TLN201(F)
2004-02-06
1
TOSHIBA Infrared LED GaAℓAs Infrared Emitter
TLN201(F)
Lead Free Product
Opto−Electronic Switches
Tape And Card Readers
Equipment Using Infrared Transmission
• To−18 metal package.
• High radiant power: Po = 5mW(typ.)
• High radiant intensity: IE = 35mW / sr(typ.)
• Excellent radiant−intensity linearity. Modulation by pulse operation
and high frequency is possible.
• Highly reliable due to hermetic seal
• Same external shape as TPS708(F) photodiode
Maximum Ratings (Ta = 25°C)
Characteristic Symbol Rating Unit
Forward current IF 100 mA
Forward current derating
(Ta > 25°C) ∆IF / °C −1 mA / °C
Pulse forward current (Note) IFP 1 A
Reverse voltage VR 5 V
Operating temperature range Topr −40~125 °C
Storage temperature range Tstg −55~150 °C
(Note): Pulse width ≦ 100µs,repetitive frequency = 100Hz
Markings
Unit: mm
TOSHIBA 4−5Q2
Weight: 0.33 g (typ.)
Pin Connection
1. Cathode
2. Anode (case)
12
Letter color：red
Product No.(TL omitted)
Monthly lot number
Month of manufacture
(january to december denoted by letters A to L respectively)
Year of manufacture
(last digit of year of manufacture)
N201
TLN201(F)
2004-02-06
2
Optical And Electrical Characteristics (Ta = 25°C)
Characteristic Symbol Test Condition Min Typ. Max Unit
Forward voltage VF I
F = 50mA ― 1.5 1.9 V
Pulse forward voltage VFP I
FP = 1A ― 5.0 ― V
Reverse current IR V
R = 5V ― ― 10 µA
Radiant intensity IE I
F = 50mA 20 35 ― mW / sr
Radiant power PO I
F = 50mA ― 5 ― mW
Capacitance CT V
R = 0, f = 1MHz ― 17 ― pF
Peak emission wavelength λP I
F = 50mA ― 880 ― nm
Spectral line half width ∆λ I
F = 50mA ― 80 ― nm
Half value angle θ2
1 IF = 50mA ― ±7 ― °
Precautions
Please be careful of the followings.
1. Soldering temperature : 260°C max
Soldering time : 5s max
(Soldering must be performed 1.5m from the bottom of the package.)
2. When forming the leads, bend each lead under the 2mm from the body of the device.
Soldering must be performed after the leads have been formed.
3. Radiant intensity falls over time due to the current which flows in the infrared LED.
When designing a circuit, take into account this change in radiant power over time.
The ratio of fluctuation in radiation intensity to fluctuation in optical output is 1 : 1.
(0)P (t)P
(0)I (t)I
O
O
E
E=
TLN201(F)
2004-02-06
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Ambient temperature Ta (°C)
IF – Ta
Allowable forward current IF (mA)
20 40
60 80 140
60
40
20
120
0
0
80
100
100 120
Wavelength Characteristic (typ.)
Wavelength λ (nm)
Relative intensity
1.0
0
0.8
0.6
0.4
0.2
760 800 840 880 920 960 1000
IF = 50mA
Ta = 2 5 °C
Pulse forward voltage VFP (V)
Pulse forward current IFP (mA)
I
FP – VFP (typ.)
1 2
3 4 7 0 5 6
5
3
50
1
10
30
1000
300
500
100
Pulse width ≦ 100µs
Repetitive
Frequency = 100Hz
Ta = 25°C
Forward current IF (mA)
Radiant intensity IE (mW / sr)
I
E – IF (typ.)
Pulse width ≦100µs
Repetitive
Frequency = 100Hz
Ta = 2 5 ° C
3 10
30 100 1000
500
1
1
300
300
3000
1000
50
30
100
5
3
10
Pulse
DＣ
I
F – VF (typ.)
Forward voltage VF (V)
Forward current IF (mA)
1.3 1.4 1.5 1.8
5
100
1
1.1
30
50
1.6 1.7
3
10
1.2
Ta = 100°C
75
50 25 0-25
TLN201(F)
2004-02-06
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Relative I
E – Ta (typ.)
Ambient temperature Ta (°C)
Relative radiant intensity
10
0.1
-40
0.3
5
3
1
0.5
0 40 80 120 140
-20 20 60 100
0 0.2
0.4 0.6 0.8 1.0
0° 10° 20°
30°
40°
50°
60°
70°
80°
90°
10°
20°
30°
40°
50°
60°
70°
80°
90°
Radiation Pattern (typ.)
(Ta = 25°C)
Relative intensity
Pulse width PW (s)
IFP – PW
Allowable pulse forward current
IFP (mA)
10µ 30µ 10m 3µ 100µ 300µ 1m 3m
300
100
50
10
500
1000
3000
30
Ta = 25°C
f = 100Hz
200Hz 1kHz 5kHz
2kHz 10kHz 500Hz
Collector current IC (mA)
Coupling Characteristic With
TPS601(F)
Distance d (mm)
5
100
1000
5
3
1
0.5
0.3
3 10
30 100
0.1
1 300 50 500
50
30
10
IE = 25.5mW / sr
Ta = 25°C
TPS601A(F) using sample
IL = 226µA
at VCE = 3V
E = 0.1mW / cm2
d
TLN201(F)
2004-02-06
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• The information contained herein is subject to change without notice.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
• GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,
cut, crush or dissolve chemically.
030619EAC
RESTRICTIONS ON PRODUCT USE
