o> PRODUCT SPECIFICATION vT vT 1. SCOPE 2 _ ; a 1.1. This document specifies the performance requirements for the AMP* low profile edge connector. This connector is a multi-contact, edge board type assembly having wo contacts for solder applications. 1.2. When testing or inspecting the subject product, this document shall always be _ supported by the applicable Product Drawing and by 109-9000, Packaging Components o Division Connector Test Methods. In case of conflict the order of document preced- z ence is as follows: A. Product Drawing B. This Product Specification C. 109-9000, Packaging Components Division Connector Test Methods 2. APPLICABLE DOCUMENTS 2.1. Applicable portions of the following documents form a part of the manufacturing control of this product. A. MIL-G-45204: Gold Plating, Electrodeposited B. MIL-STD-105: Sampling Procedures and Inspection by Attributes 2.2. The following documents describe handling and use of this product. A. 109-9000: Packaging Components Division Connector Test Methods B. MIL-STD-202: Test Methods for Electronic and Electrical Component Parts 3. PERFORMANCE REQUIREMENTS - as 3.1. Ratings f ga =z - PF By A. Current: 5.0 amperes maximum per contact feos B. Temperature: -55 C to 105 C Og uo. 2 SEOs 3.2. Test Requirements and Procedures Summary ia oe <oE8 Test Description Requirements Procedure ~Kaz a Eee Examination of Product Meet requirements of drawing. Dimensional and visual. FEE wZO : : SEE Termination Resistance, .O10 ohm max. 50 my max open circuit, nego Low Level 100 ma max short circuit, rm Zz a<,8 . age Termination Resistance, .010 ohm max. 5 amp. zg Rated Current Eane Figure 1 (cont) cee * Trademark of AMP Incorporated <4 ot ma (EF rferl7b Ac Ph AMP Wcorroraren CHK f - ~ Harrisburg, Pa. i Marg tn, 7rai-7G APR von an, | Lae No _ REV ee 22? |B LAL 108-9044", NAME SHEET pIsT 1oF 3 CONNECTOR, EDGE, LOW PROFLLE i4 [orr}_nevision Recorp app | DATE ~~ AMP 1250-13 REV 10-73 = > " 108-9044 Test Description Requirements Procedure Insulation Resistance 5000 megohms min. 560 vdc. Dielectric Withstanding Voltage - Sea Level Centerline Test Voltage .125 1000 vrms ~156 1500 vrms 5 ma max leakage. Unmated connectors, test between adjacent contacts, and contacts to mounting hardware. Contact Engaging Force 16.9 902 Max per contact pair. Maximum thickness gage .070. Contact Separating Force 1.5 oz min per contact pair. Size 3 times with max thick- ness gage .070. Check with min thickness gage .054. Connector Mating Force 19.0 oz max average per contact pair. Maximum thickness gage .070. Durability No evidence of physical damage. Meets termination resistance, low level and rated current and contact separation force. Mate and unmate using max- imum thickness gage .070; 250 cycles for .000030 gold plate, 100 cycles for .000015 gold plate. Thermal Shack No evidence of physical damage. -55 to 105 C. Vibration No interruption of- contin- uity greater than 1 micro- second. No physical dan- age, 10 G's peak, 10-500 Hz; mated with printed circuit board. Physical Shock No interruption of contin- uity greater than 1 micro- second. No physical dam- age. 100 G's, 6 msec, sawtooth; mated with printed circuit board. Humidity, Steady State Meet insulation resistance and dielectric withstand- ing voltage. Unmated, 90-95% RH, 96 hr, 4g7 - 2 C. Contact Retention Contacts shall not dis- lodge from its normal lecking position. Axial load of 10 1b applied to contacts. Figure 1 (end) AMP INCORPORATED Harrisburg, Pa. SHEET 20F_2. Loc NO REV _ BIA! 108-9044, NAME CONNECTOR, EDGE, LOW PROFILE map eaten marae AMP 2763-2 REV 10-73 108-9044 3.5. Connector Tests and Sequence Test MIL-STD-202 Method 109-9000 Test Sequence (a} Requirement Paragraph 1 2 Examination of Product oe Connector Mating Force Termination Resistance, Low Level (b) Termination Resistance, Rated Current (b) 307 Insulation Resistance 302, Cond B Dielectric Withstanding Voltage 301 pe] | be | pe Contact Engaging Force Contact Separation Force Pal es] P< Tes Bes pos [es Thermal Shock (d) 107, Cond A Durability Contact Separation Force Termination Resistance, Low Level Termination Resistance, Rated Current Repke ENT Se Ga bo foc fre trl ing cay cof ener] enfcntenfen ol on] a Vibration (e} 204, Cond A 12. Xx Physical Shock (e) 213, Cond I 13. x Humidity, Steady State Insulation Resistance Dielectric Withstanding Voltage 103, Cond B Gy Uopin 14. x Termination Resistance, Low Level (b) un hy os. rs Terminating Resistance, Rated Current {B) Contact Retention (c} (a) Test Sequences 1 and 2 are connectors {b} See Figure 3. with contacts and hardware. {ce} Contact Retention, Solder Fyelet Contacts Onlv - The connector shall he mounted in an appropriate fixture and a straight axial pull as specified in Figure 1 The contact shall be capabie of with- standing the applied force for a minimum of five seconds without disiodging shall be applied to the contact post. from the connector. {d) Upper temperature limit 105C. (e) See Figure 4. Figure 2 3.4. Selection of Test Samples A. Test samples shall consist of 6 connectors of the greatest number of positions of each connector type offered, 3 each Test Sequence 1 and Test Sequence <. Two additional specimens shall be selected from the least number of positions offered and tested to Sequence 2. 3.5. Acceptance Quality Level MIL-STD-305, Inspection Level II, Normal Inspection, AQL 1.5%. AAA P AMP INCORPORATED ~ Harrisburg, Pa. SHEET or. Loc NO B|A| 108-9044|"0" CONNECTOR, EDGE, LOW PROFILE AMP 1251-13 REV 10-73 rs " 108-9044 f_N Power \AY Supply ) j Contacts _ 4.00 _N Connector Printed Circuit Test Board (See Figure 4) Figure 3 fermination Resistance Test Circuit AMP INCORPORATED AMP SHEET 4 OFS. 2s [Al 108-9044 REV 0 NAME CONNECTOR, EDGE, LOW PROFILE LMP 2763-2 REV 10-73 1l08-9L+44 NO Lue p t7005 A BSC Typ - o -,000 (See Note 3) Typ -| .003 Total 1. Dimensions are in inches. 2. Unless otherwise specified, tolerance is +.005. 3. The test card shall extend 4.00 + .02 from the receptacle after MIL-STD-275. 7. Conductor configuration optional beyond card slot depth. 8. Printed wiring shall be identical on both sides. I 062 4 NN L 1 _/ | 4 pew -| wme 062 ~A- - pa C+ .005 - (See Note 6) =| A | .004 Total Connector A ; Contact RSC B Spacing 125 .125 | .078 156 .156 | .094 Notes: insertion. 4. Number of contacts shall be the same as on the corresponding printed wiring connector. S. Printed circuit test board shall be 2 oz copper and gold over nickel plated per 6. This dimension shall be the minimum connector card slot length minus .008. Figure 4 Printed Circuit Board AMP INCORPORATED sneer | [AMP SOF fre REV 0 NAME A|\ 108-9044 CONNECTOR, EDGE, LOW PROFILE AMP 1251-13 REV 10~73 i