An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMK02000
SNAS390D NOVEMBER 2006REVISED SEPTEMBER 2007
Precision Clock Conditioner with Integrated PLL
Check for Samples: LMK02000
All trademarks are the property of their respective owners.
1
1 Features
1 20 fs Additive Jitter
Integrated Integer-N PLL with Outstanding
Normalized Phase Noise Contribution of -224
dBc/Hz
Clock Output Frequency Range of 1 to 800 MHz
3 LVDS and 5 LVPECL Clock Outputs
Dedicated Divider and Delay Blocks on Each
Clock Output
Pin Compatible Family of Clocking Devices
3.15 to 3.45 V Operation
Package: 48 Pin WQFN (7.0 x 7.0 x 0.8 mm)
2 Target Applications
Data Converter Clocking
Networking, SONET/SDH, DSLAM
Wireless Infrastructure
Medical
Test and Measurement
Military / Aerospace
3 Description
The LMK02000 precision clock conditioner combines
the functions of jitter cleaning/reconditioning,
multiplication, and distribution of a reference clock.
The device integrates a high performance Integer-N
Phase Locked Loop (PLL), three LVDS, and five
LVPECL clock output distribution blocks.
Each clock distribution block includes a
programmable divider, a phase synchronization
circuit, a programmable delay, a clock output mux,
and an LVDS or LVPECL output buffer. This allows
multiple integer-related and phase-adjusted copies of
the reference to be distributed to eight system
components.
The clock conditioner comes in a 48-pin WQFN
package and is footprint compatible with other
clocking devices in the same family.
OSCin
OSCin* R Divider Phase
Detector
N Divider
CLKout0
CLKout0*
CLKout1
CLKout1*
CLKout2
CLKout2*
CLKout3
CLKout3*
CLKout4
CLKout4*
CLKout5
CLKout5*
CLKout6
CLKout6*
CLKout7
CLKout7*
Divider
Delay
Mux
Divider
Delay
Mux
Divider
Delay
Mux
Divider
Delay
Mux
Divider Delay Mux
Divider Delay Mux
Divider Delay Mux
Divider Delay Mux
Distribution Path
CLK
DATA
LE
Control
Registers
PWire
Port Device
Control LDGOE
SYNC*
Fin
Fin*
Charge
Pump CPout
Low Clock Buffers
High Clock Buffers
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3.1 Functional Block Diagram
GND
NC
Vcc1
Vcc2
Vcc3
Vcc4
Vcc5
Vcc6
Vcc7
Vcc8
Vcc9
Vcc10
Vcc11
Vcc12
Vcc13
Vcc14
CLKuWire
DATAuWire
LEuWire
NC
LDObyp1
LDObyp2
GOE
LD
CLKout0
CLKout0*
CLKout1
CLKout1*
CLKout2
CLKout2*
CLKout3
CLKout3*
GND
SYNC*
OSCin
OSCin*
CPout
Fin
Fin*
Bias
CLKout4
CLKout4*
CLKout5
CLKout5*
CLKout6
CLKout6*
CLKout7
CLKout7*
WQFN-48
Top Down View
4748 46 45 44 43 42 41 40 39 38 37
11
12
10
9
8
7
6
5
4
3
2
1
1413 15 16 17 18 19 20 21 22 23 24
26
25
27
28
29
30
31
32
33
34
35
36
DAP
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3.2 Connection Diagram
Figure 1. 48-Pin WQFN Package
Pin Descriptions
Pin # Pin Name I/O Description
1, 25 GND - Ground
2, 7 NC - No Connection to these pins
3, 8, 13, 16, 19, 22, 26,
30, 31, 33, 37, 40, 43, 46 Vcc1, Vcc2, Vcc3, Vcc4, Vcc5, Vcc6, Vcc7, Vcc8,
Vcc9, Vcc10, Vcc11, Vcc12, Vcc13, Vcc14 - Power Supply
4 CLKuWire I MICROWIRE Clock Input
5 DATAuWire I MICROWIRE Data Input
6 LEuWire I MICROWIRE Latch Enable Input
9, 10 LDObyp1, LDObyp2 - LDO Bypass
11 GOE I Global Output Enable
12 LD O Lock Detect and Test Output
14, 15 CLKout0, CLKout0* O LVDS Clock Output 0
17, 18 CLKout1, CLKout1* O LVDS Clock Output 1
20, 21 CLKout2, CLKout2* O LVDS Clock Output 2
23, 24 CLKout3, CLKout3* O LVPECL Clock Output 3
27 SYNC* I Global Clock Output Synchronization
28, 29 OSCin, OSCin* I Oscillator Clock Input; Must be AC coupled
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Connection Diagram (continued)
Pin Descriptions (continued)
Pin # Pin Name I/O Description
32 CPout O Charge Pump Output
34, 35 Fin, Fin* I Frequency Input; Must be AC coupled
36 Bias I Bias Bypass
38, 39 CLKout4, CLKout4* O LVPECL Clock Output 4
41, 42 CLKout5, CLKout5* O LVPECL Clock Output 5
44, 45 CLKout6, CLKout6* O LVPECL Clock Output 6
47, 48 CLKout7, CLKout7* O LVPECL Clock Output 7
DAP DAP - Die Attach Pad is Ground
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
(1) "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) This device is a high performance integrated circuit with ESD handling precautions. Handling of this device should only be done at ESD
protected work stations. The device is rated to a HBM-ESD of > 2 kV, a MM-ESD of > 200 V, and a CDM-ESD of > 1.2 kV.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
4 Absolute Maximum Ratings (1)(2)(3)
Parameter Symbol Ratings Units
Power Supply Voltage VCC -0.3 to 3.6 V
Input Voltage VIN -0.3 to (VCC + 0.3) V
Storage Temperature Range TSTG -65 to 150 °C
Lead Temperature (solder 4 s) TL+260 °C
Junction Temperature TJ125 °C
5 Recommended Operating Conditions
Parameter Symbol Min Typ Max Units
Ambient Temperature TA-40 25 85 °C
Power Supply Voltage VCC 3.15 3.3 3.45 V
(1) Specification assumes 16 thermal vias connect the die attach pad to the embedded copper plane on the 4-layer JEDEC board. These
vias play a key role in improving the thermal performance of the WQFN. It is recommended that the maximum number of vias be used in
the board layout.
6 Package Thermal Resistance
Package θJA θJ-PAD (Thermal Pad)
48-Lead WQFN (1) 27.4° C/W 5.8° C/W
5
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(1) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as
otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and
are not ensured.
(2) See CURRENT CONSUMPTION / POWER DISSIPATION CALCULATIONS for more current consumption / power dissipation
calculation information.
(3) For all frequencies the slew rate, SLEWFin, is measured between 20% and 80%.
(4) Specification is ensured by characterization and is not tested in production.
(5) A specification in modeling PLL in-band phase noise is the 1/f flicker noise, LPLL_flicker(f), which is dominant close to the carrier. Flicker
noise has a 10 dB/decade slope. PN10kHz is normalized to a 10 kHz offset and a 1 GHz carrier frequency. PN10kHz = LPLL_flicker(10
kHz) - 20log(Fout / 1 GHz), where LPLL_flicker(f) is the single side band phase noise of only the flicker noise's contribution to total noise,
L(f). To measure LPLL_flicker(f) it is important to be on the 10 dB/decade slope close to the carrier. A high phase detector frequency and a
clean crystal are important to isolating this noise source from the total phase noise, L(f). LPLL_flicker(f) can be masked by the reference
oscillator performance if a low power or noisy source is used. The total PLL inband phase noise performance is the sum of LPLL_flicker(f)
and LPLL_flat(f).
7 Electrical Characteristics (1)
(3.15 V Vcc 3.45 V, -40 °C TA85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA= 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not specified).
Symbol Parameter Conditions Min Typ Max Units
Current Consumption
ICC Power Supply Current
(2)
Entire device; CLKout0 & CLKout4
enabled in Bypass Mode 145.8 mA
Entire device; All Outputs Off (no
emitter resistors placed) 70
ICCPD Power Down Current POWERDOWN = 1 1 mA
Reference Oscillator
fOSCin square Reference Oscillator Input Frequency
Range for Square Wave AC coupled; Differential (VOD)1 200 MHz
VOSCinsquare Square Wave Input Voltage for OSCin and
OSCin* 0.2 1.6 Vpp
Frequency Input
fFin Frequency Input Frequency Range 1 800 MHz
SLEWFin Frequency Input Slew Rate (3)(4)0.5 V/ns
DUTYFin Frequency Input Duty Cycle 40 60 %
PFin Input Power Range for Fin or Fin* AC coupled -13 8 dBm
PLL
fCOMP Phase Detector Frequency 40 MHz
ISRCECPout Charge Pump Source Current
VCPout = Vcc/2, PLL_CP_GAIN = 1x 100
µA
VCPout = Vcc/2, PLL_CP_GAIN = 4x 400
VCPout = Vcc/2, PLL_CP_GAIN = 16x 1600
VCPout = Vcc/2, PLL_CP_GAIN = 32x 3200
ISINKCPout Charge Pump Sink Current
VCPout = Vcc/2, PLL_CP_GAIN = 1x -100
μA
VCPout = Vcc/2, PLL_CP_GAIN = 4x -400
VCPout = Vcc/2, PLL_CP_GAIN = 16x -1600
VCPout = Vcc/2, PLL_CP_GAIN = 32x -3200
ICPoutTRI Charge Pump TRI-STATE Current 0.5 V < VCPout < Vcc - 0.5 V 2 10 nA
ICPout%MIS Magnitude of Charge Pump
Sink vs. Source Current Mismatch VCPout = Vcc / 2
TA= 25°C 3 %
ICPoutVTUNE Magnitude of Charge Pump
Current vs. Charge Pump Voltage Variation 0.5 V < VCPout < Vcc - 0.5 V
TA= 25°C 4 %
ICPoutTEMP Magnitude of Charge Pump Current vs.
Temperature Variation 4 %
PN10kHz PLL 1/f Noise at 10 kHz Offset (5)
Normalized to 1 GHz Output Frequency PLL_CP_GAIN = 1x -117 dBc/Hz
PLL_CP_GAIN = 32x -122
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Electrical Characteristics (1) (continued)
(3.15 V Vcc 3.45 V, -40 °C TA85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA= 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not specified).
Symbol Parameter Conditions Min Typ Max Units
(6) A specification in modeling PLL in-band phase noise is the Normalized Phase Noise Contribution, LPLL_flat(f), of the PLL and is defined
as PN1Hz = LPLL_flat(f) 20log(N) 10log(fCOMP). LPLL_flat(f) is the single side band phase noise measured at an offset frequency, f, in a
1 Hz Bandwidth and fCOMP is the phase detector frequency of the synthesizer. LPLL_flat(f) contributes to the total noise, L(f). To measure
LPLL_flat(f) the offset frequency, f, must be chosen sufficiently smaller then the loop bandwidth of the PLL, and yet large enough to avoid
a substantial noise contribution from the reference and flicker noise. LPLL_flat(f) can be masked by the reference oscillator performance if
a low power or noisy source is used.
(7) The Clock Distribution Section includes all parts of the device except the PLL section. Typical Additive Jitter specifications apply to the
clock distribution section only.
(8) Applies to GOE, LD, and SYNC*.
PN1Hz Normalized Phase Noise Contribution
(6) PLL_CP_GAIN = 1x -219 dBc/Hz
PLL_CP_GAIN = 32x -224
Clock Distribution Section (7) - LVDS Clock Outputs (CLKout0 to CLKout2)
JitterADD Additive RMS Jitter (7)
RL= 100 Ω
Distribution Path =
800 MHz
Bandwidth =
12 kHz to 20 MHz
CLKoutX_MUX =
Bypass 20
fs
CLKoutX_MUX =
Divided
CLKoutX_DIV =
475
tSKEW CLKoutX to CLKoutY (4) Equal loading and identical clock
configuration
RL= 100 Ω-30 ±4 30 ps
VOD Differential Output Voltage RL= 100 Ω250 350 450 mV
ΔVOD Change in magnitude of VOD for
complementary output states RL= 100 Ω-50 50 mV
VOS Output Offset Voltage RL= 100 Ω1.070 1.25 1.370 V
ΔVOS Change in magnitude of VOS for
complementary output states RL= 100 Ω-35 35 mV
ISA
ISB Clock Output Short Circuit Current
single ended Single ended outputs shorted to GND -24 24 mA
ISAB Clock Output Short Circuit Current
differential Complementary outputs tied together -12 12 mA
Clock Distribution Section (7) - LVPECL Clock Outputs (CLKout3 to CLKout7)
JitterADD Additive RMS Jitter (7)
RL= 100 Ω
Distribution Path =
800 MHz
Bandwidth =
12 kHz to 20 MHz
CLKoutX_MUX =
Bypass 20
fs
CLKoutX_MUX =
Divided
CLKoutX_DIV =
475
tSKEW CLKoutX to CLKoutY (4) Equal loading and identical clock
configuration
Termination = 50 Ωto Vcc - 2 V -30 ±3 30 ps
VOH Output High Voltage
Termination = 50 Ωto Vcc - 2 V
Vcc -
0.98 V
VOL Output Low Voltage Vcc -
1.8 V
VOD Differential Output Voltage 660 810 965 mV
Digital LVTTL Interfaces (8)
VIH High-Level Input Voltage 2.0 Vcc V
VIL Low-Level Input Voltage 0.8 V
IIH High-Level Input Current VIH = Vcc -5.0 5.0 µA
IIL Low-Level Input Current VIL = 0 -40.0 5.0 µA
VOH High-Level Output Voltage IOH = +500 µA Vcc -
0.4 V
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Electrical Characteristics (1) (continued)
(3.15 V Vcc 3.45 V, -40 °C TA85 °C, Differential Inputs/Outputs; except as specified. Typical values represent most
likely parametric norms at Vcc = 3.3 V, TA= 25 °C, and at the Recommended Operation Conditions at the time of product
characterization and are not specified).
Symbol Parameter Conditions Min Typ Max Units
(9) Applies to CLKuWire, DATAuWire, and LEuWire.
VOL Low-Level Output Voltage IOL = -500 µA 0.4 V
Digital MICROWIRE Interfaces (9)
VIH High-Level Input Voltage 1.6 Vcc V
VIL Low-Level Input Voltage 0.4 V
IIH High-Level Input Current VIH = Vcc -5.0 5.0 µA
IIL Low-Level Input Current VIL = 0 -5.0 5.0 µA
MICROWIRE Timing
tCS Data to Clock Set Up Time See Data Input Timing 25 ns
tCH Data to Clock Hold Time See Data Input Timing 8 ns
tCWH Clock Pulse Width High See Data Input Timing 25 ns
tCWL Clock Pulse Width Low See Data Input Timing 25 ns
tES Clock to Enable Set Up Time See Data Input Timing 25 ns
tCES Enable to Clock Set Up Time See Data Input Timing 25 ns
tEWH Enable Pulse Width High See Data Input Timing 25 ns
tCES tCS
D27 D26 D25 D24
tCH tCWH tCWL
D23 D0 A3 A2 A1 A0
MSB LSB
DATAuWire
CLKuWire
LEuWire
tES
tEWH
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8 Serial Data Timing Diagram
Data bits set on the DATAuWire signal are clocked into a shift register, MSB first, on each rising edge of the
CLKuWire signal. On the rising edge of the LEuWire signal, the data is sent from the shift register to the
addressed register determined by the LSB bits. After the programming is complete the CLKuWire, DATAuWire,
and LEuWire signals should be returned to a low state.
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9 Charge Pump Current Specification Definitions
I1 = Charge Pump Sink Current at VCPout = Vcc - ΔV
I2 = Charge Pump Sink Current at VCPout = Vcc/2
I3 = Charge Pump Sink Current at VCPout =ΔV
I4 = Charge Pump Source Current at VCPout = Vcc - ΔV
I5 = Charge Pump Source Current at VCPout = Vcc/2
I6 = Charge Pump Source Current at VCPout =ΔV
ΔV = Voltage offset from the positive and negative supply rails. Defined to be 0.5 V for this device.
Charge Pump Output Current Magnitude Variation vs. Charge Pump Output Voltage
Charge Pump Sink Current vs. Charge Pump Output Source Current Mismatch
Charge Pump Output Current Magnitude Variation vs. Temperature
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Charge Pump Current Specification Definitions (continued)
11
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10 Functional Description
The LMK02000 precision clock conditioner combines the functions of jitter cleaning/reconditioning, multiplication,
and distribution of a reference clock. The device integrates a high performance Integer-N Phase Locked Loop
(PLL), three LVDS, and five LVPECL clock output distribution blocks.
Each clock distribution block includes a programmable divider, a phase synchronization circuit, a programmable
delay, a clock output mux, and an LVDS or LVPECL output buffer. This allows multiple integer-related and
phase-adjusted copies of the reference to be distributed to eight system components.
The clock conditioner comes in a 48-pin WQFN package and is footprint compatible with other clocking devices
in the same family.
10.1 BIAS PIN
To properly use the device, bypass Bias (pin 36) with a low leakage 1 µF capacitor connected to Vcc. This is
important for low noise performance.
10.2 LDO BYPASS
To properly use the device, bypass LDObyp1 (pin 9) with a 10 µF capacitor and LDObyp2 (pin 10) with a 0.1 µF
capacitor.
10.3 OSCILLATOR INPUT PORT (OSCin, OSCin*)
The purpose of OSCin is to provide the PLL with a reference signal. The OSCin port must be AC coupled, refer
to the System Level Diagram in the Application Information section. The OSCin port may be driven single
endedly by AC grounding OSCin* with a 0.1 µF capacitor.
10.4 FREQUENCY INPUT PORT (Fin, Fin*)
The purpose of Fin is to provide the PLL with a feedback signal from an external oscillator. The Fin port may be
driven single endedly by AC grounding Fin*.
10.5 CLKout DELAYS
Each individual clock output includes a delay adjustment. Clock output delay registers (CLKoutX_DLY) support a
150 ps step size and range from 0 to 2250 ps of total delay.
10.6 LVDS/LVPECL OUTPUTS
Each LVDS or LVPECL output may be disabled individually by programming the CLKoutX_EN bits. All the
outputs may be disabled simultaneously by pulling the GOE pin low or programming EN_CLKout_Global to 0.
10.7 GLOBAL CLOCK OUTPUT SYNCHRONIZATION
The SYNC* pin synchronizes the clock outputs. When the SYNC* pin is held in a logic low state, the divided
outputs are also held in a logic low state. When the SYNC* pin goes high, the divided clock outputs are activated
and will transition to a high state simultaneously. Clocks in the bypassed state are not affected by SYNC* and
are always synchronized with the divided outputs.
The SYNC* pin must be held low for greater than one clock cycle of the Frequency Input port, also known as the
distribution path. Once this low event has been registered, the outputs will not reflect the low state for four more
cycles. Similarly once the SYNC* pin becomes high, the outputs will not simultaneously transition high until four
more distribution path clock cycles have passed. See the timing diagram below for further detail. In the timing
diagram below the clocks are programmed as CLKout0_MUX = Bypassed, CLKout1_MUX = Divided,
CLKout1_DIV = 2, CLKout2_MUX = Divided, and CLKout2_DIV = 4.
Distribution
Path
SYNC*
CLKout0
CLKout1
CLKout2
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10.8 SYNC* Timing Diagram
The SYNC* pin provides an internal pull-up resistor as shown on the functional block diagram. If the SYNC* pin
is not terminated externally the clock outputs will operate normally. If the SYNC* function is not used, clock
output synchronization is not specified.
10.9 CLKout OUTPUT STATES
Each clock output may be individually enabled with the CLKoutX_EN bits. Each individual output enable control
bit is gated with the Global Output Enable input pin (GOE) and the Global Output Enable bit
(EN_CLKout_Global).
All clock outputs can be disabled simultaneously if the GOE pin is pulled low by an external signal or
EN_CLKout_Global is set to 0.
CLKoutX
_EN bit EN_CLKout
_Global bit GOE pin Clock X Output State
1 1 Low Low
Don't care 0 Don't care Off
0 Don't care Don't care Off
1 1 High / No Connect Enabled
When an LVDS output is in the Off state, the outputs are at a voltage of approximately 1.5 volts. When an
LVPECL output is in the Off state, the outputs are at a voltage of approximately 1 volt.
10.10 GLOBAL OUTPUT ENABLE AND LOCK DETECT
The GOE pin provides an internal pull-up resistor. If it is not terminated externally, the clock output states are
determined by the Clock Output Enable bits (CLKoutX_EN) and the EN_CLKout_Global bit.
By programming the PLL_MUX register to Digital Lock Detect Active High (See PLL_MUX[3:0] -- Multiplexer
Control for LD Pin), the Lock Detect (LD) pin can be connected to the GOE pin in which case all outputs are set
low automatically if the synthesizer is not locked.
10.11 POWER ON RESET
When supply voltage to the device increases monotonically from ground to Vcc, the power on reset circuit sets
all registers to their default values, see RESET Bit -- R0 only for more information on default register values.
Voltage should be applied to all Vcc pins simultaneously.
10.12 General Programming Information
The LMK02000 device is programmed using several 32-bit registers which control the device's operation. The
registers consist of a data field and an address field. The last 4 register bits, ADDR[3:0] form the address field.
The remaining 28 bits form the data field DATA[27:0].
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General Programming Information (continued)
During programming, LEuWire is low and serial data is clocked in on the rising edge of clock (MSB first). When
LEuWire goes high, data is transferred to the register bank selected by the address field. Only registers R0 to
R7, R11, R14, and R15 need to be programmed for proper device operation.
It is required to program register R14.
10.12.1 RECOMMENDED PROGRAMMING SEQUENCE
The recommended programming sequence involves programming R0 with the reset bit set (RESET = 1) to
ensure the device is in a default state. It is not necessary to program R0 again, but if R0 is programmed again,
the reset bit is programmed clear (RESET = 0). Registers are programmed in order with R15 being the last
register programmed. An example programming sequence is shown below.
Program R0 with the reset bit set (RESET = 1). This ensures the device is in a default state. When the reset
bit is set in R0, the other R0 bits are ignored.
If R0 is programmed again, the reset bit is programmed clear (RESET = 0).
Program R0 to R7 as necessary with desired clocks with appropriate enable, mux, divider, and delay settings.
Program R11 with DIV4 setting if necessary.
Program R14 with global clock output bit, power down setting, PLL mux setting, and PLL R divider. It is
required to program register R14.
R14 must be programmed in accordance with the register map as shown in the register map (see
Table 1).
Program R15 with PLL charge pump gain, and PLL N divider.
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Table 1. LMK02000 REGISTER MAP
Re
gist
er 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Data [27:0] A3 A2 A1 A0
R0 RE
SE
T000000000000CLKout0
_MUX
[1:0]
CL
Kou
t0_
EN
CLKout0_DIV
[7:0] CLKout0_DLY
[3:0] 0 0 0 0
R10000000000000CLKout1
_MUX
[1:0]
CL
Kou
t1_
EN
CLKout1_DIV
[7:0] CLKout1_DLY
[3:0] 0 0 0 1
R20000000000000CLKout2
_MUX
[1:0]
CL
Kou
t2_
EN
CLKout2_DIV
[7:0] CLKout2_DLY
[3:0] 0 0 1 0
R30000000000000CLKout3
_MUX
[1:0]
CL
Kou
t3_
EN
CLKout3_DIV
[7:0] CLKout3_DLY
[3:0] 0 0 1 1
R40000000000000CLKout4
_MUX
[1:0]
CL
Kou
t4_
EN
CLKout4_DIV
[7:0] CLKout4_DLY
[3:0] 0 1 0 0
R50000000000000CLKout5
_MUX
[1:0]
CL
Kou
t5_
EN
CLKout5_DIV
[7:0] CLKout5_DLY
[3:0] 0 1 0 1
R60000000000000CLKout6
_MUX
[1:0]
CL
Kou
t6_
EN
CLKout6_DIV
[7:0] CLKout6_DLY
[3:0] 0 1 1 0
R70000000000000CLKout7
_MUX
[1:0]
CL
Kou
t7_
EN
CLKout7_DIV
[7:0] CLKout7_DLY
[3:0] 0 1 1 1
R110000000010000010DIV
4000000000001011
R14 0 0 10
EN
_CL
Kou
t_Gl
oba
l
PO
WE
RD
OW
N
TRI
-
ST
AT
E
PLL
_C
P_
PO
L
PLL_MUX
[3:0] PLL_R
[11:0] 00001110
LMK02000
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15
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Table 1. LMK02000 REGISTER MAP (continued)
Re
gist
er 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
R15 PLL_
CP_
GAIN
[1:0] 0 0 0 0 PLL_N
[17:0] 00001111
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10.12.2 REGISTER R0 to R7
Registers R0 through R7 control the eight clock outputs. Register R0 controls CLKout0, Register R1 controls
CLKout1, and so on. There is one additional bit in register R0 called RESET. Aside from this, the functions of
these bits are identical. The X in CLKoutX_MUX, CLKoutX_DIV, CLKoutX_DLY, and CLKoutX_EN denote the
actual clock output which may be from 0 to 7.
10.12.2.1 RESET Bit -- R0 only
This bit is only in register R0. The use of this bit is optional and it should be set to '0' if not used. Setting this bit
to a '1' forces all registers to their power on reset condition and therefore automatically clears this bit. If this bit is
set, all other R0 bits are ignored and R0 needs to be programmed again if used with its proper values and
RESET = 0.
Bit Name Default
Bit Value Bit State Bit Description Register Bit
Location
RESET 0 No reset, normal operation Reset to power on defaults R0 31
CLKoutX_MUX 0 Bypassed CLKoutX mux mode
R0 to R7
18:17
CLKoutX_EN 0 Disabled CLKoutX enable 16
CLKoutX_DIV 1 Divide by 2 CLKoutX clock divide 15:8
CLKoutX_DLY 0 0 ps CLKoutX clock delay 7:4
DIV4 0 PDF 20 MHz Phase Detector Frequency R11 15
EN_CLKout_Global 1 Normal - CLKouts normal Global clock output enable
R14
27
POWERDOWN 0 Normal - Device active Device power down 26
PLL_CP_TRI 0 Normal - PLL active TRI-STATE PLL charge pump 25
PLL_CP_POL 0 Negative Polarity CP Polarity of charge pump 24
PLL_MUX 0 Disabled Multiplexer control for LD pin 23:20
PLL_R 10 R divider = 10 PLL R divide value 19:8
PLL_CP_GAIN 0 100 uA Charge pump current R15 31:30
PLL_N 760 N divider = 760 PLL N divide value 25:8
10.12.2.2 CLKoutX_MUX[1:0] -- Clock Output Multiplexers
These bits control the Clock Output Multiplexer for each clock output. Changing between the different modes
changes the blocks in the signal path and therefore incurs a delay relative to the bypass mode. The different
MUX modes and associated delays are listed below.
CLKoutX_MUX[1:0] Mode Added Delay Relative to Bypass Mode
0 Bypassed (default) 0 ps
1 Divided 100 ps
2 Delayed 400 ps
(In addition to the programmed delay)
3 Divided and Delayed 500 ps
(In addition to the programmed delay)
10.12.2.3 CLKoutX_DIV[7:0] -- Clock Output Dividers
These bits control the clock output divider value. In order for these dividers to be active, the respective
CLKoutX_MUX (See CLKoutX_MUX[1:0] -- Clock Output Multiplexers) bit must be set to either "Divided" or
"Divided and Delayed" mode. After all the dividers are programed, the SYNC* pin must be used to ensure that all
edges of the clock outputs are aligned (See GLOBAL CLOCK OUTPUT SYNCHRONIZATION). By adding the
divider block to the output path a fixed delay of approximately 100 ps is incurred.
The actual Clock Output Divide value is twice the binary value programmed as listed in the table below.
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CLKoutX_DIV[7:0] Clock Output Divider value
0 0 0 0 0 0 0 0 Invalid
0 0 0 0 0 0 0 1 2 (default)
00000010 4
00000011 6
00000100 8
00000101 10
........ ...
11111111 510
10.12.2.4 CLKoutX_DLY[3:0] -- Clock Output Delays
These bits control the delay stages for each clock output. In order for these delays to be active, the respective
CLKoutX_MUX (See CLKoutX_MUX[1:0] -- Clock Output Multiplexers) bit must be set to either "Delayed" or
"Divided and Delayed" mode. By adding the delay block to the output path a fixed delay of approximately 400 ps
is incurred in addition to the delay shown in the table below.
CLKoutX_DLY[3:0] Delay (ps)
0 0 (default)
1 150
2 300
3 450
4 600
5 750
6 900
7 1050
8 1200
9 1350
10 1500
11 1650
12 1800
13 1950
14 2100
15 2250
10.12.2.5 CLKoutX_EN bit -- Clock Output Enables
These bits control whether an individual clock output is enabled or not. If the EN_CLKout_Global bit (See
EN_CLKout_Global Bit -- Global Clock Output Enable) is set to zero or if GOE pin is held low, all CLKoutX_EN
bit states will be ignored and all clock outputs will be disabled. See CLKout OUTPUT STATES for more
information on CLKout states.
CLKoutX_EN bit Conditions CLKoutX State
0 EN_CLKout_Global bit = 1
GOE pin = High / No Connect 1 Disabled (default)
1 Enabled
10.12.3 REGISTER R11
This register only has one bit and only needs to be programmed in the case that the phase detector frequency is
greater than 20 MHz and digital lock detect is used. Otherwise, it is automatically defaulted to the correct values.
10.12.3.1 DIV4
This bit divides the frequency presented to the digital lock detect circuitry by 4. It is necessary to get a reliable
output from the digital lock detect output in the case of a phase detector frequency greater than 20 MHz.
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DIV4 Digital Lock Detect Circuitry Mode
0 Not divided; Phase detector frequency 20 MHz (default)
1 Divided by 4; Phase detector frequency > 20 MHz
10.12.4 REGISTER R14
The LMK02000 requires register R14 to be programmed as shown in the register map (see Table 1).
10.12.4.1 PLL_R[11:0] -- R Divider Value
These bits program the PLL R Divider and are programmed in binary fashion.
PLL_R[11:0] PLL R Divide Value
0 0 0 0 0 0 0 0 0 0 0 0 Invalid
000000000001 1
000000000010 2
............ ...
0 0 0 0 0 0 0 0 1 0 1 0 10 (default)
............ ...
1 1 1 1 1 1 1 1 1 1 1 1 4095
10.12.4.2 PLL_MUX[3:0] -- Multiplexer Control for LD Pin
These bits set the output mode of the LD pin. The table below lists several different modes.
PLL_MUX[3:0] Output Type LD Pin Function
0 Hi-Z Disabled (default)
1 Push-Pull Logic High
2 Push-Pull Logic Low
3 Push-Pull Digital Lock Detect (Active High)
4 Push-Pull Digital Lock Detect (Active Low)
5 Push-Pull Analog Lock Detect
6 Open Drain NMOS Analog Lock Detect
7 Open Drain PMOS Analog Lock Detect
8 Invalid
9 Push-Pull N Divider Output/2 (50% Duty Cycle)
10 Invalid
11 Push-Pull R Divider Output/2 (50% Duty Cycle)
12 to 15 Invalid
10.12.4.3 POWERDOWN Bit -- Device Power Down
This bit can power down the device. Enabling this bit powers down the entire device and all blocks, regardless of
the state of any of the other bits or pins.
POWERDOWN bit Mode
0 Normal Operation (default)
1 Entire Device Powered Down
10.12.4.4 EN_CLKout_Global Bit -- Global Clock Output Enable
This bit overrides the individual CLKoutX_EN bits (See CLKoutX_EN bit -- Clock Output Enables). When this bit
is set to 0, all clock outputs are disabled, regardless of the state of any of the other bits or pins. See CLKout
OUTPUT STATES for more information on CLKout states.
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EN_CLKout_Global bit Clock Outputs
0 All Off
1 Normal Operation (default)
10.12.4.5 PLL_CP_TRI Bit -- PLL Charge Pump TRI-STATE
This bit sets the PLL charge pump TRI-STATE.
PLL_CP_TRI PLL Charge Pump
0 Normal operation (default)
1 TRI-STATE
10.12.4.6 PLL_CP_POLBbit -- PLL Charge Pump Polarity
This bit sets the polarity of the charge pump to either negative or positive. A negative charge pump is used with a
VCO or VCXO which decreases frequency with increasing tuning voltage. A positive charge pump is used with a
VCO or VCXO which increases frequency with increasing tuning voltage.
PLL_CP_POL PLL Charge Pump Polarity
0 Negative (default)
1 Positive
10.12.5 Register R15
10.12.5.1 PLL_N[17:0] -- PLL N Divider
These bits program the divide value for the PLL N Divider. The PLL N Divider precedes the PLL phase detector.
The VCO or VCXO frequency is calculated as, fVCO = fOSCin × PLL N Divider / PLL R Divider. Since the PLL N
divider is a pure binary counter, there are no illegal divide values for PLL_N[17:0] except for 0.
PLL_N[17:0] PLL N Divider Value
0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Invalid
000000000000000001 1
. . . . . . . . . . . . . . . . . . ...
0 0 0 0 0 0 0 0 1 0 1 1 1 1 1 0 0 0 760 (default)
. . . . . . . . . . . . . . . . . . ...
1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 262143
10.12.5.2 PLL_CP_GAIN[1:0] -- PLL Charge Pump Gain
These bits set the charge pump gain of the PLL.
PLL_CP_GAIN[1:0] Charge Pump Gain
0 1x (default)
1 4x
2 16x
3 32x
CPout
LEuWire
CLKuWire
DATAuWire
GOE
LD
(optional)
To Host
CLKout0
CLKout0*
CLKout1
CLKout1*
CLKout2
CLKout2*
CLKout3
CLKout3*
CLKout4
CLKout4*
CLKout5
CLKout5*
CLKout6
CLKout6*
CLKout7
CLKout7*
To System
SYNC*
OSCin
OSCin*
Bias
Vcc
LDObyp1
LDObyp2
10 PF 0.1 PF
1 PF
0.1 PF
0.1 PF
LMK02000
Fin
Fin*
0.1 PF0.1 PF
100:
100:
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11 Application Information
11.1 SYSTEM LEVEL DIAGRAM
The following shows the LMK02000 in a typical application. In this setup the clock may be multiplied,
reconditioned, and redistributed.
Figure 2. Typical Application
11.2 BIAS PIN
To properly use the device, bypass Bias (pin 36) with a low leakage 1 µF capacitor connected to Vcc. This is
important for low noise performance.
11.3 LDO BYPASS
To properly use the device, bypass LDObyp1 (pin 9) with a 10 µF capacitor and LDObyp2 (pin 10) with a 0.1 µF
capacitor.
11.4 CURRENT CONSUMPTION / POWER DISSIPATION CALCULATIONS
Due to the myriad of possible configurations the following table serves to provide enough information to allow the
user to calculate estimated current consumption of the LMK02000. Unless otherwise noted Vcc = 3.3 V, TA= 25
°C.
21
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CURRENT CONSUMPTION / POWER DISSIPATION CALCULATIONS (continued)
Table 2. Block Current Consumption
Block Condition Current
Consumption at
3.3 V (mA)
Power Dissipated
in device (mW)
Power Dissipated in
LVPECL emitter
resistors (mW)
Entire device,
core current All outputs off; No LVPECL emitter resistors
connected 70 231 -
Low clock buffer
(internal) The low clock buffer is enabled anytime one of
CLKout0 through CLKout3 are enabled 9 29.7 -
High clock buffer
(internal) The high clock buffer is enabled anytime one of the
CLKout4 through CLKout7 are enabled 9 29.7 -
Output buffers
LVDS output, bypass mode 17.8 58.7 -
LVPECL output, bypass mode (includes 120 Ω
emitter resistors) 40 72 60
LVPECL output, disabled mode (includes 120 Ω
emitter resistors) 17.4 38.3 19.1
LVPECL output, disabled mode. No emitter
resistors placed; open outputs 0 0 -
Divide circuitry
per output Divide enabled, divide = 2 5.3 17.5 -
Divide enabled, divide > 2 8.5 28.0 -
Delay circuitry per
output Delay enabled, delay < 8 5.8 19.1 -
Delay enabled, delay > 7 9.9 32.7 -
Entire device CLKout0 & CLKout4 enabled in bypass mode 145.8 421.1 60
From Table 2 the current consumption can be calculated in any configuration. For example, the current for the
entire device with 1 LVDS (CLKout0) & 1 LVPECL (CLKout4) output in bypass mode can be calculated by
adding up the following blocks: core current, low clock buffer, high clock buffer, one LVDS output buffer current,
and one LVPECL output buffer current. There will also be one LVPECL output drawing emitter current, but some
of the power from the current draw is dissipated in the external 120 Ωresistors which doesn't add to the power
dissipation budget for the device. If delays or divides are switched in, then the additional current for these stages
needs to be added as well.
For power dissipated by the device, the total current entering the device is multiplied by the voltage at the device
minus the power dissipated in any emitter resistors connected to any of the LVPECL outputs. If no emitter
resistors are connected to the LVPECL outputs, this power will be 0 watts. For example, in the case of 1 LVDS
(CLKout0) & 1 LVPECL (CLKout4) operating at 3.3 volts, we calculate 3.3 V × (70 + 9 + 9 + 17.8 + 40) mA = 3.3
V × 145.8 mA = 481.1 mW. Because the LVPECL output (CLKout4) has the emitter resistors hooked up and the
power dissipated by these resistors is 60 mW, the total device power dissipation is 481.1 mW - 60 mW = 421.1
mW.
When the LVPECL output is active, ~1.9 V is the average voltage on each output as calculated from the LVPECL
Voh & Vol typical specification. Therefore the power dissipated in each emitter resistor is approximately (1.9 V)2/
120 Ω= 30 mW. When the LVPECL output is disabled, the emitter resistor voltage is ~1.07 V. Therefore the
power dissipated in each emitter resistor is approximately (1.07 V)2/ 120 Ω= 9.5 mW.
11.5 THERMAL MANAGEMENT
Power consumption of the LMK02000 can be high enough to require attention to thermal management. For
reliability and performance reasons the die temperature should be limited to a maximum of 125 °C. That is, as an
estimate, TA(ambient temperature) plus device power consumption times θJA should not exceed 125 °C.
The package of the device has an exposed pad that provides the primary heat removal path as well as excellent
electrical grounding to the printed circuit board. To maximize the removal of heat from the package a thermal
land pattern including multiple vias to a ground plane must be incorporated on the PCB within the footprint of the
package. The exposed pad must be soldered down to ensure adequate heat conduction out of the package. A
recommended land and via pattern is shown in Figure 3. More information on soldering WQFN packages can be
obtained at www.ti.com.
0.33 mm, typ
1.2 mm, typ
5.0 mm, min
22
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THERMAL MANAGEMENT (continued)
Figure 3.
To minimize junction temperature it is recommended that a simple heat sink be built into the PCB (if the ground
plane layer is not exposed). This is done by including a copper area of about 2 square inches on the opposite
side of the PCB from the device. This copper area may be plated or solder coated to prevent corrosion but
should not have conformal coating (if possible), which could provide thermal insulation. The vias shown in
Figure 3 should connect these top and bottom copper layers and to the ground layer. These vias act as “heat
pipes” to carry the thermal energy away from the device side of the board to where it can be more effectively
dissipated.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMK02000ISQ/NOPB WQFN RHS 48 250 178.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
LMK02000ISQX/NOPB WQFN RHS 48 2500 330.0 16.4 7.3 7.3 1.3 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMK02000ISQ/NOPB WQFN RHS 48 250 210.0 185.0 35.0
LMK02000ISQX/NOPB WQFN RHS 48 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Sep-2016
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
SEE TERMINAL
DETAIL
48X 0.30
0.18
5.1 0.1
48X 0.5
0.3
0.8
0.7
(A) TYP
0.05
0.00
44X 0.5
2X
5.5
2X 5.5
A7.15
6.85 B
7.15
6.85
0.30
0.18
0.5
0.3
(0.2)
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
DIM A
OPT 1 OPT 2
(0.1) (0.2)
PIN 1 INDEX AREA
0.08 C
SEATING PLANE
1
12 25
36
13 24
48 37
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05
EXPOSED
THERMAL PAD
49 SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 1.800
DETAIL
OPTIONAL TERMINAL
TYPICAL
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
48X (0.25)
48X (0.6)
( 0.2) TYP
VIA
44X (0.5)
(6.8)
(6.8)
(1.25) TYP
( 5.1)
(R0.05)
TYP
(1.25)
TYP
(1.05) TYP
(1.05)
TYP
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
SYMM
1
12
13 24
25
36
37
48
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
49
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
METAL EDGE
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL
www.ti.com
EXAMPLE STENCIL DESIGN
48X (0.6)
48X (0.25)
44X (0.5)
(6.8)
(6.8)
16X
( 1.05)
(0.625) TYP
(R0.05) TYP
(1.25)
TYP
(1.25)
TYP
(0.625) TYP
WQFN - 0.8 mm max heightRHS0048A
PLASTIC QUAD FLATPACK - NO LEAD
4214990/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
49
SYMM
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X
SYMM
1
12
13 24
25
36
37
48
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