〇Product structure : Silicon monolithic integrated circuit. 〇This product has no designed protection against radioactive rays.
〇This product does not include laser transmitter. 〇This product does not include optical load.
〇This product includes Photo detector, ( Photo Diode ) inside of it.
. 1/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
TSZ22111 • 14 • 001
www.rohm.com
Sensor for Heart Rate Monitor ICs
Optical Sensor for Heart Rate Monitor IC
BH1790GLC
General Description
BH1790GLC is optical sensor for heart rate monitor IC in
which LED driver and green light detection photo-diode
are incorporated. This device drives LED and provides
the intensity of light reflected from body.
LED brightness can be adjusted by LED driver current
and light emitting period. The photodiode having the
high sensitivity for green light, excellent wavelength
selectivity and excellent lrcut characteristics achieves
accurate pulse wave detection.
Features
Green filter with excellent wavelength selectivity.
Built-in Ircut Filter.
LED driver with current selection.
Correspond to 1.8V I2C Interface.
Applications
Wearable device, smart phone, Tablet PC.
Key Specifications
VCC1 Voltage Range: 2.5V to 3.6V
VCC2 Voltage Range: 1.7V to 3.6V
Current Consumption: 200μA(Typ)
Standby Mode Current: 0.8μA(Typ)
Operating Temperature Range: -20°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
WLGA010V28 2.80mm x 2.80mm x 1.00mm
Typical Application Circuit
WLGA010V28
Micro
Controller
ADC
control I2C
LED
control
OSCPOR
VCC1
GND
LED1
SDA
LED2
VCC2
SCL
ADC
IRCUT
GREEN
LED
Driver
TEST1
LED
Driver
TEST2
TEST3
Datashee
t
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications ........................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Description ................................................................................................................................................................................ 3
Block Diagram ................................................................................................................................................................................ 4
Description of Blocks ...................................................................................................................................................................... 4
Absolute Maximum Ratings ............................................................................................................................................................ 5
Thermal Resistance ........................................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 6
Electrical Characteristics................................................................................................................................................................. 6
I2C Bus Timing Characteristics ....................................................................................................................................................... 7
Typical Performance Curves ........................................................................................................................................................... 8
Figure 1. Sensitivity Ratio vs Wavelength ................................................................................................................................... 8
Figure 2. Sensor out vs Temperature .......................................................................................................................................... 8
Figure 3. Ratio vs Angle .............................................................................................................................................................. 8
Figure 4. Ratio vs Angle .............................................................................................................................................................. 8
Measurement Sequence ................................................................................................................................................................. 8
Register Map ................................................................................................................................................................................ 11
Power Supply Sequence............................................................................................................................................................... 14
I2C Bus Communication ................................................................................................................................................................ 15
Application Example ..................................................................................................................................................................... 16
I/O equivalent circuit ..................................................................................................................................................................... 17
Operational Notes ......................................................................................................................................................................... 18
Ordering information ..................................................................................................................................................................... 20
Marking Diagram .......................................................................................................................................................................... 20
Optical design for the device ......................................................................................................................................................... 20
Physical Dimension, Tape and Reel Information ........................................................................................................................... 21
Revision History ............................................................................................................................................................................ 22
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Pin Configuration
Pin Description
Pin No.
Pin Name
Function
1
VCC1
Power supply terminal
2
GND
GND terminal
3
LED1
LED1 driver output
4
LED2
LED2 driver output
5
TEST1
TEST1 terminal(Note 1)
6
TEST3
TEST3 terminal(Note 4)
7
TEST2
TEST2 terminal(Note 3)
8
VCC2
IO Power supply terminal(Note 2)
9
SDA
I2C bus interface SDA terminal
10
SCL
I2C bus interface SCL terminal
(Note 1) connect to GND.
(Note 2) connect to I2C Pull up power supply.
(Note 3) connect to VCC2.
(Note 4) no connect.
(TOP VIEW)
4
LED2
10
SCL
9
SDA
8
VCC2
7
TEST2
6
TEST3
5
TEST1
3
LED1
2
GND
1
VCC1
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
www.rohm.com
TSZ22111 • 15 • 001
BH1790GLC
Block Diagram
Description of Blocks
・IRCUT
This filter passes visible light and blocks infrared light.
・GREEN
Green color pass filter
・PD
Photodiodes (PD) convert light into current.
・LED Driver
LED driver circuit
・ADC
AD converter
・OSC
Internal oscillator generates clock for internal logic.
・POR
Power on reset
・I2C
I2C bus interface
・ADC control
AD converter control block
・LED control
LED driver control block
ADC
control I2C
LED
control
OSCPOR
VCC1
GND
LED1
SDA
LED2
VCC2
SCL
ADC
IRCUT
GREEN
LED
Driver
TEST1
LED
Driver
TEST2
TEST3
PD
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VCCMAX
4.5
V
LOGIC terminal Voltage
VIN
-0.3 to +4.5
V
LED terminal Voltage
VLED
7
V
Operating Temperature
TOPR
-20 to +85
°C
Storage Temperature
TSTG
-40 to +100
°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s
2s2p
WLGA010V28
Junction to Ambient
θJA
398.4
218.3
°C/W
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
70.0mm x 70.0mm x 1.6mmt
Top
Copper Pattern
Thickness
Footprints and Traces
35μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
70.0mm x 70.0mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
35μm
70.0mm x 70.0mm
35μm
70.0mm x 70.0mm
35μm
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Recommended Operating Conditions (Ta= -20°C to +85°C)
Parameter
Symbol
Min
Typ
Max
Unit
VCC1 Supply Voltage
VCC1
2.5
3.0
3.6
V
VCC2 Supply Voltage
VCC2
1.7
3.0
3.6
V
LED1, LED2 Terminal Voltage
VLED
0.7
-
5.5
V
Electrical Characteristics
(Unless otherwise specified VCC1=3.0V, VCC2=3.0V, Ta=25°C, RCYCLE=32Hz Mode)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Supply Current
ICC1
-
200
400
µA
LED no emitting
Supply Current during LED current
drive
ICC2
-
1.6
3.2
mA
LED emitting
LED_CURRENT=10mA Mode
Standby Mode Current
ICC3
-
0.8
1.5
µA
No input light
Green Data Count Value
DGREEN
1750
2700
3650
count
EV=10µW/cm2(Note1)
Dark Count Value
S0_0
-
0
100
count
No input light
Measurement Time
TINT
-
-
28
ms
LED Emitting Time
twlLED
-
300
410
µs
LED Output Current
ILED
5
10
15
mA
LED terminal voltage = 1.0V
LED_CURRENT=10mA Mode
LED Off Leakage Current
IOFF
-
0
1
µA
LED terminal voltage = 5.5V
OSC Cycle
tOSC
-
1.4
1.9
µs
SCL SDA Input ‘H’ Voltage
VIH
1.26
-
-
V
SCL SDA Input ‘L’ Voltage
VIL
-
-
0.54
V
SCL SDA Input ‘H/L’ Current
IIHL
-10
-
10
µA
I2C SDA Output ‘L’ Voltage
VOL
0
-
0.4
V
IOL = +3mA
(Note 1) Green LED(λp=527nm) is used as optical source.
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
I2C Bus Timing Characteristics (Unless otherwise specified VCC1=3.0V, VCC2=3.0V, Ta=25°C)
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
I2C SCL Clock frequency
fSCL
0
-
400
kHz
I2C ‘L’ Period of the SCL Clock
tLOW
1.3
-
-
μs
I2C ‘H’ Period of the SCL Clock
tHIGH
0.6
-
-
μs
I2C START Condition Setup Time
tSU;STA
0.6
-
-
μs
I2C Hold Time (Repeated)
STARTCondition
tHD;STA
0.6
-
-
μs
I2C Data Setup Time
tSU;DAT
100
-
-
ns
I2C Data Hold Time
tHD;DAT
0
-
-
μs
I2C Setup Time for STOP Condition
tSU;STO
0.6
-
-
μs
I2C Bus Free Time between a STOP
and START Condition
tBUF
1.3
-
-
μs
SDA
SCL
tHD;STA
tLOW
tHD;DAT
tSU;DAT
tHIGH
tSU;STA
tHD;STA
tSU;STO
tBUF
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Typical Performance Curves
Figure 1. Sensitivity Ratio vs Wavelength
(“Green Spectral Response”)
Figure 2. Sensor out vs Temperature
(“Temperature Dependency of Dark (0lx) Sensor out ”,
MEAS_CONTROL1(41h)=82h)
Figure 3. Ratio vs Angle
(“Directional Characteristics 1”)
Figure 4. Ratio vs Angle
(“Directional Characteristics 2)
0.0
0.2
0.4
0.6
0.8
1.0
400 500 600 700 800 900 1000 1100
Wavelength[nm]
Sensitivity Ratio
0
20
40
60
80
100
-40 -20 0 20 40 60 80 100
Ta[℃]
Sensor out[Count]
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-90 -60 -30 0 30 60 90
Angle[deg]
Ratio
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-90 -60 -30 0 30 60 90
Angle[deg]
Ratio
-
+
-
+
1pin
-
+
-
+
1pin
9/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Measurement Sequence
1. Power On
2. Start measurement by writing the parameters of address 41h to 43h.
3. Read data in order of address 54h to 57h after measurement complementation.
Measurement finished within measurement time(Note 1).
Reading the data of address 57h restart measurement.
4. After restart of measurement, repeat step3 then measurement data can be read.
5. Write “SWRESET=1” (Address 40h), when stop measurement or change parameter.
Repeat from step 2, when start measurement again.
6. Parameter refreshment is recommended. Write parameter of address 41h to 43h regularly after reading data.
(Note 1) Measurement time is changed by “RCYCLE” (Address 41h).
Power On
Over
Power on time
No
Write : 0x418X
Write : 0x42XX
Write : 0x4301
Over
Measurement Time
No
Read : 0x5400
Read : 0x5500
Read : 0x5600
Read : 0x5700
Set parameter in order of address 41h, 42h and 43h.
1. Wait measurement complementation.
2. Read data in order of address 54h, 55h, 56h and 57h
after waiting more than measurement time TINT.
Set parameter more than power on time t2
(Note 2)
after power on.
(Note 2)
Refer to “Power Supply Sequence”.
Yes
Yes
10/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
[Example : Measurement Sequence] LED_LIGHT_FREQ=0, RCYCLE=0x2, Read cycle=32Hz
[Example : Parameter Refreshment] Changing register value is prohibited.
Write register value after read data.
[Example : Parameter Change] Register value can be changed.
Write register value after writing register “SWRESET=1”
Power Supply
Register Access Write
41-43h
1/32 sec
Read
54-57h
1/32 sec
Read
54-57h
VCC voltage
Power Supply
Register Access
1/32 sec
Read
54-57h
1/32 sec
Read
54-57h
Write
41-43h
Read
54-57h
VCC voltage
Power Supply
Register Access
1/32 sec 1/32 sec
Read
54-57h
Write
40-43h
Read
54-57h
VCC voltage
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Register Map
Name
Address
R/W
Default
Function
MANUFACTURER ID
0x0F/0x92
R
0xE0
Manufacturer ID
PART ID
0x10
R
0x0D
Part ID
RESET
0x40
RW
0x00
SWRESET
MEAS_CONTROL1
0x41
RW
0x00
Measurement setting Control
MEAS_CONTROL2
0x42
RW
0x00
Measurement setting Control
MEAS_START
0x43
RW
0x00
Start Measurement
DATAOUT_LEDOFF
0x54/0x55
R
0xFF
Measurement Data (LED OFF)
DATAOUT_LEDON
0x56/0x57
R
0xFF
Measurement Data (LED ON)
○ MANUFACTOR ID ( 0x0F/0x92h )
Register
R/W
Address
Function
MANUFACTURER ID
R
0x0F/0x92
Manufacturer ID : 0xE0
○ PART ID ( 0x10h )
Register
R/W
Address
Function
PART ID
R
0x10
Part ID : 0x0D
○ RESET ( 0x40h )
Register
R/W
Address
Function
RESET
R/W
0x40
Reset
default value 0x00
Bit
Name
Function
7
SWRESET
1 : Software reset is performed
6:0
Reserved
Write “0”
<SWRESET>
Reset process is performed when writing SWRESET=1.
“1” is not written in register “SWRESET”, Read value is always “0”
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
○ MEAS_CONTROL1 ( 0x41h )
Register
R/W
Address
Function
MEAS_CONTROL1
R/W
0x41
System control setting
default value 0x00
Bit
Name
Function
7
RDY
0 : Prohibited
1 : OSC block is active
6:3
Reserved
Write “0”
2
LED_LIGHTING_FREQ
Select LED emitting frequency
0 : 128Hz Mode, 1 : 64Hz Mode
1:0
RCYCLE
Select Data reading frequency
00 : Prohibited, 01 : 64Hz Mode, 10 : 32Hz Mode, 11 : Prohibited
<RDY>
OSC block is active at “RDY=1”.
OSC block is supply clock to internal block.
<LED_LIGHTLING_FREQ>
Select LED emitting frequency.
<RCYCLE>
Select Measurement time corresponding to data reading frequency. Measurement time depends on OSC cycle.
64Hz Mode : 7370 x tosc ms
32Hz Mode : 14740 x tosc ms
○ MEAS_CONTROL2 ( 0x42h )
Register
R/W
Address
Function
MEAS_CONTROL2
R/W
0x42
Measurement control setting
default value 0x00
Bit
Name
Function
7:6
LED_EN
Select LED driver mode
5
LED_ON_TIME
Select LED emitting time
0 : 0.3ms Mode, 1 : 0.6ms Mode
4
Reserved
Write “0”
3:0
LED_CURRENT
Select LED driver current
<LED_EN>
Select LED driver mode.
LED_EN[1:0]
LED1
LED2
00
(Note1)
(Note1)
01
Constant
Light Emission
(Note1)
10
(Note1)
Constant
Light Emission
11
Constant
Light Emission
Constant
Light Emission
(Note1) Pulsed light emit after starting measurement(Write “MEAS_ST=1” or Read address 57h).
No light emit after measurement completion.
13/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
<LED_ON_TIME>
Select LED emitting time.
LED emitting time depends on by OSC cycle.
0.3ms Mode : 216 x tosc μs
0.6ms Mode : 432 x tosc μs
<LED_CURRENT>
Select LED lighting current.
○ MEAS_START ( 0x43h )
Register
R/W
Address
Function
MEAS_START
R/W
0x43
Measurement start
default value 0x00
Bit
Name
Function
7:1
Reserved
Write ”0”
0
MEAS_ST
Flag of start measurement
0 : Prohibited, 1 : Measurement start
<MEAS_ST>
Start measurement by writing “MEAS_ST=1” after writing “RDY=1”.
Measurement doesn’t restart if writing “MEAS_ST=1” after start measurement.
When stop measurement, write “SWRESET=1” without writing “MEAS_ST=0”.
○ DATAOUT ( 0x54/0x55, 0x56/0x57h )
Register
R/W
Address
Function
DATAOUT_LEDOFF data
R
0x54
lower 8bit
0x55
upper 8bit
DATAOUT_LEDON data
R
0x56
lower 8bit
0x57
upper 8bit
default value 0xFFFF
DATAOUT_LEDOFF data : Green Data Count Value when LED no emitting
DATAOUT_LEDON data : Green Data Count Value when LED emitting
DATA value is MSB first.
Read data in order of address 0x54h to 0x57 after waiting measurement time.
Measurement is restarted by reading address 0x57.
LED_CURRENT[3:0]
Current Mode
0x0
0mA Mode
0x1 to 0x7
Prohibited
0x8
1mA Mode
0x9
2mA Mode
0xA
3mA Mode
0xB
6mA Mode
0xC
10mA Mode
0xD
20mA Mode
0xE
30mA Mode
0xF
60mA Mode
14/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Explanation of Software Reset Command
All registers are reset by Software reset command.
Power Supply Sequence
Supply power to VCC1 with VCC2, or after supply power to VCC2.
This IC has POR function triggered by VCC1 voltage.
All registers are reset when power supply to VCC1 by POR circuit.
Please note the below behavior when application design.
1.Power on time VCC1 : t1
"t1" should be more than 0ms.
2.Power on time : t2
"t2" should be more than 2ms. The IC becomes active state 2ms after VCC1 voltage goes beyond 2.5V.
3.Power off time : t3
"t3" should be more than 1ms.
VCC1 voltage should keep being less than 0.4V for more than 1ms, before supplying power to VCC1.
* "active state" means the state that This IC operates correctly.
Once VCC1 goes below 2.5V, power supply sequence should follow below sequence.
0.4V
VCC1
2.5V
active
Undefined Behavior
t2
Undefined Behavior
t3
active
t2
VCC2
1.7V
t1
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 15 • 001
BH1790GLC
I2C Bus Communication
1. Slave address "1011011"
2. Main write format
(1) Indicate register address
ST
Slave Address
W
0
ACK
Indicate register address
ACK
SP
(2) Write to data register after indicating register address
ST
Slave Address
W
0
ACK
Indicate register address
ACK
Data specified at register
address field
ACK
・・・・・・
ACK
Data specified at register
address field + N
ACK
SP
This IC continues to receive data with address increments until master issues stop condition.
Write cycle is 40h - 41h - 42h - 43h …55h - 56h - 57h …FFh - 00h - 01h …3Fh - 40h……
All registers are included in write-chain.
Ex) If register address field is 41h, then this IC writes data like seeing in below.
41h - 42h - 43h ……… 3Eh - 3Fh - 40h……. It is continued until master issues stop condition.
*There is no registers in address 00h - 0Eh, 11h - 3Fh, 44h - 53h, 58h - 91h and 93h - FFh, but it is necessary to access
these registers when writing some data with address increments. It is recommended to access 40h - 43h individually.
3. Main read format
(1) Read data after indicate register address (Master issues restart condition)
ST
Slave Address
W
0
ACK
Indicate register address
ACK
ST
Slave Address
R
1
ACK
Data specified at register address
field
ACK
Data specified at register
address field + 1
ACK
・・・・・・
ACK
Data specified at register
address field + N
NACK
SP
(2) Case of read data
ST
Slave Address
R
1
ACK
Data specified at register address
field
ACK
Data specified at register
address field + 1
ACK
・・・・・・
ACK
Data specified at register address
field + N
NACK
SP
This IC continue to output data from specified address field until master issues stop condition.
Read cycle is 40h - 41h - 42h - 43h …55h - 56h - 57h …FFh - 00h - 01h …3Fh - 40h……
All registers are included in read-chain.
Ex) If register address field is 54h, then this IC outputs data like seeing in below.
54h - 55h - 56h ……FFh - 00h - 01h…3Fh - 40h… It is continued until master issues stop condition.
*There is no registers in address 00h - 0Eh, 11h - 3Fh, 44h - 53h, 58h - 91h and 93h - FFh, but it is necessary to access
these registers when reading data with address increments. It is recommended to access 41h - 43h, 54h - 57h, 0Fh - 10h
and 92h individually.
*This IC operates as I2C bus slave device.
*Please refer formality I2C bus specification of NXP semiconducto
from master to slave
from slave to master
17/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
I/O equivalent circuit
PIN No.
Pin Name
Equivalent Circuit Diagram
1
VCC1
2
GND
3
LED1
4
LED2
5
TEST1
6
TEST3
7
TEST2
8
VCC2
9
SDA
10
SCL
VCC2
VCC2
VCC2
VCC2
VCC2
VCC1
VCC1
VCC1
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TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
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TSZ22111 • 15 • 001
BH1790GLC
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
19/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
www.rohm.com
TSZ22111 • 15 • 001
BH1790GLC
Operational Notes – continued
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure xx. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
N
N
P
+
P
N
N
P
+
P Substrate
GND
N
P
+
N
N
P
+
N
P
P Substrate
GND
GND
Parasitic
Elements
Pin A
Pin A
Pin B
Pin B
B
C
E
Parasitic
Elements
GND
Parasitic
Elements
C
B
E
Transistor
(
NPN
)
Resistor
N Region
close
-
by
Parasitic
Elements
20/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
www.rohm.com
TSZ22111 • 15 • 001
BH1790GLC
Ordering information
B
H
1
7
9
0
G
L
C
-
E 2
Part Number
Package
GLC: WLGA010V28
Packaging and forming specification
E2: Embossed tape and real
Marking Diagram
Optical design for the device
sensitive area 0.6 x 0.6mm
1.4mm
2.8mm
1.4mm
2.8mm
WLGA010V28(TOP VIEW)
Part Number Marking
LOT Number
F
A
22/22
TSZ02201-0M3M0F616010-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
1.Feb 2017 Rev.004
www.rohm.com
TSZ22111 • 15 • 001
BH1790GLC
Revision History
Date
Revision
Changes
01.Feb.2016
001
New Release
14.Mar.2016
002
modify Typical Application Circuit
modify Pin Description
modify Description of Blocks
modify Electrical Characteristics
modify Measurement Sequence
modify Application Example
9.June.2016
003
Modify Thermal Resistance
1.Feb.2017
004
Modify Title
Modify Annotation of Electrical Characteristics
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
