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1
One world. One KEMET
Benets
• AEC–Q200automotivequalied
• Up to 10x increase in capacitance versus C0G
• Extremely low effective series resistance (ESR)
• Extremely low effective series inductance (ESL)
• High ripple current capability
• Low noise solution similar to C0G
• Retains over 99% of nominal capacitance at full rated voltage
• Small predictable and linear capacitance change with respect
to temperature
• Operatingtemperaturerangeof−55°Cto+125°C
• Capacitance up to 470 nF
• DC voltage ratings up to 50 V
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC
(Commercial & Automotive Grade)
Overview
KEMET U2J dielectric features a maximum operating
temperatureof125°Candisconsideredstable.The
Electronics Industries Alliance (EIA) characterizes U2J
dielectric as a Class I material. Components of this
classicationaretemperaturecompensatingandare
suited for resonant circuit applications or those where Q
and stability of capacitance characteristics are required.
U2J is an extremely stable dielectric material that exhibits
a negligible shift in capacitance with respect to voltage
and boasts a predictable and linear change in capacitance
with reference to ambient temperature with no aging
effect. In addition, U2J dielectric extends the available
capacitance range of Class I MLCCs to achieve values
previously only available using Class II dielectric materials
like X7R, X5R, Y5V and Z5U.
U2J is not sensitive to DC Bias as compared to Class
II dielectric materials and retains over 99% of nominal
capacitance at full rated voltage. KEMET automotive grade
capacitors meet the demanding Automotive Electronics
Council'sAEC–Q200qualicationrequirements.
Capacitancechangeislimitedto−750±120ppm/°Cfrom
−55°Cto+125°C.Thesedevicesarelead(Pb)-free,RoHS
and REACH compliant without exception and are capable
ofwithstandingmultiplepassesthroughalead(Pb)-free
solderreowprole.
Applications
• Wireless charging
• Resonant LLC converters
• Powerconversion
• Pulsecircuits
• High ripple current
• Critical timing
• Decoupling
• Transient voltage suppression
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2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Ordering Information
C1206 C104 J 3 J A C TU
Ceramic
Case Size
(L" x W")
Specication/
Series1
Capacitance
Code (pF)
Capacitance
Tolerance2
Rated Voltage
(VDC) Dielectric Failure Rate/
Design Termination Finish3Packaging/
Grade (C-Spec)
0402
0603
0805
1206
1210
1812
C =
Standard
Twosignicant
digits and
number of
zeros.
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
8 = 10
4 = 16
3 = 25
5 = 50
J = U2J A = N/A C = 100% Matte Sn See
"Packaging
C-Spec
Ordering
Options Table"
1 Flexible termination option is available. Please see FT-CAP product bulletin C1087_U2J_FT-CAP_SMD.
2 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade
1
Bulk Bag/Unmarked
Not required (blank)
7" Reel/Unmarked
TU
13" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch
2
7081
13" Reel/Unmarked/2 mm pitch
2
7082
Automotive Grade
3
7" Reel
AUTO
13" Reel/Unmarked
AUTO7411 (EIA 0603 and smaller case sizes)
AUTO7210 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2 mm pitch
2
3190
13" Reel/Unmarked/2 mm pitch
2
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3 Reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimensions. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3 All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices.
For more information see "Capacitor Marking."
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 10/9/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Qualication/Certication
Commercialgradeproductsaresubjecttointernalqualication.Detailsregardingtestmethodsandconditionsare
referencedinTable4,Performance&Reliability.
Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regardingtestmethodsandconditionsarereferencedinthedocumentAEC–Q200,StressTestQualicationforPassive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead(Pb)-free,RoHS,andREACHcompliantwithoutexemptions.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 10/9/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
DetailsregardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualicationforPassive
Components.TheseproductsaresupportedbyaProductChangeNotication(PCN)andProductionPartApprovalProcess
warrant(PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
componentwithouttherequirementtosubmitacustomerSourceControlledDrawing(SCD)orspecicationforreviewbya
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
notgrantedthesame“privileges”asotherautomotiveC-Specs.CustomerPCNapprovalandPPAPrequestlevelsarelimited
(see details below.)
Product Change Noti cation (PCN)
TheKEMETproductchangenoticationsystemisusedtocommunicateprimarilythefollowingtypesofchanges:
•Product/processchangesthataffectproductform,t,function,and/orreliability
• Changes in manufacturing site
•Productobsolescence
KEMET Automotive
C-Spec
Customer Noti cation Due To: Days Prior To
Implementation
Process/Productchange Obsolescence*
KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
ThepurposeoftheProductionPartApprovalProcessis:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
•Toprovidetheevidencethatallcustomerengineeringdesignrecordsandspecicationrequirementsareproperly
understoodandfullledbythemanufacturingorganization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
●PartnumberspecicPPAPavailable
○ProductfamilyPPAPonly
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5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA
Size
Code
Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0402 1005 1.00(0.040)±0.05(0.002) 0.50(0.020)±0.05(0.002)
See Table 2
for thickness
0.30(0.012)±0.10(0.004) 0.30 (0.012)
Solderreow
only
0603 1608 1.60(0.063)±0.15(0.006) 0.80(0.032)±0.15(0.006) 0.35(0.014)±0.15(0.006) 0.70 (0.028)
Solder wave
or
Solderreow
0805 2012 2.00(0.079)±0.20(0.008) 1.25(0.049)±0.20(0.008) 0.50(0.02)±0.25(0.010) 0.75 (0.030)
1206 3216 3.20(0.126)±0.20(0.008) 1.60(0.063)±0.20(0.008) 0.50(0.02)±0.25(0.010) N/A
1210 3225 3.20(0.126)±0.20(0.008) 2.50(0.098)±0.20(0.008) 0.50(0.02)±0.25(0.010) Solderreow
only
1812 4532 4.50(0.177)±0.30(0.012) 3.20(0.126)±0.30(0.012) 0.60(0.024)±0.35(0.014)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°Cto+125°C
CapacitanceChangewithReferenceto+25°Cand0VDCApplied
(TCC) −750±120ppm/°C
Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0.1%
Dielectric Withstanding Voltage (DWV)
250% of rated voltage
(5±1secondsandcharge/dischargenotexceeding50mA)
DissipationFactor(DF)MaximumLimitat25°C 0.1%
InsulationResistance(IR)Limitat25°C 1,000MΩµFor100GΩ
(Ratedvoltageappliedfor120±5secondsat25°C)
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Electrical Characteristics (Typical)
−15
−10
−5
0
5
10
15
−60 −40 −20 0 20 40 60 80 100 120 140
Capacitance Change (%)
Temperature (°C)
Capacitance vs. Temperature (TCC)
0
−0.5
−0.4
−0.3
−0.2
−0.1
0.0
5 10 15 20 25
DC Bias (V)
Capacitance Change (%)
0
−0.10
−0.06
−0.08
−0.04
−0.02
0.00
5 10 15 20 25
AC Bias (V
RMS
)
Capacitance Change (%)
DC&ACBiasEffectiveCapacitance
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
U2J All All 0.5
0.3%or±0.25pF
10% of Initial
limit
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7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)
XX1 - Commercial Grade Only
Capacitance Cap
Code
Case Size/
Series C0402C C0603C C0805C C1206C C1210C C1812C
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
100 pF 101 F G J K M BB BB BB BB
110 pF 111 F G J K M BB BB BB BB
120 pF 121 F G J K M BB BB BB BB
130 pF 131 F G J K M BB BB BB BB
150 pF 151 F G J K M BB BB BB BB
160 pF 161 F G J K M BB BB BB BB
180 pF 181 F G J K M BB BB BB BB
200 pF 201 F G J K M BB BB BB BB
220 pF 221 F G J K M BB BB BB BB
240 pF 241 F G J K M BB BB BB BB
270 pF 271 F G J K M BB BB BB BB
300 pF 301 F G J K M BB BB BB BB
330 pF 331 F G J K M BB BB BB BB
360 pF 361 F G J K M BB BB BB BB
390 pF 391 F G J K M BB BB BB BB
430 pF 431 F G J K M BB BB BB BB
470 pF 471 F G J K M BB BB BB BB
510 pF 511 F G J K M BB BB BB BB
560 pF 561 F G J K M BB BB BB BB
620 pF 621 F G J K M BB BB BB BB
680 pF 681 F G J K M BB BB BB BB
750 pF 751 F G J K M BB BB BB BB
820 pF 821 F G J K M BB BB BB BB
910 pF 911 F G J K M BB BB BB BB
1,000 pF 102 F G J K M BB BB BB BB CF CF CF CF
1,100 pF 112 F G J K M BB BB BB BB CF CF CF CF
1,200 pF 122 F G J K M BB BB BB BB CF CF CF CF
1,300 pF 132 F G J K M BB BB BB BB CF CF CF CF
1,500 pF 152 F G J K M BB BB BB BB CF CF CF CF
1,600 pF 162 F G J K M BB BB BB BB CF CF CF CF
1,800 pF 182 F G J K M BB BB BB BB CF CF CF CF
2,000 pF 202 F G J K M BB BB BB CF CF CF CF
2,200 pF 222 F G J K M BB BB BB CF CF CF CF
2,400 pF 242 FG J K M CF CF CF CF
2,700 pF 272 F G J K M CF CF CF CF
3,000 pF 302 F G J K M CF CF CF CF
3,300 pF 332 F G J K M CF CF CF CF
3,600 pF 362 F G J K M CF CF CF CF
3,900 pF 392 F G J K M CF CF CF CF
4,300 pF 432 F G J K M CF CF CF CF
4,700 pF 472 F G J K M CF CF CF CF DN DN DN DN
5,100 pF 512 F G J K M CF CF CF CF DN DN DN DN
5,600 pF 562 F G J K M CF CF CF CF DN DN DN DN
6,200 pF 622 F G J K M CF CF CF CF DN DN DN DN
6,800 pF 682 F G J K M CF CF CF CF DN DN DN DN
7,500 pF 752 F G J K M CF CF CF CF DN DN DN DN
8,200 pF 822 F G J K M CF CF CF CF DN DN DN DN
9,100 pF 912 F G J K M CF CF CF CF DN DN DN DN
10,000 pF 103 F G J K M CF CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB
Capacitance Cap
Code
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35
Case Size/
Series
C0402C C0603C C0805C C1206C C1210C C1812C
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont'd
XX1 - Commercial Grade Only
Capacitance Cap
Code
Case Size/
Series C0402C C0603C C0805C C1206C C1210C C1812C
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
12,000 pF 123 F G J K M CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB
15,000 pF 153 F G J K M CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB
18,000 pF 183 F G J K M DN DN DN DN EB EB EB EB FB FB FB FB
22,000 pF 223 F G J K M DN DN DN DP EB EB EB EB FB FB FB FB
27,000 pF 273 F G J K M DP DP DP DP EB EB EB EB FB FB FB FB
33,000 pF 333 F G J K M DP DP DP DG EB EB EB EB FB FB FB FB GB GB GB
39,000 pF 393 F G J K M DG DG DG DG EB EB EB EB FB FB FB FB GB GB GB
47,000 pF 473 F G J K M DG DG DG DG EB EB EB EB FB FB FB FB GB GB GB
56,000 pF 563 F G J K M DG DG DG EB EB EB EC FB FB FB FB GB GB GB
68,000 pF 683 F G J K M EC EC EC EC FB FB FB FB GB GB GB
82,000 pF 823 F G J K M EC EC EC EE FB FB FB FB GB GB GB
100,000 pF 104 F G J K M EC EC EC EF FB FB FB FC GB GB GB
120,000 pF 124 F G J K M EF EF EF EH FC FC FC FE GB GB GB
150,000 pF 154 F G J K M EF EF EF EH FE FE FE FG GB GB GB
180,000 pF 184 F G J K M EH EH EH FG FG FG FG GB GB GB
220,000 pF 224 F G J K M EH EH EH FG FG FG FH GB GB GB
270,000 pF 274 F G J K M FH FH FH FM GB GB GB
330,000 pF 334 F G J K M FM FM FM GC GC GC
390,000 pF 394 F G J K M GH GH GH
470,000 pF 474 F G J K M GK GK GK GN1
Capacitance Cap
Code
Rated Voltage
(VDC)
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
10
16
25
50
Voltage Code 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35 8 4 35
Case Size/
Series
C0402C C0603C C0805C C1206C C1210C C1812C
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9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0402
0.50±0.05
10,000
50,000
0
0
CF
0603
0.80±0.07*
4,000
15,000
0
0
DN
0805
0.78±0.10*
4,000
15,000
0
0
DP
0805
0.90±0.10*
4,000
15,000
0
0
DG
0805
1.25±0.15
0
0
2,500
10,000
EB
1206
0.78±0.10
4,000
10,000
4,000
10,000
EC
1206
0.90±0.10
0
0
4,000
10,000
EE
1206
1.10±0.10
0
0
2,500
10,000
EF
1206
1.20±0.15
0
0
2,500
10,000
EH
1206
1.60±0.20
0
0
2,000
8,000
FB
1210
0.78±0.10
0
0
4,000
10,000
FC
1210
0.90±0.10
0
0
4,000
10,000
FE
1210
1.00±0.10
0
0
2,500
10,000
FG
1210
1.25±0.15
0
0
2,500
10,000
FH
1210
1.55±0.15
0
0
2,000
8,000
FM
1210
1.70±0.20
0
0
2,000
8,000
FT
1210
1.90±0.20
0
0
2,000
8,000
FI
1210
2.10±0.20*
0
0
1,500
7,000
GB
1812
1.00±0.10
0
0
1,000
4,000
GC
1812
1.10±0.10
0
0
1,000
4,000
GH
1812
1.40±0.15
0
0
1,000
4,000
GK
1812
1.60±0.20
0
0
1,000
4,000
GN
1812
1.70±0.20
0
0
1,000
4,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity1Plastic Quantity
Package quantity based on nished chip thickness specications.
1 If ordering using the 2 mm tape and reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Table 2B – Bulk Packaging Quantities
Packaging Type Loose Packaging
Bulk Bag (default)
PackagingC-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0402
1005
150,000
0603
1608
0805
2012
1206
3216
1210
3225
1812
4532
20,000
1 The "Packaging C-Spec" is a 4 to 8 digit code which identies the packaging type and/or product grade. When ordering, the proper code must be included
in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial grade
product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for
automotive grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-static bulk bag and automotive grade products). The 15th
through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk
Bag" packaging.
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 10/9/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
CY X V1 V2 CY X V1 V2 CY X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations, the user should perform
qualication testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
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11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
•SolderwaveorsolderreowforEIAcasesizes0603,0805and1206
•AllotherEIAcasesizesarelimitedtosolderreowonly
Recommended Reow Soldering Prole:
The KEMET families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection,IRorvaporphasereowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedproleconditionsforconvectionandIRreowreecttheproleconditionsoftheIPC/J-
STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereowpassesat
these conditions.
Prole Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (tS) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds
Ramp-Up Rate (TL to TP)3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)183°C 217°C
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
PeakTemperature(TP)235°C 260°C
TimeWithin5°CofMaximum
PeakTemperature(tP)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
Time25°CtoPeak
Temperature 6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum ramp up rate = 3°C/second
Maximum ramp down rate = 6°C/second
tP
tL
ts
25°C to Peak
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS-C-6429 Appendix1,Note:
Board Flex JIS-C-6429 Appendix2,Note:3.0mm(minimum).
Solderability J-STD-002
Magnication50XConditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°C,category3
c)MethodDat260°C,category3
Temperature Cycling JESD22 Method JA-104 1,000cycles(−55°Cto+125°C).Measurementat24hours±4hoursaftertestconclusion.
Biased Humidity MIL-STD-202 Method 103
Loadhumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Lowvolthumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Moisture Resistance MIL-STD-202 Method 106
t=24hours/cycle.Steps7aand7bnotrequired.Measurementat24hours±4hoursafter
test conclusion.
Thermal Shock MIL-STD-202 Method 107
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds. Dwell time – 15 minutes. Air – air.
High Temperature Life
MIL-STD-202
Method 108/EIA -198
1,000hoursat125°Cwith2Xratedvoltageapplied.
Storage Life MIL-STD-202 Method 108 125°C,0VDCfor1,000hours.
Vibration MIL-STD-202 Method 204
5G'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick
7securepointsononelongsideand2securepointsatcornersofoppositesides.Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz.
Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical, OKEM clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
Package Size (L" x W") Force Duration
0402
5 N (0.51 kg)
60 seconds
0603
10 N (1.02 kg)
≥0805
18 N (1.83 kg)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 10/9/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Capacitor Marking (Optional):
Lasermarkingoptionisnotavailableon:
• C0G, U2J, Ultra Stable X8R, and Y5V dielectric devices
• EIA 0402 case size devices
• EIA0603casesizedeviceswithexibleterminationoption
• KPScommercialandautomotivegradestackeddevices
These capacitors are supplied unmarked only.
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Con guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7" Reel 13" Reel 7" Reel 13" Reel
Pitch(P
1
)* Pitch(P
1
)*
01005 – 0402 8 2 2
0603 82/4 2/4
0805 84444
1206 – 1210 84444
1805 – 1808 12 4 4
≥1812 12 8 8
KPS1210 12 8 8
KPS1812
and 2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance speci cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotive grade 7" reel unmarked
C-3191
Automotive grade 13" reel unmarked
C-7081
Commercial grade 7" reel unmarked
C-7082
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Bene ts of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changesandincreasedefficiency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75±0.10
(0.069±0.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0&K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
4.0±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm)
and double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
R Reference
Note 2
8 mm 1.5+0.10-0.0
(0.059+0.004-0.0) 1.75±0.10
(0.069±0.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.079±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246) 3.5±0.05
(0.138±0.002)
2.0±0.05
(0.079±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0±0.10
(0.157±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
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Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:
Tape Width Peel Strength
8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300±10mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
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18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
14.4
(0.567)
Shall accommodate tape
width without interference
12 mm
12.4+2.0/−0.0
(0.488+0.078/−0.0)
18.4
(0.724)
16 mm
16.4+2.0/−0.0
(0.646+0.078/−0.0)
22.4
(0.882)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 10/9/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1086_U2J • 10/9/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
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