MAG.LAYERS
GMLB-160808-W Series
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GMLB chip beads can be used in a variety of electronic applications
including:
Computers and Computer Peripherals
Cellular Communication Equipment
Digital Cameras
Digital Televisions
Audio Equipment
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The GMLB Series is Mag.Layers’ line of high quality ferrite chip beads. Using
the latest in multilayer technology, we have developed chip beads that are able
to resolve all EMI/EMC issues. High quality, reliability, and versatility make the
GMLB series chip beads suitable for all your design needs.
z High Reliability
The monolithic inorganic materials used to construct GMLB chips restrain magnetic
flux leakage thereby minimizing EMI concerns. GMLB chips are also extremely
effective with unstable grounding.
z Small Chip-Shaped Design
The chip-shaped design makes GMLB chip beads ideal for automatic mounting.
z High Soldering Heat Resistance
High quality termination allows both flow and re-flow soldering methods to be
applied.
z Sharp High Frequency Characteristics
The GMLB high frequency chip series has sharp impedance characteristics, which
make it suitable for high-speed signal lines.
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GMLB - 1060808 - 0030 A-N8
c d e f g h
c Product Code
d Dimension Code
e Impedance (at 100 MHz)
f Series Type
g Design Code
h Code for Special Specification
MAG.LAYERS
GMLB-160808-W Series
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NOTEDimensions in mm
PRODUCT NO. A B C D
GMLB-160808
(0603)
1.6±0.15
(0.063±0.006)
0.8±0.15
(0.031±0.006)
0.8±0.15
(0.031±0.006)
0.3±0.20
(0.012±0.008)
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CU
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EN
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NG
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In operating temperatures exceeding +85, derating of current is necessary for chip
ferrite beads for which rated current is 1.5A or over. Please apply the derating curve
shown below according to the operating temperature.
1
2
3
4
5
6
7
1.5
Operating Temperature()
Rated Current (A)
85 125
MAG.LAYERS
GMLB-160808-W Series
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TS
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Part Number Impedance ()
at 100 MHz RDC () Max. IDC (mA) Max. Operating
Temp. Range ()
GMLB-160808-0470W-N8 470±25% 0.8
GMLB-160808-0600W-N8 600±25% 1.0 200
GMLB-160808-1000W-N8 1000±25% 1.2 100
GMLB-160808-0120W-N7 120 ±25% 0.4
GMLB-160808-0220W-N7 220±25% 0.6
GMLB-160808-0330W-N7 330±25% 0.8
200
GMLB-160808-0120WP-N8 120 ±25% 0.04 2000
GMLB-160808-0600WP-N8 600±25% 0.35 500
-55 ~ +125
z Temperature rise should be less than 40 for P-type and less than 25 for other
types when rated current is applied.
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ET
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HO
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/
/
/
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z Test Instrument:
Z: Agilent 4291B Impedance Analyzer, Test Fixture: Agilent 16192
Osc. Level: 500mV
RDC: Agilent 34401A
z Test Condition:
< Unless otherwise specified >
Temperature: 15°C to 35°C Humidity: 25% to 85% RH
< In case of doubt >
Temperature: 25°C ± 2°C Humidity: 60% to 70% RH
MAG.LAYERS
GMLB-160808-W Series
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(
(
(
T
T
T
2
2
25
5
5
)
)
)
GMLB-160808-0470W-N8
1 10 100 1000
0
200
400
600
800
1000
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0600W-N8
1 10 100 1000
0
300
600
900
1200
1500
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R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-1000W-N8
1 10 100 1000
0
500
1000
1500
2000
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R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0120W-N7
1 10 100 1000
0
100
200
300
400
500
600
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R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0220W-N7
1 10 100 1000
0
200
400
600
800
1000
1200
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0330W-N7
1 10 100 1000
0
300
600
900
1200
1500
1800
X
R
Z
Impedance(Ohm)
Frequency(MHz)
GMLB-160808-0120WP-N8
0
50
100
150
200
250
300
350
1 10 100 1000
Frequency(MHz)
Impedance(ohm)
GMLB-160808-0600WP-N8
1 10 100 1000
0
300
600
900
1200
1500
X
R
Z
Impedance(Ohm)
Frequency(MHz)
MAG.LAYERS
GMLB-160808-W Series
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z
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z
Peel-off Force
165° TO 180°
TOP COVER TAPE
BASE TAPE
The force for peeling off cover tape is 10 grams in the arrow direction.
z Dimension (Unit: mm)
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TYPE SIZE A B W P T CHIPS/REEL
GMLB 160808 1.1 1.9 8 4 1.1, *0.95±0.05 4000
*: For paper reels
TYPE A
B
C D E
F
8 mm 178±1
60 +0.5
-0 - 13 ±0.2 9 ±0.5 12 ±0.5
12 mm 178±0.3 60 ±0.2 19.3 ±0.1 13.5 ±0.1 13.6 ±0.1 -
MAG.LAYERS
GMLB-160808-W Series
z Taping Quantity
SERIES 1608
PCS/Reel 4000
z Tape Packing Case
`
W
L
H
Unit: cm
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ND
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CB
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B
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AY
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YO
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ABB
C
Land
pattern
Component
Solder-resist
W
L
Component
Unit: mm
Type 1608
L 1.6
Size W0.8
A 0.6~0.8
B 0.6~0.8
C 0.6~0.8
No. of
Reels W L H
2 18±0.5 18±0.5 2.4±0.2
3 18±0.5 18±0.5 3.6±0.2
4 18±0.5 18±0.5 4.8±0.2
5 18±0.5 18±0.5 6.0±0.2
MAG.LAYERS
GMLB-160808-W Series
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Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the terminal electrode shall
be covered with fresh solder.
Solder:
Sn-3.0Ag-0.5Cu
Solder Temperature:
245 ± 5
Flux: Rosin
Dip Time: 3 ± 1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder.
Solder temperature : 260 ± 5
Flux: Rosin
Dip time: 10 ± 1 seconds
TYPE W(KGF) TIME (SEC)
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
W
GMLB-160808 0.6 30 ± 5
TYPE A(MM) P(KGF)
Bending Strength
No mechanical damage.
The ferrite shall not be damaged.
A
Chip
P
1.0
R0.5
GMLB-160808 1.0 1.0
Climatic test
ITEM SPECIFICATION TEST CONDITION
Thermal Shock
(Temperature Cycle)
Temperature: -55~125 for 30
minutes each, 100 cycles.
Humidity Resistance
Temperature : 60
Humidity: 95% RH
Time: 1000 ± 12 Hours
High Temperature
Resistance
Impedance shall be within ±20% of the initial
value.
Temperature : 85±2
Time: 1000 ± 12 Hours
1. Operating Temperature Range: -55 TO +125
2. Storage Condition: The temperature should be within -40~85 and humidity should be less than
75% RH. The product should be used within 6 months from the time of delivery.
MAG.LAYERS
GMLB-160808-W Series
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FL
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OW
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SO
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OF
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Ts
min
Ts
max
tL
tP
tS
Preheat
TP
TL
Critical Zone
T
L
to T
P
Ramp-down
Ramp-up
t=25
to Peak Time
Temperature
Profile Feature Sn-Pb Pb-Free
ts 60~120 seconds 60~180 seconds
Tsmin 100 150
Preheat
Tsmax 150 200
Average ramp-up rate (Tsmax to TP) 3/second max. 3/second max.
Temperature (TL)183 217
Time main above Time (tL) 60~150 seconds 60~150 seconds
Peak temperature (TP) 230 250~260
Time within 5 of actual peak
temperature (tP) 10 seconds 10 seconds
Ramp-down rate 6/sec max. 6/sec max.
Time 25 to peak temperature 6 minutes max. 8 minutes max.
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The contents of this data sheet are subject to change without notice. Please
confirm the specifications and delivery conditions when placing your order.