1
FEATURES
APPLICATIONS
DESCRIPTION
bq20z90
SLUS778 – JULY 2007www.ti.com
SBS 1.1-COMPLIANT GAS GAUGE ENABLED WITH IMPEDANCE TRACK™TECHNOLOGY FOR USE WITH THE bq29330
•Lifetime Data Logging
2
•Patented Impedance Track™ Technology •30-Pin TSSOP (DBT)Accurately Measures Available Charge inLi-Ion and Li-Polymer Batteries
•Notebook PCs•Better than 1% Error Over Lifetime of theBattery
•Medical and Test Equipment•Portable Instrumentation•Instant Accuracy – No Learning CycleRequired
•Automatically adjusts for battery aging,battery self discharge and temperature
The bq20z90 SBS-compliant gas gauge IC,inefficiencies
incorporating patented Impedance Track™technology, is designed for battery-pack or in-system•Supports the Smart Battery Specification SBS
installation. The bq20z90 measures and maintains anV1.1
accurate record of available charge in Li-ion or•Works With the TI bq29330 Analog Front-End
Li-polymer batteries using its integrated(AFE) Protection IC to Provide Complete Pack
high-performance analog peripherals. The bq20z90Electronics Solution
monitors capacity change, battery impedance,open-circuit voltage, and other critical parameters of•Full Array of Programmable Voltage, Current,
the battery pack, and reports the information to theand Temperature Protection Features
system host controller over a serial-communication•Integrated Time Base Removes Need for
bus. It is designed to work with the bq29330 analogExternal Crystal with Optional Crystal Input
front-end (AFE) protection IC to maximize•Electronics for 7.2-V, 10.8-V or 14.4-V Battery
functionality and safety, and minimize componentPacks With 50% Fewer External Components count and cost in smart battery circuits.•Based on a Powerful Low-Power RISC CPU
The Impedance Track technology continuouslyCore With High-Performance Peripherals
analyzes the battery impedance, resulting in superiorgas-gauging accuracy. This enables remaining•Integrated Field Programmable FLASH
capacity to be calculated with discharge rate,Memory Eliminates the Need for External
temperature, and cell aging all accounted for duringConfiguration Memory
each stage of every cycle.•Measures Charge Flow Using aHigh-Resolution, 16-Bit Integrating
AVAILABLE OPTIONSDelta-Sigma Converter
PACKAGE– Better Than 0.65 nVh of Resolution
T
A
30-PIN TSSOP (DBT) 30-PIN TSSOP (DBT)Tube Tape & Reel– Self-Calibrating
– 40 °C to•Uses 16-Bit Delta-Sigma Converter for
bq20z90DBT
(1)
bq20z90DBTR
(2)85 °CAccurate Voltage and TemperatureMeasurements
•Extensive Data Reporting Options ForImproved System Interaction•Optional Pulse Charging Feature for ImprovedCharge Times•Drives 3-, 4- or 5-Segment LED Display forRemaining Capacity Indication
(1) A single tube quantity is 50 units.1
•Supports SHA-1 Authentication (2) A single reel quantity is 2000 unitsPlease be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2IMPEDANCE TRACK is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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SYSTEM PARTITIONING DIAGRAM
LDO+
Reset
I2C
SMBus
HDQ
Pack+
Pack-
Discharge/Charge/
Pre-ChargeFETs
2-TierOverCurrent
Protection
2kBytesof
DataFlash
Fuse
Watchdog&
Protection Timing
Cell Balancing Drive
SystemInterface SystemInterface
32.768kHz
16DigGPIO&Peripherals
8DigGPIOor AnalogGPI
2.5V/3.3V(LED) NchFET Drive
(ChargePumps)
RAMConfiguration,Status
andControlRegisters
24kx22Program
Flash
2kBytes
ofRAM
6kx22
MaskROM
Cell, Bat and Pack
Voltage Translation
Precharge
Control
Host Interface & Data
Management
TOUT andLEDOUT
PowerSupport
Reset
AnalogOutputDrive
32kHzOscillatorand8MHzSystemClock
T1
StandardDelta-Sigma A toDConverter
IntegratingDelta-Sigma A toDConverter
1
2
7
6
5
4
3
30
29
28
27
26
25
24
NC
XALERT
SDATA
SCLK
CLKOUT
TS1
VCELL-
VCELL+
NC
RBI
VCC
VSS
MRST
TS2
PRES SRN
PFIN
SAFE
SMBD
NC LED4
LED5
*VSS
SRP
8
9
10
11
12
23
22
21
20
19
13
14
15
18
17
16
SMBC
DISP
NC
LED3
LED2
LED1
NC-Nointernalconnection
bq20z90
SLUS778 – JULY 2007
TSSOP (DBT)(TOP VIEW)
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bq20z90
SLUS778 – JULY 2007
TERMINAL FUNCTIONS
TERMINAL
I/O
(1)
DESCRIPTIONNO. NAME
1 NC – Not used — leave floating2 XALERT I Input from bq29330 XALERT output.3 SDATA I/O Data transfer to and from bq293304 SCLK I/O Communication clock to the bq293305 CLKOUT O 32.768-kHz output for the bq29330. This pin should be directly connected to the AFE.6 TS1 I 1
st
Thermistor voltage input connection to monitor temperature7 TS2 I 2
nd
Thermistor voltage input connection to monitor temperature8 PRES I Active low input to sense system insertion and typically requires additional ESD protectionActive low input to detect secondary protector output status and allows the bq20z90 to report the9 PFIN I
status of the 2
nd
level protection output10 SAFE O Active high output to enforce additional level of safety protection; e.g., fuse blow.11 SMBD I/OD SMBus data open-drain bidirectional pin used to transfer address and data to and from the bq20z9012 NC – Not used — leave floating13 SMBC I/OD SMBus clock open-drain bidirectional pin used to clock the data transfer to and from the bq20z90Display control for the LEDs. This pin is typically connected to bq29330 REG via a 100-k Ωresistor14 DISP I
and a push-button switch to VSS.15 NC – Not used — leave floating16 LED1 O LED1 display segment that drives an external LED depending on the firmware configuration17 LED2 O LED2 display segment that drives an external LED depending on the firmware configuration18 LED3 O LED3 display segment that drives an external LED depending on the firmware configuration19 LED4 O LED4 display segment that drives an external LED depending on the firmware configuration20 LED5 O LED5 display segment that drives an external LED depending on the firmware configuration21 VSS – Connected I/O pin to VSSConnections to the top of a small-value sense resistor to monitor the battery charge- and22 SRP IA
discharge-current flowConnections to the bottom of a small-value sense resistor to monitor the battery charge- and23 SRN IA
discharge-current flowMaster reset input that forces the device into reset when held low. Must be held high for normal24 MRST I
operation25 VSS P Negative Supply Voltage26 VCC P Positive Supply VoltageBackup power to the bq20z90 data registers during periods of low operating voltage. RBI accepts a27 RBI P
storage capacitor or a battery input.28 NC – Not used — leave floating29 VCELL+ I Input from bq29330 used to read a scaled value of individual cell voltages30 VCELL- I Input from bq29330 used to read a scaled value of individual cell voltages
(1) I = Input, IA = Analog input, I/O = Input/output, I/OD = Input/Open-drain output, O = Output, OA = Analog output, P = Power
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ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
bq20z90
SLUS778 – JULY 2007
over operating free-air temperature range (unless otherwise noted)
(1)
RANGE
V
CC
relative to V
SS
Supply voltage range – 0.3 V to 2.75 VV
(IOD)
relative to V
SS
Open-drain I/O pins – 0.3 V to 6 VV
I
relative to V
SS
Input voltage range to all other pins – 0.3 V to V
CC
+ 0.3 VT
A
Operating free-air temperature range – 40 °C to 85 °CT
stg
Storage temperature range – 65 °C to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
V
CC
= 2.4 V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
CC
Supply voltage 2.4 2.5 2.6 VNo flash programming 400
(1)I
CC
Operating mode current μAbq20z90 + bq29330 475Sleep mode 8
(1)I
(SLP)
Low-power storage mode current μAbq20z90 + bq29330 51Output voltage low SMBC, SMBD, SDATA, SCLK, SAFE I
OL
= 0.5 mA 0.4 VV
OL
LED1 – LED5 I
OL
= 10 mA 0.4 VV
OH
Output high voltage, SMBC, SMBD, SDATA, SCLK, SAFE I
OH
= – 1 mA V
CC
– 0.5 VV
IL
Input voltage low SMBC, SMBD, SDATA, SCLK, XALERT, – 0.3 0.8
VPRES, PFINDISP – 0.3 0.8 VV
IH
Input voltage high SMBC, SMBD, SDATA, SCLK, XALERT, 2 6
VPRES, PFINDISP 2 V
CC
+ 0.3 VC
IN
Input capacitance 5 pFV
(AI1)
Input voltage range VCELL+, VCELL-,TS1, TS2 - 0.2 0.8XV
CC
VV
(AI2)
Input voltage range SRN, SRP – 0.20 0.20Z
(AI2)
Input impedance VCELL+, VCELL-, TS1, TS2 0 V – 1 V 8 M Ω
Z
(AI1)
Input impedance SRN, SRP 0 V – 1 V 2.5 M Ω
(1) This value does not include the bq29330
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POWER-ON RESET
1.76
1.77
1.78
1.79
1.8
1.81
-40 -20 0 20 40 60 80
T -Free-AirTemperature-°C
A
Power-OnResetNegative-GoingVoltage-V
POWERONRESETBEHAVIOR
FREE-AIRTEMPERATURE
VS
INTEGRATING ADC (Coulomb Counter) CHARACTERISTICS
OSCILLATOR
bq20z90
SLUS778 – JULY 2007
V
CC
= 2.4V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
IT –
Negative-going voltage input 1.7 1.8 1.9 VV
HYS
Power-on reset hysteresis 50 125 200 mV
V
CC
= 2.4V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
(SR)
Input voltage range, V
(SRN)
and V
(SRP)
V
(SR)
= V(SRN) – V(SRP) – 0.2 0.2 VV
(SROS)
Input offset 10 μVINL Integral nonlinearity error 0.007% 0.034%
V
CC
= 2.4 V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
HIGH FREQUENCY OSCILLATOR
f
(OSC)
Operating Frequency 4.194 MHz-3% 0.25% 3%f
(EIO)
Frequency Error
(1) (2)
T
A
= 20 °C to 70 °C -2% 0.25% 2%t
(SXO)
Start-up Time
(3)
2.5 5 ms
LOW FREQUENCY OSCILLATOR
f
(LOSC)
Operating Frequency 32.768 KHz-2.5% 0.25% 2.5%f
(LEIO)
Frequency Error
(2) (4)
T
A
= 20 °C to 70 °C -1.5% 0.25% 1.5%
(1) The frequency error is measured from 4.194 MHz.(2) The frequency drift is included and measured from the trimmed frequency at V
CC
= 2.5 V, T
A
= 25 °C.(3) The start-up time is defined as the time it takes for the oscillator output frequency to be within 1% of the specified frequency.(4) The frequency error is measured from 32.768 kHz.
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DATA FLASH MEMORY CHARACTERISTICS
REGISTER BACKUP
bq20z90
SLUS778 – JULY 2007
OSCILLATOR (continued)V
CC
= 2.4 V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
(LSXO)
Start-up time
(5)
500 μs
(5) The start-up time is defined as the time it takes for the oscillator output frequency to be ± 3%.
V
CC
= 2.4 V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
t
DR
Data retention See
(1)
10 YearsFlash programming write-cycles See
(1)
20,000 Cyclest
(WORDPROG)
Word programming time See
(1)
2 msI
(DDdPROG)
Flash-write supply current See
(1)
5 10 mA
(1) Assured by design. Not production tested
V
CC
= 2.4 V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
(RB)
RB data-retention input current V
(RB)
> V
(RBMIN)
, V
CC
< V
IT-
1500 nAV
(RB)
> V
(RBMIN)
, V
CC
< V
IT-
, T
A
= 0 °C 40 160to 50 °CV
(RB)
RB data-retention voltage
(1)
1.7 V
(1) Specified by design. Not production tested.
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SMBus TIMING SPECIFICATIONS
bq20z90
SLUS778 – JULY 2007
V
CC
= 2.4 V to 2.6 V, T
A
= – 40 °C to 85 °C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f
SMB
SMBus operating frequency Slave mode, SMBC 50% duty cycle 10 100
kHzf
MAS
SMBus master clock frequency Master mode, no clock low slave extend 51.2t
BUF
Bus free time between start and stop 4.7t
HD:STA
Hold time after (repeated) start 4
μst
SU:STA
Repeated start setup time 4.7t
SU:STO
Stop setup time 4Receive mode 0t
HD:DAT
Data hold time
Transmit mode 300 nst
SU:DAT
Data setup time 250t
TIMEOUT
Error signal/detect See
(1)
25 35 mst
LOW
Clock low period 4.7
μst
HIGH
Clock high period See
(2)
4 50t
LOW:SEXT
Cumulative clock low slave extend time See
(3)
25
mst
LOW:MEXT
Cumulative clock low master extend time See
(4)
10t
F
Clock/data fall time (V
ILMAX
– 0.15 V) to (V
IHMIN
+ 0.15 V) 300
nst
R
Clock/data rise time 0.9 VCC to (VILMAX – 0.15 V) 1000
(1) The bq20z90 times out when any clock low exceeds t
TIMEOUT
.(2) t
HIGH:MAX
. is minimum bus idle time. SMBC = 1 for t > 50 μs causes reset of any transaction involving the bq20z90 that is in progress.(3) t
LOW:SEXT
is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.(4) t
LOW:MEXT
is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop.
SMBus TIMING DIAGRAM
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FEATURE SET
Primary (1st Level) Safety Features
Secondary (2nd Level) Safety Features
Charge Control Features
Gas Gauging
bq20z90
SLUS778 – JULY 2007
The bq20z90 supports a wide range of battery and system protection features that can easily be configured. Theprimary safety features include:
•Battery cell over/under voltage protection•Battery pack over/under voltage protection•2 independent charge overcurrent protection•3 independent discharge overcurrent protection•Short circuit protection•Over temperature protection•AFE Watchdog
•Host Watchdog
The secondary safety features of the bq20z90 can be used to indicate more serious faults via the SAFE (pin 10)pin. This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging ordischarging. The secondary safety features include:
•Safety over voltage•Battery cell imbalance•2nd level protection IC input•Safety over current•Safety over temperature•Open thermistor•Charge FET and Zero-Volt Charge FET fault•Discharge FET fault•Fuse blow failure detection•AFE Communication error•AFE Verification error•Internal flash data error
The bq20z90 charge control features include:
•Report the appropriate charging current needed for constant current charging and the appropriate chargingvoltage needed for constant voltage charging to a smart charger using SMBus broadcasts.•Determine the chemical state of charge of each battery cell using Impedance Track™. Using cell balancingalgorithm, gradually decrease the differences in the cells' state of charge in a fully charged state. Thisprevents high cells from overcharging, causing excessive degradation and also increases the usable packenergy by preventing early charge termination.•Support Pre-charging/Zero-volt charging•Support Fast charging•Support Pulse charging•Support Charge Inhibit and Charge Suspend modes•Report charging faults and also indicate charging status via charge and discharge alarms.
The bq20z90 uses the Impedance Track™ Technology to measure and calculate the available charge in batterycells. The achievable accuracy is better than 1% error over the lifetime of the battery and there is no fullcharge-discharge learning cycle required.
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LED Display
LifeTime Data Logging Features
Authentication
Power Modes
CONFIGURATION
Oscillator Function
System Present Operation
BATTERY PARAMETER MEASUREMENTS
bq20z90
SLUS778 – JULY 2007
See Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm application note (SLUA364)for further details.
The bq20z90 can drive a 3-, 4-, or 5- segment LED display for remaining capacity indication. The LED drivecurrent can be adjusted to 3mA, 4mA and 5mA digitally.
The bq20z90 offers a lifetime data logging array, where all important measurements are stored for warranty andanalysis purposes. The data monitored include:
•Lifetime maximum temperature•Lifetime minimum temperature•Lifetime maximum battery cell voltage•Lifetime minimum battery cell voltage•Lifetime maximum battery pack voltage•Lifetime minimum battery pack voltage•Lifetime maximum charge current•Lifetime maximum discharge current•Lifetime maximum charge power•Lifetime maximum discharge power•Lifetime maximum average discharge current•Lifetime maximum average discharge power•Lifetime average temperature
The bq20z90 supports authentication by the host using SHA-1.
The bq20z90 supports 3 different power modes to reduce power consumption:
•In Normal Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updatesin 1 second intervals. Between these intervals, the bq20z90 is in a reduced power stage.•In Sleep Mode, the bq20z90 performs measurements, calculations, protection decisions, and data updates inadjustable time intervals. Between these intervals, the bq20z90 is in a reduced power stage.•In Shutdown Mode the bq20z90 is completety disabled.
The bq20z90 fully integrates the system and processor oscillators and, therefore, requires no pins orcomponents for this feature.
The bq20z90 periodically verifies the PRES pin and detects that the battery is present in the system via a lowstate on a PRES input. When this occurs, bq20z90 enters normal operating mode. When the pack is removedfrom the system and the PRES input is high, the bq20z90 enters the battery-removed state, disabling the charge,discharge and ZVCHG FETs. The PRES input is ignored and can be left floating when non-removal mode is setin the data flash.
The bq20z90 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and asecond delta-sigma ADC for individual cell and battery voltage, and temperature measurement.
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Charge and Discharge Counting
Voltage
Current
Wake Function
Auto Calibration
Temperature
COMMUNICATIONS
SMBus On and Off State
SBS Commands
bq20z90
SLUS778 – JULY 2007
The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltagedrop across a small-value sense resistor between the SRP and SRN pins. The integrating ADC measures bipolarsignals from -0.25 V to 0.25 V. The bq20z90 detects charge activity when V
SR
= V
(SRP)
-V
(SRN)
is positive anddischarge activity when V
SR
= V
(SRP)
-V
(SRN)
is negative. The bq20z90 continuously integrates the signal overtime, using an internal counter. The fundamental rate of the counter is 0.65 nVh.
The bq20z90 updates the individual series cell voltages through the bq29330 at one second intervals. Thebq20z90 configures the bq29330 to connect the selected cell, cell offset, or bq29330 VREF to the CELL pin ofthe bq29330, which is required to be connected to VIN of the bq20z90. The internal ADC of the bq20z90measures the voltage, scales it, and calibrates itself appropriately. This data is also used to calculate theimpedance of the cell for the Impedance Track™ gas-gauging.
The bq20z90 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge currentusing a 5 m Ωto 20 m Ωtyp. sense resistor.
The bq20z90 can exit sleep mode, if enabled, by the presence of a programmable level of current signal acrossSRP and SRN.
The bq20z90 provides an auto-calibration feature to cancel the voltage offset error across SRP and SRN formaximum charge measurement accuracy. The bq20z90 performs auto-calibration when the SMBus lines staylow continuously for a minimum of a programmable amount of time.
The bq20z90 TS1 and TS2 inputs, in conjunction with two identical NTC thermistors (default are Semitec103AT), measure the battery environmental temperature. The bq20z90 can also be configured to use its internaltemperature sensor.
The bq20z90 uses SMBus v1.1 with Master Mode and package error checking (PEC) options per the SBSspecification.
The bq20z90 detects an SMBus off state when SMBC and SMBD are logic-low for ≥2 seconds. Clearing thisstate requires either SMBC or SMBD to transition high. Within 1 ms, the communication bus is available.
Table 1. SBS COMMANDS
SBS Cmd Mode Name Format Size in Min Max Default Value UnitBytes Value Value
0x00 R/W ManufacturerAccess hex 2 0x0000 0xffff —0x01 R/W RemainingCapacityAlarm unsigned int 2 0 65535 300 mAh or10mWh0x02 R/W RemainingTimeAlarm unsigned int 2 0 65535 10 min0x03 R/W BatteryMode hex 2 0x0000 0xe383 —0x04 R/W AtRate signed int 2 -32768 32767 — mA or 10mW0x05 R AtRateTimeToFull unsigned int 2 0 65534 — min0x06 R AtRateTimeToEmpty unsigned int 2 0 65534 — min
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bq20z90
SLUS778 – JULY 2007
Table 1. SBS COMMANDS (continued)
SBS Cmd Mode Name Format Size in Min Max Default Value UnitBytes Value Value
0x07 R AtRateOK unsigned int 2 0 65535 —0x08 R Temperature unsigned int 2 0 65535 — 0.1 °K0x09 R Voltage unsigned int 2 0 65535 — mV0x0a R Current signed int 2 -32768 32767 — mA0x0b R AverageCurrent signed int 2 -32768 32767 — mA0x0c R MaxError unsigned int 1 0 100 — %0x0d R RelativeStateOfCharge unsigned int 1 0 100 — %0x0e R AbsoluteStateOfCharge unsigned int 1 0 100+ — %0x0f R/W RemainingCapacity unsigned int 2 0 65535 — mAh or10mWh0x10 R FullChargeCapacity unsigned int 2 0 65535 — mAh or10mWh0x11 R RunTimeToEmpty unsigned int 2 0 65534 — min0x12 R AverageTimeToEmpty unsigned int 2 0 65534 — min0x13 R AverageTimeToFull unsigned int 2 0 65534 — min0x14 R ChargingCurrent unsigned int 2 0 65534 — mA0x15 R ChargingVoltage unsigned int 2 0 65534 — mV0x16 R BatteryStatus unsigned int 2 0x0000 0xdbff —0x17 R/W CycleCount unsigned int 2 0 65535 —0x18 R/W DesignCapacity unsigned int 2 0 65535 4400 mAh or10mWh0x19 R/W DesignVoltage unsigned int 2 0 65535 14400 mV0x1a R/W SpecificationInfo hex 2 0x0000 0xffff 0x00310x1b R/W ManufactureDate unsigned int 2 — — 01-Jan-1980 ASCII0x1c R/W SerialNumber hex 2 0x0000 0xffff 0x00010x20 R/W ManufacturerName String 11+1 — — Texas Inst. ASCII0x21 R/W DeviceName String 7+1 — — bq20z90 ASCII0x22 R/W DeviceChemistry String 4+1 — — LION ASCII0x23 R/W ManufacturerData String 14+1 — — — ASCII0x2f R/W Authenticate String 20+1 — — — ASCII0x3c R CellVoltage4 unsigned int 2 0 65535 — mV0x3d R CellVoltage3 unsigned int 2 0 65535 — mV0x3e R CellVoltage2 unsigned int 2 0 65535 — mV0x3f R CellVoltage1 unsigned int 2 0 65535 — mV
Table 2. EXTENDED SBS COMMANDS
SBS Mode Name Format Size in Min Value Max Value Default UnitCmd Bytes Value
0x45 R AFEData String 11+1 — — — ASCII0x46 R/W FETControl hex 1 0x00 0x1e —0x4f R StateOfHealth unsigned int 1 0 100 — %0x50 R SafetyAlert hex 2 0x0000 0xffff —0x51 R SafetyStatus hex 2 0x0000 0xffff —0x52 R PFAlert hex 2 0x0000 0x9fff —0x53 R PFStatus hex 2 0x0000 0x9fff —0x54 R OperationStatus hex 2 0x0000 0xf7f7 —0x55 R ChargingStatus hex 2 0x0000 0xffff —
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SLUS778 – JULY 2007
Table 2. EXTENDED SBS COMMANDS (continued)
SBS Mode Name Format Size in Min Value Max Value Default UnitCmd Bytes Value
0x57 R ResetData hex 2 0x0000 0xffff —0x58 R WDResetData unsigned int 2 0 65535 —0x5a R PackVoltage unsigned int 2 0 65535 --- mV0x5d R AverageVoltage unsigned int 2 0 65535 — mV0x60 R/W UnSealKey hex 4 0x00000000 0xffffffff —0x61 R/W FullAccessKey hex 4 0x00000000 0xffffffff —0x62 R/W PFKey hex 4 0x00000000 0xffffffff —0x63 R/W AuthenKey3 hex 4 0x00000000 0xffffffff —0x64 R/W AuthenKey2 hex 4 0x00000000 0xffffffff —0x65 R/W AuthenKey1 hex 4 0x00000000 0xffffffff —0x66 R/W AuthenKey0 hex 4 0x00000000 0xffffffff —0x70 R/W ManufacturerInfo String 8+1 — — — ASCII0x71 R/W SenseResistor unsigned int 2 0 65535 — μ Ω
0x77 R/W DataFlashSubClassID hex 2 0x0000 0xffff —0x78 R/W DataFlashSubClassPage1 hex 32 — — —0x79 R/W DataFlashSubClassPage2 hex 32 — — —0x7a R/W DataFlashSubClassPage3 hex 32 — — —0x7b R/W DataFlashSubClassPage4 hex 32 — — —0x7c R/W DataFlashSubClassPage5 hex 32 — — —0x7d R/W DataFlashSubClassPage6 hex 32 — — —0x7e R/W DataFlashSubClassPage7 hex 32 — — —0x7f R/W DataFlashSubClassPage8 hex 32 — — —
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Product Folder Link(s): bq20z90
PACKAGE OPTION ADDENDUM
www.ti.com 3-Dec-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
BQ20Z90DBT-V150 ACTIVE TSSOP DBT 30 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
BQ20Z90DBT-V150G4 ACTIVE TSSOP DBT 30 60 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
BQ20Z90DBTR-V150 ACTIVE TSSOP DBT 30 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
BQ20Z90DBTR-V150G4 ACTIVE TSSOP DBT 30 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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