BCP53T1 Series Preferred Devices PNP Silicon Epitaxial Transistors This PNP Silicon Epitaxial transistor is designed for use in audio amplifier applications. The device is housed in the SOT-223 package which is designed for medium power surface mount applications. * High Current: 1.5 Amps * NPN Complement is BCP56 * The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die * Available in 12 mm Tape and Reel Use BCP53T1 to order the 7 inch/1000 unit reel. Use BCP53T3 to order the 13 inch/4000 unit reel. * Device Marking: BCP53T1 = AH BCP53-10T1 = AH-10 BCP53-16T1 = AH-16 http://onsemi.com MEDIUM POWER HIGH CURRENT SURFACE MOUNT PNP TRANSISTORS COLLECTOR 2,4 BASE 1 MAXIMUM RATINGS (TC = 25C unless otherwise noted) Rating EMITTER 3 Symbol Value Unit Collector-Emitter Voltage VCEO -80 Vdc Collector-Base Voltage VCBO -100 Vdc Emitter-Base Voltage VEBO -5.0 Vdc Collector Current IC 1.5 Adc Total Power Dissipation @ TA = 25C (Note 1.) Derate above 25C PD Operating and Storage Temperature Range 4 1 MARKING DIAGRAM 2 AHxxx 3 1.5 12 Watts mW/C TJ, Tstg -65 to +150 C Symbol Max Unit RJA 83.3 C/W SOT-223 CASE 318E STYLE 1 AHxxx = Device Code xxx = -10 or -16 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction to Ambient (surface mounted) Lead Temperature for Soldering, 0.0625 from case Time in Solder Bath TL C Sec 260 10 1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in. ORDERING INFORMATION Device Package Shipping BCP53T1 SOT-223 1000/Tape & Reel BCP53T3 SOT-223 4000/Tape & Reel BCP53-10T1 SOT-223 1000/Tape & Reel BCP53-10T3 SOT-223 4000/Tape & Reel BCP53-16T1 SOT-223 1000/Tape & Reel BCP53-16T3 SOT-223 4000/Tape & Reel Preferred devices are recommended choices for future use and best overall value. Semiconductor Components Industries, LLC, 2000 November, 2000 - Rev. 2 1 Publication Order Number: BCP53T1/D BCP53T1 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristics Symbol Min Typ Max Unit Collector-Base Breakdown Voltage (IC = -100 Adc, IE = 0) V(BR)CBO -100 - - Vdc Collector-Emitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) V(BR)CEO -80 - - Vdc Collector-Emitter Breakdown Voltage (IC = -100 Adc, RBE = 1.0 kohm) V(BR)CER -100 - - Vdc Emitter-Base Breakdown Voltage (IE = -10 Adc, IC = 0) V(BR)EBO -5.0 - - Vdc Collector-Base Cutoff Current (VCB = -30 Vdc, IE = 0) ICBO - - -100 nAdc Emitter-Base Cutoff Current (VEB = -5.0 Vdc, IC = 0) IEBO - - -10 Adc DC Current Gain (IC = -5.0 mAdc, VCE = -2.0 Vdc) All Part Types (IC = -150 mAdc, VCE = -2.0 Vdc) BCP53T1 BCP53-10T1 BCP53-16T1 (IC = -500 mAdc, VCE = -2.0 Vdc) All Part Types hFE 25 40 63 100 25 - - - - - - 250 160 250 - - Collector-Emitter Saturation Voltage (IC = -500 mAdc, IB = -50 mAdc) VCE(sat) - - -0.5 Vdc Base-Emitter On Voltage (IC = -500 mAdc, VCE = -2.0 Vdc) VBE(on) - - -1.0 Vdc fT - 50 - MHz OFF CHARACTERISTICS ON CHARACTERISTICS DYNAMIC CHARACTERISTICS Current-Gain - Bandwidth Product (IC = -10 mAdc, VCE = -5.0 Vdc, f = 35 MHz) hFE , DC CURRENT GAIN f T , CURRENT GAIN BANDWIDTH PRODUCT (MHz) TYPICAL ELECTRICAL CHARACTERISTICS 500 VCE = 2 V 200 100 50 20 1 3 5 10 30 50 100 IC, COLLECTOR CURRENT (mA) 300 500 1000 500 300 VCE = 2 V 100 50 20 1 Figure 1. DC Current Gain Figure 2. Current Gain Bandwidth Product 1 V(BE)sat @ IC/IB = 10 C, CAPACITANCE (pF) V, VOLTAGE (VOLTS) 0.8 V(BE)on @ VCE = 2 V 0.6 0.4 0.2 V(CE)sat @ IC/IB = 10 0 1 10 1000 10 100 IC, COLLECTOR CURRENT (mA) 100 120 110 100 90 80 70 60 50 40 30 20 10 0 1000 Cib Cob 0 2 4 6 8 10 12 14 IC, COLLECTOR CURRENT (mA) V, VOLTAGE (VOLTS) Figure 3. Saturation and "ON" Voltages Figure 4. Capacitances http://onsemi.com 2 16 18 20 BCP53T1 Series INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE POWER DISSIPATION into the equation for an ambient temperature TA of 25C, The power dissipation of the SOT-223 is a function of the one can calculate the power dissipation of the device which input pad size. These can vary from the minimum pad size in this case is 1.5 watts. for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is PD = 150C - 25C = 1.5 watts determined by TJ(max), the maximum rated junction 83.3C/W temperature of the die, RJA, the thermal resistance from The 83.3C/W for the SOT-223 package assumes the the device junction to ambient; and the operating recommended collector pad area of 965 sq. mils on a glass temperature, TA. Using the values provided on the data epoxy printed circuit board to achieve a power dissipation sheet for the SOT-223 package, PD can be calculated as of 1.5 watts. If space is at a premium, a more realistic follows. approach is to use the device at a PD of 833 mW using the TJ(max) - TA PD = footprint shown. Using a board material such as Thermal RJA Clad, a power dissipation of 1.6 watts can be achieved The values for the equation are found in the maximum using the same footprint. ratings table on the data sheet. Substituting these values MOUNTING PRECAUTIONS * The soldering temperature and time should not exceed 260C for more than 10 seconds. * When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the interface between the board and the package. With the total design. The footprint for the semiconductor packages correct pad geometry, the packages will self align when must be the correct size to insure proper solder connection subjected to a solder reflow process. 0.15 3.8 0.079 2.0 SOT-223 0.091 2.3 0.248 6.3 0.091 2.3 0.079 2.0 0.059 1.5 0.059 1.5 http://onsemi.com 3 0.059 1.5 inches mm BCP53T1 Series PACKAGE DIMENSIONS SOT-223 CASE 318E-04 ISSUE K A F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 4 S 1 2 3 B D L G J C 0.08 (0003) M H K INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0 10 S 0.264 0.287 STYLE 1: PIN 1. 2. 3. 4. MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0 10 6.70 7.30 BASE COLLECTOR EMITTER COLLECTOR ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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