REGULATORY COMPLIANCE (Data Sheet downloaded on Jul 17, 2018)
2011/65 +
2015/863 163 SVHC
ECX-5976-19.440M
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers,
certain parameters are intentionally excluded from this specification sheet.
ELECTRICAL SPECIFICATIONS
Nominal Frequency 19.440MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Lead Integrity MIL-STD-883, Method 2004
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 02/16/2005 | Page 1 of 4
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
ECX-5976-19.440M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
12.70
MIN
13.58
MAX
4.88 ±0.20
DIA 0.457
±0.051(X2)
4.70
MAX
11.18
MAX
LINE MARKING
1ECX-5976
219.440M
3XXYZZ
XX=Ecliptek Manufacturing
Designator
Y=Last Digit Of Year
ZZ=Week of Year
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 02/16/2005 | Page 2 of 4
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
ECX-5976-19.440M
Recommended Solder Reflow Methods
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/Second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 Seconds
Ramp-down Rate 6°C/Second Maximum
Time 25°C to Peak Temperature (t) 8 Minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 02/16/2005 | Page 3 of 4
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
ECX-5976-19.440M
Recommended Solder Reflow Methods
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/Second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 1 Time / 235°C Maximum 2 Times
Time within 5°C of actual peak (tp)5 Seconds Maximum 1 Time / 15 Seconds Maximum 2 Times
Ramp-down Rate 5°C/Second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision A 02/16/2005 | Page 4 of 4
Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200
