   
     
  
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DHigh-Current Inverting Outputs Drive Up To
15 LSTTL Loads
DLow Power Consumption, 80-µA Max ICC
D’HC257 ...Typical tpd = 9 ns
D’HC258 ...Typical tpd = 12 ns
D±6-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
DProvides Bus Interface from Multiple
Sources in High-Performance Systems
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A/B
1A
1B
1Y
2A
2B
2Y
GND
VCC
G
4A
4B
4Y
3A
3B
3Y
SN54HC257, SN54HC258...J PACKAGE
SN74HC257, SN74HC258...D, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
4A
4B
NC
4Y
3A
SN54HC257, SN54HC258...FK PACKAGE
(TOP VIEW)
1A
A/B
NC
3Y
3B V
G
2Y
GND
NC
CC
NC − No internal connection
1B
1Y
NC
2A
2B
description/ordering information
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N
Tube of 25
SN74HC257N SN74HC257N
PDIP − N Tube of 25 SN74HC258N SN74HC258N
Tube of 40 SN74HC257D
Reel of 2500 SN74HC257DR HC257
SOIC − D Reel of 250 SN74HC257DT
HC257
SOIC − D
Tube of 40 SN74HC258D
HC258
Reel of 2500 SN74HC258DR HC258
−40°C to 85°C
SOP − NS
Reel of 2000
SN74HC257NSR HC257
−40 C to 85 C
SOP − NS Reel of 2000 SN74HC258NSR HC258
Tube of 90 SN74HC257PW
Reel of 2000 SN74HC257PWR HC257
TSSOP − PW
Reel of 250 SN74HC257PWT
HC257
TSSOP − PW Tube of 90 SN74HC258PW
Reel of 2000 SN74HC258PWR HC258
Reel of 250 SN74HC258PWT
HC258
CDIP − J
Tube of 25
SNJ54HC257J SNJ54HC257J
−55°C to 125°C
CDIP − J Tube of 25 SNJ54HC258J SNJ54HC258J
−55°C to 125°C
LCCC − FK
Tube of 55
SNJ54HC257FK SNJ54HC257FK
LCCC − FK
Tube of 55
SNJ54HC258FK SNJ54HC258FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright 2003, Texas Instruments Incorporated
  !"#$%! & '("")% $& ! *(+,'$%! -$%).
"!-('%& '!!"# %! &*)''$%!& *)" %/) %)"#& ! )0$& &%"(#)%&
&%$-$"- 1$""$%2. "!-('%! *"!')&&3 -!)& !% )')&&$",2 ',(-)
%)&%3 ! $,, *$"$#)%)"&.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
 *"!-('%& '!#*,$% %! 4 $,, *$"$#)%)"& $") %)&%)-
(,)&& !%/)"1&) !%)-.  $,, !%/)" *"!-('%& *"!-('%!
*"!')&&3 -!)& !% )')&&$",2 ',(-) %)&%3 ! $,, *$"$#)%)"&.
   
     
  
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
These devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized
systems. The 3-state outputs do not load the data lines when the output-enable (G) input is at a high logic level.
To ensure the high-impedance state during power up or power down, G should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
INPUTS OUTPUT Y
GA/B A B ’HC257 ’HC258
H X X X Z Z
LLLX L H
LLHX H L
LHXL L H
L H X H H L
’HC257 logic diagram (positive logic)
4Y
3Y
2Y
1Y
A/B
G
4B
4A
3B
3A
2B
2A
1B
1A 4
2
3
7
5
6
9
11
10
12
14
13
1
15
Pin numbers shown are for the D, J, N, NS, and PW packages.
   
     
  
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
’HC258 logic diagram (positive logic)
4Y
3Y
2Y
1Y
A/B
G
4B
4A
3B
3A
2B
2A
1B
1A 4
2
3
7
5
6
9
11
10
12
14
13
1
15
Pin numbers shown are for the D, J, N, NS, and PW packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±35 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±70 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 1): D package 73°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 67°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 64°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 108°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
   
     
  
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 2)
SN54HC257,
SN54HC258 SN74HC257,
SN74HC258
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
V
IH
High-level input voltage VCC = 4.5 V 3.15 3.15 V
VIH
High-level input voltage
VCC = 6 V 4.2 4.2
V
VCC = 2 V 0.3 0.5
V
IL
Low-level input voltage VCC = 4.5 V 0.9 1.35 V
VIL
Low-level input voltage
VCC = 6 V 1.2 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
∆t/∆vInput transition rise/fall time VCC = 4.5 V 500 500 ns
∆t/∆v
Input transition rise/fall time
VCC = 6 V 400 400
ns
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 2: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°CSN54HC257,
SN54HC258 SN74HC257,
SN74HC258
UNIT
PARAMETER
TEST CONDITIONS
VCC
MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.9 1.998 1.9 1.9
I
OH
= −20 µA4.5 V 4.4 4.499 4.4 4.4
V
OH
V
= V
or V
IOH = −20 µA
6 V 5.9 5.999 5.9 5.9 V
VOH
IOH = −6 mA 4.5 V 3.98 4.3 3.7 3.84
V
IOH = −7.8 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
I
OL
= 20 µA4.5 V 0.001 0.1 0.1 0.1
V
OL
V
= V
or V
IOL = 20 µA
6 V 0.001 0.1 0.1 0.1 V
VOL
IOL = 6 mA 4.5 V 0.17 0.26 0.4 0.33
V
IOL = 7.8 mA 6 V 0.15 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
IOZ VO = VCC or 0 6 V ±0.01 ±0.5 ±10 ±5µA
ICC VI = VCC or 0, IO = 0 6 V 8 160 80 µA
Ci2 V to 6 V 3 10 10 10 pF
   
     
  
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC257 SN74HC257
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 50 100 150 125
A or B Any Y 4.5 V 10 20 30 25
tpd
A or B
Any Y
6 V 9 17 25 21
ns
tpd 2 V 50 100 150 125 ns
A/B Any Y 4.5 V 10 20 30 25
A/B
Any Y
6 V 9 17 25 21
2 V 75 150 225 190
t
en
GAny Y 4.5 V 15 30 45 38 ns
ten
G
Any Y
6 V 13 26 38 32
ns
2 V 75 150 225 190
t
dis
GAny Y 4.5 V 15 30 45 38 ns
tdis
G
Any Y
6 V 13 26 38 32
ns
2 V 28 60 90 75
t
t
Any Y 4.5 V 8 12 18 15 ns
tt
Any Y
6 V 6 10 15 13
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC257 SN74HC257
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 75 150 245 190
A or B Any Y 4.5 V 15 30 45 38
tpd
A or B
Any Y
6 V 13 26 38 32
ns
tpd 2 V 75 150 245 190 ns
A/B Any Y 4.5 V 15 30 45 38
A/B
Any Y
6 V 13 26 38 32
2 V 100 200 300 250
t
en
GAny Y 4.5 V 24 40 60 50 ns
ten
G
Any Y
6 V 18 34 51 43
ns
2 V 45 210 315 265
t
t
Any Y 4.5 V 17 42 63 53 ns
tt
Any Y
6 V 13 36 53 45
ns
   
     
  
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC258 SN74HC258
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 60 100 150 125
A or B Any Y 4.5 V 13 20 30 25
tpd
A or B
Any Y
6 V 12 17 25 21
ns
tpd 2 V 60 115 175 145 ns
A/B Any Y 4.5 V 13 23 35 29
A/B
Any Y
6 V 12 20 30 25
2 V 70 150 225 190
t
en
GAny Y 4.5 V 15 30 45 38 ns
ten
G
Any Y
6 V 13 26 38 32
ns
2 V 75 150 225 190
t
dis
GAny Y 4.5 V 15 30 45 38 ns
tdis
G
Any Y
6 V 13 26 38 32
ns
2 V 28 60 90 75
t
t
Any Y 4.5 V 8 12 18 15 ns
tt
Any Y
6 V 6 10 15 13
ns
switching characteristics over recommended operating free-air temperature range, CL = 150 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HC258 SN74HC258
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 95 150 245 190
A or B Any Y 4.5 V 23 30 45 38
tpd
A or B
Any Y
6 V 21 26 38 32
ns
tpd 2 V 95 165 240 210 ns
A/B Any Y 4.5 V 23 33 48 42
A/B
Any Y
6 V 21 28 41 36
2 V 100 200 300 250
t
en
GAny Y 4.5 V 24 40 60 50 ns
ten
G
Any Y
6 V 18 34 51 43
ns
2 V 45 210 315 265
t
t
Any Y 4.5 V 17 42 63 53 ns
tt
Any Y
6 V 13 36 53 45
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per multiplexer No load 40 pF
   
     
  
SCLS224B − DECEMBER 1982 − REVISED SEPTEMBER 2003
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50% 10%10% 90% 90% VCC
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
VCC
VOH
VOL
0 V
trtf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VOH
VOL
tr
tf
tPHL tPLH
Out-of-Phase
Output
50%
10%
90%
VCC
≈VCC
VOL
0 V
Output
Control
(Low-Level
Enabling)
Output
Waveform 1
(See Note B)
50%
tPZL tPLZ
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
VOH
≈0 V
50%
50%
tPZH
tPHZ
Output
Waveform 2
(See Note B)
≈VCC
Test
Point
From Output
Under Test
CL
(see Note A)
RL
V
CC
S1
S2
LOAD CIRCUIT
PARAMETER CL
tPZH
tpd or tt
tdis
ten tPZL
tPHZ
tPLZ
1 kΩ
1 kΩ
50 pF
or
150 pF
50 pF
Open Closed
RLS1
Closed Open
S2
Open Closed
Closed Open
50 pF
or
150 pF Open Open−−
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. t
PLH
and t
PHL
are the same as t
pd
.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
85124012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
8512401EA ACTIVE CDIP J 16 1 TBD Call TI Call TI
SN54HC257J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74HC257D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC257NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC257NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC257PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PWLE OBSOLETE TSSOP PW 16 TBD Call TI Call TI
SN74HC257PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PWT ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC257PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258DTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258N ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC258NE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC258NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWT ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC258PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC257FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC257J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 4
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC257, SN74HC257 :
•Catalog: SN74HC257
•Military: SN54HC257
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC257DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC257NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC257PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC257PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC258DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74HC258NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC258PWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC258PWT TSSOP PW 16 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC257DR SOIC D 16 2500 333.2 345.9 28.6
SN74HC257NSR SO NS 16 2000 367.0 367.0 38.0
SN74HC257PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74HC257PWT TSSOP PW 16 250 367.0 367.0 35.0
SN74HC258DR SOIC D 16 2500 333.2 345.9 28.6
SN74HC258NSR SO NS 16 2000 367.0 367.0 38.0
SN74HC258PWR TSSOP PW 16 2000 367.0 367.0 35.0
SN74HC258PWT TSSOP PW 16 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2