SCLS224B - DECEMBER 1982 - REVISED SEPTEMBER 2003 15 LSTTL Loads D Low Power Consumption, 80-A Max ICC D 'HC257 . . . Typical tpd = 9 ns SN54HC257, SN54HC258 . . . J PACKAGE SN74HC257, SN74HC258 . . . D, N, NS, OR PW PACKAGE (TOP VIEW) 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 'HC258 . . . Typical tpd = 12 ns 6-mA Output Drive at 5 V Low Input Current of 1 A Max Provides Bus Interface from Multiple Sources in High-Performance Systems SN54HC257, SN54HC258 . . . FK PACKAGE (TOP VIEW) VCC G 4A 4B 4Y 3A 3B 3Y 1B 1Y NC 2A 2B 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A 4B NC 4Y 3A 2Y GND NC 3Y 3B A/B 1A 1B 1Y 2A 2B 2Y GND D D D D 1A A/B NC VCC G D Wide Operating Voltage Range of 2 V to 6 V D High-Current Inverting Outputs Drive Up To NC - No internal connection description/ordering information ORDERING INFORMATION PACKAGE TA PDIP - N Tube of 25 SOIC - D -40C -40 C to 85 85C C SOP - NS TSSOP - PW CDIP - J SN74HC257N SN74HC258N SN74HC258N SN74HC257D Reel of 2500 SN74HC257DR Reel of 250 SN74HC257DT Tube of 40 SN74HC258D Reel of 2500 SN74HC258DR Reel of 2000 HC258 HC257 SN74HC258NSR HC258 SN74HC257PW Reel of 2000 SN74HC257PWR Reel of 250 SN74HC257PWT Tube of 90 SN74HC258PW Reel of 2000 SN74HC258PWR Reel of 250 SN74HC258PWT Tube of 55 HC257 SN74HC257NSR Tube of 90 -55C to 125C TOP-SIDE MARKING SN74HC257N Tube of 40 Tube of 25 LCCC - FK ORDERABLE PART NUMBER HC257 HC258 SNJ54HC257J SNJ54HC257J SNJ54HC258J SNJ54HC258J SNJ54HC257FK SNJ54HC257FK SNJ54HC258FK SNJ54HC258FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated !"#$%! & '("")% $& ! *(+,'$%! -$%). "!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%& &%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&. *"!-('%& '!#*,$% %! 4 $,, *$"$#)%)"& $") %)&%)(,)&& !%/)"1&) !%)-. $,, !%/)" *"!-('%& *"!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCLS224B - DECEMBER 1982 - REVISED SEPTEMBER 2003 description/ordering information (continued) These devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (G) input is at a high logic level. To ensure the high-impedance state during power up or power down, G should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. FUNCTION TABLE INPUTS OUTPUT Y G A/B A B 'HC257 'HC258 H X X X Z Z L L L X L H L L H X H L L H X L L H L H X H H L 'HC257 logic diagram (positive logic) G A/B 1A 1B 2A 2B 3A 3B 4A 4B 15 1 2 4 3 5 7 2Y 6 11 9 3Y 10 14 12 13 Pin numbers shown are for the D, J, N, NS, and PW packages. 2 1Y POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 4Y SCLS224B - DECEMBER 1982 - REVISED SEPTEMBER 2003 'HC258 logic diagram (positive logic) G A/B 1A 1B 2A 2B 3A 3B 4A 4B 15 1 2 4 1Y 3 5 7 2Y 6 11 9 3Y 10 14 12 4Y 13 Pin numbers shown are for the D, J, N, NS, and PW packages. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 mA Package thermal impedance, JA (see Note 1): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCLS224B - DECEMBER 1982 - REVISED SEPTEMBER 2003 recommended operating conditions (see Note 2) SN54HC257, SN54HC258 VCC VIH Supply voltage VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO t/v MIN NOM MAX 2 5 6 Input voltage Output voltage MAX 2 5 6 3.15 3.15 4.2 4.2 0 V V 0.3 0.5 0.9 1.35 1.2 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time NOM 1.5 0 UNIT MIN 1.5 VCC = 4.5 V VCC = 6 V Low-level input voltage SN74HC257, SN74HC258 0 VCC VCC 0 1000 1000 500 500 V V V ns VCC = 6 V 400 400 TA Operating free-air temperature -55 125 -40 85 C NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -20 A VOH VI = VIH or VIL IOH = -6 mA IOH = -7.8 mA VOL 4 VI = VCC or 0 VO = VCC or 0 ICC Ci VI = VCC or 0, MAX MIN TYP 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 MIN MAX SN74HC257, SN74HC258 5.2 MIN UNIT MAX V 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 A 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 IOL = 6 mA IOL = 7.8 mA 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V 0.1 100 1000 1000 nA 6V 0.01 0.5 10 5 A 8 160 80 A 3 10 10 10 pF VI = VIH or VIL II IOZ SN54HC257, SN54HC258 TA = 25C VCC IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 V SCLS224B - DECEMBER 1982 - REVISED SEPTEMBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER SN74HC257 VCC 2V 50 100 150 125 A or B Any Y 4.5 V 10 20 30 25 6V 9 17 25 21 2V 50 100 150 125 4.5 V 10 20 30 25 6V 9 17 25 21 A/B tdis SN54HC257 TO (OUTPUT) tpd ten TA = 25C TYP MAX FROM (INPUT) G G tt Any Y Any Y Any Y Any Y MIN MIN MAX MIN MAX 2V 75 150 225 190 4.5 V 15 30 45 38 6V 13 26 38 32 2V 75 150 225 190 4.5 V 15 30 45 38 6V 13 26 38 32 2V 28 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 UNIT ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) A or B TO (OUTPUT) Any Y tpd A/B ten tt G Any Y Any Y Any Y VCC TA = 25C MIN TYP MAX SN54HC257 MIN MAX SN74HC257 MIN MAX 2V 75 150 245 190 4.5 V 15 30 45 38 6V 13 26 38 32 2V 75 150 245 190 4.5 V 15 30 45 38 6V 13 26 38 32 2V 100 200 300 250 4.5 V 24 40 60 50 6V 18 34 51 43 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 UNIT ns ns ns 5 SCLS224B - DECEMBER 1982 - REVISED SEPTEMBER 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER SN74HC258 VCC 2V 60 100 150 125 A or B Any Y 4.5 V 13 20 30 25 6V 12 17 25 21 2V 60 115 175 145 4.5 V 13 23 35 29 6V 12 20 30 25 A/B G tdis SN54HC258 TO (OUTPUT) tpd ten TA = 25C TYP MAX FROM (INPUT) G tt Any Y Any Y Any Y Any Y MIN MIN MAX MIN MAX 2V 70 150 225 190 4.5 V 15 30 45 38 6V 13 26 38 32 2V 75 150 225 190 4.5 V 15 30 45 38 6V 13 26 38 32 2V 28 60 90 75 4.5 V 8 12 18 15 6V 6 10 15 13 UNIT ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) A or B TO (OUTPUT) Any Y tpd A/B ten tt G Any Y Any Y Any Y VCC TA = 25C MIN TYP MAX SN54HC258 MIN MAX SN74HC258 MIN MAX 2V 95 150 245 190 4.5 V 23 30 45 38 6V 21 26 38 32 2V 95 165 240 210 4.5 V 23 33 48 42 6V 21 28 41 36 2V 100 200 300 250 4.5 V 24 40 60 50 6V 18 34 51 43 2V 45 210 315 265 4.5 V 17 42 63 53 6V 13 36 53 45 UNIT ns ns ns operating characteristics, TA = 25C PARAMETER Cpd 6 TEST CONDITIONS Power dissipation capacitance per multiplexer POST OFFICE BOX 655303 No load * DALLAS, TEXAS 75265 TYP 40 UNIT pF SCLS224B - DECEMBER 1982 - REVISED SEPTEMBER 2003 PARAMETER MEASUREMENT INFORMATION VCC PARAMETER Test Point From Output Under Test S1 tPZH ten RL CL (see Note A) 1 k tPZL tPHZ tdis S2 RL 1 k CL S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 50 pF tPLZ tpd or tt -- LOAD CIRCUIT 50 pF or 150 pF VCC Input 50% 50% 0V tPLH In-Phase Output 50% 10% tPHL 90% VOH 50% 10% V OL tf 90% tr tPHL Out-of-Phase Output 90% tPLH 50% 10% 50% 10% 90% VOH VOL tf tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES Output Control (Low-Level Enabling) VCC 50% 50% 0V tPZL Output Waveform 1 (See Note B) tPLZ VCC VCC 50% 10% VOL tPZH Input 50% 10% 90% VCC 90% 50% 10% 0 V tr Output Waveform 2 (See Note B) 90% VOH 0 V tPHZ tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES 50% VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8512401EA ACTIVE CDIP J 16 1 TBD Call TI Call TI SN54HC257J ACTIVE CDIP J 16 1 TBD SN74HC257D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257DTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM N / A for Pkg Type SN74HC257N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC257NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC257NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples (Requires Login) 85124012A A42 (3) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty 90 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp ACTIVE TSSOP PW 16 SN74HC257PWLE OBSOLETE TSSOP PW 16 SN74HC257PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC257PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258D ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258DTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HC258NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Addendum-Page 2 CU NIPDAU Level-1-260C-UNLIM Call TI Samples (Requires Login) SN74HC257PWG4 TBD (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Sep-2011 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) SN74HC258NSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC258PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC257FK ACTIVE LCCC FK 20 1 TBD SNJ54HC257J ACTIVE CDIP J 16 1 TBD POST-PLATE N / A for Pkg Type A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 5-Sep-2011 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC257, SN74HC257 : * Catalog: SN74HC257 * Military: SN54HC257 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74HC257DR Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74HC257NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC257PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC257PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC258DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74HC258NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC258PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC258PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC257DR SOIC D 16 2500 333.2 345.9 28.6 SN74HC257NSR SO NS 16 2000 367.0 367.0 38.0 SN74HC257PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HC257PWT TSSOP PW 16 250 367.0 367.0 35.0 SN74HC258DR SOIC D 16 2500 333.2 345.9 28.6 SN74HC258NSR SO NS 16 2000 367.0 367.0 38.0 SN74HC258PWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74HC258PWT TSSOP PW 16 250 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated