BTA208X-1000C,127 - NXP Semiconductors

1. Product profile

1.1 General description

Planar p assivated hig h commutation three qua drant tria c in a SOT18 6A "full pack" plastic

package. This triac is intended for use in motor control circu i ts where very high blo cking

voltage, hi gh static and dynamic dV/dt as well as high dIcom/dt can occur. This "series C"

triac will commutate the full rated RMS current at the maximum rated junction temperature

without the aid of a snubber.

1.2 Features and benefits

3Q technology for improved noise

immunity

High commutation capability with

maximum false trigger immunity

High immunity to false turn-on by dV/dt

Isolated mounting base package

Planar passivated for voltage

ruggedness and reliability

Triggering in three quadrants only

Very high voltage capability

1.3 Applications

Compressor starti ng controls

General purpose motor controls

Reversing induction motor control

circuits e.g. vertical axis washing

machines

1.4 Quick reference data

BTA208X-1000C

3Q Hi-Com Triac

Rev. 4 — 24 January 2011 Product data sheet

TO-220F

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDRM repetitive peak

off-state voltage --1000V

ITSM non-repetitive

peak on-state

current

full sine wave; Tj(init) =25°C;

tp= 20 ms; see Figure 4;

see Figure 5

--65A

IT(RMS) RMS on-state

current full sine wave; Th≤73 °C;

see Figure 3; see Figure 1;

see Figure 2

--8A

Product data sheet Rev. 4 — 24 January 2011 2 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

2. Pinning information

3. Ordering information

Static characteristics

IGT gate trigger

current VD=12V; I

T= 0.1 A; T2+ G+;

Tj=25°C; see Figure 7 2635mA

VD=12V; I

T= 0.1 A; T2+ G-;

Tj=25°C; see Figure 7 2 1335mA

VD=12V; I

T= 0.1 A; T2- G-;

Tj=25°C; see Figure 7 2 2335mA

Table 1. Quick reference data …continued

Symbol Parameter Conditions Min Typ Max Unit

Tabl e 2. Pinning information

Pin Symbol Description Simplified outline Graphi c sy mbol

1 T1 main terminal 1

SOT186A (TO-220F)

2 T2 main terminal 2

3 G gate

mb n.c. mounting base; isolated

321

sym051

Table 3. Ordering information

Type number Package

Name Description Version

BTA208 X-1000C TO-220F plastic single-ended package; isolated heatsink mounted;

1 mounting hole; 3-lead TO-220 "full pack" SOT186A

Product data sheet Rev. 4 — 24 January 2011 3 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

4. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maxi mum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage - 1000 V

IT(RMS) RMS on-state current full sine wave; Th≤73 °C; see Figure 3;

see Figure 1; see Figure 2 -8A

ITSM non-repetitive peak on-state

current full sine wave; Tj(init) =25°C;

tp= 20 ms; see Figure 4; see Figure 5 -65A

full sine wave; Tj(init) =25°C;

tp=16.7ms -71A

I2tI

2t for fusing tp= 10 ms; sine-wave pulse - 21 A2s

dIT/dt rate of rise of on-state current IT=12A; I

G= 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs

IGM peak gate current - 2 A

VGM peak gate voltage - 5 V

PGM peak gate power - 5 W

PG(AV) av erage gate power over any 20 ms period - 0.5 W

Tstg storage temperature -40 150 °C

Tjjunction temperature - 125 °C

Fig 1. RMS on-state current as a function of heatsink

temperature; maximum values Fig 2. RMS on-state current as a function of surge

duration; maximum values

Th (°C)

−50 150100050

003aaa969

IT(RMS)

73 °C

(A)

surge duration (s)

−2

10110

−1

003aaa970

T(RMS)

(A)

Product data sheet Rev. 4 — 24 January 2011 4 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

Fig 3. Total power dissipation as a function of RM S on-state current; maximum values

Fig 4. Non-repetitive peak on-state current as a function o f the number of sinusoidal current cycles; maximum

values

003aaa967

tot

T(RMS)

(A)

0 108462

(W)

107

116

125

h(max)

(°C)

α = 180°

120°

90°

60°

30°

conduction

angle

(degrees)

form

factor

120

180

2.8

2.2

1.9

1.57

003aaa968

ITSM

number of cycles

1 103

102

(A)

TSM

j(init)

= 25 °C max

Product data sheet Rev. 4 — 24 January 2011 5 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

5. Thermal characteristics

Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values

003aab121

tp (ms)

10−2102

1010−11

102

103

ITSM

(A)

(1)

TSM

j(init)

= 25 °C max

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-h) thermal resistance

from junction to

heatsink

full cycle or half cycle; with heatsink

compound; see Figure 6 --4.5K/W

full cycle or half cycle; without heatsink

compound; see Figure 6 --6.5K/W

Rth(j-a) thermal resistance

from junction to

ambient

in free air - 55 - K/W

Product data sheet Rev. 4 — 24 January 2011 6 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

6. Isolation characteristics

(1) Unidirectional (half cycle) without heatsink compound

(2) Unidirectional (half cycle) with heatsink compound

(3) Bidirectional (full cycle) without heatsink compound

(4) Bidirectional (full cycle) with heatsink compound

Fig 6. Transient thermal impedance from junction to heatsink as a function of pulse duration

003aaf915

10−1

10−2

Zth(j-h)

(K/W)

10−3

tp (s)

10−511010−1

10−2

10−410−3

(1)

(2)

(3)

(4)

Table 6. Isolation characteristics

Symbol Parameter Conditions Min Typ Max Unit

Visol(RMS) RMS isolation voltage from all terminals to external heatsink;

sinusoidal waveform; clean and dust

free ; 50 Hz ≤f≤60 Hz; RH ≤65 %;

Th=25°C

- - 2500 V

Cisol isolation capacitance from main terminal 2 to external

heatsink ; f = 1 MHz; Th=25°C -10-pF

Product data sheet Rev. 4 — 24 January 2011 7 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

7. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

IGT gate trigger current VD=12V; I

T= 0.1 A; T2+ G+;

Tj=25°C; see Figure 7 2635mA

VD=12V; I

T= 0.1 A; T2+ G-;

Tj=25°C; see Figure 7 2 1335mA

VD=12V; I

T= 0.1 A; T2- G-;

Tj=25°C; see Figure 7 2 2335mA

ILlatching current VD=12V; I

G= 0.1 A; T2+ G+;

Tj=25°C; see Figure 8 - 2550mA

VD=12V; I

G= 0.1 A; T2+ G-;

Tj=25°C; see Figure 8 - 4875mA

VD=12V; I

G= 0.1 A; T2- G-;

Tj=25°C; see Figure 8 - 3050mA

IHholding current VD=12V; T

j=25°C; see Figure 9 - 2050mA

VTon-stat e vo ltage IT=10A; T

j= 25 °C; see Figure 10 - 1.3 1.65 V

VGT gate trigger voltage VD=12V; I

T= 0.1 A; Tj=25°C;

see Figure 11 -0.71.5V

VD=400V; I

T= 0.1 A; Tj= 125 °C 0.25 0.4 - V

IDoff-state current VD= 1000 V; Tj=125°C - 0.1 0.5 mA

Dynamic characteristics

dVD/dt rate of rise of off-state

voltage VDM =670V; T

j= 125 °C; exponential

waveform; gate open circuit 1000 4000 - V/µs

dIcom/dt rate of change of

commutating current VD=400V; T

j= 125 °C; IT(RMS) =8A;

dVcom/dt = 20 V/µs; gate open circuit;

snubberless condition; see Figure 12

12 32 - A/ms

Product data sheet Rev. 4 — 24 January 2011 8 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

(1) T2- G-

(2) T2+ G-

(3) T2+ G+

Fig 7. Normalized gate trigger current as a fu nction of

junction temperature Fig 8. Normalized latching current as a function of

junction temperature

Vo = 1.264 V; Rs = 0.0378 Ω

(1) Tj = 125 °C; typical values

(2) Tj = 125 °C; maximum values

(3) Tj = 25 °C; maximum values

Fig 9. Normalized holding current as a function of

junction temperature Fig 10. On-state current as a function of on-state

voltage

Tj (°C)

−50 150100050

003aac888

(1)

(2)

(3)

IGT

IGT(25°C)

Tj (°C)

−50 150100050

001aab100

IL(25°C)

Tj (°C)

−50 150100050

001aab099

IH(25°C)

003aaa971

VT (V)

0321

(A)

(1) (2) (3)

Product data sheet Rev. 4 — 24 January 2011 9 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

Fig 11. Normalized gate trigger voltage as a function of

junction temperature Fig 12. Rate of change of commutating cu rrent as a

function of junction temperature; typical and

minimum values

Tj (°C)

−50 150100050

001aab101

0.8

1.2

1.6

0.4

VGT

VGT(25°C)

003aaa973

Tj (°C)

20 14010060

102

103

dIcom/dt

(A/ms)

typ

min

Product data sheet Rev. 4 — 24 January 2011 10 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

8. Package outline

Fig 13. Package outline SOT186A (TO-220F)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT186A 3-lead TO-220F

0 5 10 mm

scale

Plastic single-ended package; isolated heatsink mounted;

1 mounting hole; 3-lead TO-220 'full pack' SOT186

Notes

1. Terminal dimensions within this zone are uncontrolled.

2. Both recesses are ∅ 2.5 × 0.8 max. depth

L2L1

bwM

123

UNIT D

b1D1eqQPL

cL2(1)

max.

5.08 3

mm 4.6

4.0

2.9

2.5

0.9

0.7

1.1

0.9

1.4

1.0

0.7

0.4

15.8

15.2

6.5

6.3

10.3

9.7 2.54 14.4

13.5

T(2)

2.5 0.4

3.30

2.79

2.7

1.7

0.6

0.4

2.6

2.3

3.0

2.6

3.2

3.0

DIMENSIONS (mm are the original dimensions)

02-04-09

06-02-14

mounting

base

Product data sheet Rev. 4 — 24 January 2011 11 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

9. Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BTA208X-1000C v.4 20110124 Product data sheet - BTA208X-1000C v.3

Modifications: •Various changes to content.

BTA208X-1000C v.3 20101108 Product data sheet - BTA208X-1000C v.2

Product data sheet Rev. 4 — 24 January 2011 12 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The p r oduct status of device(s) desc r ibed in this doc ument may have ch anged since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

10.3 Disclaimers

Limited warranty and liability — Information in this d ocument is be lieved to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semi conductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and with out

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe prop erty or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any def ault,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’ s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objecti ve specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary sp ecification.

Product [short] data sheet Production This document contains the product speci ficat ion.

Product data sheet Rev. 4 — 24 January 2011 13 of 14

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by cu stomer.

No offer to sell or license — Nothing in this document ma y be interpret ed or

construed as an of fer to se ll product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) d escribed herein may

be subject to export control regulat i ons. Export might require a prior

authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

10.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BTA208X-1000C

3Q Hi-Com Triac

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 24 January 2011

Document i dentifier: BTA208X-1000C

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5

6 Isolation characteristics . . . . . . . . . . . . . . . . . . .6

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .7

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13

11 Contact information. . . . . . . . . . . . . . . . . . . . . .13