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2Revision: 22-Oct-08
20ETF..S Soft Recovery Series
Vishay High Power Products Surface Mountable Fast
Soft Recovery Rectifier Diode, 20 A
Note
(1) When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward voltage drop VFM
20 A, TJ = 25 °C 1.30 V
60 A, TJ = 25 °C 1.67
Forward slope resistance rt12.5 mΩ
Threshold voltage VF(TO) TJ = 150 °C 0.9 V
Maximum reverse leakage current IRM
TJ = 25 °C VR = Rated VRRM 0.1 mA
TJ = 150 °C 5.0
RECOVERY CHARACTERISTICS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Reverse recovery time trr IF at 20 Apk
100 A/µs
25 °C
160 ns
Reverse recovery current Irr 10 A
Reverse recovery charge Qrr 1.25 µC
Snap factor S Typical 0.6
IFM trr
dir
dt
IRM(REC)
Qrr
t
tatb
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range TJ, TStg - 40 to 150 °C
Maximum thermal resistance,
junction to case RthJC DC operation 0.9
°C/W
Maximum thermal resistance
junction to ambient (PCB mount) RthJA (1) 40
Soldering temperature TS240 °C
Approximate weight 2g
0.07 oz.
Marking device Case style D2PAK (SMD-220)
20ETF02S
20ETF04S
20ETF06S