LIS302SG - STMICROELECTRONICS - Datasheet.Directory

March 2008 Rev 1 1/19

LIS302SG

MEMS motion sensor

3-axis - ±2g analog output "piccolo" accelerometer

Features

■Single voltage supply operation

■~2 mW power consumption

■±2 g full-scale

■3 acceleration channels plus multiplexed

analog output

■Ratiometric output voltage

■Power-down mode

■Embedded self-test

■10000 g high shock survivability

■ECOPACK® RoHS and “Green” compliant

(see Section 6)

Description

The LIS302SG is a miniaturized low-power three-

axis linear accelerometer belonging to the

“piccolo” family of ST motion sensors. It includes

a sensing element and an IC interface to provide

an analog signal to the external world.

The sensing element, capable of detecting the

acceleration, is manufactured using a dedicated

process developed by ST to produce motion

sensors and actuators in silicon.

The IC interface is manufactured using a CMOS

process that allows to design a dedicated circuit

which is trimmed to better match the sensing

element characteristics.

The LIS302SG has a full scale of ±2 g and it is

capable of measuring accelerations over a

maximum bandwidth of 2.0 kHz. The device

bandwidth may be reduced by using external

capacitances. The self-test capability allows the

user to check the functioning of the sensor in the

final application.

The device has three analog acceleration output

plus an embedded multiplexer that allows to

redirect the analog outputs onto a single pin for

operation with a single channel A/D converter.

The LIS302SG is available in plastic Thin Land

Grid Array package (TLGA) and it is guaranteed

to operate over an extended temperature range

from -40 °C to +85 °C.

The LIS302SG belongs to a family of products

suitable for a variety of applications, including:

– Mobile terminals

– Gaming and virtual reality input devices

– Free-fall detection for data protection

– Antitheft systems and inertial navigation

– Appliance and robotics.

LGA-14

(3x5x0.9mm)

Table 1. Device summary

Order codes Temperature range [°C] Package Packing

LIS302SG -40 to +85 LGA-14 Tray

LIS302SGTR -40 to +85 LGA-14 Tape and reel (16mm, pitch 8mm)

www.st.com

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Contents LIS302SG

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Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.4 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.2 Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5 Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1 Mechanical characteristics at 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.2 Mechanical characteristics derived from measurement in the -40 °C to +85

°C temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

5.3 Electro-mechanical characteristics at 25 °C . . . . . . . . . . . . . . . . . . . . . . . 17

6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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LIS302SG List of figures

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List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 3. LIS302SG electrical connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 4. Output response vs. orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Figure 5. X axis zero-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 6. X axis sensitivity-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 7. Y axis zero-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 8. Y axis sensitivity-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 9. Z axis zero-g level at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 10. Z axis sensitivity-g level at 3.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Figure 11. X axis zero-g level change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 12. X axis sensitivity-g change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 13. Y axis zero-g level change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 14. Y axis sensitivity-g change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 15. Z axis zero-g level change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 16. Z axis sensitivity-g change vs. temperature at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 17. Current consumption in normal mode at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 18. Current consumption in Power-down mode at 3.3 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Figure 19. LGA-14: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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List of tables LIS302SG

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List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 3. Mechanical characteristics @ Vdd =3.3 V, T = 25 °C unless otherwise noted. . . . . . . . . . . 7

Table 4. Electrical characteristics @ Vdd =3.3 V, T=25 °C unless otherwise noted. . . . . . . . . . . . . . 8

Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 6. Filter capacitor selection, Cload (x,y,z) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 7. Mux I/O table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 8. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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LIS302SG Block diagram and pin description

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1 Block diagram and pin description

Figure 1. Block diagram

1.1 Pin description

Figure 2. Pin connection

S/H

Routx

Routz

REFERENCE TRIMMING CIRCUIT CLOCK

S/H

Routy

CHARGE

AMPLIFIER

DEMUX

Voutx

Voutz

Vouty

Aux_in

Vout

S1 S0

MUX

Y+

Z+

Y-

Z-

X+

X-

SELF-TEST

MUX

(TOP VIEW)

DIRECTIONS OF

DETECTABLE

ACCELERATIONS (BOTTOM VIEW)

Reserved

Vouty

Voutz

GND

Vout

Aux_in

Vdd

Voutx

Reserved

13 1

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Block diagram and pin description LIS302SG

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Table 2. Pin description

Pin # Pin name Function

1 Reserved Connect to Vdd

2 Reserved Connect to Vdd

3 S0 Mux selector 0 (connect to Vdd or to GND)

4 S1 Mux selector 1 (connect to Vdd or to GND)

5 ST Self-test (logic 0: normal mode; logic 1: Self-test)

6 PD Power-down (logic 0: normal mode; logic 1: power-down mode)

7 Voutx Output Voltage X channel

8 Vouty Output Voltage Y channel

9 Voutz Output Voltage Z channel

10 GND 0V supply

11 Vout Multiplexer output

12 Aux_In Auxiliary input

13 Vdd Power supply

14 Reserved Connect to Vdd

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LIS302SG Mechanical and electrical specifications

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2 Mechanical and electrical specifications

2.1 Mechanical characteristics

Table 3. Mechanical characteristics @ Vdd =3.3 V, T = 25 °C unless otherwise noted(1)

Symbol Parameter Test condition Min. Typ.(2) Max. Unit

Ar Acceleration range(3) ±2.0 g

So Sensitivity(4) 0.145*Vdd

–5% 0.145*Vdd 0.145*Vdd

+ 5% V/g

SoDr Sensitivity change vs.

temperature Delta from +25 °C ±0.01 %/°C

Voff Zero-g level(4) T = 25 °C Vdd/2-6% Vdd/2 Vdd/2+6% V

OffDr Zero-g level change

vs temperature Delta from +25 °C ±0.5 mg/°C

NL Non linearity(5) Best fit straight line ±0.5 % FS

CrossAx Cross-axis(6) ±2 %

An Acceleration noise

density Vdd=3.3 V 200 µg/

Vt Self-test output

voltage change(7),(8)

T = 25 °C

Vdd=3.3 V

X axis

+95 +200 mV

T = 25 °C

Vdd=3.3 V

Y axis

+95 +200 mV

T = 25 °C

Vdd=3.3 V

Z axis

+95 +200 mV

Fres Sensing element

resonant frequency(9) all axes 2.0 kHz

Top Operating

temperature range -40 +85 °C

Wh Product weight 30 mgram

1. The product is factory calibrated at 3.3 V. The operational power supply range is specified in Table 4. Since the device is

ratiometric Voff, So and Vt parameters will vary with supply voltage.

2. Typical specifications are not guaranteed

3. Guaranteed by wafer level test and measurement of initial offset and sensitivity

4. Zero-g level and sensitivity are ratiometric to supply voltage

5. Guaranteed by design

6. Contribution to the measuring output of an inclination/acceleration along any perpendicular axis

7. “Self-test output voltage change” is defined as Vout(Vst=logic 1)-Vout(Vst=logic 0)

8. “Self-test output voltage change” varies cubically with supply voltage

9. Minimum resonance frequency Fres=2.0 kHz. Sensor bandwidth=1/(2*π*32kΩ*Cload), with Cload>2.5 nF

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Mechanical and electrical specifications LIS302SG

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2.2 Electrical characteristics

Table 4. Electrical characteristics @ Vdd =3.3 V, T=25 °C unless otherwise noted(1)

1. The product is factory calibrated at 3.3 V.

Symbol Parameter Test condition Min. Typ.(2)

2. Typical specifications are not guaranteed

Max. Unit

Vdd Supply voltage 3.0 3.3 3.6 V

Idd Supply current Mean value

PD pin connected to GND 0.65 mA

IddPdn Supply current in

power-down mode PD pin connected to Vdd 1 µA

Vst Self-test input Logic 0 level at Vdd=3.3 V 0 0.2*Vdd V

Logic 1 level at Vdd=3.3 V 0.8*Vdd Vdd V

Rout Output impedance of

Voutx, Vouty, Voutz 32 kΩ

Cload

Capacitive load drive

for Voutx, Vouty,

Voutz(3)

3. Minimum resonance frequency Fres=2.0 kHz. Device bandwidth=1/(2*π*32kΩ*Cload), with Cload>2.5 nF

2.5 nF

Vs0 S0 Input Logic 0 level at Vdd=3.3 V 0 0.2*Vdd V

Logic 1 level at Vdd=3.3 V 0.8*Vdd Vdd V

Vs1 S1 input Logic 0 level at Vdd=3.3 V 0 0.2*Vdd V

Logic 1 level at Vdd=3.3 V 0.8*Vdd Vdd V

Rmux

Series resistance of

multiplexer input vs.

Vout

Ω

Cloadmux

Capacitive load drive

for multiplexed output

Vout

10 pF

To n

Turn-on time

at exit from

power-down mode

Cload in µF 160*Cload+0.3 ms

To p Operating

temperature range -40 +85 °C

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LIS302SG Mechanical and electrical specifications

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2.3 Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage

to the device. This is a stress rating only and functional operation of the device under these

conditions is not implied. Exposure to maximum rating conditions for extended periods may

affect device reliability.

Table 5. Absolute maximum ratings

Symbol Ratings Maximum value Unit

Vdd Supply voltage -0.3 to 6 V

Vin Input voltage on any control pin (PD, ST, S0, S1) -0.3 to Vdd +0.3 V

VAux_in Aux_in input voltage -0.3 to Vdd +0.3 V

APOW Acceleration (any axis, powered, Vdd=3.3 V) 3000 g for 0.5 ms

10000 g for 0.1 ms

AUNP Acceleration (any axis, not powered) 3000 g for 0.5 ms

10000 g for 0.1 ms

TSTG Storage temperature range -40 to +150 °C

ESD Electrostatic discharge protection

2 (HBM) KV

1.5 (CDM) KV

200 (MM) V

This is a Mechanical Shock sensitive device, improper handling can cause

permanent damages to the part

This is an ESD sensitive device, improper handling can cause permanent damages to

the part

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Mechanical and electrical specifications LIS302SG

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2.4 Terminology

Sensitivity describes the gain of the sensor and can be determined by applying 1 g

acceleration to it. As the sensor can measure DC accelerations this can be done easily by

pointing the axis of interest towards the center of the Earth, note the output value, rotate the

sensor by 180 degrees (point to the sky) and note the output value again thus applying ±1 g

acceleration to the sensor. Subtracting the larger output value from the smaller one, and

dividing the result by 2, will give the actual sensitivity of the sensor. This value changes very

little over temperature (see sensitivity change vs. temperature) and also very little over time.

The Sensitivity tolerance describes the range of Sensitivities of a large population of

sensors.

Zero-g level describes the actual output signal if there is no acceleration present. A sensor

in a steady state on a horizontal surface will measure 0 g in X axis and 0 g in Y axis whereas

the Z axis will measure 1 g. The output is ideally for a 3.3 V powered sensor Vdd/2 =

1650 mV. A deviation from ideal 0-g level (1650 mV in this case) is called Zero-g offset.

Offset of precise MEMS sensors is to some extend a result of stress to the sensor and

therefore the offset can slightly change after mounting the sensor onto a printed circuit

board or exposing it to extensive mechanical stress. Offset changes little over temperature -

see “Zero-g level change vs. temperature” - the Zero-g level of an individual sensor is very

stable over lifetime. The Zero-g level tolerance describes the range of Zero-g levels of a

population of sensors.

Self-test allows to check the sensor functionality without moving it. The Self-test function is

off when the ST pin is connected to GND. When the ST pin is tied at Vdd an actuation force

is applied to the sensor, simulating a definite input acceleration. In this case the sensor

outputs will exhibit a voltage change in their DC levels. When ST is activated, the device

output level is given by the algebraic sum of the signals produced by the acceleration acting

on the sensor and by the electrostatic test-force. If the output signals change within the

amplitude specified inside Ta bl e 3 , then the sensor is working properly and the parameters

of the interface chip are within the defined specification.

Output impedance describes the resistor inside the output stage of each channel. This

resistor is part of a filter consisting of an external capacitor of at least 2.5 nF and the internal

resistor. Due to the resistor level, only small inexpensive external capacitors are needed to

generate low corner frequencies. When interfacing with an ADC it is important to use high

input impedance input circuitries to avoid measurement errors. Note that the minimum load

capacitance forms a corner frequency close to the resonance frequency of the sensor. In

general the smallest possible bandwidth for a particular application should be chosen to get

the best results.

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LIS302SG Functionality

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3 Functionality

The LIS302SG is a “piccolo” low-power, analog output three-axis linear accelerometer

packaged in a LGA package. The complete device includes a sensing element and an IC

interface able to take the information from the sensing element and to provide an analog

signal to the external world. The sensor provides the three accelerations and one

multiplexed analog output.

3.1 Sensing element

A proprietary process is used to create a surface micro-machined accelerometer. The

technology allows to carry out suspended silicon structures which are attached to the

substrate in a few points called anchors and are free to move in the direction of the sensed

acceleration. To be compatible with the traditional packaging techniques a cap is placed on

top of the sensing element to avoid blocking the moving parts during the moulding phase of

the plastic encapsulation.

When an acceleration is applied to the sensor the proof mass displaces from its nominal

position, causing an imbalance in the capacitive half-bridge. This imbalance is measured

using charge integration in response to a voltage pulse applied to the sense capacitor.

At steady state the nominal value of the capacitors are few pF and when an acceleration is

applied the maximum variation of the capacitive load is in the fF range.

3.2 IC interface

The complete signal processing uses a fully differential structure, while the final stage

converts the differential signal into a single-ended one to be compatible with the external

world.

The first stage is a low-noise capacitive amplifier that implements a Correlated Double

Sampling (CDS) at its output to cancel the offset and the 1/f noise. The produced signal is

then sent to three different S&Hs, one for each channel, and made available to the outside.

The device provides an embedded multiplexer to allow the redirection of either the analog

output signals Voutx, Vouty, and Voutz or of an auxiliary input signal onto a single pin for

operation with a single channel A/D converter.

All the analog parameters (output offset voltage and sensitivity) are ratiometric to the

voltage supply. Increasing or decreasing the voltage supply, the sensitivity and the offset will

increase or decrease linearly. The feature provides the cancellation of the error related to

the voltage supply along an analog to digital conversion chain.

3.3 Factory calibration

The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Voff).

The trimming values are stored inside the device in a non volatile structure. Any time the

device is turned on, the trimming parameters are downloaded into the registers to be

employed during the normal operation. This allows the user to employ the device without

further calibration.

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Application hints LIS302SG

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4 Application hints

Figure 3. LIS302SG electrical connection

Power supply decoupling capacitors (100 nF ceramic or polyester + 10 µF Aluminum)

should be placed as near as possible to the device (common design practice).

The LIS302SG allows to band limit Voutx, Vouty and Voutz through the use of external

capacitors. The recommended frequency range spans from DC up to 2.0 kHz. Capacitors

must be added at output pins to implement low-pass filtering for antialiasing and noise

reduction, even if the only multiplexed output (Vout) is used. The equation for the cut-off

frequency ( ft ) of the external filters is:

Taking into account that the internal filtering resistor (Rout) has a nominal value equal to

32 kΩ, the equation for the external filter cut-off frequency may be simplified as follows:

The tolerance of the internal resistor can vary typically of ±20% within its nominal value of

32 kΩ; thus the cut-off frequency will vary accordingly. A minimum capacitance of 2.5 nF for

Cload(x, y, z) is required in any case.

An external capacitor can be added to the Vout pin. Values below 10 pF are recommended.

DIRECTIONS OF

DETECTABLE

ACCELERATIONS

Digital signals

Vout X

LIS302SG

Vout Y

Cload y

Cload x

(top view)

Optional

Cload z

Aux In

100nF 10

GNDGND

Vdd

Vout

GND

Vdd

Pin 1 indicator

Optional

Analog signals

Cloadmux

Vout Z

2πRout Cload xyz,,()⋅⋅

-------------------------------------------------------------------------=

5µF

Cload xyz,,()

---------------------------------------Hz[]=

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LIS302SG Application hints

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4.1 Soldering information

The LGA package is compliant with the ECOPACK®, RoHs and “Green” standard.

It is qualified for soldering heat resistance according to JEDEC J-STD-020C.

Leave “Pin 1 Indicator” unconnected during soldering.

Land pattern and soldering recommendations are available at www.st.com/mems.

4.2 Output response vs. orientation

Figure 4. Output response vs. orientation

Figure 4 refers to LIS302SG powered at 3.3 V.

Table 6. Filter capacitor selection, Cload (x,y,z)

Cut-off frequency Capacitor value

1 Hz 5 µF

10 Hz 0.5 µF

20 Hz 250 nF

50 Hz 100 nF

100 Hz 50 nF

200 Hz 25 nF

500 Hz 10 nF

Table 7. Mux I/O table

S1 pin S0 pin Mux status

0 0 Vout = Voutx

0 1 Vout = Vouty

1 0 Vout = Voutz

11 Vout = Aux_in

Earth’s Surface

X=1.65V (0g)

Y=1.65V (0g)

Z=2.13V (+1g)

X=1.65V (0g)

Y=1.65V (0g)

Z=1.17V (-1g)

X=1.17V (-1g)

Y=1.65V (0g)

X=2.13V (+1g)

Y=1.65V (0g)

X=1.65V (0g)

Y=1.17V (-1g)

X=1.65V (0g)

Y=2.13V (+1g)

Z=1.65V (0g)

Top

Bottom

Top

Bottom

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Typical performance characteristics LIS302SG

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5 Typical performance characteristics

5.1 Mechanical characteristics at 25°C

Figure 5. X axis zero-g level at 3.3 V Figure 6. X axis sensitivity-g level at

3.3 V

Figure 7. Y axis zero-g level at 3.3 V Figure 8. Y axis sensitivity-g level at

3.3 V

Figure 9. Z axis zero-g level at 3.3 V Figure 10. Z axis sensitivity-g level

at 3.3 V

−250 −200 −150 −100 −50 0 50 100 150 200 250

Zero−g Level Offset [mg]

Percent of parts [%]

0.43 0.44 0.45 0.46 0.47 0.48 0.49 0.5 0.51 0.52

Sensitivity [V/g]

Percent of parts [%]

−250 −200 −150 −100 −50 0 50 100 150 200 250

Zero−g Level Offset [mg]

Percent of parts [%]

0.43 0.44 0.45 0.46 0.47 0.48 0.49 0.5 0.51 0.52

Sensitivity [V/g]

Percent of parts [%]

−250 −200 −150 −100 −50 0 50 100 150 200 250

Zero−g Level Offset [mg]

Percent of parts [%]

0.43 0.44 0.45 0.46 0.47 0.48 0.49 0.5 0.51 0.52

Sensitivity [V/g]

Percent of parts [%]

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LIS302SG Typical performance characteristics

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5.2 Mechanical characteristics derived from measurement in the

-40 °C to +85 °C temperature range

Figure 11. X axis zero-g level change vs.

temperature at 3.3 V

Figure 12. X axis sensitivity-g change

vs. temperature at 3.3 V

Figure 13. Y axis zero-g level change vs.

temperature at 3.3 V

Figure 14. Y axis sensitivity-g change

vs. temperature at 3.3 V

Figure 15. Z axis zero-g level change vs.

temperature at 3.3 V

Figure 16. Z axis sensitivity-g change

vs. temperature at 3.3 V

−6 −4 −2 0 2 4 6

0−g level drift (mg/

Percent of parts (%)

−0.05 −0.04 −0.03 −0.02 −0.01 0 0.01 0.02 0.03 0.04 0.05

Sensitivity drift (%/

Percent of parts (%)

−6 −4 −2 0 2 4 6

0−g level drift (mg/

Percent of parts (%)

−0.05 −0.04 −0.03 −0.02 −0.01 0 0.01 0.02 0.03 0.04 0.05

Sensitivity drift (%/

Percent of parts (%)

−6 −4 −2 0 2 4 6

0−g level drift (mg/

Percent of parts (%)

−0.05 −0.04 −0.03 −0.02 −0.01 0 0.01 0.02 0.03 0.04 0.05

Sensitivity drift (%/

Percent of parts (%)

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Typical performance characteristics LIS302SG

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5.3 Electro-mechanical characteristics at 25 °C

Figure 17. Current consumption in

normal mode at 3.3 V

Figure 18. Current consumption in

Power-down mode at 3.3 V

500 550 600 650 700 750 800 850 900

Current consumption [uA]

Percent of parts [%]

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1

Current consumption [uA]

Percent of parts [%]

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LIS302SG Package information

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6 Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK® is an ST trademark.

ECOPACK® specifications are available at: www.st.com.

Figure 19. LGA-14: mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm inch

MIN. TYP. MAX. MIN. TYP. MAX.

A1 0.920 1.000 0.0362 0.0394

A2 0.700 0.0275

A30.180 0.220 0.260 0.0071 0.0087 0.0102

D1 2.850 3.000 3.150 0.1122 0.1181 0.1240

E1 4.850 5.000 5.150 0.1909 0.19680.2027

e0.800 0.0315

d0.300 0.0118

L1 4.000 0.1575

N1.360 0.0535

N1 1.200 0.0472

P1 0.965 0.975 0.9850.0380 0.03840.0386

P2 0.640 0.650 0.660 0.0252 0.0256 0.0260

T1 0.750 0.800 0.850 0.0295 0.0315 0.0335

T2 0.450 0.500 0.550 0.0177 0.0197 0.0217

R 1.200 1.600 0.0472 0.0630

h 0.150 0.0059

k 0.050 0.0020

i 0.100 0.0039

s0.100 0.0039

LGA-14 (3x5x0.92mm) Pitch 0.8mm

Land Grid Array Package

7773587 C

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Revision history LIS302SG

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7 Revision history

Table 8. Document revision history

Date Revision Changes

05-Mar-2008 1 Initial release

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LIS302SG

19/19

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