©2006 Fairchild Semiconductor Corporation 1www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
September 2006
FCAS50SN60
Smart Power Module for SRM
Features
Very low thermal resistance due to using DBC
600V-50A single-phase asymmetric bridge IGBT converter
for SRM drive including control ICs for g ate driving and pro-
tection
Divided negative dc-link terminals for inverter current sensing
applications
Single-grounded power supply due to built-in HVIC
Switching frequency of 2.2~8kHz
Isolation rating of 2500Vrms/min.
Applications
AC 200V ~ 242V single-phase SRM drives for home
application vacuum cleaner.
General Description
FCAS50SN60 is an advanced smart power module for SRM
drive that Fairchild has newly developed and designed to pro-
vide very compact and high performance SRM motor drives
mainly targeting low-power inverter-driven SRM application
especially for a vacuum air cleaner. It combines optimized cir-
cuit protection and drive matched to low-loss IGBTs. System
reliability is further enhanced by the integrated under-voltage
lock-out and short-circuit protection. The high speed built-in
HVIC provides opto-coupler-less IGBT gate driving capability
that further reduce the overall size of the inverter system
design. In addition the incorporated HVIC facilitates the use of
single-supply drive topology enabling the FCAS50SN60 to be
driven by only one drive supply voltage without negative bias.
Each phase current of inverter can be monitored separately due
to the divided negative dc terminals.
Top View
26.8 mm
mm
Top View
44
Bottom View
Bo tto m Vie w
Figure 1.
2www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Integrated Power Functions
600V-50A IGBT asymmetric converter for single-phase SRM drives (Please refer to Figure 3)
Integrated Drive, Protection and System Control Functions
For high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting
Control circuit under-voltage (UV) protection
Note) Available bootstrap circuit example is given in Figures 10.
For low-side IGBTs: Gate drive circuit, Short circuit protection (SC)
Control supply circuit under-voltage (UV) protection
Fault signaling: Corresponding to a UV fault (Low-side supply)
Input interface: 5V CMOS/LSTTL compatible, Schmitt trigger input
Pin Configuration
Figure 2.
Top View
Case Temperature (TC)
Detecting Point
DBCDBC
(1) VCC(L)
(2) COM
(3) NC
(4) NC
(5) IN(L)
(6) VFO
(15) VB
(16) VS
(17) G(H)
(18) E(H)
(19) R(TH)
(20) V(TH)
(7) CFOD
(8) CSC
(9) G(L)
(10) E(L)
(11) NC
(12) NC
(13) IN(H)
(14) VCC(H)
(21) NB2
(22) NC
(23) NB1
(27) P
(24) NA
(25) B
(26) A
3www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Pin Descriptions
Pin Number Pin Name Pin Description
1V
CC(L) Low-side Common Bias Voltage for IC and IGBTs Driving
2 COM Common Supply Ground
3 NC Dummy Pin
4 NC Dummy Pin
5IN
(L) Signal Input for Low-side IGBT
6V
FO Fault Output
7C
FOD Capacitor for Fault Output Duration Time Selection
8C
SC Capacitor (Low-pass Filter) for Short-Current Detection
9G
(L) Gate terminal of low-side IGBT
10 E(L) Emitter terminal of low-side IGBT
11 NC Dummy Pin
12 NC Dummy Pin
13 IN(H) Signal Input for High-side IGBT
14 VCC(H) High-side Bias Voltage
15 VBHigh-side Bias Voltage for Gate Driving
16 VSHigh-side Bias Voltage Ground for Gate Driving
17 G(H) Gate terminal of the High-side IGBT
18 E(H) Emitter terminal of the High-side IGBT
19 R(TH) Thermistor Series Resistor
20 V(TH) Thermistor Bias Voltage
21 NB2 Negative DC–Link Input for B Leg (Should be shorted with NB1 externally)
22 NC Dummy Pin
23 NB1 Negative DC–Link Input for B Leg (Should be shorted with NB2 externally)
24 NANegative DC–Link Input for A Leg
25 B Output for B Leg
26 A Output for A Leg
27 P Positive DC–Link Input
4www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Internal Equivalent Circuit and Input/Output Pins
Note:
1. The low-side is composed of one IGBT and freewheeling diode and one control IC which has gate driving and protection functions.
2. The power si de is composed of four dc-link i nput terminals and two output terminals.
3. The high-side is composed of one IGBT and freewheeling diode and one drive IC for high-side IGBT.
Figure 3.
COM(L)
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(WL)
OUT(VL)
OUT(UL)
NB1 (23)
NA (24)
B (25)
A (26)
P (27)
(16) VS
(15) VB
(8) CSC
(7) CFOD
(6) VFO
(5) IN(L)
(4) NC
(3) NC
(2) COM
(1) VCC(L)
VCC
VB
OUT
COM VS
IN
(14) VCC(H)
(13) IN(H)
(11) NC
(9) G(L)
(10) E(L)
(17) G(H)
(18) E(H)
(12) NC
(19) R(TH)
(20) V(TH)
NB2 (21)
NC (22)
5www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Absolute Maximum Ratings (TJ = 25°C, Unless Otherwise Specified)
Inverter Part
Note:
1. The maximum junction temperature rating of the power chips integrated within the module is 150 °C(@TC 10 0°C). However, to insure safe operation, the average junction
temperature should be limited to TJ(ave) 125°C (@TC 100°C)
Control Part
Total System
Thermal Resistance
Note:
2. For the m easurement p oint of case temperature (TC), please refer to Figure 2.
Symbol Parameter Conditions Rating Units
VPN(Surge) Supply Voltage (Surge) Applied between P- NA, NB1, NB2 550 V
VCES Collector-emitter Voltage 600 V
± ICEach IGBT Collector Current TC = 25°C 50 A
± ICP Each IGBT Collector Current (Peak) TC = 25°C, Under 1ms Pulse Width 100 A
PCCollector Dissipation TC = 25°C per One IGBT 110 W
TJOperating Junction Temperature (Note 1) -20 ~ 125 °C
Symbol Parameter Conditions Rating Units
VCC Control Supply Voltage Applied between VCC(H), VCC(L) - COM 20 V
VBS High-side Control Bias Voltage Applied between VB - VS20 V
VIN Input Signal Voltage Applied between IN(H), IN(L) - COM -0.3~5.5 V
VFO Fault Output Supply Voltage Applied between VFO - COM -0.3~VCC+0.3 V
IFO Fault Output Current Sink Current at VFO Pin 5 mA
VSC Current Sensing Input Voltage Applied between CSC - COM -0.3~VCC+0.3 V
Symbol Parameter Conditions Rating Units
VPN(PROT) Self Protection Supply Voltage Limit
(Short Circuit Protection Capability) VCC = VBS = 13.5 ~ 16.5V
TJ = 125°C, Non-repetitive, less than 6µs400 V
TCModule Case Operation Temperature -20 ~ 95 °C
TSTG Storage Temperature -40 ~ 125 °C
VISO Isolation Voltage 60Hz, Sinusoidal, AC 1 minute, Connection
Pins to DBC 2500 Vrms
Symbol Parameter Conditions Min. Typ. Max. Units
Rth(j-c)Q Junction to Case Thermal
Resistance Each IGBT under Operating Condition - - 0.90 °C/W
Rth(j-c)F Each FWDi under Operating Condition - - 2.2 °C/W
6www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Electrical Characteristics (TJ = 25°C, Unless Otherwise Specified)
Inverter Part
Note:
3. tON and tOFF include the propagation delay time of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving cond ition internally.
For the detailed information, please see Figure 4.
Figure 4. Switching Time Definition
Symbol Parameter Conditions Min. Typ. Max. Units
VCE(SAT) Collector-Emitter
Saturation Voltage VCC = VBS = 15V
VIN = 5V IC = 50A, TJ = 25°C - 1.6 2.3 V
VFM FWDi Forward Voltage VIN = 0V IC = 50A, TJ = 25°C - 2.1 3.0 V
HS tON Switching Times VPN = 300V, VCC = VBS = 15V
IC = 50A
VIN = 0V 5V, Inductive Load
RE(H) = 10
(Note 3)
-0.8- µs
tC(ON) -0.6- µs
tOFF -1.5- µs
tC(OFF) -0.8- µs
trr -0.08- µs
LS tON VPN = 300V, VCC = VBS = 15V
IC = 50A
VIN = 0V 5V, Inductive Load
(Note 3)
-1.1- µs
tC(ON) -0.9- µs
tOFF -1.5- µs
tC(OFF) -0.8- µs
trr -0.05- µs
ICES Collector - Emitter
Leakage Current VCE = VCES - - 250 µA
VCE
IC
VIN
tOFF tC(OFF)
VIN(OFF) 10% VCE 10% IC
VCE IC
VIN
tON tC(ON)
VIN(ON) 10% IC10% VCE
90% IC
100% IC
trr
7www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Electrical Characteristics (TJ = 25°C, Unless Otherwise Specified)
Control Part
Note:
4. Short-circuit current protection is functioning only at the low-sides.
5. The fault-out pulse width tFOD depends on the capacitance value of CFOD according to the following approximate equation : CFOD = 18.3 x 10-6 x tFOD[F]
Recommended Operating Conditions
Symbol Parameter Conditions Min. Typ. Max. Units
IQCCL Quiescent VCC Supply
Current VCC = 15V
IN(L) = 0V VCC(L) - COM - - 40 mA
IQCCH VCC = 15V
IN(H) = 0V VCC(H) - COM - - 80 µA
IQBS Quiescent VBS Supply
Current VBS = 15V
IN(H) = 0V VB - VS- - 100 µA
VFOH Fault Output Voltage VSC = 0V, VFO Circuit: 4.7k to 5V Pull-up 4.5 - - V
VFOL VSC = 1V, VFO Circuit: 4.7k to 5V Pull-up - - 0.8 V
VSC(ref) Short Circuit Trip Level VCC = 15V (Note 4) 0.45 0.5 0.55 V
UVCCD Supply Circuit Under-
Voltage Protection Detection Level Applied between
VCC(L) - COM 10.5 - 12.5 V
UVCCR Reset Level 11.0 - 13 V
UVBSD Detection Level Applied between
VB - VS
10.0 - 12.5 V
UVBSR Reset Level 10.5 - 13.0 V
tFOD Fault-out Pulse Width CFOD = 33nF (Note 5) 1.4 1.8 2.0 ms
VIH ON Threshold Voltage Logic‘1’ input voltage Applied between
IN(H), IN(L) - COM 3.0 - - V
VIL OFF Threshold Voltage Logic‘0’ input voltage - - 0.8 V
IINH(ON) Input Bias Current IN(H) = 5V Applied between
IN(H), IN(L) - COM 0.9 - 2.2 mA
IINL(ON) IN(L) = 5V 0.9 - 2.4 mA
RTH Resistance of Thermistor @ TC = 25°C (Note Fig. 10) - 50 - k
@ TC = 80°C (Note Fig. 10) - 5.76 - k
Symbol Parameter Conditions Value Units
Min. Typ. Max.
VPN Supply Voltage Applied between P - NA, NB1, NB2 - 300 450 V
VCC Control Supply Voltage Applied between VCC(H), VCC(L) - COM 13.5 15 16.5 V
VBS High-side Bias Voltage Applied between VB - VS13.5 15 18.5 V
fPWM PWM Input Signal TC 100°C, TJ 125°C - 3 - kHz
VIN(ON) Input ON Voltage Applied between IN(H), IN(L) - COM 4 ~ 5.5 V
VIN(OFF) Input OFF Voltage Applied between IN(H), IN(L) - COM 0 ~ 0.65 V
8www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Mechanical Characteristics and Ratings
Figure 5. Flatness Measurement Position
Parameter Conditions Limits Units
Min. Typ. Max.
Mounting Torque Mounting Screw - M3 5.17 6.29 7.30 Kg•cm
0.51 0.62 0.72 N•m
Surface Flatness Note Figure 5. 0 - 120 um
Weight - 15.0 - g
(+)
(+)
(+)
9www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Time Charts of Protective Function
a1 : Control supply voltage rises: After the voltage rises UVCCR, the circuits start to operate when next input is applied.
a2 : Normal operation: IGBT ON and carrying current.
a3 : Under voltage detection (UVCCD).
a4 : IGBT OFF in spite of control input condition.
a5 : Fault output operation starts.
a6 : Under voltage reset (UVCCR).
a7 : Normal operation: IGBT ON and carrying current.
Fig. 6. Under-Voltage Protection (Low-side)
b1 : Control supply voltage rises: After the voltage reaches UVBSR, the circuits start to operate when next input is applied.
b2 : Normal operation: IGBT ON and carrying current.
b3 : Under voltage detection (UVBSD).
b4 : IGBT OFF in spite of control input condition, but there is no fault output signal.
b5 : Under voltage reset (UVBSR)
b6 : Normal operation: IGBT ON and carrying current
Fig. 7. Under-Voltage Protection (High-side)
Input S ignal
Output Current
Fault Output Signal
Control
Supply Voltage
RESET
UVCCR
Protection
Circuit S tate SET RESET
UVCCD
a1 a3
a2 a4
a6
a5
a7
Input S ignal
Output Current
Fault Output Signal
Control
Supply Voltage
RESET
UVBSR
Protection
Circuit S tate SET RESET
UVBSD
b1 b3
b2 b4 b6
b5
High-level (no fault output)
10 www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
(with the external shunt resistance and CR connection)
c1 : Normal operation: IGBT ON and carrying current.
c2 : Short circuit current detection (SC trigger).
c3 : Hard IGBT gate interrupt.
c4 : IGBT turns OFF.
c5 : Fault output timer operation starts: The pulse width of the fault output signal is set by the external capacitor CFO.
c6 : Input “L” : IGBT OFF state.
c7 : Input “H”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.
c8 : IGBT OFF state
Fig. 8. Short-Circuit Current Protection (Low-side Operation only)
Fig. 9. R-T Curve of the Built-in Thermistor
In te rn a l IGBT
Ga te -Emitte r V o lta g e
In p u t S ig n a l
O utput Current
Sensing V oltage
F a u lt Ou tp u t S ig n a l
P1
P2
P3
P4
P6
P5
P7
P8
S C R e fe re n ce
Voltage (0.5V )
RC Filter Delay
SC Detection
R-T G ra ph
0
20
40
60
80
100
120
20 30 40 50 60 70 80 90 100 110 120 130
Temperature [°C]
Resistance [k]
11 www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Note:
1. RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application’s
printed circuit board. The input signal section integrates 3.3k(typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal
voltage dr op at input terminal.
2. The logic input is compatible with standard CMOS or LSTTL outputs.
Figure 10. Recommended CPU I/O Interface Circuit
Note:
It would be recommended that the boots trap diode, DBS, has soft and fast recovery characteristics. RBS should be 2.5 times greater than RE(H)
Figure 11. Recommended Bootstrap Operation Circuit and Pa rameters
CPU
COM
5V-Line
1nF
4.7k
VFO
100
1nF
SRM Module
RPF=
CPF=
IN(H)
IN(L)
15V-Line
25Ω
18uF 0.1uF
1000uF 1uF
SRM m odule
Vcc
IN
COM
VB
HO
VS
Vcc
IN
COM
OUT
Outputs
P
NA
This Value depends on P WM Control Algorithm
DBS
RBS
VSL
NB
RE(H)=10
12 www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Note:
1. To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm)
2. By virtue of integrating an application specific type HVIC inside the Module, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible.
3. VFO output is open collector type. This signal line should be pulled up to the positive side of the 5V power supply with approximately 4.7k resistance. Please refer to Figure
10.
4. CSP15 of around 7 times larger than bootstrap capacitor CBS is recommended.
5. VFO output pulse width should be determined by connecting an external capacitor(CFOD) between CFOD(pin7) and COM(pin2) . (Example : if CFOD = 33 nF, then tFO = 1.8ms
(typ.)) Please refer to the note 6 for calculation method.
6. Input signal is Hi gh-Ac tive ty pe. The re is a 3.3k resistor inside the IC to pull down each input signal line to GND. When employing RC coupling circuits, set up such RC couple
that input signal agree with turn-off/turn-on threshold voltage.
7. To prevent errors of the protection function, the wiring around RSC, RF and CSC should be as short as possible.
8. In the short-circuit protection circuit, please select the RFCSC time constant in the range 3~4 µs.
9. Each capacitor should be mounted as close to the pins as possible.
10. To preve nt surge dest ruction , the wi ring be tween th e smo othin g cap acitor and the P&N p ins sho uld be a s short as possibl e. The use o f a high frequ ency no n-indu ctive capac-
itor of around 0.1~0 .22 µF between P and N pins is recommended.
11. Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays.
12. CSPC15 should be over 1uF and mounted as close to the pins of the module as possible.
13. NB1(pin23) and NB2(pin 21) should be shorted exter nally. Fig. 12. Application Circuit
Fault
15V line
CBS CBSC
RBS DBS
CSP15 CSPC15
CFOD
5V line
RPF
CPL
CBPF
RS
M
CDCS
Gating BL
CPF
C
P
U
RF
Inp ut Signa l for
Short-Circuit Protection
CSC
Gating AH
COM(L)
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(WL)
OUT(VL)
OUT(UL)
NB1 (23)
NA (24)
B (25)
A (26)
P (27)
(16) VS
(15) VB
(8) CSC
(7) CFOD
(6) VFO
(5) IN(L)
(4) NC
(3) NC
(2) COM
(1) VCC(L)
VCC
VB
OUT
COM VS
IN
(14) VCC(H)
(13) IN(H)
(11) NC
(9) G(L)
(10) E(L)
(17) G(H)
(18) E(H)
(12) NC
(19) R(TH)
(20) V(TH)
NB2 (21)
NC (22)
RE(H)
13 www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Detailed Package Outline Drawings
14 www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Detailed Package Outline Drawings (Continued)
15 www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
Detailed Package Outline Drawings (Continued)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to
be an exhaustive list of all such trademarks.
16 www.fairchildsemi.com
FCAS50SN60 Rev. A
FCAS50SN60 Smart Power Module for SRM
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support
or sustain life, or (c) whose failure to perform when properly used
in accordance with instructions for use pr ovided in the labeling,
can be reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life support device
or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or system, or to
affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
FAST®
FASTr™
FPS™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
i-Lo
ImpliedDisconnect™
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC®
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerEdge™
PowerSaver™
PowerTrench®
QFET®
QS™
QT Optoelectronics™
Quiet Se ries™
RapidConfigure™
RapidConnect™
µSerDes™
SILENT SWITCHER®
SMART START™
SPM™
Stealth™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic®
TINYOPTO™
TruTranslation™
UHC™
UltraFET®
UniFET™
VCX™
ACEx™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOLT
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
FACT Quiet Series™
Across the board. Around the world.™
The Power Franchise®
Programmable Active Droop™
Rev. I14