PHOTODARLINGTON OPTOCOUPLERS DESCRIPTION The CNX48U, H11BX, MOC8080 and TIL113 have a gallium arsenide infrared emitter optically coupled to a silicon planar photodarlington. CNX48U H11B1 MOC8080 TIL113 H11B2 H11B255 H11B3 FEATURES * High sensitivity to low input drive current * Meets or exceeds all JEDEC Registered Specifications * VDE 0884 approval available as a test option -add option .300. (e.g., H11B1.300) 6 1 6 SCHEMATIC 1 ANODE 1 6 BASE APPLICATIONS * * * * * Low power logic circuits 6 Telecommunications equipment Portable electronics Solid state relays Interfacing coupling systems of different potentials and impedances. Parameter CATHODE 2 5 COLLECTOR N/C 3 1 4 EMITTER Symbol Device Value Units TSTG All -55 to +150 C Operating Temperature TOPR All -55 to +100 C Lead Solder Temperature TSOL All 260 for 10 sec C 250 mW 3.3 mW/C TOTAL DEVICE Storage Temperature Total Device Power Dissipation @ TA = 25C Derate above 25C EMITTER Continuous Forward Current Reverse Voltage Forward Current - Peak (300 s, 2% Duty Cycle) LED Power Dissipation @ TA = 25C Derate above 25C PD All IF All 100 mA VR All 6 V IF(pk) All PD DETECTOR All CNX48U, TIL113 H11B1, H11B2 Collector-Emitter Breakdown Voltage BVCEO H11B3 H11B255 MOC8080 3.0 A 100 mW 1.8 mW/C 30 25 V 55 CNX48U, H11B1 H11B2, H11B3 Collector-Base Breakdown Voltage BVCBO MOC8080 Detector Power Dissipation @ TA = 25C Derate above 25C V 55 V 7 V TIL113 H11B255 Emitter-Collector Breakdown Voltage 30 BVECO All PD All 150 mW 2.0 mW/C 6/1/00 200042A PHOTODARLINGTON OPTOCOUPLERS CNX48U H11B1 MOC8080 TIL113 ELECTRICAL CHARACTERISTICS H11B2 H11B255 H11B3 (TA = 25C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol EMITTER H11B255 (IF = 10 mA) MOC8080 VF (IF = 10 mA, TA = -55C) (IF = 50 mA) Capacitance DETECTOR Collector-Emitter Breakdown Voltage Typ** Max 0.8 1.2 1.5 1.2 1.3 0.9 1.3 1.7 0.7 TIL113 CNX48U MOC8080 (IF = 10 mA, TA = 100C) Reverse Leakage Current Min Unit H11B1, H11B2 (IF = 10 mA) Input Forward Voltage Device 1.05 1.4 H11B3 1.35 1.5 10 (VR = 6 V) IR All 0.001 (VF = 0 V, f = 1.0 MHz) C All 50 (IC = 1 mA, IF = 0) (IC = 100 A, IF = 0) CNX48U BVCEO (IC = 10 mA, IF = 0) 30 60 25 60 55 70 30 100 V A pF TIL113 H11B1, H11B2 H11B3 (IC = 100 A, IF = 0) H11B255 (IC = 1 mA, IF = 0) MOC8080 V CNX48U, H11B1 Collector-Base (IC = 100 A, IE = 0) H11B2, H11B3 BVCBO Breakdown Voltage H11B255 (IC = 100 A, IF = 0) Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current TIL113 MOC8080 (IE = 100 A, IB = 0) BVECO All (VCE = 10 V, Base Open) ICEO All V 55 100 7 10 1 V 100 nA Note ** Typical values at TA = 25C 6/1/00 200042A PHOTODARLINGTON OPTOCOUPLERS CNX48U H11B1 MOC8080 TIL113 TRANSFER CHARACTERISTICS DC Characteristics Test Conditions Symbol (IF = 10 mA, VCE = 1 V) Current(1) Device Min MOC8080 50 (500) H11B255 10 (100) CNX48U 60 (600) TIL113 30 (300) H11B1 5 (500) IC (CTR) (IF = 1 mA, VCE = 5 V) (IF = 1 mA, VCE = 1 V) H11B3 5 (500) 1.75 (350) 1.0 CNX48U 1.0 H11B255 1.0 (IF = 8 mA, IC = 2 mA) TIL113 1.25 (IC = 10 mA, VCE = 10 V) (RL = 100 1) (Fig.7) toff (IF = 10 mA, VCC = 5 V) H11B1 ton V 25 H11B2 H11B255 18 H11B3 ton 3.5 (Fig. 8) toff 36 (IF = 1 mA, VCC = 5 V) ton (RE = 100 1), (RBE = 1M1) Units mA (%) H11B3, MOC8080 VCE(sat) Max (IF = 50 mA, IC = 50 mA) AC Characteristics Switching Times 2 (200) 1 (100) Typ** H11B1, H11B2 (IF =1 mA, IC = 1 mA) (IF = 5 mA, IC = 10 mA) H11B2 H11B3 CNX48U (IF = 0.5 mA, VCE = 1 V) Saturation Voltage H11B255 (TA = 25C Unless otherwise specified.) (IF = 10 mA, VCE = 5 V) Collector Output H11B2 s CNX48U 70 (RE = 1k1), (RBE = 10M1) (Fig. 8) toff (IF = 5 mA, VCC = 10 V) ton (RL = 100 1) (Fig.7) toff (IF = 200 mA, IC = 50 mA) ton (VCC = 10 V) (RL = 100 1) (Fig.7) 190 3.5 MOC8080 25 0.35 5 55 100 Typ** Max TIL113 toff ISOLATION CHARACTERISTICS Characteristic Input-Output Isolation Voltage(2) Isolation Resistance(2) Isolation Capacitance(2) Test Conditions Symbol (II-O 61 A, Vrms, t = 1 min.) Min 5300 Units Vac(rms) (VI-O = 500 VDC) RISO 1011 1 (VI-O = , f = 1 MHz) CISO 0.8 pf Note ** Typical values at TA = 25C 6/1/00 200042A PHOTODARLINGTON OPTOCOUPLERS CNX48U H11B1 MOC8080 TIL113 TA = 0C, 25C TA = 70C TA = 100C TA = -55C 1 NORMALIZED TO: CTR @ IF = 10 mA TA = 25C VCE = 5 V 0.1 0.1 1 10 100 1 NORMALIZED TO: CTR @ IF = 10 mA TA = 25C VCE = 10 V 0.1 -80 NORMALIZED TO: IF = 1 mA VCE = 5 V IF = 10 mA 10 IF = 5 mA 6 4 IF = 2 mA 2 IF = 1 mA 0 0 1 2 3 4 5 6 7 8 -40 -20 0 20 40 60 80 100 120 Fig. 4 Dark Current vs. Ambient Temperature ICEO - COLLECTOR-EMITTER DARK CURRENT (nA) IC - COLLECTOR CURRENT (NORMALIZED) 16 8 -60 TA - AMBIENT TEMPERATURE (C) Fig. 3 Collector Current vs. Collector-Emitter Voltage 12 H11B3 10 IF - LED INPUT CURRENT (mA) 14 H11B255 Fig. 2 Current Transfer Ratio vs. Ambient Temperature CTR - CURRENT TRANSFER RATIO (NORMALIZED) CTR - CURRENT TRANSFER RATIO (NORMALIZED) Fig. 1 Output Current vs. Input Current H11B2 9 10000 VCE = 10 V 1000 100 10 1 0.1 0.01 10 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE (C) VCE- COLLECTOR -EMITTER VOLTAGE (V) Fig. 5 Turn-On Time vs. Input Current Fig. 6 Turn-Off Time vs. Input Current 1000 1000 RL = 1 k1 VCC = 10 V 100 10 TOFF - TIME (s) TON - TIME (s) RL = 100 1 RL = 10 1 RL = 1 k1 100 RL = 100 1 10 RL = 10 1 1 VCC = 10 V 1 0.1 0.1 1 10 IF - LED INPUT CURRENT (mA) 100 0.1 1 10 100 IF - LED INPUT CURRENT (mA) 6/1/00 200042A PHOTODARLINGTON OPTOCOUPLERS CNX48U H11B1 MOC8080 TIL113 H11B2 H11B255 H11B3 TYPICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES (25C Free air temperature unless otherwise specified) (Cont.) INPUT VCC RL RIN PULSE OUTPUT INPUT 5V OUTPUT 10% 1.5 V 90% t on t off IF Test Circuit (All devices except CNX48U) Switching Waveforms (All devices except CNX48U) Fig. 7 Switching Time Test Circuit and Waveforms (All devices except CNX48U) VCC INPUT INPUT 90% R BE 501 10% OUTPUT RE Test Circuit (CNX48U only) t on t off Switching Waveforms (CNX48U only) Fig. 8 Switching Time Test Circuit and Waveforms (CNX48U only) Notes 1. The current transfer ratio(IC/IF) is the ratio of the detector collector current to the LED input current with VCE @ 10 V. 2. For this test, LED pins 1 and 2 are common and phototransistor pins 4,5 and 6 are common. 6/1/00 200042A PHOTODARLINGTON OPTOCOUPLERS CNX48U H11B1 MOC8080 TIL113 Package Dimensions (Through Hole) H11B2 H11B255 H11B3 Package Dimensions (Surface Mount) PIN 1 ID. 0.350 (8.89) 0.330 (8.38) 3 2 PIN 1 ID. 1 0.270 (6.86) 0.240 (6.10) SEATING PLANE 0.270 (6.86) 0.240 (6.10) 0.350 (8.89) 0.330 (8.38) 4 5 0.070 (1.78) 0.045 (1.14) 6 0.300 (7.62) TYP 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.115 (2.92) 0.200 (5.08) 0.165 (4.18) 0.016 (0.41) 0.008 (0.20) 0.020 (0.51) MIN 0.154 (3.90) 0.100 (2.54) 0.016 (0.40) 0.008 (0.20) 0.022 (0.56) 0.016 (0.41) 0 to 15 0.020 (0.51) MIN 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.300 (7.62) TYP 0.100 (2.54) TYP 0.016 (0.40) MIN 0.315 (8.00) MIN 0.405 (10.30) MAX Lead Coplanarity : 0.004 (0.10) MAX Package Dimensions (0.4"Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.270 (6.86) 0.240 (6.10) 0.070 (1.78) 0.060 (1.52) SEATING PLANE 0.350 (8.89) 0.330 (8.38) 0.415 (10.54) 0.070 (1.78) 0.045 (1.14) 0.100 (2.54) 0.295 (7.49) 0.030 (0.76) 0.200 (5.08) 0.115 (2.92) 0.154 (3.90) 0.100 (2.54) 0.004 (0.10) MIN 0.016 (0.40) 0.008 (0.20) 0 to 15 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.400 (10.16) TYP NOTE All dimensions are in inches (millimeters) 6/1/00 200042A PHOTODARLINGTON OPTOCOUPLERS CNX48U H11B1 MOC8080 TIL113 H11B2 H11B255 H11B3 ORDERING INFORMATION Order Entry Identifier Option S .S Description Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W .W 0.4" Lead Spacing 300 .300 VDE 0884 300W .300W VDE 0884, 0.4" Lead Spacing 3S .3S VDE 0884, Surface Mount 3SD .3SD VDE 0884, Surface Mount, Tape & Reel QT Carrier Tape Specifications ("D" Taping Orientation) 12.0 0.1 4.85 0.20 4.0 0.1 0.30 0.05 4.0 0.1 O1.55 0.05 1.75 0.10 7.5 0.1 16.0 0.3 13.2 0.2 9.55 0.20 0.1 MAX 10.30 0.20 O1.6 0.1 User Direction of Feed NOTE All dimensions are millimeters 6/1/00 200042A PHOTODARLINGTON OPTOCOUPLERS DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. www.fairchildsemi.com 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. (c) 2000 Fairchild Semiconductor Corporation 6/1/00 200042A