18-Bit Registered Transceivers
CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
SCCS057 - August 1994 - Revised March 2000
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
Copyright © 2000, Texas Instruments Incorporated
1CY74FCT162H501
T
Features
FCT-E speed at 3.8 ns
Power-off disable outputs permits live insertion
Edge-rate control circuitry for significantly improved
noise characteristics
Typical output skew < 250 ps
ESD > 2000V
TSSOP (19.6 mil pitch) and SSOP (25-mil pitch)
packages
Industrial temperature range of 40˚C to +85˚C
•V
CC = 5V ± 10%
CY74FCT16501T Features:
64 mA sink current, 32 mA source current
Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
CY74FCT162501T Features:
Balanced 24 mA output drivers
Reduced system switching noise
Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
CY74FCT162H501T Features:
Bus hold retains last active state
Eliminates the need for external pull-up or pull-down
resistors
Functional Description
These 18-bit universal bus transceivers can be operated in
transparent, latched or clock modes by combining D-type
latches and D-type flip-flops. Data flow in each direction is
controlled by output enable (OEAB and OEBA), latch enable
(LEAB and LEBA), and clock inputs (CLKAB and CLKBA). For
A-to-B data flow, the device operates in transparent mode
when LEAB is HIGH. When LEAB is LOW, the A data is latched
if CLKAB is held at a HIGH or LOW logic level. If LEAB is LOW,
the A bus data is stored in the latch/flip-flop on the
LOW-to-HIGH transition of CLKAB. OEAB performs the output
enable function on the B port. Data flow from B-to-A is similar
tothatofA-to-BandiscontrolledbyOEBA,LEBA,andCLKBA.
The output buffers are designed with a power-off disable
feature to allow live insertion of boards.
The CY74FCT16501T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
THE CY74FCT162501T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
needforexternal terminatingresistorsand provides forminimal
undershoot and reduced ground bounce. The
CY74FCT162501T is ideal for driving transmission lines.
The CY74FCT162H501T is a 24-mA balanced output part, that
has “bus hold” on the data inputs. The device retains the input’s
last state whenever the input goes to high impedance. This
eliminates the need for pull-up/down resistors and prevents
floating inputs.
GND
Functional Block Diagram Pin Configuration
1
2
3
4
5
6
7
8
9
10
11
12
OEAB
SSOP/TSSOP
Top View
13
14
15
16
17
18
19
20
21
22
23
24
LEAB
A1
GND
GND
VCC
GND
GND
FCT16501-1
A2
A3
A4
A5
A6
A7
A8
A9
GND
25
26
27
28
GND
A10
A11
A12
VCC
A13
A14
A15
A16
A17
A18
OEBA
LEBA
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
GND
CLKAB
B1
GND
B2
B3
VCC
B4
B5
B6
GND
B7
B8
B9
B10
B11
B12
B13
B14
B15
VCC
B16
B17
B18
CLKBA
OEAB
CLKBA
LEBA
OEBA
CLKAB
LEAB
C
D
C
D
C
D
A1B1
C
D
TO 17 OTHER CHANNELS
FCT16501-2
CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
2
Maximum Ratings[6, 7]
(Above which the useful life may be impaired. For user
guidelines, not tested.)
Storage Temperature .................................... 55°C to +125°C
Ambient Temperature with
Power Applied.................................................. 55°C to +125°C
DC Input Voltage.................................................0.5V to +7.0V
DC Output Voltage..............................................0.5V to +7.0V
DC Output Current
(Maximum Sink Current/Pin)...........................60 to +120 mA
Power Dissipation.......................................................... 1.0W
Static Discharge Voltage ...........................................>2001V
(per MIL-STD-883, Method 3015)
Notes:
1. On the 74FCT162H501T these pins have bus hold.
2. A-to-B data flow is shown. B-to-A data flow is similar but uses OEBA, LEBA, and CLKBA.
3. H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
Z = High-impedance
= LOW-to-HIGH Transition
4. Output level before the indicated steady-state input conditions were established.
5. Output level before the indicated steady-state input conditions were established, provided that CLKAB was HIGH before LEAB went LOW.
6. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature range.
7. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
Pin Description
Name Description
OEAB A-to-B Output Enable Input
OEBA B-to-A Output Enable Input (Active LOW)
LEAB A-to-B Latch Enable Input
LEBA B-to-A Latch Enable Input
CLKAB A-to-B Clock Input
CLKBA B-to-A Clock Input
A A-to-B Data Inputs or B-to-A Three-State
Outputs[1]
B B-to-A Data Inputs or A-to-B Three-State
Outputs[1]
Function Table[2, 3]
Inputs Outputs
OEAB LEAB CLKAB A B
L X X X Z
H H X L L
H H X H H
H L L L
H L H H
H L L X B[4]
H L H X B[5]
Operating Range
Range Ambient
Temperature VCC
Industrial 40°C to +85°C 5V ± 10%
CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
3
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions Min. Typ.[8] Max. Unit
VIH Input HIGH Voltage 2.0 V
VIL Input LOW Voltage 0.8 V
VHInput Hysteresis[9] 100 mV
VIK Input Clamp Diode Voltage VCC=Min., IIN=18 mA 0.7 1.2 V
IIH Input HIGH Current Standard VCC=Max., VI=VCC ±1µA
Bus Hold ±100
IIL Input LOW Current Standard VCC=Max., VI=GND ±1µA
Bus Hold ±100 µA
IBBH
IBBL Bus Hold Sustain Current on Bus Hold Input[10] VCC=Min., VI=2.0V 50 µA
VI=0.8V +50 µA
IBHHO
IBHLO Bus Hold Overdrive Current on Bus Hold In-
put[10] VCC=Max., VI=1.5V TBD mA
IOZH High Impedance Output Current
(Three-State Output pins) VCC=Max., VOUT=2.7V ±1µA
IOZL High Impedance Output Current
(Three-State Output pins) VCC=Max., VOUT=0.5V ±1µA
IOS Short Circuit Current[11] VCC=Max., VOUT=GND 80 140 200 mA
IOOutput Drive Current[11] VCC=Max., VOUT=2.5V 50 180 mA
IOFF Power-Off Disable VCC=0V, VOUT4.5V[12] ±1µA
Output Drive Characteristics for CY74FCT16501T
Parameter Description Test Conditions Min. Typ.[8] Max. Unit
VOH Output HIGH Voltage VCC=Min., IOH=3 mA 2.5 3.5 V
VCC=Min., IOH=15 mA 2.4 3.5
VCC=Min., IOH=32 mA 2.0 3.0
VOL Output LOW Voltage VCC=Min., IOL=64 mA 0.2 0.55 V
Output Drive Characteristics for CY74FCT162501T, CY74FCT162H501T
Parameter Description Test Conditions Min. Typ.[8] Max. Unit
IODL Output LOW Current[11] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA
IODH Output HIGH Current[11] VCC=5V, VIN=VIH or VIL, VOUT=1.5V 60 115 150 mA
VOH Output HIGH Voltage VCC=Min., IOH=24 mA 2.4 3.3 V
VOL Output LOW Voltage VCC=Min., IOL=24 mA 0.3 0.55 V
Notes:
8. Typical values are at VCC= 5.0V, TA= +25˚C ambient.
9. This parameter is specified but not tested.
10. Pins with bus hold are described in Pin Description.
11. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
12. Tested at +25˚C.
CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
4
Capacitance[9] (TA = +25˚C, f = 1.0 MHz)
Parameter Description Test Conditions Typ.[8] Max. Unit
CIN Input Capacitance VIN = 0V 4.5 6.0 pF
COUT Output Capacitance VOUT = 0V 5.5 8.0 pF
Power Supply Characteristics
Sym. Parameter Test Conditions[13] Min. Typ.[8] Max. Unit
ICC Quiescent Power Supply
Current VCC=Max. VIN<0.2V
VIN>VCC0.2V 5 500 µA
ICC Quiescent Power Supply
Current TTL inputs HIGH VCC= Max., VIN = 3.4V[14] 0.5 1.5 mA
ICCD Dynamic Power Supply
Current[15] VCC=Max., Outputs Open
OEAB=OEBA=VCC or GND
One Input Toggling,
50% Duty Cycle
VIN=VCC or
VIN=GND 75 120 µA/
MHz
ICTotal Power Supply
Current[16] VCC=Max., Outputs Open
f0 =10MHz (CLKAB)
50% Duty Cycle
OEAB=OEBA=VCC
LEAB = GND, One Bit Toggling
f1 = 5MHz, 50% Duty Cycle
VIN=VCC or
VIN=GND 0.8 1.7 mA
VIN=3.4V or
VIN=GND 1.3 3.2
VCC=Max., Outputs Open
f0 = 10MHz (CLKAB)
50% Duty Cycle
OEAB=OEBA=VCC
LEAB=GND
Eighteen Bits Toggling
f1=2.5MHz, 50% Duty Cycle
VIN=VCC or
VIN=GND 3.8 6.5[17]
VIN=3.4V or
VIN=GND 8.5 20.8[17]
Notes:
13. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
14. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
15. This parameter is not directly testable, but is derived for use in Total Power Supply.
16. IC=I
QUIESCENT + IINPUTS + IDYNAMIC
IC=I
CC+ICCDHNT+ICCD(f0/2 + f1N1)
ICC = Quiescent Current with CMOS input levels
ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)
DH= Duty Cycle for TTL inputs HIGH
NT= Number of TTL inputs at DH
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)
f0= Clock frequency for registered devices, otherwise zero
f1= Input signal frequency
N1= Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
17. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
5
Switching Characteristics Over the Operating Range[18]
CY74FCT16501AT
CY74FCT162501AT CY74FCT162501CT
CY74FCT162H501CT CY74FCT16501ET
CY74FCT162501ET
CY74FCT162H501ET Fig.
No.[19]
Parameter Description Min. Max. Min. Max. Min. Max. Unit
fMAX CLKAB or CLKBA
frequency[20] 150 150 150 MHz
tPLH
tPHL Propagation Delay
A to B or B to A 1.5 5.1 1.5 4.6 1.5 3.8 ns 1,3
tPLH
tPHL Propagation Delay
LEBA to A, LEAB to B 1.5 5.6 1.5 5.3 1.5 4.2 ns 1,5
tPLH
tPHL Propagation Delay
CLKBA to A,
CLKAB to B
1.5 5.6 1.5 5.3 1.5 4.2 ns 1,5
tPZH
tPZL Output Enable Time
OEBAto A, OEAB to B 1.5 6.0 1.5 5.6 1.5 4.8 ns 1,7,8
tPHZ
tPLZ Output Disable Time
OEBAto A, OEAB to B 1.5 5.6 1.5 5.2 1.5 5.2 ns 1,7,8
tSU Set-Up Time,
HIGH or LOW
A to CLKAB,
B to CLKBA
3.0 3.0 2.4 ns 4
tHHold Time
HIGH or LOW
A to CLKAB,
B to CLKBA
0 0 0 ns 4
tSU Set-Up Time,
HIGH or LOW
A to LEAB,
B to LEBA
Clock
LOW 3.0 3.0 2.0 ns 4
Clock
HIGH 1.5 1.5 1.5 ns 4
tHHold Time, HIGH or
LOW, A to LEAB,
B to LEBA
1.5 1.5 0.5 ns 4
tWLEAB or LEBA Pulse
Width HIGH[20] 3.0 3.0 3.0 ns 5
tWCLKAB or CLKBA
Pulse Width HIGH or
LOW[20]
3.0 3.0 3.0 ns 5
tSK(O) Output Skew[21] 0.5 0.5 0.5 ns
Notes:
18. Minimum limits are specified, but not tested, on propagation delays.
19. See “Parameter Measurement Information” in the General Information section.
20. This parameter is guaranteed but not tested.
21. Skew between any two outputs of the same package switching in the same direction. This parameter ensured by design.
CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
6
Ordering Information CY74FCT16501T
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
3.8 CY74FCT16501ETPACT Z56 56-Lead (240-Mil) TSSOP Industrial
CY74FCT16501ETPVC/PVCT O56 56-Lead (300-Mil) SSOP
5.1 CY74FCT16501ATPVC/PVCT O56 56-Lead (300-Mil) SSOP Industrial
Ordering Information CY74FCT162501T
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
3.8 74FCT162501ETPACT Z56 56-Lead (240-Mil) TSSOP Industrial
CY74FCT162501ETPVC O56 56-Lead (300-Mil) SSOP
74FCT162501ETPVCT O56 56-Lead (300-Mil) SSOP
4.6 74FCT162501CTPACT Z56 56-Lead (240-Mil) TSSOP Industrial
CY74FCT162501CTPVC O56 56-Lead (300-Mil) SSOP
74FCT162501CTPVCT O56 56-Lead (300-Mil) SSOP
5.1 74FCT162501ATPACT Z56 56-Lead (240-Mil) TSSOP Industrial
CY74FCT162501ATPVC O56 56-Lead (300-Mil) SSOP
74FCT162501ATPVCT O56 56-Lead (300-Mil) SSOP
Ordering Information CY74FCT162H501T
Speed
(ns) Ordering Code Package
Name Package Type Operating
Range
3.8 74FCT162H501ETPACT Z56 56-Lead (240-Mil) TSSOP Industrial
74FCT162H501ETPVC/PVCT O56 56-Lead (300-Mil) SSOP
4.6 74FCT162H501CTPACT Z56 56-Lead (240-Mil) TSSOP Industrial
74FCT162H501CTPVC/PVCT O56 56-Lead (300-Mil) SSOP
CY74FCT16501T
CY74FCT162501T
CY74FCT162H501T
7
Package Diagrams
56-Lead Shrunk Small Outline Package O56
56-Lead Thin Shrunk Small Outline Package Z56
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Copyright 2000, Texas Instruments Incorporated