
GATE1
RGRXCTL VSS
DVDD15 RGTXC
RGRXC DSDDQS1 DVDD18 DVDD18
RSV14 DVDD18
URDATA7/
MRXD7 VSS CVDD
RSV28 CVDD
URADDR4/
PCBE0/
GP[2]
UXADDR2/
PCBE3 DVDD33
UXENB/
MTXEN/
RMTXEN VSS
DVDD33 VSS
RGMDIO PLLV2 VSS
DED11 DVDD18 DVDD18
URDATA4/
MRXD4
UX-
ADDR3/
MDIO
RGTXD2
B
DVDD15
VSS DVDD18
DVDD18
RSV07 DVDD18
CLKIN2DVDD33
VSS VSS VSS VSS VSS
C
VSS
URENB/
MRXDV
URSOC/
MRXER/
RMRXER
CVDD
URDATA1/
MRXD1/
RMRXD1
URDATA6/
MRXD6
URCLK/
MRCLK DVDD15
VSS VSS
14
DDR2
CLKOUT
VREFSSTL
DSDCKE
DCE0
CVDD
DDR2
CLKOUT
VSS
VSS
DVDD18
CVDD
15
DEA13
DBA0
DBA1
DBA2
VSS
DEA12
CVDD
DVDD18
VSS
VSS
14 15
CVDD
RSV04
VSS CVDD VSS CVDD
RSV05
F
D
E
A
G
H
J
K
L
M
N
P
B
C
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Figure 2-5. TCI6482 Pin Map (Bottom View) [Quadrant D]
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2.6 Signal Groups Description
A. This pin functions as GP[1] by default. For more details, see Section 3.
Figure 2-6. CPU and Peripheral Signals
20 Device Overview Copyright © 2005–2012, Texas Instruments Incorporated
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TINPL1
TOUTL1
URADDR3/ /GP[15]PREQ (C)
Timer 1 Timer 2
Timers (64-Bit)
URADDR2/ /GP[14]PINTA (C)
URADDR1/ /GP[13]PRST (C)
URADDR0/ /GP[12]PGNT (C)
VTXD3/FSX1/GP[11](D)
VTXD2/FSR1/GP[10](D)
VTXD1/DX1/GP[9](D)
VTXD0/DR1/GP[8](D)
GPIO
General-Purpose Input/Output (GPIO) Port 0
RIOTX[3:0]
RIOTX[3:0]
RIORX[3:0]
RIORX[3:0]
4
4
4
4
Transmit
Receive
Clock
RapidIO
RIOCLK
RIOCLK
A. This pin functions as GP[1] by default.
B. These McBSP1 peripheral pins are muxed with the GPIO peripheral pins and, by default, these signals function as GPIO peripheral
pins. For more details, see the section of this document.Device Configuration
C. These UTOPIA and PCI peripheral pins are muxed with the GPIO peripheral pins and, by default, these signals function as GPIO
peripheral pins. For more details, see the section of this document.Device Configuration
D. These VLYNQ and McBSP1 peripheral pins are muxed with the GPIO peripheral pins and, by default, these signals function as
GPIO peripheral pins. For more details, see the section of this document.Device Configuration
GP[7]
GP[6]
GP[5]
GP[4]
CLKX1/GP[3](B)
URADDR4/ /GP[2]PCBE0 (C)
SYSCLK4/GP[1](A)
CLKR1/GP[0](B)
TINPL0
TOUTL0
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Figure 2-7. Timers/GPIO/RapidIO Peripheral Signals
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ACE4(A) AECLKOUT
AED[63:0]
ACE3(A)
ACE2(A)
AEA[19:0]
AARDY
Data
Memory Map
Space Select
Address
Byte Enables
64
20
External
Memory I/F
Control
EMIFA (64-bit Data Bus)
AECLKIN
AHOLD
AHOLDA
ABUSREQ
Bus
Arbitration
ABE3
ABE2
ABE1
ABE0
ASWE/AAWE
DDR2CLKOUT
DED[31:0]
DCE0
DEA[13:0]
Data
Memory Map
Space Select
Address
Byte Enables
32
14
External
Memory I/F
Control
DDR2 Memoty Controller (32-bit Data Bus)
DSDCAS
DSDCKE
DDR2CLKOUT
DSDDQS[3:0]
DSDRAS
DSDWE
DSDDQS[3:0]
ABE7
ABE6
ABE5
ABE4
ACE5(A)
Bank Address
ABA[1:0]
AR/W
AAOE/ASOE
ASADS/ASRE
Bank Address DBA[2:0]
DEODT[1:0]
DSDDQGATE[0]
DSDDQM3
DSDDQM2
DSDDQM1
DSDDQM0
DSDDQGATE[1]
DSDDQGATE[2]
DSDDQGATE[3]
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Figure 2-8. EMIFA and DDR2 Memory Controller Peripheral Signals
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HD[15:0]/AD[15:0]
HD[31:16]/AD[31:16]
HCNTL0/PSTOP
HCNTL1/PDEVSEL
HHWIL/PCLK
(HPI16 ONLY)
CLKX1/GP[3]
VTXD3/FSX1/GP[11]
VTXD1/DX1/GP[9]
CLKR1/GP[0]
VTXD2/FSR1/GP[10]
VTXD0/DR1/GP[8]
CLKS
(SHARED)
VSCRUN/CLKX0
VCLK/CLKR0
VRXD3/FSX0
VRXD2/FSR0
VRXD1/DX0
VRXD0/DR0
VTXD3/FSX1/GP[11]
VTXD2/FSR1/GP[10]
VTXD1/DX1/GP[9]
VTXD0/DR1/GP[8]
Data
Register Select
Half-Word
Select
Control
HPI
(Host-Port Interface)
(A)
McBSP1
Transmit
Receive
Clock
McBSPs
(Multichannel Buffered Serial Ports)
(B)(C)
McBSP0
Transmit
Receive
Clock
VLYNQ(B)(C) I2C
HAS/PPAR
HR/ /W PCBE2
HCS PPERR/
HDS1 PSERR/
HDS2 PCBE1/
HRDY PIRDY/
HINT PFRAME/
VSCRUN/CLKX0
VRXD3/FSX0
VRXD1/DX0
VCLK/CLKR0
VRXD2/FSR0
SCL
SDA
VRXD0/DR0
A. These HPI pins are muxed with the PCI peripheral. By default, these pins function as HPI. When the HPI is enabled, the number of HPI pins
used depends on the HPI configuration (HPI16 or HPI32). For more details on these muxed pins, see the section of this
document.
Device Configuration
B. These VLYNQ and McBSP1 peripheral pins are muxed with the GPIO peripheral pins and, by default, these signals function as GPIO
peripheral pins. For more details, see the section of this document.Device Configuration
C. These VLYNQ peripheral pins are muxed with the McBSP0 peripheral pins and, by default, these signals function as McBSP0
peripheral pins. For more details, see the section of this document.Device Configuration
32
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Figure 2-9. HPI/McBSP/VLYNQ/I2C Peripheral Signals
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RGTXCTL, RGRXCTL
URSOC/MRXER/RMRXER,
URENB/MRXDV,
URCLAV/MCRS/RMCRSDV,
UXSOC/MCOL,
UXENB/MTXEN/RMTXEN
Ethernet MAC (EMAC) and MDIO(B)
UXADDR3/MDIO
UXADDR4/MDCLK
MDIO
Clock
Clocks
Error Detect
and Control
Input/Output
Receive
RGMDIO
RGMDCLK
RGTXD[3:0]
A. RGMII signals are mutually exclusive to all other EMAC signals.
B. These EMAC pins are muxed with the UTOPIA peripheral. By default, these signals function as EMAC. For more details on these
muxed pins, see the Device Configuration section of this document.
RGTXC,
RGRXC,
RGREFCLK
UXDATA[7:2]/MTXD[7:2],
UXDATA[1:0]/MTXD[1:0]/RMTXD[1:0]
Transmit
RGMII(A)
GMII
RMII
MII
RGRXD[3:0]
URDATA[7:2]/MRXD[7:2],
URDATA[1:0]/MRXD[1:0]/RMRXD[1:0]
RGMII(A)
GMII
RMII
MII
RGMII(A)
GMII
RMII
MII
RGMII(A)
GMII
RMII
MII
RGMII(A)
GMII
RMII
MII
GMII
RMII
MII
RGMII(A)
UXCLK/MTCLK/RMREFCLK,
URCLK/MRCLK,
UXCLAV/GMTCLK
Ethernet MAC
(EMAC)
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Figure 2-10. EMAC/MDIO [MII, GMII, RMII, and RGMII] Peripheral Signals
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URADDR2/PINTA/GP[14] Control/Status
URADDR4/PCLK/GP[2]
URDATA0/MRXD0/RMRXD0
URDATA1/MRXD1/RMRXD1
URADDR3/PREQ/GP[15]
URADDR1/PRST/GP[13]
URADDR0/PGNT/GP[12]
Receive
URDATA7/MRXD7
URDATA4/MRXD4
URDATA3/MRXD3
URDATA2/MRXD2
URCLAV/MCRS/RMCRSDV
URENB/MRXDV
URDATA5/MRXD5
URDATA6/MRXD6
URSOC/MRXER/RMRXER
URCLK/MRCLK Clock
Control/Status
Transmit
Clock
UXADDR2/PCBE3
UXADDR4/MDCLK
UXDATA0/MTXD0/RMTXD0
UXDATA1/MTXD1/RMTXD1
UXADDR3/MDIO
UXADDR1/PIDSEL
UXADDR0/PTRDY
UXDATA7/MTXD7
UXDATA4/MTXD4
UXDATA3/MTXD3
UXDATA2/MTXD2
UXCLAV/GMTCLK
UXENB/MTXEN/RMTXEN
UXDATA5/MTXD5
UXDATA6/MTXD6
UXSOC/MCOL/TCLKRISE
UXCLK/MTCLK/
RMREFCLK
UTOPIA (SLAVE)(A)
A. These UTOPIA pins are muxed with the PCI or EMAC or GPIO peripherals. By default, these signals function as GPIO or EMAC peripheral
pins or have no function. For more details on these muxed pins, see the Device Configuration section of this document.
HD[15:0]/AD[15:0]
HR/W/PCBE2
HDS2/PCBE1
UXADDR4/PCBE0/GP[2]
HHWIL/PCLK
HINT/PFRAME
URADDR2/PINTA/GP[14]
Data/Address
Arbitration
32 Clock
Control
PCI Interface(A)
HAS/PPAR
URADDR1/PRST/GP[13]
HRDY/PIRDY
HCNTL0/PSTOP
UXADDR0/PTRDY
UXADDR2/PCBE3
UXADDR1/PIDSEL
HCNTL1/PDEVSEL
HDS1/PSERR
Error
Command
Byte Enable
HCS/PPERR
URADDR0/PGNT/GP[12]
URADDR3/PREQ/GP[15]
HD[31:16]/AD[31:16]
A. These PCI pins are muxed with the HPI or UTOPIA or GPIO peripherals. By default, these signals function as GPIO or EMAC. For more details
on these muxed pins, see the Device Configuration section of this document.
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Figure 2-11. UTOPIA Peripheral Signals
Figure 2-12. PCI Peripheral Signals
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2.7 Terminal Functions
The terminal functions table (Table 2-3) identifies the external signal names, the associated pin (ball)
numbers along with the mechanical package designator, the pin type (I, O/Z, or I/O/Z), whether the pin
has any internal pullup/pulldown resistors, and a functional pin description. For more detailed information
on device configuration, peripheral selection, multiplexed/shared pins, and pullup/pulldown resistors, see
Section 3,Device Configuration.
Table 2-3. Terminal Functions
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
CLOCK/PLL CONFIGURATIONS
CLKIN1 N28 I IPD Clock Input for PLL1.
CLKIN2 G3 I IPD Clock Input for PLL2.
PLLV1 T29 A 1.8-V I/O supply voltage for PLL1
PLLV2 A5 A 1.8-V I/O supply voltage for PLL2
SYSCLK4 is the clock output at 1/8 of the device speed (O/Z) or this pin can be
SYSCLK4/GP[1](3) AJ13 I/O/Z IPD programmed as the GP1 pin (I/O/Z) [default].
JTAG EMULATION
TMS AJ10 I IPU JTAG test-port mode select
TDO AH8 O/Z IPU JTAG test-port data out
TDI AH9 I IPU JTAG test-port data in
TCK AJ9 I IPU JTAG test-port clock
JTAG test-port reset. For IEEE 1149.1 JTAG compatibility, see
TRST AH7 I IPD Section 8.23.3.1.1.
EMU0(4) AF7 I/O/Z IPU Emulation pin 0
EMU1(4) AE11 I/O/Z IPU Emulation pin 1
EMU2 AG9 I/O/Z IPU Emulation pin 2
EMU3 AF10 I/O/Z IPU Emulation pin 3
EMU4 AF9 I/O/Z IPU Emulation pin 4
EMU5 AE12 I/O/Z IPU Emulation pin 5
EMU6 AG8 I/O/Z IPU Emulation pin 6
EMU7 AF12 I/O/Z IPU Emulation pin 7
EMU8 AF11 I/O/Z IPU Emulation pin 8
EMU9 AH13 I/O/Z IPU Emulation pin 9
EMU10 AD10 I/O/Z IPU Emulation pin 10
EMU11 AD12 I/O/Z IPU Emulation pin 11
EMU12 AE10 I/O/Z IPU Emulation pin 12
EMU13 AD8 I/O/Z IPU Emulation pin 13
EMU14 AF13 I/O/Z IPU Emulation pin 14
EMU15 AE9 I/O/Z IPU Emulation pin 15
EMU16 AH12 I/O/Z IPU Emulation pin 16
EMU17 AH10 I/O/Z IPU Emulation pin 17
EMU18 AE13 I/O/Z IPU Emulation pin 18
(1) I = Input, O = Output, Z = High impedance, S = Supply voltage, GND = Ground, A = Analog signal
(2) IPD = Internal pulldown, IPU = Internal pullup. For most systems, a 1-kΩresistor can be used to oppose the IPU/IPD. For more detailed
information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 3.7,
Pullup/Pulldown Resistors.
(3) These pins are multiplexed pins. For more details, see Section 3,Device Configuration.
(4) The TCI6482 DSP does not require external pulldown resistors on the EMU0 and EMU1 pins for normal or boundary-scan operation.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
RESETS, INTERRUPTS, AND GENERAL-PURPOSE INPUT/OUTPUTS
RESET AG14 I Device reset
Nonmaskable interrupt, edge-driven (rising edge)
Any noise on the NMI pin may trigger an NMI interrupt; therefore, if the NMI pin
NMI AH4 I IPD is not used, it is recommended that the NMI pin be grounded versus relying on
the IPD.
RESETSTAT AE14 O Reset Status pin. The RESETSTAT pin indicates when the device is in reset
POR AF14 I Power on reset.
GP[7] AG2 I/O/Z IPD
GP[6] AG3 I/O/Z IPD General-purpose input/output (GPIO) pins (I/O/Z).
GP[5] AJ2 I/O/Z IPD
GP[4] AH2 I/O/Z IPD
URADDR3/PREQ/ P2 I/O/Z
GP[15]
URADDR2/PINTA (5)/P3 I/O/Z UTOPIA received address pins or PCI peripheral pins or General-purpose
GP[14] input/output (GPIO) [15:12, 2] pins (I/O/Z) [default]
URADDR1/PRST/ R5 I/O/Z PCI bus request (O/Z) or GP[15] (I/O/Z) [default]
GP[13] PCI interrupt A (O/Z) or GP[14] (I/O/Z) [default]
URADDR0/PGNT/ R4 I/O/Z PCI reset (I) or GP[13] (I/O/Z) [default]
GP[12] PCI bus grant (I) or GP[12] (I/O/Z) [default]
VTXD3/FSX1/GP[11] AG4 I/O/Z IPD PCI command/byte enable 0 (I/O/Z) or GP[2] (I/O/Z) [default]
VTXD2/FSR1/GP[10] AE5 I/O/Z IPD VLYNQ transmit data pins [3:0] (O) or McBSP1 pins or GP[11:8] pins (I/O/Z)
[default]
VTXD1/DX1/GP[9] AG5 I/O/Z IPD McBSP1 transmit clock (I/O/Z) or GP[3] (I/O/Z) [default]
VTXD0/DR1/GP[8] AH5 I/O/Z IPD McBSP1 receive clock (I/O/Z) or GP[0] (I/O/Z) [default]
CLKX1/GP[3] AF5 I/O/Z IPD GP[1] pin (I/O/Z). SYSCLK4 is the clock output at 1/8 of the device speed (O/Z)
URADDR4/PCBE0/ P1 I/O/Z or this pin can be programmed as a GP[1] pin (I/O/Z) [default].
GP[2]
SYSCLK4/GP[1] AJ13 O/Z IPD
CLKR1/GP[0] AF4 I/O/Z IPD
HOST-PORT INTERFACE (HPI) or PERIPHERAL COMPONENT INTERCONNECT (PCI)
PCI enable pin. This pin controls the selection (enable/disable) of the HPI and
GP[15:8], or PCI peripherals. This pin works in conjunction with the
PCI_EN Y29 I IPD MCBSP1_EN (AEA5 pin) to enable/disable other peripherals (for more details,
see Section 3,Device Configuration).
HINT/PFRAME U3 I/O/Z Host interrupt from DSP to host (O/Z) or PCI frame (I/O/Z)
Host control - selects between control, address, or data registers (I) [default] or
HCNTL1/PDEVSEL U4 I/O/Z PCI device select (I/O/Z)
Host control - selects between control, address, or data registers (I) [default] or
HCNTL0/PSTOP U5 I/O/Z PCI stop (I/O/Z)
Host half-word select - first or second half-word (not necessarily high or low
HHWIL/PCLK V3 I/O/Z order)
[For HPI16 bus width selection only] (I) [default] or PCI clock (I)
HR/W/PCBE2 T5 I/O/Z Host read or write select (I) [default] or PCI command/byte enable 2 (I/O/Z)
HAS/PPAR T3 I/O/Z Host address strobe (I) [default] or PCI parity (I/O/Z)
HCS/PPERR U6 I/O/Z Host chip select (I) [default] or PCI parity error (I/O/Z)
HDS1/PSERR (6) U2 I/O/Z Host data strobe 1 (I) [default] or PCI system error (I/O/Z)
HDS2/PCBE1 U1 I/O/Z Host data strobe 2 (I) [default] or PCI command/byte enable 1 (I/O/Z)
HRDY/PIRDY T4 I/O/Z Host ready from DSP to host (O/Z) [default] or PCI initiator ready (I/O/Z)
URADDR3/PREQ/ UTOPIA received address pin 3 (URADDR3) (I) or PCI bus request (O/Z) or
P2 I/O/Z
GP[15] GP[15] (I/O/Z) [default]
(5) These pins function as open-drain outputs when configured as PCI pins.
(6) These pins function as open-drain outputs when configured as PCI pins.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
URADDR2/PINTA (6)/ UTOPIA received address pin 2 (URADDR2) (I) or PCI interrupt A (O/Z) or
P3 I/O/Z
GP[14] GP[14] (I/O/Z) default]
URADDR1/PRST/ UTOPIA received address pin 1 (URADDR1) (I) or PCI reset (I) or GP[13]
R5 I/O/Z
GP[13] (I/O/Z) [default]
URADDR0/PGNT/ UTOPIA received address pin 0 (URADDR0) (I) or PCI bus grant (I) or GP[12]
R4 I/O/Z
GP[12] (I/O/Z)[default]
URADDR4/PCBE0/ UTOPIA received address pin 4 (URADDR4) (I) or PCI command/byte enable 0
P1 I/O/Z
GP[2] (I/O/Z) or GP[2] (I/O/Z)[default]
UTOPIA transmit address pin 2 (UXADDR2) (I) or PCI command/byte enable 3
UXADDR2/PCBE3 P5 I/O/Z (I/O/Z). By default, this pin has no function.
UTOPIA transmit address pin 1 (UXADDR1) (I) or PCI initialization device
UXADDR1/PIDSEL R3 I select (I). By default, this pin has no function.
UTOPIA transmit address pin 0 (UXADDR0) (I) or PCI target ready (PRTDY)
UXADDR0/PTRDY P4 I/O/Z (I/O/Z). By default, this pin has no function.
HD31/AD31 AA3
HD30/AD30 AA5
HD29/AD29 AC4
HD28/AD28 AA4
HD27/AD27 AC5
HD26/AD26 Y1
HD25/AD25 AD2
HD24/AD24 W1 Host-port data [31:16] pin (I/O/Z) [default] or PCI data-address bus [31:16]
I/O/Z (I/O/Z)
HD23/AD23 AC3
HD22/AD22 AE1
HD21/AD21 AD1
HD20/AD20 W2
HD19/AD19 AC1
HD18/AD18 Y2
HD17/AD17 AB1
HD16/AD16 Y3
HD15/AD15 AB2
HD14/AD14 W4
HD13/AD13 AC2
HD12/AD12 V4
HD11/AD11 AF3
HD10/AD10 AE3
HD9/AD9 AB3
HD8/AD8 W5 I/O/Z Host-port data [15:0] pin (I/O/Z) [default] or PCI data-address bus [15:0] (I/O/Z)
HD7/AD7 AB4
HD6/AD6 Y4
HD5/AD5 AD3
HD4/AD4 Y5
HD3/AD3 AD4
HD2/AD2 W6
HD1/AD1 AB5
HD0/AD0 AE2
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
EMIFA (64-BIT) - CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
ABA1/EMIFA_EN V25 O/Z IPD EMIFA bank address control (ABA[1:0])
• Active-low bank selects for the 64-bit EMIFA.
When interfacing to 16-bit Asynchronous devices, ABA1 carries bit 1 of the
byte address.
For an 8-bit Asynchronous interface, ABA[1:0] are used to carry bits 1 and
0 of the byte address
DDR2 Memory Controller enable (DDR2_EN) [ABA0]
ABA0/DDR2_EN V26 O/Z IPD 0 - DDR2 Memory Controller peripheral pins are disabled (default)
1 - DDR2 Memory Controller peripheral pins are enabled
EMIFA enable (EMIFA_EN) [ABA1]
0 - EMIFA peripheral pins are disabled (default)
1 - EMIFA peripheral pins are enabled
ACE5 V27 O/Z IPU EMIFA memory space enables
ACE4 V28 O/Z IPU • Enabled by bits 28 through 31 of the word address
ACE3 W26 O/Z IPU • Only one pin is asserted during any external data access
Note: The TCI6482 device does not have ACE0 and ACE1 pins
ACE2 W27 O/Z IPU
ABE7 W29 O/Z IPU
ABE6 K26 O/Z IPU
ABE5 L29 O/Z IPU EMIFA byte-enable control
ABE4 L28 O/Z IPU • Decoded from the low-order address bits. The number of address bits or
byte enables used depends on the width of external memory.
ABE3 AA29 O/Z IPU • Byte-write enables for most types of memory.
ABE2 AA28 O/Z IPU
ABE1 AA25 O/Z IPU
ABE0 AA26 O/Z IPU
EMIFA (64-BIT) - BUS ARBITRATION
AHOLDA N26 O IPU EMIFA hold-request-acknowledge to the host
AHOLD R29 I IPU EMIFA hold request from the host
ABUSREQ L27 O IPU EMIFA bus request output
EMIFA (64-BIT) - ASYNCHRONOUS/SYNCHRONOUS MEMORY CONTROL
EMIFA external input clock. The EMIFA input clock (AECLKIN or SYSCLK4
AECLKIN N29 I IPD clock) is selected at reset via the pullup/pulldown resistor on the AEA[15] pin.
Note: AECLKIN is the default for the EMIFA input clock.
AECLKOUT V29 O/Z IPD EMIFA output clock [at EMIFA input clock (AECLKIN or SYSCLK4) frequency]
Asynchronous memory write-enable/Programmable synchronous interface
AAWE/ASWE AB25 O/Z IPU write-enable
AARDY K29 I IPU Asynchronous memory ready input
AR/W W25 O/Z IPU Asynchronous memory read/write
AAOE/ASOE Y28 O/Z IPU Asynchronous/Programmable synchronous memory output-enable
Programmable synchronous address strobe or read-enable
• For programmable synchronous interface, the R_ENABLE field in the Chip
Select x Configuration Register selects between ASADS and ASRE:
ASADS/ASRE R26 O/Z IPU – If R_ENABLE = 0, then the ASADS/ASRE signal functions as the
ASADS signal.
– If R_ENABLE = 1, then the ASADS/ASRE signal functions as the
ASRE signal.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
EMIFA (64-BIT) - ADDRESS
AEA19/BOOTMODE3 N25 EMIFA external address (word address) (O/Z)
Controls initialization of the DSP modes at reset (I) via pullup/pulldown resistors
AEA18/BOOTMODE2 L26 [For more detailed information, see Section 3,Device Configuration.]
AEA17/BOOTMODE1 L25 Note: If a configuration pin must be routed out from the device and 3-stated
O/Z IPD (not driven), the internal pullup/pulldown (IPU/IPD) resistor should not be relied
AEA16/BOOTMODE0 P26 upon; TI recommends the use of an external pullup/pulldown resistor. For more
AEA15/AECLKIN_SEL P27 detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.7,Pullup/Pulldown
AEA14/HPI_WIDTH R25 Resistors.
AEA13/LENDIAN R27 O/Z IPU • Boot mode - device boot mode configurations (BOOTMODE[3:0]) [Note:
AEA12/UTOPIA_EN R28 the peripheral must be enabled to use the particular boot mode.]
AEA[19:16]:
0000 - No boot (default mode)
0001 - Host boot (HPI)
0010 -Reserved
0011 - Reserved
0100 - EMIFA 8-bit ROM boot
0101 - Master I2C boot
0110 - Slave I2C boot
0111 - Host boot (PCI)
1000 thru 1111 - Serial Rapid I/O boot configurations
For more detailed information on the boot modes, see Section 2.4,Boot
Sequence.
CFGGP[2:0] pins must be set to 000b during reset for proper operation of
the PCI boot mode.
• EMIFA input clock source select
Clock mode select for EMIFA (AECLKIN_SEL)
AEA15:
0 - AECLKIN (default mode)
1 - SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software
selectable via the Software PLL1 Controller. By default, SYSCLK4 is
selected as CPU/8 clock rate.
• HPI peripheral bus width (HPI_WIDTH) select
O/Z IPD [Applies only when HPI is enabled; PCI_EN pin = 0]
AEA11 T25 AEA14:
0 - HPI operates as an HPI16 (default). (HPI bus is 16 bits wide. HD[15:0]
pins are used and the remaining HD[31:16] pins are reserved pins in the
Hi-Z state.)
1 - HPI operates as an HPI32.
• Device Endian mode (LENDIAN)
AEA13:
0 - System operates in Big Endian mode
1 - System operates in Little Endian mode(default)
• UTOPIA Enable bit (UTOPIA_EN)
AEA12: UTOPIA peripheral enable(functional)
0 - UTOPIA disabled; Ethernet MAC (EMAC) and MDIO enable(default).
This means all multiplexed EMAC/UTOPIA and MDIO/UTOPIA pins
function as EMAC and MDIO. Which EMAC/MDIO configuration (interface)
[MII, RMII, GMII or the standalone RGMII] is controlled by the
MACSEL[1:0] bits.
1 - UTOPIA enabled; EMAC and MDIO disabled [except when the
MACSEL[1:0] bits = 11 then, the EMAC/MDIO RGMII interface is still
functional].
This means all multiplexed EMAC/UTOPIA and MDIO/UTOPIA pins now
function as UTOPIA. And if MACSEL[1:0] = 11, the RGMII standalone pin
functions can be used.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
AEA10/MACSEL1 M25 • EMAC/MDIO interface select bits (MACSEL[1:0])
If the EMAC and MDIO peripherals are enabled, AEA12 pin (UTOPIA_EN
AEA9/MACSEL0 M27 = 0) , there are two additional configuration pins — MACSEL[1:0] — to
AEA8/PCI_EEAI P25 select the EMAC/MDIO interface.
AEA[10:9]: MACSEL[1:0] with AEA12 =0.
AEA7/VLYNQ_EN N27 00 - 10/100 EMAC/MDIO MII Mode Interface (default)
AEA6/PCI66 U27 01 - 10/100 EMAC/MDIO RMII Mode Interface
AEA5/MCBSP1_EN U28 10 - 10/100/1000 EMAC/MDIO GMII Mode Interface
11 - 10/100/1000 with RGMII Mode Interface
AEA4/ T28
SYSCLKOUT_EN [RGMII interface requires a 1.8-V or 1.5-V I/O supply]
When UTOPIA is enabled (AEA12 = 1), if the MACSEL[1:0] bits = 11 then,
AEA3 T27 the EMAC/MDIO RGMII interface is still functional. For more detailed
AEA2/CFGGP2 T26 information, see Section 3,Device Configuration.
AEA1/CFGGP1 U26 • PCI I2C EEPROM Auto-Initialization (PCI_EEAI)
AEA8: PCI auto-initialization via external I2C EEPROM
If the PCI peripheral is disabled (PCI_EN pin = 0), this pin must not be
pulled up.
0 - PCI auto-initialization through I2C EEPROM is disabled (default).
1 - PCI auto-initialization through I2C EEPROM is enabled.
• VLYNQ enable bit (VLYNQ_EN)
AEA7:
0-VLYNQ disabled; McBSP1 and McBSP0 enabled (default)
This means all multiplexed VLYNQ/McBSP1/GPIO and VLYNQ/McBSP0
pins function as McBSP0 and McBSP1 [if AEA5 pin = 1] and as McBSP0
and GPIO [if AEA5 pin = 0].
1-VLYNQ enabled; McBSP1, McBSP0, and GPIO disabled
This means all multiplexed VLYNQ/McBSP1/GPIO and VLYNQ/McBSP0
pins now function as VLYNQ.
• PCI Frequency Selection (PCI66)
O/Z IPD [The PCI peripheral needs be enabled (PCI_EN = 1) to use this function]
Selects the PCI operating frequency of 66-MHz or 33-MHz PCI operating
frequency is selected at reset via the pullup/pulldown resistor on the PCI66
pin:
AEA6:
0 - PCI operates at 33 MHz (default).
1 - PCI operates at 66 MHz.
AEA0/CFGGP0 U25 Note: If the PCI peripheral is disabled (PCI_EN = 0), this pin must not be
pulled up.
• McBSP1 Enable bit (MCBSP1_EN)
Selects which function is enabled on the McBSP1/GPIO muxed pins
AEA5:
0 - GPIO pin functions enabled (default).
1 - McBSP1 pin functions enabled.
• SYSCLKOUT Enable pin (SYSCLKOUT_EN)
Selects which function is enabled on the SYSCLK4/GP[1] muxed pin
AEA4:
0 - GP[1] pin function of the SYSCLK4/GP[1] pin enabled (default).
1 - SYSCLK4 pin function of the SYSCLK4/GP[1] pin enabled.
• Configuration GPI (CFGGP[2:0]) (AEA[2:0])
These pins are latched during reset and their values are shown in the
DEVSTAT register. These values can be used by software routines for boot
operations.
Note: For proper TCI6482 device operation, the AEA11 pin must be externally
pulled up at device reset with a 1-kΩresistor. The AEA3 pin must be pulled up
at device reset using a 1-kΩresistor if power is applied to the SRIO supply
pins. If the SRIO peripheral is not used and the SRIO supply pins are
connected to VSS, the AEA3 pin must be pulled down to VSS using a 1-kΩ
resistor.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
EMIFA (64-BIT) - DATA
AED63 F25
AED62 A27
AED61 C27
AED60 C28
AED59 E27
AED58 D28
AED57 D27
AED56 F27
AED55 G25
AED54 G26
AED53 A28
AED52 F28
AED51 B28
AED50 G27
AED49 B27
AED48 G28
AED47 H25
AED46 J26
AED45 H26
AED44 J27
AED43 H27 I/O/Z IPU EMIFA external data
AED42 J28
AED41 C29
AED40 J29
AED39 D29
AED38 J25
AED37 F29
AED36 F26
AED35 G29
AED34 K28
AED33 K25
AED32 K27
AED31 AA27
AED30 AG29
AED29 AB29
AED28 AC27
AED27 AB28
AED26 AC26
AED25 AB27
AED24 AC25
AED23 AB26
AED22 AD28
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
AED21 AD29
AED20 AJ28
AED19 AF29
AED18 AH28
AED17 AE29
AED16 AG28
AED15 AF28
AED14 AH26
AED13 AE28
AED12 AE26
AED11 AD26 I/O/Z IPU EMIFA external data
AED10 AF27
AED9 AG27
AED8 AD27
AED7 AE25
AED6 AJ27
AED5 AJ26
AED4 AE27
AED3 AG25
AED2 AH27
AED1 AF25
AED0 AD25
DDR2 MEMORY CONTROLLER (32-BIT) - CONTROL SIGNALS COMMON TO ALL TYPES OF MEMORY
DDR2 Memory Controller memory space enable. When the DDR2 Memory
DCE0 E14 O/Z Controller is enabled, it always keeps this pin low.
DBA2 E15 O/Z
DBA1 D15 O/Z DDR2 Memory Controller bank address control
DBA0 C15 O/Z
DDR2CLKOUT B14 O/Z DDR2 Memory Controller output clock (CLKIN2 frequency × 10)
DDR2CLKOUT A14 O/Z Negative DDR2 Memory Controller output clock (CLKIN2 frequency × 10)
DSDCAS D13 O/Z DDR2 Memory Controller SDRAM column-address strobe
DSDRAS C13 O/Z DDR2 Memory Controller SDRAM row-address strobe
DSDWE B13 O/Z DDR2 Memory Controller SDRAM write-enable
DSDCKE D14 O/Z DDR2 Memory Controller SDRAM clock-enable (used for self-refresh mode)
DEODT1 A17 O/Z On-die termination signals to external DDR2 SDRAM. These pins should not be
connected to the DDR2 SDRAM.
Note: There are no on-die termination resistors implemented on the TCI6482
DEODT0 E16 O/Z DSP die.
DSDDQGATE3 F21 I DDR2 Memory Controller data strobe gate [3:0]
DSDDQGATE2 E21 O/Z For hookup of these signals, see the Implementing DDR2 PCB Layout on the
DSDDQGATE1 B9 I TMS320TCI6482 application report (literature number SPRAAA9).
DSDDQGATE0 A9 O/Z
DSDDQM3 C23 O/Z DDR2 Memory Controller byte-enable controls
• Decoded from the low-order address bits. The number of address bits or
DSDDQM2 C20 O/Z byte enables used depends on the width of external memory.
DSDDQM1 C8 O/Z • Byte-write enables for most types of memory.
DSDDQM0 C11 O/Z • Can be directly connected to SDRAM read and write mask signal (SDQM).
Copyright © 2005–2012, Texas Instruments Incorporated Device Overview 33
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
DSDDQS3 E23 I/O/Z
DSDDQS2 E20 I/O/Z DDR2 Memory Controller data strobe [3:0] positive
DSDDQS1 E8 I/O/Z
DSDDQS0 E11 I/O/Z
DSDDQS3 D23 I/O/Z DDR2 data strobe [3:0] negative
DSDDQS2 D20 I/O/Z Note: These pins are used to meet AC timings. For more detailed information,
DSDDQS1 D8 I/O/Z see the Implementing DDR2 PCB Layout on the TMS320TCI6482 application
report (literature number SPRAAA9).
DSDDQS0 D11 I/O/Z
DDR2 MEMORY CONTROLLER (32-BIT) - ADDRESS
DEA13 B15
DEA12 A15
DEA11 A16
DEA10 B16
DEA9 C16
DEA8 D16
DEA7 B17 O/Z DDR2 Memory Controller external address
DEA6 C17
DEA5 D17
DEA4 E17
DEA3 A18
DEA2 B18
DEA1 C18
DEA0 D18
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
DDR2 MEMORY CONTROLLER (32-BIT) - DATA
DED31 B25
DED30 A25
DED29 B24
DED28 A24
DED27 D22
DED26 C22
DED25 B22
DED24 A22
DED23 D21
DED22 C21
DED21 B21
DED20 A21
DED19 D19
DED18 C19
DED17 A19
DED16 B19 I/O/Z DDR2 Memory Controller external data
DED15 C7
DED14 D7
DED13 A7
DED12 B7
DED11 F9
DED10 E9
DED9 D9
DED8 C9
DED7 D10
DED6 C10
DED5 B10
DED4 A10
DED3 D12
DED2 C12
DED1 B12
DED0 A12
TIMER 1
TOUTL1 AG7 O/Z IPD Timer 1 output pin for lower 32-bit counter
TINPL1 AJ6 I IPD Timer 1 input pin for lower 32-bit counter
TIMER 0
TOUTL0 AF8 O/Z IPD Timer 0 output pin for lower 32-bit counter
TINPL0 AH6 I IPD Timer 0 input pin for lower 32-bit counter
INTER-INTEGRATED CIRCUIT (I2C)
SCL AG26 I/O/Z I2C clock. When the I2C module is used, use an external pullup resistor.
SDA AF26 I/O/Z I2C data. When I2C is used, ensure there is an external pullup resistor.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
MULTICHANNEL BUFFERED SERIAL PORT 1 AND MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP1 and McBSP0)
McBSP external clock source (as opposed to internal) (I)
CLKS AJ4 I IPD [shared by McBSP1 and McBSP0]
MULTICHANNEL BUFFERED SERIAL PORT 1 (McBSP1)
CLKR1/GP[0] AF4 I/O/Z IPD McBSP1 receive clock (I/O/Z) or GP[0] (I/O/Z) [default]
VLYNQ transmit data pin [2] (O) or McBSP1 receive frame sync (I/O/Z) or
VTXD2/FSR1/GP[10] AE5 I/O/Z IPD GP[10] (I/O/Z) [default]
VLYNQ transmit data pin [0] (O) or McBSP1 receive data (I) or GP[8] (I/O/Z)
VTXD0/DR1/GP[8] AH5 I/O/Z IPD [default]
VLYNQ transmit data pin [1] (O) or McBSP1 transmit data (O/Z) or GP[9]
VTXD1/DX1/GP[9] AG5 I/O/Z IPD (I/O/Z) [default]
VLYNQ transmit data pin [3] (O) or McBSP1 transmit frame sync (I/O/Z) or
VTXD3/FSX1/GP[11] AG4 I/O/Z IPD GP[11] (I/O/Z) [default]
CLKX1/GP[3] AF5 I/O/Z IPD McBSP1 transmit clock (I/O/Z) or GP[3] (I/O/Z) [default]
MULTICHANNEL BUFFERED SERIAL PORT 0 (McBSP0)
VCLK/CLKR0 AG1 I/O/Z IPU VLYNQ (I/O) or McBSP0 receive clock (I/O/Z) [default]
VRXD2/FSR0 AH3 I/O/Z IPD VLYNQ receive data pin [2] (I) or McBSP0 receive frame sync (I/O/Z) [default]
VRXD0/DR0 AJ5 I IPD VLYNQ receive data pin [0] (I) or McBSP0 receive data (I) [default]
VRXD1/DX0 AF6 I/O/Z IPD VLYNQ receive data pin [1] (I) or McBSP0 transmit data (O/Z) [default]
VRXD3/FSX0 AJ3 I/O/Z IPD VLYNQ receive data pin [3] (I) or McBSP0 transmit frame sync (I/O/Z) [default]
VSCRUN/CLKX0 AG6 I/O/Z IPU VLYNQ serial clock run request (I/O) or McBSP0 transmit clock (I/O/Z) [default]
UNIVERSAL TEST AND OPERATIONS PHY INTERFACE for ASYNCHRONOUS TRANSFER MODE (ATM) [UTOPIA SLAVE]
UTOPIA SLAVE (ATM CONTROLLER) - TRANSMIT INTERFACE
Source clock for UTOPIA transmit driven by Master ATM Controller.
When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
UXCLK/MTCLK/ N4 I/O/Z pin is either EMAC MII transmit clock (MTCLK) or the EMAC RMII reference
RMREFCLK clock. The EMAC function is controlled by the MACSEL[1:0] (AEA[10:9] pins).
For more detailed information, see Section 3,Device Configuration.
Transmit cell available status output signal from UTOPIA Slave.
0 indicates a complete cell is NOT available for transmit
UXCLAV/GMTCLK K5 I/O/Z 1 indicates a complete cell is available for transmit
When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is EMAC GMII transmit clock. MACSEL[1:0] dependent.
UTOPIA transmit interface enable input signal. Asserted by the Master ATM
Controller to indicate that the UTOPIA Slave should put out on the Transmit
Data Bus the first byte of valid data and the UXSOC signal in the next clock
UXENB/MTXEN/ J5 I/O/Z cycle.
RMTXEN When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is either the EMAC MII transmit enable [default] or EMAC RMII transmit
enable or EMAC GMII transmit enable. MACSEL[1:0] dependent.
Transmit Start-of-Cell signal. This signal is output by the UTOPIA Slave on the
rising edge of the UXCLK, indicating that the first valid byte of the cell is
available on the 8-bit Transmit Data Bus (UXDATA[7:0]).
UXSOC/MCOL K3 I/O/Z When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is either the EMAC MII collision sense or EMAC GMII collision sense.
MACSEL[1:0] dependent.
UXADDR4/MDCLK M5 I UTOPIA transmit address pins (UXADDR[4:0]) (I)
As UTOPIA transmit address pins, UTOPIA_EN (AEA12 pin) = 1:
UXADDR3/MDIO N3 I • 5-bit Slave transmit address input pins driven by the Master ATM Controller
UXADDR2/PCBE3 P5 I to identify and select one of the Slave devices (up to 31 possible) in the
ATM System.
UXADDR1/PIDSEL R3 I
When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0) and if
the PCI_EN pin = 1, these pins are PCI peripheral pins:
UXADDR0/PTRDY P4 I PCI command/byte enable 3(PCBE3) [I/O/Z],
PCI initialization device select (PIDSEL) [I], and
PCI target ready (PTRDY) [I/O/Z].
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
UXDATA7/MTXD7 N5
UXDATA6/MTXD6 M3 UTOPIA 8-bit transmit data bus (I/O/Z) [default] or EMAC MII 4-bit transmit data
bus (I/O/Z) [default] or EMAC GMII 8-bit transmit data bus or EMAC RMII 2-bit
UXDATA5/MTXD5 L5 transmit data bus (I/O/Z)
UXDATA4/MTXD4 L3 Using the Transmit Data Bus, the UTOPIA Slave (on the rising edge of the
UXDATA3/MTXD3 K4 O/Z UXCLK) transmits the 8-bit ATM cells to the Master ATM Controller.
UXDATA2/MTXD2 M4 When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), these
UXDATA1/MTXD1/ pins function as EMAC pins and are controlled by the MACSEL[1:0] (AEA[10:9]
L4
RMTXD1 pins) to select the MII, RMII, GMII or RGMII EMAC interface. (For more details,
see Section 3,Device Configuration).
UXDATA0/MTXD0/ M1
RMTXD0
UTOPIA SLAVE (ATM CONTROLLER) - RECEIVE INTERFACE
Source clock for UTOPIA receive driven by Master ATM Controller.
URCLK/MRCLK H1 I/O/Z When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is EMAC MII [default] or GMII receive clock. MACSEL[1:0] dependent.
Receive cell available status output signal from UTOPIA Slave.
0 indicates NO space is available to receive a cell from Master ATM Controller
URCLAV/MCRS/ 1 indicates space is available to receive a cell from Master ATM Controller
J4 I/O/Z
RMCRSDV When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is EMAC MII carrier sense [default] or RMII carrier sense/data valid or GMII
carrier sense. MACSEL[1:0] dependent. MACSEL[1:0] dependent.
UTOPIA receive interface enable input signal. Asserted by the Master ATM
Controller to indicate to the UTOPIA Slave to sample the Receive Data Bus
URENB/MRXDV H5 I/O/Z (URDATA[7:0]) and URSOC signal in the next clock cycle or thereafter.
When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is EMAC MII [default] or GMII receive data valid. MACSEL[1:0] dependent.
Receive Start-of-Cell signal. This signal is output by the Master ATM Controller
to indicate to the UTOPIA Slave that the first valid byte of the cell is available to
URSOC/MRXER/ sample on the 8-bit Receive Data Bus (URDATA[7:0]).
H4 I/O/Z
RMRXER When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is EMAC MII [default] or RMII or GMII receive error. MACSEL[1:0]
dependent.
URADDR4/PCBE0/ UTOPIA receive address pins [URADDR[4:0] (I)]:
P1 I
GP[2] As UTOPIA receive address pins, UTOPIA_EN (AEA12 pin) = 1:
• 5-bit Slave receive address input pins driven by the Master ATM Controller
URADDR3/PREQ/ P2 I to identify and select one of the Slave devices (up to 31 possible) in the
GP[15] ATM System.
URADDR2/PINTA (1)/P3 I • When the UTOPIA peripheral is disabled [UTOPIA_EN (AEA12 pin) = 0],
GP[14] these pins are PCI (if PCI_EN = 1) or GPIO (if PCI_EN = 0) pins
URADDR1/PRST/ (GP[15:12, 2]).
R5 I
GP[13] As PCI peripheral pins:
PCI command/byte enable 0 (PCBE0) [I/O/Z]
PCI bus request (PREQ) [O/Z],
URADDR0/PGNT/ R4 I PCI interrupt A (PINTA) [O/Z],
GP[12] PCI reset (PRST) [I], and
PCI bus grant (PGNT) [I/O/Z].
URDATA7/MRXD7 M2
URDATA6/MRXD6 H2 UTOPIA 8-bit Receive Data Bus (I/O/Z) [default] or EMAC receive data bus
URDATA5/MRXD5 L2 [MII] [default] (I/O/Z) or [GMII] (I/O/Z) or [RMII] (I/O/Z)
Using the Receive Data Bus, the UTOPIA Slave (on the rising edge of the
URDATA4/MRXD4 L1 URCLK) can receive the 8-bit ATM cell data from the Master ATM Controller.
URDATA3/MRXD3 J3 I/O/Z When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), these
URDATA2/MRXD2 J1 pins function as EMAC pins and are controlled by the MACSEL[1:0] (AEA[10:9]
URDATA1/MRXD1/ pins) to select the MII, RMII, GMII, or RGMII EMAC interface. (For more details,
H3
RMRXD1 see Section 3,Device Configuration).
URDATA0/MRXD0/ J2
RMRXD0
(1) These pins function as open-drain outputs when configured as PCI pins.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
RAPIDIO SERIAL PORT
RIOCLK AF15 I RapidIO serial port source (reference) clock
RIOCLK AG15 I Negative RapidIO serial port source (reference) clock
RIOTX3 AF17 O/Z
RIOTX2 AG18 RapidIO transmit data bus bits [3:0] (differential)
RIOTX1 AG22
RIOTX0 AF23
RIOTX3 AF18 O/Z
RIOTX2 AG19 RapidIO negative transmit data bus bits [3:0] (differential)
RIOTX1 AG21
RIOTX0 AF22
RIORX3 AH18 I
RIORX2 AJ18 RapidIO receive data bus bits [3:0] (differential)
RIORX1 AJ22
RIORX0 AH22
RIORX3 AH17 I
RIORX2 AJ19 RapidIO negative receive data bus bits [3:0] (differential)
RIORX1 AJ21
RIORX0 AH23
MANAGEMENT DATA INPUT/OUTPUT (MDIO) FOR MII/RMII/GMII
UTOPIA transmit address pin 4 (UXADDR4) (I) or MDIO serial clock (MDCLK)
UXADDR4/MDCLK M5 I/O/Z IPD for MII/RMII/GMII mode (O)
UTOPIA transmit address pin 3 (UXADDR3) (I) or MDIO serial data (MDIO) for
UXADDR3/MDIO N3 I/O/Z IPU MII/RMII/GMII mode (I/O)
MANAGEMENT DATA INPUT/OUTPUT (MDIO) FOR RGMII
RGMDCLK B4 O/Z MDIO serial clock (RGMII mode) (RGMDCLK) (O)
RGMDIO A4 I/O/Z MDIO serial data (RGMII mode) (RGMDIO) (I/O)
ETHERNET MAC (EMAC) [MII/RMII/GMII]
If the Ethernet MAC (EMAC) and MDIO are enabled (AEA12 driven low [UTOPIA_EN = 0]), there are two additional configuration pins - the
MAC_SEL[1:0] (AEA[10:9] pins) - that select one of the four interface modes (MII, RMII, GMII, or RGMII) for the EMAC/MDIO interface. For
more detailed information on the EMAC configuration pins, see Section 3,Device Configuration.
UTOPIA receive clock (URCLK) driven by Master ATM Controller (I) or when
the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this pin is
URCLK/MRCLK H1 I EMAC receive clock (MRCLK) for MII [default] or GMII. MACSEL[1:0]
dependent.
UTOPIA receive cell available status output signal from UTOPIA Slave (O) or
URCLAV/MCRS/ when the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
J4 I/O/Z
RMCRSDV pin is EMAC carrier sense (MCRS) (I) for MII [default] or GMII, or EMAC carrier
sense/receive data valid (RMCRSDV) (I) for RMII. MACSEL[1:0] dependent.
UTOPIA receive Start-of-Cell signal (I) or when the UTOPIA peripheral is
URSOC/MRXER/ H4 I disabled (UTOPIA_EN [AEA12 pin] = 0), this pin is EMAC receive error
RMRXER (MRXIR) (I) for MII [default], RMII, or GMII. MACSEL[1:0] dependent.
UTOPIA receive interface enable input signal (I). Asserted by the Master ATM
Controller to indicate to the UTOPIA Slave to sample the Receive Data Bus
(URDATA[7:0]) and URSOC signal in the next clock cycle or thereafter.
URENB/MRXDV H5 I When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is EMAC MII [default] or GMII receive data valid (MRXDV) (I). MACSEL[1:0]
dependent.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
URDATA7/MRXD7 M2
URDATA6/MRXD6 H2 UTOPIA 8-bit Receive Data Bus (I) [default] or EMAC receive data bus for MII
URDATA5/MRXD5 L2 [default], RMII, or GMII
URDATA4/MRXD4 L1 Using the Receive Data Bus, the UTOPIA Slave (on the rising edge of the
URCLK) can receive the 8-bit ATM cell data from the Master ATM Controller.
URDATA3/MRXD3 J3 I
URDATA2/MRXD2 J1 When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), these
pins function as EMAC receive data pins for MII [default], RMII, or GMII
URDATA1/MRXD1/ H3 (MRXD[x:0]) (I). MACSEL[1:0] dependent.
RMRXD1
URDATA0/MRXD0/ J2
RMRXD0 Transmit cell available status output signal from UTOPIA slave (O).
• 0 indicates a complete cell is NOT available for transmit
• 1 indicates a complete cell is available for transmit
UXCLAV/GMTCLK K5 O/Z
When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is EMAC GMII transmit clock (GMTCLK) (O). MACSEL[1:0] dependent.
UTOPIA transmit source clock (UXCLK) driven by Master ATM Controller (I) or
when the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
UXCLK/MTCLK/ pin is either EMAC MII [default] or GMII transmit clock (MTCLK) (I) or the
N4 I
RMREFCLK EMAC RMII reference clock (RMREFCLK) (I). The EMAC function is controlled
by the MACSEL[1:0] (AEA[10:9] pins). For more detailed information, see
Section 3,Device Configuration.
UTOPIA transmit Start-of-Cell signal (O). This signal is output by the UTOPIA
Slave on the rising edge of the UXCLK, indicating that the first valid byte of the
cell is available on the 8-bit Transmit Data Bus (UXDATA[7:0]).
UXSOC/MCOL K3 I/O/Z When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this
pin is the EMAC collision sense (MCDL) (I) for MII [default] or GMII.
MACSEL[1:0] dependent.
UTOPIA transmit interface enable input signal [default] (I) or when the UTOPIA
UXENB/ MTXEN/ peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), this pin is either the
J5 I/O/Z
RMTXEN EMAC transmit enable (MTXEN) (O) for MII [default], RMII, or GMII.
MACSEL[1:0] dependent.
UXDATA7/MTXD7 N5
UXDATA6/MTXD6 M3 UTOPIA 8-bit transmit data bus (O) [default] or
UXDATA5/MTXD5 L5 EMAC transmit data bus for MII [default], RMII, or GMII.
UXDATA4/MTXD4 L3 Using the Transmit Data Bus, the UTOPIA Slave (on the rising edge of the
UXDATA3/MTXD3 K4 O/Z UXCLK) transmits the 8-bit ATM cells to the Master ATM Controller.
UXDATA2/MTXD2 M4 When the UTOPIA peripheral is disabled (UTOPIA_EN [AEA12 pin] = 0), these
UXDATA1/MTXD1/ pins function as EMAC transmit data pins (MTXD[x:0]) (O) for MII, RMII, or
L4
RMTXD1 GMII. MACSEL[1:0] dependent.
UXDATA0/MTXD0/ M1
RMTXD0
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
ETHERNET MAC (EMAC) [RGMII]
If the Ethernet MAC (EMAC) and MDIO are enabled (AEA12 driven low [UTOPIA_EN = 0]), there are two additional configuration pins - the
MAC_SEL[1:0] (AEA[10:9] pins) - that select one of the four interface modes (MII, RMII, GMII, or RGMII) for the EMAC/MDIO interface. For
more detailed information on the EMAC configuration pins, see Section 3,Device Configuration.
RGMII reference clock (O). This 125-MHz reference clock is provided as a
convenience. It can be used as a clock source to a PHY, so that the PHY may
RGREFCLK C4 O/Z generate RXC clock to communicate with the EMAC. This clock is stopped
while the device is in reset. This pin is available only when RGMII mode is
selected ( MACSEL[1:0] =11).
RGMII transmit clock (O). This pin is available only when RGMII mode is
RGTXC D4 O/Z selected (MACSEL[1:0] =11).
RGTXD3 A2
RGTXD2 C3 RGMII transmit data [3:0] (O). This pin is available only when RGMII mode is
O/Z selected (MACSEL[1:0] =11).
RGTXD1 B3
RGTXD0 A3 RGMII transmit enable (O). This pin is available only when RGMII mode is
RGTXCTL D3 O/Z selected (MACSEL[1:0] =11).
RGMII receive clock (I). This pin is available only when RGMII mode is selected
RGRXC E3 I (MACSEL[1:0] =11).
RGRXD3 C1 I
RGRXD2 E4 I RGMII receive data [3:0] (I). This pin is available only when RGMII mode is
selected (MACSEL[1:0] =11).
RGRXD1 E2 I
RGRXD0 E1 I RGMII receive control (I). This pin is available only when RGMII mode is
RGRXCTL C2 I selected (MACSEL[1:0] =11).
RESERVED FOR TEST
RSV02 V5
RSV03 W3 Reserved. These pins must be connected directly to core supply (CVDD) for
proper device operation.
RSV04 N11
RSV05 P11 Reserved. This pin must be connected directly to 1.5-/1.8-V I/O supply
(DVDD15) for proper device operation.
RSV07 G4 I NOTE: If the EMAC RGMII is not used, these pins can be connected directly to
ground (VSS).
Reserved. This pin must be connected directly to the 1.8-V I/O supply (DVDD18)
RSV09 D26 I for proper device operation.
Reserved. This pin must be connected to ground (VSS) via a 200-Ωresistor for
proper device operation.
NOTE: If the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and
RSV11 D24 RSV12 pins can be connected directly to ground (VSS) to save power.
However, connecting these pins directly to ground will prevent boundary-scan
from functioning on the DDR2 Memory Controller pins. To preserve boundary-
scan functionality on the DDR2 Memory Controller pins, see Section 8.3.4.
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a
200-Ωresistor for proper device operation.
NOTE: If the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and
RSV12 C24 RSV12 pins can be connected directly to ground (VSS) to save power.
However, connecting these pins directly to ground will prevent boundary-scan
from functioning on the DDR2 Memory Controller pins. To preserve boundary-
scan functionality on the DDR2 Memory Controller pins, see Section 8.3.4.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
Reserved. This pin must be connected to ground (VSS) via a 200-Ωresistor for
proper device operation.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
RSV13 F2 RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 8.3.4.
Reserved. This pin must be connected to the 1.5/1.8-V I/O supply (DVDD15) via
a 200-Ωresistor for proper device operation.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
RSV14 F1 RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 8.3.4.
Reserved. This pin must be connected via a 39-Ωresistor directly to ground
RSV15 T1 (VSS) for proper device operation. The resistor used should have a minimal
rating of 1/10 W.
Reserved. This pin must be connected via a 20-Ωresistor directly to 3.3-V I/O
RSV16 T2 Supply (DVDD33) for proper device operation. The resistor used should have a
minimal rating of 1/10 W.
RSV17 AE21 A
RSV18 E13 A
RSV19 F18 A
RSV20 U29 A
RSV21 A6 A
RSV22 B26 O
RSV23 C26 O
RSV24 B6 O
RSV25 C6 O
RSV26 AJ11 A Reserved. (Leave unconnected, do not connect to power or ground.)
RSV27 AH11 A
RSV36 AD11 I/O/Z IPU
RSV37 AD9 I/O/Z IPU
RSV38 AG10 I/O/Z IPU
RSV39 AG11 I/O/Z IPU
RSV40 AJ12 I/O/Z IPU
RSV41 W28 O/Z IPU
RSV42 Y26 O/Z IPU
RSV43 Y25 O/Z IPU
RSV44 Y27 O/Z
RSV28 N7 A
RSV29 N6 A Reserved. These pins must be connected directly to VSS for proper device
operation.
RSV30 P23 A
RSV31 P24 A Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a 1-
RSV32 D25 kΩresistor for proper device operation.
Reserved. This pin must be connected directly to ground for proper device
RSV33 C25 operation.
Reserved. This pin must be connected to the 1.8-V I/O supply (DVDD18) via a 1-
RSV34 E6 kΩresistor for proper device operation.
Reserved. This pin must be connected directly to ground for proper device
RSV35 D6 operation.
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
SUPPLY VOLTAGE MONITOR PINS
Die-side 1.2-V core supply (CVDD) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
CVDDMON N1 and other voltage monitoring pins, see the TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100 application report (literature number
SPRAAC7). If the CVDDMON pin is not used, it should be connected directly to
the 1.2-V core supply (CVDD).
Die-side 3.3-V I/O supply (DVDD33) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
DVDD33MON L6 and other voltage monitoring pins, see the TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100 application report (literature number
SPRAAC7). If the DVDD33MON pin is not used, it should be connected directly to
the 3.3-V I/O supply (DVDD33).
Die-side 1.5-/1.8-V I/O supply (DVDD15) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
and other voltage monitoring pins, see the TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100 application report (literature number
SPRAAC7). If the DVDD15MON pin is not used, it should be connected directly to
DVDD15MON F3 I the 1.5-/1.8-V I/O supply (DVDD15).
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, DVDD15MON,
VREFHSTL, RSV13, and RSV14 pins can be connected directly to ground (VSS)
to save power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 8.3.4.
Die-side 1.8-V I/O supply (DVDD18) voltage monitor pin. The monitor pins
indicate the voltage on the die and, therefore, provide the best probe point for
voltage monitoring purposes. For more information regarding the use of this
DVDD18MON A26 and other voltage monitoring pins, see the TMS320TCI6482 Design Guide and
Comparisons to TMS320TCI100 application report (literature number
SPRAAC7). If the DVDD18MON pin is not used, it should be connected directly to
the 1.8-V I/O supply (DVDD18).
SUPPLY VOLTAGE PINS
(DVDD18/2)-V reference for SSTL buffer (DDR2 Memory Controller). This input
voltage can be generated directly from DVDD18 using two 1-kΩresistors to form
a resistor divider circuit.
NOTE: The DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and
VREFSSTL C14 A RSV12 pins can be connected directly to ground (VSS) to save power.
However, connecting these pins directly to ground will prevent boundary-scan
from functioning on the DDR2 Memory Controller pins. To preserve boundary-
scan functionality on the DDR2 Memory Controller pins, see Section 8.3.4.
(DVDD15/2)-V reference for HSTL buffer (EMAC RGMII). VREFHSTL can be
generated directly from DVDD15 using two 1-kΩresistors to form a resistor
divider circuit.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
VREFHSTL B2 A RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
power. However, connecting these pins directly to ground will prevent
boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 8.3.4.
1.8-V I/O supply voltage (SRIO regulator supply).
DVDDR AD20 S NOTE: If Rapid I/O is not used, this pin can be connected directly to VSS.
AC15 SRIO analog supply:
1.25-V I/O supply voltage (-1000 and -1200 devices)
AC17
AVDDA A 1.2-V I/O supply voltage (-850 devices).
Do not use core supply.
AD16 NOTE: If Rapid I/O is not used, these pins can be connected directly to VSS.
AVDLL1 A13 A 1.8-V I/O supply voltage.
AVDLL2 E18
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
U16 SRIO interface supply:
1.25-V core supply voltage (-1000 and -1200 devices)
V15
DVDDRM S 1.2-V core supply voltage (-850 devices).
The source for this supply voltage must be the same as that of CVDD.
V17 NOTE: If RapidIO is not used, these pins can be connected directly to VSS.
W16 Main SRIO supply:
1.25-V I/O supply voltage (-1000 and -1200 devices)
DVDD12 S 1.2-V I/O supply voltage (-850 devices).
W18 Do not use core supply.
NOTE: If RapidIO is not used, these pins can be connected directly to VSS.
AE17
AE19 SRIO termination supply:
AE23 1.25-V I/O supply voltage (-1000 and -1200 devices)
AVDDT AF20 A 1.2-V I/O supply voltage (-850 devices).
Do not use core supply.
AH20 NOTE: If RapidIO is not used, these pins can be connected directly to VSS.
AJ17
AJ23
A1
B5 1.8-V or 1.5-V I/O supply voltage for the RGMII function of the EMAC.
NOTE: If the RGMII mode of the EMAC is not used, the DVDD15, VREFHSTL,
D2 RSV13, and RSV14 pins can be connected to directly ground (VSS) to save
DVDD15 D5 S power. However, connecting these pins directly to ground will prevent
F5 boundary-scan from functioning on the RGMII pins of the EMAC. To preserve
boundary-scan functionality on the RGMII pins, see Section 8.3.4.
G6
H7
B8
B11
B20
B23
E10
E12
E22
E24
F7
F11
F13
F15
DVDD18 S 1.8-V I/O supply voltage (DDR2 Memory Controller)
F17
F19
F23
G8
G10
G12
G14
G16
G18
G20
G22
G24
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
A29
E26
E28
G2
H23
H28
J6
J24
K1
K7
K23
L24
M7
M23
M28
N24
P6
P28
R1
R6
R23
DVDD33 T7 S 3.3-V I/O supply voltage
T24
U23
V1
V7
V24
W23
Y7
Y24
AA1
AA6
AA23
AB7
AB24
AC6
AC9
AC11
AC13
AC19
AC21
AC23
AC29
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
AD5
AD7
AD14
AD18
AD22
AD24
AE6
AE8
AE15
AF1
AF16
DVDD33 AF24 S 3.3-V I/O supply voltage
AG12
AG17
AG23
AH14
AH16
AH24
AJ1
AJ7
AJ15
AJ25
AJ29
L12
L14
L16
L18
M11
M13
M15
M17
M19
N12 1.25-V core supply voltage (-1000 and -1200 devices)
CVDD S1.2-V core supply voltage (-850 devices)
N14
N16
N18
P13
P15
P17
P19
R12
R14
R16
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
R18
T11
T13
T15
T17
T19
U12 1.25-V core supply voltage (-1000 and -1200 devices)
CVDD S1.2-V core supply voltage (-850 devices)
U14
U18
V11
V13
V19
W12
W14
GROUND PINS
A8
A11
A20
A23
B1
B29
C5
D1
E5
E7
VSS GND Ground pins
E19
E25
E29
F4
F6
F8
F10
F12
F14
F16
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
F20
F22
F24
G1
G5
G7
G9
G11
G13
G15
G17
G19
G21
G23
H6
H24
VSS GND Ground pins
H29
J7
J23
K2
K6
K24
L7
L11
L13
L15
L17
L19
L23
M6
M12
M14
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
M16
M18
M24
M26
M29
N2
N13
N15
N17
N19
N23
P7
P12
P14
P16
P18
P29
VSS GND Ground pins
R2
R7
R11
R13
R15
R17
R19
R24
T6
T12
T14
T16
T18
T23
U7
U11
U13
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
U15
U17
U19
U24
V2
V6
V12
V14
V16
V18
V23
W7
W11
W13
W15
W17
VSS GND Ground pins
W19
W24
Y6
Y23
AA2
AA7
AA24
AB6
AB23
AC7
AC8
AC10
AC12
AC14
AC16
AC18
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Table 2-3. Terminal Functions (continued)
SIGNAL TYPE(1) IPD/IPU(2) DESCRIPTION
NAME NO.
AC20
AC22
AC24
AC28
AD6
AD13
AD15
AD17
AD19
AD21
AD23
AE4
AE7
AE16
AE18
AE20
AE22
AE24
VSS GND Ground pins
AF2
AF19
AF21
AG13
AG16
AG20
AG24
AH1
AH15
AH19
AH21
AH25
AH29
AJ8
AJ14
AJ16
AJ20
AJ24
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2.8 Development
2.8.1 Development Support
In case the customer would like to develop their own features and software on the TCI6482 device, TI
offers an extensive line of development tools for the TMS320C6000™ DSP platform, including tools to
evaluate the performance of the processors, generate code, develop algorithm implementations, and fully
integrate and debug software and hardware modules. The tool's support documentation is electronically
available within the Code Composer Studio™ Integrated Development Environment (IDE).
The following products support development of C6000™ DSP-based applications:
Software Development Tools: Code Composer Studio™ Integrated Development Environment (IDE):
including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software (DSP/BIOS™), which provides the basic run-time target
software needed to support any DSP application.
Hardware Development Tools: Extended Development System (XDS™) Emulator (supports C6000™
DSP multiprocessor system debug) EVM (Evaluation Module)
2.8.2 Device Support
2.8.2.1 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all
DSP devices and support tools. Each DSP commercial family member has one of three prefixes: TMX,
TMP, or TMS (e.g., TMS320TCI6482GTZ2). Texas Instruments recommends two of three possible prefix
designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of
product development from engineering prototypes (TMX/TMDX) through fully qualified production
devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final device's electrical
specifications.
TMP Final silicon die that conforms to the device's electrical specifications but has not completed
quality and reliability verification.
TMS Fully qualified production device.
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal
qualification testing.
TMDS Fully qualified development-support product.
TMX and TMP devices and TMDX development-support tools are shipped with against the following
disclaimer:
"Developmental product is intended for internal evaluation purposes."
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
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TCI6482
PREFIX
TMS 320 TCI6482 GTZ
TMX = Experimental device
TMS = Qualified device
DEVICE FAMILY
320 = TMS320 DSP family
PACKAGE TYPE(B)
CTZ = 697-pin plastic BGA, with Pb-Free die bump and solder balls
GTZ = 697-pin plastic BGA, with Pb-ed solder balls
ZTZ = 697-pin plastic BGA, with Pb-Free solder balls
DEVICE
DEVICE SPEED RANGE
( )
8 = 850 MHz
Blank = 1 GHz
2 = 1.2 GHz
2
TEMPERATURE RANGE(A)
Blank = 0°C to +90°C (default commercial temperature)
A = -40°C to 105°C (extended temperature)
( )
SILICON REVISION(C)
B = silicon revision 2.1
D = silicon revision 3.1
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TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, GTZ), the temperature range (for example, blank is the default commercial
temperature range), and the device speed range, in megahertz (for example, 2 is 1200 MHz [1.2 GHz]).
Figure 2-13 provides a legend for reading the complete device name for any TMS320C64x+™ DSP
generation member.
For device part numbers and further ordering information for TMS320TCI6482 in the CTZ/GTZ/ZTZ
package type, see the TI website (www.ti.com) or contact your TI sales representative.
A. The extended temperature "A version" devices may have different operating conditions than the commercial
temperature devices. For more details, see Section 7.2,Recommended Operating Conditions.
B. BGA = Ball Grid Array
C. For silicon revision information, see the TMS320TCI6482 Digital Signal Processor Silicon Errata (literature number
SPRZ235).
Figure 2-13. TMS320C64x+™ DSP Device Nomenclature (including the TMS320TCI6482 DSP)
2.8.2.2 Documentation Support
The following documents describe the TMS320TCI6482 Communications Infrastructure Digital Signal
Processor. Copies of these documents are available on the Internet at www.ti.com.Tip: Enter the
literature number in the search box provided at www.ti.com.
SPRU871 TMS320C64x+ DSP Megamodule Reference Guide. Describes the TMS320C64x+ digital
signal processor (DSP) megamodule. Included is a discussion on the internal direct memory
access (IDMA) controller, the interrupt controller, the power-down controller, memory
protection, bandwidth management, and the memory and cache.
SPRU732 TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide. Describes the CPU
architecture, pipeline, instruction set, and interrupts for the TMS320C64x and TMS320C64x+
digital signal processors (DSPs) of the TMS320C6000 DSP family. The C64x/C64x+ DSP
generation comprises fixed-point devices in the C6000 DSP platform. The C64x+ DSP is an
enhancement of the C64x DSP with added functionality and an expanded instruction set.
SPRAA84 TMS320C64x to TMS320C64x+ CPU Migration Guide. Describes migrating from the Texas
Instruments TMS320C64x digital signal processor (DSP) to the TMS320C64x+ DSP. The
objective of this document is to indicate differences between the two cores. Functionality in
the devices that is identical is not included.
SPRU889 High-Speed DSP Systems Design Reference Guide. Provides recommendations for
meeting the many challenges of high-speed DSP system design. These recommendations
include information about DSP audio, video, and communications systems for the C5000 and
C6000 DSP platforms.
SPRU894 TMS320C6472/TMS320TCI648x DSP DDR2 Memory Controller User's Guide. This
document describes the DDR2 memory controller in the TMS320C6472/TMS320TCI648x
digital signal processors (DSPs).
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SPRUEA7 TMS320TCI648x Bootloader User's Guide. This document describes the features of the
on-chip Bootloader provided with the TMS320TCI648x digital signal processors (DSPs).
SPRU925 TMS320TCI648x DSP External Memory Interface (EMIF) User's Guide. This document
describes the operation of the external memory interface (EMIF) in the TMS320TCI648x
digital signal processors (DSPs).
SPRU874 TMS320TCI648x DSP Host Port Interface (HPI) User's Guide. This guide describes the
host port interface (HPI) on the TMS320TCI648x digital signal processors (DSPs).
SPRUE13 TMS320C6472/TMS320TCI648x Serial RapidIO (SRIO) User's Guide. This document
describes the Serial RapidIO (SRIO) on the TMS320C6472/TMS320TCI648x digital signal
processors (DSPs).
SPRUE12 TMS320TCI6482 DSP Ethernet Media Access Controller (EMAC)/ Management Data
Input/Output (MDIO) User's Guide. This document provides a functional description of the
Ethernet Media Access Controller (EMAC) and Physical layer (PHY) device Management
Data Input/Output (MDIO) module integrated with the TMS320TCI6482 digital signal
processors (DSPs).
SPRUE69 TMS320TCI648x DSP Peripheral Component Interconnect (PCI) User's Guide. This
document describes the peripheral component interconnect (PCI) port in the
TMS320TCI648x digital signal processors (DSPs).
SPRUE10 TMS320TCI648x DSP Turbo-Decoder Coprocessor 2 (TCP2) Reference Guide. This
document describes the operation and programming of the TCP2 in the TMS320TCI648x
digital signal processors (DSPs).
SPRUE09 TMS320TCI648x DSP Viterbi-Decoder Coprocessor 2 (VCP2) Reference Guide. This
document describes the operation and programming of the VCP2 in the TMS320TCI648x
digital signal processors (DSPs).
SPRU727 TMS320C6472/TMS320TCI648x DSP Enhanced DMA (EDMA3) Controller User's Guide.
This document describes the Enhanced DMA (EDMA3) Controller on the
TMS320C6472/TMS320TCI648x digital signal processors (DSPs).
SPRUE11 TMS320C6472/TMS320TCI648x DSP Inter-Integrated Circuit (I2C) Module User's Guide.
This document describes the inter-integrated circuit (I2C) module in the
TMS320C6472/TMS320TCI648x digital signal processors (DSPs).
SPRU818 TMS320C6472/TMS320TCI648x DSP 64-Bit Timer User’s Guide. This document provides
an overview of the 64-bit timer in the TMS320C6472/TMS320TCI648x digital signal
processors (DSPs).
SPRU806 TMS320C6472/TMS320TCI648x DSP Software-Programmable Phase-Locked Loop
(PLL) Controller User's Guide. This document describes the operation of the software-
programmable phase-locked loop (PLL) controller in the TMS320C6472/TMS320TCI648x
digital signal processors (DSPs).
SPRU803 TMS320TCI648x DSP Multichannel Buffered Serial Port (McBSP) Reference Guide. This
document describes the operation of the multichannel buffered serial port (McBSP) in the
TMS320TCI648x digital signal processors (DSPs).
SPRU726 TMS320TCI648x DSP Universal Test and Operations PHY Interface for ATM 2
(UTOPIA2) User’s Guide. This document describes the universal test and operations PHY
interface for asynchronous transfer mode (ATM) 2 (UTOPIA2) in the TMS320TCI648x digital
signal processors (DSPs).
SPRU725 TMS320C6472/TMS320TCI648x DSP General-Purpose Input/Output (GPIO) User’s
Guide. This document describes the general-purpose input/output (GPIO) peripheral in the
TMS320C6472/TMS320TCI648x digital signal processors (DSPs).
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2.8.2.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and
help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
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3 Device Configuration
On the TCI6482 device, certain device configurations like boot mode, pin multiplexing, and endianess, are
selected at device reset. The status of the peripherals (enabled/disabled) is determined after device reset.
By default, the peripherals on the TCI6482 device are disabled and need to be enabled by software before
being used.
3.1 Device Configuration at Device Reset
Table 3-1 describes the TCI6482 device configuration pins. The logic level of the AEA[19:0], ABA[1:0],
and PCI_EN pins is latched at reset to determine the device configuration. The logic level on the device
configuration pins can be set by using external pullup/pulldown resistors or by using some control device
(e.g., FPGA/CPLD) to intelligently drive these pins. When using a control device, care should be taken to
ensure there is no contention on the lines when the device is out of reset. The device configuration pins
are sampled during reset and are driven after the reset is removed. To avoid contention, the control device
should only drive the EMIFA pins when RESETSTAT is low.
NOTE
If a configuration pin must be routed out from the device and 3-stated (not driven), the
internal pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the use
of an external pullup/pulldown resistor. For more detailed information on pullup/pulldown
resistors and situations where external pullup/pulldown resistors are required, see
Section 3.7,Pullup/Pulldown Resistors.
Table 3-1. TCI6482 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN)
CONFIGURATION IPD/
NO. FUNCTIONAL DESCRIPTION
PIN IPU(1)
Boot Mode Selections (BOOTMODE [3:0]).
These pins select the boot mode for the device.
0000 No boot (default mode)
0001 Host boot (HPI)
0010 Reserved
0011 Reserved
[N25, 0100 EMIFA 8-bit ROM boot
L26, 0101 Master I2C boot
AEA[19:16] IPD
L25, 0110 Slave I2C boot
P26] 0111 Host boot (PCI)
1000 thru Serial Rapid I/O boot configurations
1111
If selected for boot, the corresponding peripheral is automatically enabled after device reset.
For more detailed information on boot modes, see Section 2.4,Boot Sequence.
CFGGP[2:0] pins must be set to 000b during reset for proper operation of the PCI boot
mode.
EMIFA input clock source select (AECLKIN_SEL).
0 AECLKIN (default mode)
AEA15 P27 IPD 1 SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software selectable
via the Software PLL1 Controller. By default, SYSCLK4 is selected as CPU/8
clock rate.
(1) IPD = Internal pulldown, IPU = Internal pullup. For most systems, a 1-kΩresistor can be used to oppose the IPU/IPD. For more detailed
information on pullup/pulldown resistors and situations where external pullup/pulldown resistors are required, see Section 3.7,
Pullup/Pulldown Resistors.
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Table 3-1. TCI6482 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN) (continued)
CONFIGURATION IPD/
NO. FUNCTIONAL DESCRIPTION
PIN IPU(1)
HPI peripheral bus width select (HPI_WIDTH).
0 HPI operates in HPI16 mode (default).
HPI bus is 16 bits wide; HD[15:0] pins are used and the remaining HD[31:16]
pins are reserved pins in the Hi-Z state.
AEA14 R25 IPD 1 HPI operates in HPI32 mode.
HPI bus is 32 bits wide; HD[31:0] pins are used.
Applies only when HPI function of HPI/PCI multiplexed pins is selected (PCI_EN pin = 0).
Device Endian mode (LENDIAN).
AEA13 R27 IPU 0 System operates in Big Endian mode.
1 System operates in Little Endian mode (default).
UTOPIA pin function enable bit (UTOPIA_EN).
This pin selects the function of the UTOPIA/EMAC and UTOPIA/MDIO multiplexed pins.
0 UTOPIA pin function disabled; EMAC and MDIO pin function enabled (default).
This means all multiplexed UTOPIA/EMAC and UTOPIA/MDIO pins function as
EMAC and MDIO pins. The interface used by EMAC/MDIO (MII, RMII, GMII or
AEA12 R28 IPD the standalone RGMII) is controlled by the MACSEL[1:0] pins (AEA[10:9]).
1 UTOPIA pin function enabled; EMAC and MDIO pin function disabled.
This means all multiplexed UTOPIA/EMAC and UTOPIA/MDIO pins now function
as UTOPIA. The EMAC/MDIO peripheral can still be used with RGMII
(MACSEL[1:0] = 11).
For proper TCI6482 device operation, this pin must be externally pulled up with a 1-kΩ
AEA11 T25 IPD resistor at device reset.
EMAC Interface Selects (MACSEL[1:0]).
These pins select the interface used by the EMAC/MDIO peripheral.
00 10/100 EMAC/MDIO with MII Interface [default]
01 10/100 EMAC/MDIO with RMII Interface
10 10/100/1000 EMAC/MDIO with GMII Interface
[M25,
AEA[10:9] IPD 11 10/100/1000 EMAC/MDIO with RGMII Interface
M27] If the UTOPIA pin function is selected [UTOPIA_EN (AEA12 pin) = 1] for multiplexed
UTOPIA/EMAC and UTOPIA/MDIO pins, the EMAC/MDIO peripheral can only be used with
RGMII.
For more detailed information on the UTOPIA_EN and MAC_SEL[1:0] control pin selections,
see Table 3-3.
PCI I2C EEPROM Auto-Initialization (PCI_EEAI).
PCI auto-initialization via external I2C EEPROM
0 PCI auto-initialization through external I2C EEPROM is disabled. The PCI
peripheral uses the specified PCI default values (default).
AEA8 P25 IPD 1 PCI auto-initialization through external I2C EEPROM is enabled. The PCI
peripheral is configured through external I2C EEPROM provided the PCI
peripheral pins are enabled (PCI_EN = 1).
Note: If the PCI pin function is disabled (PCI_EN pin = 0), this pin must not be pulled up.
VLYNQ pin function enable bit (VLYNQ_EN).
This pin selects the function of the VLYNQ/McBSP1/GPIO and VLYNQ/McBSP0 multiplexed
pins.
0 VLYNQ pin function is disabled; McBSP1/GPIO and McBSP0 pin functions are
enabled (default).
This means all multiplexed VLYNQ/McBSP1/GPIO pins function as
AEA7 N27 IPD McBSP1/GPIO pins and all multiplexed VLYNQ/McBSP0 pins function as
McBSP0 pins. The function of the McBSP1/GPIO pins is determined by the
McBSP1_EN pin (AEA5).
1 VLYNQ pin function enabled; McBSP1/GPIO and McBSP0 pin functions are
disabled.
This means all multiplexed VLYNQ/McBSP1/GPIO and VLYNQ/McBSP0 pins
function as VLYNQ.
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Table 3-1. TCI6482 Device Configuration Pins (AEA[19:0], ABA[1:0], and PCI_EN) (continued)
CONFIGURATION IPD/
NO. FUNCTIONAL DESCRIPTION
PIN IPU(1)
PCI Frequency Selection (PCI66).
Selects the operating frequency of the PCI (either 33 MHz or 66 MHz).
0 PCI operates at 33 MHz (default)
AEA6 U27 IPD 1 PCI operates at 66 MHz
Note: If the PCI pin function is disabled (PCI_EN pin = 0), this pin must not be pulled up.
McBSP1 pin function enable bit (MCBSP1_EN).
Selects which function is enabled on the McBSP1/GPIO multiplexed pins when the VLYNQ
function is disabled (VLYNQ_EN pin = 0).
AEA5 U28 IPD 0 GPIO pin function enabled (default).
This means all multiplexed McBSP1/GPIO pins function as GPIO pins.
1 McBSP1 pin function enabled.
This means all multiplexed McBSP1/GPIO pins function as McBSP1 pins.
SYSCLKOUT Enable bit (SYSCLKOUT_EN).
Selects which function is enabled on the SYSCLK4/GP[1] muxed pin.
AEA4 T28 IPD 0 GP[1] pin function is enabled (default)
1 SYSCLK4 pin function is enabled
For proper TCI6482 device operation, the AEA3 pin must be pulled up at device reset using
a 1-kΩresistor if power is applied to the SRIO supply pins. If the SRIO peripheral is not
AEA3 T27 IPD used and the SRIO supply pins are connected to VSS, the AEA3 pin must be pulled down to
VSS using a 1-kΩresistor.
Configuration General-Purpose Inputs (CFGGP[2:0])
[T26, The value of these pins is latched to the Device Status Register following device reset and is
AEA[2:0] U26, IPD used by the on-chip bootloader for some boot modes. For more information on the boot
U25] modes, see Section 2.4,Boot Sequence.
PCI pin function enable bit (PCI_EN).
Selects which function is enabled on the HPI/PCI and the PCI/UTOPIA multiplexed pins.
0 HPI and UTOPIA pin function enabled (default)
PCI_EN Y29 IPD This means all multiplexed HPI/PCI and PCI/UTOPIA pins function as HPI and
UTOPIA pins, respectively .
1 PCI pin function enabled
This means all multiplexed HPI/PCI and PCI/UTOPIA pins function as PCI pins.
DDR2 Memory Controller enable (DDR2_EN).
ABA0 V26 IPD 0 DDR2 Memory Controller peripheral pins are disabled (default)
1 DDR2 Memory Controller peripheral pins are enabled
EMIFA enable (EMIFA_EN).
ABA1 V25 IPD 0 EMIFA peripheral pins are disabled (default)
1 EMIFA peripheral pins are enabled
3.2 Peripheral Configuration at Device Reset
Some TCI6482 device peripherals share the same pins (internally multiplexed) and are mutually exclusive.
Therefore, not all peripherals may be used at the same time. The device configuration pins described in
Section 3.1,Device Configuration at Device Reset, determine which function is enabled for the multiplexed
pins.
Note that when the pin function of a peripheral is disabled at device reset, the peripheral is permanently
disabled and cannot be enabled until its pin function is enabled and another device reset is executed.
Also, note that enabling the pin function of a peripheral does not enable the corresponding peripheral. All
peripherals on the TCI6482 device are disabled by default, except when used for boot, and must be
enabled through software before being used.
Other peripheral options like PCI clock speed and EMAC/MDIO interface mode can also be selected at
device reset through the device configuration pins. The configuration selected is also fixed at device reset
and cannot be changed until another device reset is executed with a different configuration selected.
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The multiply factor of the PLL1 Controller is not selected through the configuration pins. The PLL1 multiply
factor is set in software through the PLL1 controller registers after device reset. The PLL2 multiply factor is
fixed. For more information, see Section 8.7,PLL1 and PLL1 Controller, and Section 8.8,PLL2 and PLL2
Controller.
On the TCI6482 device, the PCI peripheral pins are multiplexed with the HPI pins and partially multiplexed
with the UTOPIA pins. The PCI_EN pin selects the function for the HPI/PCI multiplexed pins. The PCI66,
PCI_EEAI, and HPI_WIDTH control other functions of the PCI and HPI peripherals. Table 3-2 describes
the effect of the PCI_EN, PCI66, PCI_EEAI, and HPI_WIDTH configuration pins.
Table 3-2. PCI_EN, PCI66, PCI_EEAI, and HPI_WIDTH Peripheral Selection (HPI and PCI)
CONFIGURATION PIN SETTING(1) PERIPHERAL FUNCTION SELECTED
PCI66 PCI_EEAI HPI_WIDTH
PCI_EN PIN HPI DATA HPI DATA 32-BIT PCI PCI
AEA6 PIN AEA8 PIN AEA14 PIN
[Y29] LOWER UPPER (66-/33-MHz) AUTO-INIT
[U27] [P25](1) [R25]
0 0 0 0 Enabled Hi-Z Disabled N/A
0 0 0 1 Enabled Enabled Disabled N/A
Enabled
1 1 1 X Disabled (via External I2C
Enabled EEPROM)
(66 MHz)
1 1 0 X Disabled Disabled
Disabled
1 0 0 X Disabled (default values)
Enabled Enabled
(33 MHz)
1 0 1 X Disabled (via External I2C
EEPROM)
(1) PCI_EEAI is latched at reset as a configuration input. If PCI_EEAI is set as one, then default values are loaded from an external I2C
EEPROM.
The UTOPIA and EMAC/MDIO pins are also multiplexed on the TCI6482 device. The UTOPIA_EN
function (AEA12 pin) controls the function of these multiplexed pins. The MAC_SEL[1:0] configuration pins
(AEA[10:9) control which interface is used by the EMAC/MDIO. Note that since the PCI shares some pins
with the UTOPIA peripheral, its state also affects the operation of the UTOPIA. Table 3-3 describes the
effect of the UTOPIA_EN, PCI_EN, and MACSEL[1:0] configuration pins.
Table 3-3. UTOPIA_EN, and MAC_SEL[1:0] Peripheral Selection (UTOPIA and EMAC)
CONFIGURATION PIN SETTING PERIPHERAL FUNCTION SELECTED
MAC_SEL[1:0]
UTOPIA_EN PCI_EN PIN AEA[10:9] PINS EMAC/MDIO UTOPIA
AEA12 PIN [R28] [Y29] [M25, M27]
10/100 EMAC/MDIO with MII Interface
0 x 00b Disabled
[default]
10/100 EMAC/MDIO with RMII
0 x 01b Disabled
Interface
10/100/1000 EMAC/MDIO with GMII
0 x 10b Disabled
Interface
10/100/1000 EMAC/MDIO with RGMII
0 x 11b Disabled
Interface(1)
1 0 00b, 01b, or 10b Disabled UTOPIA Slave with Full Functionality
10/100/1000 EMAC/MDIO with RGMII
1 0 11b UTOPIA Slave with Full Functionality
Interface(1)
UTOPIA Slave with Single PHY Mode
1 1 00b, 01b, or 10b Disabled Only
10/100/1000 EMAC/MDIO with RGMII UTOPIA Slave with Single PHY Mode
1 1 11b Interface(1) Only
(1) RGMII interface requires a 1.5-/1.8-V I/O supply.
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3.3 Peripheral Selection After Device Reset
On the TCI6482 device, peripherals can be in one of several states. These states are listed in Table 3-4.
Table 3-4. Peripheral States
PERIPHERALS THAT CAN BE
STATE DESCRIPTION IN THIS STATE
HPI
PCI
McBSP0
Peripheral pin function has been completely McBSP1
disabled through the device configuration
Static powerdown UTOPIA
pins. Peripheral is held in reset and clock is EMAC/MDIO
turned off. VLYNQ
EMIFA
DDR2 Memory Controller
TCP
VCP
I2C
Timer 0
Timer 1
GPIO
Peripheral is held in reset and clock is turned EMAC/MDIO
Disabled off. Default state for all peripherals not in McBSP0
static powerdown mode. McBSP1
HPI
PCI
UTOPIA
VLYNQ
RSA0
RSA1
TCP
VCP
I2C
Timer 0
Timer 1
GPIO
MDIO
EMAC/MDIO
Clock to the peripheral is turned on and the McBSP0
Enabled peripheral is taken out of reset. McBSP1
HPI
PCI
UTOPIA
VLYNQ
RSA0
RSA1
EMIFA
DDR2 Memory Controller
Not a user-programmable state. This is an All peripherals that can be in a
Disable in progress intermediate state when transitioning from an disabled state.
enabled state to a disabled state.
Not a user-programmable state. This is an All peripherals that can be in an
Enable in progress intermediate state when transitioning from an enabled state.
disabled state to an enabled state.
Following device reset, all peripherals that are not in the static powerdown state are in the disabled state
by default. Peripherals used for boot such as HPI and PCI are enabled automatically following a device
reset.
Peripherals are only allowed certain transitions between states (see Figure 3-1).
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Reset
Static
Powerdown
Disabled
Disabled
Enable In
Progress
Enabled
Disable In
Progress
Unlock the PERCFG0 register by
using the PERLOCK register.
Write to the PERCFG0 register
within 16 SYSCLK3 clock cycles
to change the state of the
peripherals.
Poll the PERSTAT registers to
verify state change.
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Figure 3-1. Peripheral Transitions Between States
Figure 3-2 shows the flow needed to change the state of a given peripheral on the TCI6482 device.
Figure 3-2. Peripheral State Change Flow
A 32-bit key (value = 0x0F0A 0B00) must be written to the Peripheral Lock register (PERLOCK) in order to
allow access to the PERCFG0 register. Writes to the PERCFG1 register can be done directly without
going through the PERLOCK register.
NOTE
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same
fetch packet if code is being executed from external memory. If the instructions are in
different fetch packets, fetching the second instruction from external memory may stall the
instruction long enough such that PERCFG0 register will be locked before the instruction is
executed.
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3.4 Device State Control Registers
The TCI6482 device has a set of registers that are used to control the status of its peripherals. These
registers are shown in Table 3-5 and described in the next sections.
NOTE
The device state control registers can only be accessed using the CPU or the emulator.
Table 3-5. Device State Control Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02AC 0000 - Reserved
02AC 0004 PERLOCK Peripheral Lock Register
02AC 0008 PERCFG0 Peripheral Configuration Register 0
02AC 000C - Reserved
02AC 0010 - Reserved
02AC 0014 PERSTAT0 Peripheral Status Register 0
02AC 0018 PERSTAT1 Peripheral Status Register 1
02AC 001C - 02AC 001F - Reserved
02AC 0020 EMACCFG EMAC Configuration Register
02AC 0024 - 02AC 002B - Reserved
02AC 002C PERCFG1 Peripheral Configuration Register 1
02AC 0030 - 02AC 0053 - Reserved
02AC 0054 EMUBUFPD Emulator Buffer Powerdown Register
02AC 0058 - Reserved
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3.4.1 Peripheral Lock Register Description
When written with correct 32-bit key (0x0F0A0B00), the Peripheral Lock Register (PERLOCK) allows one
write to the PERCFG0 register within 16 SYSCLK3 cycles.
NOTE
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same
fetch packet if code is being executed from external memory. If the instructions are in
different fetch packets, fetching the second instruction from external memory may stall the
instruction long enough such that PERCFG0 register will be locked before the instruction is
executed.
31 0
LOCKVAL
R/W-F0F0 F0F0
LEGEND: R/W = Read/Write; -n= value after reset
Figure 3-3. Peripheral Lock Register (PERLOCK) - 0x02AC 0004
Table 3-6. Peripheral Lock Register (PERLOCK) Field Descriptions
Bit Field Value Description
31:0 LOCKVAL When programmed with 0x0F0A 0B00 allows one write to the PERCFG0 register within 16
SYSCLK3 clock cycles.
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3.4.2 Peripheral Configuration Register 0 Description
The Peripheral Configuration Register (PERCFG0) is used to change the state of the peripherals. One
write is allowed to this register within 16 SYSCLK3 cycles after the correct key is written to the PERLOCK
register.
NOTE
The instructions that write to the PERLOCK and PERCFG0 registers must be in the same
fetch packet if code is being executed from external memory. If the instructions are in
different fetch packets, fetching the second instruction from external memory may stall the
instruction long enough that the PERCFG0 register is locked before the instruction is
executed.
31 30 29 28 27 26 25 24
SRIOCTL Reserved RSA1CTL Reserved RSA0CTL Reserved VLYNQCTL
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
23 22 21 20 19 18 17 16
Reserved UTOPIACTL Reserved PCICTL Reserved HPICTL Reserved McBSP1CTL
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
15 14 13 12 11 10 9 8
Reserved McBSP0CTL Reserved I2CCTL Reserved GPIOCTL Reserved TIMER1CTL
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
76543210
Reserved TIMER0CTL Reserved EMACCTL Reserved VCPCTL Reserved TCPCTL
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; -n= value after reset
Figure 3-4. Peripheral Configuration Register 0 (PERCFG0) - 0x02AC 0008
Table 3-7. Peripheral Configuration Register 0 (PERCFG0) Field Descriptions
Bit Field Value Description
31:30 SRIOCTL Mode control for SRIO. SRIO does not have a corresponding status bit in the Peripheral Status
Registers. Once SRIOCTL is set to 11b, the SRIO peripheral can be used within 16 SYSCLK3
cycles.
00b Set SRIO to disabled mode
11b Set SRIO to enabled mode
29 Reserved Reserved.
28 RSA1CTL Mode control for RSA1
0 Set RSA1 to disabled mode
1 Set RSA1 to enabled mode
27 Reserved Reserved.
26 RSA0CTL Mode control for RSA0
0 Set RSA0 to disabled mode
1 Set RSA0 to enabled mode
25 Reserved Reserved.
24 VLYNQCTL Mode control for VLYNQ
0 Set VLYNQ to disabled mode
1 Set VLYNQ to enabled mode
23 Reserved Reserved.
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Table 3-7. Peripheral Configuration Register 0 (PERCFG0) Field Descriptions (continued)
Bit Field Value Description
22 UTOPIACTL Mode control for UTOPIA
0 Set UTOPIA to disabled mode
1 Set UTOPIA to enabled mode
21 Reserved Reserved.
20 PCICTL Mode control for PCI. This bit defaults to 1 when host boot is used (BOOTMODE[3:0] = 0111b).
0 Set PCI to disabled mode
1 Set PCI to enabled mode
19 Reserved Reserved.
18 HPICTL Mode control for HPI. This bit defaults to 1 when host boot is used (BOOTMODE[3:0] = 0001b).
0 Set HPI to disabled mode
1 Set HPI to enabled mode
17 Reserved 1 Reserved.
16 McBSP1CTL Mode control for McBSP1
0 Set McBSP1 to disabled mode
1 Set McBSP1 to enabled mode
15 Reserved Reserved.
14 McBSP0CTL Mode control for McBSP0
0 Set McBSP0 to disabled mode
1 Set McBSP0 to enabled mode
13 Reserved Reserved.
12 I2CCTL Mode control for I2C
0 Set I2C to disabled mode
1 Set I2C to enabled mode
11 Reserved Reserved.
10 GPIOCTL Mode control for GPIO
0 Set GPIO to disabled mode
1 Set GPIO to enabled mode
9 Reserved Reserved.
8 TIMER1CTL Mode control for Timer 1
0 Set Timer 1 to disabled mode
1 Set Timer 1 to enabled mode
7 Reserved Reserved.
6 TIMER0CTL Mode control for Timer 0
0 Set Timer 0 to disabled mode
1 Set Timer 0 to enabled mode
5 Reserved Reserved.
4 EMACCTL Mode control for EMAC/MDIO
0 Set EMAC/MDIO to disabled mode
1 Set EMAC/MDIO to enabled mode
3 Reserved Reserved.
2 VCPCTL Mode control for VCP
0 Set VCP to disabled mode
1 Set VCP to enabled mode
1 Reserved Reserved.
0 TCPCTL Mode control for TCP
0 Set TCP to disabled mode
1 Set TCP to enabled mode
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3.4.3 Peripheral Configuration Register 1 Description
The Peripheral Configuration Register (PERCFG1) is used to enable the EMIFA and DDR2 Memory
Controller. EMIFA and the DDR2 Memory Controller do not have corresponding status bits in the
Peripheral Status Registers. The EMIFA and DDR2 Memory Controller peripherals can be used within 16
SYSCLK3 cycles after EMIFACTL and DDR2CTL are set to 1. Once EMIFACTL and DDR2CTL are set to
1, they cannot be set to 0. Note that if the DDR2 Memory Controller and EMIFA are disabled at reset
through the device configuration pins (DDR2.EN[ABA0] and EMIFA[ABA1]), they cannot be enabled
through the PERCFG1 register.
31 8
Reserved
R-0x00
7 2 1 0
Reserved DDR2CTL EMIFACTL
R-0x00 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 3-5. Peripheral Configuration Register 1 (PERCFG1) - 0x02AC 002C
Table 3-8. Peripheral Configuration Register 1 (PERCFG1) Field Descriptions
Bit Field Value Description
31:2 Reserved Reserved.
1 DDR2CTL Mode Control for DDR2 Memory Controller. Once this bit is set to 1, it cannot be changed to 0.
0 Set DDR2 to disabled
1 Set DDR2 to enabled
0 EMIFACTL Mode control for EMIFA. Once this bit is set to 1, it cannot be changed to 0. This bit defaults to 1 if
EMIFA 8-bit ROM boot is used (BOOTMODE[3:0] = 0100b).
0 Set EMIFA to disabled
1 Set EMIFA to enabled
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3.4.4 Peripheral Status Registers Description
The Peripheral Status Registers (PERSTAT0 and PERSTAT1) show the status of the TCI6482 device
peripherals.
31 30 29 27 26 24
Reserved HPISTAT McBSP1STAT
R-0 R-0 R-0
23 21 20 18 17 16
McBSP0STAT I2CSTAT GPIOSTAT
R-0 R-0 R-0
15 14 12 11 9 8
GPIOSTAT TIMER1STAT TIMER0STAT EMACSTAT
R-0 R-0 R-0 R-0
7 6 5 3 2 0
EMACSTAT VCPSTAT TCPSTAT
R-0 R-0 R-0
LEGEND: R = Read only; -n= value after reset
Figure 3-6. Peripheral Status Register 0 (PERSTAT0) - 0x02AC 0014
Table 3-9. Peripheral Status Register 0 (PERSTAT0) Field Descriptions
Bit Field Value Description
31:30 Reserved Reserved.
29:27 HPISTAT HPI status
000 HPI is in the disabled state
001 HPI is in the enabled state
011 HPI is in the static powerdown state
100 HPI is in the disable in progress state
101 HPI is in the enable in progress state
Others Reserved
26:24 McBSP1STAT McBSP1 status
000 McBSP1 is in the disabled state
001 McBSP1 is in the enabled state
011 McBSP1 is in the static powerdown state
100 McBSP1 is in the disable in progress state
101 McBSP1 is in the enable in progress state
Others Reserved
23:21 McBSP0STAT McBSP0 status
000 McBSP0 is in the disabled state
001 McBSP0 is in the enabled state
011 McBSP0 is in the static powerdown state
100 McBSP0 is in the disable in progress state
101 McBSP0 is in the enable in progress state
Others Reserved
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Table 3-9. Peripheral Status Register 0 (PERSTAT0) Field Descriptions (continued)
Bit Field Value Description
20:18 I2CSTAT I2C status
000 I2C is in the disabled state
001 I2C is in the enabled state
011 I2C is in the static powerdown state
100 I2C is in the disable in progress state
101 I2C is in the enable in progress state
Others Reserved
17:15 GPIOSTAT GPIO status
000 GPIO is in the disabled state
001 GPIO is in the enabled state
011 GPIO is in the static powerdown state
100 GPIO is in the disable in progress state
101 GPIO is in the enable in progress state
Others Reserved
14:12 TIMER1STAT Timer1 status
000 Timer1 is in the disabled state
001 Timer1 is in the enabled state
011 Timer1 is in the static powerdown state
100 Timer1 is in the disable in progress state
101 Timer1 is in the enable in progress state
Others Reserved
11:9 TIMER0STAT Timer0 status
000 Timer0 is in the disabled state
001 Timer0 is in the enabled state
011 Timer0 is in the static powerdown state
100 Timer0 is in the disable in progress state
101 Timer0 is in the enable in progress state
Others Reserved
8:6 EMACSTAT EMAC/MDIO status
000 EMAC/MDIO is in the disabled state
001 EMAC/MDIO is in the enabled state
011 EMAC/MDIO is in the static powerdown state
100 EMAC/MDIO is in the disable in progress state
101 EMAC/MDIO is in the enable in progress state
Others Reserved
5:3 VCPSTAT VCP status
000 VCP is in the disabled state
001 VCP is in the enabled state
011 VCP is in the static powerdown state
100 VCP is in the disable in progress state
101 VCP is in the enable in progress state
Others Reserved
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Table 3-9. Peripheral Status Register 0 (PERSTAT0) Field Descriptions (continued)
Bit Field Value Description
2:0 TCPSTAT TCP status
000 TCP is in the disabled state
001 TCP is in the enabled state
011 TCP is in the static powerdown state
100 TCP is in the disable in progress state
101 TCP is in the enable in progress state
Others Reserved
31 16
Reserved
R-0
15 14 12 11 9 8 6 5 3 2 0
Rsvd RSA1STAT RSA0STAT VLYNQSTAT UTOPIASTAT PCISTAT
R-0 R-0 R-0 R-0 R-0 R-0
LEGEND: R = Read only; -n= value after reset
Figure 3-7. Peripheral Status Register 1 (PERSTAT1) - 0x02AC 0018
Table 3-10. Peripheral Status Register 1 (PERSTAT1) Field Descriptions
Bit Field Value Description
31:15 Reserved Reserved.
14:12 RSA1STAT RSA1 status
000 RSA1 is in the disabled state
001 RSA1 is in the enabled state
011 RSA1 is in the static powerdown state
100 RSA1 is in the disable in progress state
101 RSA1 is in the enable in progress state
Others Reserved
11:9 RSA0STAT RSA0 status
000 RSA0 is in the disabled state
001 RSA0 is in the enabled state
011 RSA0 is in the static powerdown state
100 RSA0 is in the disable in progress state
101 RSA0 is in the enable in progress state
Others Reserved
8:6 VLYNQSTAT VLYNQ status
000 VLYNQ is in the disabled state
001 VLYNQ is in the enabled state
011 VLYNQ is in the static powerdown state
100 VLYNQ is in the disable in progress state
101 VLYNQ is in the enable in progress state
Others Reserved
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Table 3-10. Peripheral Status Register 1 (PERSTAT1) Field Descriptions (continued)
Bit Field Value Description
5:3 UTOPIASTAT UTOPIA status
000 UTOPIA is in the disabled state
001 UTOPIA is in the enabled state
011 UTOPIA is in the static powerdown state
100 UTOPIA is in the disable in progress state
101 UTOPIA is in the enable in progress state
Others Reserved
2:0 PCISTAT PCI status
000 PCI is in the disabled state
001 PCI is in the enabled state
011 PCI is in the static powerdown state
100 PCI is in the disable in progress state
101 PCI is in the enable in progress state
Others Reserved
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3.4.5 EMAC Configuration Register (EMACCFG) Description
The EMAC Configuration Register (EMACCFG) is used to assert and deassert the reset of the Reduced
Media Independent Interface (RMII) logic of the EMAC. For more details on how to use this register, see
Section 8.14,Ethernet MAC (EMAC).
31 24
Reserved
R/W-0
23 19 18 17 16
Reserved RMII_RST Reserved
R/W-0001b R/W-1 R/W-0
15 0
Reserved
R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 3-8. EMAC Configuration Register (EMACCFG) - 0x02AC 0020
Table 3-11. EMAC Configuration Register (EMACCFG) Field Descriptions
Bit Field Value Description
31:19 Reserved Reserved. Writes to this register must keep the default values of these bits.
18 RMII_RST RMII reset bit. This bit is used to reset the RMII logic of the EMAC.
0 RMII logic reset is released.
1 RMII logic reset is asserted.
17:0 Reserved Reserved. Writes to this register must keep this bit as 0.
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3.4.6 Emulator Buffer Powerdown Register (EMUBUFPD) Description
The Emulator Buffer Powerdown Register (EMUBUFPD) is used to control the state of the pin buffers of
emulator pins EMU[18:2]. These buffers can be powered down if the device trace feature is not needed.
31 8
Reserved
R-0
7 1 0
Reserved EMUCTL
R-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 3-9. Emulator Buffer Powerdown Register (EMUBUFPD) - 0x02AC 0054
Table 3-12. Emulator Buffer Powerdown Register (EMUBUFPD) Field Descriptions
Bit Field Value Description
31:1 Reserved Reserved
0 EMUCTL Buffer powerdown for EMU[18:2] pins
0 Power-up buffers
1 Power-down buffers
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3.5 Device Status Register Description
The device status register depicts the device configuration selected upon device reset. Once set, these
bits will remain set until a device reset. For the actual register bit names and their associated bit field
descriptions, see Figure 3-10 and Table 3-13.
Note that enabling or disabling peripherals through the Peripheral Configuration Registers (PERCFG0 and
PERCFG1) does not affect the DEVSTAT register. To determine the status of peripherals following writes
to the PERCFG0 and PERCFG1 registers, read the Peripherals Status Registers (PERSTAT0 and
PERSTAT1).
31 24
Reserved
R-0000 0000
23 22 21 20 19 18 17 16
Reserved EMIFA_EN DDR2_EN PCI_EN CFGGP2 CFGGP1 CFGGP0 Reserved
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-1
15 14 13 12 11 10 9 8
SYSCLKOUT_ MCBSP1_EN PCI66 VLYNQ_EN PCI_EEAI MAC_SEL1 MAC_SEL0 Reserved
EN
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-1
76543210
UTOPIA_EN LENDIAN HPI_WIDTH AECLKINSEL BOOTMODE3 BOOTMODE2 BOOTMODE1 BOOTMODE0
R-0 R-1 R-0 R-0 R-0 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -x= value after reset
Note: The default values of the fields in the DEVSTAT register are latched from device configuration pins, as described in Section 3.1,
Device Configuration at Device Reset. The default values shown here correspond to the setting dictated by the internal pullup or pulldown
resistor.
Figure 3-10. Device Status Register (DEVSTAT) - 0x02A8 0000
Table 3-13. Device Status Register (DEVSTAT) Field Descriptions
Bit Field Value Description
31:23 Reserved Reserved. Read-only, writes have no effect.
22 EMIFA_EN EMIFA Enable (EMIFA_EN) status bit
Shows the status of whether the EMIFA peripheral pins are enabled/disabled.
0 EMIFA peripheral pins are disabled (default)
1 EMIFA peripheral pins are enabled
21 DDR2_EN DDR2 Memory Controller Enable (DDR2_EN) status bit
Shows the status of whether the DDR2 Memory Controller peripheral pins are enabled/disabled.
0 DDR2 Memory Controller peripheral pins are disabled (default)
1 DDR2 Memory Controller peripheral pins are enabled
20 PCI_EN PCI Enable (PCI_EN) status bit
Shows the status of which function is enabled on the HPI/PCI and PCI/UTOPIA multiplexed pins.
0 HPI and UTOPIA pin functions are enabled (default)
1 PCI pin functions are enabled
19:17 CFGGP[2:0] Used as General-Purpose inputs for configuration purposes.
These pins are latched at reset. These values can be used by S/W routines for boot operations.
16 Reserved Reserved. Read-only, writes have no effect.
15 SYSCLKOUT_EN SYSCLKOUT Enable (SYSCLKOUT_EN) status bit
Shows the status of which function is enabled on the SYSCLK4/GP[1] muxed pin.
0 GP[1] pin function of the SYSCLK4/GP[1] pin enabled (default)
1 SYSCLK4 pin function of the SYSCLK4/GP[1] pin enabled
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Table 3-13. Device Status Register (DEVSTAT) Field Descriptions (continued)
Bit Field Value Description
14 MCBSP1_EN McBSP1 Enable (MCBSP1_EN) status bit
Shows the status of which function is enabled on the McBSP1/GPIO muxed pins.
0 GPIO pin functions enabled (default)
1 McBSP1 pin functions enabled
13 PCI66 PCI Frequency Selection (PCI66) status bit
Shows the PCI operating frequency selected at reset.
0 PCI operates at 33 MHz (default)
1 PCI operates at 66 MHz
12 VLYNQ_EN VLYNQ Enable (VLYNQ_EN) status bit
Shows the status of which function is enabled on the VLYNQ/McBSP1/GPIO and VLYNQ/McBSP0
multiplexed pins.
0 McBSP1/GPIO and McBSP0 pin functions are enabled (default)
1 VLYNQ pin functions are enabled
11 PCI_EEAI PCI I2C EEPROM Auto-Initialization (PCI_EEAI) status bit
Shows whether the PCI auto-initialization via external I2C EEPROM is enabled/disabled.
0 PCI auto-initialization through external I2C EEPROM is disabled; the PCI peripheral uses the
specified PCI default values (default).
1 PCI auto-initialization through external I2C EEPROM is enabled; the PCI peripheral is configured
through external I2C EEPROM provided the PCI peripheral pin is enabled (PCI_EN = 1).
10:9 MACSEL[1:0] EMAC Interface Select (MACSEL[1:0]) status bits
Shows which EMAC interface mode has been selected.
00 10/100 EMAC/MDIO with MII Interface (default)
01 10/100 EMAC/MDIO with RMII Interface
10 10/100/1000 EMAC/MDIO with GMII Interface
11 10/100/1000 EMAC/MDIO with RGMII Mode Interface
[RGMII interface requires a 1.8-V or 1.5-V I/O supply]
8 Reserved Reserved. Read-only, writes have no effect.
7 UTOPIA_EN UTOPIA enable (UTOPIA_EN) status bit
Shows the status of which function is enabled on the UTOPIA/EMAC and UTOPIA/MDIO
multiplexed pins.
0 EMAC and MDIO pin functions are enabled (default)
1 UTOPIA pin functions are enabled
6 LENDIAN Device Endian mode (LENDIAN)
Shows the status of whether the system is operating in Big Endian mode or Little Endian mode
(default).
0 System is operating in Big Endian mode
1 System is operating in Little Endian mode (default)
5 HPI_WIDTH HPI bus width control bit.
Shows the status of whether the HPI bus operates in 32-bit mode or in 16-bit mode (default).
0 HPI operates in 16-bit mode. (default)
1 HPI operates in 32-bit mode
4 AECLKINSEL EMIFA input clock select
Shows the status of what clock mode is enabled or disabled for EMIFA.
0 AECLKIN (default mode)
1 SYSCLK4 (CPU/x) Clock Rate. The SYSCLK4 clock rate is software selectable via the PLL1
Controller. By default, SYSCLK4 is selected as CPU/8 clock rate.
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Table 3-13. Device Status Register (DEVSTAT) Field Descriptions (continued)
Bit Field Value Description
3:0 BOOTMODE[3:0] Boot mode configuration bits
Shows the status of what device boot mode configuration is operational.
BOOTMODE[3:0]
[Note: if selected for boot, the corresponding peripheral is automatically enabled after device reset.]
0000 No boot (default mode)
0001 Host boot (HPI)
0010 Reserved
0011 Reserved
0100 EMIFA 8-bit ROM boot
0101 Master I2C boot
0110 Slave I2C boot
0111 Host boot (PCI)
1000 Serial Rapid I/O boot
thru
1111 For more detailed information on the boot modes, see Section 2.4,Boot Sequence.
3.6 JTAG ID (JTAGID) Register Description
The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the
TCI6482 device, the JTAG ID register resides at address location 0x02A8 0008. For the actual register bit
names and their associated bit field descriptions, see Figure 3-11 and Table 3-14.
31 28 27 12 11 1 0
VARIANT PART NUMBER MANUFACTURER LSB
(4-bit) (16-bit) (11-bit)
R-n R-0000 0000 1000 1010b 0000 0010 111b R-1
LEGEND: R = Read only; -n= value after reset
Figure 3-11. JTAG ID (JTAGID) Register - 0x02A8 0008
Table 3-14. JTAG ID (JTAGID) Register Field Descriptions
Bit Field Value Description
31:28 VARIANT Variant (4-Bit) value. The value of this field depends on the silicon revision being
used. For more information, see the TMS320TCI6482 Digital Signal Processor
Silicon Errata (literature number SPRZ235).
Note: the VARIANT field may be invalid if no CLKIN1 signal is applied.
27:12 PART NUMBER Part Number (16-Bit) value. TCI6482 device value: 0000 0000 1000 1010b.
11:1 MANUFACTURER Manufacturer (11-Bit) value. TCI6482 device value: 0000 0010 111b.
0 LSB LSB. This bit is read as a "1" for the TCI6482 device.
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3.7 Pullup/Pulldown Resistors
Proper board design should ensure that input pins to the TCI6482 device always be at a valid logic level
and not floating. This may be achieved via pullup/pulldown resistors. The TCI6482 device features internal
pullup (IPU) and internal pulldown (IPD) resistors on most pins to eliminate the need, unless otherwise
noted, for external pullup/pulldown resistors.
An external pullup/pulldown resistor needs to be used in the following situations:
•Device Configuration Pins: If the pin is both routed out and 3-stated (not driven), an external
pullup/pulldown resistor must be used, even if the IPU/IPD matches the desired value/state.
•Other Input Pins: If the IPU/IPD does not match the desired value/state, use an external
pullup/pulldown resistor to pull the signal to the opposite rail.
For the device configuration pins (listed in Table 3-1), if they are both routed out and 3-stated (not driven),
it is strongly recommended that an external pullup/pulldown resistor be implemented. Although, internal
pullup/pulldown resistors exist on these pins and they may match the desired configuration value,
providing external connectivity can help ensure that valid logic levels are latched on these device
configuration pins. In addition, applying external pullup/pulldown resistors on the device configuration pins
adds convenience to the user in debugging and flexibility in switching operating modes.
Tips for choosing an external pullup/pulldown resistor:
• Consider the total amount of current that may pass through the pullup or pulldown resistor. Make sure
to include the leakage currents of all the devices connected to the net, as well as any internal pullup or
pulldown resistors.
• Decide a target value for the net. For a pulldown resistor, this should be below the lowest VIL level of
all inputs connected to the net. For a pullup resistor, this should be above the highest VIH level of all
inputs on the net. A reasonable choice would be to target the VOL or VOH levels for the logic family of
the limiting device; which, by definition, have margin to the VIL and VIH levels.
• Select a pullup/pulldown resistor with the largest possible value; but, which can still ensure that the net
will reach the target pulled value when maximum current from all devices on the net is flowing through
the resistor. The current to be considered includes leakage current plus, any other internal and
external pullup/pulldown resistors on the net.
• For bidirectional nets, there is an additional consideration which sets a lower limit on the resistance
value of the external resistor. Verify that the resistance is small enough that the weakest output buffer
can drive the net to the opposite logic level (including margin).
• Remember to include tolerances when selecting the resistor value.
• For pullup resistors, also remember to include tolerances on the DVDD rail.
For most systems, a 1-kΩresistor can be used to oppose the IPU/IPD while meeting the above criteria.
Users should confirm this resistor value is correct for their specific application.
For most systems, a 20-kΩresistor can be used to compliment the IPU/IPD on the device configuration
pins while meeting the above criteria. Users should confirm this resistor value is correct for their specific
application.
For more detailed information on input current (II), and the low-/high-level input voltages (VIL and VIH) for
the TCI6482 device, see Section 7.3,Electrical Characteristics Over Recommended Ranges of Supply
Voltage and Operating Case Temperature.
To determine which pins on the TCI6482 device include internal pullup/pulldown resistors, see Table 2-3,
Terminal Functions.
3.8 Configuration Examples
Figure 3-12 and Figure 3-13 illustrate examples of peripheral selections/options that are configurable on
the TCI6482 device.
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Shadingdenotesaperipheralmodulenotavailableforthisconfiguration.
UTOPIA
McBSP0 TIMER0
EMIFA
GPIO
PLL2and
PLL2
Controller
TIMER1
PLL1and
PLL1
Controller
DDR2
Memory
Controller
VCP2
AED[63:0]
64
AECLKIN, AARDY, AHOLD
AEA[22:3], ACE[3:0], ABE[7:0],
AECLKOUT, ASDCKE,
AHOLDA, ABUSREQ,
ASADS/ASRE, AAOE/ASOE,
AAWE/ASWE
SCL
SDA
CLKIN1,PLLV1
SYSCLK4
RIOCLK,RIOCLK,RIOTX[3:0],
RIOTX[3:0],RIORX[3:0],RIORX[3:0]
HRDY,HINT
HCNTL0,HCNTL1,HHWIL,
HAS,HR/W,HCS,HDS1,HDS2
CLKR0,FSR0,DR0,CLKS0,
DX0,FSX0,CLKX0
MRXD[3:0],MRXER,MRXDV,MCOL,
MCRS,MTCLK,MRCLK,MTXD[3:0],
MTXEN
32
HD[31:0]
TCP2
CLKIN2,PLLV2
GP[15:12,2,1]
DEA[21:2],DCE[1:0],DBE[3:0],DDRCLK,DDRCLK,
DSDCKE,DDQS,DDQS,DSDCAS,DSDRAS,
DSDWE
DEVSTAT Register:0x0061 9161
PCI_EN=0(PCIdisabled,default)
ABA1(EMIFA_EN)=1(EMIFA enabled)
ABA0(DDR2_EN)=1(DDR2MemoryControllerenabled)
VLYNQ
VTXD[3:0]
McBSP1
EMAC RapidIO
32
ED[31:0]
TINP1L
TOUT1L
TOUT0
TINP0
GMDIO,GMDCLK MDIO I2C
PCI
HPI
(32-Bit)
AEA[19:16](BOOTMODE[3:0])=0001,(HPIBoot)
AEA[15](AECLKIN_SEL)=0,(AECLKIN,default)
AEA[14](HPI_WIDTH)=1,(HPI,32-bitOperation)
AEA[13](LENDIAN)=IPU,(LittleEndianMode,default)
AEA[12](UTOPIA_EN)=0,(UTOPIA disabled,default)
AEA[11]=1,(mustopposeIPD)
AEA [10:9](MACSEL[1:0])=00,(10/100MIIMode)
AEA[8](PCI_EEAI)=0,(PCII2CEEPROM Auto-Initdisabled,default)
AEA[7](VLYNQ_EN)=1,(VLYNQenabled)
AEA[6](PCI66)=0,(PCI33MHz,[default,don’tcare])
AEA[5](MCBSP1_EN)=0,(McBSP1disabled,default)
AEA[4](SYSCLKOUT_EN)=1,(SYSCLK4pinfunction)
AEA[3]=1,(mustopposeIPD)
AEA[2:0](CFGGP[2:0])=000,(default)
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
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Figure 3-12. Configuration Example A (McBSP + HPI32 + I2C + EMIFA + DDR2 Memory Controller +
TIMERS + RapidIO + EMAC (MII) + MDIO + VLYNQ)
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Shadingdenotesaperipheralmodulenotavailableforthisconfiguration.
UTOPIA
McBSP0 TIMER0
EMIFA
GPIO
TIMER1
PLL1and
PLL1
Controller
DDR2
Memory
Controller
VCP2
AED[63:0]
64
AECLKIN, AARDY, AHOLD
AEA[22:3], ACE[3:0], ABE[7:0],
AECLKOUT, ASDCKE,
AHOLDA, ABUSREQ,
ASADS/ASRE, AAOE/ASOE,
AAWE/ASWE
SCL
SDA
CLKIN1,PLLV1
SYSCLK4
RIOCLK,RIOCLK,RIOTX[3:0],
RIOTX[3:0],RIORX[3:0],RIORX[3:0]
HRDY,HINT
HCNTL0,HCNTL1,HHWIL,
HAS,HR/W,HCS,HDS1,HDS2
CLKR0,FSR0,DR0,CLKS0,
DX0,FSX0,CLKX0
MRXD[7:0],MRXER,MRXDV,MCOL,
MCRS,MTCLK,MRCLK,MTXD[7:0],
MTXEN
32
HD[31:0]
TCP2
CLKIN2,PLLV2
GP[15:12,2,1]
DEA[21:2],DCE[1:0],DBE[3:0],DDRCLK,DDRCLK,
DSDCKE,DDQS,DDQS,DSDCAS,DSDRAS,
DSDWE
DEVSTAT Register:0x0061 C551
PCI_EN=0(PCIdisabled)
ABA1(EMIFA_EN)=1(EMIFA enabled)
ABA0(DDR2_EN)=1(DDR2MemoryControllerenabled)
VLYNQ
McBSP1
EMAC RapidIO
32
ED[31:0]
TINP1L
TOUT1L
TOUT0
TINP0
GMDIO,GMDCLK MDIO I2C
PCI
HPI
(32-Bit)
AEA[19:16](BOOTMODE[3:0])=0001,(HPIBoot)
AEA[15](AECLKIN_SEL)=0,(AECLKIN,default)
AEA[14](HPI_WIDTH)=1,(HPI,32-bitOperation)
AEA[13](LENDIAN)=IPU,(LittleEndianMode,default)
AEA[12](UTOPIA_EN)=0,(UTOPIA disabled,default)
AEA[11]=1,(mustopposeIPD)
AEA [10:9](MACSEL[1:0])=10,(10/100/1000GMIIMode)
AEA[8](PCI_EEAI)=0,(PCII2CEEPROM Auto-Initdisabled,default)
AEA[7](VLYNQ_EN)=0,(VLYNQdisabled,default)
AEA[6](PCI66)=0,(PCI33MHz,[default,don’tcare])
AEA[5](MCBSP1_EN)=1,(McBSP1enabled)
AEA[4](SYSCLKOUT_EN)=1,(SYSCLK4pinfunction)
AEA[3]=1,(mustopposeIPD)
AEA[2:0](CFGGP[2:0])=000,(default)
CLKR1,FSR1,DR1,CLKS1,
DX1,FSX1,CLKX1
PLL2and
PLL2
Controller
TMS320TCI6482
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SPRS246K –APRIL 2005–REVISED MARCH 2012
Figure 3-13. Configuration Example B (2 McBSPs + HPI32 + I2C + EMIFA + DDR2 Memory Controller +
TIMERS + RapidIO + EMAC (GMII) + MDIO
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4 System Interconnect
On the TCI6482 device, the C64x+ Megamodule, the EDMA3 transfer controllers, and the system
peripherals are interconnected through two switch fabrics. The switch fabrics allow for low-latency,
concurrent data transfers between master peripherals and slave peripherals. Through a switch fabric the
CPU can send data to the Viterbi co-processor (VCP2) without affecting a data transfer between the PCI
and the DDR2 memory controller. The switch fabrics also allow for seamless arbitration between the
system masters when accessing system slaves.
4.1 Internal Buses, Bridges, and Switch Fabrics
Two types of buses exist in the TCI6482 device: data buses and configuration buses. Some TCI6482
device peripherals have both a data bus and a configuration bus interface, while others only have one
type of interface. Furthermore, the bus interface width and speed varies from peripheral to peripheral.
Configuration buses are mainly used to access the register space of a peripheral and the data buses are
used mainly for data transfers. However, in some cases, the configuration bus is also used to transfer
data. For example, data is transferred to the VCP2 and TCP2 via their configuration bus. Similarly, the
data bus can also be used to access the register space of a peripheral. For example, the EMIFA and
DDR2 memory controller registers are accessed through their data bus interface.
The C64x+ Megamodule, the EDMA3 traffic controllers, and the various system peripherals can be
classified into two categories: masters and slaves. Masters are capable of initiating read and write
transfers in the system and do not rely on the EDMA3 for their data transfers. Slaves on the other hand
rely on the EDMA3 to perform transfers to and from them. Masters include the EDMA3 traffic controllers,
SRIO, and PCI. Slaves include the McBSP, UTOPIA, and I2C.
The TCI6482 device contains two switch fabrics through which masters and slaves communicate. The
data switch fabric, known as the data switched central resource (SCR), is a high-throughput interconnect
mainly used to move data across the system (for more information, see Section 4.2). The data SCR
connects masters to slaves via 128-bit data buses running at a SYSCLK2 frequency (SYSCLK2 is
generated from PLL1 controller). Peripherals that have a 128-bit data bus interface running at this speed
can connect directly to the data SCR; other peripherals require a bridge.
The configuration switch fabric, also known as the configuration switch central resource (SCR) is mainly
used by the C64x+ Megamodule to access peripheral registers (for more information, see Section 4.3).
The configuration SCR connects C64x+ Megamodule to slaves via 32-bit configuration buses running at a
SYSCLK2 frequency (SYSCLK2 is generated from PLL1 controller). As with the data SCR, some
peripherals require the use of a bridge to interface to the configuration SCR. Note that the data SCR also
connects to the configuration SCR.
Bridges perform a variety of functions:
• Conversion between configuration bus and data bus.
• Width conversion between peripheral bus width and SCR bus width.
• Frequency conversion between peripheral bus frequency and SCR bus frequency.
For example, the EMIFA and DDR2 memory controller require a bridge to convert their 64-bit data bus
interface into a 128-bit interface so that they can connect to the data SCR. In the case of the TCP2 and
VCP2, a bridge is required to connect the data SCR to the 64-bit configuration bus interface.
Note that some peripherals can be accessed through the data SCR and also through the configuration
SCR.
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4.2 Data Switch Fabric Connections
Figure 4-1 shows the connection between slaves and masters through the data switched central resource
(SCR). Masters are shown on the right and slaves on the left. The data SCR connects masters to slaves
via 128-bit data buses running at a SYSCLK2 frequency. SYSCLK2 is supplied by the PLL1 controller and
is fixed at a frequency equal to the CPU frequency divided by 3.
Some peripherals, like PCI and the C64x+ Megamodule, have both slave and master ports. Note that
each EDMA3 transfer controller has an independent connection to the data SCR.
The Serial RapidIO (SRIO) peripheral has two connections to the data SCR. The first connection is used
when descriptors are being fetched from system memory. The other connection is used for all other data
transfers.
Note that masters can access the configuration SCR through the data SCR. The configuration SCR is
described in Section 4.3.
Not all masters on the TCI6482 DSP may connect to all slaves. Allowed connections are summarized in
Table 4-1 .
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Serial RapidIO
(Descriptor)
M
EMAC
HPI
M
M
M
128-bit
(SYSCLK2)
M3
M0
S
S
M
M
M
M
S TCP2
VCP2S
McBSPsS
UTOPIAS
DDR2
Memory
Controller
S
EMIFAS
PCI
S
MASTER SLAVE
SM
Bridge
CFG
SCR
S
Bridge
PCI M
EDMA3 Channel
Controller
EDMA3
Transfer
Controllers
Megamodule
M1
M2
S3
S0
S1
S2
M
Serial
RapidIO
(Data)
S
VLYNQ
S
VLYNQSS
Events
MMegamodule
Data SCR
Bridge
128 (SYSCLK2)
128 (SYSCLK2)
128 (SYSCLK2)
128 (SYSCLK2)
32 (SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
128 (SYSCLK2)
128 (SYSCLK2)
128 (SYSCLK2)
32
(SYSCLK3)
32
(SYSCLK3)
128
(SYSCLK2)
64 (SYSCLK2)
64 (SYSCLK2)
Bridge
Bridge
Bridge
128
(SYSCLK3)
32
(SYSCLK3)
Bridge
Bridge
128
(SYSCLK2)
128
(SYSCLK2)
64
(SYSCLK2)
64
(SYSCLK2)
32
(SYSCLK3)
32 (SYSCLK2)
Configuration Bus
Data Bus
S
128
(SYSCLK2)
128
(SYSCLK2)
M
M
32
(SYSCLK3)
32 (SYSCLK3)
32
(SYSCLK3)
128 (SYSCLK2)
32
(SYSCLK3)
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
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Figure 4-1. Switched Central Resource Block Diagram
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Table 4-1. SCR Connection Matrix
DDR2 MEMORY
TCP2 VCP2 McBSPs UTOPIA2 CONFIGURATION SCR VLYNQ PCI EMIFA MEGAMODULE
CONTROLLER
TC0 Y Y N N N N N Y Y Y
TC1 N N Y Y Y Y Y Y Y Y
TC2 N N N N N Y Y Y Y Y
TC3 N N N N N Y Y Y Y Y
EMAC N N N N N N N Y Y Y
HPI N N N N Y Y N Y Y Y
PCI N N N N Y Y N Y Y Y
SRIO(1) N N N N Y N N Y Y Y
Megamodule Y Y Y Y Y Y Y Y Y N
VLYNQ N N N N Y N N Y Y Y
(1) Applies to both descriptor and data accesses by the SRIO peripheral.
4.3 Configuration Switch Fabric
Figure 4-2 shows the connection between the C64x+ Megamodule and the configuration switched central
resource (SCR). The configuration SCR is mainly used by the C64x+ Megamodule to access peripheral
registers. The data SCR also has a connection to the configuration SCR which allows masters to access
most peripheral registers. The only registers not accessible by the data SCR through the configuration
SCR are the device configuration registers and the PLL1 and PLL2 controller registers; these can only be
accessed by the C64x+ Megamodule.
The configuration SCR uses 32-bit configuration buses running at SYSCLK2 frequency. SYSCLK2 is
supplied by the PLL1 controller and is fixed at a frequency equal to the CPU frequency divided by 3.
Copyright © 2005–2012, Texas Instruments Incorporated System Interconnect 81
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Megamodule M
CFG SCR
S
M
M
STCP2
VCP2
S
McBSPs
S
UTOPIA
S
Timers
S
HPI
S
PCI
S
S
Bridge
7
GPIO
S
EMAC/MDIO
M
Data SCR S
S
I2C
SS
PLL
Controllers(A)
S
SDevice
Configuration
Registers(A)
EDMA3 TC0
S
EDMA3 TC1
S
Serial RapidIO
S
SEDMA3 TC2
S
EDMA3 CC
SS
EDMA3 TC3
S
M
M
32
(SYSCLK3)
32 (SYSCLK2)
32 (SYSCLK2)
MUX
32
(SYSCLK2)
32
(SYSCLK2)
32 (SYSCLK2)
32 (SYSCLK2)
32
(SYSCLK3)
32
(SYSCLK2)
32 (SYSCLK2)
32-bit
(SYSCLK2)
Configuration Bus
Data Bus
MUX
MUX
32
(SYSCLK2)
32
(SYSCLK2)
32
(SYSCLK2)
32
(SYSCLK2)
A. Only accessible by the C64x+ Megamodule.
B. All clocks in this figure are generated by the PLL1 controller.
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK3)
32
(SYSCLK2)
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Figure 4-2. C64x+ Megamodule - SCR Connection
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4.4 Bus Priorities
On the TCI6482 device, bus priority is programmable for each master. The register bit fields and default
priority levels for TCI6482 bus masters are shown in Table 4-2. The priority levels should be tuned to
obtain the best system performance for a particular application. Lower values indicate higher priorities. For
some masters, the priority values are programmed at the system level by configuring the PRI_ALLOC
register. Details on the PRI_ALLOC register are shown in Figure 4-3. The C64x+ megamodule, SRIO, and
EDMA masters contain registers that control their own priority values.
The priority is enforced when several masters in the system are vying for the same endpoint. Note that the
configuration SCR port on the data SCR is considered a single endpoint meaning priority will be enforced
when multiple masters try to access the configuration SCR. Priority is also enforced on the configuration
SCR side when a master (through the data SCR) tries to access the same endpoint as the C64x+
megamodule.
In the PRI_ALLOC register, the HOST field applies to the priority of the HPI and PCI peripherals. The
EMAC and VLYNQ fields specify the priority of the EMAC and VLYNQ peripherals, respectively. The
SRIO field is used to specify the priority of the Serial RapidIO when accessing descriptors from system
memory. The priority for Serial RapidIO data accesses is set in the peripheral itself.
Table 4-2. TCI6482 Default Bus Master Priorities
DEFAULT
BUS MASTER PRIORITY CONTROL
PRIORITY LEVEL
EDMA3TC0 0 QUEPRI.PRIQ0 (EDMA3 register)
EDMA3TC1 0 QUEPRI.PRIQ1 (EDMA3 register)
EDMA3TC2 0 QUEPRI.PRIQ2 (EDMA3 register)
EDMA3TC3 0 QUEPRI.PRIQ3 (EDMA3 register)
SRIO (Data Access) 0 PER_SET_CNTL.CBA_TRANS_PRI
(SRIO register)
SRIO (Descriptor Access) 0 PRI_ALLOC.SRIO
EMAC 1 PRI_ALLOC.EMAC
PCI 2 PRI_ALLOC.HOST
HPI 2 PRI_ALLOC.HOST
C64x+ Megamodule (MDMA port) 7 MDMAARBE.PRI (C64x+ Megamodule
Register)
31 16
Reserved
R-0000 0000 0000 0000
15 12 11 9 8 6 5 3 2 0
Reserved SRIO VLYNQ HOST EMAC
R-000 0 R/W-001 R/W-100 R/W-010 R/W-001
LEGEND: R/W = Read/Write; R = Read only; -n = value at reset
Figure 4-3. Priority Allocation Register (PRI_ALLOC)
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A register file
Data path 1 Data path 2
B register file
D2 S2
xx
xx
M2 L2
Instruction decode
M1
xx
xx
L1 S1 D1
16/32−bit instruction dispatch
Instruction fetch
SPLOOP buffer
64 64
C64x+ CPU
256
32
L1D cache/SRAM
Bandwidth management
Memory protection
L1 data memory controller
IDMA
256
256
Bandwidth management
L1 program memory controller
Memory protection
256
Advanced event
triggering
(AET)
Interrupt
and exception
controller
Power control
L2 memory
controller
256
256
Master DMA
Slave DMA
128
256
L1P cache/SRAM
L2
cache/
SRAM
256
128
128
To primary
switch fabric
Cache
control
Bandwidth
management
Memory
protection
Cache control
Cache control
Internal
ROM(A) 256
Configuration
Registers
32
To Chip
registers
External memory
controller
A. When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
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5 C64x+ Megamodule
The C64x+ Megamodule consists of several components — the C64x+ CPU, the L1 program and data
memory controllers, the L2 memory controller, the internal DMA (IDMA), the interrupt controller, power-
down controller, and external memory controller. The C64x+ Megamodule also provides support for
memory protection (for L1P, L1D, and L2 memories) and bandwidth management (for resources local to
the C64x+ Megamodule). Figure 5-1 shows a block diagram of the C64x+ Megamodule.
Figure 5-1. 64x+ Megamodule Block Diagram
For more detailed information on the TMS320C64x+ Megamodule on the TCI6482 device, see the
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).
5.1 Memory Architecture
The TMS320TCI6482 device contains a 2048KB level-2 memory (L2), a 32KB level-1 program memory
(L1P), and a 32KB level-1 data memory (L1D).
The L1P memory configuration for the TCI6482 device is as follows:
• Region 0 size is 0K bytes (disabled).
• Region 1 size is 32K bytes with no wait states.
The L1D memory configuration for the TCI6482 device is as follows:
• Region 0 size is 0K bytes (disabled).
• Region 1 size is 32K bytes with no wait states.
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4K bytes
8K bytes
16K bytes
L1P memory 00E0 0000h
00E0 4000h
00E0 6000h
00E0 7000h
00E0 8000h
direct
mapped
SRAM
1/2
dm
3/4
SRAM
SRAM
7/8
All
SRAM
000 001 010 011 100 Block base
address
L1P mode bits
cache 4K bytes
cache
direct
mapped
cache
direct
mapped
cache
4K bytes
8K bytes
16K bytes
L1D memory 00F0 0000h
00F0 4000h
00F0 6000h
00F0 7000h
00F0 8000h
2-way
SRAM
1/2
2-way
3/4
SRAM
SRAM
7/8
All
SRAM
000 001 010 011 100 Block base
address
L1D mode bits
cache 4K bytes
cache
2-way
cache
2-way
cache
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L1D is a two-way set-associative cache while L1P is a direct-mapped cache.
The L1P and L1D cache can be reconfigured via software through the L1PMODE field of the L1P
Configuration Register (L1PMODE) and the L1DMODE field of the L1D Configuration Register (L1DCFG)
of the C64x+ Megamodule. After device reset, L1P and L1D cache are configured as all cache or all
SRAM. The on-chip Bootloader changes the reset configuration for L1P and L1D. For more information,
see the TMS320TCI648x Bootloader User's Guide (literature number SPRUEC7) .
Figure 5-2 and Figure 5-3 show the available SRAM/cache configurations for L1P and L1D, respectively.
Figure 5-2. TMS320TCI6482 L1P Memory Configurations
Figure 5-3. TMS320TCI6482 L1D Memory Configurations
The L2 memory configuration for the TCI6482 device is as follows:
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32K bytes
64K bytes
128K bytes
1792K bytes
L2 memory
0080 0000h
009C 0000h
009E 0000h
009F 0000h
009F 8000h
00A0 0000h
7/8
SRAM
4-way
cache
4-way
cache
15/16
SRAM
4-way
cache
31/32
SRAM
4-way
63/64
SRAM
All
SRAM
000 001 010 011 111
Block base
address
L2 mode bits
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• Port 0 configuration:
– Memory size is 2048KB
– Starting address is 0080 0000h
– 2-cycle latency
– 4 × 128-bit bank configuration
• Port 1 configuration:
– Memory size is 32K bytes (this corresponds to the internal ROM)
– Starting address is 0010 0000h
– 1-cycle latency
– 1 × 256-bit bank configuration
L2 memory can be configured as all SRAM or as part 4-way set-associative cache. The amount of L2
memory that is configured as cache is controlled through the L2MODE field of the L2 Configuration
Register (L2CFG) of the C64x+ Megamodule. Figure 5-4 shows the available SRAM/cache configurations
for L2. By default, L2 is configured as all SRAM after device reset.
Figure 5-4. TMS320TCI6482 L2 Memory Configurations
For more information on the operation L1 and L2 caches, see the TMS320C64x+ DSP Cache User's
Guide (literature number SPRU862).
All memory on the TCI6482 device has a unique location in the memory map (see Table 2-2).
When accessing the internal ROM of the DSP, the CPU frequency must always be less than 750 MHz.
Therefore, when using a software boot mode, care must be taken such that the CPU frequency does not
exceed 750 MHz at any point during the boot sequence. After the boot sequence has completed, the CPU
frequency can be programmed to the frequency required by the application. For more detailed information
ont he boot modes, see Section 2.4,Boot Sequence.
5.2 Memory Protection
Memory protection allows an operating system to define who or what is authorized to access L1D, L1P,
and L2 memory. To accomplish this, the L1D, L1P, and L2 memories are divided into pages. There are 16
pages of L1P (2KB each), 16 pages of L1D (2KB each), and 32 pages of L2 (64KB each). The L1D, L1P,
and L2 memory controllers in the C64x+ Megamodule are equipped with a set of registers that specify the
permissions for each memory page.
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Each page may be assigned with fully orthogonal user and supervisor read, write, and execute
permissions. Additionally, a page may be marked as either (or both) locally or globally accessible. A local
access is a direct CPU access to L1D, L1P, and L2, while a global access is initiated by a DMA (either
IDMA or the EDMA3) or by other system masters. Note that EDMA or IDMA transfers programmed by the
CPU count as global accesses.
The CPU and the system masters on the TCI6482 device are all assigned a privilege ID of 0. Therefore it
is only possible to specify whether memory pages are locally or globally accessible. The AID0 and LOCAL
bits of the memory protection page attribute registers specify the memory page protection scheme, see
Table 5-1.
Table 5-1. Available Memory Page Protection Schemes
AID0 Bit LOCAL Bit Description
0 0 No access to memory page is permitted.
0 1 Only direct access by CPU is permitted.
1 0 Only accesses by system masters and IDMA are permitted (includes EDMA and IDMA
accesses initiated by the CPU).
1 1 All accesses permitted
For more information on memory protection for L1D, L1P, and L2, see the TMS320C64x+ Megamodule
Reference Guide (literature number SPRU871).
5.3 Bandwidth Management
When multiple requestors contend for a single C64x+ Megamodule resource, the conflict is solved by
granting access to the highest priority requestor. The following four resources are managed by the
Bandwidth Management control hardware:
• Level 1 Program (L1P) SRAM/Cache
• Level 1 Data (L1D) SRAM/Cache
• Level 2 (L2) SRAM/Cache
• Memory-mapped registers configuration bus
The priority level for operations initiated within the C64x+ Megamodule; e.g., CPU-initiated transfers, user-
programmed cache coherency operations, and IDMA-initiated transfers, are declared through registers in
the C64x+ Megamodule. The priority level for operations initiated outside the C64x+ Megamodule by
system peripherals is declared through the Priority Allocation Register (PRI_ALLOC), see Section 4.4.
System peripherals with no fields in PRI_ALLOC have their own registers to program their priorities.
More information on the bandwidth management features of the C64x+ Megamodule can be found in the
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).
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5.4 Power-Down Control
The C64x+ Megamodule supports the ability to power-down various parts of the C64x+ Megamodule. The
power-down controller (PDC) of the C64x+ Megamodule can be used to power down L1P, the cache
control hardware, the CPU, and the entire C64x+ Megamodule. These power-down features can be used
to design systems for lower overall system power requirements.
NOTE
The TCI6482 device does not support power-down modes for the L2 memory at this time.
More information on the power-down features of the C64x+ Megamodule can be found in the
TMS320C64x+ Megamodule Reference Guide (literature number SPRU871).
5.5 Megamodule Resets
Table 5-2 shows the reset types supported on the TCI6482 device and they affect the resetting of the
Megamodule, either both globally or just locally.
Table 5-2. Megamodule Reset (Global or Local)
GLOBAL LOCAL
RESET TYPE MEGAMODULE MEGAMODULE
RESET RESET
Power-On Reset Y Y
Warm Reset Y Y
Max Reset Y Y
System Reset Y Y
CPU Reset N Y
For more detailed information on the global and local megamodule resets, see the TMS320C64x+
Megamodule Reference Guide (literature number SPRU871) and for more detailed information on device
resets, see Section 8.6,Reset Controller.
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5.6 Megamodule Revision
The version and revision of the C64x+ Megamodule can be read from the Megamodule Revision ID
Register (MM_REVID) located at address 0181 2000h. The MM_REVID register is shown in Figure 5-5
and described in Table 5-3. The C64x+ Megamodule revision is dependant on the silicon revision being
used. For more information, see the TMS320TCI6482 Digital Signal Processor Silicon Errata (literature
number SPRZ235) .
31 16 15 0
VERSION REVISION(A)
R-1h R-n
LEGEND: R = Read only; -n= value after reset
A. The C64x+ Megamodule revision is dependant on the silicon revision being used. For more information, see
the TMS320TCI6482 Digital Signal Processor Silicon Errata (literature number SPRZ235) .
Figure 5-5. Megamodule Revision ID Register (MM_REVID) [Hex Address: 0181 2000h]
Table 5-3. Megamodule Revision ID Register (MM_REVID) Field Descriptions
Bit Field Value Description
31:16 VERSION 1h Version of the C64x+ Megamodule implemented on the device. This field is always read as 1h.
15:0 REVISION Revision of the C64x+ Megamodule version implemented on the device. The C64x+ Megamodule
revision is dependant on the silicon revision being used. For more information, see the
TMS320TCI6482 Digital Signal Processor Silicon Errata (literature number SPRZ235) .
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5.7 C64x+ Megamodule Register Descriptions
Table 5-4. Megamodule Interrupt Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0180 0000 EVTFLAG0 Event Flag Register 0 (Events [31:0])
0180 0004 EVTFLAG1 Event Flag Register 1
0180 0008 EVTFLAG2 Event Flag Register 2
0180 000C EVTFLAG3 Event Flag Register 3
0180 0010 - 0180 001C - Reserved
0180 0020 EVTSET0 Event Set Register 0 (Events [31:0])
0180 0024 EVTSET1 Event Set Register 1
0180 0028 EVTSET2 Event Set Register 2
0180 002C EVTSET3 Event Set Register 3
0180 0030 - 0180 003C - Reserved
0180 0040 EVTCLR0 Event Clear Register 0 (Events [31:0])
0180 0044 EVTCLR1 Event Clear Register 1
0180 0048 EVTCLR2 Event Clear Register 2
0180 004C EVTCLR3 Event Clear Register 3
0180 0050 - 0180 007C - Reserved
0180 0080 EVTMASK0 Event Mask Register 0 (Events [31:0])
0180 0084 EVTMASK1 Event Mask Register 1
0180 0088 EVTMASK2 Event Mask Register 2
0180 008C EVTMASK3 Event Mask Register 3
0180 0090 - 0180 009C - Reserved
0180 00A0 MEVTFLAG0 Masked Event Flag Status Register 0 (Events [31:0])
0180 00A4 MEVTFLAG1 Masked Event Flag Status Register 1
0180 00A8 MEVTFLAG2 Masked Event Flag Status Register 2
0180 00AC MEVTFLAG3 Masked Event Flag Status Register 3
0180 00B0 - 0180 00BC - Reserved
0180 00C0 EXPMASK0 Exception Mask Register 0 (Events [31:0])
0180 00C4 EXPMASK1 Exception Mask Register 1
0180 00C8 EXPMASK2 Exception Mask Register 2
0180 00CC EXPMASK3 Exception Mask Register 3
0180 00D0 - 0180 00DC - Reserved
0180 00E0 MEXPFLAG0 Masked Exception Flag Register 0
0180 00E4 MEXPFLAG1 Masked Exception Flag Register 1
0180 00E8 MEXPFLAG2 Masked Exception Flag Register 2
0180 00EC MEXPFLAG3 Masked Exception Flag Register 3
0180 00F0 - 0180 00FC - Reserved
0180 0100 - Reserved
0180 0104 INTMUX1 Interrupt Multiplexor Register 1
0180 0108 INTMUX2 Interrupt Multiplexor Register 2
0180 010C INTMUX3 Interrupt Multiplexor Register 3
0180 0110 - 0180 013C - Reserved
0180 0140 AEGMUX0 Advanced Event Generator Mux Register 0
0180 0144 AEGMUX1 Advanced Event Generator Mux Register 1
0180 0148 - 0180 017C - Reserved
0180 0180 INTXSTAT Interrupt Exception Status Register
0180 0184 INTXCLR Interrupt Exception Clear Register
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Table 5-4. Megamodule Interrupt Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0180 0188 INTDMASK Dropped Interrupt Mask Register
0180 0188 - 0180 01BC - Reserved
0180 01C0 EVTASRT Event Asserting Register
0180 01C4 - 0180 FFFF - Reserved
Table 5-5. Megamodule Powerdown Control Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0181 0000 PDCCMD Power-down controller command register
0181 0004 - 0181 1FFF - Reserved
Table 5-6. Megamodule Revision Register
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0181 2000 MM_REVID Megamodule Revision ID Register
0181 2004 - 0181 2FFF - Reserved
Table 5-7. Megamodule IDMA Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0182 0000 IDMA0STAT IDMA Channel 0 Status Register
0182 0004 IDMA0MASK IDMA Channel 0 Mask Register
0182 0008 IMDA0SRC IDMA Channel 0 Source Address Register
0182 000C IDMA0DST IDMA Channel 0 Destination Address Register
0182 0010 IDMA0CNT IDMA Channel 0 Count Register
0182 0014 - 0182 00FC - Reserved
0182 0100 IDMA1STAT IDMA Channel 1 Status Register
0182 0104 - Reserved
0182 0108 IMDA1SRC IDMA Channel 1 Source Address Register
0182 010C IDMA1DST IDMA Channel 1 Destination Address Register
0182 0110 IDMA1CNT IDMA Channel 1 Count Register
0182 0114 - 0182 017C - Reserved
0182 0180 - Reserved
0182 0184 - 0182 01FF - Reserved
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Table 5-8. Megamodule Cache Configuration Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0184 0000 L2CFG L2 Cache Configuration Register
0184 0004 - 0184 001F - Reserved
0184 0020 L1PCFG L1P Configuration Register
0184 0024 L1PCC L1P Cache Control Register
0184 0028 - 0184 003F - Reserved
0184 0040 L1DCFG L1D Configuration Register
0184 0044 L1DCC L1D Cache Control Register
0184 0048 - 0184 0FFF - Reserved
0184 1000 - 0184 104F - See Table 5-11,CPU Megamodule Bandwidth Management Registers
0184 1050 - 0184 3FFF - Reserved
0184 4000 L2WBAR L2 Writeback Base Address Register - for Block Writebacks
0184 4004 L2WWC L2 Writeback Word Count Register
0184 4008 - 0184 400C - Reserved
0184 4010 L2WIBAR L2 Writeback and Invalidate Base Address Register - for Block Writebacks
0184 4014 L2WIWC L2 Writeback and Invalidate word count register
0184 4018 L2IBAR L2 Invalidate Base Address Register
0184 401C L2IWC L2 Invalidate Word Count Register
0184 4020 L1PIBAR L1P Invalidate Base Address Register
0184 4024 L1PIWC L1P Invalidate Word Count Register
0184 4030 L1DWIBAR L1D Writeback and Invalidate Base Address Register
0184 4034 L1DWIWC L1D Writeback and Invalidate Word Count Register
0184 4038 - Reserved
0184 4040 L1DWBAR L1D Writeback Base Address Register - for Block Writebacks
0184 4044 L1DWWC L1D Writeback Word Count Register
0184 4048 L1DIBAR L1D Invalidate Base Address Register
0184 404C L1DIWC L1D Invalidate Word Count Register
0184 4050 - 0184 4FFF - Reserved
0184 5000 L2WB L2 Global Writeback Register
0184 5004 L2WBINV L2 Global Writeback and Invalidate Register
0184 5008 L2INV L2 Global Invalidate Register
0184 500C - 0184 5024 - Reserved
0184 5028 L1PINV L1P Global Invalidate Register
0184 502C - 0184 503C - Reserved
0184 5040 L1DWB L1D Global Writeback Register
0184 5044 L1DWBINV L1D Global Writeback and Invalidate Register
0184 5048 L1DINV L1D Global Invalidate Register
0184 504C - 0184 5FFF - Reserved
0184 6000 - 0184 640F - See Table 5-9,Megamodule Error Detection Correct Registers
0184 6410 - 0184 7FFF - Reserved
MAR0 to
0184 8000 - 0184 81FC Reserved
MAR127
MAR128 to
0184 8200 - 0184 823C Reserved
MAR143
MAR144 to
0184 8240 - 0184 827C Reserved
MAR159
0184 8280 MAR160 Controls EMIFA CE2 Range A000 0000 - A0FF FFFF
0184 8284 MAR161 Controls EMIFA CE2 Range A100 0000 - A1FF FFFF
0184 8288 MAR162 Controls EMIFA CE2 Range A200 0000 - A2FF FFFF
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Table 5-8. Megamodule Cache Configuration Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0184 828C MAR163 Controls EMIFA CE2 Range A300 0000 - A3FF FFFF
0184 8290 MAR164 Controls EMIFA CE2 Range A400 0000 - A4FF FFFF
0184 8294 MAR165 Controls EMIFA CE2 Range A500 0000 - A5FF FFFF
0184 8298 MAR166 Controls EMIFA CE2 Range A600 0000 - A6FF FFFF
0184 829C MAR167 Controls EMIFA CE2 Range A700 0000 - A7FF FFFF
0184 82A0 MAR168 Controls EMIFA CE2 Range A800 0000 - A8FF FFFF
0184 82A4 MAR169 Controls EMIFA CE2 Range A900 0000 - A9FF FFFF
0184 82A8 MAR170 Controls EMIFA CE2 Range AA00 0000 - AAFF FFFF
0184 82AC MAR171 Controls EMIFA CE2 Range AB00 0000 - ABFF FFFF
0184 82B0 MAR172 Controls EMIFA CE2 Range AC00 0000 - ACFF FFFF
0184 82B4 MAR173 Controls EMIFA CE2 Range AD00 0000 - ADFF FFFF
0184 82B8 MAR174 Controls EMIFA CE2 Range AE00 0000 - AEFF FFFF
0184 82BC MAR175 Controls EMIFA CE2 Range AF00 0000 - AFFF FFFF
0184 82C0 MAR176 Controls EMIFA CE3 Range B000 0000 - B0FF FFFF
0184 82C4 MAR177 Controls EMIFA CE3 Range B100 0000 - B1FF FFFF
0184 82C8 MAR178 Controls EMIFA CE3 Range B200 0000 - B2FF FFFF
0184 82CC MAR179 Controls EMIFA CE3 Range B300 0000 - B3FF FFFF
0184 82D0 MAR180 Controls EMIFA CE3 Range B400 0000 - B4FF FFFF
0184 82D4 MAR181 Controls EMIFA CE3 Range B500 0000 - B5FF FFFF
0184 82D8 MAR182 Controls EMIFA CE3 Range B600 0000 - B6FF FFFF
0184 82DC MAR183 Controls EMIFA CE3 Range B700 0000 - B7FF FFFF
0184 82E0 MAR184 Controls EMIFA CE3 Range B800 0000 - B8FF FFFF
0184 82E4 MAR185 Controls EMIFA CE3 Range B900 0000 - B9FF FFFF
0184 82E8 MAR186 Controls EMIFA CE3 Range BA00 0000 - BAFF FFFF
0184 82EC MAR187 Controls EMIFA CE3 Range BB00 0000 - BBFF FFFF
0184 82F0 MAR188 Controls EMIFA CE3 Range BC00 0000 - BCFF FFFF
0184 82F4 MAR189 Controls EMIFA CE3 Range BD00 0000 - BDFF FFFF
0184 82F8 MAR190 Controls EMIFA CE3 Range BE00 0000 - BEFF FFFF
0184 82FC MAR191 Controls EMIFA CE3 Range BF00 0000 - BFFF FFFF
0184 8300 MAR192 Controls EMIFA CE4 Range C000 0000 - C0FF FFFF
0184 8304 MAR193 Controls EMIFA CE4 Range C100 0000 - C1FF FFFF
0184 8308 MAR194 Controls EMIFA CE4 Range C200 0000 - C2FF FFFF
0184 830C MAR195 Controls EMIFA CE4 Range C300 0000 - C3FF FFFF
0184 8310 MAR196 Controls EMIFA CE4 Range C400 0000 - C4FF FFFF
0184 8314 MAR197 Controls EMIFA CE4 Range C500 0000 - C5FF FFFF
0184 8318 MAR198 Controls EMIFA CE4 Range C600 0000 - C6FF FFFF
0184 831C MAR199 Controls EMIFA CE4 Range C700 0000 - C7FF FFFF
0184 8320 MAR200 Controls EMIFA CE4 Range C800 0000 - C8FF FFFF
0184 8324 MAR201 Controls EMIFA CE4 Range C900 0000 - C9FF FFFF
0184 8328 MAR202 Controls EMIFA CE4 Range CA00 0000 - CAFF FFFF
0184 832C MAR203 Controls EMIFA CE4 Range CB00 0000 - CBFF FFFF
0184 8330 MAR204 Controls EMIFA CE4 Range CC00 0000 - CCFF FFFF
0184 8334 MAR205 Controls EMIFA CE4 Range CD00 0000 - CDFF FFFF
0184 8338 MAR206 Controls EMIFA CE4 Range CE00 0000 - CEFF FFFF
0184 833C MAR207 Controls EMIFA CE4 Range CF00 0000 - CFFF FFFF
0184 8340 MAR208 Controls EMIFA CE5 Range D000 0000 - D0FF FFFF
0184 8344 MAR209 Controls EMIFA CE5 Range D100 0000 - D1FF FFFF
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Table 5-8. Megamodule Cache Configuration Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0184 8348 MAR210 Controls EMIFA CE5 Range D200 0000 - D2FF FFFF
0184 834C MAR211 Controls EMIFA CE5 Range D300 0000 - D3FF FFFF
0184 8350 MAR212 Controls EMIFA CE5 Range D400 0000 - D4FF FFFF
0184 8354 MAR213 Controls EMIFA CE5 Range D500 0000 - D5FF FFFF
0184 8358 MAR214 Controls EMIFA CE5 Range D600 0000 - D6FF FFFF
0184 835C MAR215 Controls EMIFA CE5 Range D700 0000 - D7FF FFFF
0184 8360 MAR216 Controls EMIFA CE5 Range D800 0000 - D8FF FFFF
0184 8364 MAR217 Controls EMIFA CE5 Range D900 0000 - D9FF FFFF
0184 8368 MAR218 Controls EMIFA CE5 Range DA00 0000 - DAFF FFFF
0184 836C MAR219 Controls EMIFA CE5 Range DB00 0000 - DBFF FFFF
0184 8370 MAR220 Controls EMIFA CE5 Range DC00 0000 - DCFF FFFF
0184 8374 MAR221 Controls EMIFA CE5 Range DD00 0000 - DDFF FFFF
0184 8378 MAR222 Controls EMIFA CE5 Range DE00 0000 - DEFF FFFF
0184 837C MAR223 Controls EMIFA CE5 Range DF00 0000 - DFFF FFFF
0184 8380 MAR224 Controls DDR2 CE0 Range E000 0000 - E0FF FFFF
0184 8384 MAR225 Controls DDR2 CE0 Range E100 0000 - E1FF FFFF
0184 8388 MAR226 Controls DDR2 CE0 Range E200 0000 - E2FF FFFF
0184 838C MAR227 Controls DDR2 CE0 Range E300 0000 - E3FF FFFF
0184 8390 MAR228 Controls DDR2 CE0 Range E400 0000 - E4FF FFFF
0184 8394 MAR229 Controls DDR2 CE0 Range E500 0000 - E5FF FFFF
0184 8398 MAR230 Controls DDR2 CE0 Range E600 0000 - E6FF FFFF
0184 839C MAR231 Controls DDR2 CE0 Range E700 0000 - E7FF FFFF
0184 83A0 MAR232 Controls DDR2 CE0 Range E800 0000 - E8FF FFFF
0184 83A4 MAR233 Controls DDR2 CE0 Range E900 0000 - E9FF FFFF
0184 83A8 MAR234 Controls DDR2 CE0 Range EA00 0000 - EAFF FFFF
0184 83AC MAR235 Controls DDR2 CE0 Range EB00 0000 - EBFF FFFF
0184 83B0 MAR236 Controls DDR2 CE0 Range EC00 0000 - ECFF FFFF
0184 83B4 MAR237 Controls DDR2 CE0 Range ED00 0000 - EDFF FFFF
0184 83B8 MAR238 Controls DDR2 CE0 Range EE00 0000 - EEFF FFFF
0184 83BC MAR239 Controls DDR2 CE0 Range EF00 0000 - EFFF FFFF
MAR240 to
0184 83C0 -0184 83FC Reserved
MAR255
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Table 5-9. Megamodule Error Detection Correct Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0184 6000 - Reserved
0184 6004 L2EDSTAT L2 Error Detection Status Register
0184 6008 L2EDCMD L2 Error Detection Command Register
0184 600C L2EDADDR L2 Error Detection Address Register
0184 6010 L2EDEN0 L2 Error Detection Enable Map 0 Register
0184 6014 L2EDEN1 L2 Error Detection Enable Map 1 Register
0184 6018 L2EDCPEC L2 Error Detection - Correctable Parity Error Count Register
0184 601C L2EDNPEC L2 Error Detection - Non-Correctable Parity Error Count Register
0184 6020 - 0184 6400 - Reserved
0184 6404 L1PEDSTAT L1P Error Detection Status Register
0184 6408 L1PEDCMD L1P Error Detection Command Register
0184 640C L1PEDADDR L1P Error Detection Address Register
Table 5-10. Megamodule L1/L2 Memory Protection Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0184 A000 L2MPFAR L2 memory protection fault address register
0184 A004 L2MPFSR L2 memory protection fault status register
0184 A008 L2MPFCR L2 memory protection fault command register
0184 A00C - 0184 A0FF - Reserved
0184 A100 L2MPLK0 L2 memory protection lock key bits [31:0]
0184 A104 L2MPLK1 L2 memory protection lock key bits [63:32]
0184 A108 L2MPLK2 L2 memory protection lock key bits [95:64]
0184 A10C L2MPLK3 L2 memory protection lock key bits [127:96]
0184 A110 L2MPLKCMD L2 memory protection lock key command register
0184 A114 L2MPLKSTAT L2 memory protection lock key status register
0184 A118 - 0184 A1FF - Reserved
0184 A200 L2MPPA0 L2 memory protection page attribute register 0
0184 A204 L2MPPA1 L2 memory protection page attribute register 1
0184 A208 L2MPPA2 L2 memory protection page attribute register 2
0184 A20C L2MPPA3 L2 memory protection page attribute register 3
0184 A210 L2MPPA4 L2 memory protection page attribute register 4
0184 A214 L2MPPA5 L2 memory protection page attribute register 5
0184 A218 L2MPPA6 L2 memory protection page attribute register 6
0184 A21C L2MPPA7 L2 memory protection page attribute register 7
0184 A220 L2MPPA8 L2 memory protection page attribute register 8
0184 A224 L2MPPA9 L2 memory protection page attribute register 9
0184 A228 L2MPPA10 L2 memory protection page attribute register 10
0184 A22C L2MPPA11 L2 memory protection page attribute register 11
0184 A230 L2MPPA12 L2 memory protection page attribute register 12
0184 A234 L2MPPA13 L2 memory protection page attribute register 13
0184 A238 L2MPPA14 L2 memory protection page attribute register 14
0184 A23C L2MPPA15 L2 memory protection page attribute register 15
0184 A240 L2MPPA16 L2 memory protection page attribute register 16
0184 A244 L2MPPA17 L2 memory protection page attribute register 17
0184 A248 L2MPPA18 L2 memory protection page attribute register 18
0184 A24C L2MPPA19 L2 memory protection page attribute register 19
0184 A250 L2MPPA20 L2 memory protection page attribute register 20
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Table 5-10. Megamodule L1/L2 Memory Protection Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0184 A254 L2MPPA21 L2 memory protection page attribute register 21
0184 A258 L2MPPA22 L2 memory protection page attribute register 22
0184 A25C L2MPPA23 L2 memory protection page attribute register 23
0184 A260 L2MPPA24 L2 memory protection page attribute register 24
0184 A264 L2MPPA25 L2 memory protection page attribute register 25
0184 A268 L2MPPA26 L2 memory protection page attribute register 26
0184 A26C L2MPPA27 L2 memory protection page attribute register 27
0184 A270 L2MPPA28 L2 memory protection page attribute register 28
0184 A274 L2MPPA29 L2 memory protection page attribute register 29
0184 A278 L2MPPA30 L2 memory protection page attribute register 30
0184 A27C L2MPPA31 L2 memory protection page attribute register 31
0184 A280 - 0184 A2FC(1) - Reserved
0184 0300 - 0184 A3FF - Reserved
0184 A400 L1PMPFAR L1 program (L1P) memory protection fault address register
0184 A404 L1PMPFSR L1P memory protection fault status register
0184 A408 L1PMPFCR L1P memory protection fault command register
0184 A40C - 0184 A4FF - Reserved
0184 A500 L1PMPLK0 L1P memory protection lock key bits [31:0]
0184 A504 L1PMPLK1 L1P memory protection lock key bits [63:32]
0184 A508 L1PMPLK2 L1P memory protection lock key bits [95:64]
0184 A50C L1PMPLK3 L1P memory protection lock key bits [127:96]
0184 A510 L1PMPLKCMD L1P memory protection lock key command register
0184 A514 L1PMPLKSTAT L1P memory protection lock key status register
0184 A518 - 0184 A5FF - Reserved
0184 A600 - 0184 A63C(2) - Reserved
0184 A640 L1PMPPA16 L1P memory protection page attribute register 16
0184 A644 L1PMPPA17 L1P memory protection page attribute register 17
0184 A648 L1PMPPA18 L1P memory protection page attribute register 18
0184 A64C L1PMPPA19 L1P memory protection page attribute register 19
0184 A650 L1PMPPA20 L1P memory protection page attribute register 20
0184 A654 L1PMPPA21 L1P memory protection page attribute register 21
0184 A658 L1PMPPA22 L1P memory protection page attribute register 22
0184 A65C L1PMPPA23 L1P memory protection page attribute register 23
0184 A660 L1PMPPA24 L1P memory protection page attribute register 24
0184 A664 L1PMPPA25 L1P memory protection page attribute register 25
0184 A668 L1PMPPA26 L1P memory protection page attribute register 26
0184 A66C L1PMPPA27 L1P memory protection page attribute register 27
0184 A670 L1PMPPA28 L1P memory protection page attribute register 28
0184 A674 L1PMPPA29 L1P memory protection page attribute register 29
0184 A678 L1PMPPA30 L1P memory protection page attribute register 30
0184 A67C L1PMPPA31 L1P memory protection page attribute register 31
0184 A680 - 0184 ABFF - Reserved
0184 AC00 L1DMPFAR L1 data (L1D) memory protection fault address register
0184 AC04 L1DMPFSR L1D memory protection fault status register
(1) These addresses correspond to the L2 memory protection page attribute registers 32-63 (L2MPPA32-L2MPPA63) of the C64x+
megamaodule. These registers are not supported for the TCI6482 device.
(2) These addresses correspond to the L1P memory protection page attribute registers 0-15 (L1PMPPA0-L1PMPPA15) of the C64x+
megamaodule. These registers are not supported for the TCI6482 device.
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Table 5-10. Megamodule L1/L2 Memory Protection Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0184 AC08 L1DMPFCR L1D memory protection fault command register
0184 AC0C - 0184 ACFF - Reserved
0184 AD00 L1DMPLK0 L1D memory protection lock key bits [31:0]
0184 AD04 L1DMPLK1 L1D memory protection lock key bits [63:32]
0184 AD08 L1DMPLK2 L1D memory protection lock key bits [95:64]
0184 AD0C L1DMPLK3 L1D memory protection lock key bits [127:96]
0184 AD10 L1DMPLKCMD L1D memory protection lock key command register
0184 AD14 L1DMPLKSTAT L1D memory protection lock key status register
0184 AD18 - 0184 ADFF - Reserved
0184 AE00 - 0184 AE3C(3) - Reserved
0184 AE40 L1DMPPA16 L1D memory protection page attribute register 16
0184 AE44 L1DMPPA17 L1D memory protection page attribute register 17
0184 AE48 L1DMPPA18 L1D memory protection page attribute register 18
0184 AE4C L1DMPPA19 L1D memory protection page attribute register 19
0184 AE50 L1DMPPA20 L1D memory protection page attribute register 20
0184 AE54 L1DMPPA21 L1D memory protection page attribute register 21
0184 AE58 L1DMPPA22 L1D memory protection page attribute register 22
0184 AE5C L1DMPPA23 L1D memory protection page attribute register 23
0184 AE60 L1DMPPA24 L1D memory protection page attribute register 24
0184 AE64 L1DMPPA25 L1D memory protection page attribute register 25
0184 AE68 L1DMPPA26 L1D memory protection page attribute register 26
0184 AE6C L1DMPPA27 L1D memory protection page attribute register 27
0184 AE70 L1DMPPA28 L1D memory protection page attribute register 28
0184 AE74 L1DMPPA29 L1D memory protection page attribute register 29
0184 AE78 L1DMPPA30 L1D memory protection page attribute register 30
0184 AE7C L1DMPPA31 L1D memory protection page attribute register 31
0184 AE80 - 0185 FFFF - Reserved
(3) These addresses correspond to the L1D memory protection page attribute registers 0-15 (L1DMPPA0-L1DMPPA15) of the C64x+
megamaodule. These registers are not supported for the TCI6482 device.
Table 5-11. CPU Megamodule Bandwidth Management Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
0182 0200 EMCCPUARBE EMC CPU Arbitration Control Register
0182 0204 EMCIDMAARBE EMC IDMA Arbitration Control Register
0182 0208 EMCSDMAARBE EMC Slave DMA Arbitration Control Register
0182 020C EMCMDMAARBE EMC Master DMA Arbitration Control Resgiter
0182 0210 - 0182 02FF - Reserved
0184 1000 L2DCPUARBU L2D CPU Arbitration Control Register
0184 1004 L2DIDMAARBU L2D IDMA Arbitration Control Register
0184 1008 L2DSDMAARBU L2D Slave DMA Arbitration Control Register
0184 100C L2DUCARBU L2D User Coherence Arbitration Control Resgiter
0184 1010 - 0184 103F - Reserved
0184 1040 L1DCPUARBD L1D CPU Arbitration Control Register
0184 1044 L1DIDMAARBD L1D IDMA Arbitration Control Register
0184 1048 L1DSDMAARBD L1D Slave DMA Arbitration Control Register
0184 104C L1DUCARBD L1D User Coherence Arbitration Control Resgiter
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Table 5-12. Device Configuration Registers (Chip-Level Registers)
HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS
Read-only. Provides status of the
02A8 0000 DEVSTAT Device Status Register user's device configuration on reset.
02A8 0004 PRI_ALLOC Priority Allocation Register Sets priority for Master peripherals
JTAG and BSDL Identification Read-only. Provides 32-bit JTAG ID of
02A8 0008 JTAGID Register the device.
02A8 000C - 02AB FFFF - Reserved
02AC 0000 - Reserved
02AC 0004 PERLOCK Peripheral Lock Register
02AC 0008 PERCFG0 Peripheral Configuration Register 0
02AC 000C - Reserved
02AC 0010 - Reserved
02AC 0014 PERSTAT0 Peripheral Status Register 0
02AC 0018 PERSTAT1 Peripheral Status Register 1
02AC 001C - 02AC 001F - Reserved
02AC 0020 EMACCFG EMAC Configuration Register
02AC 0024 - 02AC 002B - Reserved
02AC 002C PERCFG1 Peripheral Configuration Register 1
02AC 0030 - 02AC 0053 - Reserved
02AC 0054 EMUBUFPD Emulator Buffer Powerdown Register
02AC 0058 - Reserved
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6 Rake Search Accelerator (RSA)
On the TMS320TCI6482 device, there are two Rake Search Accelerators (RSAs). These RSAs are
connected directly to the C64x+ CPU.
The RSA is an extension of the C64x+ CPU. The CPU performs send/receive to the RSAs via the .L and
.S functional units.
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7 Device Operating Conditions
7.1 Absolute Maximum Ratings Over Operating Case Temperature Range (Unless
Otherwise Noted)(1)
Supply voltage range: CVDD (2) -0.5 V to 1.5 V
DVDD33 (2) -0.5 V to 4.2 V
DVDDR, DVDD18, AVDLL1, AVDLL2 (2) -0.5 V to 2.5 V
DVDD15 (2) -0.5 V to 2.5 V
DVDD12, DVDDRM, AVDDT, AVDDA (2) -0.5 V to 1.5 V
PLLV1, PLLV2(2) -0.5 V to 2.5 V
Input voltage (VI) range: 3.3-V pins (except PCI-capable pins) -0.5 V to DVDD33 + 0.5 V
PCI-capable pins -0.5 V to DVDD33 + 0.5 V
RGMII pins -0.5 V to 2.5 V
DDR2 memory controller pins -0.5 V to 2.5 V
Output voltage (VO) range: 3.3-V pins (except PCI-capable pins) -0.5 V to DVDD33 + 0.5 V
PCI-capable pins -0.5 V to DVDD33 + 0.5 V
RGMII pins -0.5 V to 2.5 V
DDR2 memory controller pins -0.5 V to 2.5 V
Operating case temperature range, TC: (default) 0°C to 90°C
(A version) [A-1000 device] -40°C to 105°C
Storage temperature range, Tstg -65°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS.
7.2 Recommended Operating Conditions
MIN NOM MAX UNIT
-1200 1.2125 1.25 1.2875 V
A-1000/-1000
CVDD Supply voltage, Core -850 1.1640 1.20 1.2360 V
-1200 1.2125 1.25 1.2875 V
Supply voltage, Core A-1000/-1000
DVDDRM [required only for RapidIO] -850 1.1640 1.20 1.2360 V
-1200
DVDD12,1.1875 1.25 1.3125 V
Supply voltage, I/O A-1000/-1000
AVDDA,[required only for RapidIO]
AVDDT -850 1.14 1.20 1.26 V
DVDD33 Supply voltage, I/O 3.14 3.3 3.46 V
DVDD18 Supply voltage, I/O 1.71 1.8 1.89 V
AVDLL1 Supply voltage, I/O 1.71 1.8 1.89 V
AVDLL2 Supply voltage, I/O 1.71 1.8 1.89 V
VREFSSTL Reference voltage 0.49DVDD18 0.50DVDD18 0.51DVDD18 V
1.8-V operation 1.71 1.8 1.89 V
Supply voltage, I/O
DVDD15 [required only for EMAC RGMII] 1.5-V operation 1.43 1.5 1.57 V
1.8-V operation 0.855 0.9 0.945 V
VREFHSTL Reference voltage 1.5-V operation 0.713 0.75 0.787 V
PLLV1, Supply voltage, PLL 1.71 1.8 1.89 V
PLLV2
VSS Supply ground 0 0 0 V
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Recommended Operating Conditions (continued)
MIN NOM MAX UNIT
3.3 V pins (except
PCI-capable and 2 V
I2C pins)
PCI-capable 0.5DVDD33 DVDD33 + 0.5 V
pins(1)
VIH High-level input voltage I2C pins 0.7DVDD33 V
RGMII pins VREFHSTL + 0.10 DVDD15 + 0.30 V
DDR2 memory
controller pins VREFSSTL + 0.125 DVDD18 + 0.3 V
(DC)
3.3 V pins (except
PCI-capable and 0 0.8 V
I2C pins)
PCI-capable -0.5 0.3DVDD33 V
pins(1)
VIL Low-level input voltage I2C pins 0 0.3DVDD33 V
RGMII pins -0.3 VREFHSTL - 0.1 V
DDR2 memory
controller pins -0.3 VREFSSTL - 0.125 V
(DC)
I/O VDD = 1.2 V -0.360 1.560
(SRIO)
I/O VDD = 1.25 V -0.375 1.625
(SRIO)
I/O VDD = 1.5 V -0.450 1.950
Maximum voltage during (EMAC RGMII)
VOS overshoot/undershoot (PCI-capable V
I/O VDD = 1.8 V -0.540 2.340
pins)(2) (3) (EMAC RGMII,
DDR2)
I/O VDD = 3.3 V -1.000 4.300
(except PCI-
capable pins)
commercial 0 90
temperature
TCOperating case temperature °C
extended -40 105
temperature
(1) These rated numbers are from the PCI Local Bus Specification (version 2.3). The DC specifications and AC specifications are defined in
Table 4-3 and Table 4-4, respectively, of the PCI Local Bus Specification.
(2) PCI-capable pins can withstand a maximum overshoot/undershoot for up to 11 ns as required by the PCI Local Bus Specification
(version 2.3).
(3) Duration of overshoot/undershoot must not exceed 30% of the cycle period.
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7.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and
Operating Case Temperature (Unless Otherwise Noted)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
3.3-V pins (except PCI- DVDD33 = MIN, 0.8DVDD33 V
capable and I2C pins) IOH = MAX
IOH = -0.5 mA,
PCI-capable pins(2) 0.9DVDD33 V
High-level DVDD33 = 3.3 V
VOH output voltage RGMII pins DVDD15 - 0.4 V
DDR2 memory 1.4 V
controller pins
3.3-V pins (except PCI- DVDD33 = MIN, 0.22DVDD33 V
capable and I2C pins) IOL = MAX
IOL = 1.5 mA,
PCI-capable pins(2) 0.1DVDD33 V
DVDD33 = 3.3 V
Low-level output
VOL Pulled up to 3.3 V, 3 mA sink
voltage I2C pins 0.4 V
current
RGMII pins 0.4 V
DDR2 memory 0.4 V
controller pins VI= VSS to DVDD33, pins
without internal pullup or -1 1 uA
pulldown resistor
3.3-V pins (except PCI- VI= VSS to DVDD33, pins with
capable and I2C pins) 50 100 400 uA
internal pullup resistor
Input current
II(3) VI= VSS to DVDD33, pins with
[DC] -400 -100 -50 uA
internal pulldown resistor
I2C pins 0.1DVDD33 ≤VI≤0.9DVDD33 -10 10 uA
PCI-capable pins(4) -1000 1000 uA
RGMII pins 0.4 V
AECLKOUT,
CLKR1/GP[0],
CLKX1/GP[3],
SYSCLK4/GP[1], -8 mA
EMU[18:0],
VCLK/CLKR0,
VSCRUN/CLKX0
EMIF pins (except
AECLKOUT), NMI,
TOUT0L, TINP0L,
TOUT1L, TINP1L,
PCI_EN, EMAC-
High-level capable pins (except
IOH output current RGMII pins),
[DC] -4 mA
RESETSTAT, McBSP-
capable pins (except
CLKR1/GP[0],
CLKX1/GP[3],
VCLK/CLKR0,
VSCRUN/CLKX0),
GP[7:4], and TDO
PCI-capable pins(2) -0.5 mA
RGMII pins -8 mA
DDR2 memory 4 mA
controller pins
(1) For test conditions shown as MIN, MAX, or NOM, use the appropriate value specified in the recommended operating conditions table.
(2) These rated numbers are from the PCI Local Bus Specification (version 2.3). The DC specifications and AC specifications are defined in
Table 4-3 and Table 4-4, respectively, of the PCI Local Bus Specification.
(3) IIapplies to input-only pins and bi-directional pins. For input-only pins, IIindicates the input leakage current. For bi-directional pins, II
includes input leakage current and off-state (hi-Z) output leakage current.
(4) PCI input leakage currents include Hi-Z output leakage for all bidirectional buffers with 3-state outputs.
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted) (continued)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
AECLKOUT,
CLKR1/GP[0],
CLKX1/GP[3],
SYSCLK4/GP[1], 8 mA
EMU[18:0],
VCLK/CLKR0,
VSCRUN/CLKX0
EMIF pins (except
AECLKOUT), NMI,
TOUT0L, TINP0L,
TOUTP1L, TINP1L,
PCI_EN, EMAC-
Low-level output capable pins (except
IOL current [DC] RGMII pins), 4 mA
RESETSTAT, McBSP-
capable pins (except
CLKR1/GP[0],
CLKX1/GP[3],
VCLK/CLKR0,
VSCRUN/CLKX0),
GP[7:4], and TDO
PCI-capable pins(2) 1.5 mA
RGMII pins 8 mA
DDR2 memory -4 mA
controller pins
Off-state output
IOZ (5) 3.3-V pins VO= DVDD33 or 0 V -20 20 uA
current [DC] CVDD = 1.25 V, 1.76 W
CPU frequency = 1200 MHz
CVDD = 1.25 V,
PCDD Core supply power(6) 1.66 W
CPU frequency = 1000 MHz
CVDD = 1.2 V, 1.41 W
CPU frequency = 850 MHz
DVDD33 = 3.3 V,
DVDD18 = DVDDR = 1.8 V,
PLLV1 = PLLV2 = AVDLL1 = 0.54 W
AVDLL2 = 1.8 V,
CPU frequency = 1200 MHz
DVDDRM = DVDD12 = AVDDT =
AVDDA = 1.25 V,
DVDD33 = 3.3 V,
DVDD18 = DVDDR = 1.8 V, 0.53 W
DVDD15 = VREFHSTL = 1.5 V,
PDDD I/O supply power(6) PLLV1 = PLLV2 = AVDLL1 =
AVDLL2 = 1.8 V,
CPU Frequency = 1000 MHz
DVDDRM = DVDD12 = AVDDT =
AVDDA = 1.2 V,
DVDD33 = 3.3 V,
DVDD18 = DVDDR = 1.8 V, 0.53 W
DVDD15 = VREFHSTL = 1.5 V,
PLLV1 = PLLV2 = AVDLL1 =
AVDLL2 = 1.8 V,
CPU Frequency = 850 MHz
(5) IOZ applies to output-only pins, indicating off-state (hi-Z) output leakage current.
(6) Assumes the following conditions: 50% CPU utilization; DDR2 at 20% utilization (250 MHz), 50% writes, 32 bits, 50% bit switching;
EMIFA at 40% utilization (133 MHz), 50% writes, 64 bits, 50% bit switching; McBSP0/1 at 100 MHz, 10% utilization, 50% switching;
VCP2 at 50% utilization; TCP2 at 20% utilization; EMAC, 1000 Mbps, RGMII, 50% utilization, 50% switching; SRIO 3.125, 4 lanes, 50%
utilization, 50% switching; One 100-MHz Timer at 10% utilization; device configured for HPI32 mode, 50 MBps, 30% utilization, 50%
writes, 32, 50% switching, with pull-up resistors on HPI pins; room temperature (25°C). The actual current draw is highly application-
dependent. For more details on core and I/O activity, see the TMS320TCI6482 Power Consumption Summary application report
(literature number SPRAAF1).
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Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case
Temperature (Unless Otherwise Noted) (continued)
PARAMETER TEST CONDITIONS(1) MIN TYP MAX UNIT
CiInput capacitance 10 pF
CoOutput capacitance 10 pF
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Transmission Line
4.0 pF 1.85 pF
Z0 = 50 Ω
(see Note)
Tester Pin Electronics Data Sheet Timing Reference Point
Output
Under
Test
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects must
be taken into account. A transmission line with a delay of 2 ns can be used to produce the desired transmission line ef fect. The transmission
line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns) from the data sheet timings.
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
42 Ω3.5 nH
Device Pin
(see Note)
Vref = 1.5 V
Vref = VIL MAX (or VOL MAX)
Vref = VIH MIN (or VOH MIN)
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8 C64x+ Peripheral Information and Electrical Specifications
8.1 Parameter Information
Figure 8-1. Test Load Circuit for AC Timing Measurements
The load capacitance value stated is only for characterization and measurement of AC timing signals. This
load capacitance value does not indicate the maximum load the device is capable of driving.
8.1.1 3.3-V Signal Transition Levels
All input and output timing parameters are referenced to 1.5 V for both "0" and "1" logic levels.
Figure 8-2. Input and Output Voltage Reference Levels for AC Timing Measurements
All rise and fall transition timing parameters are referenced to VIL MAX and VIH MIN for input clocks,
VOLMAX and VOH MIN for output clocks.
Figure 8-3. Rise and Fall Transition Time Voltage Reference Levels
8.1.2 3.3-V Signal Transition Rates
All timings are tested with an input edge rate of 4 volts per nanosecond (4 V/ns).
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1
2
3
4
5
6
7
8
10
11
AECLKOUT
(Output from DSP)
AECLKOUT
(Input to External Device)
Control Signals(A)
(Output from DSP)
Control Signals
(Input to External Device)
Data Signals(B)
(Output from External Device)
Data Signals(B)
(Input to DSP)
9
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8.1.3 Timing Parameters and Board Routing Analysis
The timing parameter values specified in this data sheet do not include delays by board routings. As a
good board design practice, such delays must always be taken into account. Timing values may be
adjusted by increasing/decreasing such delays. TI recommends utilizing the available I/O buffer
information specification (IBIS) models to analyze the timing characteristics correctly. To properly use IBIS
models to attain accurate timing analysis for a given system, see the Using IBIS Models for Timing
Analysis application report (literature number SPRA839). If needed, external logic hardware such as
buffers may be used to compensate any timing differences.
For inputs, timing is most impacted by the round-trip propagation delay from the DSP to the external
device and from the external device to the DSP. This round-trip delay tends to negatively impact the input
setup time margin, but also tends to improve the input hold time margins (see Table 8-1 and Figure 8-4).
Figure 8-4 represents a general transfer between the DSP and an external device. The figure also
represents board route delays and how they are perceived by the DSP and the external device.
Table 8-1. Board-Level Timing Example
(see Figure 8-4)
NO. DESCRIPTION
1 Clock route delay
2 Minimum DSP hold time
3 Minimum DSP setup time
4 External device hold time requirement
5 External device setup time requirement
6 Control signal route delay
7 External device hold time
8 External device access time
9 DSP hold time requirement
10 DSP setup time requirement
11 Data route delay
A. Control signals include data for Writes.
B. Data signals are generated during Reads from an external device.
Figure 8-4. Board-Level Input/Output Timings
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CVDD12
All other
power supplies
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2
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8.2 Recommended Clock and Control Signal Transition Behavior
All clocks and control signals must transition between VIH and VIL (or between VIL and VIH) in a monotonic
manner.
8.3 Power Supplies
8.3.1 Power-Supply Sequencing
TI recommends the power-supply sequence shown in Figure 8-5. After the DVDD33 supply is stable, the
remaining power supplies can be powered up at the same time as CVDD as long as their supply voltage
never exceeds the CVDD voltage during powerup. Some TI power-supply devices include features that
facilitate power sequencing; for example, Auto-Track or Slow-Start/Enable features. For more information,
visit www.ti.com/dsppower.
Figure 8-5. Power-Supply Sequence
Table 8-2. Timing Requirements for Power-Supply Sequence
-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tsu(DVDD33-CVDD12) Setup time, DVDD33 supply stable before CVDD12 supply stable 0.5 200 ms
2 tsu(CVDD12-ALLSUP) Setup time, CVDD12 supply stable before all other supplies stable 0 200 ms
8.3.2 Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to the DSP. These caps need to be close to the DSP, no more than 1.25 cm maximum
distance to be effective. Physically smaller caps are better, such as 0402, but need to be evaluated from a
yield/manufacturing point-of-view. Parasitic inductance limits the effectiveness of the decoupling
capacitors, therefore physically smaller capacitors should be used while maintaining the largest available
capacitance value. As with the selection of any component, verification of capacitor availability over the
product's production lifetime should be considered.
8.3.3 Power-Down Operation
One of the power goals for the TCI6482 device is to reduce power dissipation due to unused peripherals.
There are different ways to power down peripherals on the TCI6482 device.
Some peripherals can be statically powered down at device reset through the device configuration pins
(see Section 3.1,Device Configuration at Device Reset). Once in a static power-down state, the peripheral
is held in reset and its clock is turned off. Peripherals cannot be enabled once they are in a static power-
down state. To take a peripheral out of the static power-down state, a device reset must be executed with
a different configuration pin setting.
After device reset, all peripherals on the TCI6482 device are in a disabled state and must be enabled by
software before being used. It is possible to enable only the peripherals needed by the application while
keeping the rest disabled. Note that peripherals in a disabled state are held in reset with their clocks
gated. For more information on how to enable peripherals, see Section 3.3,Peripheral Selection After
Device Reset.
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Peripherals used for booting, like I2C and HPI, are automatically enabled after device reset. It is possible
to disable peripherals used for booting after the boot process is complete. This, too, results in gating of the
clock(s) to the powered-down peripheral. Once a peripheral is powered-down, it must remain powered
down until the next device reset.
The C64x+ Megamodule also allows for software-driven power-down management for all of the C64x+
megamodule components through its Power-Down Controller (PDC). The CPU can power-down part or
the entire C64x+ megamodule through the power-down controller based on its own execution thread or in
response to an external stimulus from a host or global controller. More information on the power-down
features of the C64x+ Megamodule can be found in the TMS320C64x+ Megamodule Reference Guide
(literature number SPRU871).
8.3.4 Preserving Boundary-Scan Functionality on RGMII and DDR2 Memory Pins
When the RGMII mode of the EMAC is not used, the DVDD15, DVDD15MON, VREFHSTL, RSV13, and RSV14
pins can be connected directly to ground (VSS) to save power. However, this will prevent boundary-scan
from functioning on the RGMII pins of the EMAC. To preserve boundary-scan functionality on the RGMII
pins, DVDD15, VREFHSTL, RSV14, and RSV13 should be connected as follows:
• DVDD15 and DVDD15MON - connect these pins to the 1.8-V I/O supply (DVDD18).
• VREFHSTL - connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from the
DVDD18 supply using two 1-kΩresistors to form a resistor divider circuit.
• RSV13 - connect this pin to ground (VSS) via a 200-Ωresistor.
• RSV14 - connect this pin to the 1.8-V I/O supply (DVDD18) via a 200-Ωresistor.
Similarly, when the DDR2 Memory Controller is not used, the VREFSSTL, RSV11, and RSV12 pins can be
connected directly to ground (VSS) to save power. However, this will prevent boundary-scan from
functioning on the DDR2 Memory Controller pins. To preserve boundary-scan functionality on the DDR2
Memory Controller pins, VREFSSTL, RSV11, and RSV12 should be connected as follows:
• VREFSSTL - connect to a voltage of DVDD18/2. The DVDD18/2 voltage can be generated directly from the
DVDD18 supply using two 1-kΩresistors to form a resistor divider circuit.
• RSV11 - connect this pin to ground (VSS) via a 200-Ωresistor.
• RSV12 - connect this pin to the 1.8-V I/O supply (DVDD18) via a 200-Ωresistor.
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8.4 Enhanced Direct Memory Access (EDMA3) Controller
The primary purpose of the EDMA3 is to service user-programmed data transfers between two memory-
mapped slave endpoints on the device. The EDMA3 services software-driven paging transfers (e.g., data
movement between external memory and internal memory), performs sorting or subframe extraction of
various data structures, services event driven peripherals such as a McBSP or the UTOPIA port , and
offloads data transfers from the device CPU.
The EDMA3 includes the following features:
• Fully orthogonal transfer description
– 3 transfer dimensions: array (multiple bytes), frame (multiple arrays), and block (multiple frames)
– Single event can trigger transfer of array, frame, or entire block
– Independent indexes on source and destination
• Flexible transfer definition:
– Increment or FIFO transfer addressing modes
– Linking mechanism allows for ping-pong buffering, circular buffering, and repetitive/continuous
transfers, all with no CPU intervention
– Chaining allows multiple transfers to execute with one event
• 256 PaRAM entries
– Used to define transfer context for channels
– Each PaRAM entry can be used as a DMA entry, QDMA entry, or link entry
• 64 DMA channels
– Manually triggered (CPU writes to channel controller register), external event triggered, and chain
triggered (completion of one transfer triggers another)
• 4 Quick DMA (QDMA) channels
– Used for software-driven transfers
– Triggered upon writing to a single PaRAM set entry
• 4 transfer controllers/event queues with programmable system-level priority
• Interrupt generation for transfer completion and error conditions
• Memory protection support
– Active memory protection for accesses to PaRAM and registers
• Debug visibility
– Queue watermarking/threshold allows detection of maximum usage of event queues
– Error and status recording to facilitate debug
Each of the transfer controllers has a direct connection to the switched central resource (SCR).
NOTE
Although the transfer controllers are directly connected to the SCR, they can only access
certain device resources. For example, only transfer controller 1 (TC1) can access the
McBSPs. Table 4-1 lists the device resources that can be accessed by each of the transfer
controllers.
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8.4.1 EDMA3 Device-Specific Information
The EDMA supports two addressing modes: constant addressing and increment addressing mode. On the
TCI6482 DSP, constant addressing mode is not supported by any peripheral or internal memory. For more
information on these two addressing modes, see the TMS320TCI648x DSP Enhanced DMA (EDMA3)
Controller User's Guide (literature number SPRU727) .
A DSP interrupt must be generated at the end of an HPI or PCI boot operation to begin execution of the
loaded application. Since the DSP interrupt generated by the HPI and PCI is mapped to the EDMA event
DSP_EVT (DMA channel 0), it will get recorded in bit 0 of the EDMA Event Register (ER). This event must
be cleared by software before triggering transfers on DMA channel 0. The EDMA3 on the TCI6482 DSP
supports active memory protection, but it does not support proxied memory protection.
8.4.2 EDMA3 Channel Synchronization Events
The EDMA3 supports up to 64 DMA channels that can be used to service system peripherals and to move
data between system memories. DMA channels can be triggered by synchronization events generated by
system peripherals. Table 8-3 lists the source of the synchronization event associated with each of the
DMA channels. On the TCI6482 device, the association of each synchronization event and DMA channel
is fixed and cannot be reprogrammed.
For more detailed information on the EDMA3 module and how EDMA3 events are enabled, captured,
processed, prioritized, linked, chained, and cleared, etc., see the TMS320TCI648x DSP Enhanced DMA
(EDMA3) Controller User's Guide (literature number SPRU727) .
Table 8-3. TCI6482 EDMA3 Channel Synchronization Events(1)
EDMA BINARY EVENT NAME EVENT DESCRIPTION
CHANNEL
0(2) 000 0000 DSP_EVT HPI/PCI-to-DSP event
1 000 0001 TEVTLO0 Timer 0 lower counter event
2 000 0010 TEVTHI0 Timer 0 high counter event
3 000 0011 - None
4 000 0100 - None
5 000 0101 - None
6 000 0110 - None
7 000 0111 - None
8 000 1000 - None
9 000 1001 - None
10 000 1010 - None
11 000 1011 - None
12 000 1100 XEVT0 McBSP0 transmit event
13 000 1101 REVT0 McBSP0 receive event
14 000 1110 XEVT1 McBSP1 transmit event
15 000 1111 REVT1 McBSP1 receive event
16 001 0000 TEVTLO1 Timer 1 lower counter event
17 001 0001 TEVTHI1 Timer 1 high counter event
18-19 - - None
20 001 0100 INTDST1 RapidIO Interrupt 1
21-27 - - None
28 001 1100 VCP2REVT VCP2 receive event
(1) In addition to the events shown in this table, each of the 64 channels can also be synchronized with the transfer completion or alternate
transfer completion events. For more detailed information on EDMA event-transfer chaining, see the TMS320TCI648x DSP Enhanced
DMA (EDMA3) Controller User's Guide (literature number SPRU727) .
(2) HPI boot and PCI boot are terminated using a DSP interrupt. The DSP interrupt is registered in bit 0 (channel 0) of the EDMA Event
Register (ER). This event must be cleared by software before triggering transfers on DMA channel 0.
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Table 8-3. TCI6482 EDMA3 Channel Synchronization Events(1) (continued)
EDMA BINARY EVENT NAME EVENT DESCRIPTION
CHANNEL
29 001 1101 VCP2XEVT VCP2 transmit event
30 001 1110 TCP2REVT TCP2 receive event
31 001 1111 TCP2XEVT TCP2 transmit event
32 010 0000 UREVT UTOPIA receive event
33-39 - - None
40 010 1000 UXEVT UTOPIA transmit event
41-43 - - None
44 010 1100 ICREVT I2C receive event
45 010 1101 ICXEVT I2C transmit event
46-47 - - None
48 011 0000 GPINT0 GPIO event 0
49 011 0001 GPINT1 GPIO event 1
50 011 0010 GPINT2 GPIO event 2
51 011 0011 GPINT3 GPIO event 3
52 011 0100 GPINT4 GPIO event 4
53 011 0101 GPINT5 GPIO event 5
54 011 0110 GPINT6 GPIO event 6
55 011 0111 GPINT7 GPIO event 7
56 011 1000 GPINT8 GPIO event 8
57 011 1001 GPINT9 GPIO event 9
58 011 1010 GPINT10 GPIO event 10
59 011 1011 GPINT11 GPIO event 11
60 011 1100 GPINT12 GPIO event 12
61 011 1101 GPINT13 GPIO event 13
62 011 1110 GPINT14 GPIO event 14
63 011 1111 GPINT15 GPIO event 15
8.4.3 EDMA3 Peripheral Register Descriptions
Table 8-4. EDMA3 Channel Controller Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 0000 PID Peripheral ID Register
02A0 0004 CCCFG EDMA3CC Configuration Register
02A0 0008 - 02A0 00FC - Reserved
02A0 0100 DCHMAP0 DMA Channel 0 Mapping Register
02A0 0104 DCHMAP1 DMA Channel 1 Mapping Register
02A0 0108 DCHMAP2 DMA Channel 2 Mapping Register
02A0 010C DCHMAP3 DMA Channel 3 Mapping Register
02A0 0110 DCHMAP4 DMA Channel 4 Mapping Register
02A0 0114 DCHMAP5 DMA Channel 5 Mapping Register
02A0 0118 DCHMAP6 DMA Channel 6 Mapping Register
02A0 011C DCHMAP7 DMA Channel 7 Mapping Register
02A0 0120 DCHMAP8 DMA Channel 8 Mapping Register
02A0 0124 DCHMAP9 DMA Channel 9 Mapping Register
02A0 0128 DCHMAP10 DMA Channel 10 Mapping Register
02A0 012C DCHMAP11 DMA Channel 11 Mapping Register
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Table 8-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 0130 DCHMAP12 DMA Channel 12 Mapping Register
02A0 0134 DCHMAP13 DMA Channel 13 Mapping Register
02A0 0138 DCHMAP14 DMA Channel 14 Mapping Register
02A0 013C DCHMAP15 DMA Channel 15 Mapping Register
02A0 0140 DCHMAP16 DMA Channel 16 Mapping Register
02A0 0144 DCHMAP17 DMA Channel 17 Mapping Register
02A0 0148 DCHMAP18 DMA Channel 18 Mapping Register
02A0 014C DCHMAP19 DMA Channel 19 Mapping Register
02A0 0150 DCHMAP20 DMA Channel 20 Mapping Register
02A0 0154 DCHMAP21 DMA Channel 21 Mapping Register
02A0 0158 DCHMAP22 DMA Channel 22 Mapping Register
02A0 015C DCHMAP23 DMA Channel 23 Mapping Register
02A0 0160 DCHMAP24 DMA Channel 24 Mapping Register
02A0 0164 DCHMAP25 DMA Channel 25 Mapping Register
02A0 0168 DCHMAP26 DMA Channel 26 Mapping Register
02A0 016C DCHMAP27 DMA Channel 27 Mapping Register
02A0 0170 DCHMAP28 DMA Channel 28 Mapping Register
02A0 0174 DCHMAP29 DMA Channel 29 Mapping Register
02A0 0178 DCHMAP30 DMA Channel 30 Mapping Register
02A0 017C DCHMAP31 DMA Channel 31 Mapping Register
02A0 0180 DCHMAP32 DMA Channel 32 Mapping Register
02A0 0184 DCHMAP33 DMA Channel 33 Mapping Register
02A0 0188 DCHMAP34 DMA Channel 34 Mapping Register
02A0 018C DCHMAP35 DMA Channel 35 Mapping Register
02A0 0190 DCHMAP36 DMA Channel 36 Mapping Register
02A0 0194 DCHMAP37 DMA Channel 37 Mapping Register
02A0 0198 DCHMAP38 DMA Channel 38 Mapping Register
02A0 019C DCHMAP39 DMA Channel 39 Mapping Register
02A0 01A0 DCHMAP40 DMA Channel 40 Mapping Register
02A0 01A4 DCHMAP41 DMA Channel 41 Mapping Register
02A0 01A8 DCHMAP42 DMA Channel 42 Mapping Register
02A0 01AC DCHMAP43 DMA Channel 43 Mapping Register
02A0 01B0 DCHMAP44 DMA Channel 44 Mapping Register
02A0 01B4 DCHMAP45 DMA Channel 45 Mapping Register
02A0 01B8 DCHMAP46 DMA Channel 46 Mapping Register
02A0 01BC DCHMAP47 DMA Channel 47 Mapping Register
02A0 01C0 DCHMAP48 DMA Channel 48 Mapping Register
02A0 01C4 DCHMAP49 DMA Channel 49 Mapping Register
02A0 01C8 DCHMAP50 DMA Channel 50 Mapping Register
02A0 01CC DCHMAP51 DMA Channel 51 Mapping Register
02A0 01D0 DCHMAP52 DMA Channel 52 Mapping Register
02A0 01D4 DCHMAP53 DMA Channel 53 Mapping Register
02A0 01D8 DCHMAP54 DMA Channel 54 Mapping Register
02A0 01DC DCHMAP55 DMA Channel 55 Mapping Register
02A0 01E0 DCHMAP56 DMA Channel 56 Mapping Register
02A0 01E4 DCHMAP57 DMA Channel 57 Mapping Register
02A0 01E8 DCHMAP58 DMA Channel 58 Mapping Register
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Table 8-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 01EC DCHMAP59 DMA Channel 59 Mapping Register
02A0 01F0 DCHMAP60 DMA Channel 60 Mapping Register
02A0 01F4 DCHMAP61 DMA Channel 61 Mapping Register
02A0 01F8 DCHMAP62 DMA Channel 62 Mapping Register
02A0 01FC DCHMAP63 DMA Channel 63 Mapping Register
02A0 0200 QCHMAP0 QDMA Channel 0 Mapping Register
02A0 0204 QCHMAP1 QDMA Channel 1 Mapping Register
02A0 0208 QCHMAP2 QDMA Channel 2 Mapping Register
02A0 020C QCHMAP3 QDMA Channel 3 Mapping Register
02A0 0210 - 02A0 021C - Reserved
02A0 0220 - 02A0 023C - Reserved
02A0 0240 DMAQNUM0 DMA Queue Number Register 0
02A0 0244 DMAQNUM1 DMA Queue Number Register 1
02A0 0248 DMAQNUM2 DMA Queue Number Register 2
02A0 024C DMAQNUM3 DMA Queue Number Register 3
02A0 0250 DMAQNUM4 DMA Queue Number Register 4
02A0 0254 DMAQNUM5 DMA Queue Number Register 5
02A0 0258 DMAQNUM6 DMA Queue Number Register 6
02A0 025C DMAQNUM7 DMA Queue Number Register 7
02A0 0260 QDMAQNUM QDMA Queue Number Register
02A0 0264 - 02A0 0280 - Reserved
02A0 0284 QUEPRI Queue Priority Register
02A0 0288 - 02A0 02FC - Reserved
02A0 0300 EMR Event Missed Register
02A0 0304 EMRH Event MissedRegister High
02A0 0308 EMCR Event Missed Clear Register
02A0 030C EMCRH Event Missed Clear Register High
02A0 0310 QEMR QDMA Event Missed Register
02A0 0314 QEMCR QDMA Event Missed Clear Register
02A0 0318 CCERR EDMA3CC Error Register
02A0 031C CCERRCLR EDMA3CC Error Clear Register
02A0 0320 EEVAL Error Evaluate Register
02A0 0324 - 02A0 033C - Reserved
02A0 0340 DRAE0 DMA Region Access Enable Register for Region 0
02A0 0344 DRAEH0 DMA Region Access Enable Register High for Region 0
02A0 0348 DRAE1 DMA Region Access Enable Register for Region 1
02A0 034C DRAEH1 DMA Region Access Enable Register High for Region 1
02A0 0350 DRAE2 DMA Region Access Enable Register for Region 2
02A0 0354 DRAEH2 DMA Region Access Enable Register High for Region 2
02A0 0358 DRAE3 DMA Region Access Enable Register for Region 3
02A0 035C DRAEH3 DMA Region Access Enable Register High for Region 3
02A0 0360 DRAE4 DMA Region Access Enable Register for Region 4
02A0 0364 DRAEH4 DMA Region Access Enable Register High for Region 4
02A0 0368 DRAE5 DMA Region Access Enable Register for Region 5
02A0 036C DRAEH5 DMA Region Access Enable Register High for Region 5
02A0 0370 DRAE6 DMA Region Access Enable Register for Region 6
02A0 0374 DRAEH6 DMA Region Access Enable Register High for Region 6
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Table 8-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 0378 DRAE7 DMA Region Access Enable Register for Region 7
02A0 037C DRAEH7 DMA Region Access Enable Register High for Region 7
02A0 0380 QRAE0 QDMA Region Access Enable Register for Region 0
02A0 0384 QRAE1 QDMA Region Access Enable Register for Region 1
02A0 0388 QRAE2 QDMA Region Access Enable Register for Region 2
02A0 038C QRAE3 QDMA Region Access Enable Register for Region 3
02A0 0390 - 02A0 039C - Reserved
02A0 0400 Q0E0 Event Queue 0 Entry Register 0
02A0 0404 Q0E1 Event Queue 0 Entry Register 1
02A0 0408 Q0E2 Event Queue 0 Entry Register 2
02A0 040C Q0E3 Event Queue 0 Entry Register 3
02A0 0410 Q0E4 Event Queue 0 Entry Register 4
02A0 0414 Q0E5 Event Queue 0 Entry Register 5
02A0 0418 Q0E6 Event Queue 0 Entry Register 6
02A0 041C Q0E7 Event Queue 0 Entry Register 7
02A0 0420 Q0E8 Event Queue 0 Entry Register 8
02A0 0424 Q0E9 Event Queue 0 Entry Register 9
02A0 0428 Q0E10 Event Queue 0 Entry Register 10
02A0 042C Q0E11 Event Queue 0 Entry Register 11
02A0 0430 Q0E12 Event Queue 0 Entry Register 12
02A0 0434 Q0E13 Event Queue 0 Entry Register 13
02A0 0438 Q0E14 Event Queue 0 Entry Register 14
02A0 043C Q0E15 Event Queue 0 Entry Register 15
02A0 0440 Q1E0 Event Queue 1 Entry Register 0
02A0 0444 Q1E1 Event Queue 1 Entry Register 1
02A0 0448 Q1E2 Event Queue 1 Entry Register 2
02A0 044C Q1E3 Event Queue 1 Entry Register 3
02A0 0450 Q1E4 Event Queue 1 Entry Register 4
02A0 0454 Q1E5 Event Queue 1 Entry Register 5
02A0 0458 Q1E6 Event Queue 1 Entry Register 6
02A0 045C Q1E7 Event Queue 1 Entry Register 7
02A0 0460 Q1E8 Event Queue 1 Entry Register 8
02A0 0464 Q1E9 Event Queue 1 Entry Register 9
02A0 0468 Q1E10 Event Queue 1 Entry Register 10
02A0 046C Q1E11 Event Queue 1 Entry Register 11
02A0 0470 Q1E12 Event Queue 1 Entry Register 12
02A0 0474 Q1E13 Event Queue 1 Entry Register 13
02A0 0478 Q1E14 Event Queue 1 Entry Register 14
02A0 047C Q1E15 Event Queue 1 Entry Register 15
02A0 0480 Q2E0 Event Queue 2 Entry Register 0
02A0 0484 Q2E1 Event Queue 2 Entry Register 1
02A0 0488 Q2E2 Event Queue 2 Entry Register 2
02A0 048C Q2E3 Event Queue 2 Entry Register 3
02A0 0490 Q2E4 Event Queue 2 Entry Register 4
02A0 0494 Q2E5 Event Queue 2 Entry Register 5
02A0 0498 Q2E6 Event Queue 2 Entry Register 6
02A0 049C Q2E7 Event Queue 2 Entry Register 7
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Table 8-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 04A0 Q2E8 Event Queue 2 Entry Register 8
02A0 04A4 Q2E9 Event Queue 2 Entry Register 9
02A0 04A8 Q2E10 Event Queue 2 Entry Register 10
02A0 04AC Q2E11 Event Queue 2 Entry Register 11
02A0 04B0 Q2E12 Event Queue 2 Entry Register 12
02A0 04B4 Q2E13 Event Queue 2 Entry Register 13
02A0 04B8 Q2E14 Event Queue 2 Entry Register 14
02A0 04BC Q2E15 Event Queue 2 Entry Register 15
02A0 04C0 Q3E0 Event Queue 3 Entry Register 0
02A0 04C4 Q3E1 Event Queue 3 Entry Register 1
02A0 04C8 Q3E2 Event Queue 3 Entry Register 2
02A0 04CC Q3E3 Event Queue 3 Entry Register 3
02A0 04D0 Q3E4 Event Queue 3 Entry Register 4
02A0 04D4 Q3E5 Event Queue 3 Entry Register 5
02A0 04D8 Q3E6 Event Queue 3 Entry Register 6
02A0 04DC Q3E7 Event Queue 3 Entry Register 7
02A0 04E0 Q3E8 Event Queue 3 Entry Register 8
02A0 04E4 Q3E9 Event Queue 3 Entry Register 9
02A0 04E8 Q3E10 Event Queue 3 Entry Register 10
02A0 04EC Q3E11 Event Queue 3 Entry Register 11
02A0 04F0 Q3E12 Event Queue 3 Entry Register 12
02A0 04F4 Q3E13 Event Queue 3 Entry Register 13
02A0 04F8 Q3E14 Event Queue 3 Entry Register 14
02A0 04FC Q3E15 Event Queue 3 Entry Register 15
02A0 0500 - 02A0 051C - Reserved
02A0 0520 - 02A0 05FC - Reserved
02A0 0600 QSTAT0 Queue Status Register 0
02A0 0604 QSTAT1 Queue Status Register 1
02A0 0608 QSTAT2 Queue Status Register 2
02A0 060C QSTAT3 Queue Status Register 3
02A0 0610 - 02A0 061C - Reserved
02A0 0620 QWMTHRA Queue Watermark Threshold A Register
02A0 0624 - 02A0 063C - Reserved
02A0 0640 CCSTAT EDMA3CC Status Register
02A0 0644 - 02A0 06FC - Reserved
02A0 0700 - 02A0 07FC - Reserved
02A0 0800 MPFAR Memory Protection Fault Address Register
02A0 0804 MPFSR Memory Protection Fault Status Register
02A0 0808 MPFCR Memory Protection Fault Command Register
02A0 080C MPPA0 Memory Protection Page Attribute Register 0
02A0 0810 MPPA1 Memory Protection Page Attribute Register 1
02A0 0814 MPPA2 Memory Protection Page Attribute Register 2
02A0 0818 MPPA3 Memory Protection Page Attribute Register 3
02A0 081C MPPA4 Memory Protection Page Attribute Register 4
02A0 0820 MPPA5 Memory Protection Page Attribute Register 5
02A0 0824 MPPA6 Memory Protection Page Attribute Register 6
02A0 0828 MPPA7 Memory Protection Page Attribute Register 7
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Table 8-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 082C - 02A0 0FFC - Reserved
02A0 1000 ER Event Register
02A0 1004 ERH Event Register High
02A0 1008 ECR Event Clear Register
02A0 100C ECRH Event Clear Register High
02A0 1010 ESR Event Set Register
02A0 1014 ESRH Event Set Register High
02A0 1018 CER Chained Event Register
02A0 101C CERH Chained Event Register High
02A0 1020 EER Event Enable Register
02A0 1024 EERH Event Enable Register High
02A0 1028 EECR Event Enable Clear Register
02A0 102C EECRH Event Enable Clear Register High
02A0 1030 EESR Event Enable Set Register
02A0 1034 EESRH Event Enable Set Register High
02A0 1038 SER Secondary Event Register
02A0 103C SERH Secondary Event Register High
02A0 1040 SECR Secondary Event Clear Register
02A0 1044 SECRH Secondary Event Clear Register High
02A0 1048 - 02A0 104C - Reserved
02A0 1050 IER Interrupt Enable Register
02A0 1054 IERH Interrupt Enable High Register
02A0 1058 IECR Interrupt Enable Clear Register
02A0 105C IECRH Interrupt Enable Clear High Register
02A0 1060 IESR Interrupt Enable Set Register
02A0 1064 IESRH Interrupt Enable Set High Register
02A0 1068 IPR Interrupt Pending Register
02A0 106C IPRH Interrupt Pending High Register
02A0 1070 ICR Interrupt Clear Register
02A0 1074 ICRH Interrupt Clear High Register
02A0 1078 IEVAL Interrupt Evaluate Register
02A0 107C - Reserved
02A0 1080 QER QDMA Event Register
02A0 1084 QEER QDMA Event Enable Register
02A0 1088 QEECR QDMA Event Enable Clear Register
02A0 108C QEESR QDMA Event Enable Set Register
02A0 1090 QSER QDMA Secondary Event Register
02A0 1094 QSECR QDMA Secondary Event Clear Register
02A0 1098 - 02A0 1FFF - Reserved
Shadow Region 0 Channel Registers
02A0 2000 ER Event Register
02A0 2004 ERH Event Register High
02A0 2008 ECR Event Clear Register
02A0 200C ECRH Event Clear Register High
02A0 2010 ESR Event Set Register
02A0 2014 ESRH Event Set Register High
02A0 2018 CER Chained Event Register
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Table 8-4. EDMA3 Channel Controller Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 201C CERH Chained Event Register Hig
02A0 2020 EER Event Enable Register
02A0 2024 EERH Event Enable Register High
02A0 2028 EECR Event Enable Clear Register
02A0 202C EECRH Event Enable Clear Register High
02A0 2030 EESR Event Enable Set Register
02A0 2034 EESRH Event Enable Set Register High
02A0 2038 SER Secondary Event Register
02A0 203C SERH Secondary Event Register High
02A0 2040 SECR Secondary Event Clear Register
02A0 2044 SECRH Secondary Event Clear Register High
02A0 2048 - 02A0 204C - Reserved
02A0 2050 IER Interrupt Enable Register
02A0 2054 IERH Interrupt Enable Register High
02A0 2058 IECR Interrupt Enable Clear Register
02A0 205C IECRH Interrupt Enable Clear Register High
02A0 2060 IESR Interrupt Enable Set Register
02A0 2064 IESRH Interrupt Enable Set Register High
02A0 2068 IPR Interrupt Pending Register
02A0 206C IPRH Interrupt Pending Register High
02A0 2070 ICR Interrupt Clear Register
02A0 2074 ICRH Interrupt Clear Register High
02A0 2078 IEVAL Interrupt Evaluate Register
02A0 207C - Reserved
02A0 2080 QER QDMA Event Register
02A0 2084 QEER QDMA Event Enable Register
02A0 2088 QEECR QDMA Event Enable Clear Register
02A0 208C QEESR QDMA Event Enable Set Register
02A0 2090 QSER QDMA Secondary Event Register
02A0 2094 QSECR QDMA Secondary Event Clear Register
02A0 2098 - 02A0 23FF - Reserved
02A0 2400 - 02A0 2497 - Shadow Region 2 Channel Registers
02A0 2498 - 02A0 25FF - Reserved
02A0 2600 - 02A0 2697 - Shadow Region 3 Channel Registers
02A0 2698 - 02A0 27FF - Reserved
02A0 2800 - 02A0 2897 - Shadow Region 4 Channel Registers
02A0 2898 - 02A0 29FF - Reserved
02A0 2A00 - 02A0 2A97 - Shadow Region 5 Channel Registers
02A0 2A98 - 02A0 2BFF - Reserved
02A0 2C00 - 02A0 2C97 - Shadow Region 6 Channel Registers
02A0 2C98 - 02A0 2DFF - Reserved
02A0 2E00 - 02A0 2E97 - Shadow Region 7 Channel Registers
02A0 2E98 - 02A0 2FFF - Reserved
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Table 8-5. EDMA3 Parameter RAM(1)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A0 4000 - 02A0 401F - Parameter Set 0
02A0 4020 - 02A0 403F - Parameter Set 1
02A0 4040 - 02A0 405F - Parameter Set 2
02A0 4060 - 02A0 407F - Parameter Set 3
02A0 4080 - 02A0 409F - Parameter Set 4
02A0 40A0 - 02A0 40BF - Parameter Set 5
02A0 40C0 - 02A0 40DF - Parameter Set 6
02A0 40E0 - 02A0 40FF - Parameter Set 7
02A0 4100 - 02A0 411F - Parameter Set 8
02A0 4120 - 02A0 413F - Parameter Set 9
... ...
02A0 47E0 - 02A0 47FF - Parameter Set 63
02A0 4800 - 02A0 481F - Parameter Set 64
02A0 4820 - 02A0 483F - Parameter Set 65
... ...
02A0 5FC0 - 02A0 5FDF - Parameter Set 254
02A0 5FE0 - 02A0 5FFF - Parameter Set 255
(1) The TCI6482 device has 256 EDMA3 parameter sets total. Each parameter set can be used as a DMA entry, a QDMA entry, or a link
entry.
Table 8-6. EDMA3 Transfer Controller 0 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A2 0000 PID Peripheral Identification Register
02A2 0004 TCCFG EDMA3TC Configuration Register
02A2 0008 - 02A2 00FC - Reserved
02A2 0100 TCSTAT EDMA3TC Channel Status Register
02A2 0104 - 02A2 011C - Reserved
02A2 0120 ERRSTAT Error Register
02A2 0124 ERREN Error Enable Register
02A2 0128 ERRCLR Error Clear Register
02A2 012C ERRDET Error Details Register
02A2 0130 ERRCMD Error Interrupt Command Register
02A2 0134 - 02A2 013C - Reserved
02A2 0140 RDRATE Read Rate Register
02A2 0144 - 02A2 023C - Reserved
02A2 0240 SAOPT Source Active Options Register
02A2 0244 SASRC Source Active Source Address Register
02A2 0248 SACNT Source Active Count Register
02A2 024C SADST Source Active Destination Address Register
02A2 0250 SABIDX Source Active Source B-Index Register
02A2 0254 SAMPPRXY Source Active Memory Protection Proxy Register
02A2 0258 SACNTRLD Source Active Count Reload Register
02A2 025C SASRCBREF Source Active Source Address B-Reference Register
02A2 0260 SADSTBREF Source Active Destination Address B-Reference Register
02A2 0264 - 02A2 027C - Reserved
02A2 0280 DFCNTRLD Destination FIFO Set Count Reload
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Table 8-6. EDMA3 Transfer Controller 0 Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A2 0284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register
02A2 0288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register
02A2 028C - 02A2 02FC - Reserved
02A2 0300 DFOPT0 Destination FIFO Options Register 0
02A2 0304 DFSRC0 Destination FIFO Source Address Register 0
02A2 0308 DFCNT0 Destination FIFO Count Register 0
02A2 030C DFDST0 Destination FIFO Destination Address Register 0
02A2 0310 DFBIDX0 Destination FIFO BIDX Register 0
02A2 0314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0
02A2 0318 - 02A2 033C - Reserved
02A2 0340 DFOPT1 Destination FIFO Options Register 1
02A2 0344 DFSRC1 Destination FIFO Source Address Register 1
02A2 0348 DFCNT1 Destination FIFO Count Register 1
02A2 034C DFDST1 Destination FIFO Destination Address Register 1
02A2 0350 DFBIDX1 Destination FIFO BIDX Register 1
02A2 0354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1
02A2 0358 - 02A2 037C - Reserved
02A2 0380 DFOPT2 Destination FIFO Options Register 2
02A2 0384 DFSRC2 Destination FIFO Source Address Register 2
02A2 0388 DFCNT2 Destination FIFO Count Register 2
02A2 038C DFDST2 Destination FIFO Destination Address Register 2
02A2 0390 DFBIDX2 Destination FIFO BIDX Register 2
02A2 0394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2
02A2 0398 - 02A2 03BC - Reserved
02A2 03C0 DFOPT3 Destination FIFO Options Register 3
02A2 03C4 DFSRC3 Destination FIFO Source Address Register 3
02A2 03C8 DFCNT3 Destination FIFO Count Register 3
02A2 03CC DFDST3 Destination FIFO Destination Address Register 3
02A2 03D0 DFBIDX3 Destination FIFO BIDX Register 3
02A2 03D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3
02A2 03D8 - 02A2 7FFF - Reserved
Table 8-7. EDMA3 Transfer Controller 1 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A2 8000 PID Peripheral Identification Register
02A2 8004 TCCFG EDMA3TC Configuration Register
02A2 8008 - 02A2 80FC - Reserved
02A2 8100 TCSTAT EDMA3TC Channel Status Register
02A2 8104 - 02A2 811C - Reserved
02A2 8120 ERRSTAT Error Register
02A2 8124 ERREN Error Enable Register
02A2 8128 ERRCLR Error Clear Register
02A2 812C ERRDET Error Details Register
02A2 8130 ERRCMD Error Interrupt Command Register
02A2 8134 - 02A2 813C - Reserved
02A2 8140 RDRATE Read Rate Register
02A2 8144 - 02A2 823C - Reserved
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Table 8-7. EDMA3 Transfer Controller 1 Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A2 8240 SAOPT Source Active Options Register
02A2 8244 SASRC Source Active Source Address Register
02A2 8248 SACNT Source Active Count Register
02A2 824C SADST Source Active Destination Address Register
02A2 8250 SABIDX Source Active Source B-Index Register
02A2 8254 SAMPPRXY Source Active Memory Protection Proxy Register
02A2 8258 SACNTRLD Source Active Count Reload Register
02A2 825C SASRCBREF Source Active Source Address B-Reference Register
02A2 8260 SADSTBREF Source Active Destination Address B-Reference Register
02A2 8264 - 02A2 827C - Reserved
02A2 8280 DFCNTRLD Destination FIFO Set Count Reload
02A2 8284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register
02A2 8288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register
02A2 828C - 02A2 82FC - Reserved
02A2 8300 DFOPT0 Destination FIFO Options Register 0
02A2 8304 DFSRC0 Destination FIFO Source Address Register 0
02A2 8308 DFCNT0 Destination FIFO Count Register 0
02A2 830C DFDST0 Destination FIFO Destination Address Register 0
02A2 8310 DFBIDX0 Destination FIFO BIDX Register 0
02A2 8314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0
02A2 8318 - 02A2 833C - Reserved
02A2 8340 DFOPT1 Destination FIFO Options Register 1
02A2 8344 DFSRC1 Destination FIFO Source Address Register 1
02A2 8348 DFCNT1 Destination FIFO Count Register 1
02A2 834C DFDST1 Destination FIFO Destination Address Register 1
02A2 8350 DFBIDX1 Destination FIFO BIDX Register 1
02A2 8354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1
02A2 8358 - 02A2 837C - Reserved
02A2 8380 DFOPT2 Destination FIFO Options Register 2
02A2 8384 DFSRC2 Destination FIFO Source Address Register 2
02A2 8388 DFCNT2 Destination FIFO Count Register 2
02A2 838C DFDST2 Destination FIFO Destination Address Register 2
02A2 8390 DFBIDX2 Destination FIFO BIDX Register 2
02A2 8394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2
02A2 8398 - 02A2 83BC - Reserved
02A2 83C0 DFOPT3 Destination FIFO Options Register 3
02A2 83C4 DFSRC3 Destination FIFO Source Address Register 3
02A2 83C8 DFCNT3 Destination FIFO Count Register 3
02A2 83CC DFDST3 Destination FIFO Destination Address Register 3
02A2 83D0 DFBIDX3 Destination FIFO BIDX Register 3
02A2 83D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3
02A2 83D8 - 02A2 FFFF - Reserved
Table 8-8. EDMA3 Transfer Controller 2 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A3 0000 PID Peripheral Identification Register
02A3 0004 TCCFG EDMA3TC Configuration Register
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Table 8-8. EDMA3 Transfer Controller 2 Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A3 0008 - 02A3 00FC - Reserved
02A3 0100 TCSTAT EDMA3TC Channel Status Register
02A3 0104 - 02A3 011C - Reserved
02A3 0120 ERRSTAT Error Register
02A3 0124 ERREN Error Enable Register
02A3 0128 ERRCLR Error Clear Register
02A3 012C ERRDET Error Details Register
02A3 0130 ERRCMD Error Interrupt Command Register
02A3 0134 - 02A3 013C - Reserved
02A3 0140 RDRATE Read Rate Register
02A3 0144 - 02A3 023C - Reserved
02A3 0240 SAOPT Source Active Options Register
02A3 0244 SASRC Source Active Source Address Register
02A3 0248 SACNT Source Active Count Register
02A3 024C SADST Source Active Destination Address Register
02A3 0250 SABIDX Source Active Source B-Index Register
02A3 0254 SAMPPRXY Source Active Memory Protection Proxy Register
02A3 0258 SACNTRLD Source Active Count Reload Register
02A3 025C SASRCBREF Source Active Source Address B-Reference Register
02A3 0260 SADSTBREF Source Active Destination Address B-Reference Register
02A3 0264 - 02A3 027C - Reserved
02A3 0280 DFCNTRLD Destination FIFO Set Count Reload
02A3 0284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register
02A3 0288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register
02A3 028C - 02A3 02FC - Reserved
02A3 0300 DFOPT0 Destination FIFO Options Register 0
02A3 0304 DFSRC0 Destination FIFO Source Address Register 0
02A3 0308 DFCNT0 Destination FIFO Count Register 0
02A3 030C DFDST0 Destination FIFO Destination Address Register 0
02A3 0310 DFBIDX0 Destination FIFO BIDX Register 0
02A3 0314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0
02A3 0318 - 02A3 033C - Reserved
02A3 0340 DFOPT1 Destination FIFO Options Register 1
02A3 0344 DFSRC1 Destination FIFO Source Address Register 1
02A3 0348 DFCNT1 Destination FIFO Count Register 1
02A3 034C DFDST1 Destination FIFO Destination Address Register 1
02A3 0350 DFBIDX1 Destination FIFO BIDX Register 1
02A3 0354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1
02A3 0358 - 02A3 037C - Reserved
02A3 0380 DFOPT2 Destination FIFO Options Register 2
02A3 0384 DFSRC2 Destination FIFO Source Address Register 2
02A3 0388 DFCNT2 Destination FIFO Count Register 2
02A3 038C DFDST2 Destination FIFO Destination Address Register 2
02A3 0390 DFBIDX2 Destination FIFO BIDX Register 2
02A3 0394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2
02A3 0398 - 02A3 03BC - Reserved
02A3 03C0 DFOPT3 Destination FIFO Options Register 3
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Table 8-8. EDMA3 Transfer Controller 2 Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A3 03C4 DFSRC3 Destination FIFO Source Address Register 3
02A3 03C8 DFCNT3 Destination FIFO Count Register 3
02A3 03CC DFDST3 Destination FIFO Destination Address Register 3
02A3 03D0 DFBIDX3 Destination FIFO BIDX Register 3
02A3 03D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3
02A3 03D8 - 02A3 7FFF - Reserved
Table 8-9. EDMA3 Transfer Controller 3 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A3 8000 PID Peripheral Identification Register
02A3 8004 TCCFG EDMA3TC Configuration Register
02A3 8008 - 02A3 80FC - Reserved
02A3 8100 TCSTAT EDMA3TC Channel Status Register
02A3 8104 - 02A3 811C - Reserved
02A3 8120 ERRSTAT Error Register
02A3 8124 ERREN Error Enable Register
02A3 8128 ERRCLR Error Clear Register
02A3 812C ERRDET Error Details Register
02A3 8130 ERRCMD Error Interrupt Command Register
02A3 8134 - 02A3 813C - Reserved
02A3 8140 RDRATE Read Rate Register
02A3 8144 - 02A3 823C - Reserved
02A3 8240 SAOPT Source Active Options Register
02A3 8244 SASRC Source Active Source Address Register
02A3 8248 SACNT Source Active Count Register
02A3 824C SADST Source Active Destination Address Register
02A3 8250 SABIDX Source Active Source B-Index Register
02A3 8254 SAMPPRXY Source Active Memory Protection Proxy Register
02A3 8258 SACNTRLD Source Active Count Reload Register
02A3 825C SASRCBREF Source Active Source Address B-Reference Register
02A3 8260 SADSTBREF Source Active Destination Address B-Reference Register
02A3 8264 - 02A3 827C - Reserved
02A3 8280 DFCNTRLD Destination FIFO Set Count Reload
02A3 8284 DFSRCBREF Destination FIFO Set Destination Address B Reference Register
02A3 8288 DFDSTBREF Destination FIFO Set Destination Address B Reference Register
02A3 828C - 02A3 82FC - Reserved
02A3 8300 DFOPT0 Destination FIFO Options Register 0
02A3 8304 DFSRC0 Destination FIFO Source Address Register 0
02A3 8308 DFCNT0 Destination FIFO Count Register 0
02A3 830C DFDST0 Destination FIFO Destination Address Register 0
02A3 8310 DFBIDX0 Destination FIFO BIDX Register 0
02A3 8314 DFMPPRXY0 Destination FIFO Memory Protection Proxy Register 0
02A3 8318 - 02A3 833C - Reserved
02A3 8340 DFOPT1 Destination FIFO Options Register 1
02A3 8344 DFSRC1 Destination FIFO Source Address Register 1
02A3 8348 DFCNT1 Destination FIFO Count Register 1
02A3 834C DFDST1 Destination FIFO Destination Address Register 1
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Table 8-9. EDMA3 Transfer Controller 3 Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02A3 8350 DFBIDX1 Destination FIFO BIDX Register 1
02A3 8354 DFMPPRXY1 Destination FIFO Memory Protection Proxy Register 1
02A3 8358 - 02A3 837C - Reserved
02A3 8380 DFOPT2 Destination FIFO Options Register 2
02A3 8384 DFSRC2 Destination FIFO Source Address Register 2
02A3 8388 DFCNT2 Destination FIFO Count Register 2
02A3 838C DFDST2 Destination FIFO Destination Address Register 2
02A3 8390 DFBIDX2 Destination FIFO BIDX Register 2
02A3 8394 DFMPPRXY2 Destination FIFO Memory Protection Proxy Register 2
02A3 8398 - 02A3 83BC - Reserved
02A3 83C0 DFOPT3 Destination FIFO Options Register 3
02A3 83C4 DFSRC3 Destination FIFO Source Address Register 3
02A3 83C8 DFCNT3 Destination FIFO Count Register 3
02A3 83CC DFDST3 Destination FIFO Destination Address Register 3
02A3 83D0 DFBIDX3 Destination FIFO BIDX Register 3
02A3 83D4 DFMPPRXY3 Destination FIFO Memory Protection Proxy Register 3
02A3 83D8 - 02A3 FFFF - Reserved
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8.5 Interrupts
8.5.1 Interrupt Sources and Interrupt Controller
The CPU interrupts on the TCI6482 device are configured through the C64x+ Megamodule Interrupt
Controller. The interrupt controller allows for up to 128 system events to be programmed to any of the
twelve CPU interrupt inputs (CPUINT4 - CPUINT15), the CPU exception input (EXCEP), or the advanced
emulation logic. The 128 system events consist of both internally-generated events (within the
megamodule) and chip-level events. Table 8-10 shows the mapping of system events. For more
information on the Interrupt Controller, see the TMS320C64x+ Megamodule Reference Guide (literature
number SPRU871).
Table 8-10. TCI6482 System Event Mapping
EVENT NUMBER INTERRUPT EVENT DESCRIPTION
0(1) EVT0 Output of event combiner 0 in interrupt controller, for events 1 - 31.
1(1) EVT1 Output of event combiner 1 in interrupt controller, for events 32 - 63.
2(1) EVT2 Output of event combiner 2 in interrupt controller, for events 64 - 95.
Output of event combiner 3 in interrupt controller, for events 96 -
3(1) EVT3 127.
Reserved. These system events are not connected and, therefore,
4 - 8 Reserved not used.
EMU interrupt for:
1. Host scan access
9(1) EMU_DTDMA 2. DTDMA transfer complete
3. AET interrupt
10 None This system event is not connected and, therefore, not used.
11(1) EMU_RTDXRX EMU real-time data exchange (RTDX) receive complete
12(1) EMU_RTDXTX EMU RTDX transmit complete
13(1) IDMA0 IDMA channel 0 interrupt
14(1) IDMA1 IDMA channel 1 interrupt
15 DSPINT HPI/PCI-to-DSP interrupt
16 I2CINT I2C interrupt
17 MACINT Ethernet MAC interrupt
18 AEASYNCERR EMIFA error interrupt
Reserved. This system event is not connected and, therefore, not
19 Reserved used.
20 INTDST0 RapidIO interrupt 0
21 INTDST1 RapidIO interrupt 1
22 INTDST4 RapidIO interrupt 4
Reserved. This system event is not connected and, therefore, not
23 Reserved used.
24 EDMA3CC_GINT EDMA3 channel global completion interrupt
Reserved. These system events are not connected and, therefore,
25 - 31 Reserved not used.
32 VCP2_INT VCP2 error interrupt
33 TCP2_INT TCP2 error interrupt
Reserved. These system events are not connected and, therefore,
34 - 35 Reserved not used.
36 UINT UTOPIA interrupt
Reserved. These system events are not connected and, therefore,
37 - 39 Reserved not used.
40 RINT0 McBSP0 receive interrupt
(1) This system event is generated from within the C64x+ megamodule.
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Table 8-10. TCI6482 System Event Mapping (continued)
EVENT NUMBER INTERRUPT EVENT DESCRIPTION
41 XINT0 McBSP0 transmit interrupt
42 RINT1 McBSP1 receive interrupt
43 XINT1 McBSP1 transmit interrupt
Reserved. These system events are not connected and, therefore,
44 - 49 Reserved not used.
50 VINT VLYNQ pulse interrupt
51 GPINT0 GPIO interrupt
52 GPINT1 GPIO interrupt
53 GPINT2 GPIO interrupt
54 GPINT3 GPIO interrupt
55 GPINT4 GPIO interrupt
56 GPINT5 GPIO interrupt
57 GPINT6 GPIO interrupt
58 GPINT7 GPIO interrupt
59 GPINT8 GPIO interrupt
60 GPINT9 GPIO interrupt
61 GPINT10 GPIO interrupt
62 GPINT11 GPIO interrupt
63 GPINT12 GPIO interrupt
64 GPINT13 GPIO interrupt
65 GPINT14 GPIO interrupt
66 GPINT15 GPIO interrupt
67 TINTLO0 Timer 0 lower counter interrupt
68 TINTHI0 Timer 0 higher counter interrupt
69 TINTLO1 Timer 1 lower counter interrupt
70 TINTHI1 Timer 1 higher counter interrupt
71 EDMA3CC_INT0 EDMA3CC completion interrupt - Mask0
72 EDMA3CC_INT1 EDMA3CC completion interrupt - Mask1
73 EDMA3CC_INT2 EDMA3CC completion interrupt - Mask2
74 EDMA3CC_INT3 EDMA3CC completion interrupt - Mask3
75 EDMA3CC_INT4 EDMA3CC completion interrupt - Mask4
76 EDMA3CC_INT5 EDMA3CC completion interrupt - Mask5
77 EDMA3CC_INT6 EDMA3CC completion interrupt - Mask6
78 EDMA3CC_INT7 EDMA3CC completion interrupt - Mask7
79 EDMA3CC_ERRINT EDMA3CC error interrupt
Reserved. This system event is not connected and, therefore, not
80 Reserved used.
81 EDMA3TC0_ERRINT EDMA3TC0 error interrupt
82 EDMA3TC1_ERRINT EDMA3TC1 error interrupt
83 EDMA3TC2_ERRINT EDMA3TC2 error interrupt
84 EDMA3TC3_ERRINT EDMA3TC3 error interrupt
Reserved. These system events are not connected and, therefore,
85 - 95 Reserved not used.
96(2) INTERR Interrupt Controller dropped CPU interrupt event
97(2) EMC_IDMAERR EMC invalid IDMA parameters
Reserved. These system events are not connected and, therefore,
98 - 99 Reserved not used.
100(2) EFIINTA EFI interrupt from side A
(2) This system event is generated from within the C64x+ megamodule.
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Table 8-10. TCI6482 System Event Mapping (continued)
EVENT NUMBER INTERRUPT EVENT DESCRIPTION
101(2) EFIINTB EFI interrupt from side B
Reserved. These system events are not connected and, therefore,
102 - 112 Reserved not used.
113(2) L1P_ED1 L1P single bit error detected during DMA read
Reserved. These system events are not connected and, therefore,
114 - 115 Reserved not used.
116(2) L2_ED1 L2 single bit error detected
117(2) L2_ED2 L2 two bit error detected
118(2) PDC_INT Powerdown sleep interrupt
Reserved. This system event is not connected and, therefore, not
119 Reserved used.
120(2) L1P_CMPA L1P CPU memory protection fault
121(2) L1P_DMPA L1P DMA memory protection fault
122(3) L1D_CMPA L1D CPU memory protection fault
123(3) L1D_DMPA L1D DMA memory protection fault
124(3) L2_CMPA L2 CPU memory protection fault
125(3) L2_DMPA L2 DMA memory protection fault
126(3) IDMA_CMPA IDMA CPU memory protection fault
127(3) IDMA_BUSERR IDMA bus error interrupt
(3) This system event is generated from within the C64x+ megamodule.
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1
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8.5.2 External Interrupts Electrical Data/Timing
Table 8-11. Timing Requirements for External Interrupts(1)
(see Figure 8-6)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tw(NMIL) Width of the NMI interrupt pulse low 6P ns
2 tw(NMIH) Width of the NMI interrupt pulse high 6P ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
Figure 8-6. NMI Interrupt Timing
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8.6 Reset Controller
The reset controller detects the different type of resets supported on the TCI6482 device and manages the
distribution of those resets throughout the device.
The TCI6482 device has several types of resets: power-on reset, warm reset, max reset, system reset,
and CPU reset. Table 8-12 explains further the types of reset, the reset initiator, and the effects of each
reset on the chip. For more information on the effects of each reset on the PLL controllers and their
clocks, see Section 8.6.8,Reset Electrical Data/Timing.
Table 8-12. Reset Types
TYPE INITIATOR EFFECT(s)
Power-on Reset POR pin Resets the entire chip including the test and emulation logic.
Resets everything except for the test and emulation logic and PLL2.
Warm Reset RESET pin Emulator stays alive during Warm Reset.
Max Reset RapidIO [through INTDST5(1)] Same as Warm Reset.
A system reset maintains memory contents and does not reset the
System Reset Emulator test and emulation circuitry. The device configuration pins are also
not re-latched and the state of the peripherals is also not affected.(2)
CPU Local Reset HPI/PCI CPU local reset.
(1) INTDST5 is used generate a MAX reset only. It is not connected to the device interrupt controller. For more detailed information on the
INTDST5, see the TMS320TCI648x DSP Serial Rapid I/O User's Guide (literature number SPRUE13) .
(2) On the TCI6482 device, peripherals can be in one of several states. These states are listed in Table 3-4.
8.6.1 Power-on Reset (POR Pin)
Power-on Reset is initiated by the POR pin and is used to reset the entire chip, including the test and
emulation logic. Power-on Reset is also referred to as a cold reset since the device usually goes through a
power-up cycle. During power-up, the POR pin must be asserted (driven low) until the power supplies
have reached their normal operating conditions. Note that a device power-up cycle is not required to
initiate a Power-on Reset.
The following sequence must be followed during a Power-on Reset:
1. Wait for all power supplies to reach normal operating conditions while keeping the POR pin asserted
(driven low).
While POR is asserted, all pins will be set to high-impedance. After the POR pin is deasserted (driven
high), all Z group pins, low group pins, and high group pins are set to their reset state and will remain
at their reset state until the otherwise configured by their respective peripheral. All peripherals, except
those selected for boot purposes, are disabled after a Power-on Reset and must be enabled through
the Device State Control registers; for more details, see Section 3.3,Peripheral Selection After Device
Reset.
2. Once all the power supplies are within valid operating conditions, the POR pin must remain asserted
(low) for a minimum of 256 CLKIN2 cycles. The PLL1 controller input clock, CLKIN1, and the PCI input
clock, PCLK, must also be valid during this time. PCLK is only needed if the PCI module is being used.
If the DDR2 memory controller and the EMAC peripheral are not needed, CLKIN2 can be tied low and,
in this case, the POR pin must remain asserted (low) for a minimum of 256 CLKIN1 cycles after all
power supplies have reached valid operating conditions.
Within the low period of the POR pin, the following happens:
– The reset signals flow to the entire chip (including the test and emulation logic), resetting modules
that use reset asynchronously.
– The PLL1 controller clocks are started at the frequency of the system reference clock. The clocks
are propagated throughout the chip to reset modules that use reset synchronously. By default,
PLL1 is in reset and unlocked.
– The PLL2 controller clocks are started at the frequency of the system reference clock. PLL2 is held
in reset. Since the PLL2 controller always operates in PLL mode, the system reference clock and
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all the system clocks are invalid at this point.
– The RESETSTAT pin stays asserted (low), indicating the device is in reset.
3. The POR pin may now be deasserted (driven high).
When the POR pin is deasserted, the configuration pin values are latched and the PLL controllers
change their system clocks to their default divide-down values. PLL2 is taken out of reset and
automatically starts its locking sequence. Other device initialization is also started.
4. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). By this time,
PLL2 has already completed its locking sequence and is outputting a valid clock. The system clocks of
both PLL controllers are allowed to finish their current cycles and then paused for 10 cycles of their
respective system reference clocks. After the pause the system clocks are restarted at their default
divide-by settings.
5. The device is now out of reset, device execution begins as dictated by the selected boot mode (see
Section 2.4,Boot Sequence).
NOTE
To most of the device, reset is de-asserted only when the POR and RESET pins are both
de-asserted (driven high). Therefore, in the sequence described above, if the RESET pin is
held low past the low period of the POR pin, most of the device will remain in reset. The only
exception being that PLL2 is taken out of reset as soon as POR is de-asserted (driven high),
regardless of the state of the RESET pin. The RESET pin should not be tied together with
the POR pin.
8.6.2 Warm Reset (RESET Pin)
A Warm Reset has the same effects as a Power-on Reset, except that in this case, the test and emulation
logic and PLL2 are not reset.
The following sequence must be followed during a Warm Reset:
1. Hold the RESET pin low for a minimum of 24 CLKIN1 cycles. Within the minimum 24 CLKIN1 cycles.
Within the low period of the RESET pin, the following happens:
– The Z group pins, low group pins, and the high group pins are set to their reset state with one
exception:
The PCI pins are not affected by warm reset if the PCI module was enabled before RESET went
low. In this case, PCI pins stay at whatever their value was before RESET went low.
– The reset signals flow to the entire chip (excluding the test and emulation logic), resetting modules
that use reset asynchronously.
– The PLL1 controller is reset thereby switching back to bypass mode and resetting all its registers to
their default values. PLL1 is placed in reset and loses lock. The PLL1 controller clocks start running
at the frequency of the system reference clock. The clocks are propagated throughout the chip to
reset modules that use reset synchronously.
– The PLL2 controller is reset thereby resetting all its registers to their default values. The PLL2
controller clocks start running at the frequency of the system reference clock. PLL2 is not reset,
therefore it remains locked.
– The RESETSTAT pin becomes active (low), indicating the device is in reset.
2. The RESET pin may now be released (driven inactive high).
When the RESET pin is released, the configuration pin values are latched and the PLL controllers
immediately change their system clocks to their default divide-down values. Other device initialization
is also started.
3. After device initialization is complete, the RESETSTAT pin goes inactive (high). All system clocks are
allowed to finish their current cycles and then paused for 10 cycles of their respective system reference
clocks. After the pause the system clocks are restarted at their default divide-by settings.
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4. The device is now out of reset, device execution begins as dictated by the selected boot mode (see
Section 2.4,Boot Sequence).
NOTE
The POR pin should be held inactive (high) throughout the Warm Reset sequence.
Otherwise, if POR is activated (brought low), the minimum POR pulse width must be met.
The RESET pin should not be tied together with the POR pin.
8.6.3 Max Reset
A Max Reset is initiated by the RapidIO peripheral and has the same affect as a Warm Reset.
8.6.4 System Reset
The emulator initiates a System Reset via the ICEPick module. This ICEPick-initiated reset is non-
maskable. To invoke the maximum reset via the ICEPick module, the user can perform the following from
the Code Composer Studio™ menu: Debug →Advanced Resets →System Reset.
The following memory contents are maintained during a System Reset:
• DDR2 Memory Controller: The DDR2 Memory Controller registers are not reset. In addition, the DDR2
SDRAM memory content is retained if the user places the DDR2 SDRAM in self-refresh mode before
invoking the System Reset.
• EMIFA: The contents of the memory connected to the EMIFA are retained. The EMIFA registers are
not reset.
Test, emulation, and clock logic are unaffected. The device configuration pins are also not re-latched and
the state of the peripherals (see Table 3-4) is not affected.
During a System Reset, the following happens:
1. The System Reset is initiated by the emulator.
During this time, the following happens:
– The reset signals flow to the entire chip resetting all the modules on chip except the test and
emulation logic.
– The PLL controllers are not reset. Internal system clocks are unaffected. If PLL1/PLL2 were locked
before the System Reset, they remain locked.
– The RESETSTAT pin goes low to indicate an internal reset is being generated.
2. After device initialization is complete, the RESETSTAT pin is deasserted (driven high). In addition, the
PLL controllers pause their system clocks for about 10 cycles.
At this point:
– The state of the peripherals before the System Reset is not changed. For example, if McBSP0 was
in the enabled state before System Reset, it will remain in the enabled state after System Reset.
– The I/O pins are controlled as dictated by the DEVSTAT register.
– The DDR2 Memory Controller and EMIFA registers retain their previous values. Only the DDR2
Memory Controller and EMIFA state machines are reset by the System Reset.
– The PLL controllers are operating in the mode prior to System Reset. System clocks are
unaffected.
The boot sequence is started after the system clocks are restarted. Since the configuration pins (including
the BOOTMODE[3:0] pins) are not latched with a System Reset, the previous values, as shown in the
DEVSTAT register, are used to select the boot mode.
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8.6.5 CPU Reset
A CPU Reset is initiated by the HPI or PCI peripheral. This reset only affects the CPU. During a PCI-
initiated CPU Reset, the PCI pins are set to their reset state. With the exception of the HRDY/PIRDY pin,
the PCI pins have a reset state of high-impedance; the HRDY/PIRDY pin goes high during reset.
8.6.6 Reset Priority
If any of the above reset sources occur simultaneously, the PLLCTRL only processes the highest priority
reset request. The rest request priorities are as follows (high to low):
• Power-on Reset
• Maximum Reset
• Warm Reset
• System Reset
• CPU Reset
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8.6.7 Reset Controller Register
The reset type status (RSTYPE) register (029A 00E4) is the only register for the reset controller. This
register falls in the same memory range as the PLL1 controller registers [029A 0000 - 029A 01FF] (see
Table 8-18).
8.6.7.1 Reset Type Status Register Description
The rest type status (RSTYPE) register latches the cause of the last reset. If multiple reset sources occur
simultaneously, this register latches the highest priority reset source. The reset type status register is
shown in Figure 8-7 and described in Table 8-13.
31 16
Reserved
R-0
15 43210
Reserved SRST MRST WRST POR
R-0 R-0 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-7. Reset Type Status Register (RSTYPE) [Hex Address: 029A 00E4]
Table 8-13. Reset Type Status Register (RSTYPE) Field Descriptions
Bit Field Value Description
31:4 Reserved Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
3 SRST System reset.
0 System Reset was not the last reset to occur.
1 System Reset was the last reset to occur.
2 MRST Max reset.
0 Max Reset was not the last reset to occur.
1 Max Reset was the last reset to occur.
1 WRST Warm reset.
0 Warm Reset was not the last reset to occur.
1 Warm Reset was the last reset to occur.
0 POR Power-on reset.
0 Power-on Reset was not the last reset to occur.
1 Power-on Reset was the last reset to occur.
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8.6.8 Reset Electrical Data/Timing
Table 8-14. Timing Requirements for Reset(1) (2) (3)
(see Figure 8-8 and Figure 8-9)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
5 tw(POR) Pulse duration, POR low 256D(4) ns
6 tw(RESET) Pulse duration, RESET low 24C ns
Setup time, boot mode and configuration pins valid before POR high or
7 tsu(boot) 6P ns
RESET high(5)
Hold time, boot mode and configuration pins valid after POR high or
8 th(boot) 6P ns
RESET high(5)
(1) C = 1/CLKIN1 clock frequency in ns.
(2) D = 1/CLKIN2 clock frequency in ns.
(3) P = 1/CPU clock frequency in nanoseconds (ns). Note that after power-on reset, warm reset, and max reset the CPU frequency is equal
to the CLKIN1 frequency divided by three due to the PLL1 controller being reset (see Section 8.6,Reset Controller).
(4) If CLKIN2 is not used, tw(POR) must be measured in terms of CLKIN1 cycles; otherwise, use CLKIN2 cycles.
(5) AEA[19:0], ABA[1:0], and PCI_EN are the boot configuration pins during device reset. Note: If a configuration pin must be routed out
from the device and 3-stated (not driven), the internal pullup/pulldown (IPU/IPD) resistor should not be relied upon; TI recommends the
use of an external pullup/pulldown resistor. For more detailed information on pullup/pulldown resistors and situations where external
pullup/pulldown resistors are required, see Section 3.7,Pullup/Pulldown Resistors.
Table 8-15. Switching Characteristics Over Recommended Operating Conditions During Reset(1)
(see Figure 8-9)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
9 td(PORH-RSTATH) Delay time, POR high AND RESET high to RESETSTAT high 15000C ns
(1) C = 1/CLKIN1 clock frequency in ns.
For Figure 8-8, note the following:
• Z group consists of: all I/O/Z and O/Z pins, except for Low and High group pins. Pins become high
impedance as soon as their respective power supply has reached normal operating coditions. Pins
remain in high impedance until configured otherwise by their respective peripheral.
• Low group consists of: UXDATA0/ MTXD0/RMTXD0, UXDATA1/ MTXD1/RMTXD1, UXDATA2/
MTXD2/RMTXD2, UXDATA3/ MTXD3/RMTXD3, UXDATA4/ MTXD4/RMTXD4, and UXENB/
MTXEN/RMTXEN. Pins become low as soon as their respective power supply has reached normal
operating conditions. Pins remain low until configured otherwise by their respective peripheral.
• High group consists of: AHOLD, ABUSREQ, and HRDY/PIRDY. Pins become high as soon as their
respective power supply has reached normal operating conditions. Pins remain high until configured
otherwise by their respective peripheral. The ABUSREQ pin remains high until the EMIFA is enabled
through the PERCFG1 register. Once the EMIFA is enabled, the ABUSREQ pin is driven to its inactive
state (driven low).
• All peripherals must be enable through software following a Power-on Reset; for more details, see
Section 8.6.1,Power-on Reset.
• For power-supply sequence requirements, see Section 8.3.1,Power-Supply Sequencing.
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CLKIN1
PCLK
RESET
RESETSTAT
SYSREFCLK (PLL1C)
Z Group
POR
SYSCLK3
SYSCLK4
SYSCLK5
AECLKOUT (Internal)
Boot and Device
Configuration Pins
Low Group
High Group
CLKIN2
Internal Reset PLL2C
SYSREFCLK (PLL2C)
SYSCLK1 (PLL2C)
SYSCLK2
5
9
7
8
Undefined
Undefined Low
High-Z
Undefined High
PLL2 Unlocked PLL2 Locked(A)
PLL2 Unlocked Clock Valid
Undefined
Undefined
Undefined Clock Valid (B)
Power Supplies Ramping Power Supplies Stable
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A. SYSREFCLK of the PLL2 controller runs at CLKIN2 ×10.
B. SYSCLK1 of PLL2 controller runs at SYSREFCLK/2 (default).
C. Power supplies, CLKIN1, CLKIN2 (if used), and PCLK (if used) must be stable before the start of tw(POR).
D. Do not tie the RESET and POR pins together.
E. The RESET pin can be brought high after the POR pin has been brought high. In this case, the RESET pin must be
held low for a minimum of tw(RESET) after the POR pin has been brought high.
Figure 8-8. Power-Up Timing
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CLKIN2
POR
RESET(A)(B)
RESETSTAT
Boot and
Device Configuration Pins(C)
9
7
6
8
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A. RESET should only be used after device has been powered up. For more details on the use of the RESET pin, see
Section 8.6,Reset Controller.
B. A reset signal is generated internally during a Warm Reset. This internal reset signal has the same effect as the
RESET pin during a Warm Reset.
C. Boot and Device Configurations Inputs (during reset) include: AEA[19:0], ABA[1:0], and PCI_EN.
Figure 8-9. Warm Reset and Max Reset Timing
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8.7 PLL1 and PLL1 Controller
The primary PLL controller generates the input clock to the C64x+ megamodule (including the CPU) as
well as most of the system peripherals such as the multichannel buffered serial ports (McBSPs) and the
external memory interface (EMIF).
As shown in Figure 8-10, the PLL1 controller features a software-programmable PLL multiplier controller
(PLLM) and five dividers (PREDIV, D2, D3, D4, and D5). The PLL1 controller uses the device input clock
CLKIN1 to generate a system reference clock (SYSREFCLK) and four system clocks (SYSCLK2,
SYSCLK3, SYSCLK4, and SYSCLK5).
PLL1 power is supplied externally via the PLL1 power-supply pin (PLLV1). An external EMI filter circuit
must be added to PLLV1, as shown in Figure 8-10. The 1.8-V supply of the EMI filter must be from the
same 1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter manufacturer
Murata, part number NFM18CC222R1C3 or NFM18CC223R1C3.
All PLL external components (C1, C2, and the EMI Filter) must be placed as close to the C64x+ DSP
device as possible. For the best performance, TI recommends that all the PLL external components be on
a single side of the board without jumpers, switches, or components other than the ones shown. For
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components
(C1, C2, and the EMI Filter).
The minimum CLKIN1 rise and fall times should also be observed. For the input clock timing
requirements, see Section 8.7.4,PLL1 Controller Input and Output Clock Electrical Data/Timing.
CAUTION
The PLL controller module as described in the TMS320TCI648x DSP Software-
Programmable Phase-Locked Loop (PLL) Controller User's Guide (literature number
SPRU806) includes a superset of features, some of which are not supported on the
TCI6482 DSP. The following sections describe the features that are supported; it should
be assumed that any feature not included in these sections is not supported by the
TCI6482 DSP.
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1
0
0
DIVIDER D4
CLKIN1(B)
PLLEN (PLLCTL.[0])
SYSCLK2
SYSCLK3
AECLKIN (External EMIF Clock Input)
EMIFA
DIVIDER PREDIV
DIVIDER D2(A)
DIVIDER D3(A)
AECLKOUT
PLLV1
C2
C1
EMI Filter
+1.8 V
560 pF 0.1 µF
SYSCLK5
(Emulation and Trace)
SYSREFCLK
(C64x+ MegaModule)
AECLKINSEL
(AEA[15] pin)
DIVIDER D5
PLL1 Controller
(EMIF Input Clock)
TMS320TCI6482 DSP
/1, /2, /3
ENA
PREDEN (PREDIV.[15])
/3
/6
ENA
/2, /4,
..., /16
ENA
PLL1
PLLM
x1, x15,
x20, x25,
x30, x32
D4EN (PLLDIV4.[15])
D5EN (PLLDIV5.[15])
SYSCLK4
(Internal EMIF Clock Input)
/1, /2,
..., /8
GP1/SYSCLK4
SYSCLKOUT_EN
(AEA[4] pin)
GP0
PLLOUT
PLLREF
1
VLYNQ
CLKDIR
(CTRL.[15])
0 0
11
VCLK
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A. DIVIDER D2 and DIVIDER D3 are always enabled.
B. CLKIN1 is a 3.3-V signal.
Figure 8-10. PLL1 and PLL1 Controller
8.7.1 PLL1 Controller Device-Specific Information
8.7.1.1 Internal Clocks and Maximum Operating Frequencies
As shown in Figure 8-10, the PLL1 controller generates several internal clocks including the system
reference clock (SYSREFCLK), and the system clocks (SYSCLK2/3/4/5). The high-frequency clock signal
SYSREFCLK is directly used to clock the C64x+ megamodule (including the CPU) and also serves as a
reference clock for the rest of the DSP system.
Dividers D2, D3, D4, and D5 divide the high-frequency clock SYSREFCLK to generate SYSCLK2,
SYSCLK3, SYSCLK4, and SYSCLK5, respectively. The system clocks are used to clock different portions
of the DSP:
• SYSCLK2 is used to clock the switched central resources (SCRs), EDMA3, VCP2, TCP2, and
RapidIO, as well as the data bus interfaces of the EMIFA and DDR2 Memory Controller.
• SYSCLK3 clocks the PCI, HPI, UTOPIA, McBSP, GPIO, TIMER, and I2C peripherals, as well as the
configuration bus of the PLL2 Controller.
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• SYSCLK4 is used as the internal clock for the EMIFA and VLYNQ. It is also used to clock other logic
within the DSP.
• SYSCLK5 clocks the emulation and trace logic of the DSP.
The divider ratio bits of dividers D2 and D3 are fixed at ÷3 and ÷6, respectively. The divider ratio bits of
dividers D4 and D5 are programmable through the PLL controller divider registers PLLDIV4 and PLLDIV5,
respectively.
The PLL multiplier controller (PLLM) and the dividers (D4 and D5) must be programmed after reset. There
is no hardware CLKMODE selection on the TCI6482 device.
Since the divider ratio bits for dividers D2 and D3 are fixed, the frequency of SYSCLK2 and SYSCLK3 is
tied to the frequency of SYSREFCLK. However, the frequency of SYSCLK4 and SYSCLK5 depends on
the configuration of dividers D4 and D5. For example, with PLLM in the PLL1 multiply control register set
to 10011b (x20 mode) and a 50-MHz CLKIN1 input, the PLL output PLLOUT is set to 1000 MHz and
SYSCLK2 and SYSCLK3 run at 333 MHz and 166 MHz, respectively. Divider D4 can be programmed
through the PLLDIV4 register to divide SYSREFCLK by 10 such that SYSCLK4 and, hence, the EMIF
internal clock, runs at 120 MHz.
All hosts (HPI, PCI, etc.) must hold off accesses to the DSP while the frequency of its internal clocks is
changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration
has completed.
Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, SYSCLK4, and
SYSCLK5. The PLL1 Controller must not be configured to exceed any of these constraints (certain
combinations of external clock input, internal dividers, and PLL multiply ratios might not be supported). For
the PLL clocks input and output frequency ranges, see Table 8-16.
Table 8-16. PLL1 Clock Frequency Ranges
CLOCK SIGNAL MIN MAX UNIT
CLKIN1 66.6 MHz
PLLREF (PLLEN = 1)(1) 33.3 66.6 MHz
PLLOUT(1) 400 1200 MHz
SYSCLK4 25 166 MHz
SYSCLK5 333 MHz
(1) Only applies when the PLL1 Controller is set to PLL mode (PLLEN = 1 in the PLLCTL register).
8.7.1.2 PLL1 Controller Operating Modes
The PLL1 controller has two modes of operation: bypass mode and PLL mode. The mode of operation is
determined by the PLLEN bit of the PLL control register (PLLCTL). In PLL mode, SYSREFCLK is
generated from the device input clock CLKIN1 using the divider PREDIV and the PLL multiplier PLLM. In
bypass mode, CLKIN1 is fed directly to SYSREFCLK.
All hosts (HPI, PCI, etc.) must hold off accesses to the DSP while the frequency of its internal clocks is
changing. A mechanism must be in place such that the DSP notifies the host when the PLL configuration
has completed.
8.7.1.3 PLL1 Stabilization, Lock, and Reset Times
The PLL stabilization time is the amount of time that must be allotted for the internal PLL regulators to
become stable after device powerup. The PLL should not be operated until this stabilization time has
expired.
The PLL reset time is the amount of wait time needed when resetting the PLL (writing PLLRST = 1), in
order for the PLL to properly reset, before bringing the PLL out of reset (writing PLLRST = 0). For the
PLL1 reset time value, see Table 8-17.
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The PLL lock time is the amount of time needed from when the PLL is taken out of reset (PLLRST = 1
with PLLEN = 0) to when to when the PLL controller can be switched to PLL mode (PLLEN = 1). The
PLL1 lock time is given in Table 8-17.
Table 8-17. PLL1 Stabilization, Lock, and Reset Times
MIN TYP MAX UNIT
PLL stabilization time 150 μs
PLL lock time 2000*C(1) ns
PLL reset time 128*C(1) ns
(1) C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.
8.7.2 PLL1 Controller Memory Map
The memory map of the PLL1 controller is shown in Table 8-18. Note that only registers documented here
are accessible on the TMS320TCI6482 device. Other addresses in the PLL1 controller memory map
should not be modified.
Table 8-18. PLL1 Controller Registers (Including Reset Controller)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
029A 0000 - 029A 00E3 - Reserved
029A 00E4 RSTYPE Reset Type Status Register (Reset Controller)
029A 00E8 - 029A 00FF - Reserved
029A 0100 PLLCTL PLL Control Register
029A 0104 - Reserved
029A 0108 - Reserved
029A 010C - Reserved
029A 0110 PLLM PLL Multiplier Control Register
029A 0114 PREDIV PLL Pre-Divider Control Register
029A 0118 - Reserved
029A 011C - Reserved
029A 0120 - Reserved
029A 0124 - Reserved
029A 0128 - Reserved
029A 012C - Reserved
029A 0130 - Reserved
029A 0134 - Reserved
029A 0138 PLLCMD PLL Controller Command Register
029A 013C PLLSTAT PLL Controller Status Register
029A 0140 ALNCTL PLL Controller Clock Align Control Register
029A 0144 DCHANGE PLLDIV Ratio Change Status Register
029A 0148 - Reserved
029A 014C - Reserved
029A 0150 SYSTAT SYSCLK Status Register
029A 0154 - Reserved
029A 0158 - Reserved
029A 015C - Reserved
029A 0160 PLLDIV4 PLL Controller Divider 4 Register
029A 0164 PLLDIV5 PLL Controller Divider 5 Register
029A 0168 - 029B FFFF - Reserved
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8.7.3 PLL1 Controller Register Descriptions
This section provides a description of the PLL1 controller registers. For details on the operation of the PLL
controller module, see the TMS320TCI648x DSP Software-Programmable Phase-Locked Loop (PLL)
Controller User's Guide (literature number SPRU806) .
NOTE: The PLL1 controller registers can only be accessed using the CPU or the emulator.
Not all of the registers documented in the TMS320TCI648x DSP Software-Programmable Phase-Locked
Loop (PLL) Controller User's Guide (literature number SPRU806) are supported on the TMS320TCI6482
DSP. Only those registers documented in this section are supported. Furthermore, only the bits within the
registers described here are supported. You should not write to any reserved memory location or change
the value of reserved bits.
8.7.3.1 PLL1 Control Register
The PLL control register (PLLCTL) is shown in Figure 8-11 and described in Table 8-19.
31 16
Reserved
R-0
15 876543210
PLL
Reserved Rsvd Rsvd Reserved PLLRST Rsvd PLLEN
PWRDN
R-0 R/W-0 R-1 R/W-0 R/W-1 R-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-11. PLL1 Control Register (PLLCTL) [Hex Address: 029A 0100]
Table 8-19. PLL1 Control Register (PLLCTL) Field Descriptions
Bit Field Value Description
31:8 Reserved Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
7 Reserved Reserved. Writes to this register must keep this bit as 0.
6 Reserved Reserved. The reserved bit location is always read as 1. A value written to this field has no effect.
5:4 Reserved Reserved. Writes to this register must keep this bit as 0.
3 PLLRST PLL reset bit
0 PLL reset is released
1 PLL reset is asserted
2 Reserved Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
1 PLLPWRDN PLL power-down mode select bit
0 PLL is operational
1 PLL is placed in power-down state, i.e., all analog circuitry in the PLL is turned-off
0 PLLEN PLL enable bit
0 Bypass mode. Divider PREDIV and PLL are bypassed. All the system clocks (SYSCLKn) are
divided down directly from input reference clock.
1 PLL mode. Divider PREDIV and PLL are not bypassed. PLL output path is enabled. All the system
clocks (SYSCLKn) are divided down from PLL output.
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8.7.3.2 PLL Multiplier Control Register
The PLL multiplier control register (PLLM) is shown in Figure 8-12 and described in Table 8-20. The PLLM
register defines the input reference clock frequency multiplier in conjunction with the PLL divider ratio bits
(RATIO) in the PLL controller pre-divider register (PREDIV).
31 16
Reserved
R-0
15 5 4 0
Reserved PLLM
R-0 R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-12. PLL Multiplier Control Register (PLLM) [Hex Address: 029A 0110]
Table 8-20. PLL Multiplier Control Register (PLLM) Field Descriptions
Bit Field Value Description
31:5 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4:0 PLLM PLL multiplier bits. Defines the frequency multiplier of the input reference clock in conjunction with
the PLL divider ratio bits (RATIO) in PREDIV.
0h x1 multiplier rate
Eh x15 multiplier rate
13h x20 multiplier rate
18h x25 multiplier rate
1Dh x30 multiplier rate
1Fh x32 multiplier rate
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8.7.3.3 PLL Pre-Divider Control Register
The PLL pre-divider control register (PREDIV) is shown in Figure 8-13 and described in Table 8-21.
31 16
Reserved
R-0
15 14 5 4 0
PREDEN Reserved RATIO
R/W-1 R-0 R/W-2h
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-13. PLL Pre-Divider Control Register (PREDIV) [Hex Address: 029A 0114]
Table 8-21. PLL Pre-Divider Control Register (PREDIV) Field Descriptions
Bit Field Value Description
31:16 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
15 PREDEN Pre-divider enable bit.
0 Pre-divider is disabled. No clock output.
1 Pre-divider is enabled.
14:5 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4:0 RATIO 0-1Fh Divider ratio bits.
0 ÷1. Divide frequency by 1.
1h ÷2. Divide frequency by 2.
2h ÷3. Divide frequency by 3.
3h-1Fh Reserved, do not use.
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8.7.3.4 PLL Controller Divider 4 Register
The PLL controller divider 4 register (PLLDIV4) is shown in Figure 8-14 and described in Table 8-22.
Besides being used as the EMIFA internal clock, SYSCLK4 is also used in other parts of the system.
Disabling this clock will cause unpredictable system behavior. Therefore, the PLLDIV4 register should
never be used to disable SYSCLK4.
31 16
Reserved
R-0
15 14 5 4 0
D4EN Reserved RATIO
R/W-1 R-0 R/W-3
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-14. PLL Controller Divider 4 Register (PLLDIV4) [Hex Address: 029A 0160]
Table 8-22. PLL Controller Divider 4 Register (PLLDIV4) Field Descriptions
Bit Field Value Description
31:16 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
15 D4EN Divider 4 enable bit.
0 Divider 4 is disabled. No clock output.
1 Divider 4 is enabled.
14:5 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4:0 RATIO 0-1Fh Divider ratio bits.
0 ÷2. Divide frequency by 2.
1h ÷4. Divide frequency by 4.
2h ÷6. Divide frequency by 6.
3h ÷8. Divide frequency by 8.
4h-7h ÷10 to ÷16. Divide frequency by 10 to divide frequency by 16.
8h-1Fh Reserved, do not use.
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8.7.3.5 PLL Controller Divider 5 Register
The PLL controller divider 5 register (PLLDIV5) is shown in Figure 8-15 and described in Table 8-23.
31 16
Reserved
R-0
15 14 5 4 0
D5EN Reserved RATIO
R/W-1 R-0 R/W-3
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-15. PLL Controller Divider 5 Register (PLLDIV5) [Hex Address: 029A 0164]
Table 8-23. PLL Controller Divider 5 Register (PLLDIV5) Field Descriptions
Bit Field Value Description
31:16 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
15 D5EN Divider 5 enable bit.
0 Divider 5 is disabled. No clock output.
1 Divider 5 is enabled.
14:5 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4:0 RATIO 0-1Fh Divider ratio bits.
0 ÷1. Divide frequency by 1.
1h ÷2. Divide frequency by 2.
2h ÷3. Divide frequency by 3.
3h ÷4. Divide frequency by 4.
4h-7h ÷5 to ÷8. Divide frequency by 5 to divide frequency by 8.
8h-1Fh Reserved, do not use.
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8.7.3.6 PLL Controller Command Register
The PLL controller command register (PLLCMD) contains the command bit for GO operation. PLLCMD is
shown in Figure 8-16 and described in Table 8-24.
31 16
Reserved
R-0
15 2 1 0
Reserved Rsvd GOSET
R-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-16. PLL Controller Command Register (PLLCMD) [Hex Address: 029A 0138]
Table 8-24. PLL Controller Command Register (PLLCMD) Field Descriptions
Bit Field Value Description
31:2 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
1 Reserved Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0 GOSET GO operation command for SYSCLK rate change and phase alignment. Before setting this bit to 1
to initiate a GO operation, check the GOSTAT bit in the PLLSTAT register to ensure all previous
GO operations have completed.
0 No effect. Write of 0 clears bit to 0.
1 Initiates GO operation. Write of 1 initiates GO operation. Once set, GOSET remains set but further
writes of 1 can initiate the GO operation.
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8.7.3.7 PLL Controller Status Register
The PLL controller status register (PLLSTAT) shows the PLL controller status. PLLSTAT is shown in
Figure 8-17 and described in Table 8-25.
31 16
Reserved
R-0
15 1 0
Reserved GOSTAT
R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-17. PLL Controller Status Register (PLLSTAT) [Hex Address: 029A 013C]
Table 8-25. PLL Controller Status Register (PLLSTAT) Field Descriptions
Bit Field Value Description
31:1 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0 GOSTAT GO operation status.
0 GO operation is not in progress. SYSCLK divide ratios are not being changed.
1 GO operation is in progress. SYSCLK divide ratios are being changed.
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8.7.3.8 PLL Controller Clock Align Control Register
The PLL controller clock align control register (ALNCTL) is shown in Figure 8-18 and described in Table 8-
26.
31 16
Reserved
R-0
15 5 4 3 2 0
Reserved ALN5 ALN4 Reserved
R-0 R-1 R-1 R-1
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-18. PLL Controller Clock Align Control Register (ALNCTL) [Hex Address: 029A 0140]
Table 8-26. PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions
Bit Field Value Description
31:5 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4:3 ALNnSYSCLKnalignment. Do not change the default values of these fields.
0 Do not align SYSCLKnto other SYSCLKs during GO operation. If SYSnin DCHANGE is set to 1,
SYSCLKnswitches to the new ratio immediately after the GOSET bit in PLLCMD is set.
1 Align SYSCLKnto other SYSCLKs selected in ALNCTL when the GOSET bit in PLLCMD is set.
The SYSCLKnratio is set to the ratio programmed in the RATIO bit in PLLDIVn.
2:0 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
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8.7.3.9 PLLDIV Ratio Change Status Register
Whenever a different ratio is written to the PLLDIVnregisters, the PLLCTRL flags the change in the
PLLDIV ratio change status registers (DCHANGE). During the GO operation, the PLL controller will only
change the divide ratio of the SYSCLKs with the bit set in DCHANGE. Note that changed clocks will be
automatically aligned to other clocks. The PLLDIV divider ratio change status register is shown in
Figure 8-19 and described in Table 8-27.
31 16
Reserved
R-0
15 5 4 3 2 0
Reserved SYS5 SYS4 Reserved
R-0 R-0 R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-19. PLLDIV Divider Ratio Change Status Register (DCHANGE) [Hex Address: 029A 0144]
Table 8-27. PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions
Bit Field Value Description
31:5 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4 SYS5 Identifies when the SYSCLK5 divide ratio has been modified.
0 SYSCLK5 ratio has not been modified. When GOSET is set, SYSCLK5 will not be affected.
1 SYSCLK5 ratio has been modified. When GOSET is set, SYSCLK5 will change to the new ratio.
3 SYS4 Identifies when the SYSCLK4 divide ratio has been modified.
0 SYSCLK4 ratio has not been modified. When GOSET is set, SYSCLK4 will not be affected.
1 SYSCLK4 ratio has been modified. When GOSET is set, SYSCLK4 will change to the new ratio.
2:0 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
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8.7.3.10 SYSCLK Status Register
The SYSCLK status register (SYSTAT) shows the status of the system clocks (SYSCLKn). SYSTAT is
shown in Figure 8-20 and described in Table 8-28.
31 16
Reserved
R-0
15 8
Reserved
R-0
7 543210
Reserved SYS5ON SYS4ON SYS3ON SYS2ON Reserved
R-0 R-1 R-1 R-1 R-1 R-1
LEGEND: R = Read only; -n= value after reset
Figure 8-20. SYSCLK Status Register (SYSTAT) [Hex Address: 029A 0150]
Table 8-28. SYSCLK Status Register (SYSTAT) Field Descriptions
Bit Field Value Description
31:4 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4:1 SYSnON SYSCLKnon status.
0 SYSCLKnis gated.
1 SYSCLKnis on.
0 Reserved 1 Reserved. The reserved bit location is always read as 1. A value written to this field has no effect.
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CLKIN1
2
3
4
4
51
SYSCLK4
3
4
4
2
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8.7.4 PLL1 Controller Input and Output Clock Electrical Data/Timing
Table 8-29. Timing Requirements for CLKIN1 Devices(1) (2) (3)
(see Figure 8-21)-850
A-1000/-1000
-1200
NO. PLL MODES UNIT
x1 (Bypass), x15,
x20, x25, x30, x32
MIN MAX
1 tc(CLKIN1) Cycle time, CLKIN1(4) 15 30.3 ns
2 tw(CLKIN1H) Pulse duration, CLKIN1 high 0.4C ns
3 tw(CLKIN1L) Pulse duration, CLKIN1 low 0.4C ns
4 tt(CLKIN1) Transition time, CLKIN1 1.2 ns
5 tJ(CLKIN1) Period jitter (peak-to-peak), CLKIN1 100 ps
(1) The reference points for the rise and fall transitions are measured at 3.3 V VIL MAX and VIH MIN.
(2) For more details on the PLL multiplier factors (x1 [BYPASS], x 15, x20, x25, x30, x32), see Section 8.7.1.2,PLL1 Controller Operating
Modes.
(3) C = CLKIN1 cycle time in ns. For example, when CLKIN1 frequency is 50 MHz, use C = 20 ns.
(4) The PLL1 multiplier factors (x1 [BYPASS], x 15, x20, x25, x30, x32) further limit the MIN and MAX values for tc(CLKIN1). For more
detailed information on these limitations, see Section 8.7.1.1,Internal Clocks and Maximum Operating Frequencies.
Figure 8-21. CLKIN1 Timing
Table 8-30. Switching Characteristics Over Recommended Operating Conditions for SYSCLK4 [CPU/8 -
CPU/12](1) (2)
(see Figure 8-22)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
2 tw(CKO3H) Pulse duration, SYSCLK4 high 4P - 0.7 6P + 0.7 ns
3 tw(CKO3L) Pulse duration, SYSCLK4 low 4P - 0.7 6P + 0.7 ns
4 tt(CKO3) Transition time, SYSCLK4 1 ns
(1) The reference points for the rise and fall transitions are measured at 3.3 V VOL MAX and VOH MIN.
(2) P = 1/CPU clock frequency in nanoseconds (ns)
Figure 8-22. SYSCLK4 Timing
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PLL2
SYSCLK2 (From PLL1 Controller)
SYSCLK1
DDR2
Memory
Controller
EMAC
CLKIN2(B)(C)
C162
560 pF
EMI Filter
+1.8 V
C161
0.1 mF
PLL2 Controller
TMS320TCI6482 DSP
PLLM
x20
/2
1
0/x(A)
1
SYSREFCLK
SYSCLK3 (From PLL1 Controller)
PLLREF PLLOUT
DIVIDER D1
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8.8 PLL2 and PLL2 Controller
The secondary PLL controller generates interface clocks for the Ethernet media access controller (EMAC)
and the DDR2 memory controller.
As shown in Figure 8-23, the PLL2 controller features a PLL multiplier controller and one divider (D1). The
PLL multiplier is fixed to a x20 multiplier rate and the divider D1 can be programmed to a ÷2 or ÷5 mode.
PLL2 power is supplied externally via the PLL2 power supply (PLLV2). An external PLL filter circuit must
be added to PLLV2 as shown in Figure 8-23. The 1.8-V supply for the EMI filter must be from the same
1.8-V power plane supplying the I/O power-supply pin, DVDD18. TI requires EMI filter manufacturer Murata,
part number NFM18CC222R1C3 or NFM18CC223R1C3.
All PLL external components (C161, C162, and the EMI Filter) should be placed as close to the C64x+
DSP device as possible. For the best performance, TI requires that all the PLL external components be on
a single side of the board without jumpers, switches, or components other than the ones shown. For
reduced PLL jitter, maximize the spacing between switching signals and the PLL external components
(C161, C162, and the EMI Filter). The minimum CLKIN2 rise and fall times should also be observed. For
the input clock timing requirements, see Section 8.8.4,PLL2 Controller Input Clock Electrical Data/Timing.
CAUTION
The PLL controller module as described in the TMS320TCI648x DSP Software-
Programmable Phase-Locked Loop (PLL) Controller User's Guide (literature number
SPRU806) includes a superset of features, some of which are not supported on the
TCI6482 DSP. The following sections describe the features that are supported; it should
be assumed that any feature not included in these sections is not supported by the
TCI6482 DSP.
A. /x must be programmed to /2 for GMII (default) and to /5 for RGMII.
B. If EMAC is enabled with RGMII, or GMII, CLKIN2 frequency must be 25 MHz.
C. CLKIN2 is a 3.3-V signal.
Figure 8-23. PLL2 Block Diagram
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8.8.1 PLL2 Controller Device-Specific Information
8.8.1.1 Internal Clocks and Maximum Operating Frequencies
As shown in Figure 8-23, the output of PLL2, PLLOUT, is divided by 2 and directly fed to the DDR2
memory controller. This clock is used by the DDR2 memory controller to generate DDR2CLKOUT and
DDR2CLKOUT. Note that, internally, the data bus interface of the DDR2 memory controller is clocked by
SYSCLK2 of the PLL1 controller.
The PLLOUT/2 clock is also fed back into the PLL2 controller where it becomes SYSREFCLK. Divider D1
of the PLL2 controller generates SYSCLK1 for the Ethernet media access controller (EMAC). The EMAC
uses SYSCLK1 to generate the necessary clock for each of its interfaces. Divider D1 should be
programmed to ÷2 mode [default] when using the Gigabit Media Independent Interface (GMII) mode and
to ÷5 mode when using the Reduce Gigabit Media Independent Interface (RGMII). Divider D1 is software
programmable and, if necessary, must be programmed after device reset to ÷5 when the RGMII mode of
the EMAC is used. Note that, internally, the data bus interface of the EMAC is clocked by SYSCLK3 of the
PLL2 controller.
Note that there is a minimum and maximum operating frequency for PLLREF, PLLOUT, and SYSCLK1.
The clock generator must not be configured to exceed any of these constraints. For the PLL clocks input
and output frequency ranges, see Table 8-31. Also, when EMAC is enabled with RGMII or GMII, CLKIN2
must be 25 MHz.
Table 8-31. PLL2 Clock Frequency Ranges
CLOCK SIGNAL MIN MAX UNIT
PLLREF (PLLEN = 1) 12.5 26.7 MHz
PLLOUT 250 533 MHz
SYSCLK1(1) 50 125 MHz
(1) SYSCLK1 restriction applies only when the EMAC is enabled and the RGMII or GMII modes are used. SYSCLK1 must be programmed
to 125 MHz when the GMII mode is used and to 50 MHz when the RGMII mode is used.
8.8.1.2 PLL2 Controller Operating Modes
Unlike the PLL1 controller which can operate in bypass and a PLL mode, the PLL2 controller only
operates in PLL mode. In this mode, SYSREFCLK is generated outside the PLL2 controller by dividing the
output of PLL2 by two.
The PLL2 controller is affected by power-on reset, warm reset, and max reset . During these resets the
PLL2 controller registers get reset to their default values. The internal clocks of the PLL2 controller are
also affected as described in Section 8.6,Reset Controller.
PLL2 is only unlocked during the power-up sequence (see Section 8.6,Reset Controller ) and is locked by
the time the RESETSTAT pin goes high. It does not lose lock during any of the other resets.
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8.8.2 PLL2 Controller Memory Map
The memory map of the PLL2 controller is shown in Table 8-32. Note that only registers documented here
are accessible on the TMS320TCI6482 device. Other addresses in the PLL2 controller memory map
should not be modified.
Table 8-32. PLL2 Controller Registers
HEX ADDRESS RANGE ACRONYM DESCRIPTION
029C 0000 - 029C 0114 - Reserved
029C 0118 PLLDIV1 PLL Controller Divider 1 Register
029C 011C - 029C 0134 - Reserved
029C 0138 PLLCMD PLL Controller Command Register
029C 013C PLLSTAT PLL Controller Status Register
029C 0140 ALNCTL PLL Controller Clock Align Control Register
029C 0144 DCHANGE PLLDIV Ratio Change Status Register
029C 0148 - Reserved
029C 014C - Reserved
029C 0150 SYSTAT SYSCLK Status Register
029C 0154 - 029C 0190 - Reserved
029C 0194 - 029C 01FF - Reserved
029C 0200 - 029C FFFF - Reserved
8.8.3 PLL2 Controller Register Descriptions
This section provides a description of the PLL2 controller registers. For details on the operation of the PLL
controller module, see the TMS320TCI648x DSP Software-Programmable Phase-Locked Loop (PLL)
Controller User's Guide (literature number SPRU806) .
NOTE: The PLL2 controller registers can only be accessed using the CPU or the emulator.
Not all of the registers documented in the TMS320TCI648x DSP Software-Programmable Phase-Locked
Loop (PLL) Controller User's Guide (literature number SPRU806) are supported on the TMS320TCI6482
device. Only those registers documented in this section are supported. Furthermore, only the bits within
the registers described here are supported. You should not write to any reserved memory location or
change the value of reserved bits.
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8.8.3.1 PLL Controller Divider 1 Register
The PLL controller divider 1 register (PLLDIV1) is shown in Figure 8-24 and described in Table 8-33.
31 16
Reserved
R-0
15 14 5 4 0
D1EN Reserved RATIO
R/W-1 R-0 R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-24. PLL Controller Divider 1 Register (PLLDIV1) [Hex Address: 029C 0118]
Table 8-33. PLL Controller Divider 1 Register (PLLDIV1) Field Descriptions
Bit Field Value Description
31:16 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
15 D1EN Divider D1 enable bit.
0 Divider D1 is disabled. No clock output.
1 Divider D1 is enabled.
14:5 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
4:0 RATIO 0-1Fh Divider ratio bits.
1h ÷2. Divide frequency by 2.
4h ÷5. Divide frequency by 5.
Others Reserved
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8.8.3.2 PLL Controller Command Register
The PLL controller command register (PLLCMD) contains the command bit for GO operation. PLLCMD is
shown in Figure 8-25 and described in Table 8-34.
31 16
Reserved
R-0
15 2 1 0
Reserved Rsvd GOSET
R-0 R/W-0 R/W-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-25. PLL Controller Command Register (PLLCMD) [Hex Address: 029C 0138]
Table 8-34. PLL Controller Command Register (PLLCMD) Field Descriptions
Bit Field Value Description
31:2 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
1 Reserved Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0 GOSET GO operation command for SYSCLK rate change and phase alignment. Before setting this bit to 1
to initiate a GO operation, check the GOSTAT bit in the PLLSTAT register to ensure all previous
GO operations have completed.
0 No effect. Write of 0 clears bit to 0.
1 Initiates GO operation. Write of 1 initiates GO operation. Once set, GOSET remains set but further
writes of 1 can initiate the GO operation.
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8.8.3.3 PLL Controller Status Register
The PLL controller status register (PLLSTAT) shows the PLL controller status. PLLSTAT is shown in
Figure 8-26 and described in Table 8-35.
31 16
Reserved
R-0
15 1 0
Reserved GOSTAT
R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-26. PLL Controller Status Register (PLLSTAT) [Hex Address: 029C 013C]
Table 8-35. PLL Controller Status Register (PLLSTAT) Field Descriptions
Bit Field Value Description
31:1 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0 GOSTAT GO operation status.
0 Go operation is not in progress. SYSCLK divide ratios are not being changed.
1 GO operation is in progress. SYSCLK divide ratios are being changed.
8.8.3.4 PLL Controller Clock Align Control Register
The PLL controller clock align control register (ALNCTL) is shown in Figure 8-27 and described in Table 8-
36.
31 16
Reserved
R-0
15 1 0
Reserved ALN1
R-0 R/W-1
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-27. PLL Controller Clock Align Control Register (ALNCTL) [Hex Address: 029C 0140]
Table 8-36. PLL Controller Clock Align Control Register (ALNCTL) Field Descriptions
Bit Field Value Description
31:1 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0 ALN1 SYSCLK1 alignment. Do not change the default values of these fields.
0 Do not align SYSCLK1 during GO operation. If SYS1 in DCHANGE is set to 1, SYSCLK1 switches
to the new ratio immediately after the GOSET bit in PLLCMD is set.
1 Align SYSCLK1 when the GOSET bit in PLLCMD is set. The SYSCLK1 ratio is set to the ratio
programmed in the RATIO bit in PLLDIV1.
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8.8.3.5 PLLDIV Ratio Change Status Register
Whenever a different ratio is written to the PLLDIV1 register, the PLLCTRL flags the change in the
DCHANGE status register. During the GO operation, the PLL controller will only change the divide ratio
SYSCLK1 if SYS1 in DCHANGE is 1. The PLLDIV divider ratio change status register is shown in
Figure 8-28 and described in Table 8-37.
31 16
Reserved
R-0
15 1 0
Reserved SYS1
R-0 R-0
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-28. PLLDIV Divider Ratio Change Status Register (DCHANGE) [Hex Address: 029C 0144]
Table 8-37. PLLDIV Divider Ratio Change Status Register (DCHANGE) Field Descriptions
Bit Field Value Description
31:1 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0 SYS1 SYSCLK1 divide ratio has been modified. SYSCLK1 ratio will be modified during GO operation.
0 SYSCLK1 ratio has not been modified. When GOSET is set, SYSCLK1 will not be affected.
1 SYSCLK1 ratio has been modified. When GOSET is set, SYSCLK1 will change to the new ratio.
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8.8.3.6 SYSCLK Status Register
The SYSCLK status register (SYSTAT) shows the status of the system clock (SYSCLK1). SYSTAT is
shown in Figure 8-29 and described in Table 8-38.
31 16
Reserved
R-0
15 1 0
Reserved SYS1ON
R-0 R-1
LEGEND: R/W = Read/Write; R = Read only; -n= value after reset
Figure 8-29. SYSCLK Status Register [Hex Address: 029C 0150]
Table 8-38. SYSCLK Status Register Field Descriptions
Bit Field Value Description
31:1 Reserved 0 Reserved. The reserved bit location is always read as 0. A value written to this field has no effect.
0 SYS1ON SYSCLK1 on status.
0 SYSCLK1 is gated.
1 SYSCLK1 is on.
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8.8.4 PLL2 Controller Input Clock Electrical Data/Timing
Table 8-39. Timing Requirements for CLKIN2(1) (2) (3)
(see Figure 8-30)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tc(CLKIN2) Cycle time, CLKIN2 37.5 80 ns
2 tw(CLKIN2H) Pulse duration, CLKIN2 high 0.4C ns
3 tw(CLKIN2L) Pulse duration, CLKIN2 low 0.4C ns
4 tt(CLKIN2) Transition time, CLKIN2 1.2 ns
5 tJ(CLKIN2) Period jitter (peak-to-peak), CLKIN2 100 ps
(1) The reference points for the rise and fall transitions are measured at 3.3 V VIL MAX and VIH MIN.
(2) C = CLKIN2 cycle time in ns. For example, when CLKIN2 frequency is 25 MHz, use C = 40 ns.
(3) If EMAC is enabled with RGMII or GMII, CLKIN2 cycle time must be 40 ns (25 MHz).
Figure 8-30. CLKIN2 Timing
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8.9 DDR2 Memory Controller
The 32-bit, 533-MHz (data rate) DDR2 Memory Controller bus of the TCI6482 device is used to interface
to JESD79-2A standard-compliant DDR2 SDRAM devices. The DDR2 external bus only interfaces to
DDR2 SDRAM devices (up to 512 MB); it does not share the bus with any other types of peripherals. The
decoupling of DDR2 memories from other devices both simplifies board design and provides I/O
concurrency from a second external memory interface, EMIFA.
The internal data bus clock frequency and DDR2 bus clock frequency directly affect the maximum
throughput of the DDR2 bus. The clock frequency of the DDR2 bus is equal to the CLKIN2 frequency
multiplied by 10. The internal data bus clock frequency of the DDR2 Memory Controller is fixed at a divide-
by-three ratio of the CPU frequency. The maximum DDR2 throughput is determined by the smaller of the
two bus frequencies. For example, if the internal data bus frequency is 333 MHz (CPU frequency is 1
GHz) and the DDR2 bus frequency is 267 MHz (CLKIN2 frequency is 26.7 MHz), the maximum data rate
achievable by the DDR2 memory controller is 2.1 Gbytes/sec. The DDR2 bus is designed to sustain a
maximum throughput of up to 2.1 Gbytes/sec at a 533-MHz data rate (267-MHz clock rate), as long as
data requests are pending in the DDR2 Memory Controller.
8.9.1 DDR2 Memory Controller Device-Specific Information
The approach to specifying interface timing for the DDR2 memory bus is different than on other interfaces
such as EMIF, HPI, and McBSP. For these other interfaces the device timing was specified in terms of
data manual specifications and I/O buffer information specification (IBIS) models.
For the TCI6482 DDR2 memory bus, the approach is to specify compatible DDR2 devices and provide the
printed circuit board (PCB) solution and guidelines directly to the user. Texas Instruments (TI) has
performed the simulation and system characterization to ensure all DDR2 interface timings in this solution
are met. The complete DDR2 system solution is documented in the Implementing DDR2 PCB Layout on
the TMS320TCI6482 application report (literature number SPRAAA9) .
TI only supports designs that follow the board design guidelines outlined in the SPRAAA9
application report.
The DDR2 Memory Controller pins must be enabled by setting the DDR2_EN configuration pin (ABA0)
high during device reset. For more details, see Section 3.1,Device Configuration at Device Reset.
The ODT[1:0] pins of the memory controller must be left unconnected. The ODT pins on the DDR2
memory device(s) must be connected to ground.
The DDR2 memory controller on the TCI6482 device supports the following memory topologies:
• A 32-bit wide configuration interfacing to two 16-bit wide DDR2 SDRAM devices.
• A 16-bit wide configuration interfacing to a single 16-bit wide DDR2 SDRAM device.
A race condition may exist when certain masters write data to the DDR2 memory controller. For example,
if master A passes a software message via a buffer in external memory and does not wait for indication
that the write completes, when master B attempts to read the software message, then the master B read
may bypass the master A write and, thus, master B may read stale data and, therefore, receive an
incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
hardware guarantee of write-read ordering, it may be necessary to guarantee data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write.
2. Perform a dummy write to the DDR2 memory controller module ID and revision register.
3. Perform a dummy read to the DDR2 memory controller module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The
completion of the read in step 3 ensures that the previous write was done.
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The master peripherals that need to implement this workaround are HPI, PCI, and VLYNQ.
8.9.2 DDR2 Memory Controller Peripheral Register Descriptions
Table 8-40. DDR2 Memory Controller Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
7800 0000 MIDR DDR2 Memory Controller Module and Revision Register
7800 0004 DMCSTAT DDR2 Memory Controller Status Register
7800 0008 SDCFG DDR2 Memory Controller SDRAM Configuration Register
7800 000C SDRFC DDR2 Memory Controller SDRAM Refresh Control Register
7800 0010 SDTIM1 DDR2 Memory Controller SDRAM Timing 1 Register
7800 0014 SDTIM2 DDR2 Memory Controller SDRAM Timing 2 Register
7800 0018 - Reserved
7800 0020 BPRIO DDR2 Memory Controller Burst Priority Register
7800 0024 - 7800 004C - Reserved
7800 0050 - 7800 0078 - Reserved
7800 007C - 7800 00BC - Reserved
7800 00C0 - 7800 00E0 - Reserved
7800 00E4 DMCCTL DDR2 Memory Controller Control Register
7800 00E8 - 7800 00FC - Reserved
7800 0100 - 7FFF FFFF - Reserved
8.9.3 DDR2 Memory Controller Electrical Data/Timing
The Implementing DDR2 PCB Layout on the TMS320TCI6482 application report (literature number
SPRAAA9) specifies a complete DDR2 interface solution for the TCI6482 device as well as a list of
compatible DDR2 devices. TI has performed the simulation and system characterization to ensure all
DDR2 interface timings in this solution are met; therefore, no electrical data/timing information is supplied
here for this interface.
TI only supports designs that follow the board design guidelines outlined in the SPRAAA9
application report.
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8.10 External Memory Interface A (EMIFA)
The EMIFA can interface to a variety of external devices or ASICs, including:
• Pipelined and flow-through Synchronous-Burst SRAM (SBSRAM)
• ZBT (Zero Bus Turnaround) SRAM and Late Write SRAM
• Synchronous FIFOs
• Asynchronous memory, including SRAM, ROM, and Flash
8.10.1 EMIFA Device-Specific Information
Timing analysis must be done to verify all AC timings are met. TI recommends utilizing I/O buffer
information specification (IBIS) to analyze all AC timings.
To properly use IBIS models to attain accurate timing analysis for a given system, see the Using IBIS
Models for Timing Analysis application report (literature number SPRA839).
To maintain signal integrity, serial termination resistors should be inserted into all EMIF output signal lines
(for the EMIF output signals, see Table 2-3,Terminal Functions).
A race condition may exist when certain masters write data to the EMIFA. For example, if master A
passes a software message via a buffer in external memory and does not wait for indication that the write
completes, when master B attempts to read the software message, then the master B read may bypass
the master A write and, thus, master B may read stale data and, therefore, receive an incorrect message.
Some master peripherals (e.g., EDMA3 transfer controllers) will always wait for the write to complete
before signaling an interrupt to the system, thus avoiding this race condition. For masters that do not have
hardware guarantee of write-read ordering, it may be necessary to guarantee data ordering via software.
If master A does not wait for indication that a write is complete, it must perform the following workaround:
1. Perform the required write.
2. Perform a dummy write to the EMIFA module ID and revision register.
3. Perform a dummy read to the EMIFA module ID and revision register.
4. Indicate to master B that the data is ready to be read after completion of the read in step 3. The
completion of the read in step 3 ensures that the previous write was done.
The master peripherals that need to implement this workaround are HPI, PCI, and VLYNQ.
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8.10.2 EMIFA Peripheral Register Descriptions
Table 8-41. EMIFA Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
7000 0000 MIDR Module ID and Revision Register
7000 0004 STAT Status Register
7000 0008 - Reserved
7000 000C - 7000 001C - Reserved
7000 0020 BURST_PRIO Burst Priority Register
7000 0024 - 7000 004C - Reserved
7000 0050 - 7000 007C - Reserved
7000 0080 CE2CFG EMIFA CE2 Configuration Register
7000 0084 CE3CFG EMIFA CE3 Configuration Register
7000 0088 CE4CFG EMIFA CE4 Configuration Register
7000 008C CE5CFG EMIFA CE5 Configuration Register
7000 0090 - 7000 009C - Reserved
7000 00A0 AWCC EMIFA Async Wait Cycle Configuration Register
7000 00A4 - 7000 00BC - Reserved
7000 00C0 INTRAW EMIFA Interrupt RAW Register
7000 00C4 INTMSK EMIFA Interrupt Masked Register
7000 00C8 INTMSKSET EMIFA Interrupt Mask Set Register
7000 00CC INTMSKCLR EMIFA Interrupt Mask Clear Register
7000 00D0 - 7000 00DC - Reserved
7000 00E0 - 77FF FFFF - Reserved
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8.10.3 EMIFA Electrical Data/Timing
Table 8-42. Timing Requirements for AECLKIN for EMIFA(1) (2)
(see Figure 8-31)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tc(EKI) Cycle time, AECLKIN 6(3) 40 ns
2 tw(EKIH) Pulse duration, AECLKIN high 2.7 ns
3 tw(EKIL) Pulse duration, AECLKIN low 2.7 ns
4 tt(EKI) Transition time, AECLKIN 2 ns
5 tJ(EKI) Period Jitter, AECLKIN 0.02E(4) ns
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
(2) E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA.
(3) Minimum AECLKIN cycle times must be met, even when AECLKIN is generated by an internal clock source. Minimum AECLKIN times
are based on internal logic speed; the maximum useable speed of the EMIF may be lower due to AC timing requirements.
(4) This timing only applies when AECLKIN is used for EMIFA.
Figure 8-31. AECLKIN Timing for EMIFA
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6
2
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Table 8-43. Switching Characteristics Over Recommended Operating Conditions for AECLKOUT for the
EMIFA Module(1) (2) (3)
(see Figure 8-32)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 tc(EKO) Cycle time, AECLKOUT E - 0.7 E + 0.7 ns
2 tw(EKOH) Pulse duration, AECLKOUT high EH - 0.7 EH + 0.7 ns
3 tw(EKOL) Pulse duration, AECLKOUT low EL - 0.7 EL + 0.7 ns
4 tt(EKO) Transition time, AECLKOUT 1 ns
5 td(EKIH-EKOH) Delay time, AECLKIN high to AECLKOUT high 1 8 ns
6 td(EKIL-EKOL) Delay time, AECLKIN low to AECLKOUT low 1 8 ns
(1) E = the EMIF input clock (AECLKIN or SYSCLK4) period in ns for EMIFA.
(2) The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
(3) EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIFA.
Figure 8-32. AECLKOUT Timing for the EMIFA Module
8.10.3.1 Asynchronous Memory Timing
Table 8-44. Timing Requirements for Asynchronous Memory Cycles for EMIFA Module(1) (2) (3)
(see Figure 8-33 and Figure 8-34)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
3 tsu(EDV-A OEH) Setup time, AEDx valid before AAOE high 6.5 ns
4 th(AOEH-EDV) Hold time, AEDx valid after AAOE high 0 ns
5 tsu(ARDY-EKOH) Setup time, AARDY valid before AECLKOUT low 1 ns
6 th(EKOH-ARDY) Hold time, AARDY valid after AECLKOUT low 2 ns
7 tw(ARDY ) Pulse width, AARDY assertion and deassertion 2E + 5 ns
Delay time, from AARDY sampled deasserted on AECLKOUT falling to
8 td(ARDY-HOLD) 4E ns
beginning of programmed hold period
Setup time, before end of programmed strobe period by which AARDY
9 tsu(ARDY-HOLD) 2E ns
should be asserted in order to insert extended strobe wait states.
(1) E = AECLKOUT period in ns for EMIFA
(2) To ensure data setup time, simply program the strobe width wide enough.
(3) AARDY is internally synchronized. To use AARDY as an asynchronous input, the pulse width of the AARDY signal should be at least 2E
to ensure setup and hold time is met.
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ACEx
ABE[7:0]
AEA[19:0]/
ABA[1:0]
AED[63:0]
AAOE/ASOE(A)
AR/W
AAWE/ASWE(A)
AARDY(B)
Byte Enables
Address
Read Data
Hold = 1
2
Strobe = 4
Setup = 1
2
2
4
10
10
1
1
1
3
A AAOE/ASOE and AAWE/ASWE operate as AAOE (identified under select signals) and AAWE, respectively, during asynchronous
memory accesses.
BPolarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).
DEASSERTED
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Table 8-45. Switching Characteristics Over Recommended Operating Conditions for Asynchronous
Memory Cycles for EMIFA Module(1) (2) (3)
(see Figure 8-33 and Figure 8-34)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 tosu(SELV-AOEL) Output setup time, select signals valid to AAOE low RS * E - 1.5 ns
2 toh(AOEH-SELIV) Output hold time, AAOE high to select signals invalid RS * E - 1.9 ns
10 td(EKOH-AOEV) Delay time, AECLKOUT high to AAOE valid 1 7 ns
11 tosu(SELV-AWEL) Output setup time, select signals valid to AAWE low WS * E - 1.7 ns
12 toh(AWEH-SELIV) Output hold time, AAWE high to select signals invalid WH * E - 1.8 ns
13 td(EKOH-AWEV) Delay time, AECLKOUT high to AAWE valid 1.3 7.1 ns
(1) E = AECLKOUT period in ns for EMIFA
(2) RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters
are programmed via the EMIFA CE Configuration registers (CEnCFG).
(3) Select signals for EMIFA include: ACEx, ABE[7:0], AEA[19:0], ABA[1:0]; and for EMIFA writes, also include AR/W, AED[63:0].
Figure 8-33. Asynchronous Memory Read Timing for EMIFA
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AECLKOUT
ACEx
ABE[7:0]
AEA[19:0]/
ABA[1:0]
AED[63:0]
AAOE/ASOE(A)
AR/W
AAWE/ASWE(A)
AARDY(B)
Byte Enables
Address
Write Data
Hold = 1
12
Strobe = 4
Setup = 1
12
12
12
12
13
13
11
11
11
11
11
A AAOE/ASOE and AAWE/ASWE operate as AAOE (identified under select signals) and AAWE, respectively, during asynchronous memory
accesses.
B Polarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).
DEASSERTED
AECLKOUT
AARDY(A) ASSERTED DEASSERTED
Strobe
Hold = 2Extended Strobe
Strobe
Setup = 2
APolarity of the AARDY signal is programmable through the AP field of the EMIFA Async Wait Cycle Configuration register (AWCC).
8
9
6
5
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Figure 8-34. Asynchronous Memory Write Timing for EMIFA
Figure 8-35. AARDY Timing
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8.10.3.2 Programmable Synchronous Interface Timing
Table 8-46. Timing Requirements for Programmable Synchronous Interface Cycles for EMIFA Module
(see Figure 8-36)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
6 tsu(EDV-EKOH) Setup time, read AEDx valid before AECLKOUT high 2 ns
7 th(EKOH-EDV) Hold time, read AEDx valid after AECLKOUT high 1.5 ns
Table 8-47. Switching Characteristics Over Recommended Operating Conditions for Programmable
Synchronous Interface Cycles for EMIFA Module(1)
(see Figure 8-36 through Figure 8-38)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 td(EKOH-CEV) Delay time, AECLKOUT high to ACEx valid 1.3 4.9 ns
2 td(EKOH-BEV) Delay time, AECLKOUT high to ABEx valid 4.9 ns
3 td(EKOH-BEIV) Delay time, AECLKOUT high to ABEx invalid 1.3 ns
4 td(EKOH-EAV) Delay time, AECLKOUT high to AEAx valid 4.9 ns
5 td(EKOH-EAIV) Delay time, AECLKOUT high to AEAx invalid 1.3 ns
8 td(EKOH-ADSV) Delay time, AECLKOUT high to ASADS/ASRE valid 1.3 4.9 ns
9 td(EKOH-OEV) Delay time, AECLKOUT high to ASOE valid 1.3 4.9 ns
10 td(EKOH-EDV) Delay time, AECLKOUT high to AEDx valid 4.9 ns
11 td(EKOH-EDIV) Delay time, AECLKOUT high to AEDx invalid 1.3 ns
12 td(EKOH-WEV) Delay time, AECLKOUT high to ASWE valid 1.3 4.9 ns
(1) The following parameters are programmable via the EMIFA CE Configuration registers (CEnCFG):
• Read latency (R_LTNCY): 0-, 1-, 2-, or 3-cycle read latency
• Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
• ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has
been issued (CE_EXT = 0). For synchronous FIFO interface with glue, ACEx is active when ASOE is active (CE_EXT = 1).
• Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with
deselect cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as ASRE with NO deselect cycles (R_ENABLE = 1).
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AECLKOUT
ACEx
ABE[7:0]
AEA[19:0]/ABA[1:0]
AED[63:0]
ASADS/ASRE(B)
AAOE/ASOE(B)
AAWE/ASWE(B)
BE1 BE2 BE3 BE4
Q1 Q2 Q3
9
1
45
8
9
67
3
1
2BE1 BE2 BE3 BE4
EA1 EA2 EA4
8
READ latency = 2
EA3
AThe following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):
−Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency
−Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
−ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).
−Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).
−In this figure R_LTNCY = 2, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.
B AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.
Q4
AECLKOUT
ACEx
ABE[7:0]
AEA[19:0]/ABA[1:0]
AED[63:0]
ASADS/ASRE(B)
AAOE/ASOE(B)
AAWE/ASWE(B)
BE1 BE2 BE3 BE4
Q1 Q2 Q3 Q4
12
11
3
1
12
10
4
2
1
8
5
8
EA1 EA2 EA3 EA4
10
AThe following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):
− Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency
− Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
− ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).
− Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).
− In this figure W_LTNCY = 0, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.
B AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.
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Figure 8-36. Programmable Synchronous Interface Read Timing for EMIFA (With Read Latency = 2)(A)
Figure 8-37. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 0)(A)
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AECLKOUT
ACEx
ABE[7:0]
AEA[19:0]/ABA[1:0]
AED[63:0]
ASADS/ASRE(B)
AAOE/ASOE(B)
AAWE/ASWE(B)
BE1 BE2 BE3 BE4
Q1 Q2 Q3 11
3
12
10
4
2
1
8
5
8
EA1 EA2 EA3 EA4
10
Write
Latency =
1(B)
1
Q4
12
AThe following parameters are programmable via the EMIFA Chip Select n Configuration Register (CESECn):
− Read latency (R_LTNCY): 1-, 2-, or 3-cycle read latency
− Write latency (W_LTNCY): 0-, 1-, 2-, or 3-cycle write latency
− ACEx assertion length (CE_EXT): For standard SBSRAM or ZBT SRAM interface, ACEx goes inactive after the final command has been
issued (CE_EXT = 0). For synchronous FIFO interface, ACEx is active when ASOE is active (CE_EXT = 1).
− Function of ASADS/ASRE (R_ENABLE): For standard SBSRAM or ZBT SRAM interface, ASADS/ASRE acts as ASADS with deselect
cycles (R_ENABLE = 0). For FIFO interface, ASADS/ASRE acts as SRE with NO deselect cycles (R_ENABLE = 1).
− In this figure W_LTNCY = 1, CE_EXT = 0, R_ENABLE = 0, and SSEL = 1.
B AAOE/ASOE, and AAWE/ASWE operate as ASOE, and ASWE, respectively, during programmable synchronous interface accesses.
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Figure 8-38. Programmable Synchronous Interface Write Timing for EMIFA (With Write Latency = 1) (A)
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HOLD
HOLDA
EMIF Bus(A)
DSP Owns Bus External Requestor
Owns Bus DSP Owns Bus
DSP DSP
1
3
2 5
4
AECLKOUT
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8.10.4 HOLD/HOLDA Timing
Table 8-48. Timing Requirements for the HOLD/HOLDA Cycles for EMIFA Module(1)
(see Figure 8-39)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
3 th(HOLDAL-HOLDL) Hold time, HOLD low after HOLDA low E ns
(1) E = the EMIF input clock (ECLKIN) period in ns for EMIFA.
Table 8-49. Switching Characteristics Over Recommended Operating Conditions for the HOLD/HOLDA
Cycles for EMIFA Module(1) (2)
(see Figure 8-39)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 td(HOLDL-EMHZ) Delay time, HOLD low to EMIFA Bus high impedance 2E (3) ns
2 td(EMHZ-HOLDAL) Delay time, EMIF Bus high impedance to HOLDA low 0 2E ns
4 td(HOLDH-EMLZ) Delay time, HOLD high to EMIF Bus low impedance 2E 7E ns
5 td(EMLZ-HOLDAH) Delay time, EMIFA Bus low impedance to HOLDA high 0 2E ns
(1) E = the EMIF input clock (ECLKIN) period in ns for EMIFA.
(2) EMIFA Bus consists of: ACE[5:2], ABE[7:0], AED[63:0], AEA[19:0], ABA[1:0], AR/W, ASADS/ASRE, AAOE/ ASOE, and AAWE/ASWE.
(3) All pending EMIF transactions are allowed to complete before HOLDA is asserted. If no bus transactions are occurring, then the
minimum delay time can be achieved.
A. EMIFA Bus consists of: ACE[5:2], ABE[7:0], AED[63:0], AEA[19:0], ABA[1:0], AR/W, ASADS/ASRE, AAOE/ ASOE,
and AAWE/ASWE.
Figure 8-39. HOLD/HOLDA Timing for EMIFA
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AECLKOUTx
1
ABUSREQ
1
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8.10.5 BUSREQ Timing
Table 8-50. Switching Characteristics Over Recommended Operating Conditions for the BUSREQ Cycles
for EMIFA Module
(see Figure 8-40)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 td(AEKOH-ABUSRV) Delay time, AECLKOUT high to ABUSREQ valid 1 5.5 ns
Figure 8-40. BUSREQ Timing for EMIFA
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8.11 I2C Peripheral
The inter-integrated circuit (I2C) module provides an interface between a C64x+ DSP and other devices
compliant with Philips Semiconductors Inter-IC bus (I2C bus™) specification version 2.1 and connected by
way of an I2C bus. External components attached to this 2-wire serial bus can transmit/receive up to 8-bit
data to/from the DSP through the I2C module.
8.11.1 I2C Device-Specific Information
The TCI6482 device includes an I2C peripheral module (I2C). NOTE: when using the I2C module, ensure
there are external pullup resistors on the SDA and SCL pins.
The I2C modules on the TCI6482 device may be used by the DSP to control local peripherals ICs (DACs,
ADCs, etc.) or may be used to communicate with other controllers in a system or to implement a user
interface.
The I2C port supports:
• Compatible with Philips I2C Specification Revision 2.1 (January 2000)
• Fast Mode up to 400 Kbps (no fail-safe I/O buffers)
• Noise Filter to remove noise 50 ns or less
• 7- and 10-Bit Device Addressing Modes
• Multi-Master (Transmit/Receive) and Slave (Transmit/Receive) Functionality
• Events: DMA, Interrupt, or Polling
• Slew-Rate Limited Open-Drain Output Buffers
Figure 8-41 is a block diagram of the I2C module.
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Clock
Prescale
I2CPSC
Peripheral Clock
(CPU/6)
I2CCLKH
Generator
Bit Clock
I2CCLKL
Noise
Filter
SCL
I2CXSR
I2CDXR
Transmit
Transmit
Shift
Transmit
Buffer
I2CDRR
Shift
I2CRSR
Receive
Buffer
Receive
Receive
Filter
SDA
I2C Data Noise
I2COAR
I2CSAR Slave
Address
Control
Address
Own
I2CMDR
I2CCNT
Mode
Data
Count
Vector
Interrupt
Interrupt
Status
I2CIVR
I2CSTR
Mask/Status
Interrupt
I2CIMR
Interrupt/DMA
I2C Module
I2C Clock
Shading denotes control/status registers.
I2CEMDR Extended
Mode
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Figure 8-41. I2C Module Block Diagram
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8.11.2 I2C Peripheral Register Descriptions
Table 8-51. I2C Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02B0 4000 ICOAR I2C own address register
02B0 4004 ICIMR I2C interrupt mask/status register
02B0 4008 ICSTR I2C interrupt status register
02B0 400C ICCLKL I2C clock low-time divider register
02B0 4010 ICCLKH I2C clock high-time divider register
02B0 4014 ICCNT I2C data count register
02B0 4018 ICDRR I2C data receive register
02B0 401C ICSAR I2C slave address register
02B0 4020 ICDXR I2C data transmit register
02B0 4024 ICMDR I2C mode register
02B0 4028 ICIVR I2C interrupt vector register
02B0 402C ICEMDR I2C extended mode register
02B0 4030 ICPSC I2C prescaler register
02B0 4034 ICPID1 I2C peripheral identification register 1 [Value: 0x0000 0105]
02B0 4038 ICPID2 I2C peripheral identification register 2 [Value: 0x0000 0005]
02B0 403C - 02B0 405C - Reserved
02B0 4060 - 02B3 407F - Reserved
02B0 4080 - 02B3 FFFF - Reserved
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10
84
3712
5
614
2
3
13
Stop Start Repeated
Start Stop
SDA
SCL
1
11 9
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8.11.3 I2C Electrical Data/Timing
Table 8-52. Timing Requirements for I2C Timings(1)
(see Figure 8-42)-850
A-1000/-1000
-1200
NO. UNIT
STANDARD MODE FAST MODE
MIN MAX MIN MAX
1 tc(SCL) Cycle time, SCL 10 2.5 μs
Setup time, SCL high before SDA low (for a
2 tsu(SCLH-SDAL) 4.7 0.6 μs
repeated START condition)
Hold time, SCL low after SDA low (for a
3 th(SCLL-SDAL) 4 0.6 μs
START and a repeated START condition)
4 tw(SCLL) Pulse duration, SCL low 4.7 1.3 μs
5 tw(SCLH) Pulse duration, SCL high 4 0.6 μs
6 tsu(SDAV-SDLH) Setup time, SDA valid before SCL high 250 100(2) ns
Hold time, SDA valid after SCL low (For I2C
7 th(SDA-SDLL) 0(3) 0(3) 0.9(4) μs
bus™ devices)
Pulse duration, SDA high between STOP and
8 tw(SDAH) START 4.7 1.3 μs
conditions
9 tr(SDA) Rise time, SDA 1000 20 + 0.1Cb(5) 300 ns
10 tr(SCL) Rise time, SCL 1000 20 + 0.1Cb(5) 300 ns
11 tf(SDA) Fall time, SDA 300 20 + 0.1Cb(5) 300 ns
12 tf(SCL) Fall time, SCL 300 20 + 0.1Cb(5) 300 ns
Setup time, SCL high before SDA high (for
13 tsu(SCLH-SDAH) 4 0.6 μs
STOP condition)
14 tw(SP) Pulse duration, spike (must be suppressed) 0 50 ns
15 Cb(5) Capacitive load for each bus line 400 400 pF
(1) The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered
down.
(2) A Fast-mode I2C-bus™ device can be used in a Standard-mode I2C-bus™ system, but the requirement tsu(SDA-SCLH) ≥250 ns must then
be met. This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch
the LOW period of the SCL signal, it must output the next data bit to the SDA line trmax + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns
(according to the Standard-mode I2C-Bus Specification) before the SCL line is released.
(3) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the
undefined region of the falling edge of SCL.
(4) The maximum th(SDA-SCLL) has only to be met if the device does not stretch the low period [tw(SCLL)] of the SCL signal.
(5) Cb= total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
Figure 8-42. I2C Receive Timings
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25
23 19
18 22 27
20
21
17
18
28
Stop Start Repeated
Start Stop
SDA
SCL
16
26 24
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Table 8-53. Switching Characteristics for I2C Timings(1)
(see Figure 8-43)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
STANDARD MODE FAST MODE
MIN MAX MIN MAX
16 tc(SCL) Cycle time, SCL 10 2.5 μs
Delay time, SCL high to SDA low (for a
17 td(SCLH-SDAL) 4.7 0.6 μs
repeated START condition)
Delay time, SDA low to SCL low (for a START
18 td(SDAL-SCLL) 4 0.6 μs
and a repeated START condition)
19 tw(SCLL) Pulse duration, SCL low 4.7 1.3 μs
20 tw(SCLH) Pulse duration, SCL high 4 0.6 μs
21 td(SDAV-SDLH) Delay time, SDA valid to SCL high 250 100 ns
Valid time, SDA valid after SCL low
22 tv(SDLL-SDAV) 0 0 0.9 μs
(for I2C bus devices)
Pulse duration, SDA high between STOP and
23 tw(SDAH) 4.7 1.3 μs
START conditions
24 tr(SDA) Rise time, SDA 1000 20 + 0.1Cb(2) 300 ns
25 tr(SCL) Rise time, SCL 1000 20 + 0.1Cb(2) 300 ns
26 tf(SDA) Fall time, SDA 300 20 + 0.1Cb(2) 300 ns
27 tf(SCL) Fall time, SCL 300 20 + 0.1Cb(2) 300 ns
Delay time, SCL high to SDA high (for STOP
28 td(SCLH-SDAH) 4 0.6 μs
condition)
29 CpCapacitance for each I2C pin 10 10 pF
(1) Cb= total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
(2) Cb= total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
Figure 8-43. I2C Transmit Timings
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8.12 Host-Port Interface (HPI) Peripheral
8.12.1 HPI Device-Specific Information
The TCI6482 device includes a user-configurable 16-bit or 32-bit Host-port interface (HPI16/HPI32). The
AEA14 pin controls the HPI_WIDTH, allowing the user to configure the HPI as a 16-bit or 32-bit peripheral.
Software handshaking via the HRDY bit of the Host Port Control Register (HPIC) is not supported on the
TCI6482 device.
An HPI boot is terminated using a DSP interrupt. The DSP interrupt is registered in bit 0 (channel 0) of the
EDMA Event Register (ER). This event must be cleared by software before triggering transfers on DMA
channel 0.
8.12.2 HPI Peripheral Register Descriptions
Table 8-54. HPI Control Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS
0288 0000 - Reserved The CPU has read/write
access to the
0288 0004 PWREMU_MGMT HPI power and emulation management register PWREMU_MGMT register;
the Host does not have any
access to this register.
0288 0008 - 0288 0024 - Reserved
0288 0028 - Reserved
0288 002C - Reserved The Host and the CPU have
0288 0030 HPIC HPI control register read/write access to the
HPIC register.(1)
HPIA HPI address register The Host has read/write
0288 0034 (HPIAW)(2) (Write) access to the HPIA registers.
The CPU has only read
HPIA HPI address register
0288 0038 access to the HPIA registers.
(HPIAR)(2) (Read)
0288 000C - 028B 007F - Reserved
0288 0080 - 028B FFFF - Reserved
(1) The CPU can write 1 to the HINT bit to generate an interrupt to the host and it can write 1 to the DSPINT bit to clear/acknowledge an
interrupt from the host.
(2) There are two 32-bit HPIA registers: HPIAR for read operations and HPIAW for write operations. The HPI can be configured such that
HPIAR and HPIAW act as a single 32-bit HPIA (single-HPIA mode) or as two separate 32-bit HPIAs (dual-HPIA mode) from the
perspective of the host. The CPU can access HPIAW and HPIAR independently. For details about the HPIA registers and their modes,
see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number SPRU874) .
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8.12.3 HPI Electrical Data/Timing
Table 8-55. Timing Requirements for Host-Port Interface Cycles(1) (2)
(see Figure 8-44 through Figure 8-51)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
9 tsu(HASL-HSTBL) Setup time, HAS low before HSTROBE low 5 ns
10 th(HSTBL-HASL) Hold time, HAS low after HSTROBE low 2 ns
11 tsu(SELV-HASL) Setup time, select signals(3) valid before HAS low 5 ns
12 th(HASL-SELV) Hold time, select signals(3) valid after HAS low 5 ns
13 tw(HSTBL) Pulse duration, HSTROBE low 15 ns
14 tw(HSTBH) Pulse duration, HSTROBE high between consecutive accesses 2M ns
15 tsu(SELV-HSTBL) Setup time, select signals(3) valid before HSTROBE low 5 ns
16 th(HSTBL-SELV) Hold time, select signals(3) valid after HSTROBE low 5 ns
17 tsu(HDV-HSTBH) Setup time, host data valid before HSTROBE high 5 ns
18 th(HSTBH-HDV) Hold time, host data valid after HSTROBE high 1 ns
37 tsu(HCSL-HSTBL) Setup time, HCS low before HSTROBE low 0 ns
Hold time, HSTROBE low after HRDY low. HSTROBE should not be
38 th(HRDYL-HSTBL) inactivated until HRDY is active (low); otherwise, HPI writes will not 1.1 ns
complete properly.
(1) HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
(2) M = SYSCLK3 period = 6/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use M = 6 ns.
(3) Select signals include: HCNTL[1:0] and HR/W. For HPI16 mode only, select signals also include HHWIL.
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Table 8-56. Switching Characteristics for Host-Port Interface Cycles(1) (2)
(see Figure 8-44 through Figure 8-51)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
Case 1. HPIC or HPIA read 5 15
Case 2. HPID read with no auto- 9 * M + 20
increment(3)
Delay time, HSTROBE low to Case 3. HPID read with auto-increment
1 td(HSTBL-HDV) ns
9 * M + 20
DSP data valid and read FIFO initially empty(3)
Case 4. HPID read with auto-increment
and data previously prefetched into the 5 15
read FIFO
2 tdis(HSTBH-HDV) Disable time, HD high-impedance from HSTROBE high 1 4 ns
3 ten(HSTBL-HD) Enable time, HD driven from HSTROBE low 3 15 ns
4 td(HSTBL-HRDYH) Delay time, HSTROBE low to HRDY high 12 ns
5 td(HSTBH-HRDYH) Delay time, HSTROBE high to HRDY high 12 ns
Case 1. HPID read with no auto- 10 * M + 20
increment(3)
Delay time, HSTROBE low to
6 td(HSTBL-HRDYL) ns
HRDY low Case 2. HPID read with auto-increment 10 * M + 20
and read FIFO initially empty(3)
7 td(HDV-HRDYL) Delay time, HD valid to HRDY low 0 ns
Case 1. HPIA write(3) 5 * M + 20
Delay time, HSTROBE high to
34 td(DSH-HRDYL) ns
Case 2. HPID write with no auto-
HRDY low 5 * M + 20
increment(3)
Delay time, HSTROBE low to HRDY low for HPIA write and FIFO not
35 td(HSTBL-HRDYL) 40 * M + 20 ns
empty(3)
36 td(HASL-HRDYH) Delay time, HAS low to HRDY high 12 ns
(1) M = SYSCLK3 period = 6/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use M = 6 ns.
(2) HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
(3) Assumes the HPI is accessing L2/L1 memory and no other master is accessing the same memory location.
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HCS
HAS
HCNTL[1:0]
HR/W
HHWIL
HSTROBE(A)
HD[15:0]
HRDY(B)
16
15
37
13
14
16
15
37 13
312312
38
7
46
TMS320TCI6482
www.ti.com
SPRS246K –APRIL 2005–REVISED MARCH 2012
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
Figure 8-44. HPI16 Read Timing (HAS Not Used, Tied High)
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HCS
HAS
HR/W
HHWIL
HSTROBE(A)
HD[15:0]
HRDY(B)
2
3
1
37 910
14
2
38
12
11
12
11
12
11
13
76
1
3
13
37 910
36
HCNTL[1:0]
12
11
12
11
12
11
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
www.ti.com
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
Figure 8-45. HPI16 Read Timing (HAS Used)
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HCS
HAS
HCNTL[1:0]
HR/W
HHWIL
HSTROBE(A)
HD[15:0]
HRDY(B)
34
5
17 18
17 18
34
5
438
37
13
16
15 14 13
16
15
37
35
TMS320TCI6482
www.ti.com
SPRS246K –APRIL 2005–REVISED MARCH 2012
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
Figure 8-46. HPI16 Write Timing (HAS Not Used, Tied High)
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HCS
HAS
HCNTL[1:0]
HR/W
HHWIL
HSTROBE(A)
HD[15:0]
HRDY(B) 534
17 18
13
10
12
9
37
12
12
11
11
11
17 18
14
11
11
11
37
10
9
13
12
12
12
5
34
38
35
36
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
www.ti.com
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
Figure 8-47. HPI16 Write Timing (HAS Used)
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15 16
32
4
1
38
13
7
6
HCS (input)
HAS (input)
HSTROBE(A) (input)
HR/W (input)
HRDY(B) (output)
HD[31:0] (output)
HCNTL[1:0] (input)
37
TMS320TCI6482
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SPRS246K –APRIL 2005–REVISED MARCH 2012
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
C. The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 8-48. HPI32 Read Timing (HAS Not Used, Tied High)
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36
11
10
12
9
1
38
13
2
3
6
HCS (input)
HAS (input)
HSTROBE(A) (input)
HR/W (input)
HRDY(B) (output)
HD[31:0] (output)
HCNTL[1:0] (input)
7
37
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
www.ti.com
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
C. The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 8-49. HPI32 Read Timing (HAS Used)
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17
15
38
5
16
13
18
34
35
4
HCS (input)
HAS (input)
HSTROBE(A)
(input)
HR/W (input)
HRDY(B) (output)
HD[31:0] (input)
HCNTL[1:0]
(input)
37
TMS320TCI6482
www.ti.com
SPRS246K –APRIL 2005–REVISED MARCH 2012
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
C. The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 8-50. HPI32 Write Timing (HAS Not Used, Tied High)
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HRDY(B) (output)
5
11
9
17 18
34
HAS (input)
HR/W (input)
HSTROBE(A)
(input)
HCS (input)
35
36 38
HD[31:0] (input)
HCNTL[1:0]
(input)
10
12
13
37
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
www.ti.com
A. HSTROBE refers to the following logical operation on HCS, HDS1, and HDS2: [NOT(HDS1 XOR HDS2)] OR HCS.
B. Depending on the type of write or read operation (HPID without auto-incrementing; HPIA, HPIC, or HPID with auto-
incrementing) and the state of the FIFO, transitions on HRDY may or may not occur. For more detailed information on
the HPI peripheral, see the TMS320TCI648x DSP Host Port Interface (HPI) User's Guide (literature number
SPRU874) .
C. The timing tw(HSTBH), HSTROBE high pulse duration, must be met between consecutive HPI accesses in HPI32
mode.
Figure 8-51. HPI32 Write Timing (HAS Used)
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8.13 Multichannel Buffered Serial Port (McBSP)
The McBSP provides these functions:
• Full-duplex communication
• Double-buffered data registers, which allow a continuous data stream
• Independent framing and clocking for receive and transmit
• Direct interface to industry-standard codecs, analog interface chips (AICs), and other serially
connected analog-to-digital (A/D) and digital-to-analog (D/A) devices
• External shift clock or an internal, programmable frequency shift clock for data transfer
For more detailed information on the McBSP peripheral, see the TMS320TCI648x DSP Multichannel
Buffered Serial Port ( McBSP) Reference Guide (literature number SPRU803) .
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8.13.1 McBSP Device-Specific Information
The CLKS signal is shared by both McBSP0 and McBSP1 on this device. Also, the CLKGDV field of the
Sample Rate Generator Register (SRGR) must always be set to a value of 1 or greater.
The McBSP Data Receive Register (DRR) and Data Transmit Register (DXR) can be accessed through
two separate busses: a configuration bus and a data bus. Both paths can be used by the CPU and the
EDMA. The data bus should be used to service the McBSP as this path provides better performance.
However, since the data path shares a bridge with the PCI, UTOPIA, and VLYNQ peripherals (see
Figure 4-1), the configuration path should be used in cases where these peripherals are being used to
avoid any performance degradation. Note that the PCI and VLYNQ peripherals consist of an independent
master and slave. Performance degradation is only a concern when these peripherals are used to initiate
transactions on the external bus.
8.13.2 McBSP Peripheral Register Descriptions
Table 8-57. McBSP 0 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS
The CPU and EDMA3
controller can only read
028C 0000 DRR0 McBSP0 Data Receive Register via Configuration Bus this register; they cannot
write to it.
3000 0000 DRR0 McBSP0 Data Receive Register via EDMA3 Bus
028C 0004 DXR0 McBSP0 Data Transmit Register via Configuration Bus
3000 0010 DXR0 McBSP0 Data Transmit Register via EDMA Bus
028C 0008 SPCR0 McBSP0 Serial Port Control Register
028C 000C RCR0 McBSP0 Receive Control Register
028C 0010 XCR0 McBSP0 Transmit Control Register
028C 0014 SRGR0 McBSP0 Sample Rate Generator register
028C 0018 MCR0 McBSP0 Multichannel Control Register
McBSP0 Enhanced Receive Channel Enable
028C 001C RCERE00 Register 0 Partition A/B
McBSP0 Enhanced Transmit Channel Enable
028C 0020 XCERE00 Register 0 Partition A/B
028C 0024 PCR0 McBSP0 Pin Control Register
McBSP0 Enhanced Receive Channel Enable
028C 0028 RCERE10 Register 1 Partition C/D
McBSP0 Enhanced Transmit Channel Enable
028C 002C XCERE10 Register 1 Partition C/D
McBSP0 Enhanced Receive Channel Enable
028C 0030 RCERE20 Register 2 Partition E/F
McBSP0 Enhanced Transmit Channel Enable
028C 0034 XCERE20 Register 2 Partition E/F
McBSP0 Enhanced Receive Channel Enable
028C 0038 RCERE30 Register 3 Partition G/H
McBSP0 Enhanced Transmit Channel Enable
028C 003C XCERE30 Register 3 Partition G/H
028C 0040 - 028F FFFF - Reserved
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Table 8-58. McBSP 1 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS
The CPU and EDMA
controller can only read
0290 0000 DRR1 McBSP1 Data Receive Register via Configuration Bus this register; they cannot
write to it.
3400 0000 DRR1 McBSP1 Data Receive Register via EDMA bus
0290 0004 DXR1 McBSP1 Data Transmit Register via configuration bus
3400 0010 DXR1 McBSP1 Data Transmit Register via EDMA bus
0290 0008 SPCR1 McBSP1 serial port control register
0290 000C RCR1 McBSP1 Receive Control Register
0290 0010 XCR1 McBSP1 Transmit Control Register
0290 0014 SRGR1 McBSP1 sample rate generator register
0290 0018 MCR1 McBSP1 multichannel control register
McBSP1 Enhanced Receive Channel Enable
0290 001C RCERE01 Register 0 Partition A/B
McBSP1 Enhanced Transmit Channel Enable
0290 0020 XCERE01 Register 0 Partition A/B
0290 0024 PCR1 McBSP1 Pin Control Register
McBSP1 Enhanced Receive Channel Enable
0290 0028 RCERE11 Register 1 Partition C/D
McBSP1 Enhanced Transmit Channel Enable
0290 002C XCERE11 Register 1 Partition C/D
McBSP1 Enhanced Receive Channel Enable
0290 0030 RCERE21 Register 2 Partition E/F
McBSP1 Enhanced Transmit Channel Enable
0290 0034 XCERE21 Register 2 Partition E/F
McBSP1 Enhanced Receive Channel Enable
0290 0038 RCERE31 Register 3 Partition G/H
McBSP1 Enhanced Transmit Channel Enable
0290 003C XCERE31 Register 3 Partition G/H
0290 0040 - 0293 FFFF - Reserved
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8.13.3 McBSP Electrical Data/Timing
Table 8-59. Timing Requirements for McBSP(1)
(see Figure 8-52)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
2 tc(CKRX) Cycle time, CLKR/X CLKR/X ext 6P or 10(2) (3) ns
3 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X ext 0.5tc(CKRX) - 1(4) ns
CLKR int 9
5 tsu(FRH-CKRL) Setup time, external FSR high before CLKR low ns
CLKR ext 1.3
CLKR int 6
6 th(CKRL-FRH) Hold time, external FSR high after CLKR low ns
CLKR ext 3
CLKR int 8
7 tsu(DRV-CKRL) Setup time, DR valid before CLKR low ns
CLKR ext 0.9
CLKR int 3
8 th(CKRL-DRV) Hold time, DR valid after CLKR low ns
CLKR ext 3.1
CLKX int 9
10 tsu(FXH-CKXL) Setup time, external FSX high before CLKX low ns
CLKX ext 1.3
CLKX int 6
11 th(CKXL-FXH) Hold time, external FSX high after CLKX low ns
CLKX ext 3
(1) CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
(2) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(3) Use whichever value is greater. Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock
source. The minimum CLKR/X cycle times are based on internal logic speed; the maximum usable speed may be lower due to EDMA
limitations and AC timing requirements.
(4) This parameter applies to the maximum McBSP frequency. Operate serial clocks (CLKR/X) in the reasonable range of 40/60 duty cycle.
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Table 8-60. Switching Characteristics Over Recommended Operating Conditions for McBSP(1) (2)
(see Figure 8-52)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
Delay time, CLKS high to CLKR/X high for internal CLKR/X
1 td(CKSH-CKRXH) 1.4 10 ns
generated from CLKS input(3)
2 tc(CKRX) Cycle time, CLKR/X CLKR/X int 6P or 10(4) (5) (6) ns
3 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X int C - 1(7) C + 1(7) ns
4 td(CKRH-FRV) Delay time, CLKR high to internal FSR valid CLKR int -2.1 3.3 ns
CLKX int -1.7 3
9 td(CKXH-FXV) Delay time, CLKX high to internal FSX valid ns
CLKX ext 1.7 9
CLKX int -3.9 4
Disable time, DX high impedance following
12 tdis(CKXH-DXHZ) ns
last data bit from CLKX high CLKX ext 2.1 9
CLKX int -3.9 + D1(8) 4 + D2(8)
13 td(CKXH-DXV) Delay time, CLKX high to DX valid ns
CLKX ext 2.1 + D1(8) 9 + D2(8)
Delay time, FSX high to DX valid FSX int -2.3 + D1(9) 5.6 + D2(9)
14 td(FXH-DXV) ns
ONLY applies when in data FSX ext 1.9 + D1(9) 9 + D2(9)
delay 0 (XDATDLY = 00b) mode
(1) CLKRP = CLKXP = FSRP = FSXP = 0. If polarity of any of the signals is inverted, then the timing references of that signal are also
inverted.
(2) Minimum delay times also represent minimum output hold times.
(3) The CLKS signal is shared by both McBSP0 and McBSP1 on this device.
(4) Minimum CLKR/X cycle times must be met, even when CLKR/X is generated by an internal clock source. Minimum CLKR/X cycle times
are based on internal logic speed; the maximum usable speed may be lower due to EDMA limitations and AC timing requirements.
(5) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(6) Use whichever value is greater.
(7) C = H or L
S = sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
CLKGDV should be set appropriately to ensure the McBSP bit rate does not exceed the maximum limit (see (4) above).
(8) Extra delay from CLKX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 6P, D2 = 12P
(9) Extra delay from FSX high to DX valid applies only to the first data bit of a device, if and only if DXENA = 1 in SPCR.
if DXENA = 0, then D1 = D2 = 0
if DXENA = 1, then D1 = 6P, D2 = 12P
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Bit(n-1) (n-2) (n-3)
Bit 0 Bit(n-1) (n-2) (n-3)
14
12
11
10
9
3
32
8
7
6
5
4
4
3
1
32
CLKS
CLKR
FSR (int)
FSR (ext)
DR
CLKX
FSX (int)
FSX (ext)
FSX (XDATDLY=00b)
DX
13(A)
13(A)
TMS320TCI6482
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A. Parameter No. 13 applies to the first data bit only when XDATDLY ≠0.
B. The CLKS signal is shared by both McBSP0 and McBSP1 on this device.
Figure 8-52. McBSP Timing(B)
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2
1
CLKS
FSR external
CLKR/X (no need to resync)
CLKR/X (needs resync)
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Table 8-61. Timing Requirements for FSR When GSYNC = 1
(see Figure 8-53)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tsu(FRH-CKSH) Setup time, FSR high before CLKS high 4 ns
2 th(CKSH-FRH) Hold time, FSR high after CLKS high 4 ns
Figure 8-53. FSR Timing When GSYNC = 1
Table 8-62. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0(1) (2)
(see Figure 8-54)-850
A-1000/-1000
-1200
NO. UNIT
MASTER SLAVE
MIN MAX MIN MAX
4 tsu(DRV-CKXL) Setup time, DR valid before CLKX low 12 2 - 18P ns
5 th(CKXL-DRV) Hold time, DR valid after CLKX low 4 5 + 36P ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
5
4
3
8
7
6
21
CLKX
FSX
DX
DR
TMS320TCI6482
SPRS246K –APRIL 2005–REVISED MARCH 2012
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Table 8-63. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 0(1) (2)
(see Figure 8-54)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
MASTER(3) SLAVE
MIN MAX MIN MAX
1 th(CKXL-FXL) Hold time, FSX low after CLKX low(4) T - 2 T + 3 ns
2 td(FXL-CKXH) Delay time, FSX low to CLKX high(5) L - 2 L + 3 ns
3 td(CKXH-DXV) Delay time, CLKX high to DX valid -2 4 18P + 2.8 30P + 17 ns
Disable time, DX high impedance following
6 tdis(CKXL-DXHZ) L - 2 L + 3 ns
last data bit from CLKX low
Disable time, DX high impedance following
7 tdis(FXH-DXHZ) 6P + 3 18P + 17 ns
last data bit from FSX high
8 td(FXL-DXV) Delay time, FSX low to DX valid 12P + 2 24P + 17 ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
Figure 8-54. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
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Table 8-64. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0(1) (2)
(see Figure 8-55)-850
A-1000/-1000
-1200
NO. UNIT
MASTER SLAVE
MIN MAX MIN MAX
4 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 12 2 - 18P ns
5 th(CKXH-DRV) Hold time, DR valid after CLKX high 4 5 + 36P ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
4
376
21
CLKX
FSX
DX
DR 5
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Table 8-65. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 0(1) (2)
(see Figure 8-55)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
MASTER(3) SLAVE
MIN MAX MIN MAX
1 th(CKXL-FXL) Hold time, FSX low after CLKX low(4) L - 2 L + 3 ns
2 td(FXL-CKXH) Delay time, FSX low to CLKX high(5) T - 2 T + 3 ns
3 td(CKXL-DXV) Delay time, CLKX low to DX valid -2 4 18P + 2.8 30P + 17 ns
Disable time, DX high impedance following
6 tdis(CKXL-DXHZ) -2 4 18P + 3 30P + 17 ns
last data bit from CLKX low
7 td(FXL-DXV) Delay time, FSX low to DX valid H - 2 H + 4 12P + 2 24P + 17 ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
Figure 8-55. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
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Table 8-66. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1(1) (2)
(see Figure 8-56)-850
A-1000/-1000
-1200
NO. UNIT
MASTER SLAVE
MIN MAX MIN MAX
4 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 12 2 - 18P ns
5 th(CKXH-DRV) Hold time, DR valid after CLKX high 4 5 + 36P ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
5
4
38
7
6
21
CLKX
FSX
DX
DR
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Table 8-67. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 10b, CLKXP = 1(1) (2)
(see Figure 8-56)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
MASTER(3) SLAVE
MIN MAX MIN MAX
1 th(CKXH-FXL) Hold time, FSX low after CLKX high(4) T - 2 T + 3 ns
2 td(FXL-CKXL) Delay time, FSX low to CLKX low(5) H - 2 H + 3 ns
3 td(CKXL-DXV) Delay time, CLKX low to DX valid -2 4 18P + 2.8 30P + 17 ns
Disable time, DX high impedance following
6 tdis(CKXH-DXHZ) H - 2 H + 3 ns
last data bit from CLKX high
Disable time, DX high impedance following
7 tdis(FXH-DXHZ) 6P + 3 18P + 17 ns
last data bit from FSX high
8 td(FXL-DXV) Delay time, FSX low to DX valid 12P + 2 24P + 17 ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
Figure 8-56. McBSP Timing as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
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Table 8-68. Timing Requirements for McBSP as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1(1) (2)
(see Figure 8-57)-850
A-1000/-1000
-1200
NO. UNIT
MASTER SLAVE
MIN MAX MIN MAX
4 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 12 2 - 18P ns
5 th(CKXH-DRV) Hold time, DR valid after CLKX high 4 5 + 36P ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
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Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
Bit 0 Bit(n-1) (n-2) (n-3) (n-4)
5
4
3
7
6
21
CLKX
FSX
DX
DR
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Table 8-69. Switching Characteristics Over Recommended Operating Conditions for McBSP as SPI
Master or Slave: CLKSTP = 11b, CLKXP = 1(1) (2)
(see Figure 8-57)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
MASTER(3) SLAVE
MIN MAX MIN MAX
1 th(CKXH-FXL) Hold time, FSX low after CLKX high(4) H - 2 H + 3 ns
2 td(FXL-CKXL) Delay time, FSX low to CLKX low(5) T - 2 T + 1 ns
3 td(CKXH-DXV) Delay time, CLKX high to DX valid -2 4 18P + 2.8 30P + 17 ns
Disable time, DX high impedance following
6 tdis(CKXH-DXHZ) -2 4 18P + 3 30P + 17 ns
last data bit from CLKX high
7 td(FXL-DXV) Delay time, FSX low to DX valid L - 2 L + 4 12P + 2 24P + 17 ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) For all SPI Slave modes, CLKG is programmed as 1/6 of the CPU clock by setting CLKSM = CLKGDV = 1.
(3) S = Sample rate generator input clock = 6P if CLKSM = 1 (P = 1/CPU clock frequency)
S = Sample rate generator input clock = P_clks if CLKSM = 0 (P_clks = CLKS period)
T = CLKX period = (1 + CLKGDV) * S
H = CLKX high pulse width = (CLKGDV/2 + 1) * S if CLKGDV is even
H = (CLKGDV + 1)/2 * S if CLKGDV is odd
L = CLKX low pulse width = (CLKGDV/2) * S if CLKGDV is even
L = (CLKGDV + 1)/2 * S if CLKGDV is odd
(4) FSRP = FSXP = 1. As a SPI Master, FSX is inverted to provide active-low slave-enable output. As a Slave, the active-low signal input
on FSX and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for Master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for Slave McBSP
(5) FSX should be low before the rising edge of clock to enable Slave devices and then begin a SPI transfer at the rising edge of the Master
clock (CLKX).
Figure 8-57. McBSP Timing as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
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Configuration Bus DMA Memory
Transfer Controller
Peripheral Bus
EMAC Control Module
EMAC Module MDIO Module
MDIO Bus
EMAC/MDIO
Interrupt
Interrupt
Controller
Ethernet Bus
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8.14 Ethernet MAC (EMAC)
The Ethernet Media Access Controller (EMAC) module provides an efficient interface between the
TCI6482 DSP core processor and the networked community. The EMAC supports 10Base-T (10
Mbits/second [Mbps]), and 100BaseTX (100 Mbps), in either half- or full-duplex mode, and 1000BaseT
(1000 Mbps) in full-duplex mode, with hardware flow control and quality-of-service (QOS) support.
The EMAC module conforms to the IEEE 802.3-2002 standard, describing the “Carrier Sense Multiple
Access with Collision Detection (CSMA/CD) Access Method and Physical Layer” specifications. The IEEE
802.3 standard has also been adopted by ISO/IEC and re-designated as ISO/IEC 8802-3:2000(E).
Deviation from this standard, the EMAC module does not use the Transmit Coding Error signal MTXER.
Instead of driving the error pin when an underflow condition occurs on a transmitted frame, the EMAC will
intentionally generate an incorrect checksum by inverting the frame CRC, so that the transmitted frame
will be detected as an error by the network.
The EMAC control module is the main interface between the device core processor, the MDIO module,
and the EMAC module. The relationship between these three components is shown in Figure 8-58. The
EMAC control module contains the necessary components to allow the EMAC to make efficient use of
device memory, plus it controls device interrupts. The EMAC control module incorporates 8K-bytes of
internal RAM to hold EMAC buffer descriptors. The relationship between these three components is
shown in Figure 8-58.
Figure 8-58. EMAC, MDIO, and EMAC Control Modules
For more detailed information on the EMAC/MDIO, see the TMS320TCI648x DSP EMAC/MDIO Module
Reference Guide (literature number SPRUE12) .
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8.14.1 EMAC Device-Specific Information
Interface Modes
The EMAC module on the TMS320TCI6482 device supports four interface modes: Media Independent
Interface (MII), Reduced Media Independent Interface (RMII), Gigabit Media Independent Interface (GMII),
and Reduced Gigabit Media Independent Interface (RGMII). The MII and GMII interface modes are
defined in the IEEE 802.3-2002 standard.
The RGMII mode of the EMAC conforms to the Reduced Gigabit Media Independent Interface (RGMII)
Specification (version 2.0). The RGMII mode implements the same functionality as the GMII mode, but
with a reduced number of pins. Data and control information is transmitted and received using both edges
of the transmit and receive clocks (TXC and RXC).
Note: The EMAC internally delays the transmit clock (TXC) with respect to the transmit data and control
pins. Therefore, the EMAC conforms to the RGMII-ID operation of the RGMII specification. However, the
EMAC does not delay the receive clock (RXC); this signal must be delayed with respect to the receive
data and control pins outside of the DSP.
The RMII mode of the EMAC conforms to the RMII Specification (revision 1.2), as written by the RMII
Consortium. As the name implies, the Reduced Media Independent Interface (RMII) mode is a reduced
pin count version of the MII mode.
Interface Mode Select
The EMAC uses the same pins for the MII, GMII, and RMII modes. Standalone pins are included for the
RGMII mode due to specific voltage requirements. Only one mode can be used at a time. The mode used
is selected at device reset based on the MACSEL[1:0] configuration pins (for more detailed information,
see Section 3,Device Configuration). Table 8-70 shows which multiplexed pins are used in the MII, GMII,
and RMII modes on the EMAC. For a detailed description of these pin functions, see Table 2-3,Terminal
Functions.
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Table 8-70. EMAC/MDIO Multiplexed Pins (MII, RMII, and GMII Modes)
BALL NUMBER DEVICE PIN NAME MII RMII GMII
(MAC_SEL = (MAC_SEL = (MAC_SEL =
00b) 01b) 10b)
J2 URDATA0/ MRXD0/RMRXD0 MRXD0 RMRXD0 MRXD0
H3 URDATA1/ MRXD1/RMRXD1 MRXD1 RMRXD1 MRXD1
J1 URDATA2/ MRXD2 MRXD2 MRXD2
J3 URDATA3/ MRXD3 MRXD3 MRXD3
L1 URDATA4/ MRXD4 MRXD4
L2 URDATA5/ MRXD5 MRXD5
H2 URDATA6/ MRXD6 MRXD6
M2 URDATA7/ MRXD7 MRXD7
M1 UXDATA0/ MTXD0/RMTXD0 MTXD0 RMTXD0 MTXD0
L4 UXDATA1/ MTXD1/RMTXD1 MTXD1 RMTXD1 MTXD1
M4 UXDATA2/ MTXD2 MTXD2 MTXD2
K4 UXDATA3/ MTXD3 MTXD3 MTXD3
L3 UXDATA4/ MTXD4 MTXD4
L5 UXDATA5/ MTXD5 MTXD5
M3 UXDATA6/ MTXD6 MTXD6
N5 UXDATA7/ MTXD7 MTXD7
H4 URSOC/ MRXER/RMRXER MRXER RMRXER MRXER
H5 URENB/ MRXDV MRXDV MRXDV
J5 UXENB/ MTXEN/RMTXEN MTXEN RMTXEN MTXEN
J4 URCLAV/ MCRS/RMCRSDV MCRS RMCRSDV MCRS
K3 UXSOC/ MCOL MCOL MCOL
K5 UXCLAV/ GMTCLK GMTCLK
H1 URCLK/ MRCLK MRCLK MRCLK
N4 UXCLK/ MTCLK/REFCLK MTCLK RMREFCLK MTCLK
N3 UXADDR3/ GMDIO MDIO MDIO MDIO
M5 UXADDR4/ GMDCLK MDCLK MDCLK MDCLK
Using the RMII Mode of the EMAC
The Ethernet Media Access Controller (EMAC) contains logic that allows it to communicate using the
Reduced Media Independent Interface (RMII) protocol. This logic must be taken out of reset before being
used. To use the RMII mode of the EMAC follow these steps:
1. Enable the EMAC/MDIO through the Device State Control Registers.
– Unlock the PERCFG0 register by writing 0x0F0A 0B00 to the PERLOCK register.
– Set bit 4 in the PERCFG0 register within 16 SYSCLK3 clock cycles to enable the EMAC/MDIO.
– Poll the PERSTAT0 register to verify state change.
2. Initialize the EMAC/MDIO as needed.
3. Release the RMII logic from reset by clearing the RMII_RST bit of the EMAC Configuration Register
(see Section 3.4.5).
As described in the previous section, the RMII mode of the EMAC must be selected by setting
MACSEL[1:0] = 01b at device reset.
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Interface Mode Clocking
The on-chip PLL2 and PLL2 Controller generate the clocks to the EMAC module in RGMII or GMII mode.
When the EMAC is enabled with these modes, the input clock to the PLL2 Controller (CLKIN2) must have
a 25-MHz frequency. For more information, see Section 8.8,PLL2 and PLL2 Controller.
The EMAC uses SYSCLK1 of the PLL2 Controller to generate the necessary clocks for the GMII and
RGMII modes. When these modes are used, the frequency of CLKIN2 must be 25 MHz. Also, divider D1
should be programmed to ÷2 mode [default] when using the GMII mode and to ÷5 mode when using the
RGMII mode. Divider D1 is software programmable and, if necessary, must be programmed after device
reset to ÷5 when the RGMII mode of the EMAC is used.
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8.14.2 EMAC Peripheral Register Descriptions
Table 8-71. Ethernet MAC (EMAC) Control Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02C8 0000 TXIDVER Transmit Identification and Version Register
02C8 0004 TXCONTROL Transmit Control Register
02C8 0008 TXTEARDOWN Transmit Teardown Register
02C8 000F - Reserved
02C8 0010 RXIDVER Receive Identification and Version Register
02C8 0014 RXCONTROL Receive Control Register
02C8 0018 RXTEARDOWN Receive Teardown Register
02C8 001C - Reserved
02C8 0020 - 02C8 007C - Reserved
02C8 0080 TXINTSTATRAW Transmit Interrupt Status (Unmasked) Register
02C8 0084 TXINTSTATMASKED Transmit Interrupt Status (Masked) Register
02C8 0088 TXINTMASKSET Transmit Interrupt Mask Set Register
02C8 008C TXINTMASKCLEAR Transmit Interrupt Mask Clear Register
02C8 0090 MACINVECTOR MAC Input Vector Register
02C8 0094 - 02C8 009C - Reserved
02C8 00A0 RXINTSTATRAW Receive Interrupt Status (Unmasked) Register
02C8 00A4 RXINTSTATMASKED Receive Interrupt Status (Masked) Register
02C8 00A8 RXINTMASKSET Receive Interrupt Mask Set Register
02C8 00AC RXINTMASKCLEAR Receive Interrupt Mask Clear Register
02C8 00B0 MACINTSTATRAW MAC Interrupt Status (Unmasked) Register
02C8 00B4 MACINTSTATMASKED MAC Interrupt Status (Masked) Register
02C8 00B8 MACINTMASKSET MAC Interrupt Mask Set Register
02C8 00BC MACINTMASKCLEAR MAC Interrupt Mask Clear Register
02C8 00C0 - 02C8 00FC - Reserved
02C8 0100 RXMBPENABLE Receive Multicast/Broadcast/Promiscuous Channel Enable Register
02C8 0104 RXUNICASTSET Receive Unicast Enable Set Register
02C8 0108 RXUNICASTCLEAR Receive Unicast Clear Register
02C8 010C RXMAXLEN Receive Maximum Length Register
02C8 0110 RXBUFFEROFFSET Receive Buffer Offset Register
02C8 0114 RXFILTERLOWTHRESH Receive Filter Low Priority Frame Threshold Register
02C8 0118 - 02C8 011C - Reserved
02C8 0120 RX0FLOWTHRESH Receive Channel 0 Flow Control Threshold Register
02C8 0124 RX1FLOWTHRESH Receive Channel 1 Flow Control Threshold Register
02C8 0128 RX2FLOWTHRESH Receive Channel 2 Flow Control Threshold Register
02C8 012C RX3FLOWTHRESH Receive Channel 3 Flow Control Threshold Register
02C8 0130 RX4FLOWTHRESH Receive Channel 4 Flow Control Threshold Register
02C8 0134 RX5FLOWTHRESH Receive Channel 5 Flow Control Threshold Register
02C8 0138 RX6FLOWTHRESH Receive Channel 6 Flow Control Threshold Register
02C8 013C RX7FLOWTHRESH Receive Channel 7 Flow Control Threshold Register
02C8 0140 RX0FREEBUFFER Receive Channel 0 Free Buffer Count Register
02C8 0144 RX1FREEBUFFER Receive Channel 1 Free Buffer Count Register
02C8 0148 RX2FREEBUFFER Receive Channel 2 Free Buffer Count Register
02C8 014C RX3FREEBUFFER Receive Channel 3 Free Buffer Count Register
02C8 0150 RX4FREEBUFFER Receive Channel 4 Free Buffer Count Register
02C8 0154 RX5FREEBUFFER Receive Channel 5 Free Buffer Count Register
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Table 8-71. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02C8 0158 RX6FREEBUFFER Receive Channel 6 Free Buffer Count Register
02C8 015C RX7FREEBUFFER Receive Channel 7 Free Buffer Count Register
02C8 0160 MACCONTROL MAC Control Register
02C8 0164 MACSTATUS MAC Status Register
02C8 0168 EMCONTROL Emulation Control Register
02C8 016C FIFOCONTROL FIFO Control Register (Transmit and Receive)
02C8 0170 MACCONFIG MAC Configuration Register
02C8 0174 SOFTRESET Soft Reset Register
02C8 0178 - 02C8 01CC - Reserved
02C8 01D0 MACSRCADDRLO MAC Source Address Low Bytes Register (Lower 32-bits)
02C8 01D4 MACSRCADDRHI MAC Source Address High Bytes Register (Upper 32-bits)
02C8 01D8 MACHASH1 MAC Hash Address Register 1
02C8 01DC MACHASH2 MAC Hash Address Register 2
02C8 01E0 BOFFTEST Back Off Test Register
02C8 01E4 TPACETEST Transmit Pacing Algorithm Test Register
02C8 01E8 RXPAUSE Receive Pause Timer Register
02C8 01EC TXPAUSE Transmit Pause Timer Register
02C8 01F0 - 02C8 01FC - Reserved
02C8 0200 - 02C8 02FC (see Table 8-72) EMAC Statistics Registers
02C8 0300 - 02C8 03FC - Reserved
02C8 0400 - 02C8 04FC - Reserved
MAC Address Low Bytes Register (used in receive address
02C8 0500 MACADDRLO matching)
MAC Address High Bytes Register (used in receive address
02C8 0504 MACADDRHI matching)
02C8 0508 MACINDEX MAC Index Register
02C8 050C - 02C8 05FC - Reserved
02C8 0600 TX0HDP Transmit Channel 0 DMA Head Descriptor Pointer Register
02C8 0604 TX1HDP Transmit Channel 1 DMA Head Descriptor Pointer Register
02C8 0608 TX2HDP Transmit Channel 2 DMA Head Descriptor Pointer Register
02C8 060C TX3HDP Transmit Channel 3 DMA Head Descriptor Pointer Register
02C8 0610 TX4HDP Transmit Channel 4 DMA Head Descriptor Pointer Register
02C8 0614 TX5HDP Transmit Channel 5 DMA Head Descriptor Pointer Register
02C8 0618 TX6HDP Transmit Channel 6 DMA Head Descriptor Pointer Register
02C8 061C TX7HDP Transmit Channel 7 DMA Head Descriptor Pointer Register
02C8 0620 RX0HDP Receive Channel 0 DMA Head Descriptor Pointer Register
02C8 0624 RX1HDP Receive Channel 1 DMA Head Descriptor Pointer Register
02C8 0628 RX2HDP Receive Channel 2 DMA Head Descriptor Pointer Register
02C8 062C RX3HDP Receive Channel 3 DMA Head Descriptor Pointer Register
02C8 0630 RX4HDP Receive Channel 4 DMA Head Descriptor Pointer Register
02C8 0634 RX5HDP Receive Channel 5 DMA Head Descriptor Pointer Register
02C8 0638 RX6HDP Receive Channel 6 DMA Head Descriptor Pointer Register
02C8 063C RX7HDP Receive Channel 7 DMA Head Descriptor Pointer Register
Transmit Channel 0 Completion Pointer (Interrupt Acknowledge)
02C8 0640 TX0CP Register
Transmit Channel 1 Completion Pointer (Interrupt Acknowledge)
02C8 0644 TX1CP Register
Transmit Channel 2 Completion Pointer (Interrupt Acknowledge)
02C8 0648 TX2CP Register
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Table 8-71. Ethernet MAC (EMAC) Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
Transmit Channel 3 Completion Pointer (Interrupt Acknowledge)
02C8 064C TX3CP Register
Transmit Channel 4 Completion Pointer (Interrupt Acknowledge)
02C8 0650 TX4CP Register
Transmit Channel 5 Completion Pointer (Interrupt Acknowledge)
02C8 0654 TX5CP Register
Transmit Channel 6 Completion Pointer (Interrupt Acknowledge)
02C8 0658 TX6CP Register
Transmit Channel 7 Completion Pointer (Interrupt Acknowledge)
02C8 065C TX7CP Register
Receive Channel 0 Completion Pointer (Interrupt Acknowledge)
02C8 0660 RX0CP Register
Receive Channel 1 Completion Pointer (Interrupt Acknowledge)
02C8 0664 RX1CP Register
Receive Channel 2 Completion Pointer (Interrupt Acknowledge)
02C8 0668 RX2CP Register
Receive Channel 3 Completion Pointer (Interrupt Acknowledge)
02C8 066C RX3CP Register
Receive Channel 4 Completion Pointer (Interrupt Acknowledge)
02C8 0670 RX4CP Register
Receive Channel 5 Completion Pointer (Interrupt Acknowledge)
02C8 0674 RX5CP Register
Receive Channel 6 Completion Pointer (Interrupt Acknowledge)
02C8 0678 RX6CP Register
Receive Channel 7 Completion Pointer (Interrupt Acknowledge)
02C8 067C RX7CP Register
02C8 0680 - 02C8 06FC - Reserved
Reserved
was State RAM Test Access Registers
02C8 0700 - 02C8 077C - Processor Read and Write Access to Head Descriptor Pointers and
Interrupt Acknowledge Registers
02C8 0780 - 02C8 0FFF - Reserved
Table 8-72. EMAC Statistics Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02C8 0200 RXGOODFRAMES Good Receive Frames Register
Broadcast Receive Frames Register
02C8 0204 RXBCASTFRAMES (Total number of good broadcast frames received)
Multicast Receive Frames Register
02C8 0208 RXMCASTFRAMES (Total number of good multicast frames received)
02C8 020C RXPAUSEFRAMES Pause Receive Frames Register
Receive CRC Errors Register (Total number of frames received with
02C8 0210 RXCRCERRORS CRC errors)
Receive Alignment/Code Errors Register
02C8 0214 RXALIGNCODEERRORS (Total number of frames received with alignment/code errors)
Receive Oversized Frames Register
02C8 0218 RXOVERSIZED (Total number of oversized frames received)
Receive Jabber Frames Register
02C8 021C RXJABBER (Total number of jabber frames received)
Receive Undersized Frames Register
02C8 0220 RXUNDERSIZED (Total number of undersized frames received)
02C8 0224 RXFRAGMENTS Receive Frame Fragments Register
02C8 0228 RXFILTERED Filtered Receive Frames Register
02C8 022C RXQOSFILTERED Received QOS Filtered Frames Register
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Table 8-72. EMAC Statistics Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
Receive Octet Frames Register
02C8 0230 RXOCTETS (Total number of received bytes in good frames)
Good Transmit Frames Register
02C8 0234 TXGOODFRAMES (Total number of good frames transmitted)
02C8 0238 TXBCASTFRAMES Broadcast Transmit Frames Register
02C8 023C TXMCASTFRAMES Multicast Transmit Frames Register
02C8 0240 TXPAUSEFRAMES Pause Transmit Frames Register
02C8 0244 TXDEFERRED Deferred Transmit Frames Register
02C8 0248 TXCOLLISION Transmit Collision Frames Register
02C8 024C TXSINGLECOLL Transmit Single Collision Frames Register
02C8 0250 TXMULTICOLL Transmit Multiple Collision Frames Register
02C8 0254 TXEXCESSIVECOLL Transmit Excessive Collision Frames Register
02C8 0258 TXLATECOLL Transmit Late Collision Frames Register
02C8 025C TXUNDERRUN Transmit Underrun Error Register
02C8 0260 TXCARRIERSENSE Transmit Carrier Sense Errors Register
02C8 0264 TXOCTETS Transmit Octet Frames Register
02C8 0268 FRAME64 Transmit and Receive 64 Octet Frames Register
02C8 026C FRAME65T127 Transmit and Receive 65 to 127 Octet Frames Register
02C8 0270 FRAME128T255 Transmit and Receive 128 to 255 Octet Frames Register
02C8 0274 FRAME256T511 Transmit and Receive 256 to 511 Octet Frames Register
02C8 0278 FRAME512T1023 Transmit and Receive 512 to 1023 Octet Frames Register
02C8 027C FRAME1024TUP Transmit and Receive 1024 to 1518 Octet Frames Register
02C8 0280 NETOCTETS Network Octet Frames Register
02C8 0284 RXSOFOVERRUNS Receive FIFO or DMA Start of Frame Overruns Register
02C8 0288 RXMOFOVERRUNS Receive FIFO or DMA Middle of Frame Overruns Register
Receive DMA Start of Frame and Middle of Frame Overruns
02C8 028C RXDMAOVERRUNS Register
02C8 0290 - 02C8 02FC - Reserved
Table 8-73. EMAC Control Module Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02C8 1000 - Reserved
02C8 1004 EWCTL EMAC Control Module Interrupt Control Register
02C8 1008 EWINTTCNT EMAC Control Module Interrupt Timer Count Register
02C8 100C - 02C8 17FF - Reserved
Table 8-74. EMAC Descriptor Memory
HEX ADDRESS RANGE ACRONYM DESCRIPTION
02C8 2000 - 02C8 3FFF - EMAC Descriptor Memory
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MRCLK
(Input)
2 3
14
4
MTCLK
(Input)
2 3
14
4
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8.14.3 EMAC Electrical Data/Timing
8.14.3.1 EMAC MII and GMII Electrical Data/Timing
Table 8-75. Timing Requirements for MRCLK - MII and GMII Operation
(see Figure 8-59)-850
A-1000/-1000
-1200
NO. UNIT
1000 Mbps 100 Mbps 10 Mbps
(GMII Only)
MIN MAX MIN MAX MIN MAX
1 tc(MRCLK) Cycle time, MRCLK 8 40 400 ns
2 tw(MRCLKH) Pulse duration, MRCLK high 2.8 14 140 ns
3 tw(MRCLKL) Pulse duration, MRCLK low 2.8 14 140 ns
4 tt(MRCLK) Transition time, MRCLK 1 3 3 ns
Figure 8-59. MRCLK Timing (EMAC - Receive) [MII and GMII Operation]
Table 8-76. Timing Requirements for MTCLK - MII and GMII Operation
(see Figure 8-60)-850
A-1000/-1000
-1200
NO. UNIT
100 Mbps 10 Mbps
MIN MAX MIN MAX
1 tc(MTCLK) Cycle time, MTCLK 40 400 ns
2 tw(MTCLKH) Pulse duration, MTCLK high 14 140 ns
3 tw(MTCLKL) Pulse duration, MTCLK low 14 140 ns
4 tt(MTCLK) Transition time, MTCLK 3 3 ns
Figure 8-60. MTCLK Timing (EMAC - Transmit) [MII and GMII Operation]
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GMTCLK
(Output)
2 3
14
4
MRCLK (Input)
1
2
MRXD7−MRXD4(GMII only),
MRXD3−MRXD0,
MRXDV, MRXER (Inputs)
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Table 8-77. Switching Characteristics Over Recommended Operating Conditions for GMTCLK - GMII
Operation
(see Figure 8-61)-850
A-1000/-1000
-1200
NO. UNIT
1000 Mbps
MIN MAX
1 tc(GMTCLK) Cycle time, GMTCLK 8 ns
2 tw(GMTCLKH) Pulse duration, GMTCLK high 2.8 ns
3 tw(GMTCLKL) Pulse duration, GMTCLK low 2.8 ns
4 tt(GMTCLK) Transition time, GMTCLK 1 ns
Figure 8-61. GMTCLK Timing (EMAC - Transmit) [GMII Operation]
Table 8-78. Timing Requirements for EMAC MII and GMII Receive 10/100/1000 Mbit/s(1)
(see Figure 8-62)-850
A-1000/-1000
-1200
NO. UNIT
1000 Mbps 100/10 Mbps
MIN MAX MIN MAX
Setup time, receive selected signals valid before
1 tsu(MRXD-MRCLKH) 2 8 ns
MRCLK high
Hold time, receive selected signals valid after
2 th(MRCLKH-MRXD) 0 8 ns
MRCLK high
(1) For MII, Receive selected signals include: MRXD[3:0], MRXDV, and MRXER. For GMII, Receive selected signals include: MRXD[7:0],
MRXDV, and MRXER.
Figure 8-62. EMAC Receive Interface Timing [MII and GMII Operation]
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MTCLK (Input)
MTXD7−MTXD4(GMII only),
MTXD3−MTXD0,
MTXEN (Outputs)
1
GMTCLK (Output)
MTXD7−MTXD0,
MTXEN (Outputs)
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Table 8-79. Switching Characteristics Over Recommended Operating Conditions for EMAC MII and GMII
Transmit 10/100 Mbit/s(1)
(see Figure 8-63)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
100/10 Mbps
MIN MAX
1 td(MTCLKH-MTXD) Delay time, MTCLK high to transmit selected signals valid 5 25 ns
(1) For MII, Transmit selected signals include: MTXD[3:0] and MTXEN. For GMII, Transmit selected signals include: GMTXD[7:0] and
MTXEN.
Figure 8-63. EMAC Transmit Interface Timing [MII and GMII Operation]
Table 8-80. Switching Characteristics Over Recommended Operating Conditions for EMAC GMII Transmit
1000 Mbit/s(1)
(see Figure 8-64)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
1000 Mbps
MIN MAX
1 td(GMTCLKH-MTXD) Delay time, GMTCLK high to transmit selected signals valid 0.5 5 ns
(1) For GMII, Transmit selected signals include: GMTXD[7:0] and MTXEN.
Figure 8-64. EMAC Transmit Interface Timing [GMII Operation]
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RMREFCLK
(Input)
1
2
3
3
1
RMREFCLK
(Input)
RMTXD1-RMTXD0,
RMTXEN (Outputs)
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8.14.3.2 EMAC RMII Electrical Data/Timing
The RMREFCLK pin is used to source a clock to the EMAC when it is configured for RMII operation. The
RMREFCLK frequency should be 50 MHz ±50 PPM with a duty cycle between 35% and 65%, inclusive.
Table 8-81. Timing Requirements for RMREFCLK - RMII Operation
(see Figure 8-65)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 tw(RMREFCLKH) Pulse duration, RMREFCLK high 7 13 ns
2 tw(RMREFCLKL) Pulse duration, RMREFCLK low 7 13 ns
3 tt(RMREFCLK) Transition time, RMREFCLK 2 ns
Figure 8-65. RMREFCLK Timing
Table 8-82. Switching Characteristics Over Recommended Operating Conditions for EMAC RMII Transmit
10/100 Mbit/s(1)
(see Figure 8-66)-850
A-1000/-1000
-1200
NO. PARAMETER UNIT
1000 Mbps
MIN MAX
1 td(RMREFCLKH-RMTXD) Delay time, RMREFCLK high to transmit selected signals valid 3 10 ns
(1) For RMII, transmit selected signals include: RMTXD[1:0] and RMTXEN.
Figure 8-66. EMAC Transmit Interface Timing [RMII Operation]
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RMREFCLK
(Input)
1
2
3
3
4
5
RMRXD1-RMRXD0,
RMCRSDV,
RMRXER (Inputs)
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Table 8-83. Timing Requirements for EMAC RMII Input Receive for 100 Mbps(1)
(see Figure 8-67)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
tsu(RMRXD- Setup time, receive selected signals valid before RMREFCLK (at DSP)
1 4.0 ns
RMREFCLK) high/low
th(RMREFCLK- Hold time, receive selected signals valid after RMREFCLK (at DSP)
2 2.0 ns
RMRXD) high/low
(1) For RMII, receive selected signals include: RMRXD[1:0], RMRXER, and RMCRSDV.
Figure 8-67. EMAC Receive Interface Timing [RMII Operation]
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RGREFCLK
(Output)
2
3
4
4
1
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8.14.3.3 EMAC RGMII Electrical Data/Timing
An extra clock signal, RGREFCLK, running at 125 MHz is included as a convenience to the user. Note
that this reference clock is not a free-running clock. This should only be used by an external device if it
does not expect a valid clock during device reset.
Table 8-84. Switching Characteristics Over Recommended Operating Conditions for EMAC RGREFCLK -
RGMII Operation
(see Figure 8-68)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 tc(RGFCLK) Cycle time, RGREFCLK 8 - 0.8 8 + 0.8 ns
2 tw(RGFCLKH) Pulse duration, RGREFCLK high 3.2 4.8 ns
3 tw(RGFCLKL) Pulse duration, RGREFCLK low 3.2 4.8 ns
4 tt(RGFCLK) Transition time, RGREFCLK 0.75 ns
Figure 8-68. RGREFCLK Timing
Table 8-85. Timing Requirements for RGRXC - RGMII Operation
(see Figure 8-69)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
10 Mbps 360 440
1 tc(RGRXC) Cycle time, RGRXC 100 Mbps 36 44 ns
1000 Mbps 7.2 8.8
10 Mbps 0.40*tc(RGRXC) 0.60*tc(RGRXC)
2 tw(RGRXCH) Pulse duration, RGRXC high 100 Mbps 0.40*tc(RGRXC) 0.60*tc(RGRXC) ns
1000 Mbps 0.45*tc(RGRXC) 0.55*tc(RGRXC)
10 Mbps 0.40*tc(RGRXC) 0.60*tc(RGRXC)
3 tw(RGRXCL) Pulse duration, RGRXC low 100 Mbps 0.40*tc(RGRXC) 0.60*tc(RGRXC) ns
1000 Mbps 0.45*tc(RGRXC) 0.55*tc(RGRXC)
10 Mbps 0.75
4 tt(RGRXC) Transition time, RGRXC 100 Mbps 0.75 ns
1000 Mbps 0.75
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RGRXD[3:0](B)
RGRXCTL(B)
RGRXC
(at DSP)(A)
5
RXERRRXDV
1st Half-byte
2nd Half-byte
RGRXD[7:4]RGRXD[3:0]
23
1
4
4
6
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Table 8-86. Timing Requirements for EMAC RGMII Input Receive for 10/100/1000 Mbps(1)
(see Figure 8-69)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
Setup time, receive selected signals valid before RGRXC (at DSP)
5 tsu(RGRXD-RGRXCH) 1.0 ns
high/low
6 th(RGRXCH-RGRXD) Hold time, receive selected signals valid after RGRXC (at DSP) high/low 1.0 ns
(1) For RGMII, receive selected signals include: RGRXD[3:0] and RGRXCTL.
A. RGRXC must be externally delayed relative to the data and control pins.
B. Data and control information is received using both edges of the clocks. RGRXD[3:0] carries data bits 3-0 on the
rising edge of RGRXC and data bits 7-4 on the falling edge of RGRXC. Similarly, RGRXCTL carries RXDV on rising
edge of RGRXC and RXERR on falling edge.
Figure 8-69. EMAC Receive Interface Timing [RGMII Operation]
Table 8-87. Switching Characteristics Over Recommended Operating Conditions for RGTXC - RGMII
Operation for 10/100/1000 Mbit/s
(see Figure 8-70)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
10 Mbps 360 440
1 tc(RGTXC) Cycle time, RGTXC 100 Mbps 36 44 ns
1000 Mbps 7.2 8.8
10 Mbps 0.40*tc(RGTXC) 0.60*tc(RGTXC)
2 tw(RGTXCH) Pulse duration, RGTXC high 100 Mbps 0.40*tc(RGTXC) 0.60*tc(RGTXC) ns
1000 Mbps 0.45*tc(RGTXC) 0.55*tc(RGTXC)
10 Mbps 0.40*tc(RGTXC) 0.60*tc(RGTXC)
3 tw(RGTXCL) Pulse duration, RGTXC low 100 Mbps 0.40*tc(RGTXC) 0.60*tc(RGTXC) ns
1000 Mbps 0.45*tc(RGTXC) 0.55*tc(RGTXC)
10 Mbps 0.75
4 tt(RGTXC) Transition time, RGTXC 100 Mbps 0.75 ns
1000 Mbps 0.75
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RGTXC
(at DSP)(A)
RGTXD[3:0](B)
RGTXCTL(B)
5
1st Half-byte
TXERRTXEN
2nd Half-byte
1
Internal RGTXC
RGTXC at DSP pins
4
4
23
1
26
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Table 8-88. Switching Characteristics Over Recommended Operating Conditions for EMAC RGMII
Transmit(1)
(see Figure 8-70)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
Setup time, transmit selected signals valid before RGTXC (at DSP)
5 tsu(RGTXD-RGTXCH) 1.2 ns
high/low
6 th(RGTXCH-RGTXD) Hold time, transmit selected signals valid after RGTXC (at DSP) high/low 1.2
(1) For RGMII, transmit selected signals include: RGTXD[3:0] and RGTXCTL.
A. RGTXC is delayed internally before being driven to the RGTXC pin.
B. Data and control information is transmitted using both edges of the clocks. RGTXD[3:0] carries data bits 3-0 on the
rising edge of RGTXC and data bits 7-4 on the falling edge of RGTXC. Similarly, RGTXCTL carries TXEN on rising
edge of RGTXC and TXERR of falling edge.
Figure 8-70. EMAC Transmit Interface Timing [RGMII Operation]
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8.14.4 Management Data Input/Output (MDIO)
The Management Data Input/Output (MDIO) module implements the 802.3 serial management interface to
interrogate and controls up to 32 Ethernet PHY(s) connected to the device, using a shared two-wire bus.
Application software uses the MDIO module to configure the auto-negotiation parameters of each PHY
attached to the EMAC, retrieve the negotiation results, and configure required parameters in the EMAC
module for correct operation. The module is designed to allow almost transparent operation of the MDIO
interface, with very little maintenance from the core processor.
The EMAC control module is the main interface between the device core processor, the MDIO module,
and the EMAC module. The relationship between these three components is shown in Figure 8-58.
The MDIO uses the same pins for the MII, GMII, and RMII modes. Standalone pins are included for the
RGMII mode due to specific voltage requirements. Only one mode can be used at a time. The mode used
is selected at device reset based on the MACSEL[1:0] configuration pins (for more detailed information,
see Section 3,Device Configuration). Table 8-70 above shows which multiplexed pin are used in the MII,
GMII, and RMII modes on the MDIO.
For more detailed information on the EMAC/MDIO, see the TMS320TCI648x DSP EMAC/MDIO Module
Reference Guide (literature number SPRUE12) .
8.14.4.1 MDIO Device-Specific Information
Clocking Information
The MDIO clock is based on a divide-down of the SYSCLK3 (from the PLL1 controller) and is specified to
run up to 2.5 MHz, although typical operation is 1.0 MHz. Since the peripheral clock frequency is variable,
the application software or driver controls the divide-down amount.
8.14.4.2 MDIO Peripheral Register Descriptions
Table 8-89. MDIO Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02C8 1800 VERSION MDIO Version Register
02C8 1804 CONTROL MDIO Control Register
02C8 1808 ALIVE MDIO PHY Alive Status Register
02C8 180C LINK MDIO PHY Link Status Register
02C8 1810 LINKINTRAW MDIO Link Status Change Interrupt (Unmasked) Register
02C8 1814 LINKINTMASKED MDIO Link Status Change Interrupt (Masked) Register
02C8 1818 - 02C8 181C - Reserved
02C8 1820 USERINTRAW MDIO User Command Complete Interrupt (Unmasked) Register
02C8 1824 USERINTMASKED MDIO User Command Complete Interrupt (Masked) Register
02C8 1828 USERINTMASKSET MDIO User Command Complete Interrupt Mask Set Register
02C8 182C USERINTMASKCLEAR MDIO User Command Complete Interrupt Mask Clear Register
02C8 1830 - 02C8 187C - Reserved
02C8 1880 USERACCESS0 MDIO User Access Register 0
02C8 1884 USERPHYSEL0 MDIO User PHY Select Register 0
02C8 1888 USERACCESS1 MDIO User Access Register 1
02C8 188C USERPHYSEL1 MDIO User PHY Select Register 1
02C8 1890 - 02C8 1FFF - Reserved
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1
34
MDCLK
MDIO
(input)
1
7
MDCLK
MDIO
(output)
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8.14.4.3 MDIO Electrical Data/Timing
Table 8-90. Timing Requirements for MDIO Input (R)(G)MII
(see Figure 8-71)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tc(MDCLK) Cycle time, MDCLK 400 ns
2a tw(MDCLK) Pulse duration, MDCLK high 180 ns
2b tw(MDCLK) Pulse duration, MDCLK low 180 ns
3 tt(MDCLK) Transition time, MDCLK 5 ns
4 tsu(MDIO-MDCLKH) Setup time, MDIO data input valid before MDCLK high 10 ns
5 th(MDCLKH-MDIO) Hold time, MDIO data input valid after MDCLK high 10 ns
Figure 8-71. MDIO Input Timing
Table 8-91. Switching Characteristics Over Recommended Operating Conditions for MDIO Output
(see Figure 8-72)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
7 td(MDCLKL-MDIO) Delay time, MDCLK low to MDIO data output valid 100 ns
Figure 8-72. MDIO Output Timing
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8.15 Timers
The timers can be used to: time events, count events, generate pulses, interrupt the CPU, and send
synchronization events to the EDMA3 channel controller.
8.15.1 Timers Device-Specific Information
The TCI6482 device has two general-purpose timers, Timer0 and Timer1, each of which can be
configured as a general-purpose timer or a watchdog timer. When configured as a general-purpose timer,
each timer can be programmed as a 64-bit timer or as two separate 32-bit timers.
Each timer is made up of two 32-bit counters: a high counter and a low counter. The timer pins, TINPLx
and TOUTLx are connected to the low counter. The high counter does not have any external device pins.
8.15.2 Timers Peripheral Register Descriptions
Table 8-92. Timer 0 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS
0294 0000 - Reserved
Timer 0 Emulation Management/Clock Speed
0294 0004 EMUMGT_CLKSPD0 Register
0294 0008 - Reserved
0294 000C - Reserved
0294 0010 CNTLO0 Timer 0 Counter Register Low
0294 0014 CNTHI0 Timer 0 Counter Register High
0294 0018 PRDLO0 Timer 0 Period Register Low
0294 001C PRDHI0 Timer 0 Period Register High
0294 0020 TCR0 Timer 0 Control Register
0294 0024 TGCR0 Timer 0 Global Control Register
0294 0028 WDTCR0 Timer 0 Watchdog Timer Control Register
0294 002C - Reserved
0294 0030 - Reserved
0294 0034 - 0297 FFFF - Reserved
Table 8-93. Timer 1 Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME COMMENTS
0298 0000 - Reserved
0298 0004 EMUMGT_CLKSPD1 Timer 1 Emulation Management/Clock Speed Register
0298 0008 - Reserved
0298 000C - Reserved
0298 0010 CNTLO1 Timer 1 Counter Register Low
0298 0014 CNTHI1 Timer 1 Counter Register High
0298 0018 PRDLO1 Timer 1 Period Register Low
0298 001C PRDHI1 Timer 1 Period Register High
0298 0020 TCR1 Timer 1 Control Register
0298 0024 TGCR1 Timer 1 Global Control Register
0298 0028 WDTCR1 Timer 1 Watchdog Timer Control Register
0298 002C - Reserved
0298 0030 - Reserved
0298 0034 - 0299 FFFF - Reserved
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TINPLx
TOUTLx
4
3
2
1
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8.15.3 Timers Electrical Data/Timing
Table 8-94. Timing Requirements for Timer Inputs(1)
(see Figure 8-73)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tw(TINPH) Pulse duration, TINPLx high 12P ns
2 tw(TINPL) Pulse duration, TINPLx low 12P ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
Table 8-95. Switching Characteristics Over Recommended Operating Conditions for Timer Outputs(1)
(see Figure 8-73)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
3 tw(TOUTH) Pulse duration, TOUTLx high 12P - 3 ns
4 tw(TOUTL) Pulse duration, TOUTLx low 12P - 3 ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
Figure 8-73. Timer Timing
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8.16 Enhanced Viterbi-Decoder Coprocessor (VCP2)
8.16.1 VCP2 Device-Specific Information
The TCI6482 device has a high-performance embedded coprocessor [Viterbi-Decoder Coprocessor
(VCP2) that significantly speeds up channel-decoding operations on-chip. The VCP2 operating at CPU
clock divided-by-4 can decode over 694 7.95-Kbps adaptive multi-rate (AMR) [K = 9, R = 1/3] voice
channels. The VCP2 supports constraint lengths K = 5, 6, 7, 8, and 9, rates R = 3/4, 1/2, 1/3, 1/4, and 1/5,
and flexible polynomials, while generating hard decisions or soft decisions. Communications between the
VCP2 and the CPU are carried out through the EDMA3 controller.
The VCP2 supports:
• Unlimited frame sizes
• Code rates 3/4, 1/2, 1/3, 1/4, and 1/5
• Constraint lengths 5, 6, 7, 8, and 9
• Programmable encoder polynomials
• Programmable reliability and convergence lengths
• Hard and soft decoded decisions
• Tail and convergent modes
• Yamamoto logic
• Tail biting logic
• Various input and output FIFO lengths
For more detailed information on the VCP2, see the TMS320CTI648x DSP Viterbi-Decoder Coprocessor 2
(VCP2) Reference Guide (literature number SPRUE09).
8.16.2 VCP2 Peripheral Register Descriptions
Table 8-96. VCP2 Registers
EDMA BUS CONFIGURATION BUS ACRONYM REGISTER NAME
HEX ADDRESS RANGE HEX ADDRESS RANGE
5800 0000 - VCPIC0 VCP2 Input Configuration Register 0
5800 0004 - VCPIC1 VCP2 Input Configuration Register 1
5800 0008 - VCPIC2 VCP2 Input Configuration Register 2
5800 000C - VCPIC3 VCP2 Input Configuration Register 3
5800 0010 - VCPIC4 VCP2 Input Configuration Register 4
5800 0014 - VCPIC5 VCP2 Input Configuration Register 5
5800 0018 - 5800 0044 - Reserved
5800 0048 - VCPOUT0 VCP2 Output Register 0
5800 004C - VCPOUT1 VCP2 Output Register 1
5800 0050 - 5800 007C - Reserved
5800 0080 N/A VCPWBM VCP2 Branch Metrics Write FIFO Register
5800 0084 - 5800 009C - Reserved
5800 00C0 N/A VCPRDECS VCP2 Decisions Read FIFO Register
N/A 02B8 0018 VCPEXE VCP2 Execution Register
N/A 02B8 0020 VCPEND VCP2 Endian Mode Register
N/A 02B8 0040 VCPSTAT0 VCP2 Status Register 0
N/A 02B8 0044 VCPSTAT1 VCP2 Status Register 1
N/A 02B8 0050 VCPERR VCP2 Error Register
- Reserved
N/A 02B8 0060 VCPEMU VCP2 Emulation Control Register
N/A 02B8 0064 - 02B9 FFFF - Reserved
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Table 8-96. VCP2 Registers (continued)
EDMA BUS CONFIGURATION BUS ACRONYM REGISTER NAME
HEX ADDRESS RANGE HEX ADDRESS RANGE
5800 1000 - BM Branch Metrics
5800 2000 - SM State Metric
5800 3000 - TBHD Traceback Hard Decision
5800 6000 - TBSD Traceback Soft Decision
5800 F000 - IO Decoded Bits
8.17 Enhanced Turbo Decoder Coprocessor (TCP2)
8.17.1 TCP2 Device-Specific Information
The TCI6482 device has a high-performance embedded coprocessor [Turbo-Decoder Coprocessor
(TCP2) that significantly speeds up channel-decoding operations on-chip. With the CPU operating at 1
GHz, the TCP2 can decode up to forty 384-Kbps or eight 2-Mbps turbo-encoded channels (assuming 8
iterations). The TCP2 implements the max*log-map algorithm and is designed to support all polynomials
and rates required by Third-Generation Partnership Projects (3GPP and 3GPP2), with fully programmable
frame length and turbo interleaver. Decoding parameters such as the number of iterations and stopping
criteria are also programmable. Communications between the TCP2 and the CPU are carried out through
the EDMA3 controller.
The TCP2 supports:
• Parallel concatenated convolutional turbo decoding using the MAP algorithm
• All turbo code rates greater than or equal to 1/5
• 3GPP and CDMA2000 turbo encoder trellis
• 3GPP and CDMA2000 block sizes in standalone mode
• Larger block sizes in shared processing mode
• Both max log MAP and log MAP decoding
• Sliding windows algorithm with variable reliability and prolog lengths
• The prolog reduction algorithm
• Execution of a minimum and maximum number of iterations
• The SNR stopping criteria algorithm
• The CRC stopping criteria algorithm
For more detailed information on the TCP2, see the TMS320TCI648x DSP Turbo-Decoder Coprocessor 2
(TCP2) Reference Guide (literature number SPRUE10).
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8.17.2 TCP2 Peripheral Register Descriptions
Table 8-97. TCP2 Registers
EDMA BUS CONFIGURATION BUS ACRONYM REGISTER NAME
HEX ADDRESS RANGE HEX ADDRESS RANGE
5000 0000 - TCPIC0 TCP2 Input Configuration Register 0
5000 0004 - TCPIC1 TCP2 Input Configuration Register 1
5000 0008 - TCPIC2 TCP2 Input Configuration Register 2
5000 000C - TCPIC3 TCP2 Input Configuration Register 3
5000 0010 - TCPIC4 TCP2 Input Configuration Register 4
5000 0014 - TCPIC5 TCP2 Input Configuration Register 5
5000 0018 - TCPIC6 TCP2 Input Configuration Register 6
5000 001C - TCPIC7 TCP2 Input Configuration Register 7
5000 0020 - TCPIC8 TCP2 Input Configuration Register 8
5000 0024 - TCPIC9 TCP2 Input Configuration Register 9
5000 0028 - TCPIC10 TCP2 Input Configuration Register 10
5000 002C - TCPIC11 TCP2 Input Configuration Register 11
5000 0030 - TCPIC12 TCP2 Input Configuration Register 12
5000 0034 - TCPIC13 TCP2 Input Configuration Register 13
5000 0038 - TCPIC14 TCP2 Input Configuration Register 14
5000 003C - TCPIC15 TCP2 Input Configuration Register 15
5000 0040 - TCPOUT0 TCP2 Output Parameters Register 0
5000 0044 - TCPOUT1 TCP2 Output Parameters Register 1
5000 0048 - TCPOUTP2 TCP2 Output Parameters Register 2
5001 0000 N/A X0 TCP2 Data/Sys and Parity Memory
5003 0000 N/A W0 TCP2 Extrinsic Mem 0
5004 0000 N/A W1 TCP2 Extrinsic Mem 1
5005 0000 N/A I0 TCP2 Interleaver Memory
5006 0000 N/A O0 TCP2 Output/Decision Memory
5007 0000 N/A S0 TCP2 Scratch Pad Memory
5008 0000 N/A T0 TCP2 Beta State Memory
5009 0000 N/A C0 TCP2 CRC Memory
500A 0000 N/A B0 TCP2 Beta Prolog Memory
500B 0000 N/A A0 TCP2 Alpha Prolog Memory
02BA 0000 TCPPID TCP2 Peripheral Identification Register
N/A 02BA 004C TCPEXE TCP2 Execute Register
N/A 02BA 0050 TCPEND TCP2 Endianness Register
N/A 02BA 0060 TCPERR TCP2 Error Register
N/A 02BA 0068 TCPSTAT TCP2 Status Register
N/A 02BA 0070 TCPEMU TCP2 Emulation Register
N/A 02BA 005C - 02BB FFFF - Reserved
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8.18 Peripheral Component Interconnect (PCI)
The TCI6482 DSP supports connections to a PCI backplane via the integrated PCI master/slave bus
interface. The PCI port interfaces to DSP internal resources via the data switched central resource. The
data switched central resource is described in more detail in Section 4.
For more detailed information on the PCI port peripheral module, see the TMS320TCI648x DSP
Peripheral Component Interconnect (PCI) User's Guide (literature number SPRUE69) .
8.18.1 PCI Device-Specific Information
The PCI peripheral on the TCI6482 DSP conforms to the PCI Local Bus Specification (version 2.3). The
PCI peripheral can act both as a PCI bus master and as a target. It supports PCI bus operation of speeds
up to 66 MHz and uses a 32-bit data/address bus.
On the TCI6482 device, the pins of the PCI peripheral are multiplexed with the pins of the HPI, UTOPIA,
and GPIO peripherals. PCI functionality for these pins is controlled (enabled/disabled) by the PCI_EN pin
(Y29). The maximum speed of the PCI, 33 MHz or 66 MHz, is controlled through the PCI66 pin (U27). For
more detailed information on the peripheral control, see Section 3,Device Configuration.
The TCI6482 device provides an initialization mechanism through which the default values for some of the
PCI configuration registers can be read from an I2C EEPROM. Table 8-98 shows the registers which can
be initialized through the PCI auto-initialization. Also shown is the default value of these registers when
PCI auto-initialization is not used. PCI auto-initialization is controlled (enabled/disabled) through the
PCI_EEAI pin (P25). For more information on this feature, see the TMS320TCI648x DSP Peripheral
Component Interconnect (PCI) User's Guide (literature number SPRUE69) and the TMS320TCI648x
Bootloader User's Guide (literature number SPRUEC7) .
Table 8-98. Default Values for PCI Configuration
Registers
DEFAULT
REGISTER VALUE
Vendor ID/Device ID Register (PCIVENDEV) 104C B000h
Class Code/Revision ID Register (PCICLREV) 0000 0001h
Subsystem Vendor ID/Subsystem ID Register 0000 0000h
(PCISUBID)
Max Latency/Min Grant/Interrupt Pin/Interrupt Line 0000 0100h
Register (PCILGINT)
The on-chip Bootloader supports a host boot which allows an external PCI device to load application code
into the DSP's memory space. The PCI boot is terminated when the Host generates a DSP interrupt. The
Host can generate a DSP interrupt through the PCI peripheral by setting the DSPINT bit in the Back-End
Application Interrupt Enable Set Register (PCIBINTSET) and the Status Set Register (PCISTATSET). For
more information on the boot sequence of the TCI6482 DSP, see Section 2.4.
NOTE
After the host boot is complete, the DSP interrupt is registered in bit 0 (channel 0) of the
EDMA Event Register (ER). This event must be cleared by software before triggering
transfers on DMA channel 0.
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8.18.2 PCI Peripheral Register Descriptions
Table 8-99. PCI Configuration Registers
PCI HOST ACCESS ACRONYM PCI HOST ACCESS REGISTER NAME
HEX ADDRESS OFFSET
0x00 PCIVENDEV Vendor ID/Device ID
0x04 PCICSR Command/Status
0x08 PCICLREV Class Code/Revision ID
0x0C PCICLINE BIST/Header Type/Latency Timer/Cacheline Size
0x10 PCIBAR0 Base Address 0
0x14 PCIBAR1 Base Address 1
0x18 PCIBAR2 Base Address 2
0x1C PCIBAR3 Base Address 3
0x20 PCIBAR4 Base Address 4
0x24 PCIBAR5 Base Address 5
0x28 - 0x2B - Reserved
0x2C PCISUBID Subsystem Vendor ID/Subsystem ID
0x30 - Reserved
0x34 PCICPBPTR Capabilities Pointer
0x38 - 0x3B - Reserved
0x3C PCILGINT Max Latency/Min Grant/Interrupt Pin/Interrupt Line
0x40 - 0x7F - Reserved
Table 8-100. PCI Back-End Configuration Registers
DSP ACCESS ACRONYM DSP ACCESS REGISTER NAME
HEX ADDRESS RANGE
02C0 0000 - 02C0 000F - Reserved
02C0 0010 PCISTATSET PCI Status Set Register
02C0 0014 PCISTATCLR PCI Status Clear Register
02C0 0018 - 02C0 001F - Reserved
02C0 0020 PCIHINTSET PCI Host Interrupt Enable Set Register
02C0 0024 PCIHINTCLR PCI Host Interrupt Enable Clear Register
02C0 0028 - 02C0 002F - Reserved
02C0 0030 PCIBINTSET PCI Back End Application Interrupt Enable Set Register
02C0 0034 PCIBINTCLR PCI Back End Application Interrupt Enable Clear Register
02C0 0038 PCIBCLKMGT PCI Back End Application Clock Management Register
02C0 003C - 02C0 00FF - Reserved
02C0 0100 PCIVENDEVMIR PCI Vendor ID/Device ID Mirror Register
02C0 0104 PCICSRMIR PCI Command/Status Mirror Register
02C0 0108 PCICLREVMIR PCI Class Code/Revision ID Mirror Register
02C0 010C PCICLINEMIR PCI BIST/Header Type/Latency Timer/Cacheline Size Mirror Register
02C0 0110 PCIBAR0MSK PCI Base Address Mask Register 0
02C0 0114 PCIBAR1MSK PCI Base Address Mask Register 1
02C0 0118 PCIBAR2MSK PCI Base Address Mask Register 2
02C0 011C PCIBAR3MSK PCI Base Address Mask Register 3
02C0 0120 PCIBAR4MSK PCI Base Address Mask Register 4
02C0 0124 PCIBAR5MSK PCI Base Address Mask Register 5
02C0 0128 - 02C0 012B - Reserved
02C0 012C PCISUBIDMIR PCI Subsystem Vendor ID/Subsystem ID Mirror Register
02C0 0130 - Reserved
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Table 8-100. PCI Back-End Configuration Registers (continued)
DSP ACCESS ACRONYM DSP ACCESS REGISTER NAME
HEX ADDRESS RANGE
02C0 0134 PCICPBPTRMIR PCI Capabilities Pointer Mirror Register
02C0 0138 - 02C0 013B - Reserved
02C0 013C PCILGINTMIR PCI Max Latency/Min Grant/Interrupt Pin/Interrupt Line Mirror Register
02C0 0140 - 02C0 017F - Reserved
02C0 0180 PCISLVCNTL PCI Slave Control Register
02C0 0184 - 02C0 01BF - Reserved
02C0 01C0 PCIBAR0TRL PCI Slave Base Address 0 Translation Register
02C0 01C4 PCIBAR1TRL PCI Slave Base Address 1 Translation Register
02C0 01C8 PCIBAR2TRL PCI Slave Base Address 2 Translation Register
02C0 01CC PCIBAR3TRL PCI Slave Base Address 3 Translation Register
02C0 01D0 PCIBAR4TRL PCI Slave Base Address 4 Translation Register
02C0 01D4 PCIBAR5TRL PCI Slave Base Address 5 Translation Register
02C0 01D8 - 02C0 01DF - Reserved
02C0 01E0 PCIBAR0MIR PCI Base Address Register 0 Mirror Register
02C0 01E4 PCIBAR1MIR PCI Base Address Register 1 Mirror Register
02C0 01E8 PCIBAR2MIR PCI Base Address Register 2 Mirror Register
02C0 01EC PCIBAR3MIR PCI Base Address Register 3 Mirror Register
02C0 01F0 PCIBAR4MIR PCI Base Address Register 4 Mirror Register
02C0 01F4 PCIBAR5MIR PCI Base Address Register 5 Mirror Register
02C0 01F8 - 02C0 02FF - Reserved
02C0 0300 PCIMCFGDAT PCI Master Configuration/IO Access Data Register
02C0 0304 PCIMCFGADR PCI Master Configuration/IO Access Address Register
02C0 0308 PCIMCFGCMD PCI Master Configuration/IO Access Command Register
02C0 030C - 02C0 030F - Reserved
02C0 0310 PCIMSTCFG PCI Master Configuration Register
Table 8-101. DSP-to-PCI Address Translation Registers
DSP ACCESS ACRONYM DSP ACCESS REGISTER NAME
HEX ADDRESS RANGE
02C0 0314 PCIADDSUB0 PCI Address Substitute 0 Register
02C0 0318 PCIADDSUB1 PCI Address Substitute 1 Register
02C0 031C PCIADDSUB2 PCI Address Substitute 2 Register
02C0 0320 PCIADDSUB3 PCI Address Substitute 3 Register
02C0 0324 PCIADDSUB4 PCI Address Substitute 4 Register
02C0 0328 PCIADDSUB5 PCI Address Substitute 5 Register
02C0 032C PCIADDSUB6 PCI Address Substitute 6 Register
02C0 0330 PCIADDSUB7 PCI Address Substitute 7 Register
02C0 0334 PCIADDSUB8 PCI Address Substitute 8 Register
02C0 0338 PCIADDSUB9 PCI Address Substitute 9 Register
02C0 033C PCIADDSUB10 PCI Address Substitute 10 Register
02C0 0340 PCIADDSUB11 PCI Address Substitute 11 Register
02C0 0344 PCIADDSUB12 PCI Address Substitute 12 Register
02C0 0348 PCIADDSUB13 PCI Address Substitute 13 Register
02C0 034C PCIADDSUB14 PCI Address Substitute 14 Register
02C0 0350 PCIADDSUB15 PCI Address Substitute 15 Register
02C0 0354 PCIADDSUB16 PCI Address Substitute 16 Register
02C0 0358 PCIADDSUB17 PCI Address Substitute 17 Register
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Table 8-101. DSP-to-PCI Address Translation Registers (continued)
DSP ACCESS ACRONYM DSP ACCESS REGISTER NAME
HEX ADDRESS RANGE
02C0 035C PCIADDSUB18 PCI Address Substitute 18 Register
02C0 0360 PCIADDSUB19 PCI Address Substitute 19 Register
02C0 0364 PCIADDSUB20 PCI Address Substitute 20 Register
02C0 0368 PCIADDSUB21 PCI Address Substitute 21 Register
02C0 036C PCIADDSUB22 PCI Address Substitute 22 Register
02C0 0370 PCIADDSUB23 PCI Address Substitute 23 Register
02C0 0374 PCIADDSUB24 PCI Address Substitute 24 Register
02C0 0378 PCIADDSUB25 PCI Address Substitute 25 Register
02C0 037C PCIADDSUB26 PCI Address Substitute 26 Register
02C0 0380 PCIADDSUB27 PCI Address Substitute 27 Register
02C0 0384 PCIADDSUB28 PCI Address Substitute 28 Register
02C0 0388 PCIADDSUB29 PCI Address Substitute 29 Register
02C0 038C PCIADDSUB30 PCI Address Substitute 30 Register
02C0 0390 PCIADDSUB31 PCI Address Substitute 31 Register
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Table 8-102. PCI Hook Configuration Registers
DSP ACCESS ACRONYM DSP ACCESS REGISTER NAME
HEX ADDRESS RANGE
02C0 0394 PCIVENDEVPRG PCI Vendor ID and Device ID Program Register
02C0 0398 PCICMDSTATPRG PCI Command and Status Program Register
02C0 039C PCICLREVPRG PCI Class Code and Revision ID Program Register
02C0 03A0 PCISUBIDPRG PCI Subsystem Vendor ID and Subsystem ID Program Register
02C0 03A4 PCIMAXLGPRG PCI Max Latency and Min Grant Program Register
02C0 03A8 PCILRSTREG PCI LRESET Register
02C0 03AC PCICFGDONE PCI Configuration Done Register
02C0 03B0 PCIBAR0MPRG PCI Base Address Mask Register 0 Program Register
02C0 03B4 PCIBAR1MPRG PCI Base Address Mask Register 1 Program Register
02C0 03B8 PCIBAR2MPRG PCI Base Address Mask Register 2 Program Register
02C0 03BC PCIBAR3MPRG PCI Base Address Mask Register 3 Program Register
02C0 03C0 PCIBAR4MPRG PCI Base Address Mask Register 4 Program Register
02C0 03C4 PCIBAR5MPRG PCI Base Address Mask Register 5 Program Register
02C0 03C8 PCIBAR0PRG PCI Base Address Register 0 Program Register
02C0 03CC PCIBAR1PRG PCI Base Address Register 1 Program Register
02C0 03D0 PCIBAR2PRG PCI Base Address Register 2 Program Register
02C0 03D4 PCIBAR3PRG PCI Base Address Register 3 Program Register
02C0 03D8 PCIBAR4PRG PCI Base Address Register 4 Program Register
02C0 03DC PCIBAR5PRG PCI Base Address Register 5 Program Register
02C0 03E0 PCIBAR0TRLPRG PCI Base Address Translation Register 0 Program Register
02C0 03E4 PCIBAR1TRLPRG PCI Base Address Translation Register 1 Program Register
02C0 03E8 PCIBAR2TRLPRG PCI Base Address Translation Register 2 Program Register
02C0 03EC PCIBAR3TRLPRG PCI Base Address Translation Register 3 Program Register
02C0 03F0 PCIBAR4TRLPRG PCI Base Address Translation Register 4 Program Register
02C0 03F4 PCIBAR5TRLPRG PCI Base Address Translation Register 5 Program Register
02C0 03F8 PCIBASENPRG PCI Base En Prog Register
02C0 03FC - 02C0 03FF - Reserved
Table 8-103. PCI External Memory Space
HEX ADDRESS OFFSET ACRONYM REGISTER NAME
4000 0000 - 407F FFFF - PCI Master Window 0
4080 0000 - 40FF FFFF - PCI Master Window 1
4100 0000 - 417F FFFF - PCI Master Window 2
4180 0000 - 41FF FFFF - PCI Master Window 3
4200 0000 - 427F FFFF - PCI Master Window 4
4280 0000 - 42FF FFFF - PCI Master Window 5
4300 0000 - 437F FFFF - PCI Master Window 6
4380 0000 - 43FF FFFF - PCI Master Window 7
4400 0000 - 447F FFFF - PCI Master Window 8
4480 0000 - 44FF FFFF - PCI Master Window 9
4500 0000 - 457F FFFF - PCI Master Window 10
4580 0000 - 45FF FFFF - PCI Master Window 11
4600 0000 - 467F FFFF - PCI Master Window 12
4680 0000 - 46FF FFFF - PCI Master Window 13
4700 0000 - 477F FFFF - PCI Master Window 14
4780 0000 - 47FF FFFF - PCI Master Window 15
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Table 8-103. PCI External Memory Space (continued)
HEX ADDRESS OFFSET ACRONYM REGISTER NAME
4800 0000 - 487F FFFF - PCI Master Window 16
4880 0000 - 48FF FFFF - PCI Master Window 17
4900 0000 - 497F FFFF - PCI Master Window 18
4980 0000 - 49FF FFFF - PCI Master Window 19
4A00 0000 - 4A7F FFFF - PCI Master Window 20
4A80 0000 - 4AFF FFFF - PCI Master Window 21
4B00 0000 - 4B7F FFFF - PCI Master Window 22
4B80 0000 - 4BFF FFFF - PCI Master Window 23
4C00 0000 - 4C7F FFFF - PCI Master Window 24
4C80 0000 - 4CFF FFFF - PCI Master Window 25
4D00 0000 - 4D7F FFFF - PCI Master Window 26
4D80 0000 - 4DFF FFFF - PCI Master Window 27
4E00 0000 - 4E7F FFFF - PCI Master Window 28
4E80 0000 - 4EFF FFFF - PCI Master Window 29
4F00 0000 - 4F7F FFFF - PCI Master Window 30
4F80 0000 - 4FFF FFFF - PCI Master Window 31
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8.18.3 PCI Electrical Data/Timing
Texas Instruments (TI) has performed the simulation and system characterization to ensure that the PCI
peripheral meets all AC timing specifications as required by the PCI Local Bus Specification (version 2.3).
The AC timing specifications are not reproduced here. For more information on the AC timing
specifications, see section 4.2.3, Timing Specification (33 MHz timing), and section 7.6.4, Timing
Specification (66 MHz timing), of the PCI Local Bus Specification (version 2.3). Note that the TCI6482 PCI
peripheral only supports 3.3-V signaling.
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8.19 UTOPIA
8.19.1 UTOPIA Device-Specific Information
The Universal Test and Operations PHY Interface for ATM (UTOPIA) peripheral is a 50 MHz, 8-Bit Slave-
only interface. The UTOPIA is more simplistic than the Ethernet MAC, in that the UTOPIA is serviced
directly by the EDMA3 controller. The UTOPIA peripheral contains two, two-cell FIFOs, one for transmit
and one for receive, with which to buffer up data sent/received across the pins. There is a transmit and a
receive event to the EDMA3 channel controller to enable servicing.
For more detailed information on the UTOPIA peripheral, see the TMS320TCI648x DSP Universal Test
and Operations PHY Interface for ATM 2 (UTOPIA2) User's Guide (literature number SPRU726).
8.19.2 UTOPIA Peripheral Register Descriptions
Table 8-104. UTOPIA Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02B4 0000 UCR UTOPIA Control Register
02B4 0004 - Reserved
02B4 0008 - Reserved
02B4 000C - Reserved
02B4 0010 - Reserved
02B4 0014 CDR Clock Detect Register
02B4 0018 EIER Error Interrupt Enable Register
02B4 001C EIPR Error Interrupt Pending Register
02B4 0020 - 02B4 01FF - Reserved
02B4 0200 - 02B7 FFFF - Reserved
Table 8-105. UTOPIA Data Queues (Receive and Transmit) Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
3C00 0000 - 3C00 03FF URQ UTOPIA Receive (Rx) Data Queue
3C00 0400 - 3C00 07FF UXQ UTOPIA Transmit (Tx) Data Queue
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1
2
3
4
4
URCLK
1
2
3
4
4
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8.19.3 UTOPIA Electrical Data/Timing
Table 8-106. Timing Requirements for UXCLK(1)
(see Figure 8-74)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tc(UXCK) Cycle time, UXCLK 20 ns
2 tw(UXCKH) Pulse duration, UXCLK high 0.4tc(UXCK) 0.6tc(UXCK) ns
3 tw(UXCKL) Pulse duration, UXCLK low 0.4tc(UXCK) 0.6tc(UXCK) ns
4 tt(UXCK) Transition time, UXCLK 2 ns
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
Figure 8-74. UXCLK Timing
Table 8-107. Timing Requirements for URCLK(1)
(see Figure 8-75)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tc(URCK) Cycle time, URCLK 20 ns
2 tw(URCKH) Pulse duration, URCLK high 0.4tc(URCK) 0.6tc(URCK) ns
3 tw(URCKL) Pulse duration, URCLK low 0.4tc(URCK) 0.6tc(URCK) ns
4 tt(URCK) Transition time, URCLK 2 ns
(1) The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
Figure 8-75. URCLK Timing
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P47 P48 H1
N 0x1F N 0x1F N + 1 0x1F
N N
10
8
4
3
2
1
UXCLK
UXDATA[7:0]
UXADDR[4:0]
UXCLAV
UXENB
UXSOC
9
P46P45
0 x1F
A. The UTOPIA Slave module has signals that are middle-level signals indicating a high-impedance state (i.e., the UXCLAV and UXSOC signals).
5
67
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Table 8-108. Timing Requirements for UTOPIA Slave Transmit
(see Figure 8-76)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
2 tsu(UXAV-UXCH) Setup time, UXADDR valid before UXCLK high 4 ns
3 th(UXCH-UXAV) Hold time, UXADDR valid after UXCLK high 1 ns
8 tsu(UXENBL-UXCH) Setup time, UXENB low before UXCLK high 4 ns
9 th(UXCH-UXENBL) Hold time, UXENB low after UXCLK high 1 ns
Table 8-109. Switching Characteristics Over Recommended Operating Conditions for UTOPIA Slave
Transmit Cycles
(see Figure 8-76)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 td(UXCH-UXDV) Delay time, UXCLK high to UXDATA valid 3 12 ns
4 td(UXCH-UXCLAV) Delay time, UXCLK high to UXCLAV driven active value 3 12 ns
5 td(UXCH-UXCLAVL) Delay time, UXCLK high to UXCLAV driven inactive low 3 12 ns
6 td(UXCH-UXCLAVHZ) Delay time, UXCLK high to UXCLAV going Hi-Z 9 18.5 ns
7 tw(UXCLAVL-UXCLAVHZ) Pulse duration (low), UXCLAV low to UXCLAV Hi-Z 3 ns
10 td(UXCH-UXSV) Delay time, UXCLK high to UXSOC valid 3 12 ns
Figure 8-76. UTOPIA Slave Transmit Timing(A)
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P48 H1 H2 H3
N 0x1F N+1 0x1F N+2 0x1F
N N+1 N+2
1211
9
10
5
4
3
2
1
URCLK
URDATA[7:0]
URADDR[4:0]
URCLAV
URENB
URSOC
A. The UTOPIA Slave module has signals that are middle-level signals indicating a high-impedance state (i.e., the URCLAV and
URSOC signals).
8
6
7
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Table 8-110. Timing Requirements for UTOPIA Slave Receive
(see Figure 8-77)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tsu(URDV-URCH) Setup time, URDATA valid before URCLK high 4 ns
2 th(URCH-URDV) Hold time, URADDR valid after URCLK high 1 ns
3 tsu(URAV-URCH) Setup time, URADDR valid before URCLK high 4 ns
4 th(URCH-URAV) Hold time, URADDR valid after URCLK high 1 ns
9 tsu(URENBL-URCH) Setup time, URENB low before URCLK high 4 ns
10 th(URCH-URENBL) Hold time, URENB low after URCLK high 1 ns
11 tsu(URSH-URCH) Setup time, URSOC high before URCLK high 4 ns
12 th(URCH-URSH) Hold time, URSOC high after URCLK high 1 ns
Table 8-111. Switching Characteristics Over Recommended Operating Conditions for UTOPIA Slave
Receive Cycles
(see Figure 8-77)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
5 td(URCH-URCLAV) Delay time, URCLK high to URCLAV driven active value 3 12 ns
6 td(URCH-URCLAVL) Delay time, URCLK high to URCLAV driven inactive low 3 12 ns
7 td(URCH-URCLAVHZ) Delay time, URCLK high to URCLAV going Hi-Z 9 18.5 ns
8 tw(URCLAVL-URCLAVHZ) Pulse duration (low), URCLAV low to URCLAV Hi-Z 3 ns
Figure 8-77. UTOPIA Slave Receive Timing(A)
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8.20 Serial RapidIO (SRIO) Port
The SRIO port on the TCI6482 device is a high-performance, low pin-count interconnect aimed for
embedded markets. The use of the Rapid I/O interconnect in a baseband board design can create a
homogeneous interconnect environment, providing even more connectivity and control among the
components. Rapid I/O is based on the memory and device addressing concepts of processor buses
where the transaction processing is managed completely by hardware. This enables the Rapid I/O
interconnect to lower the system cost by providing lower latency, reduced overhead of packet data
processing, and higher system bandwidth, all of which are key for wireless interfaces. The Rapid I/O
interconnect offers very low pin-count interfaces with scalable system bandwidth based on 10-Gigabit per
second (Gbps) bidirectional links.
The PHY part of the RIO consists of the physical layer and includes the input and output buffers (each
serial link consists of a differential pair), the 8-bit/10-bit encoder/decoder, the PLL clock recovery, and the
parallel-to-serial/serial-to-parallel converters.
The RapidIO interface should be designed to operate at a data rate of 3.125 Gbps per differential pair.
This equals 12.5 raw GBaud/s for the 4x RapidIO port, or approximately 9 Gbps data throughput rate.
8.20.1 Serial RapidIO Device-Specific Information
The approach to specifying interface timing for the SRIO Port is different than on other interfaces such as
EMIF, HPI, and McBSP. For these other interfaces the device timing was specified in terms of data
manual specifications and I/O buffer information specification (IBIS) models.
For the TCI6482 SRIO Port, Texas Instruments (TI) provides a printed circuit board (PCB) solution
showing two DSPs connected via a 4x SRIO link directly to the user. TI has performed the simulation and
system characterization to ensure all SRIO interface timings in this solution are met. The complete SRIO
system solution is documented in the Implementing Serial RapidIO PCB Layout on a TMS320CTI6482
Hardware Design application report (literature number SPRAAB0).
TI only supports designs that follow the board design guidelines outlined in the SPRAAB0
application report.
The Serial RapidIO peripheral is a master peripheral in the TCI6482 DSP. It conforms to the RapidIO™
Interconnect Specification, Part VI: Physical Layer 1x/4x LP-Serial Specification, Revision 1.2.
If the SRIO peripheral is not used, the SRIO reference clock inputs and SRIO link pins can be left
unconnected. If the SRIO peripheral is enabled but not all links are used, the pins of the unused links can
be left unconnected and no terminations are needed. For more information, see the TMS320TCI6482
Design Guide and Comparisons to TMS320TCI100 (literature number SPRAAC7).
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8.20.2 Serial RapidIO Peripheral Register Descriptions
Table 8-112. RapidIO Control Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 0000 RIO_PID Peripheral Identification Register
02D0 0004 RIO_PCR Peripheral Control Register
02D0 0008 - 02D0 001C - Reserved
02D0 0020 RIO_PER_SET_CNTL Peripheral Settings Control Register
02D0 0024 - 02D0 002C - Reserved
02D0 0030 RIO_GBL_EN Peripheral Global Enable Register
02D0 0034 RIO_GBL_EN_STAT Peripheral Global Enable Status
02D0 0038 RIO_BLK0_EN Block Enable 0
02D0 003C RIO_BLK0_EN_STAT Block Enable Status 0
02D0 0040 RIO_BLK1_EN Block Enable 1
02D0 0044 RIO_BLK1_EN_STAT Block Enable Status 1
02D0 0048 RIO_BLK2_EN Block Enable 2
02D0 004C RIO_BLK2_EN_STAT Block Enable Status 2
02D0 0050 RIO_BLK3_EN Block Enable 3
02D0 0054 RIO_BLK3_EN_STAT Block Enable Status 3
02D0 0058 RIO_BLK4_EN Block Enable 4
02D0 005C RIO_BLK4_EN_STAT Block Enable Status 4
02D0 0060 RIO_BLK5_EN Block Enable 5
02D0 0064 RIO_BLK5_EN_STAT Block Enable Status 5
02D0 0068 RIO_BLK6_EN Block Enable 6
02D0 006C RIO_BLK6_EN_STAT Block Enable Status 6
02D0 0070 RIO_BLK7_EN Block Enable 7
02D0 0074 RIO_BLK7_EN_STAT Block Enable Status 7
02D0 0078 RIO_BLK8_EN Block Enable 8
02D0 007C RIO_BLK8_EN_STAT Block Enable Status 8
02D0 0080 RIO_DEVICEID_REG1 RapidIO DEVICEID1 Register
02D0 0084 RIO_DEVICEID_REG2 RapidIO DEVICEID2 Register
02D0 0088 - 02D0 008C - Reserved
02D0 0090 RIO_PF_16B_CNTL0 Packet Forwarding Register 0 for 16-bit Device IDs
02D0 0094 RIO_PF_8B_CNTL0 Packet Forwarding Register 0 for 8-bit Device IDs
02D0 0098 RIO_PF_16B_CNTL1 Packet Forwarding Register 1 for 16-bit Device IDs
02D0 009C RIO_PF_8B_CNTL1 Packet Forwarding Register 1 for 8-bit Device IDs
02D0 00A0 RIO_PF_16B_CNTL2 Packet Forwarding Register 2 for 16-bit Device IDs
02D0 00A4 RIO_PF_8B_CNTL2 Packet Forwarding Register 2 for 8-bit Device IDs
02D0 00A8 RIO_PF_16B_CNTL3 Packet Forwarding Register 3 for 16-bit Device IDs
02D0 00AC RIO_PF_8B_CNTL3 Packet Forwarding Register 3 for 8-bit Device IDs
02D0 00B0 - 02D0 00FC - Reserved
02D0 0100 RIO_SERDES_CFGRX0_CNTL SERDES Receive Channel Configuration Register 0
02D0 0104 RIO_SERDES_CFGRX1_CNTL SERDES Receive Channel Configuration Register 1
02D0 0108 RIO_SERDES_CFGRX2_CNTL SERDES Receive Channel Configuration Register 2
02D0 010C RIO_SERDES_CFGRX3_CNTL SERDES Receive Channel Configuration Register 3
02D0 0110 RIO_SERDES_CFGTX0_CNTL SERDES Transmit Channel Configuration Register 0
02D0 0114 RIO_SERDES_CFGTX1_CNTL SERDES Transmit Channel Configuration Register 1
02D0 0118 RIO_SERDES_CFGTX2_CNTL SERDES Transmit Channel Configuration Register 2
02D0 011C RIO_SERDES_CFGTX3_CNTL SERDES Transmit Channel Configuration Register 3
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 0120 RIO_SERDES_CFG0_CNTL SERDES Macro Configuration Register 0
02D0 0124 RIO_SERDES_CFG1_CNTL SERDES Macro Configuration Register 1
02D0 0128 RIO_SERDES_CFG2_CNTL SERDES Macro Configuration Register 2
02D0 012C RIO_SERDES_CFG3_CNTL SERDES Macro Configuration Register 3
02D0 0130 - 02D0 01FC - Reserved
02D0 0200 RIO_DOORBELL0_ICSR DOORBELL Interrupt Condition Status Register 0
02D0 0204 - Reserved
02D0 0208 RIO_DOORBELL0_ICCR DOORBELL Interrupt Condition Clear Register 0
02D0 020C - Reserved
02D0 0210 RIO_DOORBELL1_ICSR DOORBELL Interrupt Condition Status Register 1
02D0 0214 - Reserved
02D0 0218 RIO_DOORBELL1_ICCR DOORBELL Interrupt Condition Clear Register 1
02D0 021C - Reserved
02D0 0220 RIO_DOORBELL2_ICSR DOORBELL Interrupt Condition Status Register 2
02D0 0224 - Reserved
02D0 0228 RIO_DOORBELL2_ICCR DOORBELL Interrupt Condition Clear Register 2
02D0 022C - Reserved
02D0 0230 RIO_DOORBELL3_ICSR DOORBELL Interrupt Condition Status Register 3
02D0 0234 - Reserved
02D0 0238 RIO_DOORBELL3_ICCR DOORBELL Interrupt Condition Clear Register 3
02D0 023C - Reserved
02D0 0240 RIO_RX_CPPI_ICSR RX CPPI Interrupt Condition Status Register
02D0 0244 - Reserved
02D0 0248 RIO_RX_CPPI_ICCR RX CPPI Interrupt Condition Clear Register
02D0 024c - Reserved
02D0 0250 RIO_TX_CPPI_ICSR TX CPPI Interrupt Condition Status Register
02D0 0254 - Reserved
02D0 0258 RIO_TX_CPPI_ICCR TX CPPI Interrupt Condition Clear Register
02D0 025C - Reserved
02D0 0260 RIO_LSU_ICSR LSU Interrupt Condition Status Register
02D0 0264 - Reserved
02D0 0268 RIO_LSU_ICCR LSU Interrupt Condition Clear Register
02D0 026C - Reserved
02D0 0270 RIO_ERR_RST_EVNT_ICSR Error, Reset, and Special Event Interrupt Condition Status
Register
02D0 0274 - Reserved
02D0 0278 RIO_ERR_RST_EVNT_ICCR Error, Reset, and Special Event Interrupt Condition Clear
Register
02D0 027C - Reserved
02D0 0280 RIO_DOORBELL0_ICRR DOORBELL0 Interrupt Condition Routing Register
02D0 0284 RIO_DOORBELL0_ICRR2 DOORBELL 0 Interrupt Condition Routing Register 2
02D0 0288 - 02D0 028C - Reserved
02D0 0290 RIO_DOORBELL1_ICRR DOORBELL1 Interrupt Condition Routing Register
02D0 0294 RIO_DOORBELL1_ICRR2 DOORBELL 1 Interrupt Condition Routing Register 2
02D0 0298 - 02D0 029C - Reserved
02D0 02A0 RIO_DOORBELL2_ICRR DOORBELL2 Interrupt Condition Routing Register
02D0 02A4 RIO_DOORBELL2_ICRR2 DOORBELL 2 Interrupt Condition Routing Register 2
02D0 02A8 - 02D0 02AC - Reserved
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 02B0 RIO_DOORBELL3_ICRR DOORBELL3 Interrupt Condition Routing Register
02D0 02B4 RIO_DOORBELL3_ICRR2 DOORBELL 3 Interrupt Condition Routing Register 2
02D0 02B8 - 02D0 02BC - Reserved
02D0 02C0 RIO_RX_CPPI_ICRR Receive CPPI Interrupt Condition Routing Register
02D0 02C4 RIO_RX_CPPI_ICRR2 Receive CPPI Interrupt Condition Routing Register 2
02D0 02C8 - 02D0 02CC - Reserved
02D0 02D0 RIO_TX_CPPI_ICRR Transmit CPPI Interrupt Condition Routing Register
02D0 02D4 RIO_TX_CPPI_ICRR2 Transmit CPPI Interrupt Condition Routing Register 2
02D0 02D8 - 02D0 02DC - Reserved
02D0 02E0 RIO_LSU_ICRR0 LSU Interrupt Condition Routing Register 0
02D0 02E4 RIO_LSU_ICRR1 LSU Interrupt Condition Routing Register 1
02D0 02E8 RIO_LSU_ICRR2 LSU Interrupt Condition Routing Register 2
02D0 02EC RIO_LSU_ICRR3 LSU Interrupt Condition Routing Register 3
02D0 02F0 RIO_ERR_RST_EVNT_ICRR Error, Reset, and Special Event Interrupt Condition Routing
Register
02D0 02F4 RIO_ERR_RST_EVNT_ICRR2 Error, Reset, and Special Event Interrupt Condition Routing
Register 2
02D0 02F8 RIO_ERR_RST_EVNT_ICRR3 Error, Reset, and Special Event Interrupt Condition Routing
Register 3
02D0 02FC - Reserved
02D0 0300 RIO_INTDST0_DECODE INTDST Interrupt Status Decode Register 0
02D0 0304 RIO_INTDST1_DECODE INTDST Interrupt Status Decode Register 1
02D0 0308 RIO_INTDST2_DECODE INTDST Interrupt Status Decode Register 2
02D0 030C RIO_INTDST3_DECODE INTDST Interrupt Status Decode Register 3
02D0 0310 RIO_INTDST4_DECODE INTDST Interrupt Status Decode Register 4
02D0 0314 RIO_INTDST5_DECODE INTDST Interrupt Status Decode Register 5
02D0 0318 RIO_INTDST6_DECODE INTDST Interrupt Status Decode Register 6
02D0 031C RIO_INTDST7_DECODE INTDST Interrupt Status Decode Register 7
02D0 0320 RIO_INTDST0_RATE_CNTL INTDST Interrupt Rate Control Register 0
02D0 0324 RIO_INTDST1_RATE_CNTL INTDST Interrupt Rate Control Register 1
02D0 0328 RIO_INTDST2_RATE_CNTL INTDST Interrupt Rate Control Register 2
02D0 032C RIO_INTDST3_RATE_CNTL INTDST Interrupt Rate Control Register 3
02D0 0330 RIO_INTDST4_RATE_CNTL INTDST Interrupt Rate Control Register 4
02D0 0334 RIO_INTDST5_RATE_CNTL INTDST Interrupt Rate Control Register 5
02D0 0338 RIO_INTDST6_RATE_CNTL INTDST Interrupt Rate Control Register 6
02D0 033C RIO_INTDST7_RATE_CNTL INTDST Interrupt Rate Control Register 7
02D0 0340 - 02D0 03FC - Reserved
02D0 0400 RIO_LSU1_REG0 LSU1 Control Register 0
02D0 0404 RIO_LSU1_REG1 LSU1 Control Register 1
02D0 0408 RIO_LSU1_REG2 LSU1 Control Register 2
02D0 040C RIO_LSU1_REG3 LSU1 Control Register 3
02D0 0410 RIO_LSU1_REG4 LSU1 Control Register 4
02D0 0414 RIO_LSU1_REG5 LSU1 Control Register 5
02D0 0418 RIO_LSU1_REG6 LSU1 Control Register 6
02D0 041C RIO_LSU1_FLOW_MASKS LSU1 Congestion Control Flow Mask Register
02D0 0420 RIO_LSU2_REG0 LSU2 Control Register 0
02D0 0424 RIO_LSU2_REG1 LSU2 Control Register 1
02D0 0428 RIO_LSU2_REG2 LSU2 Control Register 2
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 042C RIO_LSU2_REG3 LSU2 Control Register 3
02D0 0430 RIO_LSU2_REG4 LSU2 Control Register 4
02D0 0434 RIO_LSU2_REG5 LSU2 Control Register 5
02D0 0438 RIO_LSU2_REG6 LSU2 Control Register 6
02D0 043C RIO_LSU2_FLOW_MASKS1 LSU2 Congestion Control Flow Mask Register
02D0 0440 RIO_LSU3_REG0 LSU3 Control Register 0
02D0 0444 RIO_LSU3_REG1 LSU3 Control Register 1
02D0 0448 RIO_LSU3_REG2 LSU3 Control Register 2
02D0 044C RIO_LSU3_REG3 LSU3 Control Register 3
02D0 0450 RIO_LSU3_REG4 LSU3 Control Register 4
02D0 0454 RIO_LSU3_REG5 LSU3 Control Register 5
02D0 0458 RIO_LSU3_REG6 LSU3 Control Register 6
02D0 045C RIO_LSU3_FLOW_MASKS2 LSU3 Congestion Control Flow Mask Register
02D0 0460 RIO_LSU4_REG0 LSU4 Control Register 0
02D0 0464 RIO_LSU4_REG1 LSU4 Control Register 1
02D0 0468 RIO_LSU4_REG2 LSU4 Control Register 2
02D0 046C RIO_LSU4_REG3 LSU4 Control Register 3
02D0 0470 RIO_LSU4_REG4 LSU4 Control Register 4
02D0 0474 RIO_LSU4_REG5 LSU4 Control Register 5
02D0 0478 RIO_LSU4_REG6 LSU4 Control Register 6
02D0 047C RIO_LSU4_FLOW_MASKS3 LSU4 Congestion Control Flow Mask Register
02D0 0480 - 02D0 04FC - Reserved
02D0 0500 RIO_QUEUE0_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 0
02D0 0504 RIO_QUEUE1_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 1
02D0 0508 RIO_QUEUE2_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 2
02D0 050C RIO_QUEUE3_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 3
02D0 0510 RIO_QUEUE4_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 4
02D0 0514 RIO_QUEUE5_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 5
02D0 0518 RIO_QUEUE6_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 6
02D0 051C RIO_QUEUE7_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 7
02D0 0520 RIO_QUEUE8_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 8
02D0 0524 RIO_QUEUE9_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 9
02D0 0528 RIO_QUEUE10_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 10
02D0 052C RIO_QUEUE11_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 11
02D0 0530 RIO_QUEUE12_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 12
02D0 0534 RIO_QUEUE13_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 13
02D0 0538 RIO_QUEUE14_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 14
02D0 053C RIO_QUEUE15_TXDMA_HDP Queue Transmit DMA Head Descriptor Pointer Register 15
02D0 0540 - 02D0 057C - Reserved
02D0 0580 RIO_QUEUE0_TXDMA_CP Queue Transmit DMA Completion Pointer Register 0
02D0 0584 RIO_QUEUE1_TXDMA_CP Queue Transmit DMA Completion Pointer Register 1
02D0 0588 RIO_QUEUE2_TXDMA_CP Queue Transmit DMA Completion Pointer Register 2
02D0 058C RIO_QUEUE3_TXDMA_CP Queue Transmit DMA Completion Pointer Register 3
02D0 0590 RIO_QUEUE4_TXDMA_CP Queue Transmit DMA Completion Pointer Register 4
02D0 0594 RIO_QUEUE5_TXDMA_CP Queue Transmit DMA Completion Pointer Register 5
02D0 0598 RIO_QUEUE6_TXDMA_CP Queue Transmit DMA Completion Pointer Register 6
02D0 059C RIO_QUEUE7_TXDMA_CP Queue Transmit DMA Completion Pointer Register 7
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 05A0 RIO_QUEUE8_TXDMA_CP Queue Transmit DMA Completion Pointer Register 8
02D0 05A4 RIO_QUEUE9_TXDMA_CP Queue Transmit DMA Completion Pointer Register 9
02D0 05A8 RIO_QUEUE10_TXDMA_CP Queue Transmit DMA Completion Pointer Register 10
02D0 05AC RIO_QUEUE11_TXDMA_CP Queue Transmit DMA Completion Pointer Register 11
02D0 05B0 RIO_QUEUE12_TXDMA_CP Queue Transmit DMA Completion Pointer Register 12
02D0 05B4 RIO_QUEUE13_TXDMA_CP Queue Transmit DMA Completion Pointer Register 13
02D0 05B8 RIO_QUEUE14_TXDMA_CP Queue Transmit DMA Completion Pointer Register 14
02D0 05BC RIO_QUEUE15_TXDMA_CP Queue Transmit DMA Completion Pointer Register 15
02D0 05D0 - 02D0 05FC - Reserved
02D0 0600 RIO_QUEUE0_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 0
02D0 0604 RIO_QUEUE1_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 1
02D0 0608 RIO_QUEUE2_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 2
02D0 060C RIO_QUEUE3_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 3
02D0 0610 RIO_QUEUE4_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 4
02D0 0614 RIO_QUEUE5_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 5
02D0 0618 RIO_QUEUE6_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 6
02D0 061C RIO_QUEUE7_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 7
02D0 0620 RIO_QUEUE8_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 8
02D0 0624 RIO_QUEUE9_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 9
02D0 0628 RIO_QUEUE10_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 10
02D0 062C RIO_QUEUE11_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 11
02D0 0630 RIO_QUEUE12_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 12
02D0 0634 RIO_QUEUE13_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 13
02D0 0638 RIO_QUEUE14_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 14
02D0 063C RIO_QUEUE15_RXDMA_HDP Queue Receive DMA Head Descriptor Pointer Register 15
02D0 0640 - 02D0 067C - Reserved
02D0 0680 RIO_QUEUE0_RXDMA_CP Queue Receive DMA Completion Pointer Register 0
02D0 0684 RIO_QUEUE1_RXDMA_CP Queue Receive DMA Completion Pointer Register 1
02D0 0688 RIO_QUEUE2_RXDMA_CP Queue Receive DMA Completion Pointer Register 2
02D0 068C RIO_QUEUE3_RXDMA_CP Queue Receive DMA Completion Pointer Register 3
02D0 0690 RIO_QUEUE4_RXDMA_CP Queue Receive DMA Completion Pointer Register 4
02D0 0694 RIO_QUEUE5_RXDMA_CP Queue Receive DMA Completion Pointer Register 5
02D0 0698 RIO_QUEUE6_RXDMA_CP Queue Receive DMA Completion Pointer Register 6
02D0 069C RIO_QUEUE7_RXDMA_CP Queue Receive DMA Completion Pointer Register 7
02D0 06A0 RIO_QUEUE8_RXDMA_CP Queue Receive DMA Completion Pointer Register 8
02D0 06A4 RIO_QUEUE9_RXDMA_CP Queue Receive DMA Completion Pointer Register 9
02D0 06A8 RIO_QUEUE10_RXDMA_CP Queue Receive DMA Completion Pointer Register 10
02D0 06AC RIO_QUEUE11_RXDMA_CP Queue Receive DMA Completion Pointer Register 11
02D0 06B0 RIO_QUEUE12_RXDMA_CP Queue Receive DMA Completion Pointer Register 12
02D0 06B4 RIO_QUEUE13_RXDMA_CP Queue Receive DMA Completion Pointer Register 13
02D0 06B8 RIO_QUEUE14_RXDMA_CP Queue Receive DMA Completion Pointer Register 14
02D0 06BC RIO_QUEUE15_RXDMA_CP Queue Receive DMA Completion Pointer Register 15
02D0 06C0 - 02D0 006FC - Reserved
02D0 0700 RIO_TX_QUEUE_TEAR_DOWN Transmit Queue Teardown Register
02D0 0704 RIO_TX_CPPI_FLOW_MASKS0 Transmit CPPI Supported Flow Mask Register 0
02D0 0708 RIO_TX_CPPI_FLOW_MASKS1 Transmit CPPI Supported Flow Mask Register 1
02D0 070C RIO_TX_CPPI_FLOW_MASKS2 Transmit CPPI Supported Flow Mask Register 2
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 0710 RIO_TX_CPPI_FLOW_MASKS3 Transmit CPPI Supported Flow Mask Register 3
02D0 0714 RIO_TX_CPPI_FLOW_MASKS4 Transmit CPPI Supported Flow Mask Register 4
02D0 0718 RIO_TX_CPPI_FLOW_MASKS5 Transmit CPPI Supported Flow Mask Register 5
02D0 071C RIO_TX_CPPI_FLOW_MASKS6 Transmit CPPI Supported Flow Mask Register 6
02D0 0720 RIO_TX_CPPI_FLOW_MASKS7 Transmit CPPI Supported Flow Mask Register 7
02D0 0724 - 02D0 073C - Reserved
02D0 0740 RIO_RX_QUEUE_TEAR_DOWN Receive Queue Teardown Register
02D0 0744 RIO_RX_CPPI_CNTL Receive CPPI Control Register
02D0 0748 - 02D0 07DC - Reserved
02D0 07E0 RIO_TX_QUEUE_CNTL0 Transmit CPPI Weighted Round Robin Control Register 0
02D0 07E4 RIO_TX_QUEUE_CNTL1 Transmit CPPI Weighted Round Robin Control Register 1
02D0 07E8 RIO_TX_QUEUE_CNTL2 Transmit CPPI Weighted Round Robin Control Register 2
02D0 07EC RIO_TX_QUEUE_CNTL3 Transmit CPPI Weighted Round Robin Control Register 3
02D0 07F0 - 02D0 07FC - Reserved
02D0 0800 RIO_RXU_MAP_L0 Mailbox-to-Queue Mapping Register L0
02D0 0804 RIO_RXU_MAP_H0 Mailbox-to-Queue Mapping Register H0
02D0 0808 RIO_RXU_MAP_L1 Mailbox-to-Queue Mapping Register L1
02D0 080C RIO_RXU_MAP_H1 Mailbox-to-Queue Mapping Register H1
02D0 0810 RIO_RXU_MAP_L2 Mailbox-to-Queue Mapping Register L2
02D0 0814 RIO_RXU_MAP_H2 Mailbox-to-Queue Mapping Register H2
02D0 0818 RIO_RXU_MAP_L3 Mailbox-to-Queue Mapping Register L3
02D0 081C RIO_RXU_MAP_H3 Mailbox-to-Queue Mapping Register H3
02D0 0820 RIO_RXU_MAP_L4 Mailbox-to-Queue Mapping Register L4
02D0 0824 RIO_RXU_MAP_H4 Mailbox-to-Queue Mapping Register H4
02D0 0828 RIO_RXU_MAP_L5 Mailbox-to-Queue Mapping Register L5
02D0 082C RIO_RXU_MAP_H5 Mailbox-to-Queue Mapping Register H5
02D0 0830 RIO_RXU_MAP_L6 Mailbox-to-Queue Mapping Register L6
02D0 0834 RIO_RXU_MAP_H6 Mailbox-to-Queue Mapping Register H6
02D0 0838 RIO_RXU_MAP_L7 Mailbox-to-Queue Mapping Register L7
02D0 083C RIO_RXU_MAP_H7 Mailbox-to-Queue Mapping Register H7
02D0 0840 RIO_RXU_MAP_L8 Mailbox-to-Queue Mapping Register L8
02D0 0844 RIO_RXU_MAP_H8 Mailbox-to-Queue Mapping Register H8
02D0 0848 RIO_RXU_MAP_L9 Mailbox-to-Queue Mapping Register L9
02D0 084C RIO_RXU_MAP_H9 Mailbox-to-Queue Mapping Register H9
02D0 0850 RIO_RXU_MAP_L10 Mailbox-to-Queue Mapping Register L10
02D0 0854 RIO_RXU_MAP_H10 Mailbox-to-Queue Mapping Register H10
02D0 0858 RIO_RXU_MAP_L11 Mailbox-to-Queue Mapping Register L11
02D0 085C RIO_RXU_MAP_H11 Mailbox-to-Queue Mapping Register H11
02D0 0860 RIO_RXU_MAP_L12 Mailbox-to-Queue Mapping Register L12
02D0 0864 RIO_RXU_MAP_H12 Mailbox-to-Queue Mapping Register H12
02D0 0868 RIO_RXU_MAP_L13 Mailbox-to-Queue Mapping Register L13
02D0 086C RIO_RXU_MAP_H13 Mailbox-to-Queue Mapping Register H13
02D0 0870 RIO_RXU_MAP_L14 Mailbox-to-Queue Mapping Register L14
02D0 0874 RIO_RXU_MAP_H14 Mailbox-to-Queue Mapping Register H14
02D0 0878 RIO_RXU_MAP_L15 Mailbox-to-Queue Mapping Register L15
02D0 087C RIO_RXU_MAP_H15 Mailbox-to-Queue Mapping Register H15
02D0 0880 RIO_RXU_MAP_L16 Mailbox-to-Queue Mapping Register L16
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 0884 RIO_RXU_MAP_H16 Mailbox-to-Queue Mapping Register H16
02D0 0888 RIO_RXU_MAP_L17 Mailbox-to-Queue Mapping Register L17
02D0 088C RIO_RXU_MAP_H17 Mailbox-to-Queue Mapping Register H17
02D0 0890 RIO_RXU_MAP_L18 Mailbox-to-Queue Mapping Register L18
02D0 0894 RIO_RXU_MAP_H18 Mailbox-to-Queue Mapping Register H18
02D0 0898 RIO_RXU_MAP_L19 Mailbox-to-Queue Mapping Register L19
02D0 089C RIO_RXU_MAP_H19 Mailbox-to-Queue Mapping Register H19
02D0 08A0 RIO_RXU_MAP_L20 Mailbox-to-Queue Mapping Register L20
02D0 08A4 RIO_RXU_MAP_H20 Mailbox-to-Queue Mapping Register H20
02D0 08A8 RIO_RXU_MAP_L21 Mailbox-to-Queue Mapping Register L21
02D0 08AC RIO_RXU_MAP_H21 Mailbox-to-Queue Mapping Register H21
02D0 08B0 RIO_RXU_MAP_L22 Mailbox-to-Queue Mapping Register L22
02D0 08B4 RIO_RXU_MAP_H22 Mailbox-to-Queue Mapping Register H22
02D0 08B8 RIO_RXU_MAP_L23 Mailbox-to-Queue Mapping Register L23
02D0 08BC RIO_RXU_MAP_H23 Mailbox-to-Queue Mapping Register H23
02D0 08C0 RIO_RXU_MAP_L24 Mailbox-to-Queue Mapping Register L24
02D0 08C4 RIO_RXU_MAP_H24 Mailbox-to-Queue Mapping Register H24
02D0 08C8 RIO_RXU_MAP_L25 Mailbox-to-Queue Mapping Register L25
02D0 08CC RIO_RXU_MAP_H25 Mailbox-to-Queue Mapping Register H25
02D0 08D0 RIO_RXU_MAP_L26 Mailbox-to-Queue Mapping Register L26
02D0 08D4 RIO_RXU_MAP_H26 Mailbox-to-Queue Mapping Register H26
02D0 08D8 RIO_RXU_MAP_L27 Mailbox-to-Queue Mapping Register L27
02D0 08DC RIO_RXU_MAP_H27 Mailbox-to-Queue Mapping Register H27
02D0 08E0 RIO_RXU_MAP_L28 Mailbox-to-Queue Mapping Register L28
02D0 08E4 RIO_RXU_MAP_H28 Mailbox-to-Queue Mapping Register H28
02D0 08E8 RIO_RXU_MAP_L29 Mailbox-to-Queue Mapping Register L29
02D0 08EC RIO_RXU_MAP_H29 Mailbox-to-Queue Mapping Register H29
02D0 08F0 RIO_RXU_MAP_L30 Mailbox-to-Queue Mapping Register L30
02D0 08F4 RIO_RXU_MAP_H30 Mailbox-to-Queue Mapping Register H30
02D0 08F8 RIO_RXU_MAP_L31 Mailbox-to-Queue Mapping Register L31
02D0 08FC RIO_RXU_MAP_H31 Mailbox-to-Queue Mapping Register H31
02D0 0900 RIO_FLOW_CNTL0 Flow Control Table Entry Register 0
02D0 0904 RIO_FLOW_CNTL1 Flow Control Table Entry Register 1
02D0 0908 RIO_FLOW_CNTL2 Flow Control Table Entry Register 2
02D0 090C RIO_FLOW_CNTL3 Flow Control Table Entry Register 3
02D0 0910 RIO_FLOW_CNTL4 Flow Control Table Entry Register 4
02D0 0914 RIO_FLOW_CNTL5 Flow Control Table Entry Register 5
02D0 0918 RIO_FLOW_CNTL6 Flow Control Table Entry Register 6
02D0 091C RIO_FLOW_CNTL7 Flow Control Table Entry Register 7
02D0 0920 RIO_FLOW_CNTL8 Flow Control Table Entry Register 8
02D0 0924 RIO_FLOW_CNTL9 Flow Control Table Entry Register 9
02D0 0928 RIO_FLOW_CNTL10 Flow Control Table Entry Register 10
02D0 092C RIO_FLOW_CNTL11 Flow Control Table Entry Register 11
02D0 0930 RIO_FLOW_CNTL12 Flow Control Table Entry Register 12
02D0 0934 RIO_FLOW_CNTL13 Flow Control Table Entry Register 13
02D0 0938 RIO_FLOW_CNTL14 Flow Control Table Entry Register 14
02D0 093C RIO_FLOW_CNTL15 Flow Control Table Entry Register 15
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 0940 - 02D0 09FC - Reserved
RapidIO Peripheral-Specific Registers
02D0 1000 RIO_DEV_ID Device Identity CAR
02D0 1004 RIO_DEV_INFO Device Information CAR
02D0 1008 RIO_ASBLY_ID Assembly Identity CAR
02D0 100C RIO_ASBLY_INFO Assembly Information CAR
02D0 1010 RIO_PE_FEAT Processing Element Features CAR
02D0 1014 - Reserved
02D0 1018 RIO_SRC_OP Source Operations CAR
02D0 101C RIO_DEST_OP Destination Operations CAR
02D0 1020 - 02D0 1048 - Reserved
02D0 104C RIO_PE_LL_CTL Processing Element Logical Layer Control CSR
02D0 1050 - 02D0 1054 - Reserved
02D0 1058 RIO_LCL_CFG_HBAR Local Configuration Space Base Address 0 CSR
02D0 105C RIO_LCL_CFG_BAR Local Configuration Space Base Address 1 CSR
02D0 1060 RIO_BASE_ID Base Device ID CSR
02D0 1064 - Reserved
02D0 1068 RIO_HOST_BASE_ID_LOCK Host Base Device ID Lock CSR
02D0 106C RIO_COMP_TAG Component Tag CSR
02D0 1070 - 02D0 10FC - Reserved
RapidIO Extended Features - LP Serial Registers
02D0 1100 RIO_SP_MB_HEAD 1x/4x LP Serial Port Maintenance Block Header
02D0 1104 - 02D0 1118
02D0 1120 RIO_SP_LT_CTL Port Link Time-Out Control CSR
02D0 1124 RIO_SP_RT_CTL Port Response Time-Out Control CSR
02D0 1128 - 02D0 1138 - Reserved
02D0 113C RIO_SP_GEN_CTL Port General Control CSR
02D0 1140 RIO_SP0_LM_REQ Port 0 Link Maintenance Request CSR
02D0 1144 RIO_SP0_LM_RERIO_SP Port 0 Link Maintenance Response CSR
02D0 1148 RIO_SP0_ACKID_STAT Port 0 Local Acknowledge ID Status CSR
02D0 114C - 02D0 1154 - Reserved
02D0 1158 RIO_SP0_ERR_STAT Port 0 Error and Status CSR
02D0 115C RIO_SP0_CTL Port 0 Control CSR
02D0 1160 RIO_SP1_LM_REQ Port 1 Link Maintenance Request CSR
02D0 1164 RIO_SP1_LM_RERIO_SP Port 1 Link Maintenance Response CSR
02D0 1168 RIO_SP1_ACKID_STAT Port 1 Local Acknowledge ID Status CSR
02D0 116C - 02D0 1174 - Reserved
02D0 1178 RIO_SP1_ERR_STAT Port 1 Error and Status CSR
02D0 117C RIO_SP1_CTL Port 1 Control CSR
02D0 1180 RIO_SP2_LM_REQ Port 2 Link Maintenance Request CSR
02D0 1184 RIO_SP2_LM_RERIO_SP Port 2 Link Maintenance Response CSR
02D0 1188 RIO_SP2_ACKID_STAT Port 2 Local Acknowledge ID Status CSR
02D0 118C - 02D0 1194 - Reserved
02D0 1198 RIO_SP2_ERR_STAT Port 2 Error and Status CSR
02D0 119C RIO_SP2_CTL Port 2 Control CSR
02D0 11A0 RIO_SP3_LM_REQ Port 3 Link Maintenance Request CSR
02D0 11A4 RIO_SP3_LM_RERIO_SP Port 3 Link Maintenance Response CSR
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 11A8 RIO_SP3_ACKID_STAT Port 3 Local Acknowledge ID Status CSR
02D0 11AC - 02D0 11B4 - Reserved
02D0 11B8 RIO_SP3_ERR_STAT Port 3 Error and Status CSR
02D0 11BC RIO_SP3_CTL Port 3 Control CSR
02D0 11C0 - 02D0 1FFC - Reserved
RapidIO Extended Feature - Error Management Registers
02D0 2000 RIO_ERR_RPT_BH Error Reporting Block Header
02D0 2004 - Reserved
02D0 2008 RIO_ERR_DET Logical/Transport Layer Error Detect CSR
02D0 200C RIO_ERR_EN Logical/Transport Layer Error Enable CSR
02D0 2010 RIO_H_ADDR_CAPT Logical/Transport Layer High Address Capture CSR
02D0 2014 RIO_ADDR_CAPT Logical/Transport Layer Address Capture CSR
02D0 2018 RIO_ID_CAPT Logical/Transport Layer Device ID Capture CSR
02D0 201C RIO_CTRL_CAPT Logical/Transport Layer Control Capture CSR
02D0 2020 - 02D0 2024 - Reserved
02D0 2028 RIO_PW_TGT_ID Port-Write Target Device ID CSR
02D0 202C - 02D0 203C - Reserved
02D0 2040 RIO_SP0_ERR_DET Port 0 Error Detect CSR
02D0 2044 RIO_SP0_RATE_EN Port 0 Error Enable CSR
02D0 2048 RIO_SP0_ERR_ATTR_CAPT_DBG0 Port 0 Attributes Error Capture CSR 0
02D0 204C RIO_SP0_ERR_CAPT_DBG1 Port 0 Packet/Control Symbol Error Capture CSR 1
02D0 2050 RIO_SP0_ERR_CAPT_DBG2 Port 0 Packet/Control Symbol Error Capture CSR 2
02D0 2054 RIO_SP0_ERR_CAPT_DBG3 Port 0 Packet/Control Symbol Error Capture CSR 3
02D0 2058 RIO_SP0_ERR_CAPT_DBG4 Port 0 Packet/Control Symbol Error Capture CSR 4
02D0 205C - 02D0 2064 - Reserved
02D0 2068 RIO_SP0_ERR_RATE Port 0 Error Rate CSR 0
02D0 206C RIO_SP0_ERR_THRESH Port 0 Error Rate Threshold CSR
02D0 2070 - 02D0 207C - Reserved
02D0 2080 RIO_SP1_ERR_DET Port 1 Error Detect CSR
02D0 2084 RIO_SP1_RATE_EN Port 1 Error Enable CSR
02D0 2088 RIO_SP1_ERR_ATTR_CAPT_DBG0 Port 1 Attributes Error Capture CSR 0
02D0 208C RIO_SP1_ERR_CAPT_DBG1 Port 1 Packet/Control Symbol Error Capture CSR 1
02D0 2090 RIO_SP1_ERR_CAPT_DBG2 Port 1 Packet/Control Symbol Error Capture CSR 2
02D0 2094 RIO_SP1_ERR_CAPT_DBG3 Port 1 Packet/Control Symbol Error Capture CSR 3
02D0 2098 RIO_SP1_ERR_CAPT_DBG4 Port 1 Packet/Control Symbol Error Capture CSR 4
02D0 209C - 02D0 20A4 - Reserved
02D0 20A8 RIO_SP1_ERR_RATE Port 1 Error Rate CSR
02D0 20AC RIO_SP1_ERR_THRESH Port 1 Error Rate Threshold CSR
02D0 20B0 - 02D0 20BC - Reserved
02D0 20C0 RIO_SP2_ERR_DET Port 2 Error Detect CSR
02D0 20C4 RIO_SP2_RATE_EN Port 2 Error Enable CSR
02D0 20C8 RIO_SP2_ERR_ATTR_CAPT_DBG0 Port 2 Attributes Error Capture CSR 0
02D0 20CC RIO_SP2_ERR_CAPT_DBG1 Port 2 Packet/Control Symbol Error Capture CSR 1
02D0 20D0 RIO_SP2_ERR_CAPT_DBG2 Port 2 Packet/Control Symbol Error Capture CSR 2
02D0 20D4 RIO_SP2_ERR_CAPT_DBG3 Port 2 Packet/Control Symbol Error Capture CSR 3
02D0 20D8 RIO_SP2_ERR_CAPT_DBG4 Port 2 Packet/Control Symbol Error Capture CSR 4
02D0 20DC - 02D0 20E4 - Reserved
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D0 20E8 RIO_SP2_ERR_RATE Port 2 Error Rate CSR
02D0 20EC RIO_SP2_ERR_THRESH Port 2 Error Rate Threshold CSR
02D0 20F0 - 02D0 20FC - Reserved
02D0 2100 RIO_SP3_ERR_DET Port 3 Error Detect CSR
02D0 2104 RIO_SP3_RATE_EN Port 3 Error Enable CSR
02D0 2108 RIO_SP3_ERR_ATTR_CAPT_DBG0 Port 3 Attributes Error Capture CSR 0
02D0 210C RIO_SP3_ERR_CAPT_DBG1 Port 3 Packet/Control Symbol Error Capture CSR 1
02D0 2110 RIO_SP3_ERR_CAPT_DBG2 Port 3 Packet/Control Symbol Error Capture CSR 2
02D0 2114 RIO_SP3_ERR_CAPT_DBG3 Port 3 Packet/Control Symbol Error Capture CSR 3
02D0 2118 RIO_SP3_ERR_CAPT_DBG4 Port 3 Packet/Control Symbol Error Capture CSR 4
02D0 211C - 02D0 2124 - Reserved
02D0 2128 RIO_SP3_ERR_RATE Port 3 Error Rate CSR
02D0 212C RIO_SP3_ERR_THRESH Port 3 Error Rate Threshold CSR
02D0 2130 - 02D1 0FFC - Reserved
Implementation Registers
02D1 1000 - 02D1 1FFC - Reserved
02D1 2000 RIO_SP_IP_DISCOVERY_TIMER Port IP Discovery Timer in 4x mode
02D1 2004 RIO_SP_IP_MODE Port IP Mode CSR
02D1 2008 RIO_IP_PRESCAL Port IP Prescaler Register
02D1 200C - Reserved
02D1 2010 RIO_SP_IP_PW_IN_CAPT0 Port-Write-In Capture CSR Register 0
02D1 2014 RIO_SP_IP_PW_IN_CAPT1 Port-Write-In Capture CSR Register 1
02D1 2018 RIO_SP_IP_PW_IN_CAPT2 Port-Write-In Capture CSR Register 2
02D1 201C RIO_SP_IP_PW_IN_CAPT3 Port-Write-In Capture CSR Register 3
02D1 2020 - 02D1 3FFC - Reserved
02D1 4000 RIO_SP0_RST_OPT Port 0 Reset Option CSR
02D1 4004 RIO_SP0_CTL_INDEP Port 0 Control Independent Register
02D1 4008 RIO_SP0_SILENCE_TIMER Port 0 Silence Timer Register
02D1 400C RIO_SP0_MULT_EVNT_CS Port 0 Multicast-Event Control Symbol Request Register
02D1 4010 - Reserved
02D1 4014 RIO_SP0_CS_TX Port 0 Control Symbol Transmit Register
02D1 4018 - 02D1 40FC - Reserved
02D1 4100 RIO_SP1_RST_OPT Port 1 Reset Option CSR
02D1 4104 RIO_SP1_CTL_INDEP Port 1 Control Independent Register
02D1 4108 RIO_SP1_SILENCE_TIMER Port 1 Silence Timer Register
02D1 410C RIO_SP1_MULT_EVNT_CS Port 1 Multicast-Event Control Symbol Request Register
02D1 4110 - Reserved
02D1 4114 RIO_SP1_CS_TX Port 1 Control Symbol Transmit Register
02D1 4118 - 02D1 41FC - Reserved
02D1 4200 RIO_SP2_RST_OPT Port 2 Reset Option CSR
02D1 4204 RIO_SP2_CTL_INDEP Port 2 Control Independent Register
02D1 4208 RIO_SP2_SILENCE_TIMER Port 2 Silence Timer Register
02D1 420C RIO_SP2_MULT_EVNT_CS Port 2 Multicast-Event Control Symbol Request Register
02D1 4214 RIO_SP2_CS_TX Port 2 Control Symbol Transmit Register
02D1 4218 - 02D1 42FC - Reserved
02D1 4300 RIO_SP3_RST_OPT Port 3 Reset Option CSR
02D1 4304 RIO_SP3_CTL_INDEP Port 3 Control Independent Register
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Table 8-112. RapidIO Control Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02D1 4308 RIO_SP3_SILENCE_TIMER Port 3 Silence Timer Register
02D1 430C RIO_SP3_MULT_EVNT_CS Port 3 Multicast-Event Control Symbol Request Register
02D1 4310 - Reserved
02D1 4314 RIO_SP3_CS_TX Port 3 Control Symbol Transmit Register
02D1 4318 - 02D2 0FFF - Reserved
02D2 1000 - 02DF FFFF - Reserved
8.20.3 Serial RapidIO Electrical Data/Timing
The Implementing Serial RapidIO PCB Layout on a TMS320CTI6482 Hardware Design application report
(literature number SPRAAB0) specifies a complete printed circuit board (PCB) solution for the TCI6482 as
well as a list of compatible SRIO devices showing two DSPs connected via a 4x SRIO link. TI has
performed the simulation and system characterization to ensure all SRIO interface timings in this solution
are met; therefore, no electrical data/timing information is supplied here for this interface.
TI only supports designs that follow the board design guidelines outlined in the SPRAAB0
application report.
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8.21 VLYNQ Peripheral
8.21.1 VLYNQ Device-Specific Information
The VLYNQ peripheral on the TCI6482 device conforms to the VLYNQ Module Specification (revision 2.x).
By default, the VLYNQ peripheral is initialized with a device ID of 0x22.
8.21.2 VLYNQ Peripheral Register Descriptions
Table 8-113. VLYNQ Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
3800 0000 - Reserved
3800 0004 CTRL VLYNQ Local Control Register
3800 0008 STAT VLYNQ Local Status Register
3800 000C INTPRI VLYNQ Local Interrupt Priority Vector Status/Clear Register
3800 0010 INTSTATCLR VLYNQ Local Interrupt Status/Clear Register
3800 0014 INTPENDSET VLYNQ Local Interrupt Pending/Set Register
3800 0018 INTPTR VLYNQ Local Interrupt Pointer Register
3800 001C XAM VLYNQ Local Transmit Address Map
3800 0020 RAMS1 VLYNQ Local Receive Address Map Size 1
3800 0024 RAMO1 VLYNQ Local Receive Address Map Offset 1
3800 0028 RAMS2 VLYNQ Local Receive Address Map Size 2
3800 002C RAMO2 VLYNQ Local Receive Address Map Offset 2
3800 0030 RAMS3 VLYNQ Local Receive Address Map Size 3
3800 0034 RAMO3 VLYNQ Local Receive Address Map Offset 3
3800 0038 RAMS4 VLYNQ Local Receive Address Map Size 4
3800 003C RAMO4 VLYNQ Local Receive Address Map Offset 4
3800 0040 CHIPVER VLYNQ Local Chip Version Register
3800 0044 AUTNGO VLYNQ Local Auto Negotiation Register
3800 0048 MANNGO VLYNQ Local Manual Negotiation Register
3800 004C NGOSTAT VLYNQ Local Negotiation Status Register
3800 0050 - 3800 005C - Reserved
3800 0060 INTVEC0 VLYNQ Local Interrupt Vector 3 - 0
3800 0064 INTVEC1 VLYNQ Local Interrupt Vector 7 - 4
3800 0068 - 3800 007C - Reserved for future use [Local Interrupt Vectors 8 - 31]
3800 0080 RREVID VLYNQ Remote Revision Register
3800 0084 RCTRL VLYNQ Remote Control Register
3800 0088 RSTAT VLYNQ Remote Status Register
3800 008C RINTPRI VLYNQ Remote Interrupt Priority Vector Status/Clear Register
3800 0090 RINTSTATCLR VLYNQ Remote Interrupt Status/Clear Register
3800 0094 RINTPENDSET VLYNQ Remote Interrupt Pending/Set Register
3800 0098 RINTPTR VLYNQ Remote Interrupt Pointer Register
3800 009C RXAM VLYNQ Remote Transmit Address Map
3800 00A0 RRAMS1 VLYNQ Remote Receive Address Map Size 1
3800 00A4 RRAMO1 VLYNQ Remote Receive Address Map Offset 1
3800 00A8 RRAMS2 VLYNQ Remote Receive Address Map Size 2
3800 00AC RRAMO2 VLYNQ Remote Receive Address Map Offset 2
3800 00B0 RRAMS3 VLYNQ Remote Receive Address Map Size 3
3800 00B4 RRAMO3 VLYNQ Remote Receive Address Map Offset 3
3800 00B8 RRAMS4 VLYNQ Remote Receive Address Map Size 4
3800 00BC RRAMO4 VLYNQ Remote Receive Address Map Offset 4
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Table 8-113. VLYNQ Registers (continued)
HEX ADDRESS RANGE ACRONYM REGISTER NAME
3800 00C0 RCHIPVER VLYNQ Remote Chip Version Register
3800 00C4 RAUTNGO VLYNQ Remote Auto Negotiation Register
3800 00C8 RMANNGO VLYNQ Remote Manual Negotiation Register
3800 00CC RNGOSTAT VLYNQ Remote Negotiation Status Register
3800 00D0 - 3800 00DC - Reserved
3800 00E0 RINTVEC0 VLYNQ Remote Interrupt Vector 3 - 0
3800 00E4 RINTVEC1 VYLNQ Remote Interrupt Vector 7 - 4
3800 00E8 - 3800 00FC - Reserved for future use [Remote Interrupt Vectors 8 - 31]
8.21.3 VLYNQ Electrical Data/Timing
Table 8-114. Timing Requirements for VCLK for VLYNQ
(see Figure 8-78)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tc(VCLK) Cycle time, VCLK 10 ns
2 tw(VCLKH) Pulse duration, VCLK high 0.4tc(VCLK) 0.6tc(VCLK) ns
3 tw(VCLKL) Pulse duration, VCLK low 0.4tc(VCLK) 0.6tc(VCLK) ns
4 tt(VCLK) Transition time, VCLK 0.75 ns
Figure 8-78. VCLK Timing for VLYNQ
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Table 8-115. Switching Characteristics Over Recommended Operating Conditions for Transmit Data for
the VLYNQ Module
(see Figure 8-79)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
1 td(VCLKH-TXDI) Delay time, VCLK high to VTXD[3:0] invalid [SLOW Mode] 2.25 ns
1 td(VCLKH-TXDI) Delay time, VCLK high to VTXD[3:0] invalid [FAST Mode] 0.5 ns
2 td(VCLKH-TXDV) Delay time, VCLK to VTXD[3:0] valid VCLK - 0.25 ns
Table 8-116. Timing Requirements for Receive Data for the VLYNQ Module
(see Figure 8-79)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
RTM disabled 0.2 ns
RTM enabled, RXD Flop = 0 1.3 ns
RTM enabled, RXD Flop = 1 0.8 ns
RTM enabled, RXD Flop = 2 0.4 ns
Setup time, VRXD[3:0] valid before VCLK
3 tsu(RXDV-VCLKH) RTM enabled, RXD Flop = 3 0.2 ns
high RTM enabled, RXD Flop = 4 0 ns
RTM enabled, RXD Flop = 5 -0.3 ns
RTM enabled, RXD Flop = 6 -0.5 ns
RTM enabled, RXD Flop = 7 -0.7 ns
RTM disabled 2 ns
RTM enabled, RXD Flop = 0 0.5 ns
RTM enabled, RXD Flop = 1 1.0 ns
RTM enabled, RXD Flop = 2 1.5 ns
4 th(VCLKH-RXDV) Hold time, VRXD[3:0] valid after VCLK high RTM enabled, RXD Flop = 3 2.0 ns
RTM enabled, RXD Flop = 4 2.5 ns
RTM enabled, RXD Flop = 5 3 ns
RTM enabled, RXD Flop = 6 3.5 ns
RTM enabled, RXD Flop = 7 4 ns
Figure 8-79. VLYNQ Transmit/Receive Timing
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8.22 General-Purpose Input/Output (GPIO)
8.22.1 GPIO Device-Specific Information
On the TCI6482 device, the GPIO peripheral pins GP[15:8] and GP[3:0] are muxed with the UTOPIA, PCI,
VLYNQ, and McBSP1 peripheral pins and the SYSCLK4 signal. For more detailed information on
device/peripheral configuration and the TCI6482 device pin muxing, see Section 3,Device Configuration.
8.22.2 GPIO Peripheral Register Descriptions
Table 8-117. GPIO Registers
HEX ADDRESS RANGE ACRONYM REGISTER NAME
02B0 0008 BINTEN GPIO interrupt per bank enable register
02B0 000C - Reserved
02B0 0010 DIR GPIO Direction Register
02B0 0014 OUT_DATA GPIO Output Data register
02B0 0018 SET_DATA GPIO Set Data register
02B0 001C CLR_DATA GPIO Clear Data Register
02B0 0020 IN_DATA GPIO Input Data Register
02B0 0024 SET_RIS_TRIG GPIO Set Rising Edge Interrupt Register
02B0 0028 CLR_RIS_TRIG GPIO Clear Rising Edge Interrupt Register
02B0 002C SET_FAL_TRIG GPIO Set Falling Edge Interrupt Register
02B0 0030 CLR_FAL_TRIG GPIO Clear Falling Edge Interrupt Register
02B0 008C - Reserved
02B0 0090 - 02B0 00FF - Reserved
02B0 0100 - 02B0 3FFF - Reserved
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GPOx
4
3
2
1
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8.22.3 GPIO Electrical Data/Timing
Table 8-118. Timing Requirements for GPIO Inputs(1) (2)
(see Figure 8-80)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tw(GPIH) Pulse duration, GPIx high 12P ns
2 tw(GPIL) Pulse duration, GPIx low 12P ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) The pulse width given is sufficient to generate a CPU interrupt or an EDMA event. However, if a user wants to have the DSP recognize
the GPIx changes through software polling of the GPIO register, the GPIx duration must be extended to at least 24P to allow the DSP
enough time to access the GPIO register through the CFGBUS.
Table 8-119. Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs(1)
(see Figure 8-80)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
3 tw(GPOH) Pulse duration, GPOx high 36P - 8(2) ns
4 tw(GPOL) Pulse duration, GPOx low 36P - 8(2) ns
(1) P = 1/CPU clock frequency in ns. For example, when running parts at 1000 MHz, use P = 1 ns.
(2) This parameter value should not be used as a maximum performance specification. Actual performance of back-to-back accesses of the
GPIO is dependent upon internal bus activity.
Figure 8-80. GPIO Port Timing
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8.23 Emulation Features and Capability
8.23.1 Advanced Event Triggering (AET)
The TCI6482 device supports Advanced Event Triggering (AET). This capability can be used to debug
complex problems as well as understand performance characteristics of user applications. AET provides
the following capabilities:
•Hardware Program Breakpoints: specify addresses or address ranges that can generate events such
as halting the processor or triggering the trace capture.
•Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate
events such as halting the processor or triggering the trace capture.
•Counters: count the occurrence of an event or cycles for performance monitoring.
•State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to
precisely generate events for complex sequences.
For more information on AET, see the following documents:
Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs application report (literature
number SPRA753)
Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded
Microprocessor Systems application report (literature number SPRA387)
8.23.2 Trace
The TCI6482 device supports Trace. Trace is a debug technology that provides a detailed, historical
account of application code execution, timing, and data accesses. Trace collects, compresses, and
exports debug information for analysis. Trace works in real-time and does not impact the execution of the
system.
For more information on board design guidelines for Trace Advanced Emulation, see the Emulation and
Trace Headers Technical Reference Manual (literature number SPRU655).
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TDO
TDI/TMS/TRST
1
2
34
2
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8.23.3 IEEE 1149.1 JTAG
8.23.3.1 JTAG Device-Specific Information
8.23.3.1.1 IEEE 1149.1 JTAG Compatibility Statement
For maximum reliability, the TCI6482 DSP includes an internal pulldown (IPD) on the TRST pin to ensure
that TRST will always be asserted upon power up and the DSP's internal emulation logic will always be
properly initialized when this pin is not routed out. JTAG controllers from Texas Instruments actively drive
TRST high. However, some third-party JTAG controllers may not drive TRST high but expect the use of
an external pullup resistor on TRST. When using this type of JTAG controller, assert TRST to initialize the
DSP after powerup and externally drive TRST high before attempting any emulation or boundary scan
operations.
8.23.4 JTAG Peripheral Register Descriptions
8.23.5 JTAG Electrical Data/Timing
Table 8-120. Timing Requirements for JTAG Test Port
(see Figure 8-81)-850
A-1000/-1000
NO. UNIT
-1200
MIN MAX
1 tc(TCK) Cycle time, TCK 35 ns
3 tsu(TDIV-TCKH) Setup time, TDI/TMS/TRST valid before TCK high 6 ns
4 th(TCKH-TDIV) Hold time, TDI/TMS/TRST valid after TCK high 9 ns
Table 8-121. Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port
(see Figure 8-81)-850
A-1000/-1000
NO. PARAMETER UNIT
-1200
MIN MAX
2 td(TCKL-TDOV) Delay time, TCK low to TDO valid -3 11 ns
Figure 8-81. JTAG Test-Port Timing
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9 Mechanical Data
9.1 Thermal Data
Table 9-1 shows the thermal resistance characteristics for the PBGA - CTZ/GTZ/ZTZ mechanical
package.
Table 9-1. Thermal Resistance Characteristics (S-PBGA Package) [CTZ/GTZ/ZTZ]
AIR FLOW
NO. °C/W (m/s)(1)
1 RΘJC Junction-to-case 1.45 N/A
2 RΘJB Junction-to-board 8.34 N/A
3 16.1 0.00
4 13.0 1.0
RΘJA Junction-to-free air
5 11.9 2.0
6 10.7 3.0
0.37 0.00
0.89 1.0
7 PsiJT Junction-to-package top 1.01 1.5
1.17 3.00
7.6 0.00
6.7 1.0
8 PsiJB Junction-to-board 6.4 1.5
5.8 3.00
(1) m/s = meters per second
9.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
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