© 2015 Fairchild Semiconductor Corporation FEBFIS1100MEMS_IMU6D3X Rev. 1.0
User Guide for
FIS1100 Evaluation Kit
(FEBFIS1100MEMS_IMU6D3X)
6D Inertial Measurement Unit with Motion
Co-Processor and Sensor Fusion Library
Featured Fairchild Products:
FIS1100, FAN2558, FXL4TD245, FXMA2102
For technical support, please contact Fairchild Semiconductor
or your local sales team Fairchild Sales Offices
© 2015 Fairchild Semiconductor Corporation 2 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Table of Contents
1. Introduction ............................................................................................................................... 3
1.1. Description ....................................................................................................................... 3
1.2. Features ............................................................................................................................ 4
1.3. Applications ..................................................................................................................... 4
1.4. Evaluation Board Block Diagram .................................................................................... 5
2. Evaluation Board Specifications ............................................................................................... 7
3. Photographs............................................................................................................................... 8
4. Getting Started with MT Manager ............................................................................................ 9
4.1. FIS1100 SDK Installation ................................................................................................ 9
4.2. Installed Software ........................................................................................................... 10
4.3. Hardware Connection ..................................................................................................... 10
4.4. Using MT Manager ........................................................................................................ 11
5. Printed Circuit Board (PCB) ................................................................................................... 22
6. Schematics .............................................................................................................................. 23
7. Bill of Materials (BOM) ......................................................................................................... 26
8. Testing MCU power consumption .......................................................................................... 28
9. Revision History ..................................................................................................................... 29
© 2015 Fairchild Semiconductor Corporation 3 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
1. Introduction
This user guide supports the evaluation kit for the FIS1100. The FIS1100 evaluation kit is
designed to support your evaluation of the system performance, accuracy and features
using the easy to use MT Manager Windows GUI application, as well as to support your
hardware integration and embedded software integration efforts using the extensive
FIS1100 SDK.
The FIS1100 evaluation kit should be used in conjunction with the FIS1100 datasheets as
well as Fairchild‟s application notes and technical support team. Please visit Fairchild‟s
website at www.fairchildsemi.com.
This document describes the evaluation system for the FIS1100 in combination with the
XKF3 sensor fusion library, reference drivers for the FIS1100 (source code) and an
example sensor fusion project for ARM Cortex-M microcontrollers. The document
contains general information to help the user get started with evaluating the solution,
install the FIS1100 SDK and includes an introduction to the MT Manager software, and
demonstrates the advantage of the FIS1100 AttitudeEngineTM for building accurate low
power 3D motion tracking solutions.
1.1. Description
The FIS1100 is the world‟s first complete consumer 6D MEMS Inertial Measurement
Unit (IMU) with sensor fusion to specify system level orientation accuracy. When using
the FIS1100 in combination with the supplied XKF3 9D sensor fusion, the system
features an accurate ± pitch and roll orientation, and a ±5º yaw/heading typical
specification.
The FIS1100 incorporates a 3-axis Gyroscope and a 3-axis Accelerometer and can
connect an external 3-axis magnetometer through an I²C master thus forming a complete
9DOF system.
The FIS1100 also incorporates an advanced vector Digital Signal Processor (DSP)
motion co-processor called the AttitudeEngine. The AttitudeEngine efficiently encodes
high frequency motion at high internal sampling rates, preserving full accuracy across
any output data rate.
This enables the application to utilize low Output Data Rates (ODR) or on-demand (host
polling) and still acquire accurate 3D motion data. The AttitudeEngine allows reducing
the data processing and interrupt load on a host processor with no compromises in 3D
motion tracking accuracy. The result is very low total system power in combination with
high accuracy, which are essential to many portable and battery powered applications.
The XKF3 sensor fusion library for ARM Cortex-M provides a robust sensor fusion
solution based on Xsens‟ more than 15 years of experience in the industrial and human
movement motion tracking fields. The XKF3 sensor fusion algorithm is optimized for use
with the FIS1100 AttitudeEngine to provide high accuracy orientation and high-pass 3D
velocity outputs at very low processor utilization.
© 2015 Fairchild Semiconductor Corporation 4 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
1.2. Features
FIS1100 6D Inertial Measurement Unit
- World‟s First Complete Consumer Inertial Measurement Unit (IMU) with Sensor
Fusion Library to Specify Orientation Accuracy: ±3º Pitch and Roll, ±5º
Yaw/Heading
- 3-Axis Gyroscope and 3-Axis Accelerometer in a Small 3.3 x 3.3 x 1 mm LGA
Package
- Integrated AttitudeEngine Motion Co-processor with Vector DSP Performs
Sensor Fusion at 1 kHz Sampling Rate, while Outputting Data to Host Processor
at a Lower Rate Improving Accuracy while Reducing Processor MIPS, Power,
and Interrupt Requirements
- Complete System Solution for 3D Motion Tracking, Optimized 9D Sensor
Fusion Library (XKF3) Featuring in-use Auto-Calibration Enabling Accurate 3D
Orientation (quaternion) and High-Pass 3D Velocity Motion Tracking
- Large 1536 Byte FIFO can be used to Buffer 9DOF Sensor Data to Lower
System Power Dissipation
- New Motion on Demand Technology for Polling Based Synchronization
- Large Dynamic Range from ±32 dps to ±2,560 dps and ±2 g to ±8 g
- Low Latency, High-Resolution OIS Mode
- Low Noise 50 µg/Hz Accelerometer and 10 mdps/Hz Gyroscope
- Low Power and Warm-Start Modes for Effective Power Management
- Digitally Programmable Sampling Rate and Filters
- Host Serial Interface Supporting I2C or SPI
- I2C Master for Interfacing External Magnetometer
- Embedded Temperature Sensor
- Wide Extended Operating Temperature Range (-40°C to 85°C)
XKF3 9D Sensor Fusion Library
- Continuous Sensor Auto Calibration, No User Interaction Required
- Real-Time, Low-Latency Optimal estimate of 3D Orientation
- Best-in-Class Immunity to Magnetic Distortions
- Best-in-Class Immunity to Transient Accelerations
- Flexible use Scenarios, North Referenced, Unreferenced
- Extensive Status Reporting for Smooth Integration in Applications
- Optimized Library for Popular Microcontrollers
1.3. Applications
Sport & Fitness Tracking
Wearable and Health Monitoring
Pedestrian Navigation
Light Industrial, Robotics and Autonomous Machines
Natural User Interfaces, Gaming, VR/AR
GNSS Augmentation and Dead Reckoning
Optical Video and Image Stabilization
© 2015 Fairchild Semiconductor Corporation 5 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
1.4. Evaluation Board Block Diagram
Figure 1. FEBFIS1100MEMS_IMU6D3X Block Diagram
NXP LPCXpresso54102
ARM Cortex-M development board
NXP LPC54102
ARM Cortex-M4F / M0+ dual core
ARM CMSIS RTOS
NXP LPC4325
CMSIS-DAP debugger
UART bridge
UART
FIS1100
Driver XKF3 Xbus
Interface
FEBFIS1100
Arduino UNO R3 compatible shield
FIS1100
AKM8975
AKM9912
Level Translation
Voltage
Regulation
I2C/SPI
Windows/Linux PC
MTManager
Motion Tracker GUI
interface
USB
© 2015 Fairchild Semiconductor Corporation 6 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Hardware abstraction
interface layer
Generic C99
LPC54102 specific
Static librariesARM CMSIS-RTOS
I2C driver SPI driver
Shield interface
UART driver
libXbus_CMx.aXbus interface
FIS1100 driver
Sensor Fusion libXKF3_CMx.a
NXP LPC54102 support drivers
NXP LPC54102
FIS1100 HAL Xbus HAL
External Magnetometer
Interface
AKM9912
driver
AKM9912 HAL
Figure 2. Firmware Component Overview
© 2015 Fairchild Semiconductor Corporation 7 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
2. Evaluation Board Specifications
Table 1. FEBFIS1100MEMS_IMU6D3X Arduino Uno-R3 Shield Electrical Specifications
Description
Symbol
Min
Nominal
Max
Comments
Input Voltage
VIN
3.1 V
3.3 V, 5 V
5.5 V
Choice of voltage input pin
controlled by placement of R100
or R101 0-Ohm resistors
IO Reference voltage
IOREF
1.65 V
3.65 V
Voltage on any other pin
GND
IOREF
Table 2. FEBFIS1100MEMS_IMU6D3X System Level 3D Orientation Accuracy Specifications
Parameter
Typical
Unit
Comments
Roll
±3
deg
Requires use of XKF3 software library on
host processor.
Pitch
±3
deg
Requires use of XKF3 software library on
host processor.
Yaw (Heading)
Referenced to North
±5
deg
Requires use of XKF3 software library on
host processor, using magnetometer, in a
homogenous Earth magnetic field.
Yaw (Heading)
Unreferenced
5-25
deg/h
From Allan Variance bias instability.
Does not require a magnetometer.
(See spec above for use with
magnetometer.)
Fully immune to magnetic distortions.
Output Data Rate
8 - 1000
Hz
To benefit from the power saving using the
AttitudeEngine, use a max ODR of 64 Hz.
© 2015 Fairchild Semiconductor Corporation 8 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
3. Photographs
Figure 3. FEBFIS1100MEMS_IMU6D3X Shield Board (Arduino UNO R3 Compatible)
Figure 4. FEBFIS1100MEMS_IMU6D3X Shield Board Mounted on NXP LPCXpresso54102 MCU
Evaluation Board
© 2015 Fairchild Semiconductor Corporation 9 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
4. Getting Started with MT Manager
4.1. FIS1100 SDK Installation
Figure 5. Execute the FIS1100 SDK Installer
Figure 6. Carefully Review the License Terms and if applicable agree to them to install the FIS1100 SDK
© 2015 Fairchild Semiconductor Corporation 10 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
4.2. Installed Software
Installed Software Includes:
Fairchild MT Manager
- GUI to Control FIS1100 Evaluation Board Settings
- Visualize Real Time Data Streams as Graphs
- Visualize Real Time 3D Orientation
- Record Data (ASCII) for Offline Analysis
- Playback Recorded Data for Offline Analysis
FIS1100 Software Development Kit (SDK)
- HTML Documentation for FIS1100 SDK, Including XKF3 API
- High Level C99 Driver for FIS1100
- XKF3 Libraries for Cortex-M0, M3 and M4F Cores
- ARM CMSIS-RTOS Reference Implementation for using FIS1100
Driver with XKF3 Library
- Example Firmware for NXP LPCXpresso5412
- System Integration Documentation
NXP LPCXpresso5412 Board USB Driver
- USB UART Emulation
- ARM CMSIS-DAP Debug Support
- MCU Power Consumption Measurement(1)
4.3. Hardware Connection
The FEBFIS1100MEMS_IMU6D3X “shield” board should be mounted onto the Arduino
compatible MCU board as shown in Figure 4. The MCU board should then be connected
to the host PC via a USB cable connected to JP6 as shown in Figure 7
For normal use, the DFULink jumper JP5 should be removed before the USB cable is
connected to the host PC (2)
Figure 7. Location of USB connection (J6) and DFULink jumper (JP5)
Notes:
1. Requires additional tools from NXP to be installed.
2. JP5 can be used to enable firmware upload to support MCU power measurements.
© 2015 Fairchild Semiconductor Corporation 11 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
4.4. Using MT Manager
Connecting to Evaluation Systems
Figure 8. MT Manager GUI
With the FEBFIS1100MEMS_IMU6D3X evaluation kit connected to the PC via USB,
and drivers installed, start the MT Manager software. The software automatically scans
for connected systems and displays these in the device list (4). If the MT Manager
software is started before the evaluation board is connected, the scan buttons (1) can be
used to rescan for a connected evaluation kit. Alternatively press the F5 key to rescan for
a connected evaluation kit.
With an evaluation kit selected in the device list the system operating parameters can be
controlled by opening the output configuration panel (2).
Data from attached evaluation boards can be visualized by selecting one or more the
visualization buttons (3).
Data from the evaluation system can be recorded to file for off-line analysis using the
record button (5). Data is recorded in a custom binary file format (.mtb), which can be
exported to ASCII data (File/Export) for easy analysis in other tools.
4
2
1
3
5
© 2015 Fairchild Semiconductor Corporation 12 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Configuring the FIS1100 Evaluation Kit
Clicking on the output configuration button (2) will open the output configuration dialog
for the devices selected in the device list (3)
The output configuration dialog allows the major functions of the FIS1100 and XKF3
fusion library to be configured.
Note:
3. If only a single device is connected it is automatically selected.
Figure 9. FEBFIS1100MEMS_IMU6D3X Output Configuration Dialog
© 2015 Fairchild Semiconductor Corporation 13 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Table 3. FEBFIS1100MEMS_IMU6D3X Output Configuration Options
Section
Option
Comments
FIS1100 output mode
AttitudeEngine
Uses the FIS1100 Attitude Engine to process
data at 1 kHz and output orientation and velocity
increments at the selected ODR
Accelerometer + Gyroscope
Outputs raw accelerometer and gyroscope data
at the selected ODR
Enable FIS1100 FIFO
Enables the FIS1100 FIFO to reduce data
interrupt frequency. This option is only available
in Accelerometer + Gyroscope mode.
Magnetometer selection
None
Disables magnetometer support.
AKM8975
Enables the FIS1100 support for a slaved
AK8975C magnetometer.
AKM9912
Enables firmware controlled sampling of the
AKM9912 magnetometer
Communication interface
SPI
Uses SPI for communication with sensor
components on the
FEBFIS1100MEMS_IMU6D3X shield. Note that
once SPI communication has been selected the
evaluation board must be reset to return to I²C
mode.
I²C
Uses I²C for communication with sensor
components on the
FEBFIS1100MEMS_IMU6D3X shield
Output Raw Input Data
Enables sending raw sensor data values to MT
Manager
Scenario
Navigation
The 3D orientation output from the XKF3 fusion
library is referenced to the local magnetic north
and will actively track North based on the Earth
magnetic field.
Gaming
Disables north referenced output, use this
scenario if you do not need North referenced
data and want the smoothest possible 3D
orientation output. If magnetometer data is
available, yaw drift will be reduced further.
Fused Outputs
Orientation
Enables sending the XKF3 orientation output to
MT Manager
Filter Status
Enables sending XKF3 status flags to MT
Manager
High-pass Velocity
Enables sending XKF3 high-pass velocity output
to MT Manager
Corrected Sensor Data
Acceleration
Enables sending XKF3 corrected acceleration
data to MT Manager
Angular Velocity
Enables sending XKF3 corrected angular
velocity (gyroscope) data to MT Manager
Magnetic Field
Enables sending XKF3 corrected magnetometer
data to MT Manager
© 2015 Fairchild Semiconductor Corporation 14 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Visualizing Sensor Data
MT Manager provides real time visualization of data sent from the evaluation system.
3D Orientation View
The 3D Orientation View provides a representation of the 3D orientation of the
evaluation board. The view is orientated such that the user is looking from North to South
at the evaluation board.
The „Orientation‟ output must be enabled in the output configuration options dialog to
use this view.
Figure 10. 3D Orientation View
Inertial Data View
The Inertial Data view provides graphical visualization of the inertial and magnetic field
data output by the XKF3 fusion library. The XKF3 fusion library corrects for typical
sensor errors such as gyroscope biases and magnetic hard and soft-iron distortions.
The „Corrected Sensor Data‟ options in the output configuration options dialog control
which sensor data types are available for visualization.
© 2015 Fairchild Semiconductor Corporation 15 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 11. Inertial Data View
Euler/Quaternion Orientation Data View
The Euler/Quaternion Orientation Data views provide graphical visualization of the
orientation of the evaluation board. The choice of visualization mode can be made in the
Tools Preferences MT Manager Graphs configuration dialog.
The „Orientation‟ output must be enabled in the output configuration options dialog to
use this view.
© 2015 Fairchild Semiconductor Corporation 16 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 12. Euler/Quaternion Orientation Data Views
Status Data View
The Status Data view provides a graphical representation of the XKF3 fusion library
status flags. These status flags are provided by XKF3 to provide applications feedback on
problems with the input sensor data that might affect the quality of the fused output
quantities.
The „Filter Status‟ output must be enabled in the output configuration options dialog to
use this view.
© 2015 Fairchild Semiconductor Corporation 17 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 13. Status Data View
Table 4. XKF3 Status Flag Descriptions
Flag
Description
Warning
High value indicates that the output of XKF3 should not be trusted. Details of
possible causes can be found in the subsequent flags.
Clipping Detected
High indicates that one or more sensors have exceeded their dynamic range.
MFM Active
High indicates that automatic magnetometer calibration is active and a new
calibration is being determined.
Heading Unreliable
High indicates that the heading of the system cannot be determined accurately.
The ‘Vertical Mag Field’ and ‘Magnetic Distortion’ flags may provide further details.
Vertical Mag Field
High indicates that the local magnetic field is close to vertical (aligned with gravity).
Magnetic Distortion
High indicates that the local magnetic field is distorted.
Inclination Warning
High indicates that the inclination (roll/pitch) of the system cannot be determined
accurately. The ‘User Acc Warning’ flag may provide further details.
User Acc Warning
High indicates that the acceleration of the system violates the XKF3 model
assumption (that the average acceleration is zero within some time period). This
can happen when accelerating for long times, such as in a car.
Velocity Data View
The Velocity Data view provides a graphical representation of the XKF3 fusion library‟s
high pass velocity output. The high pass velocity output is designed for tracking short
term motion of the system, such as gestures of the arm with respect to the torso.
The „High-pass Velocity‟ option must be enabled in the output configuration options
dialog to use this view.
© 2015 Fairchild Semiconductor Corporation 18 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 14. HP Velocity Data View
Device context menu
Right clicking on the FIS1100 SDK device in the Device List provides a context menu
with three options:
Sleep Wake on Motion: Selecting this menu item places the evaluation kit into
wake on motion mode. The FIS1100 will be configured to provide an interrupt on
detecting motion that will wake the MCU from sleep.
Store filter state: Selecting this menu item requests the evaluation kit to save the
XKF3 filter state to non-volatile storage. This allows the automatically estimated
calibration parameters to be stored over power cycles, resulting in better startup
performance.
Disconnect: Selecting this menu item will disconnect the MTManager GUI from
the evaluation kit.
© 2015 Fairchild Semiconductor Corporation 19 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 15. Device Context Menu Available on Right Clicking on FIS1100 SDK Device in Device List
Recording and Exporting Data
Data from the evaluation system can be recorded to file for off-line analysis using the
record button , see Figure 8. The data to record should be configured in the output
configuration dialog prior to starting recording.
Data is recorded in a custom binary file format (.mtb). Recorded data in .mtb format can
be exported to ASCII format for analysis in external tools. The data fields to export can
be selected in the ToolsPreferences dialog as show in Figure 16.
© 2015 Fairchild Semiconductor Corporation 20 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 16. MT Manager ASCII Export Configuration
© 2015 Fairchild Semiconductor Corporation 21 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Table 5. FEBFIS1100MEMS_IMU6D3X Export Options
Section
Option
Description
Comments
Orientation
None
Don’t output orientation data
Quaternion
Output orientation as unit quaternion
Orientation output must be selected in output
configuration options dialog for this data to be
available for export.
Euler Angles
Output orientation as Euler angles
Matrix
Output orientation as rotation matrix
Position and
Velocity
Position
Not supported by
FEBFIS1100MEMS_IMU6D3X
Velocity
Output high pass velocity data
High pass velocity output must be selected in
output configuration dialog for this data to be
available for export.
GNSS
Not supported by
FEBFIS1100MEMS_IMU6D3X
Inertial Data
Orientation
Increment
Velocity
Increment
Rate of Turn
Output XKF3 corrected gyroscope
data
Rate of Turn output must be selected in output
configuration dialog for this data to be
available for export.
Acceleration
Output XKF3 corrected acceleration
data
Accelerometer output must be selected in
output configuration dialog for this data to be
available for export
Free
Acceleration
Not supported by
FEBFIS1100MEMS_IMU6D3X
Miscellaneous
Sensors
Magnetic Field
Output XKF3 corrected magnetic
field data
Magnetic Field output must be selected in
output configuration dialog for this data to be
available to export
Temperature
Not supported by
FEBFIS1100MEMS_IMU6D3X
Gyro
Temperatures
Barometric
Pressure
Sensor
Component
Readout
SCR
Acceleration
Raw acceleration samples from the
FIS1100
Output Raw Input Data must be selected in
output configuration dialog for this data to be
available to export
SCR Gyroscope
Data
Raw gyroscope samples from the
FIS1100
SCR Magnetic
Field
Raw magnetometer samples
SCR
Temperature
Not supported by
FEBFIS1100MEMS_IMU6D3X
SCR Gyro
Temperature
Timestamp
Status
Status Word
Output XKF3 status flags
Filter Status output must be selected in output
configuration dialog for this data to be
available to export.
Clipping Flags
Not supported by
FEBFIS1100MEMS_IMU6D3X
RSSI
Triggers
© 2015 Fairchild Semiconductor Corporation 22 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
5. Printed Circuit Board (PCB)
Figure 17. Top Side
© 2015 Fairchild Semiconductor Corporation 23 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
6. Schematics
Figure 18. FEBFIS1100MEMS_IMU6D3X Evaluation Board Schematic (Main)
Headers
Power
© 2015 Fairchild Semiconductor Corporation 24 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 19. FEBFIS1100MEMS_IMU6D3X Evaluation Board Schematic (Interfaces)
Level Translators
Fixed Level Translators
User Interface
© 2015 Fairchild Semiconductor Corporation 25 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Figure 20. FEBFIS1100MEMS_IMU6D3X Evaluation Board Schematic (Sensors)
Magnetometers
Optional Barometer
FIS1100
Pull-up/down Resistors
© 2015 Fairchild Semiconductor Corporation 26 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
7. Bill of Materials (BOM)
Reference
Qty.
Part Number
Value
Description
Manufacturer
C100, C101,
C102, C103
4
4.7 µF/10 V/X5R, 10%
4.7 µF/10 V/X5R,
10%
C200, C201, C202,
C203, C204, C205,
C206, C207, C300,
C301, C302, C303,
C304, C305
14
100 nF/25 V/X5R, 10%
100 nF/25 V/X5R,
10%
DS200, DS201
2
KP-1608SGC
LED, 0603, GREEN
LED, 0603, Green
Kingbright
P100
1
SSQ-110-03-G-S
SOCKET
DIGITAL_COM
10-pins Stackable
Socket for
Communication and
digital IO
Samtec
P101
1
SSQ-108-03-G-S
SOCKET POWER
8-pins Stackable
Socket for Power
Samtec
P102
1
SSQ-108-03-G-S
SOCKET DIGITAL_IO
8-pins Stackable
Socket for Digital IO
Samtec
P103
1
SSQ-106-03-G-S
SOCKET ANALOG_IN
6-pins Stackable
Socket for Analog
Inputs
Samtec
Q200, Q201
2
2N7002
N-Channel MOSFET
2N7002
N-MOSFET 2N7002
Fairchild
R100, R102, R104,
R106, R108, R112
6
0R_0402_1%
0R_0402_1%
R109
1
143k_0402_1%
143k_0402_1%
R110, R114
2
39k_0402_1%
39k_0402_1%
R111, R200, R201,
R202, R203, R206,
R207, R300, R301,
R302, R304, R305,
R306, R307, R308
15
10k_0402_1%
10k_0402_1%
R113
1
82k_0402_1%
82k_0402_1%
R204, R205
2
100R_0402_1%
100R_0402_1%
S300
1
FIS1100
FIS1100
FIS1100: Virtual 9
Degrees of Freedom
(9 DOF) Attitude and
Heading Reference
System (AHRS)
Fairchild
S301
1
AK8975C
AK8975C
3-axis Electronic
Compass
AKM
S302
1
AK09912C
AK09912C
3-axis Electronic
Compass
AKM
U100, U101
2
FAN2558SX
FAN2558SX
180 mA Low Voltage
CMOS LDO
Fairchild
U200
1
FXMA2102L8X
FXMA2102L8X
Dual-Supply, 2-Bit
Voltage Translator for
Open-Drain
Applications
Fairchild
Continued on the following page…
© 2015 Fairchild Semiconductor Corporation 27 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
Bill of Materials (Continued)
Reference
Qty.
Part Number
Value
Description
Manufacturer
U201, U202, U203
3
FXL4TD245UMX
FXL4TD245UMX
Low-Voltage Dual-
Supply 4-Bit Signal
Translator with
Independent
Direction Controls
Fairchild
C306, C307
0
100 nF/25 V/X5R, 10%
100 nF/25 V/X5R,
10%
J100, J101
0
HEADER 2.54 - 2x1
(2 pins single row)
Header 2 pins Single
Row 2.54 mm Pitch
P300, P301
0
SSQ-108-01-G-S
SOCKET 2.54 - 8x1
(8 pins single row)
8-pins Socket with
2.54 mm Pitch
Samtec
R101, R103,
R105, R107
0
0R_0402_1%
0R_0402_1%
R303
0
10k_0402_1%
10k_0402_1%
S303
0
RESERVED
SW200
0
430182050816
WE 430182050816
Tact Switch Ws-TSS
Wurth Elektronik
© 2015 Fairchild Semiconductor Corporation 28 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
8. Testing MCU power consumption
The MCU development environment for the NXP LPCXpresso54102 board used by the
FEBFIS1100MEMS_IMU6D3X evaluation kit allows measuring the MCU power
consumption. This allows the MCU power consumption and utilization to be evaluated
with different configurations of FIS1100 outputs.
For details on performing power measurements please refer to the FIS1100 SDK HTML
documentation included in the FIS1100 SDK installation.
Figure 21. Power Consumption of the MCU Comparison example for FIS1100 Configurations
using the AttitudeEngine (SDI) vs. the FIS1100 Configured to Output Raw
Accelerometer and Gyroscope Samples
© 2015 Fairchild Semiconductor Corporation 29 FEBFIS1100MEMS_IMU6D3X Rev. 1.0
9. Revision History
Rev.
Date
Description
1.0.
April 2015
Initial Release
WARNING AND DISCLAIMER
Replace components on the Evaluation Board only with those parts shown on the parts list (or Bill of Materials) in the Users’ Guide. Contact an
authorized Fairchild representative with any questions.
This board is intended to be used by certified professionals, in a lab environment, following proper safety procedures. Use at your own risk. The
Evaluation board (or kit) is for demonstration purposes only and neither the Board nor this User’s Guide constitute a sales contract or create any kind
of warranty, whether express or implied, as to the applications or products involved. Fairchild warrantees that its products meet Fairchild’s published
specifications, but does not guarantee that its products work in any specific application. Fairchild reserves the right to make changes without notice to
any products described herein to improve reliability, function, or design. Either the applicable sales contract signed by Fairchild and Buyer or, if no
contract exists, Fairchild’s standard Terms and Conditions on the back of Fairchild invoices, govern the terms of sale of the products described herein.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO
IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR
USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR
THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a)
are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website,
www.fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing
counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation,
substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to
protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts
either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy
either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for
handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized
Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty
coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
EXPORT COMPLIANCE STATEMENT
These commodities, technology, or software were exported from the United States in accordance with the Export Administration Regulations for the
ultimate destination listed on the commercial invoice. Diversion contrary to U.S. law is prohibited.
U.S. origin products and products made with U.S. origin technology are subject to U.S Re-export laws. In the event of re-export, the user will be
responsible to ensure the appropriate U.S. export regulations are followed.