100324 Low Power Hex TTL-to-ECL Translator General Description The 100324 is a hex translator, designed to convert TTL logic levels to 100K ECL logic levels. The inputs are compatible with standard or Schottky TTL. A common Enable (E), when LOW, holds all inverting outputs HIGH and holds all true outputs LOW. The differential outputs allow each circuit to be used as an inverting/non-inverting translator, or as a differential line driver. The output levels are voltage compensated over the full b4.2V to b5.7V range. When the circuit is used in the differential mode, the 100324, due to its high common mode rejection, overcomes voltage gradients between the TTL and ECL ground systems. The VEE and VTTL power may be applied in either order. The 100324 is pin and function compatible with the 100124 with similar AC performance, but features power dissi- pation roughly half of the 100124 to ease system cooling requirements. Features Y Y Y Y Y Y Y Y Pin/function compatible with 100124 Meets 100124 AC specifications 50% power reduction of the 100124 Differential outputs 2000V ESD protection b 4.2V to b 5.7V operating range Available to MIL-STD-883 Available to industrial grade temperature range Logic Diagram Pin Names D0 -D5 E Q0 -Q5 Q0 -Q5 Description Data Inputs Enable Input Data Outputs Complementary Data Outputs TL/F/9878- 4 Connection Diagrams 24-Pin DIP/SOIC 28-Pin PCC 24-Pin Quad Cerpak TL/F/9878 - 2 TL/F/9878-1 C1995 National Semiconductor Corporation TL/F/9878 TL/F/9878 - 3 RRD-B30M115/Printed in U. S. A. 100324 Low Power Hex TTL-to-ECL Translator July 1992 Absolute Maximum Ratings Recommended Operating Conditions Above which the useful life may be impaired. (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. b 65 C to a 150 C Storage Temperature (TSTG) Maximum Junction Temperature (TJ) Ceramic Plastic VEE Pin Potential to Ground Pin VTTL Pin Potential to Ground Pin Input Voltage (DC) Output Current (DC Output HIGH) ESD (Note 2) Case Temperature (TC) Commercial Industrial Military 0 C to a 85 C b 40 C to a 85 C b 55 C to a 125 C Supply Voltage (VEE) a 175 C a 150 C b 5.7V to b 4.2V b 7.0V to a 0.5V b 0.5V to a 6.0V b 0.5V to a 6.0V b 50 mA t 2000V Note 1: Absolute maximum ratings are those values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: ESD testing conforms to MIL-STD-883, Method 3015. Commercial Version DC Electrical Characteristics VEE e b4.2V to b5.7V, VCC e VCCA e GND, TC e 0 C to a 85 C (Note 3), VTTL e a 4.5V to a 5.5V Symbol Parameter Min Typ Max b 955 b 870 b 1705 b 1620 VOH Output HIGH Voltage b 1025 VOL Output LOW Voltage b 1830 VOHC Output HIGH Voltage b 1035 VOLC Output LOW Voltage VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage IIH Input HIGH Current Data Enable mV mV b 1610 Conditions VIN e VIH (Max) or VIL (Min) Loading with 50X to b2.0V VIN e VIH(Min) or VIL (Max) Loading with 50X to b2.0V 2.0 5.0 V Guaranteed HIGH Signal for All Inputs 0 0.8 V Guaranteed LOW Signal for All Inputs V IIN e b18 mA b 1.2 Input HIGH Current Breakdown Test, All Inputs IIL Units Input LOW Current Data Enable b 0.9 b 5.4 IEE VEE Power Supply Current b 70 ITTL VTTL Power Supply Current 20 120 mA 1.0 mA VIN e a 2.4V, All Other Inputs VIN e GND VIN e a 5.5V, All Other Inputs e GND mA VIN e a 0.4V, All Other Inputs VIN e VIH b 45 b 22 mA All Inputs VIN e a 4.0V 25 38 mA All Inputs VIN e GND Note 3: The specified limits represent the ``worst case'' value for the parameter. Since these values normally occur at the temperature extremes, additional noise immunity and guardbanding can be achieved by decreasing the allowable system operating ranges. Conditions for testing shown in the tables are chosen to guarantee operation under ``worst case'' conditions. 2 Commercial Version (Continued) DIP AC Electric Characteristics VEE e b4.2V to b5.7V, VCC e VCCA e GND, VTTL e a 4.5V to a 5.5V Symbol Parameter TC e a 25 C TC e a 85 C Min TC e 0 C Max Min Max Min Max Units tPLH tPHL Propagation Delay Data and Enable to Output 0.50 3.00 0.50 2.90 0.50 3.00 ns tTLH tTHL Transition Time 20% to 80%, 80% to 20% 0.45 1.80 0.45 1.80 0.45 1.80 ns Conditions Figures 1 and 2 SOIC, PCC and Cerpak AC Electrical Characteristics VEE e b4.2V to b5.7V, VCC e VCCA e GND, VTTL e a 4.5V to a 5.5V Symbol Parameter TC e a 25 C TC e a 85 C Min TC e 0 C Max Min Max Min Max Units Conditions tPLH tPHL Propagation Delay Data and Enable to Output 0.50 2.80 0.50 2.70 0.50 2.80 ns tTLH tTHL Transition Time 20% to 80%, 80% to 20% 0.45 1.70 0.45 1.70 0.45 1.70 ns tOSHL Maximum Skew Common Edge Output-to-Output Variation Data to Output Path 0.95 0.95 0.95 ns PCC Only (Note 1) Maximum Skew Common Edge Output-to-Output Variation Data to Output Path 0.70 0.70 0.70 ns PCC Only (Note 1) Maximum Skew Opposite Edge Output-to-Output Variation Data to Output Path 1.60 1.60 1.60 ns PCC Only (Note 1) Maximum Skew Pin (Signal) Transition Variation Data to Output Path 1.20 1.20 1.20 ns PCC Only (Note 1) tOSLH tOST tPS Figures 1 and 2 Note 1: Output-to-Output Skew is defined as the absolute value of the difference between the actual propagation delay for any outputs within the same packaged device. The specifications apply to any outputs switching in the same direction either HIGH to LOW (tOSHL), or LOW to HIGH (tOSLH), or in opposite directions both HL and LH (tOST). Parameters tOST and tPS guaranteed by design. 3 Industrial Version PCC DC Electrical Characteristics (Note) VEE e b4.2V to b5.7V, VCC e VCCA e GND, TC e b40 C to a 85 C, VTTL e a 4.5V to a 5.5V Symbol Parameter TC e b40 C TC e 0 C to a 85 C Min Max Min Max VOH Output HIGH Voltage b 1085 b 870 b 1025 b 870 VOL Output LOW Voltage b 1830 b 1575 b 1830 b 1620 VOHC Output HIGH Voltage b 1095 VOLC Output LOW Voltage VIH Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage IIH Input HIGH Current Data Enable b 1035 b 1565 Conditions mV VIN e VIH (Max) or VIL (Min) Loading with 50X to b2.0V mV VIN e VIH(Min) or VIL (Max) Loading with 50X to b2.0V b 1610 2.0 5.0 2.0 5.0 V Guaranteed HIGH Signal for All Inputs 0 0.8 0 0.8 V Guaranteed LOW Signal for All Inputs V IIN e b18 mA b 1.2 Input HIGH Current Breakdown Test, All Inputs IIL Units Input LOW Current Data Enable b 0.9 b 5.4 IEE VEE Power Supply Current b 70 ITTL VTTL Power Supply Current b 1.2 20 120 20 120 mA 1.0 1.0 mA b 70 VIN e a 5.5V, All Other Inputs e GND mA VIN e a 0.4V, All Other Inputs VIN e VIH b 22 mA All Inputs VIN e a 4.0V 38 mA All Inputs VIN e GND b 0.9 b 5.4 b 22 VIN e a 2.4V, All Other Inputs VIN e GND 38 Note: The specified limits represent the ``worst case'' value for the parameter. Since these values normally occur at the temperature extremes, additional noise immunity and guardbanding can be achieved by decreasing the allowable system operating ranges. Conditions for testing shown in the tables are chosen to guarantee operation under ``worst case'' conditions. PCC AC Electrical Characteristics VEE e b4.2V to b5.7V, VCC e VCCA e GND, VTTL e a 4.5V to a 5.5V Symbol Parameter TC e b40 C TC e a 25 C TC e a 85 C Min Max Min Max Min Max Units Conditions tPLH tPHL Propagation Delay Data and Enable to Output 0.50 2.80 0.50 2.70 0.50 2.80 ns Figures 1 and 2 tTLH tTHL Transition Times 20% to 80%, 80% to 20% 0.35 1.80 0.45 1.70 0.45 1.70 ns Figures 1 and 2 4 Military Version DC Electrical Characteristics VEE e b4.2V to b5.7V, VCC e VCCA e GND, TC e b55 C to a 125 C, VTTL e a 4.5V to a 5.5V Symbol VOH Parameter Min Max Units TC Output HIGH Voltage b 1025 b 870 mV 0 C to a 125 C b 1085 b 870 mV b 55 C b 1830 b 1620 mV 0 C to a 125 C b 1830 b 1555 VOL Output LOW Voltage VOHC Output HIGH Voltage VOLC Output LOW Voltage VIH Input HIGH Voltage VIL Input LOW Voltage IIH Input HIGH Current Breakdown Test IIL Input LOW Current Data Enable VFCD Input Clamp Diode Voltage IEE VEE Power Supply Current ITTL VTTL Power Supply Current Conditions Notes VIN e VIH (Max) or VIL (Min) Loading with 50X to b2.0V 1, 2, 3 VIN e VIH (Max) or VIL (Min) Loading with 50X to b2.0V 1, 2, 3 mV b 55 C b 1035 mV 0 C to a 125 C b 1085 mV b 55 C b 1610 mV 0 C to a 125 C b 1555 mV b 55 C 5.0 V b 55 C to a 125 C Over VTTL, VEE, TC Range 1, 2, 3, 4 0.8 V b 55 C to a 125 C Over VTTL, VEE, TC Range 1, 2, 3, 4 20 mA b 55 C to a 125 C VIN e a 2.7V 100 mA b 55 C to a 125 C VIN e a 7.0V mA b 55 C to a 125 C VIN e a 0.4V 1, 2, 3 b 1.2 V b 55 C to a 125 C IIN e b18 mA 1, 2, 3 b 22 mA b 55 C to a 125 C All Inputs VIN e a 4.0V 1, 2, 3 38 mA b 55 C to a 125 C All Inputs VIN e GND 1, 2, 3 2.0 0.0 b 0.9 b 5.4 b 70 1, 2, 3 Note 1: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals b 55 C), then testing immediately without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides ``cold start'' specs which can be considered a worst case condition at cold temperatures. Note 2: Screen tested 100% on each device at b 55 C, a 25 C, and a 125 C, Subgroups 1, 2, 3, 7, and 8. Note 3: Sample tested (Method 5005, Table I) on each manufactured lot at b 55 C, a 25 C, and a 125 C, Subgroups A1, 2, 3, 7, and 8. Note 4: Guaranteed by applying specified input condition and testing VOH/VOL. AC Electrical Characteristics VEE e b4.2V to b5.7V, VCC e VCCA e GND, VTTL e a 4.5V to a 5.5V Symbol Parameter TC e b55 C TC e a 25 C Min Max Min Max Min Max 3.00 0.50 2.90 0.30 3.30 tPLH tPHL Propagation Delay Data and Enable to Output 0.50 tTLH tTHL Transition Time 20% to 80%, 80% to 20% 0.35 TC e a 125 C Units Conditions ns Notes 1, 2, 3, Figures 1 and 2 1.80 0.45 1.80 0.45 1.80 ns 4 Note 1: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals b 55 C), then testing immediately after power-up. This provides ``cold start'' specs which can be considered a worst case condition at cold temperatures. Note 2: Screen tested 100% on each device at a 25 C temperature only, Subgroup A9. Note 3: Sample tested (Method 5005, Table I) on each manufactured lot at a 25 C, Subgroup A9, and at a 125 C and b 55 C temperatures, Subgroups A10 and A11. Note 4: Not tested at a 25 C, a 125 C, and b 55 C temperature (design characterization data). 5 Switching Waveform TL/F/9878 - 6 FIGURE 1. Propagation Delay and Transition Times Test Circuit TL/F/9878 - 5 FIGURE 2. AC Test Circuit Notes: VCC, VCCA e 0V, VEE e b 4.5V, VTTL e a 5.0V, VIH e a 3.0V L1, L2 and L3 e equal length 50X impedance lines RT e 50X terminator internal to scope Decoupling 0.1 mF from GND to VCC, VEE and VTTL All unused outputs are loaded with 50X to b 2V or with equivalent ECL terminator network CL e Fixture and stray capacitance s 3 pF 6 Ordering Information The device number is used to form part of a simplified purchasing code where a package type and temperature range are defined as follows: 100324 D C QB Device Type (Basic) Special Variation QB e Military grade device with environmental and burn-in processing shipped in tubes Package Code D e Ceramic DIP F e Quad Cerpak P e Plastic DIP Q e Plastic Leaded Chip Carrier (PCC) S e Small Outline (SOIC) Temperature Range C e Commercial (0 C to a 85 C) I e Industry (b40 C to a 85 C) (PCC Only) M e Military (b55 C to a 125 C) 7 Physical Dimensions inches (millimeters) 24-Lead Ceramic Dual-In-Line Package (0.400x Wide) (D) NS Package Number J24E 24-Lead Molded Package (0.300x Wide) (S) NS Package Number M24B 8 Physical Dimensions inches (millimeters) (Continued) 24-Lead Plastic Dual-In-Line Package (P) NS Package Number N24E 28-Lead Plastic Chip Carrier (Q) NS Package Number V28A 9 100324 Low Power Hex TTL-to-ECL Translator Physical Dimensions inches (millimeters) (Continued) Lit. Y 103900 24 Lead Quad Cerpak (F) NS Package Number W24B LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 1111 West Bardin Road Arlington, TX 76017 Tel: 1(800) 272-9959 Fax: 1(800) 737-7018 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 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