PC852XJ0000F
Series
PC853XJ0000F
Series
1. Recognized by UL1577, file No. E64380 (as model
No. PC852/PC853)
2. Approved by VDE, DIN EN60747-5-2(
*
) (only for
PC852XJ0000F series as an option), file No.
40008087 (as model No. PC852)
3. Package resin : UL flammability grade (94V-0)
(
*
)DIN EN60747-5-2 : successor standard of DIN VDE0884
■ Features
■ Agency approvals/Compliance
1. Telephone line interface/isolation
2. Interface to power supply circuit
3. Controller for SSRs, DC motors
■ Applications
DIP 4pin Darlington Phototransistor Ouput,
High Collector-emitter Voltage
Photocoupler
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. High collector-emitter voltage (VCEO : 350V)
4. Durlington phototransistor output (CTR : MIN. 1 000%
at IF=1mA, VCE=2V)
5. Large collector power disspation : PC853XJ0000F
(PC : 300mW)
6. High isolation voltage between input and output
(Viso(rms) : 5kV)
7. Lead-free and RoHS directive compliant
■ Description
PC852XJ0000F Series/PC853XJ0000F Series con-
tains an IRED optically coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in SMT gullw-
ing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 350V and CTR is MIN.
1 000% at input current of 1mA.
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
Date Jun. 30. 2005
© SHARP Corporation
■ Internal Connection Diagram
Anode
Cathode
Emitter
Collector
11
3
4
5
2
4
3
2
■ Outline Dimensions
● PC852XJ0000F Series
(Unit : mm)
1. Through-Hole [ex. PC852XJ0000F]
4. SMT Gullwing Lead-Form (VDE option)
[ex. PC852XPYJ00F]
Product mass : approx. 0.22gProduct mass : approx. 0.22g
Plating material : SnCu (Cu : TYP. 2%)
Product mass : approx. 0.23gProduct mass : approx. 0.23g
PC852
Factory identification mark
Date code
4.58±0.5
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.5
Anode mark
7.62±0.3 4.58±0.5
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
0.26±0.1
1
2
4
3
0.6±0.2
1.2±0.3
6.5±0.5
7.62±0.3
0.26±0.1
4.58±0.5
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.3
2.54
±0.25
4
3
Anode mark Factory identification mark
Date code
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.35±0.25
1
2
4
PC852
VDE identification mark
SHARP mark "S"
PC852XJ0000F Series/PC853XJ0000F Series
2. Through-Hole (VDE option) [ex. PC852XYJ000F]
PC852
4
Factory identification mark
Date code
VDE identification mark
4.58±0.5
0.6±0.2
1.2±0.3
2.54
±0.25
6.5±0.5
Anode mark
7.62±0.3 4.58±0.5
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
0.26±0.1
1
2
4
3
SHARP mark "S"
3. SMT Gullwing Lead-Form [ex. PC852XIJ000F]
0.6±0.2
1.2±0.3
6.5±0.5
7.62±0.3
0.26±0.1
4.58±0.5
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.3
2.54±0.25
4
3
Anode mark Factory identification mark
Date code
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.35±0.25
1
2PC852
Sheet No.: D2-A04002EN
3
(Unit : mm)
PC852XJ0000F Series/PC853XJ0000F Series
1. Through-Hole [ex. PC853XJ0000F]
PC853
Factory identification mark
Date code
4.58±0.5
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.5
Anode mark
7.62±0.3 4.58±0.5
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
0.26±0.1
1
2
4
3
2. SMT Gullwing Lead-Form [ex. PC853XIJ000F]
Product mass : approx. 0.22gProduct mass : approx. 0.23g
0.6±0.2
1.2±0.3
6.5±0.5
7.62±0.3
0.26±0.1
4.58±0.5
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.3
2.54±0.25
4
3
Anode mark Factory identification mark
Date code
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.35±0.25
1
2PC853
● PC853XJ0000F Series
Sheet No.: D2-A04002EN
Date code (2 digit)
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
4
repeats in a 20 year cycle
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
Rank mark
There is no rank mark indicator.
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Reverse voltage
Terminal capacitance
Collector dark current
Transfer
charac-
teristics
Collector current
Collector-emitter saturation voltage
Collector-emitter breakdown voltage
Isolation resistance
Cut-off frequency
MIN.
−
−
−
−
10
−
5×1010
1
−
TYP.
1.2
−
30
−
−
40
−
1×1011
7
20
MAX.
1.4
10
250
200
150
−
1.2
−
−
100
Unit
V
V
µA
pF
nA
mA
V
Ω
µs
µs
Symbol
VF
IR
Ct
ICEO
BVCEO
IC
VCE (sat)
RISO
tf
fC
Response time Rise time
Fall time
Input
Output
IF=10mA
VR=4V
V=0, f=1kHz
VCE=200V, IF=0
IC=0.1mA, IF=0
IF=1mA, VCE=2V
DC500V, 40 to 60%RH
VCE=2V, IC=20mA, RL=100Ω−100 300
kHz
tr
VCE=2V, IC=20mA, RL=100Ω, −3dB
Floating capacitance −0.6 1.0CfpFV=0, f=1MHz
IF=20mA, IC=100mA
350
(Ta=25˚C)
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f=60Hz
*3 For 10s
Rating
PC852XJ0000F PC853XJ0000F
50
1
70
Reverse voltage VVR6
350
0.1
150
150
200
300
320
−30 to +100
−55 to +125
260
5.0 kV
5
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
■ Model Line-up
Lead Form
Package
DIN EN60747-5-2
Model No.
Sleeve
100pcs/sleeve
Through-Hole
-
PC852XJ0000F
Approved
PC852XYJ000F
-
PC852XIJ000F
Taping
2 000pcs/reel
SMT Gullwing
-
PC852XPJ000F
Approved
PC852XPYJ00F
Model No.
Lead Form
Package
DIN EN60747-5-2
PC853XJ0000F
Through-Hole
-
PC853XIJ000F
100pcs/sleeve
Sleeve
-
PC853XPJ000F
SMT Gullwing
Taping
2 000pcs/reel
-
6
Please contact a local SHARP sales representative to inquire about production status.
PC852XJ0000F Series/PC853XJ0000F Series
● PC852XJ0000F Series
● PC853XJ0000F Series
Sheet No.: D2-A04002EN
Fig.4 Total Power Dissipation vs. Ambient
Temperature
0
−30
10
0255075100 125
20
30
40
50
60
Ambient temperature Ta (˚C)
Forward current IF (mA)
Fig.1 Forward Current vs. Ambient
Temperature
7
PC852XJ0000F Series/PC853XJ0000F Series
100
200
300
320
400
500
0
Ambient Temperature Ta (˚C)
Total Power dissipation Ptot (mW)
0255075100 125−30
PC853XJ0000F
PC852XJ0000F
Fig.5 Peak Forward Current vs. Duty Ratio
Duty ratio
Pulse width≤100µs
Ta=25˚C
10
100
10−310−210−1
Peak forward current IFM (mA)
1
10 000
1 000
Fig.3-b Collector Power Dissipation vs.
Ambient Temperature
0
100
350
50
150
250
200
300
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
−30 0 25 50 75 100 125
(PC853XJ0000F)
0
0 125
100
200
50
150
25 50 75 100−30
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
(PC852XJ0000F)
Fig.3-a Collector Power Dissipation vs.
Ambient Temperature
Diode power dissipation P (mW)
Ambient temperature Ta (˚C)
0
100
80
70
60
40
20
−30 0 25 50 55 75 100 125
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
Sheet No.: D2-A04002EN
50
0
100
150
020406080100
Relative current transfer ratio (%)
Ambient Temperature Ta (˚C)
IF=1mA
VCE=2V
−30
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
8
Fig.7-b Current Transfer Ratio vs. Forward
Current
0
0
100
200
12345
0.5mA
1mA
1.5mA
2mA
2.5mA
3mA
5mA
Collector current IC (mA)
Collector-emitter voltage VCE (V)
PC (MAX.)
Ta=25˚C
IF=10mA
(PC852XJ0000F)
Fig.8-a Collector Current vs. Collector-
emitter Voltage
0
0.1
Current transfer ratio CTR (%)
101
Forward current IF (mA)
VCE=2V
Ta=25˚C
5 000
4 000
3 000
2 000
1 000
(PC853XJ0000F)
Fig.8-b Collector Current vs. Collector-
emitter Voltage
0.5mA
1mA
1.5mA
2mA
2.5mA
3mA
5mA
PC (MAX.)
IF=10mA
0
0
100
200
12345
Collector current IC (mA)
Collector-emitter voltage VCE (V)
Ta=25˚C
(PC853XJ0000F)
PC852XJ0000F Series/PC853XJ0000F Series
0
0.1
Current transfer ratio CTR (%)
101
Forward current IF (mA)
VCE=2V
Ta=25˚C
5 000
4 000
3 000
2 000
1 000
(PC852XJ0000F)
Fig.7-a Current Transfer Ratio vs. Forward
Current
Fig.6 Forward Current vs. Forward Voltage
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
10
100
1
Forward voltage VF (V)
Forward current IF (mA)
50˚C
25˚C
0˚C
−25˚C
Ta=75˚C
Sheet No.: D2-A04002EN
Frequency f (kHz)
0
0.1 110100
100Ω10Ω
Voltage gain Av (dB)
VCE=2V
IC=20mA
Ta=25˚C
RL=1kΩ
1 000
−25
−20
−15
−10
−5
Fig.14 Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
9
Collector-emitter saturation voltage VCE (sat) (V)
Forward current IF (mA)
0
0
1
2
3
4
5
12345
10mA
30mA
50mA
70mA
100mA
Ta=25˚C
IC=5mA
Fig.15 Collector-emitter Saturation Voltage
vs. Forward Current
Response time (µs)
1
10
100
0.01 0.1 1 10
VCE=2V
IC=20mA
Ta=25˚C tr
tf
td
ts
1 000
Load resistance RL (kΩ)
Fig.12 Response Time vs. Load Resistance
VCC
tf
tr
ts
90%
10%
td
Output
Input
RL
Input OutputRD
Please refer to the conditions in Fig.12.
VCE
Fig.13 Test Circuit for Response Time
PC852XJ0000F Series/PC853XJ0000F Series
20
040 60 80 100
10−10
10−9
10−8
10−7
10−6
10−5
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
VCE=200V
−30
10−11
Fig.11 Collector Dark Current vs. Ambient
Temperature
0
−30
0.2
020406080100
0.4
0.6
0.8
1
1.2
Ambient temperature Ta (˚C)
Collector-emitter saturation voltage VCE (sat) (V)
IF=20mA
IC=100mA
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
Sheet No.: D2-A04002EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
10
2.2
2.54
1.7
8.2
(Unit : mm)
● Design guide
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
11
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
● Presence of ODC
12
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
● Sleeve package
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
■ Package specification
13
(Unit : mm)
12.0
6.7
5.8
10.8
520
±2
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
14
● Tape and Reel package
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
D J
G
B
H
H
A
C
5˚MAX.
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
15
■ Important Notices
PC852XJ0000F Series/PC853XJ0000F Series
Sheet No.: D2-A04002EN
[E203]
