© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for
Mature Altera Devices
This datasheet provides package and thermal resistance information for mature
Altera®devices. Package information includes the ordering code reference, package
acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead
coplanarity, weight, moisture sensitivity level, and other special information. The
thermal resistance information includes device pin count, package name, and
resistance values.
This datasheet includes the following sections:
■“Device and Package Cross Reference” on page 1
■“Thermal Resistance” on page 23
■“Package Outlines” on page 44
fFor more package and thermal resistance information about Altera devices that are
not listed in this datasheet, refer to the Package and Thermal Resistance page of the
Altera website.
fFor information about trays, tubes, and dry packs, refer to AN 71: Guidelines for
Handling J-Lead, QFP, and BGA Devices.
fRoHS-compliant devices are compatible with leaded-reflow temperatures. For more
information, refer to Altera’s RoHS-Compliant Devices literature page.
Device and Package Cross Reference
Table 2 through Table 22 lists the device, package type, and number of pins for each
Altera device listed in this datasheet. Altera devices listed in this datasheet are
available in the following packages:
■Ball-Grid Array (BGA)
■Ceramic Pin-Grid Array (PGA)
■FineLine BGA (FBGA)
■Hybrid FineLine BGA (HBGA)
■Plastic Dual In-Line Package (PDIP)
■Plastic Enhanced Quad Flat Pack (EQFP)
■Plastic J-Lead Chip Carrier (PLCC)
■Plastic Quad Flat Pack (PQFP)
■Power Quad Flat Pack (RQFP)
■Thin Quad Flat Pack (TQFP)
■Ultra FineLine BGA (UBGA)
DS-PKG-16.8
2Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Table 1 lists the Altera devices and the associated table locations.
Table 1. Mature Altera Device and Package Cross Reference
Altera Device Table locations
Arria®series FPGAs ■Arria GX Devices: Table 2 on page 3
Stratix®series FPGAs
■Stratix II Devices: Table 3 on page 3
■Stratix Devices: Table 4 on page 5
Cyclone®series FPGAs
■Cyclone II Devices: Table 5 on page 7
■Cyclone Devices: Table 6 on page 8
MAX®series CPLDs
■MAX 9000 Devices: Table 7 on page 8
■MAX 7000 Devices: Table 8 on page 9
■MAX 3000A Devices: Table 9 on page 10
HardCopy®series ASICs
■HardCopy II Devices: Table 10 on page 11
■HardCopy Devices: Table 11 on page 11
■HardCopy APEX Devices: Table 12 on page 12
APEX™ series FPGAs
■APEX II Devices: Table 13 on page 13
■APEX 20KE Devices: Table 14 on page 13
■APEX 20KC Devices: Table 15 on page 15
■APEX 20K Devices: Table 16 on page 15
ACEX®1K FPGAs ACEX 1K Devices: Table 17 on page 16
Mercury™ FPGAs Mercury Devices: Table 18 on page 17
FLEX®series FPGAs
■FLEX 10KA Devices: Table 19 on page 17
■FLEX 10KS Devices: Table 20 on page 18
■FLEX 10KE Devices: Table 21 on page 18
Excalibur™ FPGAs Excalibur Devices: Table 22 on page 21
Configuration devices Configuration Devices: Table 23 on page 22
Enhanced configuration devices Enhanced Configuration Devices: Table 24 on page 22
Package Information Datasheet for Mature Altera Devices 3
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Arria GX Devices
Table 2 lists the device name, package type, and number of pins for the Arria GX
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Stratix II Devices
Table 3 lists the device name, package type, and number of pins for the Stratix II
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 2. Arria GX Devices
Device Package Pins
EP1AGX20
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
EP1AGX35
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single- Piece Lid: FBGA, Flip Chip, Option 4 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
EP1AGX50
Channel Lid: FBGA, Flip Chip, Option 1 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1152
EP1AGX60
Channel Lid: FBGA, Flip Chip, Option 1 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1152
EP1AGX90 Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1152
Table 3. Stratix II Devices (Part 1 of 2)
Device Package Pins
EP2S15
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 672
4Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
EP2S30
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 672
EP2S60
Dual-Piece Lid: FBGA, Flip Chip, Option 1 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 672
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, option 2 1020
EP2S90
Channel Lid: HBGA, Flip Chip 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
EP2S130
Channel Lid: FBGA, Flip Chip, Option 1 780
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
EP2S180
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
EP2SGX30 Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
EP2SGX60
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1152
EP2SGX90
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1152
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
EP2SGX130 Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
Table 3. Stratix II Devices (Part 2 of 2)
Device Package Pins
Package Information Datasheet for Mature Altera Devices 5
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Stratix Devices
Table 4 lists the device name, package type, and number of pins for the Stratix device
family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 4. Stratix Devices (Part 1 of 2)
Device Package Pins
EP1SGX10 Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 672
EP1SGX25
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 672
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
EP1SGX40 Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
EP1S10
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 484
BGA, Wire Bond 672
FBGA, Wire Bond, Option 2 672
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
EP1S20
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 4 484
BGA, Wire Bond 672
FBGA, Wire Bond, Option 2 672
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
EP1S25
BGA, Wire Bond 672
FBGA, Wire Bond, Option 2 672
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
EP1S30
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
Dual-Piece Lid: BGA, Flip Chip, Option 1
Single-Piece Lid: BGA, Flip Chip, Option 2 956
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
6Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
EP1S40
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
Dual-Piece Lid: BGA, Flip Chip, Option 1
Single-Piece Lid: BGA, Flip Chip, Option 2 956
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
EP1S60
Dual-Piece Lid: BGA, Flip Chip, Option 1
Single-Piece Lid: BGA, Flip Chip, Option 2 956
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
EP1S80
Dual-Piece Lid: BGA, Flip Chip, Option 1
Single-Piece Lid: BGA, Flip Chip, Option 2 956
Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020
Dual-Piece Lid: FBGA, Flip Chip, Option 1
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
Table 4. Stratix Devices (Part 2 of 2)
Device Package Pins
Package Information Datasheet for Mature Altera Devices 7
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Cyclone II Devices
Table 5 lists the device name, package type, and number of pins for the Cyclone II
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 5. Cyclone II Devices
Device Package Pins
EP2C5
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 2, Thin 256
EP2C8
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 2, Thin 256
EP2C8A FBGA, Wire Bond, Option 2, Thin 256
EP2C15A FBGA, Wire Bond, Option 2, Thin 256
FBGA, Wire Bond, A:2.40 484
EP2C20
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 2, Thin 256
FBGA, Wire Bond, A:2.40 484
EP2C20A FBGA, Wire Bond, Option 2, Thin 256
FBGA, Wire Bond, A:2.40 484
EP2C35
FBGA, Wire Bond, A:2.40 484
UBGA, Wire Bond 484
FBGA, Wire Bond, A:2.40 672
EP2C50
FBGA, Wire Bond, A:2.40 484
UBGA, Wire Bond 484
FBGA, Wire Bond, A:2.40 672
EP2C70 FBGA, Wire Bond, A:2.40 672
FBGA, Wire Bond, A:2.40 896
8Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Cyclone Devices
Table 6 lists the device name, package type, and number of pins for the Cyclone
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
MAX 9000 Devices
Table 7 lists the device name, package type, and number of pins for the MAX 9000
device family.
MAX 7000 Devices
Table 8 lists the device name, package type, and number of pins for the MAX 7000
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 6. Cyclone Devices
Device Package Pins
EP1C3 TQFP, Wire Bond 100
TQFP, Wire Bond 144
EP1C4 FBGA, Wire Bond, Option 1 324
FBGA, Wire Bond 400
EP1C6
TQFP, Wire Bond 144
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 256
EP1C12
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 256
FBGA, Wire Bond, Option 1 324
EP1C20 FBGA, Wire Bond, Option 1 324
FBGA, Wire Bond 400
Table 7. MAX 9000 Devices
Device Package Pins
EPM9320 BGA, Wire Bond 356
EPM9320A BGA, Wire Bond 356
EPM9560 BGA, Wire Bond 356
Package Information Datasheet for Mature Altera Devices 9
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Table 8. MAX 7000 Devices (Part 1 of 2)
Device Package Pins
EPM7032B
PLCC, Wire Bond 44
TQFP, Wire Bond 44
UBGA, Wire Bond 49
EPM7064B
TQFP, Wire Bond 44
UBGA, Wire Bond 49
FBGA, Wire Bond, Option 1 100
TQFP, Wire Bond 100
EPM7128B
UBGA, Wire Bond 49
TQFP, Wire Bond 100
FBGA, Wire Bond, Option 1 100
TQFP, Wire Bond 144
UBGA, Wire Bond 169
FBGA, Wire Bond, Option 1 256
EPM7256B
TQFP, Wire Bond 100
TQFP, Wire Bond 144
UBGA, Wire Bond 169
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
EPM7512B
TQFP, Wire Bond 144
UBGA, Wire Bond 169
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
BGA, Wire Bond, Option 1 256
EPM7032AE PLCC, Wire Bond 44
TQFP, Wire Bond 44
EPM7064AE
PLCC, Wire Bond 44
UBGA, Wire Bond 49
FBGA, Wire Bond, Option 1 100
TQFP, Wire Bond 44
TQFP, Wire Bond 100
FBGA, Wire Bond, Option 1 256
EPM7128AE
PLCC, Wire Bond 84
FBGA, Wire Bond, Option 1 100
TQFP, Wire Bond 100
TQFP, Wire Bond 144
UBGA, Wire Bond 169
FBGA, Wire Bond, Option 1 256
10 Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
MAX 3000A Devices
Table 8 lists the device name, package type, and number of pins for the MAX 3000A
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
EPM7256AE
TQFP, Wire Bond 100
FBGA, Wire Bond, Option 1 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
EPM7512AE
TQFP, Wire Bond 144
PQFP, Wire Bond 208
BGA, Wire Bond, Option 1 256
FBGA, Wire Bond, Option 1 256
EPM7032A PLCC, Wire Bond 44
TQFP, Wire Bond 44
EPM7128A
PLCC, Wire Bond 84
TQFP, Wire Bond 100
FBGA, Wire Bond 100
TQFP, Wire Bond 144
FBGA, Wire Bond, Option 1 256
EPM7256A
TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
EPM7192E PGA, Wire Bond 160
PQFP, Wire Bond 160
Table 8. MAX 7000 Devices (Part 2 of 2)
Device Package Pins
Table 9. MAX 3000A Devices (Part 1 of 2)
Device Package Pins
EPM3032A PLCC, Wire Bond 44
TQFP, Wire Bond 44
EPM3064A
TQFP, Wire Bond 44
PLCC, Wire Bond 44
TQFP, Wire Bond 100
EPM3128A TQFP, Wire Bond 100
Package Information Datasheet for Mature Altera Devices 11
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
HardCopy II Devices
Table 10 lists the device name, package type, and number of pins for the HardCopy II
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
HardCopy Devices
Table 11 lists the device name, package type, and number of pins for the HardCopy
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
EPM3256A TQFP, Wire Bond 144
PQFP, Wire Bond 208
EPM3512A PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
Table 9. MAX 3000A Devices (Part 2 of 2)
Device Package Pins
Table 10. HardCopy II Devices
Device Package Pins
HC210 FBGA, Wire Bond, A:2.40 484
HC220 Single-Piece Lid: FBGA, Flip Chip, Option 4 672
Single-Piece Lid: FBGA, Flip Chip, Option 3 780
HC230 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
HC240 Single-Piece Lid: FBGA, Flip Chip, Option 2 1020
Single-Piece Lid: FBGA, Flip Chip, Option 2 1508
Table 11. HardCopy Devices
Device Package Pins
HC1S25 FBGA, Wire Bond, A:2.40 672
BGA, Wire Bond 672
HC1S30 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780
HC1S40 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780
HC1S60 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020
HC1S80 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020
12 Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
HardCopy APEX Devices
Table 12 lists the device name, package type, and number of pins for the
HardCopy APEX device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 12. HardCopy APEX Devices
Device Package Pins
HC20K400 BGA, Wire Bond, Option 3 652
HC20K600 BGA, Wire Bond, Option 3 652
Dual-Piece Lid: FBGA, Flip Chip, Option 1 672
Package Information Datasheet for Mature Altera Devices 13
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
APEX II Devices
Table 13 lists the device name, package type, and number of pins for the APEX II
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
APEX 20KE Devices
Table 14 lists the device name, package type, and number of pins for the APEX 20KE
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 13. APEX II Devices
Device Package Pins
EP2A15 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672
Dual-Piece Lid: BGA, Flip Chip 724
EP2A25
Channel Lid: FBGA, Flip Chip, Option 1 672
Dual-Piece Lid: BGA, Flip Chip 724
Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020
EP2A40
Channel Lid: FBGA, Flip Chip, Option 1 672
Dual-Piece Lid: BGA, Flip Chip 724
Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020
EP2A70 Dual-Piece Lid: BGA, Flip Chip 724
Dual-Piece Lid: FBGA, Flip Chip, Option 1 1508
Table 14. APEX 20KE Devices (Part 1 of 2)
Device Package Pins
EP20K30E
FBGA, Wire Bond 144
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 324
EP20K60E
FBGA, Wire Bond 144
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 324
BGA, Wire Bond 356
14 Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
EP20K100E
FBGA, Wire Bond 144
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 324
BGA, Wire Bond 356
EP20K160E
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
EP20K200E
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
BGA, Wire Bond, Option 2 652
FBGA, Wire Bond, Option 2 672
EP20K300E
PQFP, Wire Bond 240
BGA, Wire Bond, Option 2 652
FBGA, Wire Bond, Option 2 672
EP20K400E BGA, Wire Bond, Option 3 652
FBGA, Flip Chip, Option 1 672
EP20K600E
BGA, Wire Bond, Option 3 652
FBGA, Flip Chip, Option 1 672
FBGA, Flip Chip, Option 1 1020
EP20K1000E
BGA, Flip Chip 652
FBGA, Flip Chip, Option 1 672
FBGA, Flip Chip, Option 1 1020
EP20K1500E BGA, Flip Chip 652
FBGA, Flip Chip, Option 1 1020
Table 14. APEX 20KE Devices (Part 2 of 2)
Device Package Pins
Package Information Datasheet for Mature Altera Devices 15
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
APEX 20KC Devices
Table 15 lists the device name, package type, and number of pins for the APEX 20KC
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
APEX 20K Devices
Table 16 lists the device name, package type, and number of pins for the APEX 20K
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 15. APEX 20KC Devices
Device Package Pins
EP20K200C
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
EP20K400C BGA, Wire Bond, Option 3 652
FBGA, Flip Chip, Option 1 672
EP20K600C
BGA, Wire Bond, Option 3 652
FBGA, Flip Chip, Option 1 672
FBGA, Flip Chip, Option 1 1020
EP20K1000C
BGA, Flip Chip 652
FBGA, Flip Chip, Option 1 672
FBGA, Flip Chip, Option 1 1020
Table 16. APEX 20K Devices (Part 1 of 2)
Device Package Pins
EP20K100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 324
BGA, Wire Bond 356
EP20K160 PQFP, Wire Bond 240
TQFP, Wire Bond 144
16 Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
ACEX 1K Devices
Table 17 lists the device name, package type, and number of pins for the ACE 1K
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
EP20K200
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
EP20K300 FBGA, Wire Bond, Option 2 672
EP20K400
BGA, Wire Bond, Option 3 652
PGA, Wire Bond 655
FBGA, Flip Chip, Option 1 672
Table 16. APEX 20K Devices (Part 2 of 2)
Device Package Pins
Table 17. ACEX 1K Devices
Device Package Pins
EP1K10
TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
EP1K30
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
EP1K50
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
FBGA, Wire Bond, Option 2 484
EP1K100
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
FBGA, Wire Bond, Option 2 484
Package Information Datasheet for Mature Altera Devices 17
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Mercury Devices
Table 18 lists the device name, package type, and number of pins for the Mercury
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
FLEX 10KA Devices
Table 19 lists the device name, package type, and number of pins for the FLEX 10KA
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 18. Mercury Devices
Device Package Pins
EP1M120 Dual-Piece Lid: FBGA, Flip Chip, Option 1 484
EP1M350 Dual-Piece Lid: FBGA, Flip Chip, Option 1 780
Table 19. FLEX 10KA Devices
Device Package Pins
EPF10K10A
TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
EPF10K30A
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 256
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
EPF10K100A
RQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
BGA, Wire Bond 600
EPF10K250A PGA, Wire Bond 599
BGA, Wire Bond 600
18 Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
FLEX 10KS Devices
Table 20 lists the device name, package type, and number of pins for the FLEX 10KS
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
FLEX 10KE Devices
Table 21 lists the device name, package type, and number of pins for the FLEX 10KE
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 20. FLEX 10KS Devices
Device Package Pins
EPF10K50S
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 256
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
EPF10K200S
RQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
BGA, Wire Bond 600
FBGA, Wire Bond, Option 2 672
Table 21. FLEX 10KE Devices (Part 1 of 3)
Device Package Pins
EPF10K30E
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
FBGA, Wire Bond, Option 2 484
EPF10K50E
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 256
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
Package Information Datasheet for Mature Altera Devices 19
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
EPF10K100E
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 256
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
EPF10K130E
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
BGA, Wire Bond 600
FBGA, Wire Bond, Option 2 672
EPF10K200E
PGA, Wire Bond 599
BGA, Wire Bond 600
FBGA, Wire Bond, Option 2 672
EPF10K10
PLCC, Wire Bond 84
TQFP, Wire Bond 144
PQFP, Wire Bond 208
EPF10K20
TQFP, Wire Bond 144
RQFP, Wire Bond 208
RQFP, Wire Bond 240
EPF10K30
RQFP, Wire Bond 208
RQFP, Wire Bond 240
BGA, Wire Bond 356
EPF10K40 RQFP, Wire Bond 208
RQFP, Wire Bond 240
EPF10K50
RQFP, Wire Bond 240
BGA, Wire Bond 356
PGA, Wire Bond 403
EPF10K50V
RQFP, Wire Bond 240
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond 484
EPF10K70 RQFP, Wire Bond 240
PGA, Wire Bond 503
EPF10K100 PGA, Wire Bond 503
EPF10K130V PGA, Wire Bond 599
BGA, Wire Bond 600
EPF6010A
TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
Table 21. FLEX 10KE Devices (Part 2 of 3)
Device Package Pins
20 Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
EPF10K100E
PQFP, Wire Bond 208
PQFP, Wire Bond 240
FBGA, Wire Bond, Option 1 256
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
EPF10K130E
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond, Option 2 484
BGA, Wire Bond 600
FBGA, Wire Bond, Option 2 672
EPF10K200E
PGA, Wire Bond 599
BGA, Wire Bond 600
FBGA, Wire Bond, Option 2 672
EPF10K10
PLCC, Wire Bond 84
TQFP, Wire Bond 144
PQFP, Wire Bond 208
EPF10K20
TQFP, Wire Bond 144
RQFP, Wire Bond 208
RQFP, Wire Bond 240
EPF10K30
RQFP, Wire Bond 208
RQFP, Wire Bond 240
BGA, Wire Bond 356
EPF10K40 RQFP, Wire Bond 208
RQFP, Wire Bond 240
EPF10K50
RQFP, Wire Bond 240
BGA, Wire Bond 356
PGA, Wire Bond 403
EPF10K50V
RQFP, Wire Bond 240
PQFP, Wire Bond 240
BGA, Wire Bond 356
FBGA, Wire Bond 484
EPF10K70 RQFP, Wire Bond 240
PGA, Wire Bond 503
EPF10K100 PGA, Wire Bond 503
EPF10K130V PGA, Wire Bond 599
BGA, Wire Bond 600
EPF6010A
TQFP, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
Table 21. FLEX 10KE Devices (Part 2 of 3)
Device Package Pins
Package Information Datasheet for Mature Altera Devices 21
Device and Package Cross Reference
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Excalibur Devices
Table 22 lists the device name, package type, and number of pins for the Excalibur
device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
EPF6016
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond, Option 2 256
EPF6016A
TQFP, Wire Bond 100
FBGA, Wire Bond 100
TQFP, Wire Bond 144
PQFP, Wire Bond 208
FBGA, Wire Bond, Option 1 256
EPF6024A
TQFP, Wire Bond 144
PQFP, Wire Bond 208
PQFP, Wire Bond 240
BGA, Wire Bond, Option 2 256
FBGA, Wire Bond, Option 1 256
EPF8282A PLCC, Wire Bond 84
TQFP, Wire Bond 100
EPF8452A TQFP, Wire Bond 100
PQFP, Wire Bond 160
Table 21. FLEX 10KE Devices (Part 3 of 3)
Device Package Pins
Table 22. Excalibur Devices
Device Package Pins
EPXA1 FBGA, Wire Bond, Option 2 484
Dual-Piece Lid: FBGA, Flip Chip, Option 1 672
EPXA4 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672
Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020
EPXA10 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020
22 Package Information Datasheet for Mature Altera Devices
Device and Package Cross Reference
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Configuration Devices
Table 23 lists the device name, package type, and number of pins for the
Configuration device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Enhanced Configuration Devices
Table 24 lists the device name, package type, and number of pins for the Enhanced
configuration device family.
1The package type entries with “Option #” refer to instances where multiple package
options exist for a given package type and pin count. The option number identifies the
specific type used by the corresponding device density.
Table 23. Configuration Devices
Device Package Pins
EPC1 PDIP, Wire Bond 8
PLCC, Wire Bond 20
EPC2 PLCC, Wire Bond 20
TQFP, Wire Bond 32
EPC1064 PDIP, Wire Bond 8
PLCC, Wire Bond 20
EPC1213 PDIP, Wire Bond 8
PLCC, Wire Bond 20
EPC1441
PDIP, Wire Bond 8
PLCC, Wire Bond 20
TQFP, Wire Bond 32
Table 24. Enhanced Configuration Devices
Device Package Pins
EPC4 PQFP, Wire Bond 100
EPC8 PQFP, Wire Bond 100
EPC16 UBGA, Wire Bond 88
PQFP, Wire Bond 100
Package Information Datasheet for Mature Altera Devices 23
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Altera follows JEDEC JESD51 series standards to provide thermal resistances. The
purpose of the JESD51 standards is to compare the thermal performance of various
packagesunderstandardizedtestconditions.Whilestandardizedthermalresistances
canhelp comparetherelative thermalperformance of differentpackages, theycannot
apply directly to the many specific applications because JESD51 test conditions may
not match a specific application. Several factors affect the thermal performance of a
device in a user’s application. These include power dissipation in the component;
airflow velocity, direction and turbulence level; power in adjacent components;
two-sided vs. one-sided active component mounting; printed circuit board (PCB)
orientation & construction; and adjacent boards and their power dissipation. It may
be necessary to test or model specific applications. This testing and modeling of a
component user’s specific applications is the user’s responsibility.
Table 26throughTable 43provideJA(junction-to-ambientthermalresistance)andJC
(junction-to-case thermal resistance) values for the Altera device families. Altera
reserves the right to make changes to thermal resistances without notice in the future.
Table 25 lists the mature Altera devices and the associated table locations.
Altera is transitioning to an industry-standard copper lid for its thermally enhanced
BGA and thermally enhanced Flip Chip FBGA package offerings.
fFor more information, refer to Process Change Notice PCN0214.
Table 25. Thermal Resistance
Altera Device Table Location
Arria series FPGAs ■Arria GX Devices: Table 26 on page 24
Stratix series FPGAs
■Stratix II Devices: Table 27 on page 25
■Stratix Devices: Table 28 on page 26
Cyclone series FPGAs
■Cyclone II Devices: Table 29 on page 27
■Cyclone Devices: Table 30 on page 28
MAX series CPLDs
■MAX 9000 Devices: Table 31 on page 29
■MAX 7000 Devices: Table 32 on page 30
■MAX 3000A Devices: Table 33 on page 33
HardCopy series ASICs
■HardCopy II Devices: Table 34 on page 34
■HardCopy Devices: Table 35 on page 34
APEX series FPGAs
■APEX II Devices: Table 36 on page 35
■APEX 20K: Table 37 on page 36
ACEX 1K FPGAs ACEX 1K Devices: Table 38 on page 38
Mercury FPGAs Mercury Devices: Table 39 on page 39
FLEX series FPGAs
■FLEX 10K Devices: Table 40 on page 39
■FLEX 8000 Devices: Table 41 on page 41
■FLEX 6000 Devices: Table 42 on page 42
Excalibur FPGAs Excalibur Devices: Table 43 on page 43
24 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur
device families. Therefore, two thermal resistance specifications are provided for
devices affected by this change. The older packages are identified as using the
aluminum silicon carbide (AlSiC) lid, while the newer packages are identified as
using the copper (Cu) lid.
Thermally enhanced BGA and thermally enhanced Flip Chip FBGA packages offered
in the newer Altera families, including Stratix and Stratix GX, were introduced using
an industry-standard Cu lid. Therefore, these device specifications include only a
single thermal resistance specification.
1Contact Altera if you need typical +/– values of A dimensions for thermal analysis.
The max numbers are provided for physical layout.
Arria Series Devices Thermal Resistance
Table 26 provides thermal resistance values for Arria series devices.
Arria GX Devices
Table 26 lists the thermal resistance of Arria GX devices.
Table 26. Thermal Resistance of Arria GX Devices
Device Package Pin
Count
JA
(° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA
(° C/W)
400 ft./min.
JC
(° C/W)
JB
(° C/W)
EP1AGX20 FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1
FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1
EP1AGX35 FBGA 484 12.8 10.3 8.7 7.5 0.3 3.1
FBGA 780 11.1 8.6 7.2 6.0 0.2 3.1
EP1AGX50
FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9
FBGA 780 10.9 8.4 6.9 5.8 0.2 2.9
FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5
EP1AGX60
FBGA 484 12.7 10.2 8.6 7.3 0.2 2.9
FBGA 780 10.9 8.4 6.9 5.8 0.2 2.8
FBGA 1152 9.9 7.5 6.1 5.0 0.2 2.5
EP1AGX90 FBGA 1152 9.6 7.3 5.9 4.9 0.1 2.3
Package Information Datasheet for Mature Altera Devices 25
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Stratix Series Devices Thermal Resistance
Table 27 to Table 28 provide thermal resistance values for Stratix series devices.
Stratix II Devices
Table 27 lists the thermal resistance of Stratix II devices.
Table 27. Thermal Resistance of Stratix II Devices (Part 1 of 2)
Device Package Pin
Count
JC
(° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
JB
(° C/W)
EP2S15
FBGA, Flip
Chip 484 0.4 13.1 11.1 9.6 8.3 4.2
FBGA, Flip
Chip 672 0.4 12.2 10.2 8.8 7.6 4.1
EP2S30
FBGA, Flip
Chip 484 0.2 12.6 10.6 9.1 7.9 3.7
FBGA, Flip
Chip 672 0.2 11.7 9.7 8.3 7.1 3.4
EP2S60
FBGA, Flip
Chip 484 0.1 12.3 10.3 8.8 7.5 3.4
FBGA, Flip
Chip 672 0.1 11.4 9.4 7.8 6.7 3.0
FBGA, Flip
Chip 1020 0.1 10.4 8.4 7.0 5.9 2.7
EP2S90
HBGA, Flip
Chip 484 0.1 12.0 9.9 8.3 7.1 3.7
FBGA, Flip
Chip 780 0.1 10.8 8.8 7.3 6.1 2.6
FBGA, Flip
Chip 1020 0.1 10.2 8.2 6.8 5.7 2.4
FBGA, Flip
Chip 1508 0.1 9.3 7.4 6.1 5.0 2.2
EP2S130
FBGA, Flip
Chip 780 0.1 10.1 8.7 7.2 6.0 2.4
FBGA, Flip
Chip 1020 0.1 9.5 8.1 6.7 5.5 2.2
FBGA, Flip
Chip 1508 0.1 8.6 7.3 6.0 4.8 2.1
EP2S180
FBGA, Flip
Chip 1020 0.1 9.0 7.9 6.5 5.4 2.1
FBGA, Flip
Chip 1508 0.1 8.1 7.1 5.8 4.7 1.9
EP2SGX30 FBGA,
Flip Chip 780 0.2 11.1 8.6 7.2 6.0 3.1
EP2SGX60
FBGA,
Flip Chip 780 0.2 10.9 8.4 6.9 5.8 2.8
FBGA,
Flip Chip 1152 0.2 9.9 7.5 6.1 5.0 2.5
26 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Stratix Devices
Table 28 lists the thermal resistance of Stratix devices.
EP2SGX90
FBGA,
Flip Chip 1152 0.1 9.6 7.3 5.9 4.9 2.3
FBGA,
Flip Chip 1508 0.1 9.0 6.7 5.4 4.4 1.9
EP2SGX130 FBGA,
Flip Chip 1508 0.1 8.3 6.6 5.3 4.3 1.8
Table 27. Thermal Resistance of Stratix II Devices (Part 2 of 2)
Device Package Pin
Count
JC
(° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
JB
(° C/W)
Table 28. Thermal Resistance of Stratix Devices (Part 1 of 2)
Device Package Pin
Count JC (° C/W) JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP1SGX10C
EP1SGX10D
FBGA,
Flip Chip 672 0.4 11.1 9.1 7.7 6.5
EP1SGX25C
EP1SGX25D
FBGA,
Flip Chip 672 0.2 10.8 8.8 7.4 6.2
EP1SGX25D
EP1SGX25F
FBGA,
Flip Chip 1020 0.2 9.9 7.9 6.5 5.4
EP1SGX40D
EP1SGX40G
FBGA,
Flip Chip 1020 0.2 9.8 7.7 6.4 5.3
EP1S10
FBGA,
Flip Chip 484 0.4 11.9 9.8 8.4 7.2
BGA 672 3.2 16.8 13.7 11.9 10.5
FBGA 672 3.4 17.2 14.0 12.2 10.8
FBGA,
Flip Chip 780 0.4 10.9 8.8 7.4 6.3
EP1S20
FBGA,
Flip Chip 484 0.3 11.8 9.7 8.3 7.1
BGA 672 2.5 15.5 12.4 10.7 9.3
FBGA 672 2.7 16.0 12.8 11.0 9.6
FBGA,
Flip Chip 780 0.3 10.7 8.6 7.2 6.1
EP1S25
BGA 672 2.2 14.8 11.7 10.0 8.7
FBGA 672 2.3 15.3 12 10.4 9.0
FBGA,
Flip Chip 780 0.3 10.5 8.5 7.1 6.0
FBGA,
Flip Chip 1020 0.3 10.0 8.0 6.6 5.5
Package Information Datasheet for Mature Altera Devices 27
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Cyclone Series Devices Thermal Resistance
Table 29 to Table 30 provide thermal resistance values for Cyclone series devices.
Cyclone II Devices
Table 29 lists the thermal resistance of Cyclone II devices.
Device Package Pin Count JC (° C/W) JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP1S30
FBGA,
Flip Chip 780 0.2 10.4 8.4 7.0 5.9
BGA,
Flip Chip 956 0.2 9.1 7.1 5.8 4.8
FBGA,
Flip Chip 1020 0.2 9.9 7.9 6.5 5.4
EP1S40
FBGA,
Flip Chip 780 0.2 10.4 8.3 6.9 5.8
BGA,
Flip Chip 956 0.2 9.0 7.0 5.7 4.7
FBGA,
Flip Chip 1020 0.2 9.8 7.8 6.4 5.3
FBGA,
Flip Chip 1508 0.2 9.1 7.1 5.8 4.7
EP1S60
BGA,
Flip Chip 956 0.1 8.9 6.9 5.6 4.6
FBGA,
Flip Chip 1020 0.1 9.7 7.7 6.3 5.2
FBGA,
Flip Chip 1508 0.1 8.9 7.0 5.6 4.6
EP1S80
BGA,
Flip Chip 956 0.1 8.8 6.8 5.5 4.5
FBGA,
Flip Chip 1020 0.1 9.6 7.6 6.2 5.1
FBGA,
Flip Chip 1508 0.1 8.8 6.9 5.5 4.5
Table 28. Thermal Resistance of Stratix Devices (Part 2 of 2)
Table 29. Thermal Resistance of Cyclone II Devices (Part 1 of 2)
Device Package Pin Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP2C5
TQFP,
Wire Bond 144 10.0 31.0 29.3 27.9 25.5
PQFP,
Wire Bond 208 5.5 30.4 29.2 27.3 22.3
FBGA,
Wire Bond 256 8.7 30.2 26.1 23.6 21.7
28 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Cyclone Devices
Table 30 lists the thermal resistance of Cyclone devices.
EP2C8
TQFP,
Wire Bond 144 9.9 29.8 28.3 26.9 24.9
PQFP,
Wire Bond 208 5.4 30.2 28.8 26.9 21.7
FBGA,
Wire Bond 256 7.1 27.0 23.0 20.5 18.5
EP2C15
FBGA,
Wire Bond 256 5.5 24.2 20.0 17.8 16.0
FBGA,
Wire Bond 484 4.2 21.0 17.0 14.8 13.1
EP2C20
PQFP,
Wire Bond 240 4.2 26.6 24.0 21.4 17.4
FBGA,
Wire Bond 256 5.5 24.2 20.0 17.8 16.0
FBGA,
Wire Bond 484 4.2 21.0 17.0 14.8 13.1
EP2C35
FBGA,
Wire Bond 484 3.3 19.4 15.4 13.3 11.7
UBGA,
Wire Bond 484 5.0 20.6 16.6 14.5 12.8
FBGA,
Wire Bond 672 3.1 18.6 14.6 12.6 11.1
EP2C50
FBGA,
Wire Bond 484 2.8 18.4 14.4 12.4 10.9
UBGA,
Wire Bond 484 4.4 19.6 15.6 13.6 11.9
FBGA,
Wire Bond 672 2.6 17.7 13.7 11.8 10.2
EP2C70
FBGA,
Wire Bond 672 2.2 16.9 13.0 11.1 9.7
FBGA,
Wire Bond 896 2.1 16.3 11.9 10.5 9.1
Table 29. Thermal Resistance of Cyclone II Devices (Part 2 of 2)
Device Package Pin Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
Table 30. Thermal Resistance of Cyclone Devices (Part 1 of 2)
Device Package Pin Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP1C3 TQFP 100 11.0 37.5 35.4 33.4 29.8
TQFP 144 10.0 31.1 29.4 27.9 25.5
EP1C6
TQFP 144 9.8 29.4 28.0 26.7 24.7
PQFP 240 4.3 27.2 24.7 22.1 17.8
FBGA 256 8.8 28.7 24.5 22.3 20.5
Package Information Datasheet for Mature Altera Devices 29
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
MAX Series Devices Thermal Resistance
Table 31 through Table 33 provide thermal resistance values for MAX series devices.
MAX 9000 Devices
Table 31 lists the thermal resistance of MAX 9000 devices.
Device Package Pin Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP1C12
PQFP 240 4.0 26.0 23.4 20.8 17.1
FBGA 256 6.6 24.3 20.2 18.1 16.4
FBGA 324 6.1 23.0 19.8 17.7 16.1
EP1C20 FBGA 324 5.0 21.0 17.7 15.6 14.1
FBGA 400 4.7 20.7 17.5 15.5 13.9
Table 30. Thermal Resistance of Cyclone Devices (Part 2 of 2)
Table 31. Thermal Resistance of MAX 9000 Devices
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPM9320
PLCC 84 9.0 29.0 27.0 25.0 23.0
RQFP 208 1.0 17.0 16.0 15.0 13.0
PGA 280 2.0 14.0 10.0 7.0 5.0
BGA 356 2.0 14.0 12.0 11.0 10.0
EPM9320A
PLCC 84 9.0 29.0 27.0 26.0 23.0
RQFP 208 2.0 17.0 16.0 15.0 13.0
BGA 356 1.0 12.0 11.0 10.0 9.0
EPM9400
PLCC 84 9.0 29.0 27.0 25.0 23.0
RQFP 208 1.0 17.0 16.0 15.0 13.0
RQFP 240 1.0 14.0 12.0 11.0 10.0
EPM9480 RQFP 208 1.0 17.0 16.0 15.0 12.0
RQFP 240 1.0 12.0 11.0 10.0 9.0
EPM9560
RQFP 208 1.0 17.0 16.0 15.0 12.0
RQFP 240 1.0 12.0 11.0 10.0 9.0
BGA 356 1.0 12.0 11.0 10.0 9.0
EPM9560A
RQFP 208 1.0 17.0 16.0 15.0 12.0
RQFP 240 1.0 11.0 10.0 9.0 8.0
BGA 356 1.0 12.0 11.0 10.0 9.0
30 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
MAX 7000 Devices
Table 32 lists the thermal resistance of MAX 7000 devices.
Table 32. Thermal Resistance of MAX 7000 Devices (Part 1 of 3)
Device Package Pin
Count JC (° C/W) JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPM7032
PLCC
44
10.0 33.0 31.0 30.0 27.0
PQFP 15.0 48.0 46.0 45.0 42.0
TQFP 14.0 46.0 44.0 43.0 40.0
EPM7032B
PLCC 44 10.0 33.0 31.0 30.0 27.0
TQFP 14.0 46.0 44.0 43.0 40.0
UBGA 49 23.0 69.0 67.0 66.0 62.0
EPM7032S PLCC 44 10.0 33.0 31.0 30.0 27.0
TQFP 14.0 46.0 44.0 43.0 40.0
EPM7032V PLCC 44 9.0 31.0 30.0 28.0 25.0
TQFP 14.0 45.0 44.0 42.0 39.0
EPM7032AE PLCC 44 9.0 31.0 30.0 28.0 25.0
TQFP 14.0 46.0 45.0 43.0 40.0
EPM7064S
PLCC 44 9.0 31.0 30.0 28.0 25.0
TQFP 14.0 46.0 44.0 43.0 40.0
PLCC 84 9.0 28.0 26.0 25.0 23.0
TQFP 100 11.0 39.0 37.0 35.0 32.0
EPM7064
PLCC 44 9.0 31.0 30.0 28.0 25.0
TQFP 13.0 44.0 43.0 41.0 38.0
PLCC 84 9.0 28.0 26.0 25.0 22.0
PQFP 100 6.0 33.0 32.0 31.0 30.0
EPM7064AE
EPM7064B
PLCC 44 9.0 31.0 30.0 28.0 25.0
TQFP 14.0 46.0 45.0 43.0 40.0
UBGA 49 23.0 56.0 53.0 51.0 47.0
TQFP 100 12.0 39.0 37.0 35.0 31.0
FBGA 21.0 49.0 47.0 44.0 40.0
EPM7096 PLCC 68 9.0 29.0 27.0 26.0 23.0
PLCC 84 9.0 28.0 26.0 24.0 22.0
EPM7128A
PLCC 84 9.0 28.0 26.0 25.0 22.0
TQFP 100 11.0 37.0 35.0 33.0 30.0
FBGA 18.0 44.0 42.0 39.0 35.0
TQFP 144 9.0 31.0 29.0 28.0 25.0
FBGA 256 12.0 38.0 36.0 34.0 31.0
Package Information Datasheet for Mature Altera Devices 31
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
EPM7128B
UBGA 49 22.0 53.0 50.0 48.0 44.0
TQFP 100 11.0 38.0 36.0 34.0 31.0
FBGA 19.0 46.0 44.0 41.0 37.0
TQFP 144 9.0 32.0 30.0 29.0 26.0
UBGA 169 16.0 44.0 42.0 39.0 35.0
FBGA 256 13.0 40.0 38.0 36.0 33.0
EPM7128E
PLCC 84 10.0 29.0 28.0 26.0 23.0
PQFP 100 6.0 32.0 31.0 30.0 29.0
PQFP 160 6.0 32.0 31.0 30.0 28.0
EPM7128S
PLCC 84 10.0 30.0 28.0 26.0 23.0
TQFP 100 12.0 38.0 36.0 34.0 30.0
PQFP 10.0 35.0 34.0 33.0 32.0
PQFP 160 7.0 33.0 32.0 31.0 30.0
EPM7128AE
PLCC 84 11.0 30.0 28.0 26.0 23.0
TQFP 100 12.0 38.0 36.0 34.0 30.0
FBGA 14.0 43.0 40.0 38.0 37.0
TQFP 144 11.0 33.0 30.0 28.0 26.0
UBGA 169 14.0 42.0 40.0 38.0 36.0
FBGA 256 12.0 39.0 37.0 35.0 31.0
EPM7160E
PLCC 84 10.0 29.0 28.0 26.0 23.0
PQFP 100 6.0 32.0 31.0 30.0 29.0
PQFP 160 6.0 33.0 32.0 31.0 30.0
EPM7160S
PLCC 84 10.0 35.0 28.0 26.0 23.0
TQFP 100 12.0 37.0 35.0 33.0 30.0
PQFP 160 6.0 33.0 32.0 31.0 30.0
EPM7192S PQFP 160 6.0 32.0 31.0 30.0 29.0
EPM7192E PGA 160 6.0 20.0 13.0 10.0 8.0
PQFP 6.0 32.0 31.0 30.0 26.0
EPM7256A
TQFP 100 9.0 36.0 34.0 32.0 30.0
TQFP 144 8.0 32.0 27.0 25.0 24.0
PQFP 208 5.0 30.0 28.0 26.0 21.0
FBGA 256 12.0 34.0 32.0 29.0 28.0
EPM7256B
TQFP 100 12.0 37.0 35.0 33.0 30.0
TQFP 144 9.0 33.0 29.0 27.0 25.0
UBGA 169 13.0 40.0 38.0 36.0 34.0
PQFP 208 5.0 31.0 29.0 27.0 22.0
FBGA 256 9.0 34.0 32.0 30.0 28.0
Table 32. Thermal Resistance of MAX 7000 Devices (Part 2 of 3)
Device Package Pin
Count JC (° C/W) JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
32 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
EPM7256E
PGA 192 6.0 20.0 13.0 10.0 8.0
PQFP 160 6.0 31.0 30.0 29.0 25.0
RQFP 208 1.0 17.0 16.0 15.0 13.0
EPM7256S PQFP 208 5.0 30.0 29.0 26.0 21.0
RQFP 1.0 18.0 17.0 16.0 15.0
EPM7256AE
FBGA 100 13.0 42.0 39.0 37.0 36.0
TQFP 100 12.0 37.0 35.0 33.0 30.0
TQFP 144 9.0 33.0 29.0 27.0 25.0
PQFP 208 5.0 31.0 29.0 27.0 22.0
FBGA 256 9.0 34.0 32.0 30.0 28.0
EPM7512AE
TQFP 144 10.0 32.0 27.0 25.0 23.0
PQFP 208 5.0 30.0 28.0 25.0 21.0
BGA 256 1.2 14.0 12.0 11.0 10.0
FBGA 11.0 32.0 30.0 28.0 22.0
EPM7512B
TQFP 144 10.0 32.0 27.0 25.0 24.0
UBGA 169 12.0 35.0 33.0 31.0 30.0
PQFP 208 5.0 30.0 28.0 25.0 21.0
BGA 256 1.2 14.0 12.0 11.0 10.0
FBGA 256 11.0 32.0 30.0 28.0 27.0
Table 32. Thermal Resistance of MAX 7000 Devices (Part 3 of 3)
Device Package Pin
Count JC (° C/W) JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
Package Information Datasheet for Mature Altera Devices 33
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
MAX 3000A Devices
Table 33 lists the thermal resistance of MAX 3000A devices.
HardCopy Series Devices Thermal Resistance
Table 34 to Table 35 provide thermal resistance values for HardCopy series devices.
Table 33. Thermal Resistance of MAX 3000A Devices
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPM3032A TQFP 44 14.0 46.0 45.0 43.0 40.0
PLCC 9.0 31.0 30.0 28.0 25.0
EPM3064A
TQFP 44 14.0 46.0 45.0 43.0 40.0
PLCC 9.0 31.0 30.0 28.0 25.0
TQFP 100 12.0 39.0 37.0 35.0 31.0
EPM3128A TQFP 100 12.0 38.0 36.0 34.0 30.0
EPM3256A TQFP 144 9.0 33.0 29.0 27.0 25.0
PQFP 208 5.0 31.0 29.0 27.0 22.0
EPM3512A PQFP 208 5.0 30.0 28.0 25.0 21.0
FBGA 256 11.0 32.0 30.0 28.0 22.0
34 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
HardCopy II Devices
Table 34 lists the thermal resistance of HardCopy II devices.
HardCopy Devices
Table 35 lists the thermal resistance of HardCopy devices.
Table 34. Thermal Resistance of HardCopy II Devices
Device Package Pin Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min. JB (° C/W)
HC210 FBGA,
Wire Bond 484 5.5 21.3 17.4 15.3 13.8 9.6
HC220
FBGA,
Flip Chip 672 0.5 12.1 9.9 8.3 7.1 3.6
FBGA,
Flip Chip 780 0.5 11.7 9.5 8.0 6.8 3.5
HC230 FBGA,
Flip Chip 1020 0.3 10.8 8.6 7.1 6.0 2.9
HC240
FBGA,
Flip Chip 1020 0.2 10.6 8.4 6.9 5.8 2.7
FBGA,
Flip Chip 1508 0.2 9.7 7.5 6.1 5.0 2.6
Table 35. Thermal Resistance of HardCopy Devices
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
HC20K400 BGA, Flip Chip 652 0.5 9.1 7.9 6.4 5.3
HC20K600 FBGA, Flip Chip 672 1.0 13.0 10.2 8.6 7.3
HC1S25 FBGA, Wire Bond 672 3.7 19.7 15.8 13.9 12.4
BGA, Wire Bond 3.4 19.3 15.6 13.8 12.3
HC1S30 FBGA, Flip Chip 780 0.4 10.9 8.8 7.4 6.3
HC1S40 FBGA, Flip Chip 780 0.4 10.9 8.8 7.4 6.3
HC1S60 FBGA, Flip Chip 1020 0.3 10.3 8.54 7.0 5.8
HC1S80 FBGA, Flip Chip 1020 0.3 10.3 8.54 7.0 5.8
Package Information Datasheet for Mature Altera Devices 35
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
APEX Series Devices Thermal Resistance
Table 36 to Table 37 list thermal resistance values for APEX series devices.
APEX II Devices
Table 36 lists the thermal resistance of APEX II devices.
Table 36. Thermal Resistance of APEX II Devices
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP2A15
FBGA, Flip Chip (Cu lid) 672 0.2 10.8 8.8 7.4 6.2
FBGA, Flip Chip (AlSiC lid) 0.3 11.6 9.6 8.0 6.6
BGA, Flip Chip (Cu lid) 724 0.2 9.7 7.7 6.4 5.3
BGA, Flip Chip (AlSiC lid) 0.4 10.0 8.2 6.6 5.4
EP2A25
FBGA (Cu lid) 672 0.2 10.7 8.7 7.2 6.1
FBGA, Flip Chip (AlSiC lid) 0.3 11.5 9.6 8.0 6.6
BGA, Flip Chip (Cu lid) 724 0.2 9.6 7.6 6.2 5.2
BGA, Flip Chip (AlSiC lid) 0.3 10.0 8.2 6.6 5.4
FBGA, Flip Chip (Cu lid) 1020 0.2 9.8 7.8 6.4 5.3
FBGA, Flip Chip (AlSiC lid) 0.3 10.4 8.5 6.9 5.7
EP2A40
FBGA, Flip Chip (Cu lid) 672 0.2 10.0 8.2 6.9 5.9
FBGA, Flip Chip (AlSiC lid) 0.2 10.0 8.2 6.9 5.9
BGA, Flip Chip (Cu lid) 724 0.2 9.5 7.5 6.1 5.1
BGA, Flip Chip (AlSiC lid) 0.2 9.5 7.5 6.1 5.1
FBGA, Flip Chip (Cu lid) 1020 0.2 9.7 7.7 6.3 5.2
FBGA, Flip Chip (AlSiC lid) 0.2 9.7 7.7 6.3 5.2
EP2A70
BGA, Flip Chip (Cu lid) 724 0.1 9.3 7.3 6.0 4.9
BGA, Flip Chip (AlSiC lid) 0.1 10.0 7.9 6.4 5.3
FBGA, Flip Chip (Cu lid) 1508 0.1 8.8 6.8 5.5 4.5
FBGA, Flip Chip (AlSiC lid) 0.1 9.3 7.3 5.8 4.7
36 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
APEX 20K Devices
Table 37 lists the thermal resistance of APEX 20KE, 20KC, and 20K devices.
Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 1 of 3)
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP20K30E
TQFP 144 8.0 29.0 28.0 26.0 25.0
PQFP 208 5.0 30.0 29.0 27.0 22.0
FBGA 144 14.0 36.0 34.0 32.0 29.0
FBGA 324 9.0 31.0 29.0 28.0 25.0
EP20K60E
TQFP 144 7.0 28.0 26.0 25.0 24.0
FBGA 144 11.0 33.0 32.0 30.0 27.0
PQFP 208 5.0 30.0 28.0 26.0 21.0
PQFP 240 4.0 26.0 24.0 21.0 17.0
FBGA 324 7.0 29.0 28.0 26.0 24.0
BGA 356 1.0 12.0 11.0 10.0 9.0
EP20K100
TQFP 144 7.0 26.0 25.0 24.0 23.0
PQFP 208 5.0 29.0 27.0 25.0 20.0
PQFP 240 4.0 25.0 23.0 20.0 17.0
FBGA 324 6.0 28.0 26.0 25.0 23.0
BGA 356 1.0 12.0 11.0 10.0 9.0
EP20K100E
TQFP 144 7.0 26.0 25.0 24.0 23.0
FBGA 144 9.0 32.0 30.0 29.0 26.0
PQFP 208 5.0 29.0 27.0 25.0 20.0
PQFP 240 4.0 25.0 23.0 20.0 17.0
FBGA 324 6.0 28.0 26.0 25.0 23.0
BGA 356 1.0 12.0 11.0 10.0 9.0
EP20K160E
TQFP 144 6.0 25.0 24.0 23.0 22.0
PQFP 208 5.0 28.0 26.0 23.0 19.0
PQFP 240 4.0 24.0 21.0 19.0 16.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 24.0 23.0 22.0 21.0
EP20K200
PQFP 208 4.0 25.0 23.0 20.0 17.0
PQFP 240 3.0 21.0 19.0 17.0 15.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 22.0 21.0 20.0 19.0
EP20K200E
PQFP 208 4.0 25.0 23.0 20.0 17.0
PQFP 240 3.0 22.0 19.0 18.0 16.0
BGA 356 2.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 23.0 22.0 21.0 20.0
BGA 652 1.0 12.0 11.0 10.0 9.0
FBGA 672 5.0 21.0 20.0 19.0 18.0
Package Information Datasheet for Mature Altera Devices 37
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
EP20K200C
PQFP 208 4.0 25.0 23.0 20.0 17.0
PQFP 240 3.0 22.0 19.0 18.0 16.0
BGA 356 2.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 23.0 22.0 21.0 20.0
EP20K300E
PQFP 240 3.0 19.0 18.0 16.0 15.0
BGA 652 1.0 12.0 11.0 10.0 9.0
FBGA 672 5.0 20.0 19.0 18.0 17.0
EP20K400
BGA 652 0.5 9.0 8.0 7.0 6.0
PGA 655 1.0 8.0 7.0 6.0 4.0
FBGA 672 0.4 11.6 9.6 7.9 6.5
FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6
EP20K400E
EP20K400C
BGA 652 0.5 9.0 8.0 7.0 6.0
FBGA (Cu lid) 672 0.3 10.9 8.8 7.4 6.3
FBGA (AlSiC lid) 0.4 11.7 9.7 8.0 6.7
FBGA w/ fin (1) 672 0.5 7.0 4.0 3.0 2.6
EP20K600E
EP20K600C
BGA 652 0.5 9.0 8.0 7.0 6.0
FBGA (Cu lid) 672 0.2 10.8 8.7 7.3 6.1
FBGA (AlSiC lid) 0.3 11.6 9.6 7.9 6.5
FBGA w/ fin (1) 672 0.5 5.0 3.0 3.0 2.0
FBGA (Cu lid) 1,020 0.2 9.9 7.8 6.5 5.4
FBGA (AlSiC lid) 0.3 10.4 8.4 6.8 5.6
FBGA w/ fin (1) 1,020 0.5 5.0 3.0 3.0 2.0
EP20K1000E
EP20K1000C
BGA (Cu lid) 652 0.1 8.3 7.0 5.6 4.5
BGA (AlSiC lid) 0.2 9.3 7.4 6.0 4.9
FBGA w/ fin (1) 652 0.5 4.0 3.0 3.0 2.0
FBGA (Cu lid) 672 0.1 10.6 8.6 7.2 6.0
FBGA (AlSiC lid) 0.2 11.4 9.4 7.7 6.3
FBGA w/ fin (1) 672 0.5 6.0 4.0 3.0 2.0
FBGA (Cu lid) 1,020 0.1 9.7 7.7 6.3 5.2
FBGA (AlSiC lid) 0.2 10.2 8.2 6.6 5.4
FBGA w/ fin (1) 1,020 0.5 5.0 3.0 2.0 2.0
Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 2 of 3)
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
38 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
ACEX 1K Devices Thermal Resistance
Table 38 provides thermal resistance values for ACEX 1K devices.
EP20K1500E
BGA (Cu lid) 652 0.1 8.2 6.9 5.5 4.4
BGA (AlSiC lid) 0.2 9.2 7.3 5.8 4.8
FBGA 652 0.1 9.2 7.3 5.8 4.8
FBGA w/ fin (1) 652 0.5 4.0 3.0 2.5 2.0
FBGA (Cu lid) 1,020 0.1 9.6 7.6 6.2 5.1
FBGA (AlSiC lid) 0.2 10.1 8.1 6.4 5.3
FBGA w/ fin (1) 1,020 0.5 5.0 3.0 2.5 2.0
Note to Table 37:
(1) “fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have different sizes. Altera
performed the thermal calculations in Table 37 using the following fin specifications: width: 0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base
thickness: 0.5 mm.
Table 37. Thermal Resistance of APEX 20KE, 20KC, and 20K Devices (Part 3 of 3)
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
Table 38. Thermal Resistance of ACEX 1K Devices
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP1K10
TQFP 100 11.0 37.0 35.0 33.0 29.0
TQFP 144 8.0 31.0 29.0 28.0 25.0
PQFP 208 6.0 30.0 29.0 27.0 22.0
FBGA 256 12.0 37.0 35.0 33.0 30.0
EP1K30
TQFP 144 8.0 28.0 27.0 26.0 24.0
PQFP 208 5.0 30.0 28.0 26.0 21.0
FBGA 256 9.0 31.0 29.0 28.0 25.0
EP1K50
TQFP 144 7.0 26.0 25.0 24.0 23.0
PQFP 208 5.0 29.0 28.0 25.0 20.0
FBGA 256 7.0 30.0 28.0 27.0 24.0
FBGA 484 5.0 25.0 24.0 23.0 22.0
EP1K100
PQFP 208 5.0 28.0 26.0 23.0 18.0
FBGA 256 6.0 28.0 26.0 25.0 23.0
FBGA 484 5.0 24.0 23.0 22.0 21.0
Package Information Datasheet for Mature Altera Devices 39
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Mercury Devices Thermal Resistance
Table 39 provides thermal resistance values for Mercury devices.
FLEX Series Devices Thermal Resistance
Table 40 through Table 42 provide thermal resistance values for FLEX series devices.
FLEX 10K Devices
Table 40 lists the thermal resistance of FLEX 10K devices.
Table 39. Thermal Resistance of Mercury Devices
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EP1M120 FBGA (Cu lid) 484 0.6 12.2 10.1 8.7 7.5
FBGA (AlSiC lid) 484 0.9 13.0 11.1 9.3 7.9
EP1M350 FBGA (Cu lid) 780 0.2 10.5 8.5 7.1 5.9
FBGA (AlSiC lid) 780 0.3 11.0 9.2 7.6 6.3
Table 40. Thermal Resistance of FLEX 10K Devices (Part 1 of 3)
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPF10K10
PLCC 84 9.0 28.0 26.0 24.0 22.0
TQFP 144 7.0 26.0 25.0 24.0 23.0
PQFP 208 5.0 29.0 27.0 25.0 20.0
EPF10K10A
TQFP 100 10.0 35.0 33.0 31.0 28.0
TQFP 144 7.0 29.0 28.0 26.0 25.0
PQFP 208 5.0 30.0 29.0 27.0 21.0
FBGA 256 7.0 33.0 30.0 28.0 26.0
EPF10K20
TQFP 144 6.0 24.0 23.0 22.0 21.0
RQFP 208 1.0 17.0 16.0 15.0 13.0
RQFP 240 1.0 14.0 12.0 11.0 10.0
EPF10K30
RQFP 208 1.0 17.0 16.0 15.0 12.0
RQFP 240 1.0 13.0 12.0 11.0 10.0
BGA 356 1.0 12.0 11.0 10.0 9.0
EPF10K30A
TQFP 144 7.0 25.0 24.0 23.0 22.0
PQFP 208 5.0 29.0 27.0 24.0 19.0
PQFP 240 4.0 25.0 22.0 20.0 17.0
FBGA 256 6.0 28.0 26.0 24.0 23.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 24.0 22.0 21.0 20.0
EPF10K30E
TQFP 144 9.0 28.0 27.0 26.0 24.0
PQFP 208 5.0 30.0 28.0 26.0 21.0
FBGA 256 9.0 31.0 29.0 28.0 25.0
FBGA 484 6.0 26.0 25.0 24.0 22.0
40 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
EPF10K40 RQFP 208 1.0 17.0 16.0 15.0 12.0
RQFP 240 1.0 13.0 12.0 11.0 10.0
EPF10K50
RQFP 240 1.0 12.0 11.0 10.0 9.0
BGA 356 1.0 12.0 11.0 10.0 9.0
PGA 403 3.0 12.0 10.0 9.0 8.0
PGA (1) 3.0 10.0 8.0 7.0 6.0
EPF10K50V
PQFP 240 4.0 25.0 22.0 20.0 17.0
RQFP 240 1.0 13.0 12.0 11.0 10.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 23.0 22.0 21.0 20.0
EPF10K50E
TQFP 144 9.0 26.0 25.0 24.0 23.0
PQFP 208 5.0 29.0 27.0 24.0 19.0
PQFP 240 4.0 25.0 22.0 20.0 17.0
FBGA 256 6.0 29.0 27.0 26.0 24.0
FBGA 484 5.0 25.0 24.0 23.0 21.0
EPF10K50S
TQFP 144 9.0 26.0 25.0 24.0 23.0
PQFP 208 5.0 29.0 28.0 25.0 20.0
PQFP 240 4.0 26.0 23.0 20.0 17.0
FBGA 256 7.0 30.0 28.0 27.0 24.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 25.0 24.0 23.0 22.0
EPF10K70 RQFP 240 1.0 12.0 11.0 10.0 9.0
PGA 503 1.0 8.0 7.0 6.0 4.0
EPF10K100
PGA
503
1.0 8.0 7.0 6.0 4.0
PGA (1) 1.0 6.0 5.0 4.0 3.0
PGA (2) — 2.0 — — —
EPF10K100A
RQFP 240 1.0 13.0 11.0 10.0 9.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 22.0 21.0 20.0 18.0
BGA 600 0.5 10.0 9.0 8.0 7.0
EPF10K100E
PQFP 208 5.0 28.0 26.0 23.0 18.0
PQFP 240 4.0 23.0 21.0 19.0 16.0
FBGA 256 6.0 28.0 26.0 25.0 23.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 24.0 23.0 22.0 21.0
EPF10K130V PGA 599 1.0 8.0 7.0 6.0 4.0
BGA 600 0.5 10.0 9.0 8.0 7.0
Table 40. Thermal Resistance of FLEX 10K Devices (Part 2 of 3)
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
Package Information Datasheet for Mature Altera Devices 41
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
FLEX 8000 Devices
Table 41 lists the thermal resistance of FLEX 8000 devices.
EPF10K130E
PQFP 240 4.0 21.0 19.0 17.0 15.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 23.0 22.0 21.0 20.0
BGA 600 0.5 10.0 9.0 8.0 7.0
FBGA 672 5.0 21.0 20.0 19.0 18.0
EPF10K200E
PGA 599 1.0 8.0 7.0 6.0 4.0
BGA 600 0.5 10.0 9.0 8.0 7.0
FBGA 672 5.0 20.0 19.0 18.0 17.0
EPF10K200S
RQFP 240 1.0 13.0 11.0 10.0 9.0
BGA 356 1.0 12.0 11.0 10.0 9.0
FBGA 484 5.0 22.0 21.0 20.0 19.0
BGA 600 0.5 10.0 9.0 8.0 7.0
FBGA 672 5.0 21.0 20.0 19.0 18.0
EPF10K250A PGA 599 1.0 8.0 7.0 6.0 4.0
BGA 600 0.5 10.0 9.0 8.0 7.0
Notes to Table 40:
(1) With attached pin-fin heat sink.
(2) With attached motor-driven fan heat sink.
Table 40. Thermal Resistance of FLEX 10K Devices (Part 3 of 3)
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
Table 41. Thermal Resistance of FLEX 8000 Devices (Part 1 of 2)
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPF8282A PLCC 84 10.0 30.0 28.0 26.0 23.0
TQFP 100 11.0 36.0 34.0 32.0 29.0
EPF8452A
PLCC 84 10.0 30.0 28.0 26.0 23.0
TQFP 100 11.0 35.0 33.0 31.0 28.0
PQFP 160 6.0 32.0 31.0 30.0 28.0
EPF8636A
PLCC 84 10.0 29.0 28.0 26.0 23.0
PQFP 160 6.0 32.0 31.0 30.0 27.0
PGA 192 6.0 16.0 11.0 8.0 6.0
PQFP 208 5.0 30.0 38.0 26.0 20.0
RQFP 208 1.0 17.0 16.0 15.0 14.0
42 Package Information Datasheet for Mature Altera Devices
Thermal Resistance
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
FLEX 6000 Devices
Table 42 lists the thermal resistance of FLEX 6000 devices.
Excalibur Devices Thermal Resistance
Table 43 provides thermal resistance values for Excalibur devices.
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPF8820A
TQFP 144 9.0 26.0 25.0 24.0 23.0
PQFP 160 6.0 32.0 31.0 30.0 27.0
PQFP 208 5.0 29.0 27.0 25.0 20.0
RQFP 208 1.0 17.0 16.0 15.0 14.0
BGA 225 6.0 28.0 19.0 14.0 11.0
EPF81188A
PQFP 208 5.0 28.0 26.0 24.0 19.0
PGA 232 2.0 14.0 10.0 7.0 5.0
PQFP 240 4.0 24.0 21.0 19.0 16.0
RQFP 240 1.0 14.0 12.0 11.0 10.0
EPF81500A
PQFP 240 4.0 22.0 20.0 19.0 16.0
RQFP 240 1.0 13.0 12.0 11.0 10.0
PGA 280 2.0 14.0 10.0 7.0 5.0
Table 41. Thermal Resistance of FLEX 8000 Devices (Part 2 of 2)
Table 42. Thermal Resistance of FLEX 6000 Devices
Device Package Pin Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPF6010A TQFP 100 11.0 35.0 33.0 31.0 28.0
TQFP 144 10.0 28.0 26.0 25.0 24.0
EPF6016
TQFP 144 10.0 28.0 26.0 25.0 24.0
PQFP 208 5.0 30.0 28.0 26.0 21.0
PQFP 240 4.0 26.0 24.0 21.0 17.0
BGA 256 6.0 28.0 22.0 20.0 19.0
EPF6016A
TQFP 100 11.0 35.0 33.0 31.0 28.0
FBGA 14.0 36.0 34.0 32.0 29.0
TQFP 144 10.0 29.0 28.0 26.0 24.0
PQFP 208 5.0 30.0 29.0 26.0 21.0
FBGA 256 10.0 32.0 30.0 29.0 26.0
EPF6024A
TQFP 144 10.0 27.0 26.0 25.0 24.0
PQFP 208 5.0 29.0 28.0 26.0 20.0
PQFP 240 4.0 26.0 23.0 21.0 17.0
BGA 256 6.0 28.0 22.0 20.0 19.0
FBGA 8.0 30.0 29.0 27.0 25.0
Package Information Datasheet for Mature Altera Devices 43
Thermal Resistance
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Table 43. Thermal Resistance of Excalibur Embedded Processor Solutions
Device Package
Pin
Count JC (° C/W)
JA (° C/W)
Still Air
JA (° C/W)
100 ft./min.
JA (° C/W)
200 ft./min.
JA (° C/W)
400 ft./min.
EPXA1
FBGA 484 4.0 20.0 18.3 15.8 13.9
FBGA, Flip Chip (Cu lid) 672 0.5 11.3 9.3 7.9 6.7
FBGA, Flip Chip (AlSiC lid) 672 0.8 12.2 10.2 8.6 7.2
EPXA4
FBGA, Flip Chip (Cu lid) 672 0.2 10.8 8.8 7.3 6.2
FBGA, Flip Chip (AlSiC lid) 672 0.3 11.6 9.6 7.9 6.6
FBGA, Flip Chip (Cu lid) 1,020 0.2 9.9 7.9 6.5 5.4
FBGA, Flip Chip (AlSiC lid) 1,020 0.3 10.4 8.5 6.9 5.7
EPXA10 FBGA, Flip Chip (Cu lid) 1,020 0.1 9.6 7.6 6.2 5.1
FBGA, Flip Chip (AlSiC lid) 1,020 0.2 10.0 8.0 6.4 5.7
44 Package Information Datasheet for Mature Altera Devices
Package Outlines
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outlines
The package outlines on the following pages are listed in order of ascending pin
count. Altera package outlines meet the requirements of JEDEC Publication No. 95.
1All lidless flip chip and wire bond packages are non-vented packages. All other flip
chip packages are vented packages.
Package Information Datasheet for Mature Altera Devices 45
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
8-Pin Plastic Dual In-Line Package (PDIP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in inches.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference P
Package Acronym PDIP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-001 Variation: BA
Lead Coplanarity NA
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A — — 0.170
A1 0.015 — —
A2 0.130 TYP
D 0.360 — 0.380
E 0.300 0.310 0.325
E1 0.240 0.250 0.260
L 0.125 — 0.135
b 0.016 0.018 0.020
c 0.008 0.010 0.014
e 0.100 BSC
46 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
E1
D
A
A2
A1
b
E
L
c
e
Pin 1 ID
Pin 1
Pin 4
Pin 8
Package Information Datasheet for Mature Altera Devices 47
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
20-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in inches.
■Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's
proximity, on package surface.
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AA
Lead Coplanarity 0.004 inches (0.10mm)
Weight 0.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 — —
A2 0.150 TYP
D 0.385 0.390 0.395
D1 0.350 0.353 0.356
D2 0.290 0.310 0.330
E 0.385 0.390 0.395
E1 0.350 0.353 0.356
E2 0.290 0.310 0.330
b 0.013 — 0.021
c 0.010 TYP
e 0.050 TYP
48 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 49
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
32-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: ABA
Lead Coplanarity 0.004 inches (0.1mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.20
A1 0.05 — 0.15
A2 0.95 1.00 1.05
D 9.00 BSC
D1 7.00 BSC
E 9.00 BSC
E1 7.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.30 0.37 0.45
c 0.09 — 0.20
e 0.80 BSC
03.57
50 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 51
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
44-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in inches.
■Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1’s
proximity, on package surface.
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AC
Lead Coplanarity 0.004 inches (0.10 mm)
Weight 2.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 — —
A2 0.150 TYP
D 0.685 0.690 0.695
D1 0.650 0.653 0.656
D2 0.582 0.610 0.638
E 0.685 0.690 0.695
E1 0.650 0.653 0.656
E2 0.582 0.610 0.638
b 0.013 — 0.021
c 0.010 TYP
e 0.050 TYP
52 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D1
A
A2
A1
E1
E
D
Pin 1 ID
c
e
b
D2
E2
Pin 7
Pin 17
Pin 44
Pin 1
Package Information Datasheet for Mature Altera Devices 53
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
44-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: ACB
Lead Coplanarity 0.004 inches (0.1mm)
Weight 0.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.20
A1 0.05 — 0.15
A2 0.95 — —
D 12.00 BSC
D1 10.00 BSC
E 12.00 BSC
E1 10.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.30 0.37 0.45
c 0.09 — 0.20
e 0.80 BSC
03.57
54 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 55
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
49-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAB-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.55
A1 0.20 — —
A2 — — 1.35
A3 0.70 TYP
D 7.00 BSC
E 7.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
56 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 57
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
64-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference E
Package Acronym EQFP
Leadframe Material Copper
Lead Finish (plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: ABD-HD
Lead Coplanarity 0.003 inch (0.08 mm)
Weight 0.15 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.20
A1 0.05 — 0.15
A2 0.95 1.00 1.05
D 9.00 BSC
D1 7.00 BSC
D2 3.50 4.50 5.50
E 9.00 BSC
E1 7.00 BSC
E2 3.50 4.50 5.50
L0.45 0.60 0.75
L1 1.00 REF
S 0.20 ——
b 0.13 0.18 0.23
c 0.09 — 0.20
e 0.40 BSC
0° 3.5° 7°
58 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Pin 1 ID
Pin 1
Pin 16
Pin 64 Pin 64
Pin 16
Pin 1
Detail A
See Detail A
TOP VIEW BOTTOM VIEW
Package Information Datasheet for Mature Altera Devices 59
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
84-Pin Plastic J-Lead Chip Carrier (PLCC)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in inches.
■Pin 1 is generally indicated by an indentation in the plastic body, in Pin 1's
proximity, on package surface.
Package Information
Description Specification
Ordering Code Reference L
Package Acronym PLCC
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-018 Variation: AF
Lead Coplanarity 0.004 inches (0.10mm)
Weight 7.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A 0.165 0.172 0.180
A1 0.020 — —
A2 0.150 TYP
D 1.185 1.190 1.195
D1 1.150 1.154 1.158
D2 1.082 1.110 1.138
E 1.185 1.190 1.195
E1 1.150 1.154 1.158
E2 1.082 1.110 1.138
b 0.013 — 0.021
c 0.008 TYP
e 0.050 TYP
60 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 61
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
88-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline MO-219
Lead Coplanarity 0.005 inches (0.12 mm)
Weight 0.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.40
A1 0.25 — —
A2 0.80 — —
A3 0.70 REF
D 11.00 BSC
E 8.00 BSC
b 0.40 0.45 0.50
e 0.80 BSC
62 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
A1
A3
Pin A1 ID
A
A2
E
e
D
A
be
E
G
F
C
D
B
1
6
75
432
Pin A1
Corner
H
12 11 10 98
BOTTOM VIEWTOP VIEW
Package Information Datasheet for Mature Altera Devices 63
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
100-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the
package surface.
1This POD is applicable to F100 packages of all products except MAX II, which is
assembled in Option 2 package outlines.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder ball composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: AAC-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.70
A1 0.30 — —
A2 0.25 — 1.10
A3 — — 0.80
D 11.00 BSC
E 11.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
64 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
Pin A1 ID
be
e
A3 A1
A2
A
Pin A1
Corner
TOP VIEW BOTTOM VIEW
Package Information Datasheet for Mature Altera Devices 65
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
100-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on the
package surface.
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-022 Variation: GC-1
Lead Coplanarity 0.004 inches (0.10mm)
Weight 1.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.40
A1 0.25 — 0.50
A2 2.50 2.70 2.90
D 17.20 BSC
D1 14.00 BSC
E 23.20 BSC
E1 20.00 BSC
L 0.73 0.88 1.03
L1 1.60 REF
S 0.20 — —
b 0.22 — 0.40
c 0.11 — 0.23
e 0.65 BSC
0—7
66 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
E
0.25mm
L
L1
b
e
See Detail A
A1
Detail A
C
S
A2
A
Gage
Plane
D1
D
E1
Pin 100
Pin 30
Pin 1
Pin 1 ID
Package Information Datasheet for Mature Altera Devices 67
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
100-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: AED
Lead Coplanarity 0.003 inches (0.08mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.20
A1 0.05 — 0.15
A2 0.95 1.00 1.05
D 16.00 BSC
D1 14.00 BSC
E 16.00 BSC
E1 14.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
03.57
68 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 69
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference E
Package Acronym EQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.60
A1 0.05 — 0.15
A2 1.35 1.40 1.45
D 22.00 BSC
D1 20.00 BSC
D2 4.00 — —
E 22.00 BSC
E1 20.00 BSC
E2 4.00 — —
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
03.57
70 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 71
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
144-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: AAD-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 0.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 0.25 — 1.80
A3 0.70 REF
D 13.00 BSC
E 13.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
72 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 73
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
144-Pin Plastic Thin Quad Flat Pack (TQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference T
Package Acronym TQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-026 Variation: BFB
Lead Coplanarity 0.003 inches (0.08mm)
Weight 1.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.60
A1 0.05 — 0.15
A2 1.35 1.40 1.45
D 22.00 BSC
D1 20.00 BSC
E 22.00 BSC
E1 20.00 BSC
L 0.45 0.60 0.75
L1 1.00 REF
S 0.20 — —
b 0.17 0.22 0.27
c 0.09 — 0.20
e 0.50 BSC
03.57
74 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 75
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
160-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in inches.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-067 Variation: AG
Lead Coplanarity N/A
Weight 19.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A 0.160 0.190 0.220
A1 0.050 TYP
A2 0.120 0.140 0.160
D 1.540 1.560 1.580
E 1.540 1.560 1.580
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
76 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 77
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
160-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-022 Variation: DD-1
Lead Coplanarity 0.004 inches (0.10mm)
Weight 6.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 31.20 BSC
D1 28.00 BSC
E 31.20 BSC
E1 28.00 BSC
L 0.50 — 1.03
L1 1.60 REF
S 0.20 — —
b 0.22 — 0.40
c 0.09 — 0.23
e 0.65 BSC
0—7
78 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 79
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
169-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAF-1
Lead Coplanarity 0.005 inches (0.12mm)
Weight 0.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.70
A1 0.20 — —
A2 0.65 — —
A3 0.70 TYP
D 11.00 BSC
E 11.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
80 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 81
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
208-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot in its proximity on package surface.
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Lead Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: FA-1
Lead Coplanarity 0.003 inches (0.08 mm)
Weight 6.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 30.60 BSC
D1 28.00 BSC
E 30.60 BSC
E1 28.00 BSC
L 0.50 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
0° 3.5° 8°
82 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Pin 1 ID
E
D1
D
Pin 208
A
A2
A1
S
L
L1
Detail A
Gage
Plane
0.25mm
C
b
e
See Detail A
E1
Pin 1
Pin 52
Package Information Datasheet for Mature Altera Devices 83
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
208-Pin Power Quad Flat Pack (RQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: FA-1
Lead Coplanarity 0.003 inches (0.08mm)
Weight 11.0 g (Typ.) or 6.4 g (Typ.) (1)
Moisture Sensitivity Level Printed on moisture barrier bag
Note:
(1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized
aluminum). Refer to PCN1002.
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 30.60 BSC
D1 28.00 BSC
E 30.60 BSC
E1 28.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
03.58
84 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 85
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
240-Pin Plastic Quad Flat Pack (PQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference Q
Package Acronym PQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: GA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 8.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 34.60 BSC
D1 32.00 BSC
E 34.60 BSC
E1 32.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
03.58
86 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 87
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
240-Pin Power Quad Flat Pack (RQFP)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin 1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference R
Package Acronym RQFP
Leadframe Material Copper
Lead Finish (Plating) Regular: 85Sn:15Pb (Typ.)
Pb-free: Matte Sn
JEDEC Outline Reference MS-029 Variation: GA
Lead Coplanarity 0.003 inches (0.08mm)
Weight 15.4 g (Typ.) or 8.5 g (Typ.) (1)
Moisture Sensitivity Level Printed on moisture barrier bag
Note:
(1) The lighter weight is due to the change in heat slug material used (from nickel-plated copper to anodized
aluminum). Refer to PCN1002.
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 4.10
A1 0.25 — 0.50
A2 3.20 3.40 3.60
D 34.60 BSC
D1 32.00 BSC
E 34.60 BSC
E1 32.00 BSC
L 0.45 0.60 0.75
L1 1.30 REF
S 0.20 — —
b 0.17 — 0.27
c 0.09 — 0.20
e 0.50 BSC
03.58
88 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 89
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
256-Pin Ball-Grid Array (BGA), Option 1—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAL-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 4.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.70
A1 0.35 — —
A2 0.25 — 1.10
D 27.00 BSC
E 27.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
90 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
Pin A1 ID
be
A1
A2
Pin A1
Corner
A
12
N
D
C
AB
1
J
G
E
H
F
LK
M
U
RT
P
WY
V
7
4
3
2
5
610 8
911
18
15
14
13
16
17
20
19
e
BOTTOM VIEWTOP VIEW
Package Information Datasheet for Mature Altera Devices 91
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
256-Pin Plastic Ball-Grid Array (BGA), Option 2—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAL-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.60
A1 0.35 — —
A2 — — 2.20
A3 — — 1.80
D 27.00 BSC
E 27.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
92 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
Pin A1 ID
be
e
A1
A2
Pin A1
Corner
A
W
Y
V
U
R
T
P
L
N
M
K
J
20
19
1018
17
16
15
12
13
14
11
8
97
6
5
4
3
2
F
H
G
E
D
A
B
C
1
TOP VIEW BOTTOM VIEW
A3
Package Information Datasheet for Mature Altera Devices 93
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
256-Pin FineLine Ball-Grid Array (FBGA), Option 1—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
1This POD is applicable to F256 packages of all products listed in this datasheet except
Cyclone II, which are assembled in Option 2 package outlines.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 — — 1.80
A3 0.70 REF
D 17.00 BSC
E 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
94 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
Pin A1 ID
be
e
A3
A1
A2
A
Pin A1
Corner
BOTTOM VIEW
TOP VIEW
Package Information Datasheet for Mature Altera Devices 95
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
256-Pin FineLine Ball-Grid Array (FBGA), Option 2—Thin—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the
package surface.
1This POD is applicable to F256 packages of the Cyclone II devices only.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: DAF-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 1.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.55
A1 0.25 — —
A2 1.05 REF
A3 — — 0.80
D 17.00 BSC
E 17.00 BSC
b 0.45 0.50 0.55
e 1.00 BSC
96 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 97
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
324-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Option 1
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAG-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 1.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 — — 1.80
A3 0.70 REF
D 19.00 BSC
E 19.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
98 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 99
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
356-Pin Ball-Grid Array (BGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAR-2
Lead Coplanarity 0.008 inches (0.20mm)
Weight 7.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 1.70
A1 0.35 — —
A2 0.25 — 1.10
D 35.00 BSC
E 35.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
100 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 101
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
400-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAH-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeteres
Min. Nom. Max.
A — — 2.20
A1 0.30 — —
A2 — — 1.80
A3 0.80 REF
D 21.00 BSC
E 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
102 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
Pin A1 ID
be
e
A3 A1
A2
A
Pin A1
Corner
BOTTOM VIEW
TOP VIEW
Package Information Datasheet for Mature Altera Devices 103
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
403-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in inches.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AL
Lead Coplanarity N/A
Weight 47.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A 0.157 0.180 0.203
A1 0.050 TYP
A2 0.117 0.130 0.143
D 1.940 1.960 1.980
E 1.940 1.960 1.980
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
104 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 105
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 6.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
106 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
A1
A3
A2
A
E
e
e
b
Pin A1 ID
Pin A1
Corner
BOTTOM VIEWTOP VIEW
Package Information Datasheet for Mature Altera Devices 107
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip—Channel Lid
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on the
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 6.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A 2.95 3.15 3.35
A1 0.40 0.50 0.60
A2 2.35 2.65 2.95
A3 1.35 1.45 1.55
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
108 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
A1
A3
A2
A
E
e
e
b
Pin A1 ID
Pin A1
Corner
BOTTOM VIEWTOP VIEW
Package Information Datasheet for Mature Altera Devices 109
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
484-Pin FineLine Ball-Grid Array (FBGA), Option 2—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
110 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
BOTTOM VIEW
TOP VIEW
e
e
D
E
Pin A1 ID
b
A3
A1
A2
A
Pin A1
Corner
Package Information Datasheet for Mature Altera Devices 111
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
484-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 23.00 BSC
D1 17.00 BSC
E 23.00 BSC
E1 17.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
112 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 113
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAJ-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 2.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.12 1.17 1.22
D 23.00 BSC
E 23.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
114 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
A3 A1
A2
A
Package Information Datasheet for Mature Altera Devices 115
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
484-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference H
Package Acronym HBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 11.3 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
116 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
BOTTOM VIEWTOP VIEW
E
D
e
e
A1
A2
b
A3
A
Pin A1 ID
Pin A1
Corner
Package Information Datasheet for Mature Altera Devices 117
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference U
Package Acronym UBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-216 Variation: BAP-2
Lead Coplanarity 0.005 inches (0.12mm)
Weight 1.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.20
A1 0.20 — —
A2 0.65 — —
A3 0.95 TYP
D 19.00 BSC
E 19.00 BSC
b 0.40 0.50 0.60
e 0.80 BSC
118 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
BOTTOM VIEWTOP VIEW
D
E
Pin A1 ID
b
A3
A1
A2
A
Pin A1
Corner
e
e
Package Information Datasheet for Mature Altera Devices 119
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
503-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in inches.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold Over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AN
Lead Coplanarity N/A
Weight 59.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A — — 0.205
A1 0.050 TYP
A2 — — 0.145
D 2.245 2.260 2.275
E 2.245 2.260 2.275
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
120 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
Pin A1 ID
EA1
A
A2
L
L
W
AA
R
U
N
G
J
E
C
A
19 15 11 7 321 17 13 9 5 1
2329 27 25
AG
AJ
AE
AC
3133
AN
AL
37 35
AU
AR
36 34 32 28
30 26 22
24 20 16
18 14 10
12 8 4
62
V
AM
AT
AP
AH
AK
AF
AB
AD
Y
K
P
T
M
H
D
F
B
40
3941
38
43
42
BB
BC
AW
BA
AV
AY
TOP VIEW BOTTOM VIEW
be
e
Pin A1
Corner
12
e
12
e
Package Information Datasheet for Mature Altera Devices 121
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
599-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in inches.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AP
Lead Coplanarity N/A
Weight 69.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A — — 0.205
A1 0.050 TYP
A2 — — 0.145
D 2.445 2.460 2.475
E 2.445 2.460 2.475
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
122 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 123
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
600-Pin Ball-Grid Array (BGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20mm)
Weight 12.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.00
A1 0.35 — —
A2 0.25 — 1.10
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
124 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
Pin A1 ID
be
e
A1
A2
Pin A1
Corner
A
34 12
AK
N
D
C
AB
1
J
G
E
H
F
LK
M
AJ
AG
AE
AC
AA
U
RT
P
WY
V
AH
AD
AF
AB
7
4
3
2
5
610 8
911
AR
AN
AL
AP
AM
24
23
18
15
14
13
16
17
20
21 19
22
29
26
25
28
27
32 30
3133
35
TOP VIEW BOTTOM VIEW
Package Information Datasheet for Mature Altera Devices 125
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
652-Pin Ball-Grid Array (BGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 23.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
126 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
17
10
11
12
13
AD
AG
AH
AF
AE
AA
AB
AC
Y
W
N
U
V
T
P
R
K
M
L
J
H
6
7
8
9
2
3
4
5
B
F
G
E
D
C
1
A
AJ
AR
AM
AN
AP
AK
AL
34
35
30
31
32
33
28
29
26
27
22
23
24
25
18
19
20
21
14
15
16
D
E
e
b
e
A1
A3
A2
A
Pin A1 ID
Pin A1
Corner
BOTTOM VIEWTOP VIEW
Package Information Datasheet for Mature Altera Devices 127
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
652-Pin Plastic Ball-Grid Array (BGA), Option 2—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.20
A1 0.35 — —
A2 — — 2.80
A3 — — 2.40
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
128 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
A3
TOP VIEW BOTTOM VIEW
28
29
26
27
22
23
24
25
18
19
20
21
14
15
16
17
10
11
12
13
AD
AG AH
AF
AE
AA AB
AC
Y
W
N
UV
T
P
R
K
M
L
JH
6
7
8
9
2
3
4
5
B
F
G
ED
C
1
A
D
E
e
b
e
A1
A2
A
Pin A1 ID
Pin A1
Corner
AJ
AR
AM
AN AP
AK
AL
34
35
30
31
32
33
Package Information Datasheet for Mature Altera Devices 129
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
652-Pin Plastic Ball-Grid Array (BGA), Option 3—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT or tape
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-192 Variation: BAW-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.00
A1 0.35 — —
A2 0.25 — 1.10
D 45.00 BSC
E 45.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
130 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
BOTTOM VIEWTOP VIEW
D
E
Pin A1 ID
be
A1
A2
Pin A1
Corner
A
34 12
AK
N
D
C
AB
1
J
G
E
H
F
LK
M
AJ
AG
AE
AC
AA
U
RT
P
WY
V
AH
AD
AF
AB
7
4
3
2
5
6
10 8
911
AR
AN
AL
AP
AM
24
23
18
15
14
13
16
17
20
21 19
22
29
26
25
28
27
32 30
31
3335
e
Package Information Datasheet for Mature Altera Devices 131
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
655-Pin Ceramic Pin-Grid Array (PGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in inches.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference G
Package Acronym PGA
Leadframe Material Alloy 42
Lead Finish Gold over Nickel Plate
JEDEC Outline Reference MO-128 Variation: AP
Lead Coplanarity N/A
Weight 74.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Inches
Min. Nom. Max.
A — — 0.205
A1 0.050 TYP
A2 — — 0.145
D 2.445 2.460 2.475
E 2.445 2.460 2.475
L 0.130 TYP
b 0.016 0.018 0.020
e 0.100 BSC
132 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 133
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
672-Pin Plastic Ball-Grid Array (BGA)—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAR-2
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 5.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.60
A1 0.35 — —
A2 — — 2.20
A3 — — 1.80
D 35.00 BSC
E 35.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
134 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
A2
A
E
Pin A1 ID
Pin A1
Corner
TOP VIEW BOTTOM VIEW
A3
Y
AA
W
V
R
T
U
P
21
2426
25
22
23 15
1820
19
16
17
1214
13
10
11
J
L
M
K
G
H
F
E
8
97
64
5
C
D
B
A
2
31
D
e
b
e
A1
N
AF
AD
AE
AC
AB
Package Information Datasheet for Mature Altera Devices 135
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
672-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 9.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
136 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
E
D
e
e
A1
A2
b
A3
A
Pin A1 ID
Pin A1
Corner
BOTTOM VIEWTOP VIEW
Package Information Datasheet for Mature Altera Devices 137
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
672-Pin FineLine Ball-Grid Array (FBGA), Option 2—Wire Bond
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 2.60
A1 0.30 — —
A2 — — 2.20
A3 — — 1.80
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
138 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
Pin A1 ID
b
A3
A1
A2
A
Pin A1
Corner
e
e
BOTTOM VIEW
TOP VIEW
Package Information Datasheet for Mature Altera Devices 139
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
672-Pin FineLine Ball-Grid Array (FBGA), Option 4—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 7.1 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 27.00 BSC
D1 20.00 BSC
E 27.00 BSC
E1 20.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
140 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 141
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
672-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAL-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.12 1.17 1.22
D 27.00 BSC
E 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
142 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
A3 A1
A2
A
b
e
e
Package Information Datasheet for Mature Altera Devices 143
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
724-Pin Ball-Grid Array (BGA)—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 13.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 35.00 BSC
E 35.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
144 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
D
E
e
b
e
A3
A1
A2
A
Pin A1 ID
Pin A1
Corner
BOTTOM VIEWTOP VIEW
Package Information Datasheet for Mature Altera Devices 145
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
780-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 10.7 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
146 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Pin A1 ID
Pin A1
Corner
BOTTOM VIEWTOP VIEW
E
D
e
e
A1
A2
b
A3
A
Package Information Datasheet for Mature Altera Devices 147
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
780-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip—Channel Lid
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MO-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 9.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A 3.05 3.25 3.45
A1 0.40 0.50 0.60
A2 2.45 2.75 3.05
A3 1.45 1.55 1.65
D 29.00 BSC
E 29.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
148 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Pin A1 ID
Pin A1
Corner
BOTTOM VIEWTOP VIEW
E
D
e
e
A1
A2
b
A3
A
Package Information Datasheet for Mature Altera Devices 149
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
780-Pin FineLine Ball-Grid Array (FBGA), Option 3—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAM-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 8.2 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 29.00 BSC
D1 21.00 BSC
E 29.00 BSC
E1 21.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
150 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 151
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
896-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—A:2.40
■All dimensions and tolerances conform to ASME Y14.5M – 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAN-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 3.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A 2.10 2.25 2.40
A1 0.40 0.50 0.60
A2 1.50 1.75 2.00
A3 1.12 1.17 1.22
D 31.00 BSC
E 31.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
152 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
A3 A1
A2
A
be
e
E
D
Package Information Datasheet for Mature Altera Devices 153
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
956-Pin Ball-Grid Array (BGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 19.6 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
E 40.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
154 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 155
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
956-Pin Ball-Grid Array (BGA), Option 2—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference B
Package Acronym BGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: BAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 17.0 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.60 0.75 0.90
e 1.27 BSC
156 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 157
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
1020-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 13.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 33.00 BSC
E 33.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
158 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 159
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
1020-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAP-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 10.8 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 33.00 BSC
D1 26.00 BSC
E 33.00 BSC
E1 26.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
160 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 161
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
1152-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.5 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 35.00 BSC
E 35.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
162 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 163
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
1152-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAR-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 12.4 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 35.00 BSC
D1 27.00 BSC
E 35.00 BSC
E1 27.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
164 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 165
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
1508-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 18.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
E 40.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
166 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices 167
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
1508-Pin FineLine Ball-Grid Array (FBGA), Option 2—Flip Chip
■All dimensions and tolerances conform to ASME Y14.5M - 1994.
■Controlling dimension is in millimeters.
■Pin A1 may be indicated by an ID dot, or a special feature, in its proximity on
package surface.
Package Information
Description Specification
Ordering Code Reference F
Package Acronym FBGA
Substrate Material BT
Solder Ball Composition Regular: 63Sn:37Pb (Typ.)
Pb-free: Sn:3Ag:0.5Cu (Typ.)
JEDEC Outline Reference MS-034 Variation: AAU-1
Lead Coplanarity 0.008 inches (0.20 mm)
Weight 15.9 g (Typ.)
Moisture Sensitivity Level Printed on moisture barrier bag
Package Outline Dimension Table
Symbol
Millimeters
Min. Nom. Max.
A — — 3.50
A1 0.30 — —
A2 0.25 — 3.00
A3 — — 2.50
D 40.00 BSC
D1 30.00 BSC
E 40.00 BSC
E1 30.00 BSC
b 0.50 0.60 0.70
e 1.00 BSC
168 Package Information Datasheet for Mature Altera Devices
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
Package Outline
Package Information Datasheet for Mature Altera Devices i
Additional Information
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
Additional Information
This section contains revision history and contact information.
Revision History
Table 60 lists the revision history for this document.
Table 60. Document Revision History (1) (Part 1 of 13)
Date and Document
Version Changes Made Summary of Changes
December 2011 ■Added “896-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—
A:2.40”,“484-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—
A:2.40”, and “672-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—
A:2.40”.
Updated for version 16.8
November 2011 ■Added Table 9 on page 10. Updated for version 16.7
August 2011 ■Removed HardCopy III, HardCopy IV, MAX V, MAX II, Classic, and
EPCS devices’ package listing and thermal resistance values.
Updated for version 16.6
July 2011 ■Removed Arria II, Stratix V, Stratix IV, Stratix III, Cyclone IV, and
Cyclone III devices’ package listing and thermal resistance values.
Updated for version 16.5
ii Package Information Datasheet for Mature Altera Devices
Additional Information
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
June 2011 ■Updated package diagram in “780-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Dual-Piece Lid (EP3SL150)” and “780-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-Piece Lid
(EP3SE110)”
■Added Table 30 and Table 58.
■Updated the A and A2 dimension values in “780-Pin FineLine Ball-
Grid Array (FBGA)—Flip Chip—Channel Lid (EP4SGX230)” and “780-
Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid
(EP4SE230)”.
■Updated the D1 and E1 dimension values in “1152-Pin FineLine Ball-
Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX290)” and
“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece
Lid (EP4SGX360)”.
■Updated Table 13.
■Updated the b, A, and A2 dimension values in “256-Pin Ultra FineLine
Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C10)”, “256-Pin
Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—Thin (EP3C16)”
and “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond—
Thin (EP3C25)”.
■Updated information in “Package Outlines”.
■Added new package diagram for “1152-Pin FineLine Ball-Grid Array
(HBGA)—Flip Chip—Dual-Piece Lid (EP3SL340)”, and “780-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Channel Lid
(EP4SGX180)”.
■Added new 1760-pin packages for 5SGXB5 and 5SGXB6 devices:
“1760-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece
Lid—A:3.40” to replace the 1932-pin packages for 5SGXB5 and
5SGXB6 devices.
■Updated cross reference for 5SGXB5 and 5SGXB6 1517-pin package
diagram in Table 3.
■Updated table Table 33.
Updated for version 16.4
Table 60. Document Revision History (1) (Part 2 of 13)
Date and Document
Version Changes Made Summary of Changes
Package Information Datasheet for Mature Altera Devices iii
Additional Information
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
December 2010 ■Updated document title and metadata.
■Updated Table 43 with new thermal resistance value for EP3C16
(U484 Wire Bond package) and EP3C40 (U484 Wire Bond and F780
Wire Bond packages).
■Updated note 3 in Table 9.
■Updated Table 19 and Table 53 to remove dual-piece lid options for
HardCopy II devices.
■Added Arria II GZ device package listing in Table 2 and Arria II GZ
thermal resistance in Table 35.
■Added Stratix V device package listing in Table 4 and Stratix V thermal
resistance in Table 37.
■Added MAX V device package listing in Table 13 and MAX V thermal
resistance in Table 46.
■Added new Cyclone IV device package in Table 9 and thermal
resistance values in Table 42.
■Updated lead coplanarity and A3 dimension values in 358-Pin Ultra
FineLine Ball-Grid Array (UBGA)—Flip Chip, 358-Pin Ultra FineLine
Ball-Grid Array (UBGA)—Flip Chip—Lidless (EP2AGX45), and 358-
Pin Ultra FineLine Ball-Grid Array (UBGA)—Flip Chip—Lidless
(EP2AGX65).
■Added new package diagram for 1932-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360), 324-Pin
FineLine Ball-Grid Array (FBGA)—Wire Bond (EPM2210), and 324-
Pin FineLine Ball-Grid Array (FBGA)—Wire Bond (EPM2210G).
Updated for version 16.3
Table 60. Document Revision History (1) (Part 3 of 13)
Date and Document
Version Changes Made Summary of Changes
iv Package Information Datasheet for Mature Altera Devices
Additional Information
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
September 2010 ■Updated JEDEC Outline Reference for “144-Pin Plastic Enhanced
Quad Flat Pack (EQFP)—Wire Bond (EP3C10)”, “144-Pin Plastic
Enhanced Quad Flat Pack (EQFP)—Wire Bond—(EP3C16)”, and
“144-Pin Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond—
(EP3C25)”.
■Updated dimension value for Arria II GX devices: “572-Pin FineLine
Ball-Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX95)”, “780-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX95)”,
“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(EP2AGX95)”, “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—
Flip Chip (EP2AGX65)”, “780-Pin FineLine Ball-Grid Array (FBGA)—
Flip Chip—Lidless (EP2AGX65)”, “572-Pin FineLine Ball-Grid Array
(FBGA)—Lidless—Flip Chip (EP2AGX45)”,“780-Pin FineLine Ball-
Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX45)”, “1152-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX260)”,
“780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(EP2AGX260)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Lidless (EP2AGX190)”, “780-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Lidless (EP2AGX190)”, “1152-Pin FineLine Ball-
Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX125)”, “780-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX125)”,
and “572-Pin FineLine Ball-Grid Array (FBGA)—Lidless—Flip Chip
(EP2AGX125)”.
■Updated dimension value for HardCopy devices: “1517-Pin FineLine
Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E35)”, “1152-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E35)”,
“1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(HC335)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—
Lidless (HC335)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Lidless (HC325)”, “484-Pin FineLine Ball-Grid Array (FBGA)—
Flip Chip—Lidless (HC4E25)”, “780-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Lidless (HC4E25)”, “780-Pin FineLine Ball-Grid
Array (FBGA)—Flip Chip—Lidless (HC4GX15)”, “780-Pin FineLine
Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”, “1152-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4GX25)”,
“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(HC4GX35)”, and “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Lidless (HC4GX35)”.
■Revised the unit weight info for: “484-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “484-Pin FineLine Ball-Grid Array
(FBGA), Option 4—Flip Chip”, “572-Pin FineLine Ball-Grid Array
(FBGA)—Option 1, Flip Chip”, “572-Pin FineLine Ball-Grid Array
(FBGA)—Option 2, Flip Chip”, “672-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “672-Pin FineLine Ball-Grid Array
(FBGA), Option 4—Flip Chip”, “780-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “780-Pin FineLine Ball-Grid Array
(FBGA), Option 3—Flip Chip”, “780-Pin FineLine Ball-Grid Array
(FBGA), Option 4—Flip Chip”“1020-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, and “1020-Pin FineLine Ball-Grid Array
(FBGA), Option 2—Flip Chip”.
Updated for version 16.2
Table 60. Document Revision History (1) (Part 4 of 13)
Date and Document
Version Changes Made Summary of Changes
Package Information Datasheet for Mature Altera Devices v
Additional Information
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
■Revised the unit weight info for: “1152-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “1152-Pin FineLine Ball-Grid Array
(FBGA), Option 2—Flip Chip”, “1152-Pin FineLine Ball-Grid Array
(FBGA), Option 3—Flip Chip”, “1508-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “1508-Pin FineLine Ball-Grid Array
(FBGA), Option 2—Flip Chip”, “1517-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “1517-Pin FineLine Ball-Grid Array
(FBGA), Option 2—Flip Chip”, “1760-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “1760-Pin FineLine Ball-Grid Array
(FBGA), Option 2—Flip Chip”, “1932-Pin FineLine Ball-Grid Array
(FBGA), Option 1—Flip Chip”, “1932-Pin FineLine Ball-Grid Array
(FBGA), Option 2—Flip Chip”, “484-Pin Hybrid FineLine Ball-Grid
Array (HBGA)—Flip Chip”, “780-Pin Hybrid FineLine Ball-Grid Array
(HBGA)—Flip Chip”, “1517-Pin Hybrid FineLine Ball-Grid Array
(HBGA), Option 1—Flip Chip”, “1517-Pin Hybrid FineLine Ball-Grid
Array (HBGA), Option 2—Flip Chip”, “1152-Pin Hybrid FineLine Ball-
Grid Array (HBGA), Option 1—Flip Chip”, “1152-Pin Hybrid FineLine
Ball-Grid Array (HBGA), Option 2—Flip Chip”, “1152-Pin Hybrid
FineLine Ball-Grid Array (HBGA), Option 3—Flip Chip”, and “1152-Pin
Hybrid FineLine Ball-Grid Array (HBGA), Option 4—Flip Chip”.
■Added package diagram: “144-Pin Plastic Enhanced Quad Flat Pack
(EQFP)—Wire Bond (EP3C10)”, “148-Pin Quad Flat No-Lead Package
(QFN)—Wire Bond”, “780-Pin FineLine Ball-Grid Array (FBGA),
Option 4—Flip Chip”, “1152-Pin FineLine Ball-Grid Array (FBGA),
Option 3—Flip Chip”, and “572-Pin FineLine Ball-Grid Array
(FBGA)—Option 2, Flip Chip”.
■Added package diagram for Stratix IV devices: “1152-Pin FineLine
Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX290)”,
“780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece
Lid (EP4SGX110)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Single-Piece Lid (EP4SGX110)”, “1152-Pin FineLine Ball-Grid
Array (FBGA)—Flip Chip—Channel Lid (EP4SGX180)”,“1152-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid
(EP4SGX180)”, “1932-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Single-Piece Lid (EP4SGX290)”, “780-Pin Hybrid FineLine
Ball-Grid Array (HBGA)—Flip Chip—Channel Lid (EP4SGX360)”,
“1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece
Lid (EP4SGX360)”, “1760-Pin FineLine Ball-Grid Array (FBGA) — Flip
Chip — Single-Piece Lid (EP4SGX360)”, “1517-Pin Hybrid FineLine
Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid (EP4SE530)”,
“1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—
Single-Piece Lid (EP4SE530)”, “780-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Channel Lid (EP4SE230)”, and “1152-Pin Hybrid
Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4SE530)”.
Table 60. Document Revision History (1) (Part 5 of 13)
Date and Document
Version Changes Made Summary of Changes
vi Package Information Datasheet for Mature Altera Devices
Additional Information
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
■Added package diagram for Stratix III devices: “780-Pin FineLine Ball-
Grid Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SL150)”, “780-
Pin Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece
Lid (EP3SL200)”,“1152-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Dual-Piece Lid (EP3SE110)”, “780-Pin FineLine Ball-Grid
Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE110)”, “780-Pin
Hybrid FineLine Ball-Grid Array (HBGA)—Flip Chip—Dual-Piece Lid
(EP3SE260)”, “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Channel Lid (EP3SE260)”, and “1152-Pin FineLine Ball-Grid
Array (FBGA)—Flip Chip—Dual-Piece Lid (EP3SE260)”.
■Added package diagram for Cyclone IV devices: “780-Pin FineLine
Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP4CE115)”.
■Added package diagram for Cyclone III devices :“780-Pin FineLine
Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C120)”, “144-Pin
Plastic Enhanced Quad Flat Pack (EQFP)—Wire Bond—
(EP3C16)”,“256-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire
Bond—Thin (EP3C10)”, “780-Pin FineLine Ball-Grid Array (FBGA)—
Wire Bond—OMPAC (EP3C55)”, “144-Pin Plastic Enhanced Quad
Flat Pack (EQFP)—Wire Bond—(EP3C25)”, “256-Pin FineLine Ball-
Grid Array (FBGA)—Wire Bond—Thin (EP3C10)”, “780-Pin FineLine
Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C80)”,“484-Pin
FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C120)”,
“256-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—Thin
(EP3C16)”, “256-Pin FineLine Ball-Grid Array (FBGA)—Wire Bond—
Thin (EP3C25)”, “324-Pin FineLine Ball-Grid Array (FBGA)—Wire
Bond (EP3C25)”, “324-Pin FineLine Ball-Grid Array (FBGA)—Wire
Bond (EP3C40)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Wire
Bond—OMPAC (EP3C16)”, “484-Pin FineLine Ball-Grid Array
(FBGA)—Wire Bond—OMPAC (EP3C40)”, “484-Pin FineLine Ball-
Grid Array (FBGA)—Wire Bond—OMPAC (EP3C55)”, “484-Pin
FineLine Ball-Grid Array (FBGA)—Wire Bond—OMPAC (EP3C80)”,
“484-Pin Ultra FineLine Ball-Grid Array (UBGA)—Wire Bond
(EP3CLS100)”, “256-Pin Ultra FineLine Ball-Grid Array (UBGA)—
Wire Bond—Thin (EP3C16)”, “484-Pin Ultra FineLine Ball-Grid Array
(UBGA)—Wire Bond (EP3C16)”, “256-Pin Ultra FineLine Ball-Grid
Array (UBGA)—Wire Bond—Thin (EP3C25)”, “484-Pin Ultra FineLine
Ball-Grid Array (UBGA)—Wire Bond (EP3C55)”, and “484-Pin Ultra
FineLine Ball-Grid Array (UBGA)—Wire Bond (EP3C80)”.
■Added package diagram for MAX II devices: “100-Pin FineLine Ball-
Grid Array (FBGA)—Wire Bond—Thin (EPM240)”, “100-Pin FineLine
Ball-Grid Array (FBGA)—Wire Bond—Thin (EPM570)”.
■Updated A3 dimension for “572-Pin FineLine Ball-Grid Array
(FBGA)—Lidless—Flip Chip (EP2AGX45)”, “572-Pin FineLine Ball-
Grid Array (FBGA)—Lidless—Flip Chip (EP2AGX65)”, “780-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (EP2AGX45)”,
and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(EP2AGX65)”.
Table 60. Document Revision History (1) (Part 6 of 13)
Date and Document
Version Changes Made Summary of Changes
Package Information Datasheet for Mature Altera Devices vii
Additional Information
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
■Added package diagram for HardCopy III devices: “484-Pin FineLine
Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC325)” and
“484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(HC325)”.
■Updated D1/E1 values in “1517-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Single-Piece Lid (EP4S40G2)”, “1517-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid
(EP4S100G2)”, “1517-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Single-Piece Lid (EP4SGX180)”, “1517-Pin FineLine Ball-Grid
Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SGX230)”, “484-Pin
FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless (HC4E25)”,
“780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(HC4E25)”, and “1020-Pin FineLine Ball-Grid Array (FBGA), Option
2—Flip Chip”.
■Updated Table 7.
■Updated Table 10 footnote.
■Updated thermal resistance values of EP3CLS70, EP3CLS100,
EP3CLS150, and EP3CLS200 devices F484 pin package in Table 42.
■Updated package diagram in “1152-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Single-Piece Lid (EP4SGX360)”
■Updated the notes in “256-Pin FineLine Ball-Grid Array (FBGA),
Option 1—Wire Bond” and “256-Pin FineLine Ball-Grid Array (FBGA),
Option 2—Thin—Wire Bond” to include Cyclone IV devices.
■Updated EP4SE230 device package to Channel Lid from Dual-Piece
Lid in Table 4.
■Updated package diagram in “1517-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Dual-Piece Lid (EP4SGX180)”.
■Updated EP1AGX50 and EP1AGX60 F484 pin package description
from dual-piece lid to channel lid in Table 3.
■Updated EP4SGX180 and EP4SGX230 device package description in
Table 4.
■Added note 1 to Table 6.
■Deleted HC315WF484 from Table 18.
■Added additional information to “148-Pin Quad Flat No-Lead Package
(QFN)—Wire Bond—(EP4CGX15)” and “148-Pin Quad Flat No-Lead
Package (QFN)—Wire Bond”
Table 60. Document Revision History (1) (Part 7 of 13)
Date and Document
Version Changes Made Summary of Changes
viii Package Information Datasheet for Mature Altera Devices
Additional Information
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
April 2010 ■Added Table 1 and Table 38
■Updated Table 2 through Table 37
■Updated values in Table 49, Table 50, Table 58
■Removed 148-pin Quad Flat No-Lead Package (QFN)—Wire Bond,
484-Pin FBGA, Flip Chip, Dual-Piece Lid (EP2S15), 484-Pin FBGA,
Flip Chip, Single-Piece Lid (EP2S15), 672-Pin FBGA, Flip Chip, Dual-
Piece Lid (EP2S15), 672-Pin FBGA, Flip Chip, Single-Piece Lid
(EP2S15) package outlines.
■Corrected title in 1152-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Single-Piece Lid (HC4E35)
■Added 148-Pin Quad Flat No-Lead Package (QFN)—Wire Bond—
(EP4CGX15)
■Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-
Piece Lid (EP4S40G2), 1517-Pin FineLine Ball-Grid Array (FBGA)—
Flip Chip—Single-Piece Lid (EP4S100G2), 1517-Pin Hybrid FineLine
Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid (EP4S40G5),
and 1932-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-
Piece Lid (EP4S100G4)
■Added 1152-Pin Hybrid Ball-Grid Array (HBGA)—Flip Chip—Single-
Piece Lid (EP4SE820), 1517-Pin Hybrid Ball-Grid Array (HBGA)—Flip
Chip—Single-Piece Lid (EP4SE820), and 1760-Pin FineLine Ball-Grid
Array (FBGA)—Flip Chip—Single-Piece Lid (EP4SE820)
■Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Single-
Piece Lid (EP4SGX180) and 1517-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Dual-Piece Lid (EP4SGX180)
■Added 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Dual-
Piece Lid (EP4SGX230)
■Added “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(HC4E25)”, “484-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—
Single-Piece Lid (HC4E25)”, and “780-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Lidless (HC4E25)”
■Added “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(HC4GX15)”, and “780-Pin FineLine Ball-Grid Array (FBGA)—Flip
Chip—Single-Piece Lid (HC4GX15)”
■Added “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—Lidless
(HC4GX25)”, “780-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—
Single-Piece Lid (HC4GX25)”, “1152-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Lidless (HC4GX25)”, and “1152-Pin FineLine
Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4GX25)”
Updated for version 16.1
Table 60. Document Revision History (1) (Part 8 of 13)
Date and Document
Version Changes Made Summary of Changes
Package Information Datasheet for Mature Altera Devices ix
Additional Information
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
■Added “1152-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—
Single-Piece Lid (HC4GX35)”, “1517-Pin FineLine Ball-Grid Array
(FBGA)—Flip Chip—Lidless (HC4GX35)”, and “1517-Pin FineLine
Ball-Grid Array (FBGA)—Flip Chip—Single-Piece Lid (HC4GX35)”
■Updated 1517-Pin FineLine Ball-Grid Array (FBGA)—Flip Chip—
Single-Piece Lid (EP4SGX230)
■Corrected title for 324-Pin FineLine Ball-Grid Array (FBGA)—Wire
Bond—Option 1 from 324-Pin FineLine Ball-Grid Array (FBGA)
■Corrected title for 1517-Pin Hybrid FineLine Ball-Grid Array (HBGA)
— Flip Chip — Single-Piece Lid (EP4SE820) from 1517-Pin Hybrid
FineLine Ball-Grid Array (HBGA)—Flip Chip—Single-Piece Lid
(EP4SGX820)
■Corrected weight in 324-Pin FBGA Data Sheet
■Added thermal resistance disclaimer at the beginning of the Thermal
Resistance section
■Moved EPC1, EPC2, EPC1441 entries from Table 27 to Table 37
December 2009 ■Added notes for preliminary thermal information (Table 36, Table 37,
Table 46, and Table 47)
Updated for version 16.0
Table 60. Document Revision History (1) (Part 9 of 13)
Date and Document
Version Changes Made Summary of Changes
xPackage Information Datasheet for Mature Altera Devices
Additional Information
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
November 2009 ■Added Cyclone IV information
■Added notes to 1152-Pin HBGA Option 3 Data Sheet
■Corrected drawings for 358-Pin UBGA—Lidless (EP2AGX45),
358-Pin UBGA—Lidless (EP2AGX65), and 1152-Pin FBGA—Lidless
(EP2AGX95) Data Sheets
■Added 148-Pin QFN, 169-Pin FBGA, and 324-Pin FBGA Option 2 Data
Sheets
■Added 1517-Pin—Lidless (HC4E35) and 1517-Pin Single-Piece Lid
(HC4E35) Data Sheets
■Added 780-pin FBGA—Channel Lid (EP4SGX230), 780-Pin HBGA—
Channel Lid (EP4SGX 360), 1152-Pin FBGA—Channel Lid
(EP4SGX230), 1152-Pin FBGA—Channel Lid (EP4SGX360),
1152-Pin FBGA—Dual-Piece Lid (EP4SGX230), 1152-Pin FBGA—
Single-Piece Lid (EP4SGX230), 1152-Pin FBGA—Single-Piece Lid
(EP4SGX360), 1152-Pin HBGA—Single-Piece Lid (EP4SGX530),
1152-Pin HBGA—Single-Piece Lid (EP4SGX820), 1517-Pin FBGA—
Dual-Piece Lid (EP4SGX230),
1517-Pin FBGA—Single-Piece Lid (EP4SGX230), 1517-Pin FBGA—
Single-Piece Lid (EP4SGX360), 1517-Pin HBGA—Dual-Piece Lid
(EP4SGX530), 1517-Pin HBGA—Single-Piece Lid (EP4SGX530),
1517-Pin HBGA—Single-Piece Lid (EP4S40G2 and EP4S100G2),
1517-Pin HBGA—Single-Piece Lid (EP4S100G5), 1517-Pin HBGA—
Single-Piece Lid (EP4SGX820), 1760-Pin FBGA—Dual-Piece Lid
(EP4SGX530), 1760-Pin FBGA—Single-Piece Lid (EP4SGX360),
1760-Pin FBGA—Single-Piece Lid (EP4SGX820), 1932-Pin FBGA—
Dual-Piece Lid (EP4SGX530), 1932-Pin FBGA—Single-Piece Lid
(EP4SGX530), 1932-Pin FBGA—Single-Piece Lid (EP4S100G2) Data
Sheets
■Added 484-Pin FBGA—Dual-Piece Lid (EP2S15), 484-Pin FBGA—
Single-Piece Lid (EP2S15), 672-Pin FBGA—Dual-Piece Lid (EP2S15),
672-Pin FBGA—Single-Piece Lid (EP2S15), 164-Pin MBGA
(EP3C16), and 484-Pin UBGA (EP3C40) Data Sheets
Updated for version 15.9
Table 60. Document Revision History (1) (Part 10 of 13)
Date and Document
Version Changes Made Summary of Changes
Package Information Datasheet for Mature Altera Devices xi
Additional Information
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
October 2009 ■Added 1152-Pin HBGA Option 3, 1152-Pin HBGA Option 4, 1517-Pin
HBGA Option 2, 1760-Pin FBGA Option 2, and 1932-Pin FBGA Option
2 Data Sheets
■Added 358-Pin UBGA—Lidless (EP2AGX45), 358-Pin UBGA—Lidless
(EP2AGX65), 572-Pin FBGA—Lidless (EP2AGX45), 572-Pin FBGA—
Lidless (EP2AGX65), 572-Pin FBGA—Lidless (EP2AGX95), 572-Pin
FBGA—Lidless (EP2AGX125), 780-Pin FBGA—Lidless (EP2AGX45),
780-Pin FBGA—Lidless (EP2AGX65), 780-Pin FBGA—Lidless
(EP2AGX95), 780-Pin FBGA—Lidless (EP2AGX125), 780-Pin
FBGA—Lidless (EP2AGX190), 780-Pin FBGA—Lidless
(EP2AGX260), 1152-Pin FBGA—Lidless (EP2AGX95), 1152-Pin
FBGA—Lidless (EP2AGX125), 1152-Pin FBGA—Lidless
(EP2AGX190), and 1152-Pin FBGA—Lidless (EP2AGX260) Data
Sheets
■Added 780-Pin FBGA—Lidless (HC325), 780-Pin FBGA—Single-
Piece Lid (HC325), 1152-Pin FBGA—Lidless (HC335), 1152-Pin
FBGA—Single-Piece Lid (HC335), 1152-Pin FBGA—Lidless
(HC4E35), 1152-Pin FBGA—Single-Piece Lid (HC4E35), 1517-Pin
FBGA—Lidless (HC335), and 1517-Pin FBGA—Single-Piece Lid
(HC335) Data Sheets
■Removed EP2AGX20 and EP2AGX30 entries from Table 2 and
Table 39
■Added EP4SE820 entries to Table 41
■Added Stratix IV GT devices to Table 4; added option references
■Updated thermal resistance values in Table 39
Updated for version 15.8
June 2009 ■Made three corrections to Stratix III thermal resistance table
■Added Cyclone III LS information
■Added Stratix IV GT thermal resistance values
■Added and/or HardCopy III and IV cross-reference and thermal
resistance tables
■Updated HardCopy III and IV part numbers
■Added Cyclone III M164 package information
■Added 484-Pin FBGA Option 4, 672-Pin FBGA Option 4, 1020-Pin
FBGA Option 2, 1508-Pin FBGA Option 2, and 1517-Pin Option 2
FBGA Data Sheets
■Revised 1508-Pin FBGA Option 1, 1020-Pin FBGA Option 1, 1517-Pin
FBGA Option 1, 572-Pin FBGA, and 1152-Pin FBGA Option 2 Data
Sheets
■Added 956-Pin BGA Option 2 Data Sheet
Updated for version 15.7
March 2009 ■Corrected “b Nom.” value in 358-Pin UBGA Data Sheet
■Corrected “A Max.” value and replaced package drawing in 780-Pin
FBGA - Option 3 Data Sheet
■Corrected “A Max.” value in 256-Pin UBGA Data Sheet
■Modified thermal resistance values for EP3SL200 device in Stratix III
thermal resistance table
Updated for version 15.6
Table 60. Document Revision History (1) (Part 11 of 13)
Date and Document
Version Changes Made Summary of Changes
xii Package Information Datasheet for Mature Altera Devices
Additional Information
Package Information Datasheet for Mature Altera Devices © December 2011 Altera Corporation
March 2009 ■Fixed theta symbols in several data sheet Dimension Tables
■Updated dimensions in 256-Pin UBGA Data Sheet
■Added 358-Pin UBGA Data Sheet, 572-Pin, 780-Pin Option 3, and
1152-Pin Option 2 FBGA Data Sheets
■Added Arria II GX thermal resistance table
■Added Arria II GX device and package cross-reference table
■Added EP3SL50, EP3SE80, and EP3SL110 devices to Stratix III
thermal resistance table
■Added EP4SGX70, EP4SGX180, and EP4SGX290 devices and
updated Stratix IV GX thermal resistance table
■Added HardCopy III and HardCopy IV thermal resistance table
■Miscellaneous formatting changes
Updated for version 15.5
December 2008 ■Changed dimension “A” Max. value in 1932-Pin FBGA Data Sheet Updated for version 15.4
November 2008 ■Moved Revision History to the end and added “How to Contact Altera”
section
■Added subheadings in Thermal Resistance section
■Converted to 8-1/2 x 11 page size
■Changed “Maximum Lead Coplanarity” to “Lead Coplanarity” and
added “(Typ.)” to weights for all packages
■Added EP2C15 information to Cyclone II tables
Updated for version 15.3
September 2008 ■Added thermal resistance values for Stratix IV
■Added new 1152-Pin HBGA Option 2 (42.5 MM SQ.) Data Sheet
■Added new 1517-Pin HBGA (42.5 MM SQ.) Data Sheet
■Added theta-JB thermal resistance values for Stratix II
■Added HardCopy II thermal resistance values
■Revised weights for 256-Pin BGA Option 2, 652-Pin BGA Option 2,
652-Pin BGA Option 3, 208-Pin RQFP, 240-Pin RQFP, and 304-Pin
RQFP Data Sheets
■Added notes to 1152-Pin FBGA, 1517-Pin FBGA, 1760-Pin FBGA;
changed dimension “A” thickness and “A2” thickness in 1932-Pin
FBGA Data Sheet
Updated for version 15.2
May 2008 ■Added 1932-Pin FBGA Data Sheet
■Added Device and Package Cross Reference table for Stratix IV
Updated for version 15.1
April 2008 ■Revised Maximum Lead Coplanarity values for 1517-Pin FBGA and
1760-Pin FBGA Data Sheets
■Added three entries to Table 3
■Corrected minor typos in Table 4 and Table 10
■Corrected HC210W package in Table 12
■Many tables updated for formatting consistency
Updated for version 15.0
Table 60. Document Revision History (1) (Part 12 of 13)
Date and Document
Version Changes Made Summary of Changes
Package Information Datasheet for Mature Altera Devices xiii
Additional Information
© December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices
February 2008 ■Added 164-Pin MBGA information in Table 8
■Added HardCopy II device information in Table 12
■Updated Stratix III thermal resistance values in Table 22
■Added 164-Pin MBGA Data Sheet
■Corrected 8-Pin SOIC Data Sheet (changed “B” to “b” in Package
Outline Dimension Table)
■Corrected 68-Pin MBGA Data Sheet (changed “Inches” to
“Millimeters” in Package Outline Dimension Table)
Updated for version 14.9
October 2007 ■Removed note from 100-Pin PQFP Option 1 Data Sheet
■Removed 100-Pin PQFP Option 2 Data Sheet
■Updated 88-Pin UBGA, 144-Pin EQFP, 256-Pin FBGA Option 1, 256-
Pin FBGA Option 2, 256-Pin UBGA, 1517-Pin FBGA, and 1760-Pin
FBGA Data Sheets
■Added 780-Pin HBGA and 1152-Pin HBGA Data Sheets
Updated for version 14.8
May 2007 v14.7 ■Added Arria™GX information
■Added Cyclone III tables
■Revised D2 and E2 dimensions for 144-Pin EQFP
■Revised 100-Pin MBGA - Wire Bond and 256-Pin MBGA - Wire Bond
■Added 780-Pin FBGA option 2 - Wire Bond,
256-Pin UBGA - Wire Bond, 68-Pin MBGA - Wire Bond, and 144-Pin
MBGA - Wire Bond
Changes and additions as
described in “Changes
Made” section
February 2007
v14.6
■Updated 144-Pin Plastic Thin Quad Flat Pack (TQFP) Data Sheet to
correct title and ordering code reference
■Added revision history
Revised one data sheet
(144-Pin Plastic Thin Quad
Flat Pack (TQFP) Data
Sheet), added revision
history
December 2006
v14.5
■Table 2 was added for Stratix III Device and Package Cross-Reference
■Tables 16, 17, and 18 were added for Stratix III Thermal Resistance
information
■1517-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was
added
■1760-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip data sheet was
added
■"Wire Bond" and "Flip Chip" was added to title of each data sheet, as
appropriate
■"BGA" was spelled out as "Ball-Grid Array" in all titles
■Some package outline drawings were reformatted
■Weights were updated for many packages
Added Tables for
Stratix III, updated other
data sheets
Note to Table 60:
(1) Formal revision history for this document began with version 14.5.
Table 60. Document Revision History (1) (Part 13 of 13)
Date and Document
Version Changes Made Summary of Changes
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the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks
and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera Corporation in the U.S.
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Altera customers are advised to obtain the latest version of device specifications before relying on any
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How to Contact Altera
For the most up-to-date information about Altera®products, see the following table.
Contact (Note 1)
Contact
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Note:
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