L
SMD Wraparound Ultra Low Value
Thin Film Resistors Vishay Sfernice
Document Number: 53018 For technical questions, contact: sfer@vishay.com www.vishay.com
Revision: 29-Oct-09 59
PACKAGING
Several types of packaging are proposed: waffle-pack and
tape and reel
Note
(1) 12 mm on request
• Size 2512 under development
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the top
of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please concult Vishay/Sfernice for specific ordering
code
Tape and Reel
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered is between the MOQ and the
maximum reel capacity, only one reel is provided.
When several reels are needed for ordered quantity
within MOQ and maximum reel capacity: Please consult
Vishay Sfernice for specific ordering code
SIZE MOQ
NUMBER OF PIECES PER PACKAGE
TAPE
WIDTH
WAFFLE PACK
2" × 2"
TAPE AND REEL
MIN. MAX.
0402
100
100
100
4000 8 mm
0603
0805
0705
1206 140
1505
60
2010 2000 8 mm (1)
PERFORMANCE
TESTS CONDITIONS
VALUES AND DRIFT
MIL-R-55342
REQUIREMENTS
TYPICAL
PERFORMANCES
Thermal shock MIL-R-55342 C
MIL-STD-702-Method 107 ± 0.25 % ± 0.02 %
Short time overload MIL-R-55342 C
PARA 3.10.4.7.5 ± 0.10 % ± 0.01 %
Low temperature operation MIL-R-55342 C
PARA 3.9 and 4.7.4 ± 0.25 % ± 0.01 %
Resistance to solder heat MIL-R-55342 C
PARA 3.12, 4.7.7, 4.7.1.2 ± 0.25 % ± 0.04 %
Moisture resistance
MIL-R-55342 C
PARA 3.13 and 4.7.8
MIL-STD-202-Method 106
± 0.40 % ± 0.01 %
High temperature MIL-R-55342 C
PARA 3.11 and 4.7.6 ± 0.20 % ± 0.075 %
Load life
MIL-R-55342 C
2000 h Pn at 70 °C
MIL-STD-202-Method 108
± 0.50 % ± 0.15 %