September 2013 Doc ID 17546 Rev 3 1/27
1
VND830P-E
Double channel high-side driver
Features
■ECOPACK®: lead free and RoHS compliant
■Automotive Grade: compliance with AEC
guidelines
■Very low standby current
■CMOS compatible input
■On-state open-load detection
■Off-state open-load detection
■Thermal shutdown protection and diagnosis
■Undervoltage shutdown
■Overvoltage clamp
■Output stuck to VCC detection
■Load current limitation
■Reverse battery protection
■Electrostatic discharge protection
Description
The VND830P-E is a monolithic device made by
using STMicroelectronics™ VIPower™ M0-3
technology, intended for driving any kind of load
with one side connected to ground.
Active VCC pin voltage clamp protects the devices
against low energy spikes (see ISO7637 transient
compatibility table).
Active current limitation combined with thermal
shutdown and automatic restart protects the
device against overload. The device detects
open-load condition both is on-state and off-state.
Output shorted to VCC is detected in the off-state.
Device automatically turns-off in case of ground
pin disconnection.
Type RDS(on) IOUT VCC
VND830P-E 60 mΩ(1)
1. Per each channel.
6A
(1) 36 V
Table 1. Device summary
Package
Order codes
Tube Tape and reel
SO-16L VND830P-E VND830PTR-E
www.st.com
VND830P-E Contents
Doc ID 17546 Rev 3 2/27
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16
3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 16
3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 17
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4 Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.5 Maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.1 SO-16L thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 SO-16L package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3 SO-16L packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VND830P-E List of tables
Doc ID 17546 Rev 3 3/27
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 6. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 8. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 9. Switching (VCC = 13 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 10. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 11. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 12. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 13. Electrical transient requirements on VCC pin (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 14. Electrical transient requirements on VCC pin (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 15. Electrical transient requirements on VCC pin (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 16. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 17. SO-16L mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 18. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VND830P-E List of figures
Doc ID 17546 Rev 3 4/27
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 9. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 10. Status low output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 11. Status clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 12. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 14. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 15. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 16. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 17. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 18. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 19. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 20. Open-load on-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 21. Open-load off-state detection threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 22. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 23. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 24. Open-load detection in off-state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 25. SO-16L maximum turn-off current versus load inductance. . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 26. SO-16L PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 27. Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 20
Figure 28. SO-16 L thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 29. Thermal fitting model of a quad channel HSD in SO-16L . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 30. SO-16L package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 31. SO-16L tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 32. Tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VND830P-E Block diagram and pin description
Doc ID 17546 Rev 3 5/27
1 Block diagram and pin description
Figure 1. Block diagram
Figure 2. Configuration diagram (top view)
Table 2. Suggested connections for unused and not connected pins
Connection / pin Status N.C. Output Input
Floating X X X X
To ground - X - Through 10 KΩ
resistor
OVERTEMP. 1
Vcc
GND
INPUT1 OUTPUT1
OVERVOLTAGE
LOGIC
DRIVER 1
STATUS1
Vcc
CLAMP
UNDERVOLTAGE
CLAMP 1
OPEN-LOAD ON 1
CURRENT LIMITER 1
OPEN-LOAD OFF 1
OUTPUT2
DRIVER 2
CLAMP 2
OPEN-LOAD ON 2
OPEN-LOAD OFF 2
OVERTEMP. 2
INPUT2
STATUS2
CURRENT LIMITER 2
V
CC
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 1
V
CC
OUTPUT 1
OUTPUT 1
V
CC
INPUT 2
STATUS 2
STATUS 1
INPUT 1
V
CC
GND
N.C.
1
89
16
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 6/27
2 Electrical specifications
2.1 Absolute maximum ratings
Stressing the device above the rating listed in Ta b l e 3 may cause permanent damage to the
device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the operating sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality
document.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
VCC DC supply voltage 41 V
- VCC Reverse DC supply voltage - 0.3 V
- IGND DC reverse ground pin current - 200 mA
IOUT DC output current Internally limited A
- IOUT Reverse DC output current - 6 A
IIN DC input current +/- 10 mA
ISTAT DC status current +/- 10 mA
VESD
Electrostatic discharge (Human Body Model: R=1.5 KΩ;
C = 100 pF)
- INPUT
- STATUS
- OUTPUT
- VCC
4000
4000
5000
5000
V
V
V
V
EMAX
Maximum switching energy
(L = 1.8 mH; RL = 0 Ω; Vbat = 13.5 V; Tjstart = 150 °C;
IL = 9 A)
102 mJ
Ptot Power dissipation Tlead =25°C 8.3 W
TjJunction operating temperature Internally limited °C
TcCase operating temperature - 40 to 150 °C
Tstg Storage temperature - 55 to 150 °C
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 7/27
2.2 Thermal data
2.3 Electrical characteristics
Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless
otherwise stated.
(Per each channel)
Figure 3. Current and voltage conventions
1. VFn = VCCn - VOUTn during reverse battery condition.
Table 4. Thermal data (per island)
Symbol Parameter Value Unit
Rthj-lead Thermal resistance junction-lead (max) 15 °C/W
Rthj-amb Thermal resistance junction-ambient (max) 65(1) 48(2) °C/W
1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected to all VCC pins.
Horizontal mounting and no artificial air flow.
2. When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick) connected to all VCC pins.
Horizontal mounting and no artificial air flow.
Table 5. Power output
Symbol Parameter Test conditions Min. Typ. Max. Unit
VCC(1) Operating supply voltage 5.5 13 36 V
VUSD(1) Undervoltage shutdown 3 4 5.5 V
VOV(1) Overvoltage shutdown 36 V
RON On-state resistance IOUT = 2 A; Tj = 25 °C
IOUT = 2 A; VCC > 8 V
60
120
mΩ
mΩ
I
S
I
GND
OUTPUT 2
V
CC
GND
STATUS 2
INPUT 2 I
OUT2
I
IN2
I
STAT2
V
STAT2
V
IN2
V
CC
V
OUT2
OUTPUT 1
I
OUT1
V
OUT1
INPUT 1
I
IN1
STATUS 1
I
STAT1
V
IN1
V
STAT1
V
F1 (1)
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 8/27
IS(1) Supply current
Off-state; VCC = 13 V;
VIN = VOUT = 0 V 12 40 µA
Off-state; VCC = 13 V;
VIN = VOUT = 0 V; Tj = 25°C 12 25 µA
On-state; VCC = 13 V;
VIN = 5 V; IOUT = 0 A 57mA
IL(off1) Off-state output current VIN = VOUT = 0 V 0 50 µA
IL(off2) Off-state output current VIN = 0 V; VOUT = 3.5 V -75 0 µA
IL(off3) Off-state output current VIN = VOUT = 0 V; VCC = 13 V;
Tj = 125 °C 5µA
IL(off4) Off-state output current VIN = VOUT = 0 V; VCC = 13 V;
Tj =25 °C 3µA
1. Per device.
Table 6. Protections(1)
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
Symbol Parameter Test conditions Min. Typ. Max. Unit
TTSD Shutdown temperature 150 175 200 °C
TRReset temperature 135 °C
Thyst Thermal hysteresis 7 15 °C
TSDL
Status delay in overload
conditions Tj > TTSD 20 µs
Ilim Current limitation VCC = 13 V 6 9 15 A
5.5 V < VCC < 36 V 15 A
Vdemag
Turn-off output clamp
voltage IOUT = 2 A; L = 6 mH VCC -41 VCC -48 VCC -55 V
Table 7. VCC - output diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
VFForward on voltage -IOUT=1.3 A; Tj=150°C - - 0.6 V
Table 8. Status pin
Symbol Parameter Test conditions Min. Typ. Max. Unit
VSTAT Status low output voltage ISTAT = 1.6 mA 0.5 V
ILSTAT Status leakage current Normal operation; VSTAT = 5 V 10 µA
CSTAT Status pin input capacitance Normal operation; VSTAT = 5 V 100 pF
Table 5. Power output (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 9/27
VSCL Status clamp voltage ISTAT = 1 mA 6 6.8 8 V
ISTAT = - 1 mA -0.7 V
Table 9. Switching (VCC = 13 V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on) Turn-on delay time RL = 6.5 Ω from VIN rising
edge to VOUT = 1.3 V -30-µs
td(off) Turn-off delay time RL = 6.5 Ω from VIN falling
edge to VOUT = 11.7 V -30-µs
dV/dt(on) Turn-on voltage slope RL = 6.5 Ω from VOUT = 1.3 V
to VOUT = 10.4 V -See
Figure 14 -V/µs
dV/dt(off) Turn-off voltage slope RL = 6.5 Ω from VOUT = 11.7 V
to VOUT = 1.3 V -See
Figure 15 -V/µs
Table 10. Open-load detection
Symbol Parameter Test conditions Min. Typ. Max. Unit
IOL
Open-load on-state detection
threshold VIN = 5 V 50 100 200 mA
tDOL(on)
Open-load on-state detection
delay IOUT = 0 A 200 µs
VOL
Open-load off-state voltage
detection threshold VIN = 0 V 1.5 2.5 3.5 V
tDOL(off)
Open-load detection delay at
turn-off 1000 µs
Table 11. Logic input
Symbol Parameter Test conditions Min. Typ. Max. Unit
VIL Input low level 1.25 V
IIL Low level input current VIN = 1.25 V 1 µA
VIH Input high level 3.25 V
IIH High level input current VIN = 3.25 V 10 µA
Vhyst Input hysteresis voltage 0.5 V
VICL Input clamp voltage IIN = 1 mA 6 6.8 8 V
IIN = -1 mA -0.7 V
Table 8. Status pin (continued)
Symbol Parameter Test conditions Min. Typ. Max. Unit
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 10/27
Figure 4. Switching time waveforms
Table 12. Truth table
Conditions Input Output Sense
Normal operation L
H
L
H
H
H
Current limitation
L
H
H
L
X
X
H
(Tj < TTSD) H
(Tj > TTSD) L
Overtemperature L
H
L
L
H
L
Undervoltage L
H
L
L
X
X
Overvoltage L
H
L
L
H
H
Output voltage > VOL
L
H
H
H
L
H
Output current < IOL
L
H
L
H
H
L
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 11/27
Table 15. Electrical transient requirements on VCC pin (part 3)
Table 13. Electrical transient requirements on VCC pin (part 1)
ISO T/R
7637/1
test pulse
Test levels
I II III IV Delays and impedance
1 -25 V -50 V -75 V -100 V 2ms, 10Ω
2 +25 V +50 V +75 V +100 V 0.2 ms, 10 Ω
3a -25 V -50 V -100 V -150 V 0.1 µs, 50 Ω
3b +25 V +50 V +75 V +100 V 0.1 µs, 50 Ω
4 -4 V -5 V -6 V -7 V 100 ms, 0.01 Ω
5 +26.5V +46.5V +66.5V +86.5V 400ms, 2Ω
Table 14. Electrical transient requirements on VCC pin (part 2)
ISO T/R
7637/1
test pulse
Test levels results
I II III IV
1 CCCC
2 CCCC
3a CCCC
3b CCCC
4 CCCC
5CEEE
Class Contents
CAll functions of the device are performed as designed after exposure to
disturbance.
E
One or more functions of the device is not performed as designed after
exposure to disturbance and cannot be returned to proper operation without
replacing the device.
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 12/27
Figure 5. Waveforms
OPEN-LOAD without external pull-up
STATUSn
INPUTn
NORMAL OPERATION
UNDERVOLTAGE
VCC
VUSD
VUSDhyst
INPUTn
OVERVOLTAGE
VCC
VCC > VOV
STATUS
INPUTn
STATUSn
STATUSn
INPUTn
STATUSn
INPUTn
OPEN-LOAD with external pull-up
undefined
OVERTEMPERATURE
INPUTn
STATUSn
TTSD
TR
Tj
OUTPUT VOLTAGEn
VCC<VOV
OUTPUT VOLTAGEn
OUTPUT VOLTAGEn
OUTPUT VOLTAGEn
OUTPUT VOLTAGEn
OUTPUT CURRENTn
VOUT > VOL
VOL
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 13/27
2.4 Electrical characteristics curves
Figure 6. Off-state output current Figure 7. High level input current
Figure 8. Input clamp voltage Figure 9. Status leakage current
Figure 10. Status low output voltage Figure 11. Status clamp voltage
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
2.25
2.5
IL(off1) (uA)
Off state
Vcc=36V
Vin=Vout=0V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Iih (uA)
Vin=3.25V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
Vicl (V)
Iin=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.01
0.02
0.03
0.04
0.05
Ilstat (uA)
Vstat=5V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
Vstat (V)
Istat=1.6mA
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
6
6.2
6.4
6.6
6.8
7
7.2
7.4
7.6
7.8
8
Vscl (V)
Istat=1mA
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 14/27
Figure 12. Overvoltage shutdown Figure 13. ILIM vs Tcase
Figure 14. Turn-on voltage slope Figure 15. Turn-off voltage slope
Figure 16. On-state resistance vs Tcase Figure 17. On-state resistance vs VCC
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
2
4
6
8
10
12
14
16
18
20
Ilim (A)
Vcc=13V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
0
100
200
300
400
500
600
700
800
dVout/dt(on) (V/ms)
Vcc=13V
Rl=6.5Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
200
250
300
350
400
450
500
550
600
dVout/dt(off) (V/ms)
Vcc=13V
Rl=6.5Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
20
40
60
80
100
120
140
160
Ron (mOhm)
Iout=2A
Vcc=8V; 13V & 36V
5 10152025303540
Vcc (V)
0
10
20
30
40
50
60
70
80
90
100
110
120
Ron (mOhm)
Iout=5A
Tc= - 40°C
Tc=25°C
Tc=150°C
VND830P-E Electrical specifications
Doc ID 17546 Rev 3 15/27
Figure 18. Input high level Figure 19. Input low level
Figure 20. Open-load on-state detection
threshold
Figure 21. Open-load off-state detection
threshold
Figure 22. Input hysteresis voltage
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Vih (V)
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
1
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
Vil (V)
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
70
80
90
100
110
120
130
140
150
Iol (mA)
Vcc=13V
Vin=5V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Vol (V)
Vin=0V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
Vhyst (V)
VND830P-E Application information
Doc ID 17546 Rev 3 16/27
3 Application information
Figure 23. Application schematic
3.1 GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1 Solution 1: a resistor in the ground line (RGND only)
This can be used with any type of load.
The following shows how to dimension the RGND resistor:
1. RGND ≤600 mV / (IS(on)max)
2. RGND ≥(-VCC) / (-IGND)
where - IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device’s datasheet.
Power dissipation in RGND (when VCC < 0 during reverse battery situations) is:
PD=(-V
CC)2/R
GND
This resistor can be shared amongst several different HSD. Please note that the value of this
resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
V
CC
OUTPUT2
D
ld
+5V
R
prot
OUTPUT1
STATUS1
INPUT1
+5V
STATUS2
INPUT2
GND
+5V
μ
CR
prot
R
prot
R
prot
D
GND
R
GND
V
GND
VND830P-E Application information
Doc ID 17546 Rev 3 17/27
Please note that, if the microprocessor ground is not common with the device ground, then
the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift varies depending on how many devices are ON in the case of several high-
side drivers sharing the same RGND.
If the calculated power dissipation requires the use of a large resistor, or several devices
have to share the same resistor, then ST suggests using Section 3.1.2 described below.
3.1.2 Solution 2: a diode (DGND) in the ground line
A resistor (RGND =1kΩ) should be inserted in parallel to DGND if the device is driving an
inductive load. This small signal diode can be safely shared amongst several different HSD.
Also in this case, the presence of the ground network produce a shift (~600 mV) in the input
threshold and the status output values if the microprocessor ground is not common with the
device ground. This shift does not vary if more than one HSD shares the same
diode/resistor network. Series resistor in INPUT and STATUS lines are also required to
prevent that, during battery voltage transient, the current exceeds the absolute maximum
rating. Safest configuration for unused INPUT and STATUS pin is to leave them
unconnected.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
VCC maximum DC rating. The same applies if the device is subjected to transients on the
VCC line that are greater than those shown in Tab l e 1 3.
3.3 MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the microcontroller I/O pins from latching up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os:
-VCCpeak / Ilatchup ≤ Rprot ≤ (VOHμC - VIH - VGND) / IIHmax
Example
For the following conditions:
VCCpeak = -100 V
Ilatchup ≥ 20 mA
VOHμC ≥ 4.5 V
5kΩ ≤ Rprot ≤ 65 kΩ.
The recommended values are:
Rprot = 10 kΩ
VND830P-E Application information
Doc ID 17546 Rev 3 18/27
3.4 Open-load detection in off-state
Off-state open-load detection requires an external pull-up resistor (RPU) connected between
OUTPUT pin and a positive supply voltage (VPU) like the +5 V line used to supply the
microprocessor.
The external resistor has to be selected according to the following requirements:
1. No false open-load indication when load is connected: in this case
it needs to avoid VOUT to be higher than VOlmin; this results in the following condition
VOUT = (VPU / (RL + RPU))RL < VOlmin.
2. No misdetection when load is disconnected: in this case the VOUT has to be higher than
VOLmax; this results in the following condition RPU < (VPU - VOLmax) / IL(off2).
Because Is(OFF) may significantly increase if Vout is pulled high (up to several mA), the pull-
up resistor RPU should be connected to a supply that is switched OFF when the module is in
standby.
The values of VOLmin, VOLmax and IL(off2) are available in Chapter 2: Electrical specifications.
Figure 24. Open-load detection in off-state
VOL
V batt. VPU
RPU
RL
R
DRIVER
+
LOGIC
+
-
IN P U T
STATUS
VCC
OUT
GROUND
IL(o ff2)
VND830P-E Application information
Doc ID 17546 Rev 3 19/27
3.5 Maximum demagnetization energy
Figure 25. SO-16L maximum turn-off current versus load inductance
V
IN
, I
L
t
Demagnetization Demagnetization Demagnetization
A = single pulse at TJstart = 150 °C
B= repetitive pulse at TJstart = 100 °C
C= repetitive pulse at TJstart = 125 °C
1
10
100
0,1 1 10 100
L( mH)
ILM AX (A)
A
B
C
Conditions:
VCC= 13.5 V
Note:
Values are generated with RL = 0 Ω.
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature
specified above for curves B and C.
VND830P-E Package and PCB thermal data
Doc ID 17546 Rev 3 20/27
4 Package and PCB thermal data
4.1 SO-16L thermal data
Figure 26. SO-16L PC board()
Figure 27. Rthj-amb vs PCB copper area in open box free air condition
Note:
Layout condition of Rth and Zth measurements (PCB FR4 area = 41 mm x 48 mm, PCB thickness = 2 mm, Cu thickness =
35 µm, Copper areas: 0.5 cm2, 6 cm2).
40
45
50
55
60
65
70
01234567
PCB Cu heatsink area (cm^2)
RTH j-amb (°C/W)
VND830P-E Package and PCB thermal data
Doc ID 17546 Rev 3 21/27
Figure 28. SO-16 L thermal impedance junction ambient single pulse
Equation 1: pulse calculation formula
Figure 29. Thermal fitting model of a quad channel HSD in SO-16L
ZTHδRTH δZTHtp 1δ–()+⋅=
where
δtpT⁄=
T_amb
Pd1
C1
R4
C3 C4
R3R1 R6R5R2
C5 C6C2
Pd2
R2
C1 C2
R1
Tj_1
Tj_2
VND830P-E Package and PCB thermal data
Doc ID 17546 Rev 3 22/27
Table 16. Thermal parameters
Area/ island (cm2) Footprint 6
R1 (°C/W) 0.05
R2 (°C/W) 0.3
R3 (°C/W) 2.2
R4 (°C/W) 12
R5 (°C/W) 15
R6 (°C/W) 37 22
C1 (W.s/°C) 0.001
C2 (W.s/°C) 5.00E-03
C3 (W.s/°C) 0.02
C4 (W.s/°C) 0.3
C5 (W.s/°C) 1
C6 (W.s/°C) 3 5
VND830P-E Package and packing information
Doc ID 17546 Rev 3 23/27
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2 SO-16L package information
Figure 30. SO-16L package dimensions
VND830P-E Package and packing information
Doc ID 17546 Rev 3 24/27
Table 17. SO-16L mechanical data
DIM.
mm.
Min. Typ. Max.
A2.65
a1 0.1 0.2
a2 2.45
b 0.35 0.49
b1 0.23 0.32
C0.5
c1 45° (typ.)
D 10.1 10.5
E 10.0 10.65
e1.27
e3 8.89
F7.4 7.6
L 0.5 1.27
M0.75
S 8° (max.)
VND830P-E Package and packing information
Doc ID 17546 Rev 3 25/27
5.3 SO-16L packing information
Figure 31. SO-16L tube shipment (no suffix)
Figure 32. Tape and reel shipment (suffix “TR”)
Base Q.ty 50
Bulk Q.ty 1000
Tube length (± 0.5) 532
A3.5
B13.8
C (± 0.1) 0.6
A
C
B
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
All dimensions are in mm.
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
Top
cover
tape
End
Start
No componentsNo components Components
500mm min
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Reel dimensions
VND830P-E Revision history
Doc ID 17546 Rev 3 26/27
6 Revision history
Table 18. Document revision history
Date Revision Changes
25-May-2010 1 Initial release.
22-Sep-2010 2 Changed document status from preliminary data to datasheet.
19-Sep-2013 3 Updated Disclaimer
VND830P-E
Doc ID 17546 Rev 3 27/27
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