VDSM ITAVM ITRMS ITSM VT0 rT = = = = = = 6500 V 350 A 550 A 4500 A 1.20 V 2.300 m Phase Control Thyristor 5STP 03X6500 Doc. No. 5SYA1003-04 Sep. 01 * Patented free-floating silicon technology * Low on-state and switching losses * Designed for traction, energy and industrial applications * Optimum power handling capability * Interdigitated amplifying gate Blocking Part Number 5STP 03X6500 5STP 03X6200 5STP 03X5800 Conditions VDSM VRSM 6500 V 6200 V 5800 V f = 5 Hz, tp = 10ms VDRM VRRM 5600 V 5300 V 4900 V f = 50 Hz, tp = 10ms 7000 V 6700 V 6300 V tp = 5ms, single pulse VRSM1 IDSM 150 mA VDSM IRSM 150 mA VRSM dV/dtcrit 1000 V/s Exp. to 0.67 x VDRM, Tj = 125C VDRM/ VRRM are equal to VDSM/ VRSM values up to Tj = 110C Mechanical data FM a Mounting force nom. 10 kN min. 8 kN max. 12 kN Acceleration Device unclamped 50 m/s2 Device clamped 100 m/s2 m Weight 0.4 kg DS Surface creepage distance 38 mm Da Air strike distance 21 mm Tj = 125C ABB Semiconductors AG reserves the right to change specifications without notice. 5STP 03X6500 On-state ITAVM Max. average on-state current 350 A ITRMS Max. RMS on-state current 550 A ITSM Max. peak non-repetitive 4500 A surge current 4850 A 2 It Limiting load integral Half sine wave, TC = 70C tp = 10 ms Tj = 125C tp = 8.3 ms After surge: 2 101 kA s tp = 10 ms VD = VR = 0V 2 8.3 ms 98 kA s tp = VT On-state voltage 3.50 V IT = 1000 A VT0 Threshold voltage 1.20 V IT = 300 - 900 A rT Slope resistance 2.300 m IH Holding current 30-80 mA Tj = 25C 15-60 mA Tj = 125C 80-500 mA Tj = 25C 50-200 mA Tj = 125C IL Latching current Tj = 125C Switching di/dtcrit Critical rate of rise of on-state current 100 A/s Cont. f = 50 Hz VD 0.67VDRM , Tj = 125C 200 A/s 60 sec. f = 50Hz ITRM = 1000 A IFG = 2 A, tr = 0.5 s IFG = 2 A, tr = 0.5 s td Delay time 3.0 s VD = 0.4VDRM tq Turn-off time 700 s VD 0.67VDRM ITRM = 1000 A, Tj = 125C dvD/dt = 20V/s VR > 200 V, diT/dt = 1 A/s Qrr Recovery charge min 900 As max 2000 As Triggering VGT Gate trigger voltage 2.6 V Tj = 25 IGT Gate trigger current 400 mA Tj = 25 VGD Gate non-trigger voltage 0.3 V VD =0.4 x VDRM IGD Gate non-trigger current 10 mA VD = 0.4 x VDRM VFGM Peak forward gate voltage 12 V IFGM Peak forward gate current 10 A VRGM Peak reverse gate voltage 10 V PG Gate power loss 3W ABB Semiconductors AG reserves the right to change specifications without notice. Doc. No. 5SYA1003-04 Sep. 01 page 2 of 5 5STP 03X6500 Thermal Tjmax Max. operating junction temperature range Tstg Storage temperature range RthJC Thermal resistance 85 K/kW Anode side cooled junction to case 95 K/kW Cathode side cooled 45 K/kW Double side cooled Thermal resistance case to 15 K/kW Single side cooled heat sink 7.5 K/kW Double side cooled RthCH 125 C -40...140 C Analytical function for transient thermal impedance: n ZthJC(t) = a Ri(1 - e -t/ i ) i =1 i 1 2 3 4 Ri(K/kW) 26.07 12.16 3.37 3.1 i(s) 0.6439 0.0812 0.0161 0.0075 Fig. 1 Transient thermal impedance junction to case. Fig. 2 On-state characteristics. Fig. 3 On-state characteristics. Tj=125C, 10ms half sine ABB Semiconductors AG reserves the right to change specifications without notice. Doc. No. 5SYA1003-04 Sep. 01 page 3 of 5 5STP 03X6500 Fig. 4 On-state power dissipation vs. mean onstate current. Turn - on losses excluded. Fig. 5 Max. permissible case temperature vs. mean on-state current. Fig. 6 Surge on-state current vs. pulse length. Half-sine wave. Fig. 7 Surge on-state current vs. number of pulses. Half-sine wave, 10 ms, 50Hz. ABB Semiconductors AG reserves the right to change specifications without notice. Doc. No. 5SYA1003-04 Sep. 01 page 4 of 5 5STP 03X6500 Fig. 8 Gate trigger characteristics. Fig. 9 Max. peak gate power loss. Fig. 10 Recovery charge vs. decay rate of onstate current. Fig. 11 Peak reverse recovery current vs. decay rate of on-state current. ABB Semiconductors AG reserves the right to change specifications without notice. ABB Semiconductors AG Fabrikstrasse 3 CH-5600 Lenzburg, Switzerland Telephone Fax Email Internet +41 (0)62 888 6419 +41 (0)62 888 6306 abbsem@ch.abb.com www.abbsem.com Doc. No. 5SYA1003-04 Sep. 01